A semiconductor device continuous processing apparatus

Abstract

A kind of semiconductor device continuous processing equipment, it is related to the field of semiconductor processing, including the cutting rib forming device and testing device arranged in sequence, the cutting rib forming device is used to cut the frame, bending processing, forming dispersed device to be tested;The testing device is used to test the device to be tested, and selects out good and bad products, and rejects bad products.The cutting rib forming device includes a machine box, the machine box is provided with a clip, a feeding track, a clamping mechanism, a poking mechanism and a cutting rib bending mechanism, the present application improves work efficiency and saves time.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing, and more particularly to a continuous processing apparatus for semiconductor devices. Background Technology

[0002] Currently, in the processing of D2PAK packaged devices, the traditional semiconductor packaging process separates lead cutting and external testing into two steps. The semi-finished products after lead cutting need to undergo transportation, storage, and secondary material handling before external testing. This intermediate turnover not only affects order delivery but also carries the risk of mixed materials and may even lead to the failure to promptly detect batch anomalies generated during the lead cutting process, resulting in substantial losses. Furthermore, existing technologies rely on manual testing, which is limited in scope and efficiency. Summary of the Invention

[0003] To address the above problems, this invention provides a semiconductor lead cutting, testing, and packaging integrated machine that is simple in structure, easy to process, and improves efficiency.

[0004] The technical solution of this invention is: a continuous processing equipment for semiconductor devices, comprising a lead-cutting and forming device and a testing device arranged sequentially.

[0005] The rib-cutting and forming device is used to cut and bend the frame to form dispersed test devices;

[0006] The testing device is used to test the device under test, filter out good and defective products, and remove the defective products.

[0007] The rebar cutting and forming device includes a machine housing.

[0008] The machine housing is equipped with a magazine, a feeding track, a clamping mechanism, a shifting mechanism, and a cutting and bending mechanism.

[0009] The magazine and the actuating mechanism are sequentially arranged on one side of the feeding track. The magazine is used to stack several frames, and the bottom of the magazine is equipped with a top-loading cylinder for pushing the frames upward.

[0010] The clamping mechanism is used to clamp the frame inside the magazine onto the feed track.

[0011] The actuating mechanism is used to move the frame within the feed track.

[0012] The rib cutting and bending mechanism is used to cut and bend the ribs of the frame within the feed track.

[0013] The clamping mechanism includes a support platform, a clamping cylinder for vertical movement, and grippers.

[0014] The support platform is located above the feed rail and the magazine. The support platform is provided with a sliding rail. The clamping cylinder is connected to the sliding rail via a slider. The gripper is connected to the piston rod at the bottom of the clamping cylinder. The gripper is used to clamp the frame.

[0015] The support platform is also equipped with a conveyor belt driven by a motor, and a moving block is provided on the conveyor belt for connecting the slider.

[0016] The actuating mechanism includes a pawl and a support frame.

[0017] The pawl includes a T-shaped connecting rod and an L-shaped pawl. The vertical end of the L-shaped pawl is connected to the T-shaped connecting rod, and the bottom of the horizontal end is provided with a plurality of pawl teeth evenly distributed thereon. The plurality of pawl teeth are correspondingly located in the gaps between adjacent devices under test in the frame.

[0018] The T-shaped connecting rod is movably connected to the support frame via a pry bar cylinder, the support frame is connected to a support platform, and the pry bar cylinder is located on the support platform.

[0019] The bottom of the support frame is equipped with a pawl-type cylinder for up-and-down movement;

[0020] The support platform is movably connected to the base above it via guide columns, and a spring is provided between the support platform and the base.

[0021] The rebar cutting and bending mechanism includes a rebar cutting main cylinder and a pressure block.

[0022] The main cylinder for cutting tendons is used to drive the pressing block to move up and down. The pressing block has a receiving groove in the middle of its bottom, which is located directly above the feeding track.

[0023] The bottom of the pressure block is provided with a rib-cutting area and a bending area.

[0024] The rib cutting area includes a rib cutting tool, which is located on one side of the receiving groove. The rib cutting tool is used to cut the connecting ribs between adjacent devices under test on one side of the frame.

[0025] The bending area includes a bending tool and a second rib-cutting tool, which are located on both sides of the receiving groove. The bending tool is used to bend the pipe foot after the connecting rib has been cut off on one side of the frame.

[0026] The second rib-cutting tool is used to cut the connecting ribs between adjacent test devices on the other side of the frame.

[0027] The testing device includes a workbench, a testing station, an image detection station, and two sorting stations.

[0028] The workbench is equipped with a test track, and a ring-shaped conveyor belt is installed inside the test track. The conveyor belt is used to transport the device under test into the test track.

[0029] The two sorting stations are designated as the first sorting station and the second sorting station.

[0030] The testing station, the first sorting station, the image detection station, and the second sorting station are respectively set on the workbench and arranged sequentially along the testing track;

[0031] The test track has several openings, which correspond to the test station, the image detection station, and two sorting stations, respectively.

[0032] The testing station is used to test the electrical properties of the device under test and to filter out good and defective products.

[0033] The sorting station is used to sort defective products.

[0034] The image inspection station is used to inspect the appearance of the device under test and to filter out good and bad products.

[0035] The test station includes a pair of moving cylinders.

[0036] A pair of motion cylinders are symmetrically arranged on the worktable and located on both sides of the test track.

[0037] The piston rod of the moving cylinder is connected to the test piece, and the test pieces on the pair of moving cylinders are used to contact both sides of the device under test.

[0038] The image inspection station includes a 2D image inspection mechanism.

[0039] The 2D image inspection mechanism includes a support, a 2D camera, and a light source. The support is mounted on a workbench and located on one side of the test track.

[0040] The 2D camera and light source are sequentially mounted on the support and located above the test track.

[0041] It also includes a 3D image inspection mechanism, which is located behind the 2D image inspection mechanism.

[0042] The 3D image inspection mechanism includes a turntable, a rotating stage, and a 3D5S vision inspection mechanism driven by a servo motor. The turntable is located above the test track, and vacuum suction pens connected by cylinders are spaced apart on the turntable's annular surface.

[0043] The rotary table and the 3D5S vision inspection mechanism are located on the same side of the test track. The rotary table is connected to the workbench via a base and is used to rotate the good products.

[0044] The 3D5S visual inspection mechanism includes a 3D camera, which is mounted on a worktable.

[0045] The 3D camera is used to photograph the finished products.

[0046] The sorting station includes a gantry frame, a lifting cylinder, a vacuum suction pen, and at least two defective product boxes.

[0047] The gantry frame is mounted on the workbench, the test track is located in the middle of the gantry frame, the top of the lifting cylinder is movably connected to the top of the gantry frame, and the bottom is connected to the vacuum suction pen. The vacuum suction pen is used to suck up and put defective products into the defective product box.

[0048] The defective product boxes are placed on the workbench and located on both sides of the test track.

[0049] It also includes laser marking machines and auxiliary testing stations.

[0050] The laser marking machine is mounted on a workbench and located between the first sorting station and the 2D image inspection mechanism.

[0051] The laser marking machine is used for laser marking of good products;

[0052] The auxiliary testing station is located on the workbench, between the 2D image inspection mechanism and the 3D image inspection mechanism.

[0053] The auxiliary testing station has the same structure as the testing station. The auxiliary testing station is used to test the electrical properties of the marked device under test and to filter out good and defective products.

[0054] In operation, this invention includes a lead-cutting and forming device and a testing device arranged sequentially. It effectively integrates the lead-cutting and forming process with the testing and inspection process in the semiconductor packaging process, reduces storage and transportation costs during turnover, eliminates mismixing of materials during transportation and storage, improves production efficiency and reduces costs, and can effectively reduce the risk of mismixing of materials. It can also promptly identify appearance defects and electrical defects caused by the lead-cutting and forming process. Compared with the traditional separate process, it can quickly cut off the generation of defects, avoid batch failures, and reduce losses.

[0055] This invention improves work efficiency and saves time. Attached Figure Description

[0056] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In the drawings, the parts are not necessarily drawn to scale.

[0057] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ,

[0058] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ,

[0059] Figure 3 This is a schematic diagram of the structure of the present invention.

[0060] Figure 4 This is a partial schematic diagram of the rib cutting and forming device.

[0061] Figure 5 This is a schematic diagram of the pawl structure.

[0062] Figure 6 This is a structural diagram of the compression block.

[0063] Figure 7 This is a partial schematic diagram of the bead cutting and bending mechanism.

[0064] Figure 8 This is a structural diagram of the framework.

[0065] Figure 9 This is a schematic diagram of the frame structure after processing in the rib-cutting area.

[0066] Figure 10 This is a structural diagram of the frame after processing in the bending area.

[0067] Figure 11 This is a structural diagram of the testing station.

[0068] Figure 12 yes Figure 11 Top view,

[0069] Figure 13 This is a structural diagram of a 3D image inspection mechanism.

[0070] Figure 14 This is a structural diagram of the sorting station.

[0071] Figure 15 yes Figure 1 A partial schematic diagram at point A in the middle.

[0072] Figure 16 yes Figure 15 A magnified view of a section at point M.

[0073] Figure 17 This is a structural diagram of the packaging device.

[0074] Figure 18 yes Figure 17 A magnified view of a portion at point N.

[0075] Figure 1 shows the rebar cutting and forming device.

[0076] 11 is the computer case.

[0077] 12 is the magazine, 120 is the ejector cylinder.

[0078] 13 is the feed track.

[0079] 14 is the clamping mechanism, 141 is the support platform, 142 is the clamping cylinder for up-and-down movement, 143 is the gripper, 144 is the sliding track, 145 is the slider, 146 is the conveyor belt, and 147 is the moving block.

[0080] 15 is the actuating mechanism, 151 is the pawl, 1511 is the T-shaped connecting rod, 1512 is the L-shaped lever, 152 is the support frame, 153 is the pawl tooth, 154 is the pawl's forward and backward movement cylinder, 155 is the support platform, 156 is the pawl's up and down movement cylinder, 157 is the base, and 158 is the spring.

[0081] 16 is the tendon cutting and bending mechanism, 161 is the tendon cutting main cylinder, 162 is the pressure block, 163 is the receiving groove, 164 is the tendon cutting tool one, 165 is the bending tool, 166 is the tendon cutting tool two, and 167 is the sinking groove.

[0082] 2 is the testing device.

[0083] 21 is the workbench.

[0084] 22 is the testing station, 221 is the motion cylinder, and 222 is the test piece.

[0085] 23 is the image inspection station; 231 is the support; 232 is the 2D camera; 233 is the light source; 234 is the turntable; 235 is the rotary table; 236 is the vacuum suction pen; 237 is the base; and 238 is the 3D camera.

[0086] 24 is the sorting station, 241 is the gantry frame, 2410 is the sliding hole, 242 is the lifting cylinder, 243 is the defective product box, 244 is the belt, 245 is the upright frame, 246 is the position sensor, and 247 is the position sensing area.

[0087] 25 is the test track, and 250 is the opening.

[0088] 26 is the conveyor belt, 27 is the laser marking machine, and 28 is the auxiliary testing station.

[0089] 3 is the packaging device.

[0090] 31 is the reel receiving mechanism.

[0091] 311 is the carrier tape unwinder, 3111 is the unwind reel, and 3112 is the empty tape.

[0092] 312 is a tape and reel packaging machine, 3121 is a packaging upper and lower cylinder, and 3122 is a tape and reel packaging body.

[0093] 313 is the winding machine, and 3131 is the winding reel.

[0094] 32 is the packaging tube receiving mechanism.

[0095] 321 is the material feeding / receiving track, and 3210 is the notch.

[0096] 322 is the material receiving / discharging bracket, 3211 is the packaging tube placement position, and 3212 is the packaging tube collection position.

[0097] 323 is the mounting plate, 324 is the packaging tube, 325 is the pusher cylinder, 326 is the feed cylinder, and 327 is the sensor.

[0098] 4 represents the frame, and 40 represents the gap.

[0099] 5 represents the device under test, and 50 represents the pin.

[0100] 6 is the third sorting station. Detailed Implementation

[0101] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0102] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0103] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0104] The present invention is as follows Figure 1-18As shown, a semiconductor device continuous processing equipment includes a lead-cutting and forming device 1 and a testing device 2 arranged sequentially.

[0105] The rib cutting and forming device 1 is used to cut and bend the frame 4 to form a dispersed test device 5;

[0106] The testing device 2 is used to test the device under test 5, select good products and defective products, and remove the defective products.

[0107] In specific applications, it also includes a packaging device 3, which is used to package good products. The packaging device 3 includes a reel receiving mechanism 31 and a packaging tube receiving mechanism 32.

[0108] In operation, this invention includes a lead-cutting and forming device, a testing device, and a packaging device arranged sequentially. It effectively integrates the lead-cutting and forming process with the testing and inspection process in semiconductor packaging, reducing storage and transportation costs during turnover, eliminating mismixing of materials during transportation and storage, improving production efficiency and reducing costs, while also effectively reducing the risk of mismixing of materials. Furthermore, it can promptly identify appearance defects and electrical defects caused by the lead-cutting and forming process. Compared with traditional separate processes, it can quickly cut off the generation of defects, avoid batch failures, and reduce losses.

[0109] This invention improves work efficiency and saves time.

[0110] like Figure 4 As shown, the rebar cutting and forming device 1 includes a housing 11, which contains a spring clip 12, a feeding track 13, a clamping mechanism 14, a tossing mechanism 15, and a rebar cutting and bending mechanism 16.

[0111] The magazine 12 and the actuating mechanism 15 are sequentially arranged on one side of the feeding track. The magazine 12 is used to stack several frames 4. The bottom of the magazine 12 is provided with a top-loading cylinder 120 for pushing the frames upward.

[0112] The clamping mechanism 14 is used to clamp the frame inside the magazine onto the feed track.

[0113] The actuating mechanism 15 is used to move the frame within the feed track.

[0114] The rib cutting and bending mechanism 16 is used to cut and bend the ribs of the frame within the feed track.

[0115] When the rebar cutting and forming device is working, the rebar frame to be cut is placed in the magazine and placed in the feeding positioning position. At this time, since the bottom of the magazine is equipped with a top material cylinder, it is easy to lift the frame upward one by one, which is convenient for subsequent clamping operations.

[0116] The material is clamped onto the feed track by the clamping mechanism, and then the frame is moved by the actuating mechanism. Once it reaches the cutting and bending section, the cutting and bending mechanism is activated. After completion, the subsequent testing begins.

[0117] The magazine includes at least two magazines to facilitate the placement of the frame and improve efficiency.

[0118] The clamping mechanism 14 includes a support platform 141, a clamping cylinder 142 for up and down movement, and a gripper 143 (i.e., an open clamping cylinder).

[0119] The support platform 141 is located above the feed rail 13 and the magazine 12. The support platform 141 is provided with a sliding rail 144. The clamping cylinder 142 is connected to the sliding rail 144 through a slider 145. The gripper 143 is connected to the piston rod at the bottom of the clamping cylinder 142. The gripper 143 is used to clamp the frame.

[0120] The support platform 141 is also provided with a conveyor belt 146 driven by a motor, and a moving block 147 is provided on the conveyor belt for connecting the slider.

[0121] When the clamping mechanism is activated, the motor on the support platform drives the conveyor belt, which in turn moves the moving block to drive the slider. The slider then moves the clamping cylinder up and down to the spring clip, where the gripper (i.e., the open clamping cylinder) picks up the frame and moves it to the feeding track to place the frame into the feeding track, making operation convenient.

[0122] like Figure 5 As shown, the actuating mechanism includes a pawl 151 and a support frame 152.

[0123] The pawl includes a T-shaped connecting rod 1511 and an L-shaped pawl 1512. The vertical end of the L-shaped pawl 1512 is connected to the T-shaped connecting rod 1511, and a plurality of pawl teeth 153 are evenly distributed at the bottom of the horizontal end. The plurality of pawl teeth are correspondingly located in the gaps 40 between adjacent devices under test in the frame.

[0124] The T-shaped connecting rod 1511 is movably connected to the support frame 152 via a pawl-driven forward and backward movement cylinder 154. The support frame 152 is connected to the support platform 155, and the pawl-driven forward and backward movement cylinder 154 is located on the support platform 155.

[0125] The bottom of the support frame 152 is provided with a pawl-moving cylinder 156;

[0126] The support platform 155 is movably connected above the base 157 via guide posts, and a spring 158 is provided between the support platform and the base.

[0127] When the actuating mechanism is activated, the up-and-down movement cylinder of the pawl drives the pawl to rise and fall through the support frame. During the descent, several pawl teeth on the pawl are positioned in the gaps between adjacent devices under test in the frame. Then, the pawl is moved to the area to be cut or bent by the forward and backward movement cylinder of the pawl. After processing is completed, it is moved to the subsequent test.

[0128] Because the cylinders for the forward and backward movement of the pawl are located on the support platform, and the support platform is movably connected to the base above it via guide columns, and a spring is provided between the support platform and the base; in this way, the reliability of the lifting and lowering of the support frame is ensured, and the reliability of support and reset is ensured by the spring.

[0129] like Figure 6-7 As shown, the rebar cutting and bending mechanism 16 includes a rebar cutting main cylinder 161 and a pressure block 162.

[0130] The main cylinder 161 for cutting tendons is used to drive the pressing block 162 to move up and down. The pressing block 162 has a receiving groove 163 in the middle of its bottom, which is located directly above the feeding track.

[0131] The bottom of the pressure block is provided with a rib-cutting area and a bending area.

[0132] The rib cutting area includes a rib cutting tool 164, which is located on one side of the receiving groove. The rib cutting tool is used to cut the connecting ribs between adjacent test devices on one side of the frame.

[0133] The bending area includes a bending tool 165 and a rib-cutting tool 166. The bending tool and the rib-cutting tool 166 are located on both sides of the receiving groove. The bending tool 165 is used to bend the tube foot 50 after the connecting rib has been cut off on one side of the frame.

[0134] The second rib cutting tool 166 is used to cut the connecting ribs between adjacent test devices on the other side of the frame.

[0135] When the frame enters under the action of the pawl, the rib cutting and bending mechanism is activated. The pressure block is raised and lowered by the rib cutting main cylinder. When the frame moves to the bottom of the pressure block, the pressure block descends. The first rib cutting zone cuts the connecting ribs on one side of the frame. The pressure block rises and the frame moves. The second rib cutting zone bends and cuts the ribs on the frame after the previous rib cutting. In this way, the frame performs rib cutting and bending actions in sequence.

[0136] Because the frame has connecting ribs on both sides, the bending action is performed in two separate steps to ensure the reliability of the subsequent bending action.

[0137] A groove 167 is provided on one side of the feed track below the bending area to facilitate the bending of the tube pins by the protruding bending cutter.

[0138] The testing device includes a workbench 21, a testing station 22, an image detection station 23, and two sorting stations 24.

[0139] The workbench 21 is equipped with a test track 25, and a ring conveyor belt 26 is installed inside the test track. The conveyor belt is used to transport the device under test into the test track.

[0140] The two sorting stations 24 are the first sorting station and the second sorting station, respectively.

[0141] The test station 22, the first sorting station, the image detection station 23, and the second sorting station are respectively set on the workbench and arranged sequentially along the test track;

[0142] The test track 25 is provided with several openings 250, which correspond to the test station, the image detection station and two sorting stations respectively, to facilitate the testing of the device under test, and also include corresponding laser marking operations.

[0143] The testing station 22 is used to test the electrical properties of the device under test and to filter out good and defective products.

[0144] The sorting station 24 is used to sort defective products.

[0145] The image inspection station 23 is used to inspect the appearance of the device under test and filter out good and bad products.

[0146] When the testing device is working, it first tests the electrical properties at the testing station, and good products continue to flow while defective products are sorted; then it performs visual inspection at the image inspection station, and good products continue to flow while defective products are sorted.

[0147] like Figure 11-12 As shown, the test station includes a pair of motion cylinders 221.

[0148] A pair of motion cylinders are symmetrically arranged on the worktable and located on both sides of the test track.

[0149] The piston rod of the moving cylinder is connected to the test piece 222, and the test pieces on the pair of moving cylinders are used to contact both sides of the device under test.

[0150] When the device under test is moved to the test station, a pair of motion cylinders are activated to bring the test piece into contact with both sides of the device under test. In application, the test piece is connected to the test instrument via an external wire to perform the test.

[0151] The electrical testing station is mainly used for testing the electrical capabilities of products. It can test mainstream products such as diodes, transistors, MOSFETs, and IGBTs. The Kelvin connection method is used to ensure the accuracy of the test.

[0152] The image inspection station includes a 2D image inspection mechanism.

[0153] The 2D image inspection mechanism includes a support 231, a 2D camera 232, and a light source 233. The support is mounted on a workbench and located on one side of the test track.

[0154] The 2D camera 232 and the light source 233 are sequentially mounted on the bracket and located above the test track.

[0155] 2D image inspection identifies surface defects on the front of the device under test. A light source is set up to provide supplemental illumination.

[0156] like Figure 13 As shown, it also includes a 3D image inspection mechanism, which is located behind the 2D image inspection mechanism.

[0157] The 3D image inspection mechanism includes a turntable 234 driven by a servo motor, a rotating stage 235, and a 3D5S vision inspection mechanism. The turntable is located above the test track 25, and vacuum suction pens 236 connected by cylinders are spaced apart on the annular surface of the turntable.

[0158] The rotary table and the 3D5S vision inspection mechanism are located on the same side of the test track. The rotary table is connected to the workbench via a base 237. The rotary table is used to turn the good products, which facilitates their rotation and placement on the conveyor belt, ensuring that the good products are transported in the same direction. Rotation of the rotary table is a routine action, such as being driven by a motor.

[0159] The 3D5S visual inspection mechanism includes a 3D camera 238, which is mounted on a worktable.

[0160] The 3D camera is used to photograph the finished products.

[0161] When the 3D image inspection mechanism operates, it first uses a motor-driven vacuum pen to pick up good products from the test track, places the good products on a rotating table for rotation, and ensures that subsequent devices are in the same direction.

[0162] The good product is then placed on a 3D camera for photographing, thus achieving the detection.

[0163] 3D image inspection identifies appearance defects on the back and four other faces of the device under test, facilitating the sorting of defective products. Here, the 3D5S vision inspection mechanism is a standard technology, such as the 3D5S machine vision inspection system from Xi'an Haike Yibang Optoelectronics Technology Co., Ltd.

[0164] The 2D and 3D cameras are connected to the controller to perform recognition operations.

[0165] like Figure 14As shown, the sorting station includes a gantry frame 241, a lifting cylinder 242, a vacuum suction pen, and at least two defective product boxes 243.

[0166] The gantry frame 241 is mounted on the workbench 21, the test track 25 is located in the middle of the gantry frame, the top of the lifting cylinder 242 is movably connected to the top of the gantry frame, and the bottom is connected to a vacuum suction pen. The vacuum suction pen is used to suck up and put defective products into the defective product box.

[0167] The defective product box 243 is placed on the workbench and located on both sides of the test track.

[0168] When the sorting station is working, the lifting cylinder drives the vacuum suction pen to operate. The vacuum suction pen is used to pick up and put out defective products into the defective product box, which is convenient for operation.

[0169] The top of the portal frame is provided with a motor-driven belt 244, which is connected to a lifting cylinder through a vertical frame 245; the top of the portal frame is provided with a sliding hole 2410, and the vertical frame is located in the sliding hole.

[0170] By setting a motor-driven belt, it is easy to move back and forth, thereby driving the lifting cylinder on the upright frame to move; since the upright frame is placed in the sliding hole, the reliability of sliding is guaranteed.

[0171] The gantry frame is equipped with several position sensors 246, each of which is positioned above the defective product box.

[0172] The stand is provided with a position sensing area 247, and the position sensor is used to sense the position sensing area.

[0173] In this way, when the lifting cylinder moves to the corresponding defective product box, the vacuum suction pen puts the defective product into the defective product box.

[0174] The position sensor is connected to the controller, which controls the motor to move the device to different defective product boxes for storage.

[0175] It also includes a laser marking machine 27 and an auxiliary testing station 28.

[0176] The laser marking machine 27 is mounted on a workbench and located between the first sorting station and the 2D image inspection mechanism.

[0177] The laser marking machine 27 is used for laser marking on good products;

[0178] The auxiliary testing station 27 is located on the workbench and between the 2D image inspection mechanism and the 3D image inspection mechanism.

[0179] The auxiliary testing station has the same structure as the testing station. The auxiliary testing station is used to test the electrical properties of the marked device under test and to filter out good and defective products.

[0180] Laser marking machines are used to mark good products to meet the needs of different customers. After marking, further electrical testing is conducted to avoid damage to the tested devices caused by laser marking and to ensure product reliability.

[0181] If the device under test fails electrical testing after marking, it will be directly sorted as a defective product without going through the 3D imaging inspection mechanism.

[0182] The test station configuration in this invention includes four stations before laser scanning and two stations after laser scanning, ensuring the test station requirements of most products on the market. Customization is also available upon request. Standard MOS products typically test four stations: RG, EAS, DVDS, and DC. Some customers may add SW testing, which will also meet their requirements.

[0183] It also includes the third sorting station 6.

[0184] The third sorting station 6 is located on the workbench, between the testing device 2 and the packaging device 3.

[0185] The third sorting station 6 is used to sort good products into the packaging tube receiving mechanism 32.

[0186] The third sorting station includes an auxiliary gantry frame, an auxiliary lifting cylinder, and an auxiliary vacuum suction pen, which have the same structure as the gantry frame, lifting cylinder, and vacuum suction pen of the first and second sorting stations.

[0187] The auxiliary gantry frame is mounted on the workbench, the test track is located in the middle of the auxiliary gantry frame, the top of the auxiliary lifting cylinder is movably connected to the top of the auxiliary gantry frame, and the bottom is connected to the auxiliary vacuum suction pen. The auxiliary vacuum suction pen is used to suck up and put good products into the packaging tube receiving mechanism.

[0188] The structure and operating principle of the third sorting station are similar to those of the first and second sorting stations. Here, good products are simply placed into the packaging and receiving process.

[0189] The packaging equipment is divided into a reel receiving mechanism and a packaging tube receiving mechanism, which can realize two different packaging forms to meet different customer requirements.

[0190] like Figure 15-16 As shown, the reel take-up mechanism 31 includes a carrier tape unwinding machine 311, a tape packaging machine 312, and a rewinding machine 313 arranged sequentially.

[0191] The carrier tape unwinding machine 311 includes an unwinding reel 3111 driven by a feeding motor. The unwinding reel is used to place an empty carrier tape 3112. The empty carrier tape is located on the same straight line as the test track. The empty carrier tape is used to place good products on the conveyor belt 26.

[0192] The tape and reel packaging mechanism 312 includes a packaging upper and lower cylinder 3121 and a tape and reel packaging body 3122. The packaging upper and lower cylinders are connected to the worktable and are used to drive the tape and reel packaging body to package the carrier tape containing the good product.

[0193] The winding machine 313 includes a winding reel 3131 driven by a winding motor, which is used to wind up the packaged carrier tape.

[0194] When the reel take-up mechanism operates, the carrier tape unwinder first releases an empty carrier tape, allowing the good products on the conveyor belt to fall into the empty tape. The tape is then packaged by the tape packaging machine, and finally, the rewinder performs the winding operation, simplifying the process. The packaged tape may be a flexible transparent plastic sheet, which is then glued, etc.

[0195] like Figure 17-18 As shown, the packaging tube receiving mechanism includes an arc-shaped receiving and discharging track 321 and a receiving and discharging bracket 322.

[0196] The feeding and receiving track is located on the workbench, on one side of the test track 25, and the feeding and receiving bracket 322 is located at the bottom of the feeding and receiving track 321.

[0197] The material receiving and discharging support 321 is provided with a packaging tube placement position 3211 and a packaging tube collection position 3212.

[0198] The packaging tube placement position has a pair of symmetrical mounting plates 323 at both ends, and a number of packaging tubes 324 are placed between the pair of mounting plates. The packaging tubes are connected to the material receiving and discharging track.

[0199] The material receiving and discharging bracket 322 is equipped with a pusher cylinder 325 on one side of the packaging tube placement position, which is used to push the packaging tube to the packaging tube collection position;

[0200] The mounting plate of the feeding and receiving bracket facing the feeding and receiving track is equipped with a feeding and receiving cylinder 326 and a sensor 327.

[0201] The feeding and receiving track is provided with a notch, and the sensor corresponds to notch 3210 to detect good products.

[0202] The feed cylinder is used to limit the movement of good products.

[0203] When the packaging tube receiving mechanism is activated, the good products slide down the arc-shaped receiving and discharging track into the packaging tubes in the receiving and discharging bracket. After the packaging tubes are full, they are pushed to the packaging tube collection position by the pushing cylinder. At this time, the remaining packaging tubes continue to be received.

[0204] Meanwhile, during the material receiving process, sensors are set up to detect good products, thereby controlling the action of the receiving and discharging cylinders to ensure the reliability of the receiving action. If the cylinder is full, the good products will stop sliding down, and the action will continue after the packaging tube is replaced.

[0205] The sensor is connected to a controller, which in turn is connected to the feeding and receiving cylinders. All components involved in this invention, such as the top-loading cylinder and the clamping cylinder, are controlled by the controller, which also controls the motor – all conventional technologies.

[0206] Regarding the information disclosed in this case, the following points need to be clarified:

[0207] (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design.

[0208] (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments;

[0209] The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A continuous semiconductor device processing apparatus, characterized in that, It includes a rebar cutting and forming device and a testing device arranged in sequence. The rib-cutting and forming device is used to cut and bend the frame to form dispersed test devices; The testing device is used to test the device under test, filter out good products and defective products, and remove the defective products. The rebar cutting and forming device includes a machine housing. The machine housing is equipped with a magazine, a feeding track, a clamping mechanism, a shifting mechanism, and a cutting and bending mechanism. The actuating mechanism is used to move the frame within the feed track. The rib cutting and bending mechanism is used to cut and bend the ribs of the frame inside the feed track; The actuating mechanism includes a pawl and a support frame. The pawl includes a T-shaped connecting rod and an L-shaped pawl. The vertical end of the L-shaped pawl is connected to the T-shaped connecting rod, and the bottom of the horizontal end is provided with a plurality of pawl teeth evenly distributed thereon. The plurality of pawl teeth are correspondingly located in the gaps between adjacent devices under test in the frame. The T-shaped connecting rod is movably connected to the support frame via a pry bar cylinder, the support frame is connected to a support platform, and the pry bar cylinder is located on the support platform. The bottom of the support frame is equipped with a pawl-type cylinder for up-and-down movement; The support platform is movably connected to the base above it via guide columns, and a spring is provided between the support platform and the base; The rebar cutting and bending mechanism includes a rebar cutting main cylinder and a pressure block. The main cylinder for cutting tendons is used to drive the pressing block to move up and down. The pressing block has a receiving groove in the middle of its bottom, which is located directly above the feeding track. The bottom of the pressure block is provided with a rib-cutting area and a bending area. The rib cutting area includes a rib cutting tool, which is located on one side of the receiving groove. The rib cutting tool is used to cut the connecting ribs between adjacent devices under test on one side of the frame. The bending area includes a bending tool and a second rib-cutting tool, which are located on both sides of the receiving groove. The bending tool is used to bend the pipe foot after the connecting rib has been cut off on one side of the frame. The second rib-cutting tool is used to cut the connecting ribs between adjacent test devices on the other side of the frame.

2. The semiconductor device continuous processing equipment according to claim 1, characterized in that, The magazine and the actuating mechanism are sequentially arranged on one side of the feeding track. The magazine is used to stack several frames, and the bottom of the magazine is equipped with a top-loading cylinder for pushing the frames upward. The clamping mechanism is used to clamp the frame inside the magazine onto the feed track.

3. The semiconductor device continuous processing equipment according to claim 2, characterized in that, The clamping mechanism includes a support platform, a clamping cylinder for vertical movement, and grippers. The support platform is located above the feed rail and the magazine. The support platform is provided with a sliding rail. The clamping cylinder is connected to the sliding rail via a slider. The gripper is connected to the piston rod at the bottom of the clamping cylinder. The gripper is used to clamp the frame. The support platform is also equipped with a conveyor belt driven by a motor, and a moving block is provided on the conveyor belt for connecting the slider.

4. A semiconductor device continuous processing equipment according to claim 2, characterized in that, The testing device includes a workbench, a testing station, an image detection station, and two sorting stations. The workbench is equipped with a test track, and a ring-shaped conveyor belt is installed inside the test track. The conveyor belt is used to transport the device under test into the test track. The two sorting stations are designated as the first sorting station and the second sorting station. The testing station, the first sorting station, the image detection station, and the second sorting station are respectively set on the workbench and arranged sequentially along the testing track; The test track has several openings, which correspond to the test station, the image detection station, and two sorting stations, respectively. The testing station is used to test the electrical properties of the device under test and to filter out good and defective products. The sorting station is used to sort defective products. The image inspection station is used to inspect the appearance of the device under test and to filter out good and bad products.

5. A semiconductor device continuous processing equipment according to claim 4, characterized in that, The test station includes a pair of moving cylinders. A pair of motion cylinders are symmetrically arranged on the worktable and located on both sides of the test track. The piston rod of the moving cylinder is connected to the test piece, and the test pieces on the pair of moving cylinders are used to contact both sides of the device under test.

6. The semiconductor device continuous processing equipment according to claim 4, characterized in that, The image inspection station includes a 2D image inspection mechanism. The 2D image inspection mechanism includes a support frame, a 2D camera, and a light source. The support frame is mounted on a workbench and located on one side of the test track. The 2D camera and light source are sequentially mounted on the support and located above the test track.

7. A semiconductor device continuous processing apparatus according to claim 6, characterized in that, It also includes a 3D image inspection mechanism, which is located behind the 2D image inspection mechanism. The 3D image inspection mechanism includes a turntable, a rotating stage, and a 3D5S vision inspection mechanism driven by a servo motor. The turntable is located above the test track, and vacuum suction pens connected by cylinders are spaced apart on the turntable's annular surface. The rotary table and the 3D5S vision inspection mechanism are located on the same side of the test track. The rotary table is connected to the workbench via a base and is used to rotate the good products. The 3D5S visual inspection mechanism includes a 3D camera, which is mounted on a worktable. The 3D camera is used to photograph the finished products.

8. A semiconductor device continuous processing apparatus according to claim 4, characterized in that, The sorting station includes a gantry frame, a lifting cylinder, a vacuum suction pen, and at least two defective product boxes. The gantry frame is mounted on the workbench, the test track is located in the middle of the gantry frame, the top of the lifting cylinder is movably connected to the top of the gantry frame, and the bottom is connected to the vacuum suction pen. The vacuum suction pen is used to suck up and put defective products into the defective product box. The defective product boxes are placed on the workbench and located on both sides of the test track.

9. A semiconductor device continuous processing equipment according to claim 4, characterized in that, It also includes laser marking machines and auxiliary testing stations. The laser marking machine is mounted on a workbench and located between the first sorting station and the 2D image inspection mechanism. The laser marking machine is used for laser marking of good products; The auxiliary testing station is located on the workbench, between the 2D image inspection mechanism and the 3D image inspection mechanism. The auxiliary testing station has the same structure as the testing station. The auxiliary testing station is used to test the electrical properties of the marked device under test and to filter out good and defective products.

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