Liquid flow cooling device

Abstract

A liquid flow cooling device includes a base, a cover, a guide plate, a heat conduction box, an impeller, and a drive assembly. The base includes a bottom and an annular wall. The annular wall is connected to the bottom. The bottom has an inlet channel and an outlet channel. The cover has an impeller housing chamber and a drive assembly housing chamber on opposite sides. The cover is mounted on the base. The cover has an inlet channel and an outlet channel. The outlet channel communicates with the impeller housing chamber. The impeller housing chamber is located on one side of the guide plate, and the inlet and outlet channels are located on the other side of the guide plate. The guide plate has an inlet connection port and an outlet connection port. The heat conduction box is mounted on the base and has a heat exchange chamber. The impeller is rotatably located in the impeller housing chamber. The drive assembly is located in the drive assembly housing chamber.

Description

Technical Field

[0001] This invention relates to a heat dissipation device, and more particularly to a liquid flow heat dissipation device. Background Technology

[0002] When a computer is operating, internal heat sources, such as the central processing unit (CPU), generate heat due to high-speed computation. Therefore, computers must be equipped with cooling systems to quickly and effectively remove the heat generated by these heat sources and maintain their temperature within the manufacturer's specified design range. Cooling systems are generally divided into air cooling and liquid cooling. Air cooling systems involve installing heat sinks on the heat source and a fan in the computer to dissipate heat through airflow. However, fans generate noise and are difficult to use for high-heat-generating components, such as the processor in a gaming computer. Therefore, gaming computers generally use liquid cooling. Liquid cooling systems consist of a water block and a radiator. The water block is in thermal contact with the heat source and is connected to the radiator via tubing. The water block contains a pump that drives the coolant, which absorbs heat, from the water block to the radiator, where it dissipates heat before returning to the water block.

[0003] However, due to the large number of components in a water block, assembly efficiency is low, and waterproofing design is difficult to be comprehensive. For example, if a water block originally designed for a single heat source is modified to be designed for multiple heat sources, the waterproofing performance may be difficult to improve after the structural change, resulting in the modified water block losing its waterproofing effect and causing coolant leakage. Summary of the Invention

[0004] The present invention provides a liquid flow cooling device to improve the assembly efficiency of water cooling blocks and increase the flexibility of future modifications to water cooling blocks.

[0005] An embodiment of the present invention discloses a liquid flow cooling device comprising a base, a cover, a guide plate, a heat conduction box, an impeller, and a drive assembly. The base includes a bottom and an annular wall. The annular wall is connected to the bottom, and the bottom and the annular wall together surround a storage space. The bottom has a water inlet channel and a water outlet channel. The cover has an impeller housing chamber and a drive assembly housing chamber on opposite sides. The cover is mounted on the base. The impeller housing chamber is closer to the storage space than the drive assembly housing chamber. The drive assembly housing chamber is not connected to either the storage space or the impeller housing chamber. The cover has a water inlet channel and a water outlet channel. The water outlet channel communicates with the impeller housing chamber. The guide plate is located between the bottom and the cover, with the impeller housing chamber located on one side of the guide plate, and the water inlet and water outlet channels located on the other side of the guide plate. The guide plate has a water inlet port and a water outlet port. A heat-conducting box is mounted on the bottom of the base, away from the annular wall, and has a heat exchange chamber. A water inlet channel communicates with the heat exchange chamber via a water inlet connector. An impeller housing chamber communicates with the heat exchange chamber via an water outlet connector. The impeller is rotatably located in the impeller housing chamber. A drive assembly is located in the drive assembly housing chamber and is used to drive the impeller to rotate relative to the cover. The bottom and the annular wall are integrally formed, and the guide plate and at least part of the impeller are located within a storage space surrounded by the annular wall.

[0006] According to the liquid flow cooling device of the above embodiment, since the annular wall and bottom of the base are integrally formed and in the shape of a bowl, the guide plate and impeller are placed in the bowl-shaped base, which simplifies the assembly process between the base, the cover and the guide plate, thereby reducing the assembly difficulty of the liquid flow cooling device.

[0007] Furthermore, because the annular wall and bottom of the base are integrally molded and bowl-shaped, and most of the storage space below is enclosed by the bottom, with only a small portion having inlet and outlet channels connected to the heat exchange chamber, the original heat conduction box of the liquid flow cooling device can be easily modified into a larger one. This is because the mating is simple, requiring only hole-to-hole alignment, and avoids the overall structural integration issues faced in conventional designs. Therefore, the liquid flow cooling device offers greater flexibility for future modifications.

[0008] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0009] Figure 1 This is a perspective view of the liquid flow cooling device according to the first embodiment of the present invention;

[0010] Figure 2 for Figure 1A schematic diagram of the decomposition process;

[0011] Figure 3 for Figure 2 A breakdown diagram from another perspective;

[0012] Figures 4 to 10 for Figure 1 A schematic diagram of the working fluid flow of a liquid flow cooling device.

[0013] [Symbol Explanation]

[0014] 10: Liquid flow cooling device

[0015] 100: Base

[0016] 110: Bottom

[0017] 111: Water Inlet Channel

[0018] 1111: Arc segment

[0019] 1112: Straight line segment

[0020] 112: Water outlet channel

[0021] 1121: Central Department

[0022] 1122: Extension

[0023] 120: Circular wall section

[0024] 200: Capping

[0025] 210: Water Inlet Channel

[0026] 220: Water outlet channel

[0027] 300: Deflector

[0028] 310: Water inlet connector

[0029] 320: Water outlet connection port

[0030] 330: First drainage channel

[0031] 340: Second drainage channel

[0032] 400: Heat Dissipation Box

[0033] 410: Box body

[0034] 411: Heat dissipation fins

[0035] 420: Cover

[0036] 421: First Opening

[0037] 422: Second opening

[0038] 500: Impeller

[0039] 600: Driver Component

[0040] 710: First seal

[0041] 720: Second seal

[0042] 730: Third seal

[0043] 740: Fourth seal

[0044] 800: Control circuit board

[0045] 850: Light-emitting element

[0046] 910: Water inlet connector

[0047] 920: Water outlet connector

[0048] 950: Mask

[0049] S1: Storage space

[0050] S2: Impeller housing chamber

[0051] S3: Drive component housing chamber

[0052] S4: Heat exchange chamber

[0053] C1, C2: Center

[0054] A~N: direction Detailed Implementation

[0055] Please see Figures 1 to 3 . Figure 1 This is a perspective view of the liquid flow cooling device 10 according to the first embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of its breakdown. Figure 3 for Figure 2 A breakdown diagram from another perspective.

[0056] The fluid cooling device 10 in this embodiment is, for example, a water cooling head, and is used to thermally couple to at least one heat source (not shown) to remove the heat generated by the heat source through the working fluid. The heat source is, for example, a central processing unit or a video processor. The fluid cooling device 10 includes a base 100, a cover 200, a guide plate 300, a heat conduction box 400, an impeller 500, and a drive assembly 600. The base 100 includes a bottom 110 and an annular wall 120. The annular wall 120 is connected to the bottom 110, and the bottom 110 and the annular wall 120 together surround a storage space S1.

[0057] The bottom 110 has a water inlet channel 111 and a water outlet channel 112. The water inlet channel 111 of the bottom 110 includes an arc-shaped segment 1111 and a straight segment 1112. The arc-shaped segment 1111 is centered on the center C1 of the bottom 110. The straight segment 1112 is connected to the middle section of the arc-shaped segment 1111 and extends away from the center C1 of the bottom 110, making the water inlet channel, for example, Y-shaped. The water outlet channel 112 of the bottom 110 includes a central portion 1121 and an extension portion 1122. The central portion 1121 is, for example, a circular hole and is located at the center C1 of the bottom 110. The arc-shaped segment 1111 surrounds the outside of the central portion 1121. The extension portion 1122 is connected to the central portion 1121 and extends towards the periphery of the bottom 110.

[0058] In other embodiments, the straight section of the water inlet channel can also be changed to a non-straight section, as long as it extends in a direction away from the center C1 of the bottom 110.

[0059] The cover 200 has an impeller housing chamber S2 and a drive assembly housing chamber S3 on opposite sides. The cover 200 is mounted on the base 100. The impeller housing chamber S2 is closer to the storage space S1 than the drive assembly housing chamber S3. The drive assembly housing chamber S3 is not connected to either the storage space S1 or the impeller housing chamber S2. The cover 200 has a water inlet channel 210 and a water outlet channel 220. The water outlet channel 220 connects to the impeller housing chamber S2.

[0060] A guide vane 300 is located between the bottom 110 and the cover 200, and the impeller housing chamber S2 is located on one side of the guide vane 300. The inlet channel 111 and the outlet channel 112 are located on the other side of the guide vane 300. The guide vane 300 has an inlet port 310 and an outlet port 320. The outlet port 320 of the guide vane 300 is closer to the center C2 of the guide vane 300 than the inlet port 310. Furthermore, the guide vane 300 has a first guide channel 330 and a second guide channel 340. The shape of the first diversion channel 330 matches the shape of the water inlet channel 111 and connects the water inlet port 310 of the guide plate 300 with the first opening 421 of the cover 420. The shape of the second diversion channel 340 matches the shape of the extension 1122 of the water outlet channel 112 and connects the water outlet port 320 of the guide plate 300 with the second opening 422 of the cover 420.

[0061] A heat-conducting box 400 is mounted on the bottom 110 of the base 100, away from the annular wall 120, and has a heat exchange chamber S4. Specifically, the heat-conducting box 400 includes a box body 410 and a cover 420. The cover 420 is fixed to the box body 410, for example, by welding, pressing, gluing, or screwing. The box body 410 is fixed to the bottom 110 of the base 100, for example, by welding, pressing, gluing, or screwing. The box body 410 has multiple heat dissipation fins 411 to increase the heat exchange efficiency between the box body 410 and the working fluid. The cover 420 has a first opening 421 and a second opening 422. The first opening 421 is, for example, elongated. The second opening 422 is, for example, perforated, and the size of the second opening 422 of the cover 420 is smaller than the size of the first opening 421.

[0062] In this embodiment, the two opposite ends of the arc-shaped section 1111 of the water inlet channel 111 of the base 100 are connected to the heat exchange chamber S4 through the first opening 421 of the cover 420. The end of the straight section 1112 away from the arc-shaped section 1111 is connected to the water inlet port 310 of the guide plate 300, and the water inlet port 310 of the guide plate 300 is connected to the water inlet channel 210 of the cover 200. That is, the water inlet channel 210 is connected to the heat exchange chamber S4 through the water inlet port 310, the arc-shaped section 1111 of the water inlet channel 111, and the first opening 421 of the cover 420. The central portion 1121 of the water outlet channel 112 of the base 100 is connected to the impeller accommodating chamber S2 through the water outlet port 320, and the end of the extension portion 1122 of the water outlet channel 112 away from the central portion 1121 is connected to the heat exchange chamber S4 through the second opening 422 of the cover 420. In other words, the impeller housing chamber S2 is connected to the heat exchange chamber S4 through the water outlet 320, the water outlet channel 112 and the second opening 422.

[0063] In this embodiment, the liquid flow cooling device 10 may further include a first seal 710, a second seal 720, a third seal 730, and a fourth seal 740. The first seal 710 is sandwiched between the base 100 and the guide plate 300 to prevent the working fluid flowing from the water inlet 310 of the guide plate 300 to the water inlet channel 111 of the base plate from leaking out, or to prevent the working fluid flowing from the water outlet channel 112 of the base 100 to the water outlet 320 of the guide plate 300 from leaking out. The second seal 720 is sandwiched between the guide plate 300 and the cover 200 to prevent the working fluid flowing from the water inlet channel 210 of the cover 200 to the water inlet 310 of the guide plate 300 from leaking out, or to prevent the working fluid flowing from the water outlet 320 of the guide plate 300 to the impeller receiving chamber S2 of the cover 200 from leaking out. The third seal 730 is sandwiched between the cover 420 and the bottom 110 of the base 100, and surrounds the first opening 421 to prevent the working fluid flowing from the water inlet channel 111 of the base 100 to the heat exchange chamber S4 from leaking out. The fourth seal 740 is sandwiched between the cover 420 and the bottom 110 of the base 100, and surrounds the first opening 421 and the second opening 422 to prevent the working fluid flowing from the water inlet channel 111 of the base 100 to the heat exchange chamber S4 from leaking out, or the working fluid flowing from the heat exchange chamber S4 to the water outlet channel 112 of the base 100 from leaking out.

[0064] Impeller 500 is rotatably located in impeller housing chamber S2 to drive working fluid to flow in from inlet channel 210 and out from outlet channel 220. Drive assembly 600 is located in drive assembly housing chamber S3. Drive assembly 600 includes, for example, a stator and a rotor. The stator and rotor are respectively disposed on cover 200 and impeller 500, and the stator and rotor are used to generate a rotating magnetic field that drives the rotor to rotate, so that drive assembly 600 drives impeller 500 to rotate relative to cover 200.

[0065] In this embodiment, the bottom 110 and the annular wall 120 are, for example, an integrally molded structure manufactured by injection molding, and the guide plate 300 and at least part of the impeller 500 are located in the storage space S1 and surrounded by the annular wall 120. However, the integrally molded design of the bottom 110 and the annular wall 120 is not intended to limit the invention. In other embodiments, the bottom 110 and the annular wall 120 may also be composed of two separate components.

[0066] In this embodiment, the liquid flow cooling device 10 may further include a control circuit board 800. The control circuit board 800 is fixed to the top of the cover 200 and electrically connected to the drive assembly 600 to control the rotational speed of the impeller 500 through the drive assembly 600.

[0067] In this embodiment, the liquid flow cooling device 10 may further include a plurality of light-emitting elements 850. These light-emitting elements 850 are disposed on the control circuit board 800 and are used to illuminate in a direction away from the cover 200.

[0068] In this embodiment, the liquid flow cooling device 10 may further include a water inlet connector 910 and a water outlet connector 920. One end of the water inlet connector 910 is disposed in the water inlet channel 210 of the cover, and the other end of the water inlet connector 910 is used to connect to the flow pipe. One end of the water outlet connector 920 is disposed in the water outlet channel 220 of the cover, and the other end of the water outlet connector 920 is used to connect to the flow pipe.

[0069] In this embodiment, the liquid flow cooling device 10 may further include a shield 950. The shield 950 is fixed to the annular wall 120 of the base 100 by means of a snap fastener, and covers the cover 200 and the drive assembly 600. The shield 950 serves to protect the control circuit board 800 and the drive assembly 600, and can also be used as a place for decoration and lighting effects.

[0070] In this embodiment, the liquid flow cooling device 10 is equipped with a shield 950, but this is not a limitation. In other embodiments, the shield 950 may be omitted.

[0071] In this embodiment, since the base 100 and the heat conduction box 400 are connected only through the first opening 421 to the water inlet channel 111 and through the second opening 422 to the water outlet channel 112, the pairing is simple and there are no overall structural integration problems faced by conventional designs. Therefore, the liquid flow heat dissipation device 10 can be more flexible for future modification.

[0072] Please see Figures 4 to 10 . Figures 4 to 10 for Figure 1 A schematic diagram of the working fluid flow in the liquid flow cooling device 10. (See diagram below.) Figure 4 As shown, when the liquid flow cooling device 10 is operating, the working fluid flows through the water inlet channel 210 along directions A, B, and C, and then through the water inlet 310 of the guide plate 300 along direction D. Next, as... Figure 5 As shown, the working fluid passing through the water inlet 310 of the guide plate 300 is guided by the first guide channel 330 and the water inlet channel 111 and flows in the direction E through the straight section 1112 and the arc section 1111 of the water inlet channel 111. Then, as... Figure 5 and Figure 6 As shown, the working fluid flows in direction F at both ends of the arc-shaped segment 1111 and through the first opening 421 of the cover 420. Then, as... Figure 6 and Figure 7As shown, the working fluid flowing through the first opening 421 of the cover 420 first flows into the gap of the heat dissipation fins 411 in the direction F, and then flows in the direction G to the channel around the heat dissipation fins 411. Next, the working fluid in the channel around the heat dissipation fins 411 flows through the second opening 422 of the cover 420 in the directions H and I in sequence.

[0073] Next, as Figure 7 and Figure 8 As shown, the working fluid flowing through the second opening 422 of the cover 420 flows to the extension 1122 of the outlet channel 112, and then, guided by the extension 1122 and the second guide channel 340 of the guide plate 300, flows in direction J towards the central portion 1121 of the outlet channel 112. Next, as... Figure 8 and Figure 9 As shown, the working fluid in the central part 1121 of the outlet channel 112 flows along direction K through the outlet port 320 of the guide plate 300. Then, as... Figure 9 and Figure 10 As shown, the working fluid flowing through the water outlet 320 of the guide plate 300 will be thrown along direction L to the space around the impeller 500, and flow into the water outlet channel 220 along direction M, and flow out of the water outlet channel 220 along direction N.

[0074] According to the liquid flow cooling device of the above embodiment, since the annular wall and bottom of the base are integrally formed and in the shape of a bowl, the guide plate and impeller are placed in the bowl-shaped base, which simplifies the assembly process between the base, the cover and the guide plate, thereby reducing the assembly difficulty of the liquid flow cooling device.

[0075] Furthermore, because the annular wall and bottom of the base are integrally molded and bowl-shaped, and most of the storage space below is enclosed by the bottom, with only a small portion having inlet and outlet channels connecting to the heat exchange chamber, the liquid flow cooling device can easily be modified by replacing its original heat-conducting box with a larger one. This is because the mating is simple, requiring only hole-to-hole alignment, avoiding the overall structural integration issues faced by conventional designs. This increases the flexibility of future modifications for the liquid flow cooling device. Conversely, conventional designs often use an outer casing design for the base, and the heat-conducting plate is an open design, together forming a complete sealed cavity. If the size or shape of the heat-conducting plate changes, the base can no longer form a sealed cavity with the heat-conducting plate, necessitating a redesign.

[0076] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. A liquid flow heat dissipating device, characterized by, Comprising: a base, the base comprising a bottom and an annular wall portion connected to the bottom, and the bottom and the annular wall portion collectively surrounding a storage space, the bottom having an inlet flow channel and an outlet flow channel; a cover, opposite sides of the cover respectively having an impeller accommodating chamber and a driving assembly accommodating chamber, the cover being arranged on the base, the impeller accommodating chamber being closer to the storage space than the driving assembly accommodating chamber, the driving assembly accommodating chamber not being in communication with the storage space and the impeller accommodating chamber, the cover having a water inlet passage and a water outlet passage, the water outlet passage being in communication with the impeller accommodating chamber; a flow guide plate, the flow guide plate being between the bottom and the cover, the impeller accommodating chamber being on one side of the flow guide plate, and the inlet flow channel and the outlet flow channel being on the other side of the flow guide plate, the flow guide plate having a water inlet communication port and a water outlet communication port; a heat conduction box, the heat conduction box being arranged on the bottom of the base away from the annular wall portion, and the heat conduction box having a heat exchange chamber, the water inlet passage being in communication with the heat exchange chamber through the water inlet communication port and the inlet flow channel, the impeller accommodating chamber being in communication with the heat exchange chamber through the water outlet communication port and the outlet flow channel; an impeller, the impeller being rotatably arranged in the impeller accommodating chamber; and a driving assembly, the driving assembly being arranged in the driving assembly accommodating chamber and being used to drive the impeller to rotate relative to the cover; wherein the bottom and the annular wall portion are integrally formed, and the flow guide plate and at least part of the impeller are located in the storage space and surrounded by the annular wall portion.

2. The liquid flow heat sink of claim 1, wherein The inlet flow channel of the bottom comprises an arc-shaped section and a straight section, the arc-shaped section having the center of the bottom as a center, the straight section being connected to the middle of the arc-shaped section and extending away from the center of the bottom, the opposite ends of the arc-shaped section being in communication with the heat exchange chamber, and one end of the straight section away from the arc-shaped section being in communication with the water inlet communication port of the flow guide plate.

3. The liquid flow heat sink of claim 2, wherein The outlet flow channel of the bottom comprises a central portion and an extension portion, the central portion being located at the center of the bottom, the arc-shaped section surrounding the outside of the central portion, the extension portion being connected to the central portion and extending towards the periphery of the bottom, one end of the extension portion away from the central portion being in communication with the heat exchange chamber, and the central portion being in communication with the impeller accommodating chamber.

4. The liquid flow heat sink of claim 3, wherein The heat conduction box comprises a box body and a cover body, the cover body being fixed to the box body, the box body being fixed to the bottom of the base, the box body having a plurality of heat dissipation fins, the cover body having a first opening and a second opening, and the opposite ends of the arc-shaped section being in communication with the heat exchange chamber through the first opening, and the impeller accommodating chamber being in communication with the heat exchange chamber through the second opening.

5. The liquid flow heat sink of claim 4, wherein The size of the second opening of the cover body is smaller than the size of the first opening.

6. The liquid flow heat sink of claim 4, wherein, Further comprising a first sealing member and a second sealing member, the first sealing member being clamped between the base and the flow guide plate, and the second sealing member being clamped between the flow guide plate and the cover.

7. The liquid flow heat sink of claim 6, wherein Further comprising a third sealing member, the third sealing member being clamped between the cover body and the bottom of the base and surrounding the first opening.

8. The liquid flow heat sink of claim 6, wherein, A fourth seal member is further included, which is sandwiched between the cover and the bottom of the base and surrounds the first and second openings.

9. The liquid flow heat sink of claim 4, wherein, The flow guide plate has a first flow channel and a second flow channel. The first flow channel is shaped to match the shape of the water inlet channel and to communicate the water inlet communication port of the flow guide plate with the first opening of the cover. The second flow channel is shaped to match the shape of the extension of the water outlet channel and to communicate the water outlet communication port of the flow guide plate with the second opening of the cover.

10. The liquid flow heat sink of claim 1, wherein, The water outlet communication port of the flow guide plate is closer to the center of the flow guide plate than the water inlet communication port.

11. The liquid flow heat sink of claim 1, wherein, A cover is further included, which is fixed to the annular wall portion of the base and covers the cover and the driving assembly.

12. The liquid flow heat sink of claim 1, wherein, A control circuit board is further included, which is fixed to the top of the cover and electrically connected to the driving assembly.

13. The liquid flow heat sink of claim 12, wherein, At least one light emitting element is further included, which is disposed on the control circuit board.

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