Power supply unit of aerosol-generating device

Abstract

A non-combustion inhaler (100) includes a power supply BAT, a heater connector Cn, a step-up DC / DC converter (9), a socket mounting substrate (162) in which the step-up DC / DC converter (9) is disposed on a back surface (162b), output capacitors C8 to C12, a power supply ground PGND provided inside the socket mounting substrate (162) and connected to the output capacitors C8 to C12, a signal ground AGND insulated from the power supply ground PGND inside the socket mounting substrate (162) and connected to a feedback terminal FB of the step-up DC / DC converter (9), and a common ground CGND. On the back surface (162b) of the socket mounting substrate (162), no electronic component is disposed in a common ground projection region (167) overlapping the common ground CGND.

Description

Technical Field

[0001] This invention relates to the power supply unit of an aerosol generation device. Background Technology

[0002] Patent documents 1 and 2 describe power supply units for aerosol generation devices equipped with voltage conversion ICs that boost and / or buck power. In these power supply units, to improve aerosol generation efficiency, the power supply voltage is converted by the voltage conversion IC and then supplied to the heater. Grounding of components connected to the input / output lines of the voltage conversion IC causes voltage fluctuations and noise; therefore, it is preferable to separate the grounding from that used for other signals.

[0003] In cases where power supply grounding and signal grounding are separated, a common grounding should be considered to eliminate potential deviations between these grounds.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Chinese Patent Application Publication No. 110547516

[0007] Patent Document 2: Description of Chinese Patent Application Publication No. 104664605 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] However, if a common ground is set, heat and noise will be generated along with the elimination of potential deviation, so there is room for research on how to arrange electronic components on the circuit board.

[0010] The present invention provides a power supply unit for an aerosol generation apparatus on which electronic components are suitably arranged on a circuit board.

[0011] Methods for solving problems

[0012] The power supply unit of the aerosol generation apparatus of the present invention includes:

[0013] power supply;

[0014] A heater connector for connecting a heater that consumes power supplied from the power source to heat the aerosol source;

[0015] The voltage conversion IC includes an output terminal connected to the heater connector and converting the input voltage and outputting it, and a detection terminal for detecting the voltage output from the output terminal;

[0016] The circuit board includes a first side on which the voltage conversion IC is disposed and a second side serving as the back side of the first side;

[0017] A capacitor, one end of which is connected to the output terminal;

[0018] A first ground is disposed inside the circuit board and connected to the other end of the capacitor;

[0019] A second ground is disposed inside the circuit board, insulated from the first ground inside the circuit board and connected to the detection terminal; and

[0020] Common ground, electrically connected to the first ground and the second ground.

[0021] On the second surface, no electronic components are provided in the common ground projection area that overlaps with the common ground when viewed from a direction orthogonal to the circuit board.

[0022] The effects of the invention

[0023] According to the present invention, electronic components can be appropriately arranged on a circuit board to stabilize the operation of the power supply unit of the aerosol generation device. Attached Figure Description

[0024] Figure 1 This is a 3D diagram of a non-combustion inhaler.

[0025] Figure 2 This is a perspective view showing a non-combustion inhaler with the rod installed.

[0026] Figure 3 Other perspective views of non-combustion inhalers.

[0027] Figure 4 This is an exploded perspective view of a non-combustion inhaler.

[0028] Figure 5 This is a three-dimensional view of the internal unit of a non-combustion inhaler.

[0029] Figure 6 yes Figure 5 An exploded 3D view of the internal units.

[0030] Figure 7 It is a 3D view with the power supply and the internal units of the base plate removed.

[0031] Figure 8 It is a different perspective view without the power supply and the internal units of the base plate.

[0032] Figure 9 This is a schematic diagram used to illustrate the operating mode of the inhaler.

[0033] Figure 10 It is a diagram showing the schematic structure of the internal unit's circuitry.

[0034] Figure 11 It is a diagram showing the schematic structure of the internal unit's circuitry.

[0035] Figure 12 It is a diagram showing the schematic structure of the internal unit's circuitry.

[0036] Figure 13 This is a diagram used to illustrate the operation of the circuit in sleep mode.

[0037] Figure 14 This is a diagram used to illustrate the operation of the circuit in the active mode.

[0038] Figure 15 This is a diagram used to illustrate the operation of the circuit in the initial heating setting mode.

[0039] Figure 16 This is a diagram used to illustrate the operation of the circuit when the heater is heating in heating mode.

[0040] Figure 17 This is a diagram illustrating the operation of the circuit when the heater detects temperature in heating mode.

[0041] Figure 18 This is a diagram used to illustrate the operation of the circuit in charging mode.

[0042] Figure 19 This is a diagram illustrating the circuitry during MCU reset (restart).

[0043] Figure 20 This is a more detailed circuit diagram showing the main parts of the peripheral circuitry of the boost DC / DC converter.

[0044] Figure 21 This is a cross-sectional view of a non-combustion inhaler.

[0045] Figure 22 This is a diagram showing the main surface of the connector mounting substrate.

[0046] Figure 23 This is a diagram showing the secondary side of the connector mounting substrate.

[0047] Figure 24 This diagram illustrates the internal structure of the connector mounting substrate.

[0048] Figure 25 This is a diagram showing the main surface of the MCU mounting substrate.

[0049] Figure 26 This is a diagram showing the side of the MCU mounting substrate. Detailed Implementation

[0050] The following description, with reference to the accompanying drawings, describes an inhalation system as an embodiment of the aerosol generating apparatus of the present invention. This inhalation system includes a non-combustion inhaler 100 (hereinafter simply referred to as "inhaler 100") as an embodiment of the power supply unit of the present invention, and a rod 500 heated by the inhaler 100. In the following description, an example will be given of a structure in which the heating element is non-detachable from the inhaler 100. However, the heating element may also be configured to be detachable from the inhaler 100. For example, the rod 500 and the heating element may be integrated into a component that is detachable from the inhaler 100. That is, the power supply unit of the aerosol generating apparatus may also be a structure that does not include the heating element as a component. Furthermore, "non-detachable" means that it cannot be disassembled within the scope of the intended application. Alternatively, the heating element may be formed by the cooperation of a heating element built into the rod 500 and an induction heating coil provided in the inhaler 100.

[0051] Figure 1 This is a perspective view showing the overall structure of the inhaler 100. Figure 2 This is a perspective view showing the inhaler 100 with the rod 500 installed. Figure 3 These are other perspective views of the inhaler 100. Figure 4 This is an exploded perspective view of the inhaler 100. Furthermore, for convenience, the following description will use an orthogonal coordinate system in three-dimensional space, where the three mutually orthogonal directions are defined as front-back, left-right, and up-down. In the figure, front is denoted as Fr, back as Rr, right as R, left as L, top as U, and bottom as D.

[0052] The inhaler 100 is configured as an example of an elongated, generally cylindrical rod 500 that generates a base material as a flavor component by heating (see reference). Figure 2 This is used to generate a scented aerosol, wherein the scent-generating substrate has a filler containing an aerosol source and a scent source.

[0053] <Fragrance component generating substrate (rod)>

[0054] The rod 500 includes a filler containing an aerosol source that is heated at a specified temperature to generate an aerosol.

[0055] There are no particular limitations on the type of aerosol source; extracts from various natural substances and / or their constituent components can be selected depending on the application. Aerosol sources can be solids or liquids such as polyols like glycerol and propylene glycol, or water. Aerosol sources may also contain flavor sources such as cigarette raw materials that release flavor components upon heating, or extracts derived from cigarette raw materials. The gases that impart flavor components are not limited to aerosols; for example, invisible vapors may also be generated.

[0056] The filling of the rod 500 may contain tobacco as a flavoring source. The material of the tobacco is not particularly limited; known materials such as leaves and stems can be used. The filling may also contain one or more flavorings. The type of flavoring is not particularly limited, but menthol is preferred from the viewpoint of imparting a good flavor. Flavoring sources may include plants other than tobacco (e.g., mint, medicinal herbs, or vanilla). Depending on the application, the rod 500 may also not contain a flavoring source.

[0057] <Overall Structure of a Non-combustion Inhaler>

[0058] Next, refer to Figures 1-4 The overall structure of the inhaler 100 will be described.

[0059] The inhaler 100 has a generally rectangular parallelepiped-shaped housing 110, which has a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface. The housing 110 includes: a bottom-cylindrical housing body 112, integrally formed with the front surface, rear surface, upper surface, lower surface, and right surface; and an opening 114 that closes the housing body 112 (see reference). Figure 4 The outer panel 115 and the inner panel 118 of the left surface, and the slider 119, are also present.

[0060] The inner panel 118 is fixed to the housing body 112 by bolts 120. The outer panel 115 is fixed to the housing body 112 by magnets 124 in a manner that covers the outer surface of the inner panel 118. The magnets 124 are held in place by an insulating base plate 150 (described later) housed within the housing body 112. Figure 5 The outer panel 115 is secured by magnets 124, allowing the user to replace the outer panel 115 according to their preference.

[0061] The inner panel 118 has two through holes 126 formed for the magnet 124 to pass through. Between the two vertically arranged through holes 126 on the inner panel 118, there is also a longitudinally elongated hole 127 and a circular hole 128. The elongated hole 127 allows light emitted from the eight LEDs (Light Emitting Diodes) L1 to L8 built into the housing body 112 to pass through the circular hole 128. A push-button operation switch OPS built into the housing body 112 passes through the circular hole 128. Thus, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 on the outer panel 115. Furthermore, the user can press the operation switch OPS via the press part 117 on the outer panel 115.

[0062] like Figure 2As shown, an opening 132 for inserting a rod 500 is provided on the upper surface of the housing body 112. The slider 119 can be positioned to close the opening 132 (see reference). Figure 1 ) and the position of the open opening 132 (refer to Figure 2 It is combined with the shell body 112 by moving between them in the front and back direction.

[0063] The operating switch OPS is used to perform various operations on the inhaler 100. For example, as... Figure 2 As shown, with the lever 500 inserted and installed into the opening 132, the user operates the operation switch OPS via the pressing part 117. This, in turn, activates the heating part 170 (see reference 117). Figure 5 The rod 500 is heated without combustion. When the rod 500 is heated, an aerosol is generated from an aerosol source contained in the rod 500, and the fragrance of a fragrance source contained in the rod 500 is added to the aerosol. The user can inhale the fragrance-containing aerosol by holding the suction port 502 of the rod 500, which protrudes from the opening 132.

[0064] like Figure 3 As shown, a charging terminal 134 is provided on the lower surface of the housing body 112. This charging terminal 134 is used to electrically connect to an external power source such as a socket or a portable battery to receive power. In this embodiment, the charging terminal 134 is provided as a USB (Universal Serial Bus) Type-C shaped connector, but it is not limited to this. Hereinafter, the charging terminal 134 will also be referred to as the connector RCP.

[0065] Alternatively, the charging terminal 134 may be configured to have a receiving coil, enabling it to receive power from an external power source in a contactless manner. In this case, the power transfer (wireless power transfer) method can be electromagnetic induction, magnetic resonance, or a combination of both. As another example, the charging terminal 134 may be capable of connecting to various USB ports and may also have the aforementioned receiving coil.

[0066] Figures 1-4 The structure of the inhaler 100 shown is merely one example. The inhaler 100 can be configured in various ways such that by holding the rod 500 and applying an action such as heating, a gas with flavoring components is generated from the rod 500, and the user can inhale the generated gas.

[0067] <Internal structure of a non-combustion inhaler>

[0068] Reference Figures 5-8 The internal unit 140 of the inhaler 100 will be described.

[0069] Figure 5 This is a perspective view of the internal unit 140 of the inhaler 100. Figure 6 yes Figure 5 An exploded three-dimensional view of the internal unit 140. Figure 7 It is a 3D view with the power supply BAT and the internal unit 140 of the base plate 150 removed. Figure 8 It is a 3D view of the power supply BAT and the internal unit 140 of the base plate 150 removed.

[0070] The internal unit 140, housed within the internal space of the housing 110, includes a base plate 150, a power supply BAT, a circuit section 160, a heating section 170, a notification section 180, and various sensors.

[0071] The base plate 150 is made of an insulating material, such as resin, which has properties that make it difficult for heat to pass through. The base plate 150 includes: a plate-shaped base plate body 151 disposed approximately at the center of the interior space of the housing 110 in the front-rear direction, extending in both the vertical and front-rear directions; a plate-shaped front and rear dividing wall 152 disposed approximately at the center of the interior space of the housing 110 in the front-rear direction, extending in both the vertical and horizontal directions; a plate-shaped upper and lower dividing wall 153 extending forward from approximately the center of the front and rear dividing wall 152 in the vertical direction; a plate-shaped upper base plate wall 154 extending rearward from the upper edges of the front and rear dividing walls 152 and the base plate body 151; and a plate-shaped lower base plate wall 155 extending rearward from the lower edges of the front and rear dividing walls 152 and the base plate body 151. The left surface of the base plate body 151 is covered by the aforementioned inner panel 118 and outer panel 115 of the housing 110.

[0072] The internal space of the housing 110 is divided by the bottom plate 150 to form a heating part receiving area 142 at the upper front, a substrate receiving area 144 at the lower front, and a power supply receiving space 146 at the rear, which is divided in the vertical direction.

[0073] The heating section 170, housed in the heating section receiving area 142, is composed of multiple cylindrical components arranged concentrically to form a cylindrical body as a whole. The heating section 170 has a rod receiving section 172 capable of housing a portion of the rod 500 within it, and a heater HTR (see reference) that heats the rod 500 from its outer periphery or center. Figures 10-19Preferably, the rod receiving portion 172 is made of heat-insulating material, or heat-insulating material is provided inside the rod receiving portion 172, and the surface of the rod receiving portion 172 is insulated from the heater HTR. The heater HTR can be any element capable of heating the rod 500. The heater HTR is, for example, a heating element. Examples of heating elements include resistance thermometers, ceramic heaters, and induction heaters. As a heater HTR, it is preferred to use a heater HTR with a PTC (Positive Temperature Coefficient) characteristic, which has a resistance value that increases with increasing temperature. Alternatively, a heater HTR with an NTC (Negative Temperature Coefficient) characteristic, which has a resistance value that decreases with increasing temperature, can also be used. The heating portion 170 has the function of defining a flow path for the air supplied to the rod 500 and the function of heating the rod 500. A vent (not shown) for allowing air to flow in is formed in the housing 110, configured so that air can flow into the heating portion 170.

[0074] The power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, double-layer capacitor, etc., preferably a lithium-ion secondary battery. The electrolyte of the power supply BAT may also be composed of one or a combination of a gel electrolyte, an electrolyte solution, a solid electrolyte, and an ionic liquid.

[0075] The notification unit 180 displays various information, including the State of Charge (SOC) of the power supply BAT, the preheating time during inhalation, and the duration of inhalation. In this embodiment, the notification unit 180 includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 can be composed of light-emitting elements such as LEDs L1 to L8, vibration elements such as the vibration motor M, or sound output elements. The notification unit 180 can also be a combination of two or more of the following elements: light-emitting elements, vibration elements, and sound output elements.

[0076] Various sensors include: an inhalation sensor that detects the user's suction action (inhalation action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, a housing temperature sensor that detects the temperature of the housing 110, a cover position sensor that detects the position of the slider 119, and a panel detection sensor that detects the installation and removal of the external panel 115, etc.

[0077] The intake sensor is constructed, for example, primarily using a thermistor T2 disposed near the opening 132. The power supply temperature sensor is constructed, for example, primarily using a thermistor T1 disposed near the power supply BAT. The heater temperature sensor is constructed, for example, primarily using a thermistor T3 disposed near the heater HTR. As described above, the rod receiving portion 172 is preferably thermally insulated from the heater HTR. In this case, the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod receiving portion 172. If the heater HTR has PTC or NTC characteristics, the heater HTR itself can also be used as the heater temperature sensor. The housing temperature sensor is constructed, for example, primarily using a thermistor T4 disposed near the left surface of the housing 110. The cover position sensor is constructed primarily using a Hall IC 14 including a Hall element disposed near the slider 119. The panel detection sensor is constructed primarily using a Hall IC 13 including a Hall element disposed near the inner side of the inner panel 118.

[0078] The circuit section 160 includes four circuit boards, multiple ICs (integrated circuits), and multiple components. The four circuit boards include: an MCU mounting board 161, which mainly houses the MCU (microcontroller unit) 1 (described later) and a charging IC 2; a socket mounting board 162, which mainly houses the charging terminal 134; an LED mounting board 163, which houses the operation switch OPS, LEDs L1 to L8, and the communication IC 15 (described later); and a Hall IC mounting board 164, which houses the Hall IC 14 (described later), including a Hall element constituting a cover position sensor.

[0079] The MCU mounting substrate 161 and the connector mounting substrate 162 are arranged parallel to each other in the substrate receiving area 144. Specifically, the component placement surfaces of the MCU mounting substrate 161 and the connector mounting substrate 162 are arranged along the left-right direction and the up-down direction, with the MCU mounting substrate 161 positioned forward of the connector mounting substrate 162. Both the MCU mounting substrate 161 and the connector mounting substrate 162 have openings. With cylindrical spacers 173 positioned between the peripheries of these openings, the MCU mounting substrate 161 and the connector mounting substrate 162 are fastened to the substrate fixing portion 156 of the front and rear dividing walls 152 using bolts 136. That is, the spacers 173, together with the base plate 150, fix the position of the MCU mounting substrate 161 and the connector mounting substrate 162 inside the housing 110, and mechanically connect the MCU mounting substrate 161 and the connector mounting substrate 162. This prevents short-circuit current from occurring between the MCU mounting substrate 161 and the connector mounting substrate 162 in contact. In addition, the spacer 173 may also be conductive, and the ground of the MCU mounting substrate 161 and the ground of the socket mounting substrate 162 are connected via the spacer 173.

[0080] For convenience, if the front-facing surfaces of the MCU mounting substrate 161 and the socket mounting substrate 162 are designated as their respective main surfaces 161a and 162a, and the opposite surfaces of the main surfaces 161a and 162a are designated as their respective secondary surfaces 161b and 162b, then the secondary surface 161b of the MCU mounting substrate 161 and the main surface 162a of the socket mounting substrate 162 are positioned opposite each other with a predetermined gap. The main surface 161a of the MCU mounting substrate 161 faces the front surface of the housing 110, and the secondary surface 162b of the socket mounting substrate 162 faces the front and rear dividing walls 152 of the base plate 150. The MCU mounting substrate 161 and the socket mounting substrate 162 are electrically connected via a flexible wiring board 165. A heat diffusion member 300, described later, is provided on the secondary surface 162b of the socket mounting substrate 162.

[0081] The LED mounting substrate 163 is disposed on the left side of the base plate body 151 between two magnets 124 arranged vertically. The component mounting surface of the LED mounting substrate 163 is arranged along the vertical and horizontal directions as well as the front and back directions. In other words, the component mounting surfaces of the MCU mounting substrate 161 and the socket mounting substrate 162 are orthogonal to the component mounting surface of the LED mounting substrate 163. Thus, the component mounting surfaces of the MCU mounting substrate 161 and the socket mounting substrate 162 are not necessarily orthogonal to the component mounting surface of the LED mounting substrate 163, but are preferably intersecting (not parallel). In addition, the vibration motor M, which together with the LEDs L1 to L8 constitutes the notification unit 180, is fixed to the lower surface of the lower wall 155 of the base plate and is electrically connected to the MCU mounting substrate 161.

[0082] The Hall IC mounting substrate 164 is disposed on the upper surface of the base plate upper wall 154.

[0083] <Inhaler Operation Mode>

[0084] Figure 9 This is a schematic diagram illustrating the operating modes of the inhaler 100. (For example...) Figure 9 As shown, the operating modes of the inhaler 100 include charging mode, sleep mode, activation mode, initial heating setting mode, heating mode, and heating end mode.

[0085] The sleep mode is a power-saving mode that primarily stops supplying power to the electronic components required for heating control of the heater HTR.

[0086] The active mode is the mode in which most functions except for the heating control of the heater HTR are active. When the inhaler 100 is operating in sleep mode, if the slider 119 is opened, the operating mode is switched to active mode. When the inhaler 100 is operating in active mode, if the slider 119 is closed or the inactivity time of the operation switch OPS reaches a predetermined time, the operating mode is switched to sleep mode.

[0087] The initial heating setting mode is a mode for initially setting control parameters, etc., used to start the heating control of the heater HTR. When the inhaler 100 is operating in the active mode, if the operation of the operation switch OPS is detected, the operating mode is switched to the initial heating setting mode; if the initial setting is completed, the operating mode is switched to the heating mode.

[0088] The heating mode is the mode that executes the heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection). If the operating mode is switched to heating mode, the inhaler 100 begins the heating control of the heater HTR.

[0089] The heating end mode is the mode for completing the heating control process of the heater HTR (such as storing heating history records). When the inhaler 100 is operating in heating mode, if the power supply time to the heater HTR or the number of inhalations by the user reaches the maximum limit, or the slider 119 is closed, the operating mode switches to the heating end mode. If the end process is completed, the operating mode switches back to the activation mode. When the inhaler 100 is operating in heating mode and a USB connection is established, the operating mode switches to the heating end mode. If the end process is completed, the operating mode switches back to the charging mode. Figure 9As shown, in this case, the operating mode can also be switched to the activation mode before switching to the charging mode. In other words, the inhaler 100 can also switch operating modes in the order of heating end mode, activation mode, and charging mode when a USB connection is made while operating in heating mode.

[0090] The charging mode is a mode in which the power supply BAT is charged using power supplied from an external power source connected to the RCP connector. When the inhaler 100 is operating in sleep or active mode, if an external power source is connected to the RCP connector (USB connection), the operating mode switches to charging mode. When the inhaler 100 is operating in charging mode, if the charging of the power supply BAT is completed or the connection between the RCP connector and the external power source is disconnected, the operating mode switches back to sleep mode.

[0091] <An overview of the internal unit's circuitry>

[0092] Figure 10 , Figure 11 as well as Figure 12 This is a diagram showing a schematic structure of the circuitry of the internal unit 140. Figure 11 In addition to Figure 10 The circuit shown includes an additional region 161A (enclosed by the thick dashed line) mounted on the MCU mounting substrate 161 and a region 163A (enclosed by the thick solid line) mounted on the LED mounting substrate 163, except for the fact that... Figure 10 same. Figure 12 In addition to Figure 10 The circuit shown is except for the addition of a region 162A mounted on the socket mounting substrate 162 and a region 164A mounted on the Hall IC mounting substrate 164. Figure 10 same.

[0093] exist Figure 10 The wiring represented by the thick solid line is the wiring at the same potential as the reference potential (ground potential) of the internal unit 140 (the grounding wiring of the internal unit 140), and will be referred to as the ground wire below. Figure 10 In this diagram, an electronic component that integrates multiple circuit elements onto a single chip is represented by a rectangle. The symbols for various terminals are recorded inside the rectangle. The power supply terminals VCC and VDD, mounted on the chip, represent the power supply terminals on the high-potential side. The power supply terminals VSS and GND, mounted on the chip, represent the power supply terminals on the low-potential side (reference potential side). The potential difference between the high-potential side power supply terminals and the low-potential side power supply terminals of the chip-based electronic component is called the power supply voltage. The chip-based electronic component uses this power supply voltage to perform various functions.

[0094] like Figure 11As shown, the MCU mounting substrate 161 (range 161A) includes the following main electronic components: an MCU1 that controls the inhaler 100 as a whole; a charging IC2 that controls the charging of the power supply BAT; load switches (hereinafter referred to as LSWs) 3, 4, and 5 composed of capacitors, resistors, and transistors; a ROM (Read Only Memory) 6; a switch driver 7; a buck-boost DC / DC converter 8 (shown as buck-boost DC / DC 8 in the figure); operational amplifiers OP2 and OP3; triggers (hereinafter referred to as FFs) 16 and 17; a connector Cn(t2) electrically connected to the thermistor T2 constituting the inhalation sensor (shown as the thermistor T2 connected to the connector in the figure); a connector Cn(t3) electrically connected to the thermistor T3 constituting the heater temperature sensor (shown as the thermistor T3 connected to the connector in the figure); a connector Cn(t4) electrically connected to the thermistor T4 constituting the housing temperature sensor (shown as the thermistor T4 connected to the connector in the figure); and a voltage divider circuit Pc for USB connection detection.

[0095] The grounding terminals GND of charging IC2, LSW3, LSW4, LSW5, switch driver 7, buck-boost DC / DC converter 8, FF16, and FF17 are connected to ground. The power supply terminal VSS of ROM6 is connected to ground. The negative power supply terminals of operational amplifiers OP2 and OP3 are connected to ground.

[0096] like Figure 11 As shown, on the LED mounting substrate 163 (range 163A), the following main electronic components are provided: Hall IC 13, which includes Hall elements constituting a panel detection sensor; LEDs L1 to L8; an operation switch OPS; and a communication IC 15. The communication IC 15 is a communication module used for communication with electronic devices such as smartphones. Each of the power supply terminal VSS of the Hall IC 13 and the ground terminal GND of the communication IC 15 is connected to ground. The communication IC 15 and the MCU 1 are configured to communicate via the communication line LN. One end of the operation switch OPS is connected to ground, and the other end of the operation switch OPS is connected to terminal P4 of the MCU 1.

[0097] like Figure 12As shown, on the socket mounting substrate 162 (range 162A), as main electronic components, there are: a power connector electrically connected to the power supply BAT (the power supply BAT connected to the power connector is shown in the figure), a connector electrically connected to the thermistor T1 that constitutes the power supply temperature sensor (the thermistor T1 connected to the connector is shown in the figure), a boost DC / DC converter 9 (bump DC / DC 9 is shown in the figure), a protection IC 10, an overvoltage protection IC 11, a margin meter IC 12, a socket RCP, switches S3 to S6 composed of MOSFETs, an operational amplifier OP1, and a pair of heater connectors Cn (positive side and negative side) electrically connected to the heater HTR.

[0098] The two grounding terminals GND of the RCP socket, the grounding terminal GND of the boost DC / DC converter 9, the power supply terminal VSS of the protection IC10, the power supply terminal VSS of the margin meter IC12, the grounding terminal GND of the overvoltage protection IC11, and the negative power supply terminal of the operational amplifier OP1 are all connected to the ground wire.

[0099] like Figure 12 As shown, a Hall IC 14, including a Hall element constituting a cover position sensor, is disposed on a Hall IC mounting substrate 164 (range 164A). The power supply terminal VSS of the Hall IC 14 is connected to ground. The output terminal OUT of the Hall IC 14 is connected to terminal P8 of the MCU1. The MCU1 detects the opening and closing of the slider 119 based on the signal input to terminal P8.

[0100] like Figure 11 As shown, the connector that is electrically connected to the vibration motor M is disposed on the MCU mounting substrate 161.

[0101] <Detailed information about the internal unit's circuitry>

[0102] The following is for reference Figure 10 The connection relationships of the various electronic components are explained.

[0103] The two power input terminals V of the RCP connector BUS The circuit is connected to the input terminal IN of the overvoltage protection IC11 via fuse Fs. If the USB plug is connected to the RCP connector and the USB cable including the USB plug is connected to an external power source, the power input to the two power input terminals V of the RCP connector is... BUS Supply USB voltage V USB .

[0104] One end of a voltage divider circuit Pa, consisting of two resistors in series, is connected to the input terminal IN of the overvoltage protection IC11. The other end of the voltage divider circuit Pa is connected to ground. The connection point of the two resistors constituting the voltage divider circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. When the voltage input to the voltage detection terminal OVLo is less than a threshold, the overvoltage protection IC11 outputs the voltage input to the input terminal IN from the output terminal OUT. When the voltage input to the voltage detection terminal OVLo becomes above the threshold (overvoltage), the overvoltage protection IC11 protects downstream electronic components by stopping the voltage output from the output terminal OUT (disconnecting the electrical connection between LSW3 and the RCP socket). The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of LSW3 and one end of the voltage divider circuit Pc (two resistors in series) connected to the MCU1. The other end of the voltage divider circuit Pc is connected to ground. The connection point of the two resistors constituting the voltage divider circuit Pc is connected to terminal P17 of the MCU1.

[0105] A voltage divider circuit Pf, consisting of two resistors connected in series, is connected to the input terminal VIN of LSW3. The other end of the voltage divider circuit Pf is connected to ground. The connection point of the two resistors forming the voltage divider circuit Pf is connected to the control terminal ON of LSW3. The collector terminal of bipolar transistor S2 is connected to the control terminal ON of LSW3. The emitter terminal of bipolar transistor S2 is connected to ground. The base terminal of bipolar transistor S2 is connected to terminal P19 of MCU1. If the signal input to the control terminal ON becomes high, LSW3 outputs the voltage input to the input terminal VIN from the output terminal VOUT. The output terminal VOUT of LSW3 is connected to the input terminal VBUS of charging IC2.

[0106] When the USB connection is not active, MCU1 turns on bipolar transistor S2. As a result, the control terminal ON of LSW3 is connected to ground via bipolar transistor S2, thus inputting a low-level signal to the control terminal ON of LSW3.

[0107] If a USB connection is established, the bipolar transistor S2 connected to LSW3 is disconnected via MCU1. With bipolar transistor S2 disconnected, the USB voltage V, divided by the voltage divider circuit Pf, is... USB The input is sent to the control terminal ON of LSW3. Therefore, if a USB connection is established and bipolar transistor S2 is off, a high-level signal is input to the control terminal ON of LSW3. Consequently, LSW3 outputs the USB voltage V supplied from the USB cable from the output terminal VOUT. USBFurthermore, even when a USB connection is made with bipolar transistor S2 still connected, the control terminal ON of LSW3 is connected to ground via bipolar transistor S2. Therefore, it is important to note that as long as MCU1 does not disconnect bipolar transistor S2, it will continue to input a low-level signal to the control terminal ON of LSW3.

[0108] The positive terminal of power supply BAT is connected to the power supply terminal VDD of protection IC10, the input terminal VIN of boost DC / DC converter 9, and the charging terminal bat of charging IC2. Therefore, the power supply voltage V of power supply BAT is... BAT The power supply is supplied to protection IC10, charging IC2, and boost DC / DC converter 9. A resistor Ra, a MOSFET switch Sa, a MOSFET switch Sb, and a resistor Rb are connected in series on the negative terminal of the power supply BAT. The current detection terminal CS of protection IC10 is connected to the junction of resistor Ra and switch Sa. The control terminals of switches Sa and Sb are connected to protection IC10. The two ends of resistor Rb are connected to margin meter IC12.

[0109] The protection IC10 obtains the current value flowing through resistor Ra during the charging and discharging of power supply BAT based on the voltage input to the current detection terminal CS (the voltage applied across resistor Ra). If this current value becomes excessive (overcurrent), the protection IC10 controls the opening and closing of switches Sa and Sb to stop the charging or discharging of power supply BAT, thereby protecting power supply BAT. More specifically, if an excessive current value is obtained during the charging of power supply BAT, the protection IC10 stops the charging of power supply BAT by opening switch Sb. If an excessive current value is obtained during the discharging of power supply BAT, the protection IC10 stops the discharging of power supply BAT by opening switch Sa. Furthermore, based on the voltage input to the power supply terminal VDD, if the voltage value of power supply BAT becomes abnormal (overcharging or overvoltage), the protection IC10 controls the opening and closing of switches Sa and Sb to stop the charging or discharging of power supply BAT, thereby protecting power supply BAT. More specifically, in the event of overcharging of power supply BAT, protection IC10 stops charging of power supply BAT by opening switch Sb. In the event of overdischarging of power supply BAT, protection IC10 stops discharging of power supply BAT by opening switch Sa.

[0110] A resistor Rt1 is connected to a connector that connects to a thermistor T1 located near the power supply BAT. The series circuit of resistor Rt1 and thermistor T1 is connected to ground and the regulator terminal TREG of the margin gauge IC12. The connection point of thermistor T1 and resistor Rt1 is connected to the thermistor terminal THM of the margin gauge IC12. Thermistor T1 can be either a PTC (Positive Temperature Coefficient) thermistor whose resistance increases with increasing temperature, or an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with increasing temperature.

[0111] The balance gauge IC12 detects the current flowing through resistor Rb and, based on the detected current value, derives battery information such as the remaining capacitance of the power supply BAT, the State of Charge (SOC) indicating the charging state, and the State of Health (SOH) indicating the healthy state. The balance gauge IC12 supplies voltage from the built-in regulator connected to the regulator terminal TREG to the voltage divider circuit of the thermistor T1 and resistor Rt1. The balance gauge IC12 obtains the voltage divided by this voltage divider circuit from the thermistor terminal THM and obtains temperature information related to the temperature of the power supply BAT based on this voltage. The balance gauge IC12 is connected to MCU1 via communication line LN for serial communication and is configured to communicate with MCU1. Upon request from MCU1, the balance gauge IC12 sends the derived battery information and the obtained temperature information of the power supply BAT to MCU1. MCU1 controls the discharge from the power supply BAT to the heater HTR based on the remaining capacitance of the power supply BAT obtained by the balance gauge IC12. That is, when the remaining capacitance of the power supply BAT is below a specified value, MCU1 prevents the heater HTR from discharging and displays a prompt to charge. Additionally, multiple signal lines are required for serial communication, including a data line for data transmission and a clock line for synchronization. It should be noted that... Figures 10-19 For simplicity, only one signal line is shown in the diagram.

[0112] The margin gauge IC12 has a notification terminal 12a. Notification terminal 12a is connected to terminal P6 of MCU1 and the cathode of diode D2 (described later). If an abnormality such as the power supply BAT becoming too high is detected, the margin gauge IC12 notifies MCU1 of the abnormality by outputting a low-level signal from notification terminal 12a. This low-level signal is also input to the CLR(￣) terminal of FF17 via diode D2.

[0113] One end of a reactor Lc is connected to the switching terminal SW of the boost DC / DC converter 9. The other end of the reactor Lc is connected to the input terminal VIN of the boost DC / DC converter 9. The boost DC / DC converter 9 boosts the input voltage and performs voltage conversion control from the output terminal VOUT by controlling the on / off state of the built-in transistor connected to the switching terminal SW. Additionally, the input terminal VIN of the boost DC / DC converter 9 is connected to the power supply BAT, forming the high-potential power supply terminal of the boost DC / DC converter 9. The boost DC / DC converter performs boost operation when the signal input to the enable terminal EN is high. In USB connected mode, the signal input to the enable terminal EN of the boost DC / DC converter 9 can also be controlled to a low level by the MCU1. Alternatively, in USB connected mode, the MCU1 can also disable the control of the signal input to the enable terminal EN of the boost DC / DC converter 9, making the potential of the enable terminal EN uncertain.

[0114] The source terminal of switch S4, composed of a P-channel MOSFET, is connected to the output terminal VOUT of boost DC / DC converter 9. The gate terminal of switch S4 is connected to terminal P15 of MCU1. One end of resistor Rs is connected to the drain terminal of switch S4. The other end of resistor Rs is connected to heater connector Cn, which is connected to the positive side of heater HTR. A voltage divider circuit Pb, consisting of two resistors, is connected at the junction of switch S4 and resistor Rs. The junction of the two resistors forming voltage divider circuit Pb is connected to terminal P18 of MCU1. The junction of switch S4 and resistor Rs is also connected to the positive power supply terminal of operational amplifier OP1.

[0115] The source terminal of switch S3, composed of a P-channel MOSFET, is connected to the connection line between the output terminal VOUT of boost DC / DC converter 9 and the source terminal of switch S4. The gate terminal of switch S3 is connected to terminal P16 of MCU1. The drain terminal of switch S3 is connected to the connection line between resistor Rs and the positive side of heater connector Cn. Thus, a circuit including switch S3 and a circuit including switch S4 and resistor Rs are connected in parallel between the output terminal VOUT of boost DC / DC converter 9 and the positive side of heater connector Cn. The circuit including switch S3 does not have a resistor, and therefore has a lower resistance than the circuit including switch S4 and resistor Rs.

[0116] The non-inverting input terminal of operational amplifier OP1 is connected to the resistor Rs and the heater connector Cn on the positive side. The inverting input terminal of operational amplifier OP1 is connected to the heater connector Cn on the negative side (connected to the other end of heater HTR) and the drain terminal of switch S6, which is composed of an N-channel MOSFET. The source terminal of switch S6 is connected to ground. The gate terminal of switch S6 is connected to terminal P14 of MCU1, the anode of diode D4, and the enable terminal EN of boost DC / DC converter 9. The cathode of diode D4 is connected to the Q terminal of FF17. One end of resistor R4 is connected to the output terminal of operational amplifier OP1. The other end of resistor R4 is connected to terminal P9 of MCU1 and the drain terminal of switch S5, which is composed of an N-channel MOSFET. The source terminal of switch S5 is connected to ground. The gate terminal of switch S5 is connected to the resistor Rs and the heater connector Cn on the positive side.

[0117] The input terminal VBUS of charging IC2 is connected to the anode of each of LEDs L1 to L8. The cathodes of each of LEDs L1 to L8 are connected to the control terminals PD1 to PD8 of MCU1 via resistors for current limiting. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS. LEDs L1 to L8 are configured to be able to withstand the USB voltage V supplied from the USB cable connected to the RCP connector. USB Each LED L1 operates in response to the voltage supplied from power supply BAT via charging IC2. MCU1 contains a transistor (switching element) connected to each of control terminals PD1-PD8 and ground terminal GND. MCU1 powers on LED L1 by turning on the transistor connected to control terminal PD1, and turns off LED L1 by turning off the transistor connected to control terminal PD1. By rapidly switching the transistor connected to control terminal PD1 on and off, the brightness and illumination mode of LED L1 can be dynamically controlled. LEDs L2-L8 are similarly controlled by MCU1.

[0118] Charging IC2 features a USB voltage V based on the input-to-input terminal VBUS. USB The charging function is for charging the power supply BAT. Charging IC2 obtains the charging current and charging voltage of the power supply BAT from terminals and wiring not shown in the diagram, and controls the charging of the power supply BAT based on these values ​​(power supply control from the charging terminal bat to the power supply BAT). Furthermore, charging IC2 can also obtain the temperature information of the power supply BAT sent to MCU1 from the margin meter IC12 via serial communication using communication line LN, and use this information for charging control.

[0119] The charging IC2 also features V BATPower path function and OTG function. V BAT The power path function is as follows: It outputs the power supply voltage V from the output terminal SYS to the charging terminal BAT. BAT The system power supply voltage is roughly the same as Vcc0. The OTG function is as follows: it outputs the power supply voltage V from the input terminal VBUS to the charging terminal bat. BAT The system power supply voltage Vcc4 is obtained by boosting the voltage. The OTG function of charging IC2 is enabled or disabled by MCU1 via serial communication using communication line LN. Additionally, in the OTG function, the power supply voltage V input to charging terminal bat can also be directly output from input terminal VBUS. BAT In this case, the power supply voltage V BAT It is roughly the same as the system power supply voltage Vcc4.

[0120] The output terminal SYS of charging IC2 is connected to the input terminal VIN of the buck-boost DC / DC converter 8. One end of the reactor La is connected to the switching terminal SW of charging IC2. The other end of the reactor La is connected to the output terminal SYS of charging IC2. The charge enable terminal CE(￣) of charging IC2 is connected to terminal P22 of MCU1 via a resistor. Furthermore, the collector terminal of bipolar transistor S1 is connected to the charge enable terminal CE(￣) of charging IC2. The emitter terminal of bipolar transistor S1 is connected to the output terminal VOUT of LSW4 (described later). The base terminal of bipolar transistor S1 is connected to the Q terminal of FF17. Furthermore, one end of the resistor Rc is connected to the charge enable terminal CE(￣) of charging IC2. The other end of the resistor Rc is connected to the output terminal VOUT of LSW4.

[0121] Resistors are connected to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The system power supply voltage Vcc0 is input to the input terminal VIN of the buck-boost DC / DC converter 8 from the output terminal SYS of the charging IC2. When the signal input to the enable terminal EN of the buck-boost DC / DC converter 8 becomes high, the buck-boost DC / DC converter 8 begins its boost or buck operation. The buck-boost DC / DC converter 8, controlled by the switching of the built-in transistor connected to the reactor Lb, boosts or bucks the system power supply voltage Vcc0 input to the input terminal VIN, generating a system power supply voltage Vcc1, which is then output from the output terminal VOUT. The output terminal VOUT of the buck-boost DC / DC converter 8 is connected to the feedback terminal FB of the buck-boost DC / DC converter 8, the input terminal VIN of LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of FF16, and the D terminal. The wiring supplying the system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is described as power line PL1.

[0122] If the signal input to the control terminal ON becomes high, LSW4 outputs the system power supply voltage Vcc1 from the output terminal VOUT to the input terminal VIN. The control terminal ON of LSW4 and the power line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power line PL1, a high-level signal is input to the control terminal ON of LSW4. If wiring resistance, etc., is ignored, the voltage output by LSW4 is the same as the system power supply voltage Vcc1, but to distinguish it from the system power supply voltage Vcc1, the voltage output from the output terminal VOUT of LSW4 will be recorded below as the system power supply voltage Vcc2.

[0123] The output terminal VOUT of LSW4 is connected to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of margin meter IC12, the power supply terminal VCC of ROM6, the emitter terminal of bipolar transistor S1, resistor Rc, and the power supply terminal VCC of FF17. The wiring for the system power supply voltage Vcc2 supplied from the output terminal VOUT of LSW4 is recorded as power line PL2.

[0124] If the signal input to the control terminal ON becomes high, LSW5 outputs the system power supply voltage Vcc2 from the output terminal VOUT to the input terminal VIN. The control terminal ON of LSW5 is connected to terminal P23 of MCU1. If wiring resistance is ignored, the voltage output by LSW5 is the same as the system power supply voltage Vcc2. However, to distinguish it from the system power supply voltage Vcc2, the voltage output from the output terminal VOUT of LSW5 will be referred to as the system power supply voltage Vcc3 below. The wiring supplying the system power supply voltage Vcc3 output from the output terminal VOUT of LSW5 will be referred to as power line PL3.

[0125] A series circuit of thermistor T2 and resistor Rt2 is connected to power line PL3, with resistor Rt2 connected to ground. Thermistor T2 and resistor Rt2 form a voltage divider circuit, and their connection point is connected to terminal P21 of MCU1. MCU1 detects the temperature change (resistance change) of thermistor T2 based on the voltage input to terminal P21, and determines whether there is a suction action based on the amount of this temperature change.

[0126] A series circuit of thermistor T3 and resistor Rt3 is connected to power line PL3, with resistor Rt3 connected to ground. Thermistor T3 and resistor Rt3 form a voltage divider circuit, and their connection point is connected to terminal P13 of MCU1 and the inverting input terminal of operational amplifier OP2. MCU1 detects the temperature of thermistor T3 (equivalent to the temperature of heater HTR) based on the voltage input to terminal P13.

[0127] A series circuit of thermistor T4 and resistor Rt4 is connected to power line PL3, with resistor Rt4 connected to ground. Thermistor T4 and resistor Rt4 form a voltage divider circuit, and their connection point is connected to terminal P12 of MCU1 and the inverting input terminal of operational amplifier OP3. MCU1 detects the temperature of thermistor T4 (equivalent to the temperature of housing 110) based on the voltage input to terminal P12.

[0128] The source terminal of a MOSFET switch S7 is connected to the power supply line PL2. The gate terminal of switch S7 is connected to terminal P20 of MCU1. The drain terminal of switch S7 is connected to one of a pair of connectors for the vibration motor M. The other connector is connected to ground. MCU1 controls the opening and closing of switch S7 by operating the potential of terminal P20, enabling the vibration motor M to vibrate in a specific mode. Alternatively, a dedicated driver IC can be used instead of switch S7.

[0129] A voltage divider circuit Pd (a series circuit of two resistors) is connected to the positive power supply terminal of operational amplifier OP2 and to the non-inverting input terminal of operational amplifier OP2. The connection point of the two resistors constituting the voltage divider circuit Pd is connected to the non-inverting input terminal of operational amplifier OP2. Operational amplifier OP2 outputs a signal corresponding to the temperature of heater HTR (a signal corresponding to the resistance value of thermistor T3). In this embodiment, a thermistor with NTC characteristics is used as the thermistor T3. Therefore, the higher the temperature of heater HTR (the temperature of thermistor T3), the lower the output voltage of operational amplifier OP2. This is because the negative power supply terminal of operational amplifier OP2 is connected to ground. If the voltage value input to the inverting input terminal of operational amplifier OP2 (based on the voltage division value of thermistor T3 and resistor Rt3) is higher than the voltage value input to the non-inverting input terminal of operational amplifier OP2 (based on the voltage division value of voltage divider circuit Pd), then the output voltage value of operational amplifier OP2 is approximately equal to the ground potential. That is, if the temperature of heater HTR (the temperature of thermistor T3) becomes high, the output voltage of operational amplifier OP2 becomes low.

[0130] Alternatively, when using a thermistor with PTC characteristics as thermistor T3, simply connect the output of the voltage divider circuit of thermistor T3 and resistor Rt3 to the non-inverting input terminal of operational amplifier OP2, and connect the output of the voltage divider circuit Pd to the inverting input terminal of operational amplifier OP2.

[0131] A voltage divider circuit Pe (two resistors in series) is connected to the positive power supply terminal of operational amplifier OP3 and to the non-inverting input terminal of operational amplifier OP3. The connection point of the two resistors constituting the voltage divider circuit Pe is connected to the non-inverting input terminal of operational amplifier OP3. Operational amplifier OP3 outputs a signal corresponding to the temperature of housing 110 (a signal corresponding to the resistance value of thermistor T4). In this embodiment, thermistor T4 is a thermistor with NTC characteristics, so the higher the temperature of housing 110, the lower the output voltage of operational amplifier OP3. This is because the negative power supply terminal of operational amplifier OP3 is connected to ground. If the voltage value input to the inverting input terminal of operational amplifier OP3 (based on the voltage division value of thermistor T4 and resistor Rt4) is higher than the voltage value input to the non-inverting input terminal of operational amplifier OP3 (based on the voltage division value of voltage divider circuit Pe), then the output voltage value of operational amplifier OP3 is approximately equal to the ground potential. That is, if the temperature of thermistor T4 becomes high, the output voltage of operational amplifier OP3 becomes low.

[0132] Alternatively, when using a thermistor with PTC characteristics as thermistor T4, simply connect the output of the voltage divider circuit of thermistor T4 and resistor Rt4 to the non-inverting input terminal of operational amplifier OP3, and connect the output of the voltage divider circuit Pe to the inverting input terminal of operational amplifier OP3.

[0133] A resistor R1 is connected to the output terminal of operational amplifier OP2. The cathode of diode D1 is connected to resistor R1. The anode of diode D1 is connected to the output terminal of operational amplifier OP3, the D terminal of FF17, and the CLR(￣) terminal of FF17. A resistor R2, which is connected to power supply line PL1, is connected to the connection line between resistor R1 and diode D1. Additionally, the CLR(￣) terminal of FF16 is connected to this connection line.

[0134] One end of resistor R3 is connected to the connection point between the anode of diode D1, the output terminal of operational amplifier OP3, and the D terminal of FF17. The other end of resistor R3 is connected to the power supply line PL2. Furthermore, the anodes of diodes D2 and D3, and the CLR(￣) terminal of FF17, which are connected to the notification terminal 12a of margin meter IC12, are connected to this connection line. The cathode of diode D3 is connected to terminal P5 of MCU1.

[0135] If the temperature of the heater HTR becomes too high, the signal output from operational amplifier OP2 of FF16 decreases. If the signal input to the CLR(￣) terminal becomes low, a high-level signal is input from the Q(￣) terminal to terminal P11 of MCU1. Power line PL1 supplies a high-level system power supply voltage Vcc1 to the D terminal of FF16. Therefore, in FF16, as long as the signal input to the CLR(￣) terminal, which operates with negative logic, does not become low, a low-level signal is continuously output from the Q(￣) terminal.

[0136] In any of the following situations—the temperature of the heater HTR becoming too high, the temperature of the housing 110 becoming too high, or a low-level signal indicating abnormality detection being output from the notification terminal 12a of the margin gauge IC12—the signal input to the CLR(￣) terminal of FF17 becomes low. If the signal input to the CLR(￣) terminal becomes low, FF17 outputs a low-level signal from the Q terminal. This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of boost DC / DC converter 9, and the base terminal of bipolar transistor S1 connected to charging IC2. If a low-level signal is input to the gate terminal of switch S6, the gate-source voltage of the N-channel MOSFET constituting switch S6 is lower than the threshold voltage, therefore switch S6 is turned off. If a low-level signal is input to the enable terminal EN of boost DC / DC converter 9, the enable terminal EN of boost DC / DC converter 9 is positive logic, therefore boost operation stops. If a low-level signal is input to the base terminal of bipolar transistor S1, bipolar transistor S1 is turned on (amplified current is output from the collector terminal). If bipolar transistor S1 is turned on, the high-level system power supply voltage Vcc2 is input to the CE(￣) terminal of charging IC2 via bipolar transistor S1. The CE(￣) terminal of charging IC2 is in negative logic, thus stopping the charging of power supply BAT. This stops the heating of heater HTR and the charging of power supply BAT. Furthermore, even if MCU1 outputs a low-level enable signal from terminal P22 to the charging enable terminal CE(￣) of charging IC2, if bipolar transistor S1 is turned on, the amplified current is also input from the collector terminal to terminal P22 of MCU1 and the charging enable terminal CE(￣) of charging IC2. Therefore, it is important to note that a high-level signal is input to the charging enable terminal CE(￣) of charging IC2.

[0137] A high-level system power supply voltage Vcc2 is supplied to the D terminal of FF17 from power line PL2. Therefore, in FF17, as long as the signal input to the CLR(￣) terminal, which operates with negative logic, is not low, a high-level signal is continuously output from the Q terminal. If a low-level signal is output from the output terminal of operational amplifier OP3, the low-level signal is input to the CLR(￣) terminal of FF17, regardless of the level of the signal output from the output terminal of operational amplifier OP2. It should be noted that when a high-level signal is output from the output terminal of operational amplifier OP2, the low-level signal output from the output terminal of operational amplifier OP3 is not affected by the high-level signal due to diode D1. Furthermore, when a low-level signal is output from the output terminal of operational amplifier OP2, even if a high-level signal is output from the output terminal of operational amplifier OP3, the high-level signal is replaced by a low-level signal via diode D1.

[0138] The power line PL2 branches further from the MCU mounting substrate 161 to the LED mounting substrate 163 and the Hall IC mounting substrate 164. The power supply terminal VDD of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the Hall IC 14 are connected to this branched power line PL2.

[0139] The output terminal OUT of Hall IC13 is connected to terminal P3 of MCU1 and terminal SW2 of switch driver 7. If the external panel 115 is removed, a low-level signal is output from the output terminal OUT of Hall IC13. MCU1 determines whether the external panel 115 is installed based on the signal input to terminal P3.

[0140] A series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting substrate 163. This series circuit is connected to the power supply line PL2. The connection point of the resistor and capacitor in this series circuit is connected to terminal P4 of MCU1, the operation switch OPS, and terminal SW1 of switch driver 7. When the operation switch OPS is not pressed, it is not conducting, and the signals input to terminal P4 of MCU1 and terminal SW1 of switch driver 7 become high level due to the system power supply voltage Vcc2. If the operation switch OPS is pressed and becomes conducting, the signals input to terminal P4 of MCU1 and terminal SW1 of switch driver 7 become low level due to connection to ground. MCU1 detects the operation of the operation switch OPS based on the signal input to terminal P4.

[0141] The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of LSW4. When the voltage levels of the signals input to terminals SW1 and SW2 both become low (when the external panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 stops the output operation of LSW4 by outputting a low-level signal from the reset input terminal RSTB. That is, if the operation switch OPS, which was originally pressed via the pressing part 117 of the external panel 115, is pressed directly by the user while the external panel 115 is removed, the voltage levels of the signals input to terminals SW1 and SW2 of the switch driver 7 both become low.

[0142] <Actions of each action mode of the inhaler>

[0143] The following is for reference Figures 13-19 right Figure 10 The operation of the circuit shown will be explained. Figure 13 This is a diagram used to illustrate the operation of the circuit in sleep mode. Figure 14 This is a diagram used to illustrate the operation of the circuit in the active mode. Figure 15 This is a diagram used to illustrate the operation of the circuit in the initial heating setting mode. Figure 16 This is a diagram illustrating the operation of the circuit when the heater HTR is heating in heating mode. Figure 17 This is a diagram illustrating the operation of the circuit during temperature detection of the heater HTR in heating mode. Figure 18 This is a diagram used to illustrate the operation of the circuit in charging mode. Figure 19 This diagram illustrates the circuitry during the reset (restart) of MCU1. Figures 13-19 In each of these, the terminal surrounded by a dashed ellipse in the terminals of the chip-based electronic component represents the terminal receiving the power supply voltage V. BAT USB voltage V USB And input or output terminals for system power supply voltage, etc.

[0144] In any operating mode, the power supply voltage V BAT All inputs are fed to the power supply terminal VDD of protection IC10, the input terminal VIN of boost DC / DC converter 9, and the charging terminal bat of charging IC2.

[0145] <Hibernation Mode: Figure 13 >

[0146] MCU1 enables the V of charging IC2 BAT Power path function is enabled, disabling OTG and charging functions. This is achieved by preventing the input of USB voltage V to the input terminal VBUS of charging IC2. USB V of charging IC2 BATThe power path function is active. The signal used to enable the OTG function from communication line LN is not output from MCU1 to charging IC2, therefore the OTG function is inactive. Consequently, charging IC2 operates based on the power supply voltage V input to the charging terminal bat. BAT The system power supply voltage Vcc0 is generated and output from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The buck-boost DC / DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to the enable terminal EN (which is positive logic), and generates a system power supply voltage Vcc1 based on the system power supply voltage Vcc0, which is output from the output terminal VOUT. The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is supplied to the input terminal VIN of LSW4, the control terminal ON of LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of FF16, and the D terminal, respectively.

[0147] LSW4 inputs the system power supply voltage Vcc1 to the control terminal ON, and outputs the system power supply voltage Vcc2 from the output terminal VOUT as the system power supply voltage Vcc2 from the input terminal VIN. The system power supply voltage Vcc2 output from LSW4 is input to the power supply terminal VDD of MCU1, the input terminal VIN of LSW5, the power supply terminal VDD of Hall IC13, the power supply terminal VCC of communication IC15, and the power supply terminal VDD of Hall IC14. Furthermore, the system power supply voltage Vcc2 is supplied to the power supply terminal VDD of margin meter IC12, the power supply terminal VCC of ROM6, the resistor Rc connected to the charging enable terminal CE(￣) of charging IC2, and the power supply terminals VCC of bipolar transistor S1 and FF17, the positive power supply terminal of operational amplifier OP3, the voltage divider circuit Pe, the positive power supply terminal of operational amplifier OP2, and the voltage divider circuit Pd. As long as a low-level signal is not output from the Q terminal of FF17, the bipolar transistor S1 connected to charging IC2 is disconnected. Therefore, the system power supply voltage Vcc2 generated by LSW4 is also input to the charging enable terminal CE(￣) of charging IC2. The charging enable terminal CE(￣) of charging IC2 is negative logic, so in this state, the charging function based on charging IC2 is turned off.

[0148] Thus, in sleep mode, LSW5 stops outputting the system power supply voltage Vcc3, thereby stopping the power supply to the electronic components connected to the power line PL3. Furthermore, in sleep mode, the OTG function of charging IC2 stops, thus stopping the power supply to LEDs L1 to L8.

[0149] Activation Mode: Figure 14 >

[0150] If from Figure 13 When the device is in sleep mode, the signal input to terminal P8 becomes high and slider 119 is detected to be open. MCU1 then inputs a high-level signal from terminal P23 to the control terminal ON of LSW5. Consequently, LSW5 outputs the system power supply voltage Vcc2 input to input terminal VIN as system power supply voltage Vcc3 from output terminal VOUT. The system power supply voltage Vcc3 output from LSW5's output terminal VOUT is supplied to thermistors T2, T3, and T4.

[0151] Furthermore, if slider 119 is detected to be open, MCU1 enables the OTG function of charging IC2 via communication line LN. Consequently, charging IC2 outputs the power supply voltage V input from charging terminal bat from input terminal VBUS. BAT The system power supply voltage Vcc4 is obtained by boosting the voltage. The system power supply voltage Vcc4 output from the input terminal VBUS is supplied to LEDs L1 to L8.

[0152] <Initial heating setting mode:> Figure 15 >

[0153] If from Figure 14 When the signal input to terminal P4 becomes low (OPS is pressed), MCU1, after performing various settings required for heating, inputs a high-level enable signal from terminal P14 to the enable terminal EN of the boost DC / DC converter 9. Consequently, the boost DC / DC converter 9 outputs a power supply voltage V from the output terminal VOUT. BAT The driving voltage V obtained by boosting bst Drive voltage V bst Supply is provided to switches S3 and S4. In this state, switches S3 and S4 are open. Furthermore, switch S6 is turned on by a high-level enable signal output from terminal P14. Thus, if the negative terminal of heater HTR is connected to ground and switch S3 is turned on, heater HTR becomes capable of heating. After the enable signal, which outputs a high-level signal from terminal P14 of MCU1, the system transitions to heating mode.

[0154] <Heater heating in heating mode:> Figure 16 >

[0155] exist Figure 15In this state, MCU1 initiates switching control of switch S3 connected to terminal P16 and switch S4 connected to terminal P15. These switching controls can either start automatically upon completion of the initial heating setting mode or be initiated by pressing switch OPS. Specifically, MCU1 performs heating control and temperature detection control, such as... Figure 16 That would turn on switch S3 and turn off switch S4, thus driving voltage V. bst The gas is supplied to the heater HTR for heating the heater HTR used for aerosol generation, and the temperature is detected and controlled as follows: Figure 17 That would open switch S3 and close switch S4, allowing the temperature of heater HTR to be detected.

[0156] like Figure 16 As shown, during heating control, the driving voltage V bst It is also supplied to the gate of switch S5, and switch S5 is turned on. Furthermore, during heating control, the drive voltage V of switch S3 is applied. bst The voltage is also input to the positive power supply terminal of operational amplifier OP1 via resistor Rs. The resistance of resistor Rs is negligible compared to the internal resistance of operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of operational amplifier OP1 is equal to the drive voltage V. bst Roughly the same.

[0157] Furthermore, the resistance of resistor R4 is greater than the closing resistance of switch S5. Even though operational amplifier OP1 operates during heating control, switch S5 is closed during heating control. With switch S5 closed, the output voltage of operational amplifier OP1 is divided by the voltage divider circuit formed by resistor R4 and switch S5, and then input to terminal P9 of MCU1. Because the resistance of resistor R4 is greater than the closing resistance of switch S5, the voltage input to terminal P9 of MCU1 becomes sufficiently small. This prevents large voltage inputs from operational amplifier OP1 to MCU1.

[0158] <Heater temperature detection in heating mode:> Figure 17 >

[0159] like Figure 17 As shown, during temperature detection and control, the driving voltage V bst The voltage is input to the positive power supply terminal of operational amplifier OP1 and then to voltage divider circuit Pb. The voltage divided by voltage divider circuit Pb is input to terminal P18 of MCU1. Based on the voltage input to terminal P18, MCU1 obtains the reference voltage V applied to the series circuit of resistor Rs and heater HTR for temperature detection control. temp .

[0160] Furthermore, during temperature detection and control, the drive voltage V bst (reference voltage V) temp The voltage V is supplied to the series circuit of resistor Rs and heater HTR. Then, the drive voltage V is applied through resistor Rs and heater HTR. bst (reference voltage V) temp The voltage V after voltage division heat The input is given to the non-inverting input terminal of operational amplifier OP1. The resistance of resistor Rs is sufficiently large compared to the resistance of heater HTR, therefore the voltage V... heat It is related to the driving voltage V bst Compared to a sufficiently low value, this low voltage V is suitable for temperature sensing and control. heat It is also supplied to the gate terminal of switch S5, thereby opening switch S5. Operational amplifier OP1 combines the voltage input to the inverting input terminal with the voltage input to the non-inverting input terminal V. heat The difference is amplified and output.

[0161] The output signal of operational amplifier OP1 is input to terminal P9 of MCU1. MCU1 obtains a reference voltage V based on the signal input to terminal P9 and the input voltage at terminal P18. temp Given the known resistance value of resistor Rs, the temperature of heater HTR is obtained. Based on the obtained temperature of heater HTR, MCU1 performs heating control of heater HTR. Heating control of heater HTR includes controlling the discharge from power supply BAT to heater HTR and controlling the temperature of heater HTR to reach the target temperature.

[0162] Furthermore, even when switches S3 and S4 are open (during which no power is supplied to the heater HTR), MCU1 can still obtain the temperature of the heater HTR. Specifically, MCU1 obtains the temperature of the heater HTR based on the voltage input to terminal P13 (the output voltage of the voltage divider circuit consisting of thermistor T3 and resistor Rt3).

[0163] Furthermore, MCU1 can obtain the temperature of housing 110 at any timing. Specifically, MCU1 obtains the temperature of housing 110 based on the voltage input to terminal P12 (the output voltage of the voltage divider circuit composed of thermistor T4 and resistor Rt4).

[0164] <Charging Mode: Figure 18 >

[0165] Figure 18 This example illustrates a USB connection being made while the device is in sleep mode. If a USB connection is made, the USB voltage V... USBThe voltage is input to the LSW3's input terminal VIN via the overvoltage protection IC11. USB voltage V USB It is also supplied to the voltage divider circuit Pf, which is connected to the input terminal VIN of LSW3. Immediately after the USB connection is established, bipolar transistor S2 turns on, thus the signal input to the control terminal ON of LSW3 becomes low. USB voltage V USB The voltage is also supplied to the voltage divider circuit Pc connected to terminal P17 of MCU1, and the voltage divided by the voltage divider circuit Pc is input to terminal P17. Based on the voltage input to terminal P17, MCU1 detects that a USB connection has been established.

[0166] If a USB connection is detected, MCU1 disconnects bipolar transistor S2 connected to terminal P19. If a low-level signal is input to the gate terminal of bipolar transistor S2, the USB voltage V, divided by the voltage divider circuit Pf, is... USB The input is sent to the control terminal ON of LSW3. Therefore, a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage V from the output terminal VOUT. USB The USB voltage V output from LSW3 USB The input is fed to the VBUS terminal of the charging IC2. Additionally, the USB voltage V output from LSW3... USB It is directly supplied to LEDs L1 to L8 as the system power supply voltage Vcc4.

[0167] If a USB connection is detected, MCU1 further outputs a low-level enable signal from terminal P22 to the charging enable terminal CE(￣) of charging IC2. This enables charging IC2 to activate the charging function of power supply BAT, starting based on the USB voltage V input to input terminal VBUS. USB The power supply BAT is being charged. At this time, MCU1 does not heat the heater HTR used for aerosol generation while switches S3 and S4 remain open. In other words, if a USB connection is detected based on the voltage input to terminal P17, MCU1 disables power supply from the power supply BAT to the heater connector Cn. Therefore, the socket RCP and overvoltage protection IC11, which are electronic components that function only during charging, are electronic components that function when voltage conversion control accompanying heating control is not being performed.

[0168] Furthermore, when a USB connection is made in the active mode, if a USB connection is detected, MCU1 disconnects the bipolar transistor S2 connected to terminal P19. Then, it outputs a low-level enable signal from terminal P22 to the charging enable terminal CE(￣) of charging IC2. Subsequently, through serial communication using communication line LN, the OTG function of charging IC2 is disabled. As a result, the system power supply voltage Vcc4 supplied to LEDs L1 to L8 is the voltage generated by the OTG function of charging IC2 (based on the power supply voltage V). BAT The voltage is switched to the USB voltage V output from LSW3. USB LEDs L1 to L8 will not activate unless the built-in transistors are switched on by MCU1. Therefore, unstable voltage during the OTG function's on-to-off transition period is prevented from being supplied to LEDs L1 to L8.

[0169] MCU Reset: Figure 19 >

[0170] If the external panel 115 is removed and the output of Hall IC 13 goes low, the signal input to terminal P4 of MCU1 goes low due to the activation of the operation switch OPS. Consequently, terminals SW1 and SW2 of switch driver 7 both go low. Switch driver 7 then outputs a low-level signal from the reset input terminal RSTB. This low-level signal from the reset input terminal RSTB is input to the control terminal ON of LSW4. This stops the output of the system power supply voltage Vcc2 from the output terminal VOUT. By stopping the output of the system power supply voltage Vcc2, the system power supply voltage Vcc2 is not input to the power supply terminal VDD of MCU1, thus MCU1 stops.

[0171] If the signal output from the reset input terminal RSTB is low for a predetermined time, or if the signal input to either terminal SW1 or terminal SW2 becomes high, then the switch driver 7 returns the signal output from the reset input terminal RSTB to a high level. Consequently, the control terminal ON of LSW4 becomes high, restoring the system power supply voltage Vcc2 to the state where all components are supplied.

[0172] Peripheral circuits of boost DC / DC converters

[0173] Figure 20 It shows more specifically Figure 10 The circuit diagram shown is a partial circuit diagram of the peripheral circuitry of the boost DC / DC converter 9 in the circuit shown.

[0174] exist Figure 20 As in Figure 10Electronic components and nodes omitted from the illustrations or diagrams are shown, including capacitors C1-C12, resistors R11-R14, and nodes N1 and N2.

[0175] In addition, Figure 20 The terminals of the boost DC / DC converter 9 are shown, including the first control terminal P31, the second control terminal P32, the third control terminal P33, the feedback terminal FB, and multiple switch terminals SW connected to one end of the reactor Lc and the output terminal VOUT connected to the heater connector Cn.

[0176] Furthermore, in Figure 20 In the diagram, the power ground terminal PGP, which is connected to the power ground PGND (described later), and the signal ground terminal AGP, which is connected to the signal ground AGND (described later), are shown as ground terminals GND. Figure 10 The grounding terminal GND and ground wire shown are the power grounding terminal PGP and power grounding PGND. In addition to the power grounding PGND, the socket mounting substrate 162 also has a signal grounding AGND.

[0177] Node N1 connects the input terminal VIN and one end of the reactor Lc. Node N1 is connected to the power connector connected to the power supply BAT (shown in the figure as the power supply BAT connected to this connector). One end of capacitors C1 and C2 is connected in parallel between node N1 and the input terminal VIN, and the other end of capacitors C1 and C2 is connected to signal ground AGND. Capacitors C1 and C2, with one end connected to the input terminal VIN, are bypass capacitors (so-called bypass capacitors) that do not input fluctuating current, fluctuating voltage, etc. to the input terminal VIN. Hereinafter, capacitors C1 and C2 are also referred to as bypass capacitors C1 and C2, and sometimes capacitor C1 is referred to as the first bypass capacitor C1, and capacitor C2 is referred to as the second bypass capacitor C2.

[0178] One end of capacitors C3 to C5 is connected in parallel between node N1 and one end of reactor Lc, and the other end of capacitors C3 to C5 is connected to the power supply ground PGND. Capacitors C3 to C5, with one end connected to reactor Lc, are reactor capacitors that do not input fluctuating current or voltage to reactor Lc. Hereinafter, capacitors C3 to C5 are sometimes referred to as reactor capacitors.

[0179] Node N2 connects the source terminals of switch S3 and switch S4. Node N2 is connected to the output terminal VOUT of the boost DC / DC converter 9. One end of capacitors C8 to C12 is connected in parallel between the output terminal VOUT and node N2, and the other end of capacitors C8 to C12 is connected to power ground PGND. Capacitors C8 to C12, with one end connected to the output terminal VOUT, are output capacitors that remove fluctuations in the current and voltage output from the output terminal VOUT. Hereinafter, capacitors C8 to C12 are sometimes referred to as output capacitors.

[0180] A voltage divider circuit Pg, consisting of two resistors R12 and R13 connected in series, is connected between the output terminal VOUT and the output capacitors C8 to C12. The other end of the voltage divider circuit Pg is connected to signal ground AGND. The connection point of the two resistors R12 and R13 constituting the voltage divider circuit Pg is connected to the feedback terminal FB. The boost DC / DC converter 9 performs voltage conversion control based on the voltage input to the feedback terminal FB, converting the voltage input to the input terminal VIN and outputting it from the output terminal VOUT. That is, the boost DC / DC converter 9 is controlled based on the voltage input to the feedback terminal FB to make the power supply voltage V... BAT Boost, drive voltage V bst It becomes the target voltage.

[0181] One end of capacitor C6 is connected to the first control terminal P31, and the other end of capacitor C6 is connected to signal ground AGND. The first control terminal P31 is, for example, a soft-start control terminal, which performs a soft start on the boost DC / DC converter 9 based on the capacitance of capacitor C6.

[0182] One end of a resistor R11 is connected to the second control terminal P32, and the other end of resistor R11 is connected to signal ground AGND. The second control terminal P32 is, for example, an output current limit programming terminal, which programs the output current limit value according to the resistance value of resistor R11.

[0183] One end of a series circuit of resistor R14 and capacitor C7 is connected to the third control terminal P33, and the other end of the series circuit of resistor R14 and capacitor C7 is connected to signal ground AGND. The third control terminal P33 is, for example, a phase protection connection terminal, and the series circuit of resistor R14 and capacitor C7 is a component used for phase compensation.

[0184] <Heat diffusion components>

[0185] like Figure 21As shown, a heat diffusion member 300 is provided on the secondary surface 162b of the socket mounting substrate 162, between it and the base plate 150. The secondary surface 162b of the socket mounting substrate 162, on which the heat diffusion member 300 is disposed, is opposite to the front and rear dividing walls 152 of the base plate 150, so the heat diffusion member 300 is located between the boost DC / DC converter 9 and the base plate 150.

[0186] The heat diffusion member 300 is made of a material with a higher thermal diffusivity than air, such as metal, ceramic, graphite, clay, etc. A heat sink may also be used in the heat diffusion member 300. A portion of the heat sink used in the heat diffusion member 300 may also be gel-like. The heat diffusion member 300 wholly or partially covers multiple electronic components disposed on the subsurface 162b of the socket mounting substrate 162, dispersing and diffusing heat into the air. Therefore, the temperature of the electronic components covered by the heat diffusion member 300 is less likely to rise. Furthermore, the electronic components covered by the heat diffusion member 300 are less susceptible to heat from the power supply BAT due to the base plate 150, resulting in stable operation. On the other hand, the heat diffused by the heat diffusion member 300 is suppressed from being transferred to other components by the base plate 150, thus improving the durability of the inhaler 100.

[0187] The shape of the heat diffusion member 300 is not particularly limited, but from a cost point of view, it is preferable to have a simple shape such as a square, rectangle, circle, or ellipse. Two or more heat diffusion members 300 may also be provided. In this embodiment, one heat diffusion member 300 with a generally rectangular shape is provided. The electronic components covered by the heat diffusion member 300, along with the components and ICs mounted on the MCU mounting substrate 161 and the socket mounting substrate 162, will be described later.

[0188] like Figure 21 As shown, by providing a heat diffusion member 300 on the secondary surface 162b of the socket mounting substrate 162, the MCU mounting substrate 161, the socket mounting substrate 162, the heat diffusion member 300, the base plate 150, and the power supply BAT are arranged in the front-to-back direction in this order within the internal space of the housing 110. Therefore, localized heat in the socket mounting substrate 162 is dissipated by the heat diffusion member 300, and the dissipated heat is not transferred to the power supply BAT due to the insulating base plate 150. Furthermore, the heat generated in the power supply BAT is also not transferred to the socket mounting substrate 162 due to the insulating base plate 150. Therefore, the temperature of the power supply BAT and the socket mounting substrate 162 does not easily become high, and the operation of the inhaler 100 is stable.

[0189] The heat diffusion member 300 is disposed on the sub-surface 162b of the socket mounting substrate 162 by means of adhesive, bonding, fusion or other methods. Preferably, a predetermined gap is formed between the heat diffusion member 300 and the base plate 150.

[0190] <Detailed Description of the Substrate>

[0191] Next, the configuration of the ICs and components configured on the MCU mounting substrate 161 and the socket mounting substrate 162 will be described.

[0192] [Socket mounting baseboard]

[0193] Figure 22 This is a diagram showing the main surface 162a of the socket mounting substrate 162. On the main surface 162a of the socket mounting substrate 162, which extends in the vertical direction, a heater connector Cn is disposed near the upper end, and a socket RCP is disposed at the lower end. Between the heater connector Cn and the socket RCP, a reactor Lc of the boost DC / DC converter 9 and capacitors C3 to C5 for the reactor are disposed.

[0194] Furthermore, near the RCP socket, a positive-side battery connector 222 (hereinafter referred to as positive-side battery connector 222) is arranged on the right side, and an opening 176 for a fixing spacer 173 is arranged on the left side. Furthermore, a negative-side battery connector 224 (hereinafter referred to as negative-side battery connector 224) and a power supply temperature detection connector Cn(t1) connected to a thermistor T1 constituting a power supply temperature sensor are arranged on the left side of the reactor Lc. A positive-side power bus 236 extending from the positive terminal of the power supply BAT (see reference 222) is connected to the positive-side battery connector 222. Figure 7 , Figure 8 A negative-side power bus 238 extending from the negative terminal of the power supply BAT is connected to the negative-side battery connector 224 (see reference). Figure 7 , Figure 8 ).

[0195] Figure 23 This diagram shows the sub-surface 162b of the socket mounting substrate 162. On the sub-surface 162b of the socket mounting substrate 162, a generally rectangular IC mounting area 191 is provided approximately at the center in the vertical direction, housing major ICs such as ICs. A boost DC / DC converter 9, a margin IC 12, an operational amplifier OP1, and a protection IC 10 are disposed in this IC mounting area 191. Furthermore, resistors R11, R12, and R13, and capacitors C1, C2, and C6, serving as control elements, are disposed in the IC mounting area 191. Since these control elements are disposed on the same surface as the boost DC / DC converter 9, the wiring pattern can be simplified. Additionally, the area outside the IC mounting area 191 in the sub-surface 162b is referred to as the remaining area 192.

[0196] As described above, at least a portion of the IC mounting region 191 is covered by a heat-diffusing member 300 having a higher thermal diffusivity than air. Figure 23 In the image, the area covered by the heat diffusion component 300 is shown by a thick dashed line.

[0197] The heat diffusion member 300 covers only the IC mounting area 191 on the secondary surface 162b and the IC mounting area 191 in the remaining area 192, and thus only covers a portion of the IC mounting area 191. Therefore, even without making the size and weight of the heat diffusion member 300 excessive, heat concentration can be effectively eliminated, the increase in cost and weight of the inhaler 100 can be suppressed, and its operation can be made stable.

[0198] More specifically, the heat dissipation component 300 covers at least a portion of the boost DC / DC converter 9, the margin meter IC12, the protection IC10, the resistor R11, the capacitors C2 and C6, and the operational amplifier OP1. Figure 20 In the image, the electronic components covered by the heat-diffusing member 300 are shown within the thick dashed lines. The electronic components are concepts encompassing ICs (integrated circuits), components (active and passive components), and connectors.

[0199] By at least partially covering the operational amplifier OP1, margin meter IC12, and protection IC10 with the heat diffusion component 300, these electronic components are not easily affected by heat, thus ensuring stable operation of the inhaler 100.

[0200] By covering at least a portion of the boost DC / DC converter 9 with the heat diffusion member 300, the temperature of the boost DC / DC converter 9 is less likely to rise due to the heat diffusion member 300, thus stabilizing the operation of the boost DC / DC converter 9. This allows for stability in the amount of aerosol generated and the flavor of the smoke. Preferably, the heat diffusion member 300 covers the entire boost DC / DC converter 9. The large area of ​​the heat diffusion member 300 not only allows for more efficient dissipation of heat generated by the boost DC / DC converter 9, but also suppresses localized heating of the base plate 150, thereby improving the durability of the inhaler 100.

[0201] On the other hand, the heat diffusion component 300 does not cover resistors R12 and R13 connected to the detection terminal. As described above, resistors R12 and R13 are used to detect the voltage at the feedback terminal FB. The boost DC / DC converter 9 performs voltage conversion control output from the output terminal VOUT based on the voltage input to the feedback terminal FB. Resistors R12 and R13 are fixed resistors whose resistance values ​​hardly change with temperature, but their resistance values ​​may change slightly if the temperature becomes high. Because the heat diffusion component 300 does not cover resistors R12 and R13, resistors R12 and R13 are less affected by heat, and the output voltage detected by resistors R12 and R13 is stable.

[0202] Furthermore, the heat diffusion member 300 at least partially covers half of the multiple control elements connected to multiple control terminals that are different from the feedback terminal FB of the boost DC / DC converter 9. In this embodiment, as... Figure 20 As shown, the boost DC / DC converter 9 has first to third control terminals P31, P32, and P33 as main control terminals. As control elements connected to these control terminals, capacitor C6, resistor R11, resistor R14, and capacitor C7 are provided. The heat diffusion member 300 at least partially covers resistor R11 and capacitor C6 of these four control elements. Thus, by covering half of the control elements, the area of ​​the heat diffusion member 300 can be effectively utilized, improving the heat diffusion effect. Alternatively, the heat diffusion member 300 can also partially cover at least a portion of resistor R14 and capacitor C7. Thus, since more than half of the control elements are covered, the area of ​​the heat diffusion member 300 can be further effectively utilized, further improving the heat diffusion effect.

[0203] Furthermore, the heat diffusion member 300 does not cover the reactor Lc of the boost DC / DC converter 9. As described above, the reactor Lc of the boost DC / DC converter 9 is disposed on the main surface 162a of the socket mounting substrate 162. The size of the reactor Lc connected to the boost DC / DC converter 9 increases depending on the output current of the boost DC / DC converter 9. In the inhaler 100, the heater HTR is the component that consumes the most current and power, so the reactor Lc is likely to be larger than the boost DC / DC converter 9 itself. In addition, compared with the boost DC / DC converter 9 which has a built-in switch that is switched on during boost, the reactor Lc generates less heat. Therefore, since the heat diffusion member 300 does not cover the reactor Lc, it is possible to avoid the heat diffusion member 300 becoming too large or having a complex shape. In this way, by using a heat diffusion member 300 with a simple shape to protect the appropriate electronic components, the operation of the inhaler 100 can be made stable. Furthermore, compared to the case where the boost DC / DC converter 9 and the reactor Lc occupy a large area on the substrate and are arranged on the same side of the circuit board, the size of the substrate can be reduced, thus reducing the cost and size of the inhaler 100.

[0204] Furthermore, the heat diffusion member 300 does not cover the reactor capacitors C3 to C5. Similarly, like the reactor Lc, the reactor capacitors C3 to C5 are also disposed on the main surface 162a of the socket mounting substrate 162. By not covering the reactor capacitors C3 to C5, which generate less heat, the size or shape of the heat diffusion member 300 can be prevented from becoming too large or complex. A heat diffusion member 300 with a simple shape can be used to protect appropriate electronic components, thus ensuring stable operation of the inhaler 100. Moreover, compared to the case where the boost DC / DC converter 9 and the reactor capacitors C3 to C5, which occupy a large area on the substrate, are disposed on the same surface, the size of the substrate can be reduced, thereby reducing the cost and size of the inhaler 100.

[0205] Furthermore, the heat dissipation component 300 does not cover the output capacitors C8 to C12. Output capacitors C8 to C12 are generally large capacitors to effectively remove fluctuating current and voltage. The size of the capacitors depends roughly on their capacitance. Covering these output capacitors C8 to C12 would increase the size of the heat dissipation component 300. Moreover, the output capacitors C8 to C12 generate heat when removing current and voltage fluctuations. By leaving these output capacitors C8 to C12 uncovered by the heat dissipation component 300, the heat generated by the boost DC / DC converter 9 can be effectively dissipated, and the cost of the inhaler 100 can be reduced.

[0206] Output capacitors C9 to C12 are the tallest electronic components disposed on sub-surface 162b. These output capacitors C9 to C12 are disposed in the remaining area 192 where the heat diffusion member 300 is not located, and are not covered by the heat diffusion member 300. By not covering the tallest electronic components with the heat diffusion member 300, it is possible to avoid the heat diffusion member 300 becoming too large or its shape becoming too complex. In addition, as Figure 23 As shown, in the remaining area 192, in addition to the output capacitors C9 to C12, there are also capacitor C7, output capacitor C8, resistor R14, and overvoltage protection IC11, etc.

[0207] Furthermore, the heat diffusion member 300 partially covers the bypass capacitors C1 and C2. More specifically, the heat diffusion member 300 covers the second bypass capacitor C2 but not the first bypass capacitor C1. The bypass capacitors C1 and C2 do not input fluctuating current or voltage to the input terminal VIN of the boost DC / DC converter 9. For sufficient smoothing, it is preferable to provide multiple smoothing capacitors as bypass capacitors. However, if the bypass capacitors C1 and C2 become hot, it may not be able to sufficiently remove fluctuating current or voltage. On the other hand, if the heat diffusion member 300 covers all the bypass capacitors C1 and C2, the size of the heat diffusion member 300 becomes too large or the shape becomes complex. Therefore, by the heat diffusion member 300 at least partially covering a portion of the multiple bypass capacitors C1 and C2 (in this embodiment, the second bypass capacitor C2), the second bypass capacitor C2 is prevented from becoming hot, and the boost DC / DC converter 9 is less prone to failure or malfunction. Furthermore, by covering only the second bypass capacitor C2, it is possible to prevent the heat diffusion component 300 from becoming too large or its shape from becoming too complex.

[0208] Here, the second bypass capacitor C2 is a capacitor with a smaller capacitance than the first bypass capacitor C1. As mentioned above, the size of a capacitor is largely determined by its capacitance. That is, it can be said that the smaller the capacitance of a capacitor, the more likely it is to generate localized heat. Therefore, it is preferable to protect the second bypass capacitor C2 with smaller capacitance using the heat diffusion member 300. In this way, appropriate electronic components can be protected by using a heat diffusion member 300 with a simple shape, and the operation of the inhaler 100 can be stabilized. Alternatively, instead of this embodiment, the heat diffusion member 300 may cover the first bypass capacitor C1 but not the second bypass capacitor C2 among the multiple bypass capacitors C1 and C2. Furthermore, the heat diffusion member 300 may cover only a portion of the first bypass capacitor C1 and / or a portion of the second bypass capacitor C2.

[0209] [Grounding]

[0210] Next, refer to Figure 24 The grounding of the socket mounting base plate 162 will be explained. Figure 24 This diagram illustrates the internal structure of the socket mounting substrate 162. Part (A) is a cross-sectional view along line AA of part (B). Furthermore, part (B) is a cross-sectional view of the socket mounting substrate 162 in the front-rear direction.

[0211] like Figure 24As shown, the socket mounting substrate 162 is a multilayer substrate composed of multiple stacked layers. It includes a main surface layer 402 constituting the main surface 162a, a ground layer 404 having two mutually insulated grounds PGND and AGND, a secondary surface layer 406 constituting the secondary surface 162b, a main power layer 403 disposed between the main surface layer 402 and the ground layer 404, and a secondary power layer 405 disposed between the secondary surface layer 406 and the ground layer 404. A prepreg (not shown) is disposed between each layer, and adjacent layers are kept insulated from each other.

[0212] The primary power layer 403 and the secondary power layer 405 are appropriately electrically connected via through-holes (not shown) to form a configuration. Figure 12 The circuit shown by the thin solid line in the area 162A of the socket mounting substrate 162 is mounted on the plug-in mounting substrate 162. Around the boost DC / DC converter 9, the input terminal VIN, the switch terminal SW, one end of the bypass capacitors C1 and C2, both ends of the reactor Lc, one end of the reactor capacitors C3 to C5, one end of the output capacitors C8 to C12, and the output terminal VOUT of the boost DC / DC converter 9 are connected to the main power layer 403 and the secondary power layer 405.

[0213] Grounding layer 404 includes two grounds: a power ground PGND connected to a circuit carrying a large current and a signal ground AGND connected to a circuit carrying a small current. The area between the power ground PGND and the signal ground AGND in grounding layer 404 is an insulating part 194 made of insulating material.

[0214] like Figure 20 As shown, the power ground terminal PGP of the boost DC / DC converter 9 is connected to the power ground PGND. Figure 10 The boost DC / DC converter 9 has a ground terminal GND, the other end of reactor capacitors C3 to C5 connected at one end to the wiring connecting node N1 and reactor Lc, and the other end of output capacitors C8 to C12 connected at one end to the wiring connecting output terminal VOUT and node N2.

[0215] In addition, as mentioned above, the power supply ground PGND is Figure 10 The ground wire shown is connected to the power ground PGND. Figure 12 The protection IC 10, overvoltage protection IC 11, margin meter IC 12, power supply terminal VSS of the socket RCP, and ground terminal GND are included in the range 162A of the socket mounting substrate 162.

[0216] Furthermore, such as Figure 10As shown, a transistor, i.e., switch S6, is connected to the negative terminal of the heater connector Cn via the power ground PGND, and further connected to the ground terminal GND of the socket RCP. The output terminal VOUT of the boost DC / DC converter 9, along with other ICs, switch S6, and socket RCP, are connected to the same ground, sharing a common reference potential (equivalent to the potential of the power ground PGND). Therefore, the inhaler 100 operates stably, and short circuits are less likely to occur between them, thereby improving the safety of the inhaler 100.

[0217] Furthermore, as described above, the ground of the MCU mounting substrate 161 is connected to the power ground PGND of the socket mounting substrate 162 via a spacer 173. This ensures that the ground potentials of the MCU mounting substrate 161 and the socket mounting substrate 162 are aligned, stabilizing the supply of charging power, operating power, and communication between the MCU mounting substrate 161 and the socket mounting substrate 162. On the other hand, the ground of the MCU mounting substrate 161 is not directly connected to the signal ground AGND. Therefore, the signal ground AGND is less susceptible to the effects of heat or noise generated when the power ground PGND and the ground of the MCU mounting substrate 161 are aligned at the same potential.

[0218] The following components are connected to the signal ground AGND: the signal ground terminal AGP of the boost DC / DC converter 9; the other end of resistor R11, one end of which is connected to the second control terminal P32; the other end of bypass capacitors C1 and C2, one end of which is connected to the connection line between node N1 and input terminal VIN; the other end of the series circuit of resistor R14 and capacitor C7 connected to the third control terminal P33; the other end of voltage divider circuit Pg, one end of which is connected to the connection line between output terminal VOUT and output capacitors C8 to C12 and the connection point is connected to feedback terminal FB; and the other end of capacitor C6, one end of which is connected to the first control terminal P31. That is, resistors R11 to R14, capacitors C6 and C7, and bypass capacitors C1 and C2 are arranged in the power path between the boost DC / DC converter 9 and the signal ground AGND. These electronic components function when voltage conversion control is performed by the boost DC / DC converter 9.

[0219] Thus, electronic components that function during voltage conversion control are connected to the signal ground AGND, and more preferably, only electronic components that function during voltage conversion control are connected. By not connecting electronic components that are not highly correlated with the boost DC / DC converter 9 to the signal ground AGND, the potential of the signal ground AGND is stable, and the voltage value detected by the feedback terminal FB is also stable. Therefore, the voltage applied to the heater HTR by the boost DC / DC converter 9 is stable, which can stabilize the amount of aerosol generated and the aroma of the smoke. Conversely, the electronic components that function when not performing voltage conversion control, namely the socket RCP and the overvoltage protection IC 11, are connected to the power ground PGND (see reference). Figure 10 ).

[0220] Alternatively, electronic components with low correlation to the boost DC / DC converter 9 can be connected to the signal ground AGND. However, it is preferable that the number of electronic components connected to the signal ground AGND that function when voltage conversion control is performed by the boost DC / DC converter 9 is greater than the number of electronic components connected to the signal ground AGND that function when voltage conversion control is not performed. As a result, the potential of the signal ground AGND is stable, the voltage value detected by the feedback terminal FB is also stable, and therefore the voltage applied to the heater HTR by the boost DC / DC converter 9 is stable, which enables the amount of generated aerosol and the aroma of the smoke to be stable.

[0221] Preferably, the number of components arranged on the power path between the boost DC / DC converter 9 and the signal ground AGND—namely, resistors R11-R14, capacitors C6 and C7, and bypass capacitors C1 and C2—arranged on the secondary surface 162b is greater than the number of components arranged on the main surface 162a; more preferably, all components are arranged on the secondary surface 162b. In this embodiment, all resistors R11-R14, capacitors C6 and C7, and bypass capacitors C1 and C2 are arranged on the secondary surface 162b. This reduces the likelihood of the signal ground AGND being formed in a shape where components are connected to their respective surfaces, thus enabling miniaturization of the signal ground AGND and reducing the possibility of noise intrusion from other parts of the substrate. Furthermore, it allows for a larger area of ​​the power ground PGND and enables the PGND potential to be stabilized.

[0222] Furthermore, these resistors R11-R14, capacitors C6 and C7, and bypass capacitors C1 and C2 are preferably arranged in a concentrated manner. In this embodiment, as... Figure 23As shown, if we define the four regions on the circuit board formed by four diagonals extending from the center of the quadrilateral boost DC / DC converter 9, separated by four diagonals including the vertex of the boost DC / DC converter 9, as the first region AR1 to the fourth region AR4, viewed from a direction orthogonal to the sub-plane 162b (the front-back direction in this embodiment), then bypass capacitors C1, C2, and capacitor C6 are disposed in the first region AR1, and resistors R11, R12, R14, and capacitor C7 are disposed in the third region AR3. Furthermore, resistor R13 is disposed in the second region AR2, and no components are disposed in the fourth region AR4. In this way, by providing regions with multiple components disposed on the power path between the boost DC / DC converter 9 and the signal ground AGND, and regions without components, and by concentrating the components connected to the signal ground AGND on the board, the area of ​​the signal ground AGND can be reduced, thereby reducing the possibility of noise intrusion from other parts of the board. Furthermore, the area of ​​the power ground PGND can be increased, and the potential of the power ground PGND can be stabilized.

[0223] like Figure 24 As shown, the area of ​​the power ground PGND (the shaded area in (A)) is larger than the area of ​​the signal ground AGND (the shaded area in (A)). Because the power ground PGND has a large area, its potential is stable. Therefore, current and voltage fluctuations can be removed more effectively from the waveform output by the boost DC / DC converter 9, resulting in a voltage waveform that approximates an ideal standing wave, thus stabilizing the amount of aerosol generated and the smoke aroma.

[0224] Furthermore, the signal ground AGND is at least partially surrounded by the power ground PGND. In this embodiment, the power ground PGND is configured to surround the entire circumference of the signal ground AGND. Therefore, the power ground PGND protects the signal ground AGND from external noise and other influences.

[0225] Furthermore, in this embodiment, the power ground PGND and signal ground AGND are disposed on the same layer in the socket mounting substrate 162, which is a multilayer substrate, but it is not limited to this and can also be disposed on different layers. By disposing of them on the same layer, the number of layers in the multilayer substrate can be reduced.

[0226] Furthermore, the power ground PGND and signal ground AGND are electrically connected by a common ground CGND. Through the common ground CGND, the two grounds share a common potential. The common ground CGND can be located either on the socket mounting substrate 162 or outside of it. By being located outside the socket mounting substrate 162, the power ground PGND and signal ground AGND are separated from the common ground CGND, making them less susceptible to heat and noise from the common ground. Therefore, electronic components connected to the power ground PGND and signal ground AGND are less affected by heat and noise generated by potential deviations, and the operation of the inhaler 100 is more stable. As an example of the external location of the socket mounting substrate 162, in this embodiment, the common ground CGND is located on the bottom surface of the boost DC / DC converter 9.

[0227] Here, on the main surface 162a of the socket mounting substrate 162, no electronic components are provided in the common ground projection area 167 that overlaps with the common ground CGND when viewed from a direction orthogonal to the main surface 162a (the front-back direction in this embodiment). Figure 22 The document describes a common ground projection area 167. The two grounds, PGND and AGND, are insulated within the circuit board, making their potentials prone to differing. In the common ground CGND used to eliminate this potential deviation, heat and noise are generated along with the elimination of the potential deviation. This heat and noise can potentially propagate to the vicinity of the common ground CGND, such as its front or back surfaces. By avoiding the placement of electronic components in such locations, the electronic components are less susceptible to the heat and noise generated by the elimination of the potential deviation, and the operation of the inhaler 100 is more likely to be stable.

[0228] On the other hand, the remaining portion 90 on the main surface 162a of the boost DC / DC converter 9, which is not included in the common ground CGND, can also be viewed from a direction orthogonal to the main surface 162a (the front-back direction in this embodiment) and the bottom surface of the boost DC / DC converter 9. Figure 20 Electronic components are configured in the overlapping remaining projection area 168. Figure 22The remaining projection area 168 is described together with the common ground projection area 167. When electronic components are arranged in the remaining projection area 168, compared to the case where electronic components are not arranged in the area overlapping the bottom surface of the boost DC / DC converter 9, the flexibility in arranging electronic components in the circuit board is increased, thus improving the utilization efficiency of the circuit board and avoiding its large size. Furthermore, the electronic components can include active components such as ICs and switches, or passive components such as resistors and capacitors. However, it is preferable that at least one of precision ICs and switches is not included in the electronic components; more preferably, both ICs and switches are excluded. Even more preferably, passive components that are not easily affected by noise or heat are preferred. This improves the utilization efficiency of the circuit board and makes the operation of the suction device 100 easier and more stable.

[0229] Furthermore, the reactor Lc of the boost DC / DC converter 9 disposed on the main surface 162a is preferably not disposed in the common ground projection area 167, and more preferably not disposed in the common ground projection area 167 and the remaining projection area 168. By not disposing of the reactor Lc in the common ground projection area 167, the reactor Lc is less susceptible to the effects of heat and noise from the common ground CGND, thus the voltage conversion in the boost DC / DC converter 9 is easily stabilized, and as a result, the amount of aerosol generated and the smoke aroma are also stable.

[0230] [MCU mounting baseboard]

[0231] Figure 25 This diagram shows the main surface 161a of the MCU mounting substrate 161. On the main surface 161a of the MCU mounting substrate 161, which extends vertically, a heater temperature detection connector Cn(t3), connected via wires to a thermistor T3 constituting a heater temperature sensor, is disposed at its upper end, and a charging IC2 is disposed below it. Furthermore, an opening 175 for a fixing spacer 173 is disposed at a position corresponding to the opening 176 of the socket mounting substrate 162, and the MCU1 is disposed near the opening 175.

[0232] By placing the MCU1 on the MCU mounting substrate 161 relative to the socket mounting substrate 162 where the socket RCP is configured, the MCU1 is separated from the socket RCP, thus making it less susceptible to the influence of static electricity or other factors that may enter through the socket RCP. As a result, the operation of the inhaler 100 can be made more stable.

[0233] Furthermore, the MCU1 is positioned on the secondary side 161b, which is further away from the main side 161a than the secondary side 162b of the socket mounting substrate 162. Therefore, the MCU1 can be positioned as far away as possible from the socket mounting substrate 162 and the power supply BAT, which can become heat sources, and the operation of the inhaler 100 is stable.

[0234] Figure 26 This diagram shows the subsurface 161b of the MCU mounting substrate 161. On the subsurface 161b of the MCU mounting substrate 161, a motor connector 226 for connecting to the vibration motor M via a wire is disposed on the upper side of the opening 175. Furthermore, a housing temperature detection connector Cn(t4) for connecting to the thermistor T4, which constitutes the housing temperature sensor, via a wire, and a suction detection connector Cn(t2) for connecting to the thermistor T2, which constitutes the suction sensor, via a wire, are disposed at the upper end.

[0235] A flexible wiring board 165 electrically connects the MCU mounting substrate 161 and the socket mounting substrate 162, connecting the FPC connection portions 231 and 232 of the MCU mounting substrate 161 and the socket mounting substrate 162 to each other. The FPC connection portions 231 and 232 are located at the right ends of the MCU mounting substrate 161 and the socket mounting substrate 162, and extend downward from approximately the center to the vicinity of the openings 175 and 176 in the vertical direction.

[0236] Various embodiments have been described above with reference to the accompanying drawings, but the present invention is certainly not limited to the examples described above. Those skilled in the art will understand that various modifications or alterations will be readily apparent within the scope of the claims, and these are naturally within the technical scope of the present invention. Furthermore, the constituent elements of the above embodiments can be combined arbitrarily without departing from the spirit of the invention.

[0237] For example, in the above embodiment, the reactor capacitors C3 to C5 are connected in parallel between node N1 and one end of reactor Lc, but they can also be connected in parallel between the other end of reactor Lc and switch terminal SW.

[0238] The following items are described in at least one part of this specification. Additionally, elements corresponding to those in the above embodiments are indicated in parentheses, but the scope is not limited thereto.

[0239] (1) A power supply unit (non-combustion inhaler 100) for an aerosol generating device, comprising:

[0240] Power supply (Power Supply BAT);

[0241] Heater connector (heater connector Cn) connects to a heater (heater HTR) that consumes power supplied from the power source to heat the aerosol source;

[0242] The voltage conversion IC (boost DC / DC converter 9) includes an output terminal (output terminal VOUT) connected to the heater connector and converting the input voltage and outputting it, and a detection terminal (feedback terminal FB) for detecting the voltage output from the output terminal;

[0243] The circuit board (socket mounting board 162) includes a first side (subsidence side 162b) on which the voltage conversion IC is disposed and a second side (main side 162a) serving as the back side of the first side;

[0244] A capacitor (output capacitor C8 to C12), one end of which is connected to the output terminal;

[0245] The first ground (power ground PGND) is located inside the circuit board and connected to the other end of the capacitor;

[0246] A second ground (signal ground AGND) is disposed inside the circuit board, insulated from the first ground inside the circuit board and connected to the detection terminal; and

[0247] Common ground (CGND), electrically connected to the first ground and the second ground.

[0248] On the second surface, no electronic components are provided in the common ground projection area (common ground projection area 167) that overlaps with the common ground when viewed from a direction orthogonal to the circuit board.

[0249] The two grounds are insulated within the circuit board, so their potentials are sometimes different. In the common ground used to eliminate this potential deviation, heat and noise are generated along with the elimination of the potential deviation. This heat and noise may be transmitted to the vicinity of the common ground, for example, to the front or back of the common ground. According to (1), by not placing electronic components in such locations, the electronic components are less susceptible to the heat and noise generated along with the elimination of the potential deviation, and the operation of the power supply unit of the aerosol generating device is stable.

[0250] (2) The power supply unit of the aerosol generating device as described in (1), wherein,

[0251] The common ground is located on the bottom surface of the voltage conversion IC.

[0252] According to (2), by setting the common ground in a place isolated from other electronic components, other electronic components are less likely to be affected by heat and noise from the common ground, and the operation of the power supply unit of the aerosol generating device is more stable.

[0253] (3) The power supply unit of the aerosol generating device as described in (2), wherein,

[0254] The common ground is located on a portion of the bottom surface of the voltage conversion IC.

[0255] On the second surface, a first electronic component is disposed in a projection area (residual portion projection area 168) of the remaining portion (residual portion 90) in the bottom surface of the voltage conversion IC that is not included in the aforementioned portion when viewed from a direction orthogonal to the circuit board.

[0256] According to (3), compared with the case where no electronic components are arranged in the area overlapping with the bottom surface of the voltage conversion IC, the degree of freedom in the arrangement of electronic components in the circuit board is increased, thus improving the utilization efficiency of the board and avoiding the large size of the circuit board.

[0257] (4) The power supply unit of the aerosol generating device as described in (3), wherein,

[0258] The first electronic component does not include at least one of the IC and the switch.

[0259] According to (4), precision ICs and switches in electronic components are not configured in the remaining projection area, which is not as affected by noise and heat as the common ground projection area, thereby avoiding the large size of the substrate and making it easier to stabilize the operation of the aerosol generation device.

[0260] (5) The power supply unit of the aerosol generating device as described in (3), wherein,

[0261] The first electronic component is a passive element.

[0262] According to (5), by arranging passive components in the electronic components that are not easily affected by noise and heat in the remaining projection area, which is not like the common ground projection area but may be more or less affected by noise and heat, the operation of the aerosol generating device is easy to stabilize.

[0263] (6) The power supply unit of the aerosol generating apparatus as described in any one of (1) to (5), wherein,

[0264] The power supply unit of the aerosol generating device includes a plurality of first elements (resistors R11 to R14, capacitors C1, C2, C6, and C7) disposed on the power path between the voltage conversion IC and the second ground.

[0265] The number of elements disposed on the first surface among the plurality of first elements is greater than the number of elements disposed on the second surface among the first elements.

[0266] According to (6), the situation where the second ground is formed as a shape that connects to the elements arranged on their respective surfaces can be reduced, thus enabling the second ground to be miniaturized, reducing the possibility of noise intrusion from other parts of the substrate, and enabling the first ground to be enlarged and the potential of the first ground to be stabilized.

[0267] (7) The power supply unit of the aerosol generating device as described in (6), wherein,

[0268] All of the first elements are disposed on the first surface.

[0269] According to (7), the second ground does not need to be formed in the shape of an element connected to its respective surface. Therefore, the second ground can be miniaturized, reducing the possibility of noise intrusion from other parts of the substrate, and the first ground can be enlarged, thus stabilizing the potential of the first ground.

[0270] (8) The power supply unit of the aerosol generating device as described in (6), wherein,

[0271] The power supply unit of the aerosol generating device includes multiple first components (resistors R11-R14, capacitors C1, C2, C6, and C7), which are arranged on the power path between the voltage conversion IC and the second ground, and are also disposed on the circuit board.

[0272] The voltage conversion IC has an N-sided shape when viewed from a direction orthogonal to the circuit board.

[0273] At least one of the N regions (regions AR1 to AR4) on the circuit board formed by N imaginary lines extending from the center of the voltage conversion IC in a manner that includes the vertex of the voltage conversion IC is a plurality of the plurality of first elements.

[0274] According to (8), by concentrating the components connected to the second ground on the substrate, the area of ​​the second ground can be reduced, thus reducing the possibility of noise intrusion from other parts of the substrate, and the area of ​​the first ground can be enlarged, thereby stabilizing the potential of the first ground.

[0275] (9) The power supply unit of the aerosol generating device as described in (8), wherein,

[0276] At least one of the N regions (region AR4) does not contain the first element.

[0277] According to (9), by concentrating the components connected to the second ground on the substrate, the area of ​​the second ground can be reduced, thus reducing the possibility of noise intrusion from other parts of the substrate, and the area of ​​the first ground can be enlarged, thereby stabilizing the potential of the first ground.

[0278] (10) The power supply unit of the aerosol generating apparatus as described in any one of (1) to (9), wherein,

[0279] The power supply unit of the aerosol generating device includes a reactor with one end connected to the power source and the other end connected to the voltage conversion IC.

[0280] The reactor is disposed on the second side.

[0281] According to (10), the voltage conversion IC and the reactor are components that generate heat during voltage conversion. By arranging them on different surfaces, heat concentration can be avoided, thereby improving the durability of the power supply unit of the aerosol generation device.

[0282] (11) The power supply unit of the aerosol generating apparatus as described in (10), wherein,

[0283] The reactor is positioned in a region that is not included in the common ground projection area that overlaps with the common ground when viewed from a direction orthogonal to the circuit board.

[0284] According to (11), the reactor is not easily affected by heat and noise from the common ground, so the voltage conversion in the voltage conversion IC is easy to stabilize. As a result, the amount of aerosol generated and the smoke aroma are also stable.

[0285] In addition, this application is based on Japanese patent application filed on May 10, 2021 (Japanese Patent Application No. 2021-079882), the contents of which are incorporated herein by reference.

[0286] Explanation of reference numerals in the attached figures

[0287] 9. Boost DC / DC Converter

[0288] 90 Remaining parts

[0289] 100 Non-combustible inhaler (power unit for aerosol generation device)

[0290] 162a Main face (second face)

[0291] 162b Secondary face (first face)

[0292] 162-pin mounting board (circuit board)

[0293] 167 Common grounding projection area

[0294] 168 Remaining projection area

[0295] Resistor R11 (first component)

[0296] Resistor R12 (first component)

[0297] Resistor R13 (first component)

[0298] Resistor R14 (first component)

[0299] C6 Capacitor (First Component)

[0300] C7 Capacitor (First Component)

[0301] C8 Output Capacitor

[0302] C9 Output Capacitor

[0303] C10 Output Capacitor

[0304] C11 Output capacitor

[0305] C12 Output capacitor

[0306] BAT Power Supply

[0307] HTR heater

[0308] Cn heater connector

[0309] VOUT output terminal

[0310] FB feedback terminal (detection terminal)

[0311] PGND Power ground (first ground)

[0312] AGND signal ground (second ground)

[0313] CGND Common ground.

Claims

1. A power supply unit for an aerosol generating device, comprising: power supply; A heater connector for connecting a heater that consumes power supplied from the power source to heat the aerosol source; The voltage conversion IC includes an output terminal connected to the heater connector and converting the input voltage and outputting it, and a detection terminal for detecting the voltage output from the output terminal; The circuit board includes a first side on which the voltage conversion IC is disposed and a second side serving as the back side of the first side; A capacitor, one end of which is connected to the output terminal; A first ground is disposed inside the circuit board and connected to the other end of the capacitor; The second ground is disposed inside the circuit board, and is insulated from the first ground inside the circuit board and connected to the detection terminal. as well as Common ground, electrically connected to the first ground and the second ground. On the second surface, no electronic components are provided in the common ground projection area that overlaps with the common ground when viewed from a direction orthogonal to the circuit board.

2. The power supply unit of the aerosol generating apparatus as described in claim 1, wherein, The common ground is located on the bottom surface of the voltage conversion IC.

3. The power supply unit of the aerosol generating apparatus as described in claim 2, wherein, The common ground is located on a portion of the bottom surface of the voltage conversion IC. On the second surface, a first electronic component is disposed in the projection area of ​​the remaining portion that overlaps with the remaining portion of the bottom surface of the voltage conversion IC (not included in the first portion) when viewed from a direction orthogonal to the circuit board.

4. The power supply unit of the aerosol generating apparatus as described in claim 3, wherein, The first electronic component does not include at least one of the IC and the switch.

5. The power supply unit of the aerosol generating apparatus as described in claim 3, wherein, The first electronic component is a passive element.

6. The power supply unit of the aerosol generating apparatus as described in any one of claims 1 to 5, wherein, The power supply unit of the aerosol generating device includes a plurality of first elements disposed on the power path between the voltage conversion IC and the second ground. The number of elements disposed on the first surface among the plurality of first elements is greater than the number of elements disposed on the second surface among the first elements.

7. The power supply unit of the aerosol generating apparatus as described in claim 6, wherein, All of the first elements are disposed on the first surface.

8. The power supply unit of the aerosol generating apparatus as described in claim 6, wherein, The power supply unit of the aerosol generating device includes a plurality of first elements, which are disposed on the power path between the voltage conversion IC and the second ground, and are also disposed on the circuit board. The voltage conversion IC has an N-sided shape when viewed from a direction orthogonal to the circuit board. At least one of the N regions on the circuit board formed by N imaginary lines extending from the center of the voltage conversion IC in a manner that includes the vertex of the voltage conversion IC contains multiple elements of the plurality of first elements.

9. The power supply unit of the aerosol generating apparatus as described in claim 8, wherein, At least one of the N regions does not contain the first element.

10. The power supply unit of the aerosol generating apparatus according to any one of claims 1 to 5, wherein, The power supply unit of the aerosol generating device includes a reactor with one end connected to the power source and the other end connected to the voltage conversion IC. The reactor is disposed on the second side.

11. The power supply unit of the aerosol generating apparatus as claimed in claim 10, wherein, The reactor is positioned in a region that is not included in the common ground projection area that overlaps with the common ground when viewed from a direction orthogonal to the circuit board.

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