A process for producing indium-plated ACC car logos

Abstract

This application relates to the field of ACC logo production, and more particularly to a production process for indium-plated ACC logos, comprising the following steps: S1, injection molding a transparent panel; S2, indium plating the logo groove on the back of the transparent panel using a PVD process; S3, manufacturing a logo base plate using an injection molding process, wherein several overflow sheets are integrally injection molded during the injection molding of the logo base plate, and the several overflow sheets are integrally connected to the back of the logo base plate; S4, after the logo base plate has cooled and solidified, the several overflow sheets are cut off from the back of the logo base plate. This application reduces the occurrence of wrinkles in the indium plating layer of the ACC logo, thereby ensuring the product qualification rate of the ACC logo.

Description

Technical Field

[0001] This application relates to the field of ACC logo production, and in particular to an indium-plated ACC logo production process. Background Technology

[0002] ACC stands for Adaptive Cruise Control, a widely used automotive driver assistance system. It typically uses radar to sense the distance and speed of vehicles ahead, automatically adjusting the vehicle's speed and following distance to effectively ensure driving safety. The ACC logo is a specific type of logo used with ACC; it's mounted in front of the ACC radar, acting like a radar dome. Therefore, the structure and manufacturing process of the ACC logo are more complex than ordinary logos.

[0003] In existing related technologies, the ACC logo typically includes a transparent panel, an indium-plated layer, and a logo base plate. The transparent panel is generally made of PC (polycarbonate). The front side of the transparent panel, i.e., the viewing side closest to the ACC logo, has a smooth curved surface. The back side of the transparent panel, i.e., the viewing side away from the ACC logo, has a logo groove corresponding to the logo design, and the indium-plated layer is applied within the logo groove to form the logo design. The logo base plate is generally an arc-shaped plate manufactured by injection molding black ASA or black AES. The black logo base plate is applied over the transparent panel and the indium-plated layer, making the indium-plated pattern stand out to form the ACC logo. Furthermore, in the production process of the ACC logo, the logo base plate is formed by injection molding onto the back of the transparent panel and then cooling.

[0004] Regarding the aforementioned technologies, the temperature of the ASA or AES molten adhesive used in the logo base plate is approximately 200℃, while the melting point of indium is approximately 156℃. This causes the indium plating layer to easily become molten when using ASA or AES molten adhesive for the logo base plate. Because ASA or AES molten adhesive shrinks significantly upon cooling, this shrinkage causes the molten indium plating layer to flow and form wrinkles after cooling. This makes it difficult to properly form the logo design, especially those with sharp corners, thus compromising the product qualification rate of ACC logos. Summary of the Invention

[0005] In order to reduce the occurrence of wrinkles in the indium plating layer of the ACC logo and thus ensure the product qualification rate of the ACC logo, this application provides a production process for indium-plated ACC logos.

[0006] The technical solution for the production process of indium-plated ACC car logos provided in this application is as follows:

[0007] A process for producing indium-plated ACC car emblems includes the following specific steps:

[0008] S1. Injection molding of transparent panels;

[0009] S2. Indium plating is applied to the car logo groove on the back of the transparent panel using PVD process;

[0010] S3. The logo base plate is manufactured by injection molding. When injection molding the logo base plate, several overflow sheets are integrally injection molded, and the several overflow sheets are integrally connected to the back of the logo base plate.

[0011] S4. After the logo base plate has cooled and solidified, cut off several of the overflow pieces from the back of the logo base plate.

[0012] By adopting the above technical solution, during the cooling and molding process of ASA or AES molten adhesive, the residual stress generated inside the logo base plate due to molten adhesive flow or thermal effects causes the logo base plate to shrink. The ASA or AES molten adhesive then flows and deforms towards the locations where several overflow pieces form, gradually transferring the residual stress to these overflow pieces and releasing it. After the residual stress in the logo base plate is released, the ASA or AES molten adhesive will be less likely to shrink significantly. This prevents the indium plating layer of the molten ACC logo from forming wrinkles under the shrinkage effect of the ASA or AES molten adhesive, thus ensuring the product qualification rate of the ACC logo.

[0013] In addition to relieving residual stress, the overflow strips also provide a cushioning effect for the logo base plate. During injection molding of the logo base plate, the overflow strips prevent the mold core from directly impacting the logo base plate, thereby reducing the occurrence of damage to the logo base plate by the mold core and further ensuring the product qualification rate of the ACC logo.

[0014] Optionally, in step S3, when one portion of the overflow sheet is positioned near the center of the logo base plate and the logo groove has a sharp corner corresponding to the logo style, the other portion of the overflow sheet is positioned near the sharp corner of the logo groove.

[0015] By adopting the above technical solution, the residual stress in the middle of the logo base plate is relatively large during the cooling and molding of ASA or AES melt, resulting in a large shrinkage in the middle of the logo base plate. By placing some of the overflow pieces close to the middle of the logo, the residual stress in the middle of the logo base plate is fully released, thereby effectively reducing the shrinkage in the middle of the logo base plate. This reduces the occurrence of wrinkles in the indium plating layer of the ACC logo, thus further ensuring the product qualification rate of the ACC logo.

[0016] When the logo groove has a sharp corner corresponding to the logo style, the indium plating layer partially or entirely melts under the high temperature of ASA or AES melt. On the one hand, the indium near the sharp corner is easily moved away from the sharp corner by its own surface tension. On the other hand, because the area covered by the indium near the sharp corner is small, the stability of the connection between the indium and the logo base plate is poor. As a result, the molten indium is easy to flow under the shrinkage of ASA or AES melt, making the indium plating layer extremely prone to wrinkles after cooling.

[0017] By setting an additional overflow sheet near the sharp corner of the logo recess, the shrinkage of the logo base plate near the sharp corner is reduced, thereby reducing the occurrence of ASA or AES melt adhesive driving the flow of molten indium. Furthermore, by restricting the flow of molten indium through the logo base plate, the occurrence of wrinkles in the indium plating layer of the ACC logo is further reduced, and the product qualification rate of the ACC logo is further ensured.

[0018] Optionally, in step S3, the plurality of overflow sheets are all arranged in a frustum shape, and the larger end of the plurality of overflow sheets is integrally connected to the base plate of the vehicle logo.

[0019] By adopting the above technical solution, the frustum-shaped overflow sheet is integrally connected to the logo base plate with its larger end, making it easier for ASA or AES melt to approach the overflow sheet and form an overflow sheet. This allows residual stress to be released more easily through the overflow sheet, thereby further reducing the occurrence of wrinkles in the indium plating layer of the ACC logo and further ensuring the product qualification rate of the ACC logo.

[0020] The frustum-shaped flash filler not only facilitates the release of residual stress but also aids in demolding. When the ACC logo is removed from the mold core, the frustum-shaped flash filler, with its numerous inclined surfaces, allows it to easily detach from the mold core under external force. This reduces the likelihood of the flash filler getting stuck in the mold core, making it difficult to remove the ACC logo and ensuring the orderly production of the ACC logo.

[0021] In addition, reducing the occurrence of overflow sheet stuck to the mold core not only ensures the orderly production of the ACC logo, but also helps to reduce the occurrence of overflow sheet and part of the logo base plate breaking off from the main body of the logo base plate together when the logo base is removed from the mold core by several ejector pins or operators. This helps to ensure the product qualification rate of the logo base plate, thereby further ensuring the product qualification rate of the ACC logo.

[0022] Optionally, in step S3, each of the several overflow sheets is provided with a cutting groove, the several cutting grooves are respectively arranged around each overflow sheet, and the several cutting grooves are all located close to the bottom plate of the car logo, and the depth dimension of the several cutting grooves is less than 0.3mm.

[0023] By adopting the above technical solution, the logo base plate is an arc-shaped plate manufactured by injection molding with black ASA or black AES, resulting in a significant angle between the overflow sheet and the concave surface of the logo base plate. When the overflow sheet is cut off from the logo base plate, the cutting blade is prone to colliding with the concave surface of the logo base plate, causing damage to the back of the logo base plate. By setting a cutting groove around the overflow sheet, an operating surface for the cutting blade is provided, reducing the occurrence of the cutting blade colliding with the concave surface of the logo base plate, thereby ensuring the product qualification rate of the logo base plate, and further ensuring the product qualification rate of the ACC logo.

[0024] In addition to reducing the occurrence of the cutting blade colliding with the concave surface of the logo base plate, the cutting groove also guides the cutting process. When the cutting blade is pressed against the overflow sheet, the surface of the overflow sheet, which is injection molded from ASA or AES, is relatively smooth, making it easy for the cutting blade to slip or deviate. By limiting the cutting blade's position through the cutting groove, the occurrence of the cutting blade slipping out of the groove is reduced, which helps to ensure that the cutting blade accurately and effectively cuts and removes the overflow sheet from the back of the logo base plate.

[0025] In addition to guiding the cutting blade, the cutting groove also facilitates the direct removal of excess material. The cutting groove reduces the cross-sectional area of ​​the excess material, making it easier for the excess material to break under the force of the cutting blade or the operator's fingers, thus ensuring efficient production of the ACC logo.

[0026] Finally, by limiting the depth of the cutting groove to within 0.3mm, the overflow sheet can be easily removed from the mold core by the action of several ejector pins of the mold or the operator, reducing the occurrence of the mold core getting stuck in the cutting groove, making it difficult for the overflow sheet to be removed from the mold core.

[0027] Optionally, in step S3, each of the several overflow pieces includes an overflow connecting part and an overflow cutting part. The several overflow connecting parts are integrally connected to the logo base plate. The height of the several overflow connecting parts is 0.2mm~0.3mm. The several overflow cutting parts are integrally connected to each overflow connecting part. The several cutting grooves are respectively opened in each overflow cutting part.

[0028] By adopting the above technical solution, when the overflow piece is cut off from the logo base plate using a cutting blade, the overflow connecting part with a height of 0.2mm~0.3mm maintains a distance of at least 0.2mm~0.3mm between the cutting blade and the logo base plate. This makes it more difficult for the cutting blade to collide with the concave surface of the logo base plate, thereby making it less likely for the cutting blade to damage the back of the logo base plate. This further ensures the product qualification rate of the logo base plate and the ACC logo.

[0029] Optionally, in step S3, the height of each of the overflow plates is 3mm to 5mm, the length of the bottom of each of the overflow plates is 4mm to 6mm, and the thickness of the bottom of each of the overflow plates is 0.8mm to 1.2mm.

[0030] By adopting the above technical solution, the size of the overflow sheet is limited to a suitable range, ensuring that the overflow sheet can be smoothly removed from the mold core while guaranteeing its effect on releasing residual stress. An overflow sheet that is too large will result in an excessively large contact area between the overflow sheet and the mold core, making it difficult for the overflow sheet to be removed from the mold core. Conversely, an overflow sheet that is too small will prevent the ASA or AES melt from flowing sufficiently towards the location where the overflow sheet forms during cooling and molding, thus hindering the effective release of residual stress and making it difficult to effectively reduce the occurrence of wrinkles in the indium plating layer of the ACC logo.

[0031] Optionally, in step S3, the logo base plate and several overflow pieces are manufactured by injection molding using an indium-plated ACC logo mold. The indium-plated ACC logo mold is an inverted mold. The indium-plated ACC logo mold includes a fixed mold core and a moving mold core. The cavity between the fixed mold core and the moving mold core forms a mold cavity. Several overflow grooves are provided on the side of the fixed mold core near the moving mold core. Each of the overflow grooves corresponds to one of the overflow pieces.

[0032] By adopting the above technical solution, the ejector pins and hot runners of the indium-plated ACC logo mold are both located in the fixed mold body, which helps ensure the product quality of the logo base. Since the temperature of the ASA or AES molten plastic near the hot runner is generally higher than that further away, the initial temperature of different parts of the logo base formed by injection molding from ASA or AES molten plastic is inconsistent during cooling. This results in inconsistent shrinkage during the cooling and molding process, making the logo base prone to obvious wavy shrinkage marks, affecting its aesthetics. Furthermore, when the logo base is removed from the mold core by the ejector pins, because the ASA or AES molten plastic is not yet fully hardened, the ejector pins easily leave ejection marks on the logo base, further affecting its aesthetics.

[0033] By setting the hot runner and ejector pins in the fixed mold, the shrinkage and ejection patterns formed on the logo base plate are located on the back of the logo base plate, i.e., the side away from the transparent panel. This makes it difficult for users to notice the shrinkage and ejection patterns when observing the ACC logo, thus ensuring the aesthetics of the ACC logo and ensuring the product qualification rate of the ACC logo.

[0034] On the other hand, the overflow sheet is formed on the back of the logo base plate. The cutting marks formed after the overflow sheet is cut off are also located on the back of the logo base plate. This makes it difficult for users to notice the cutting marks when observing the ACC logo, thus further ensuring the aesthetics of the ACC logo and further ensuring the product qualification rate of the ACC logo.

[0035] Optionally, the fixed mold core includes a first mold core block and a second mold core block, wherein the first mold core block has a groove on the side near the moving mold core, and the second mold core block is embedded in the groove.

[0036] By adopting the above technical solution, the second mold core block is embedded in the groove located in the first mold core block, creating a seal between the second and first mold core blocks. When the hot runner injects ASA or AES molten adhesive into the mold cavity, the gas in the mold cavity is discharged from the seal between the second and first mold core blocks. This helps to reduce the occurrence of bubbles, incomplete molding, or even carbonization in the logo base plate formed by injection molding of ASA or AES molten adhesive, thereby ensuring the product quality of the logo base plate.

[0037] The caulking joint between the second and first mold cores not only serves to expel gases inherent in the mold cavity but also to release water vapor generated by the AES molten adhesive during the injection molding of the logo base. When AES molten adhesive is used for the logo base, the AES particles themselves are highly hygroscopic. Even after drying the AES particles before injection molding, they often retain a significant amount of moisture due to equipment or human error. When the AES particles are heated and transformed into AES molten adhesive in the injection molding machine, the moisture absorbed by the particles becomes trapped within the adhesive. Under the prolonged exposure to the high temperature (approximately 200°C) of the AES molten adhesive within the mold cavity, this moisture rapidly converts into water vapor. Failure to promptly remove this water vapor can lead to issues such as bubbles, incomplete molding, and even carbonization in the logo base. Therefore, the caulking joint between the second and first mold cores effectively removes the water vapor generated by the AES molten adhesive, further ensuring the quality of the logo base.

[0038] Optionally, the second mold core block includes two fixed mold pieces and several assembly mold pieces. The two fixed mold pieces are fixedly installed on the first mold core block and are arranged facing each other. The several assembly mold pieces are arranged between the two fixed mold pieces and are arranged facing each other. Furthermore, two adjacent assembly mold pieces or two adjacent fixed mold pieces and assembly mold pieces are arranged close to each other.

[0039] By adopting the above technical solution, there is a gap between the fixed mold piece and the assembly mold piece, and there is also a gap between two adjacent assembly mold pieces. This allows the gas in the mold cavity to be quickly discharged from the gap between the fixed mold piece and the assembly mold piece or the gap between two adjacent assembly mold pieces. This reduces the occurrence of bubbles, incomplete molding, or even carbonization in the logo base plate formed by ASA melt injection molding or AES melt injection molding, thereby further ensuring the product quality of the logo base plate.

[0040] In addition, the fixed mold and assembly mold expand under the long-term high temperature of approximately 200°C of ASA melt or AES melt. This causes the gaps between the fixed mold and assembly mold, as well as the gaps between two adjacent assembly molds, to gradually decrease after the gas in the mold cavity is discharged. Consequently, it becomes difficult for ASA melt or AES melt to enter the gaps between the fixed mold and assembly mold, or between two adjacent assembly molds, and to form burrs. This further ensures the product quality of the car logo base plate and further ensures the product qualification rate of the ACC car logo.

[0041] Optionally, the fixed mold plate has a fixed venting groove, which is located close to or away from the assembly mold plate. The assembly mold plate has an assembly venting groove on one side, and both the fixed venting groove and the assembly venting groove are located away from the moving mold core.

[0042] By adopting the above technical solutions, the fixed venting groove or assembly venting groove increases the gap between the fixed mold piece and the assembly mold piece, or between two adjacent assembly mold pieces, allowing gas in the mold cavity to escape more quickly. This further reduces the occurrence of bubbles, incomplete molding, or even carbonization in the logo base plate formed by ASA melt or AES melt injection molding, thereby further ensuring the product quality of the logo base plate. In addition, by positioning the fixed venting groove and assembly venting groove far away from the moving mold core, while ensuring the rapid evacuation of gas from the mold cavity, it is difficult for ASA melt or AES melt to directly enter the fixed venting groove or assembly venting groove, further reducing the occurrence of burrs on the logo base plate and further ensuring the product qualification rate of ACC logos.

[0043] In summary, this application includes at least one of the following beneficial technical effects:

[0044] 1. During the cooling and molding process of ASA or AES molten adhesive, residual stress generated within the logo base plate due to molten adhesive flow or thermal effects causes the base plate to shrink. The ASA or AES molten adhesive then flows and deforms towards the locations where overflow flakes form, gradually transferring the residual stress to these areas and releasing it. After the residual stress in the logo base plate is released, the ASA or AES molten adhesive will be less prone to significant shrinkage. This prevents the indium plating layer of the molten ACC logo from forming wrinkles due to the shrinkage of the ASA or AES molten adhesive, thus ensuring a high product yield for the ACC logo.

[0045] In addition to relieving residual stress, the overflow strips also provide a cushioning effect for the logo base plate. During injection molding of the logo base plate, the overflow strips prevent the mold core from directly impacting the logo base plate, thereby reducing the occurrence of damage to the logo base plate by the mold core and further ensuring the product qualification rate of the ACC logo.

[0046] 2. During the cooling and molding of ASA or AES melt adhesive, the residual stress in the center of the logo base plate is relatively large, resulting in a large shrinkage in the center of the logo base plate. By placing some of the overflow sheets close to the center of the logo, the residual stress in the center of the logo base plate can be fully released, thereby effectively reducing the shrinkage in the center of the logo base plate. This reduces the occurrence of wrinkles in the indium plating layer of the ACC logo, thus further ensuring the product qualification rate of the ACC logo.

[0047] When the logo groove has a sharp corner corresponding to the logo style, the indium plating layer partially or entirely melts under the high temperature of ASA or AES melt. On the one hand, the indium near the sharp corner is easily moved away from the sharp corner by its own surface tension. On the other hand, because the area covered by the indium near the sharp corner is small, the stability of the connection between the indium and the logo base plate is poor. As a result, the molten indium is easy to flow under the shrinkage of ASA or AES melt, making the indium plating layer extremely prone to wrinkles after cooling.

[0048] By setting an additional overflow sheet near the sharp corner of the logo recess, the shrinkage of the logo base plate near the sharp corner is reduced, thereby reducing the occurrence of ASA or AES melt adhesive driving the flow of molten indium. Furthermore, by restricting the flow of molten indium through the logo base plate, the occurrence of wrinkles in the indium plating layer of the ACC logo is further reduced, and the product qualification rate of the ACC logo is further ensured.

[0049] 3. The second mold core block is embedded in the groove located in the first mold core block, creating a seal between the two mold core blocks. When the hot runner injects ASA or AES molten adhesive into the mold cavity, the gas inside the mold cavity is discharged through the seal between the second and first mold core blocks. This helps reduce the occurrence of bubbles, incomplete molding, or even carbonization in the logo base plate formed by injection molding of ASA or AES molten adhesive, thereby ensuring the product quality of the logo base plate.

[0050] The caulking joint between the second and first mold cores not only serves to expel gases inherent in the mold cavity but also to release water vapor generated by the AES molten adhesive during the injection molding of the logo base. When AES molten adhesive is used for the logo base, the AES particles themselves are highly hygroscopic. Even after drying the AES particles before injection molding, they often retain a significant amount of moisture due to equipment or human error. When the AES particles are heated and transformed into AES molten adhesive in the injection molding machine, the moisture absorbed by the particles becomes trapped within the adhesive. Under the prolonged exposure to the high temperature (approximately 200°C) of the AES molten adhesive within the mold cavity, this moisture rapidly converts into water vapor. Failure to promptly remove this water vapor can lead to issues such as bubbles, incomplete molding, and even carbonization in the logo base. Therefore, the caulking joint between the second and first mold cores effectively removes the water vapor generated by the AES molten adhesive, further ensuring the quality of the logo base.

[0051] 4. There are gaps between the fixed mold and the assembly mold, and there are also gaps between two adjacent assembly molds. This allows the gas in the mold cavity to be quickly discharged from the gaps between the fixed mold and the assembly mold or between two adjacent assembly molds. This reduces the occurrence of bubbles, incomplete molding, or even carbonization in the logo base plate formed by ASA melt injection molding or AES melt injection molding, thereby further ensuring the product quality of the logo base plate. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the indium-plated ACC logo according to an embodiment of this application.

[0053] Figure 2 This is a first exploded view of the indium-plated ACC logo in an embodiment of this application.

[0054] Figure 3 This is a second exploded view of the indium-plated ACC logo in an embodiment of this application.

[0055] Figure 4 This is a schematic diagram of the overflow sheet in an embodiment of this application.

[0056] Figure 5 This is an overall schematic diagram of the indium-plated ACC logo mold according to an embodiment of this application.

[0057] Figure 6 This is an exploded view of the indium-plated ACC logo mold according to an embodiment of this application.

[0058] Figure 7 This is a schematic diagram of the mold core in an embodiment of this application.

[0059] Figure 8 This is an exploded view of the mold core in an embodiment of this application.

[0060] Figure 9 This is an exploded view of the second mold core block in an embodiment of this application.

[0061] Explanation of reference numerals in the attached drawings: 1. Transparent panel; 101. First crescent groove; 102. Second crescent groove; 103. Third crescent groove; 11. Connecting plate; 12. Snap-fit ​​protrusion; 2. Car logo base plate; 202. Snap-fit ​​groove; 21. First crescent protrusion; 22. Second crescent protrusion; 23. Third crescent protrusion; 24. Overflow piece; 241. Overflow connecting part; 242. Overflow cutting part; 2421. Cutting groove; 3. Fixed mold body; 4. Moving mold body; 5. Fixed mold core; 501. Overflow groove; 51. First mold core block; 511. Insert groove; 52. Second mold core block; 521. Fixed mold piece; 5211. Fixed venting groove; 522. Assembly mold piece; 5221. Assembly venting groove; 523. Mold core connecting rod; 6. Moving mold core. Detailed Implementation

[0062] The following is in conjunction with the appendix Figure 1-9 This application will be described in further detail.

[0063] This application discloses a manufacturing process for an indium-plated ACC vehicle logo. In this embodiment, the indium-plated ACC vehicle logo is modeled after the logo of Yutong Motors. The manufacturing process for the indium-plated ACC vehicle logo includes the following specific steps:

[0064] S1, Injection molding of transparent panel 1.

[0065] S1.1. Transparent panels made of transparent PC material are manufactured by injection molding using a two-color mold and a two-color injection molding machine.

[0066] Reference Figure 1 and Figure 2 The transparent panel 1 is an oval shape with a smooth surface, and it is also arc-shaped, meaning it has a convex side and a concave side. In this embodiment, the convex side of the transparent panel 1 is the front side, and the concave side is the back side. A logo groove corresponding to the logo of Yutong Motors is provided on the back side of the transparent panel 1.

[0067] Reference Figure 3The logo groove is composed of a first crescent groove 101, a second crescent groove 102 and a third crescent groove 103. The first crescent groove 101, the second crescent groove 102 and the third crescent groove 103 are set one by one with the three crescent-shaped protrusions of Yutong Automobile logo from the inside to the outside.

[0068] S1.2, Using the two-color mold and two-color injection molding machine from S1.1, continue injection molding the black PC material connecting plate 11 onto the back of the transparent panel 1. (Refer to...) Figure 3 The connecting plate 11 has a plurality of snap-fit ​​protrusions 12. The plurality of snap-fit ​​protrusions 12 are arranged in a ring around the extension direction of the logo groove, and the plurality of snap-fit ​​protrusions 12 are evenly distributed on the back of the transparent panel 1.

[0069] S2. Indium plating is performed on the car logo groove on the back of the transparent panel 1 using PVD process.

[0070] S3. Manufacture the logo base plate 2 using injection molding. (Refer to...) Figure 3 The logo base plate 2 is integrally injection molded with several overflow pieces 24, and the several overflow pieces 24 are integrally connected to the back of the logo base plate 2.

[0071] Reference Figure 2 and Figure 3 The material of the logo base plate 2 is selected as ASA plastic or AES plastic. In this embodiment, the material of the logo base plate 2 is selected as AES plastic. The logo base plate 2 is integrally injection molded with a plurality of snap-fit ​​grooves 202, and the plurality of snap-fit ​​grooves 202 are respectively configured to correspond one-to-one with each snap-fit ​​protrusion 12. The logo base plate 2 is integrally injection molded with a first crescent protrusion 21, a second crescent protrusion 22 and a third crescent protrusion 23, and the first crescent protrusion 21, the second crescent protrusion 22 and the third crescent protrusion 23 are respectively configured to correspond one-to-one with the first crescent groove 101, the second crescent groove 102 and the third crescent groove 103. In this embodiment, the side of the logo base plate 2 with the first crescent protrusion 21 is the front side of the logo base plate 2, and the side away from the first crescent protrusion 21 is the back side of the logo base plate 2.

[0072] Reference Figure 3In this embodiment, the number of overflow pieces 24 is set to eight. The eight overflow pieces 24 are divided into a first group, a second group, and a third group. The first group has two overflow pieces 24, the second group has three overflow pieces 24, and the third group has three overflow pieces 24. The first group is located near the center of the logo base plate 2, and the two overflow pieces 24 of the first group are located near the center of the second crescent protrusion 22 and the third crescent protrusion 23, respectively. The three overflow pieces 24 of the second group are located near one of the sharp corners of the first crescent protrusion 21, the second crescent protrusion 22, and the third crescent protrusion 23, respectively. The three overflow pieces 24 of the third group are distributed along the same straight line as the three overflow pieces 24 of the second group, and the three overflow pieces 24 of the third group are located near the other sharp corner of the first crescent protrusion 21, the second crescent protrusion 22, and the third crescent protrusion 23, respectively.

[0073] Reference Figure 4 The overflow sheet 24 is truncated pyramidal in shape, with the larger end of the overflow sheet 24 positioned near the back of the logo base plate 2. The overflow sheet 24 has a height of 3mm to 5mm, a length of 4mm to 6mm at its bottom, and a thickness of 0.8mm to 1.2mm at its bottom. In this embodiment, the overflow sheet 24 has a height of 4mm, a length of 5mm at its bottom, and a thickness of 1mm at its bottom to ensure effective stress relief.

[0074] Reference Figure 2 and Figure 4 The overflow sheet 24 includes an overflow connecting portion 241 and an overflow cutting portion 242. The overflow connecting portion 241 is integrally injection molded to the back of the logo base plate 2, and its height is 0.2mm to 0.3mm. In this embodiment, the height of the overflow connecting portion 241 is 0.25mm. The overflow cutting portion 242 is integrally injection molded to the overflow connecting portion 241, and has a cutting groove 2421. The cutting groove 2421 is arranged around the overflow sheet 24 and close to the overflow connecting portion 241. The cross-section of the cutting groove 2421 is V-shaped, and its depth is less than 0.3mm. In this embodiment, the depth of the cutting groove 2421 is 0.25mm. The V-shaped cutting groove 2421 provides good guiding effect and facilitates demolding.

[0075] Reference Figure 5 and Figure 6The logo base plate 2 and several overflow sheets 24 are all injection molded using an indium-plated ACC logo mold. The indium-plated ACC logo mold is an inverted mold. The indium-plated ACC logo mold includes a fixed mold body 3, a moving mold body 4, and a mold core body. The mold core body includes a fixed mold core 5 and a moving mold core 6. The fixed mold core 5 is tightly fitted to the moving mold core 6, and a mold cavity is formed between the fixed mold core 5 and the moving mold core 6.

[0076] Reference Figure 3 and Figure 7 The fixed mold core 5 has eight overflow grooves 501, and the eight overflow grooves 501 are respectively set to correspond one-to-one with each overflow piece 24, so as to facilitate the injection molding of each overflow piece 24.

[0077] Reference Figure 7 and Figure 8 The fixed mold core 5 includes a first mold core block 51 and a second mold core block 52. The first mold core block 51 has a groove 511 on the side near the moving mold core 6. The second mold core block 52 is embedded in the groove 511 and is recessed in the groove 511, that is, the first mold core block 51 protrudes from the second mold core block 52, so as to reduce the occurrence of the second mold core block 52 being affected by thermal expansion and thus affecting the molding of the logo base plate 2.

[0078] Reference Figure 8 and Figure 9 The second mold core block 52 includes two fixed mold pieces 521, several assembly mold pieces 522, and two mold core connecting rods 523. Both fixed mold pieces 521 are rectangular parallelepipeds, and are bolted to the first mold core block 51, with the two fixed mold pieces 521 facing each other. The several assembly mold pieces 522 are also rectangular parallelepipeds, and each assembly mold piece 522 has a thickness of 5mm. The several assembly mold pieces 522 are positioned between the two fixed mold pieces 521, and are facing each other, with two adjacent assembly mold pieces 522 or two adjacent fixed mold pieces 521 and assembly mold pieces 522 closely fitted together. Two mold core connecting rods 523 are arranged parallel to each other. The mold core connecting rods 523 pass through two fixed mold pieces 521 and several assembly mold pieces 522, and the two fixed mold pieces 521 and several assembly mold pieces 522 are all in sliding cooperation with the mold core connecting rods 523.

[0079] Reference Figure 9The fixed mold plate 521 has a fixed venting groove 5211, which is located away from the moving mold core 6. An assembly venting groove 5221 is provided on one side of the assembly venting groove 5221, which is located near the fixed mold plate 521 or another adjacent assembly venting groove 5221, and is located away from the moving mold core 6. In this embodiment, the material of several assembly mold plates 522 is selected as brass, so that the width of the gap between two adjacent assembly mold plates 522 can be reduced by its own expansion after heating. The average linear thermal expansion coefficient of brass at 200°C is approximately 18.5 × 10⁻⁶ / °C. This causes several assembly mold pieces 522 made of brass to expand by approximately 0.016 mm along their thickness direction when heated from room temperature (approximately 25°C) to approximately 200°C. This effectively seals the caulking gap, which is typically no more than 0.03 mm wide, thus ensuring the sealing effect on the gap between two adjacent assembly mold pieces 522.

[0080] S4. After the logo base plate 2 has cooled and solidified, several overflow pieces 24 are cut off from the back of the logo base plate 2 using a cutting knife.

[0081] S5. Grind the cut edges of several overflow pieces 24 respectively.

[0082] The implementation principle of the indium-plated ACC logo production process in this application embodiment is as follows: A transparent panel 1 and a connecting plate 11 are placed together in the moving mold core 6. Then, AES molten adhesive is injected into the mold cavity to integrally connect the logo base plate 2 to the transparent panel 1 and the connecting plate 11, thereby completing the production of the ACC logo. During injection molding of the logo base plate 2, eight overflow pieces 24 are simultaneously injected onto the back of the logo base plate 2 through eight overflow grooves 501. This releases the residual stress generated during the cooling and shrinkage of the AES molten adhesive, thereby reducing the occurrence of wrinkles in the indium plating layer of the ACC logo and ensuring the product qualification rate of the ACC logo.

[0083] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A manufacturing process for indium-plated ACC vehicle logos, characterized in that: The specific steps include: S1, Injection molding of transparent panels (1); S2. Indium plating is performed on the car logo groove on the back of the transparent panel (1) using PVD process; S3. The logo base plate (2) is manufactured by injection molding process. When the logo base plate (2) is injection molded, several overflow pieces (24) are integrally injection molded. The several overflow pieces (24) are integrally connected to the back of the logo base plate (2). In step S3, when one part of the overflow sheet (24) is located near the center of the logo base plate (2) and the logo groove is provided with a sharp corner corresponding to the logo style, the other part of the overflow sheet (24) is located near the sharp corner of the logo groove. In step S3, the logo base plate (2) and several overflow pieces (24) are manufactured by injection molding using an indium-plated ACC logo mold. The indium-plated ACC logo mold is an inverted mold. The indium-plated ACC logo mold includes a fixed mold core (5) and a moving mold core (6). The cavity between the fixed mold core (5) and the moving mold core (6) forms a mold cavity. Several overflow grooves (501) are provided on the side of the fixed mold core (5) near the moving mold core (6). The several overflow grooves (501) are respectively set to correspond one-to-one with each overflow piece (24). S4. After the logo base plate (2) has cooled and formed, cut off several of the overflow pieces (24) from the back of the logo base plate (2).

2. The indium-plated ACC logo manufacturing process according to claim 1, characterized in that: In step S3, several of the overflow pieces (24) are arranged in a frustum shape, and the larger end of each of the overflow pieces (24) is integrally connected to the logo base plate (2).

3. The indium-plated ACC logo manufacturing process according to claim 2, characterized in that: In step S3, each of the overflow pieces (24) is provided with a cutting groove (2421), and the cutting grooves (2421) are respectively arranged around each overflow piece (24). The cutting grooves (2421) are all located close to the logo base plate (2), and the depth of the cutting grooves (2421) is less than 0.3mm.

4. The indium-plated ACC logo manufacturing process according to claim 3, characterized in that: In step S3, each of the several overflow pieces (24) includes an overflow connecting part (241) and an overflow cutting part (242). The several overflow connecting parts (241) are integrally connected to the logo base plate (2). The height of the several overflow connecting parts (241) is 0.2mm~0.3mm. The several overflow cutting parts (242) are integrally connected to each overflow connecting part (241). The several cutting grooves (2421) are respectively opened in each overflow cutting part (242).

5. The indium-plated ACC logo manufacturing process according to claim 2, characterized in that: In step S3, the height of each of the overflow pieces (24) is 3mm to 5mm, the length of the bottom of each of the overflow pieces (24) is 4mm to 6mm, and the thickness of the bottom of each of the overflow pieces (24) is 0.8mm to 1.2mm.

6. The indium-plated ACC logo manufacturing process according to any one of claims 1-5, characterized in that: The fixed mold core (5) includes a first mold core block (51) and a second mold core block (52). The first mold core block (51) has a groove (511) on the side near the moving mold core (6), and the second mold core block (52) is embedded in the groove (511).

7. The indium-plated ACC logo manufacturing process according to claim 6, characterized in that: The second mold core block (52) includes two fixed mold pieces (521) and a plurality of assembly mold pieces (522). The two fixed mold pieces (521) are fixedly installed on the first mold core block (51) and are arranged facing each other. The plurality of assembly mold pieces (522) are arranged between the two fixed mold pieces (521) and are arranged facing each other. Furthermore, the two adjacent assembly mold pieces (522) or the two adjacent fixed mold pieces (521) and the assembly mold pieces (522) are arranged close to each other.

8. The indium-plated ACC logo manufacturing process according to claim 7, characterized in that: The fixed mold plate (521) is provided with a fixed venting groove (5211). The fixed venting groove (5211) is located close to or away from the assembly mold plate (522). The assembly mold plate (522) is provided with an assembly venting groove (5221) on one side. Both the fixed venting groove (5211) and the assembly venting groove (5221) are located away from the moving mold core (6).

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