A loading and unloading system and method for MOCVD equipment

Abstract

The present invention discloses a loading and unloading system and method for MOCVD equipment, belonging to the field of MOCVD. The system includes a loading function area, a unloading function area, a substrate transporting robot arm, a tray transporting robot arm, and a host computer. The loading function area is provided with a substrate loading station, a tray loading station, and an assembly station. The substrate loading station is provided with a substrate loading box, the tray loading station is provided with a tray loading box, and the assembly station is provided with a detection device for detecting the combination state between the substrate and the tray. The unloading function area is provided with a separation station, a tray unloading station, and a substrate unloading station. The separation station is provided with a separation device, the tray unloading station is provided with a tray unloading box, and the substrate unloading station is provided with a substrate unloading box. The host computer is electrically connected to the substrate transporting robot arm, the tray transporting robot arm, the detection device, and the separation device. The present invention realizes a mechanical replacement for manual loading and unloading, not only improving efficiency but also avoiding the disadvantage of unstable loading and unloading operations.

Description

Technical Field

[0001] The present invention relates to, and in particular to, a loading and unloading system and method for MOCVD equipment. Background Art

[0002] MOCVD is a vapor phase epitaxial growth technology developed based on vapor phase epitaxy (VPE). Using organic compounds of Group III and Group II elements and hydrides of Group V and VI elements as crystal growth source materials, MOCVD performs vapor phase epitaxy on a substrate via a thermal decomposition reaction to grow thin layers of single crystal material. To improve substrate temperature uniformity, the substrates are placed on a tray and assembled before the vapor phase epitaxy reaction.

[0003] Therefore, during the loading and unloading process of MOCVD equipment, the substrates to be reacted must be placed on a tray, assembled, and then placed in the reaction chamber. After the reaction is completed, the tray is removed, and the substrates are separated and placed separately for subsequent processes. Repeating these steps can continuously obtain substrates that have been processed by vapor phase epitaxy.

[0004] The common loading and unloading solution for current MOCVD equipment uses a glove box as a pre-workstation to ensure a relatively clean environment. During loading and unloading, substrates and trays are manually assembled and separated using a suction pen inside the glove box before loading and unloading. However, manual loading and unloading relies heavily on operator experience, carries the risk of human error, and results in low production efficiency. Summary of the Invention

[0005] In view of the problems in the prior art that the loading and unloading operations of MOCVD equipment rely on manual labor, and the manual operation efficiency is low and the error rate is high, the purpose of the present invention is to provide a loading and unloading system and method for MOCVD equipment, so as to at least partially solve the above problems.

[0006] To achieve the above object, the technical solution of the present invention is:

[0007] In a first aspect, the present invention provides a loading and unloading system for MOCVD equipment. When in use, the system is docked with the MOCVD equipment. The system can automatically combine and separate substrates and trays in an atmospheric environment through a loading functional area, an unloading functional area, a substrate transport robot arm, and a tray transport robot arm.

[0008] The loading functional area is provided with a substrate loading station, a tray loading station and a combination station. The substrate loading station is provided with a substrate loading box for loading substrates, the tray loading station is provided with a tray loading box for loading trays, the combination station is used to combine substrates and trays, and the combination station is provided with a detection device for detecting the combination state between the substrate and the tray;

[0009] The unloading functional area is provided with a separation station, a tray unloading station and a substrate unloading station. The separation station is used to separate the substrate from the tray, and the separation station is provided with a separation device for separating the substrate from the tray. The tray unloading station is provided with a tray unloading box for loading the tray, and the substrate unloading station is provided with a substrate unloading box for loading the substrate.

[0010] A substrate gripper for manipulating a substrate is mounted at the end of the substrate transport robot arm, and a tray gripper for manipulating a tray is mounted at the end of the tray transport robot arm. The substrate transport robot arm and the tray transport robot arm are integrated on the same robot drive mechanism, which includes a lifting mechanism and a rotating mechanism.

[0011] The host computer is electrically connected to the substrate transport robot arm, the tray transport robot arm, the detection device and the separation device.

[0012] In a preferred embodiment, the combined workstation achieves precise positioning of the tray through a dual positioning method of mechanical positioning and sensor positioning; the substrate gripper is a clamping gripper, and the clamping position is the side wall of the substrate to avoid direct contact with the front and back sides of the substrate; and the end of the substrate transport robot arm has a rotating shaft, and the substrate gripper is fixedly mounted on the rotating shaft.

[0013] In a preferred embodiment, the substrate gripper includes a loading gripper and a unloading gripper arranged away from each other, the loading gripper is a clamping gripper, and the unloading gripper is a clamping gripper, a vacuum adsorption gripper, a Bernoulli gripper or a supporting friction gripper.

[0014] In a preferred embodiment, the detection device includes a through-beam sensor, and the optical axis of the through-beam sensor is located above the top surface of the tray in the assembly station; the combination state between the substrate and the tray includes an accurate combination and an inaccurate combination. When the substrate and the tray are accurately combined, there is no interference between the optical axis and the substrate; when the substrate and the tray are inaccurately combined, the optical axis is blocked by the substrate; the host computer is used to judge the combination state between the substrate and the tray according to the on-off state of the optical axis.

[0015] In a preferred embodiment, the detection device includes a detection camera, which is used to photograph the combination station and obtain a detection image containing the outline of the substrate and the pallet. The host computer is used to judge the combination state between the substrate and the pallet based on the relative position relationship between the outline of the substrate and the outline of the pallet in the detection image.

[0016] In a preferred embodiment, the separation device is used to grab the substrate from the tray from the upper side, and the separation device includes a lifting mechanism fixedly installed in the separation station and a substrate grabbing mechanism fixedly installed on the output end of the lifting mechanism, wherein the substrate grabbing mechanism is a vacuum adsorption gripper or a Bernoulli gripper.

[0017] In a preferred embodiment, the system also includes a lateral filter unit and a top filter unit, the top filter unit is used to blow clean air from the upper side to the loading functional area and the unloading functional area, and the lateral filter unit blows clean air toward the loading functional area along the direction from the loading functional area to the unloading functional area.

[0018] In a preferred embodiment, the substrate transport robot arm and the tray transport robot arm both move linearly on a track, thereby completing the switching between the various workstations in the loading functional area and the unloading functional area.

[0019] In a preferred embodiment, the substrate loading station, the tray loading station, the assembly station, the separation station, the tray unloading station and the substrate unloading station are arranged around the track.

[0020] In a preferred embodiment, the substrate is made of silicon, sapphire or silicon carbide; and the tray is made of graphite or silicon carbide.

[0021] In a preferred embodiment, the system also includes a substrate calibration station and a pallet calibration station, wherein the substrate calibration station is provided with a substrate calibrator for locating the center of the substrate and its flat edge notch, and the pallet calibration station is provided with a pallet calibrator for locating the center of the pallet and its flat edge stop; wherein the substrate calibrator and the pallet calibrator are both electrically connected to the host computer.

[0022] In a second aspect, the present invention further provides a method for loading and unloading a MOCVD device, the method being applied to the system as described above, the method comprising the following steps:

[0023] In response to the start signal, the host computer sends a substrate loading instruction and a tray loading instruction to the substrate transport robot arm and the tray transport robot arm respectively, wherein the substrate transport robot arm takes out the substrate from the substrate loading box after executing the substrate loading instruction, and the tray transport robot arm takes out the tray from the tray loading box after executing the tray loading instruction;

[0024] The host computer sends a combination instruction to the tray transport robot arm and the substrate transport robot arm respectively, and the tray transport robot arm places the tray in the combination station after executing the combination instruction, and the substrate transport robot arm places the substrate in the tray in the combination station after executing the combination instruction;

[0025] The host computer sends a detection instruction to the detection device, and the detection device obtains a detection result indicating the assembly state between the substrate and the tray after executing the detection instruction;

[0026] The host computer determines whether the substrate and the tray are accurately assembled based on the detection result. If yes, the process proceeds to the next step. Otherwise, the host computer sends an adjustment instruction to the substrate transport robot arm and returns to the previous step after the adjustment instruction is executed. After the substrate transport robot arm executes the adjustment instruction, it repositions the substrate in the assembly station.

[0027] The host computer sends a feeding instruction to the tray transporting robot arm, and after executing the feeding instruction, the tray transporting robot arm sends the tray in the combination station into the MOCVD equipment;

[0028] In response to the discharge signal, the host computer sends a discharge instruction to the tray transport robot arm, and after executing the discharge instruction, the tray transport robot arm transports the tray from the MOCVD equipment to the separation station;

[0029] The host computer sends a separation instruction to the separation device, and the separation device picks up the epitaxially processed substrate from the tray after executing the separation instruction;

[0030] The host computer sends substrate unloading instructions and tray unloading instructions to the substrate transporting robot arm and the tray transporting robot arm, wherein, after executing the substrate unloading instruction, the substrate transporting robot arm takes the epitaxially processed substrate from the separation device and places it into the substrate unloading box; after executing the tray unloading instruction, the tray transporting robot arm takes the tray from the separation station and places it into the tray unloading box.

[0031] In a third aspect, the present invention further provides a method for loading and unloading materials for an MOCVD device, the method being applied to the system as described above, the method comprising the following steps:

[0032] In response to the start signal, the host computer sends a substrate loading instruction and a tray loading instruction to the substrate transport robot arm and the tray transport robot arm respectively, wherein, after executing the substrate loading instruction, the substrate transport robot arm takes out the substrate from the substrate loading box and places it into the substrate aligner, and after executing the tray loading instruction, the tray transport robot arm takes out the tray from the tray loading box and places it into the tray aligner;

[0033] The host computer sends calibration instructions to the substrate calibrator and the tray calibrator respectively. After executing the calibration instructions, the substrate calibrator performs a calibration operation on the substrate and sends the calibration result to the host computer. After executing the calibration instructions, the tray calibrator performs a calibration operation on the tray and sends the calibration result to the host computer.

[0034] The host computer sends a combination instruction to the tray transport robot arm and the substrate transport robot arm respectively according to the received calibration result, and the tray transport robot arm places the tray in the combination station after executing the combination instruction, and the substrate transport robot arm places the substrate in the tray in the combination station after executing the combination instruction;

[0035] The host computer sends a detection instruction to the detection device, and the detection device obtains a detection result indicating the assembly state between the substrate and the tray after executing the detection instruction;

[0036] The host computer determines whether the substrate and the tray are accurately assembled based on the detection result. If yes, the process proceeds to the next step. Otherwise, the host computer sends an adjustment instruction to the substrate transport robot arm and returns to the previous step after the adjustment instruction is executed. After the substrate transport robot arm executes the adjustment instruction, it repositions the substrate in the assembly station.

[0037] The host computer sends a feeding instruction to the tray transporting robot arm, and after executing the feeding instruction, the tray transporting robot arm sends the tray in the combination station into the MOCVD equipment;

[0038] In response to the discharge signal, the host computer sends a discharge instruction to the tray transport robot arm, and after executing the discharge instruction, the tray transport robot arm transports the tray from the MOCVD equipment to the separation station;

[0039] The host computer sends a separation instruction to the separation device, and the separation device picks up the epitaxially processed substrate from the tray after executing the separation instruction;

[0040] The host computer sends substrate unloading instructions and tray unloading instructions to the substrate transporting robot arm and the tray transporting robot arm, wherein, after executing the substrate unloading instruction, the substrate transporting robot arm takes the epitaxially processed substrate from the separation device and places it into the substrate unloading box; after executing the tray unloading instruction, the tray transporting robot arm takes the tray from the separation station and places it into the tray unloading box.

[0041] By adopting the above technical solution, the beneficial effect of the present invention is that the technical solution of the present invention can realize the placement, combination and separation of substrates and trays completely by a robotic arm, so that it can be applied to the loading and unloading operations of MOCVD equipment, realizing a mechanical replacement for manual loading and unloading, which not only improves efficiency but also avoids the disadvantage of unstable loading and unloading operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic diagram of the top view of the structure of the present invention;

[0043] Figure 2 This is a schematic diagram of the workstation distribution of the present invention;

[0044] Figure 3 This is a schematic diagram of the structure of the pallet gripper in the present invention;

[0045] Figure 4 Schematic diagram of the structure of the substrate gripper (clamping gripper) in Example 1 of the present invention;

[0046] Figure 5 Schematic diagram of the structure of the substrate gripper (Bernoulli gripper) in Example 1 of the present invention;

[0047] Figure 6 Schematic diagram of the structure of the substrate gripper (vacuum adsorption gripper) in Example 1 of the present invention;

[0048] Figure 7 This is a schematic diagram of the use (accurate combination) of the detection device in Example 1 of the present invention;

[0049] Figure 8 This is a schematic diagram of the use of the detection device in Example 1 of the present invention (not accurately assembled);

[0050] Figure 9 This is a schematic diagram of the use of the detection device in Example 2 of the present invention;

[0051] Figure 10 Schematic diagram of the structure of the substrate gripper in the third embodiment of the present invention;

[0052] Figure 11 Schematic diagram of the arrangement of the filter unit in the fourth embodiment of the present invention;

[0053] Figure 12 This is a schematic structural diagram of a 6-inch substrate and its tray in Example 5 of the present invention;

[0054] Figure 13 Schematic diagram of the process of loading and unloading method for MOCVD equipment in Example 6 of the present invention;

[0055] Figure 14 Schematic diagram of the process of the loading and unloading method for MOCVD equipment in Example 7 of the present invention.

[0056] In the figure: 1-loading functional area, 11-substrate loading box, 12-tray loading box, 13-detection device, 14-calibrator, 2-unloading functional area, 21-separation device, 22-tray unloading box, 23-substrate unloading box, 3-substrate transporting robot arm, 31-substrate gripper, 311-base plate, 312-movable clamping block, 313-fixed clamping block, 4-tray transporting robot arm, 41-tray gripper, 411-support plate, 412-rubber ring, 413-limiting block, 5-host computer, 6-bracket, 7-track, 8-lateral filter unit, 9-top filter unit. DETAILED DESCRIPTION

[0057] The following is a further description of specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is intended to facilitate understanding of the present invention and does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0058] It should be noted that, in the description of the present invention, the terms "up", "down", "left", "right", "front", "back", etc. indicating directions or positional relationships are based on the description of the structure of the present invention shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, it cannot be understood as a limitation on the present invention.

[0059] The "first" and "second" in this technical solution are only used to distinguish the same or similar structures, or corresponding structures with similar functions, and are not an arrangement of the importance of these structures, nor do they have any ranking, size comparison, or other meanings.

[0060] In addition, unless otherwise expressly specified or limited, the terms "installed" and "connected" should be understood broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two structures. Those skilled in the art can understand the specific meanings of the above terms in the present invention based on the overall principles of the present invention and the specific context of this solution.

[0061] Example 1

[0062] like Figure 1-2 As shown, an embodiment of the present invention provides a loading and unloading system for MOCVD equipment, which can be deployed in an atmospheric environment. When in use, the system is docked with the vacuum module of the MOCVD equipment. The system is used to clamp the substrate to be epitaxially processed and the tray from the loading position, combine them and then send them into the MOCVD equipment for epitaxial processing, then take the combination of the epitaxially processed substrate and the tray out of the MOCVD equipment, then separate the epitaxially processed substrate from the tray, and finally transport the epitaxially processed substrate and the tray to the unloading position respectively. The above actions are all controlled by the host computer to realize automated loading and unloading operations.

[0063] The substrate is a disc-shaped structure made of silicon, sapphire, or silicon carbide, typically with a notch (arc-shaped) or a flat-edge notch. The tray is made of graphite or silicon carbide and is also disc-shaped. Its top surface has a groove that matches the size and shape of the substrate. If the substrate has a flat-edge notch, the tray also has a flat-edge stop.

[0064] like Figure 1 As shown, the system generally includes a loading area 1, an unloading area 2, a substrate transport robot 3, a tray transport robot 4, and a host computer 5. Typically, the system also includes a support structure 6 to support the various functional components and their assembly within the system, and to facilitate installation and relocation of the system within the production line.

[0065] The loading function area 1 is equipped with a substrate loading station, a tray loading station and a combination station; the unloading function area 2 is equipped with a separation station, a tray unloading station and a substrate unloading station; the substrate transport robot 3 and the tray transport robot 4 are arranged between the loading function area 1 and the unloading function area 2 to facilitate the transport of substrates and trays between the two function areas.

[0066] In this embodiment, in order to facilitate the operation of the above-mentioned two types of manipulators, the system is also configured with a substrate transport manipulator 3 and a tray transport manipulator 4 that can move between the loading function area 1 and the unloading function area 2. In this way, the size requirements of the manipulators can be reduced, and the manipulators can be moved between various workstations by moving the manipulators. For example, the system includes two tracks 7 (for example, two tracks) laid at the middle position of the bracket 6. The two tracks 7 are parallel to each other and arranged opposite to each other. A manipulator drive mechanism is installed on the tracks 7, which includes a base, a rotating mechanism fixed to the base, and a lifting mechanism fixed to the rotating mechanism. The above-mentioned substrate transport manipulator 3 and tray transport manipulator 4 are both fixed to the output end of the lifting mechanism. In terms of movement, racks can be fixed on the two tracks 7, a motor can be fixed on the base, and a drive gear that meshes with the rack can be installed on the output shaft of the motor. In this way, by controlling the speed and rotation direction of the drive motor, the substrate transport manipulator 3 and tray transport manipulator 4 can be driven to reciprocate between the various workstations, ultimately achieving the transfer of the two types of manipulators between the various workstations. Among them, in the robot drive mechanism, the rotating mechanism is configured as a slewing bearing driven by a motor, and the lifting mechanism is configured as an electric push rod driven by a motor, or a hydraulic cylinder. The output end of the lifting mechanism is usually also fixed with a mounting base for supporting the substrate transport robot arm 3 and the tray transport robot arm 4.

[0067] Among them, in order to facilitate the robot arm to operate the substrate or tray in each station, the substrate loading station, tray loading station, assembly station, separation station, tray unloading station and substrate unloading station are specifically arranged around the area where the track 7 is located (hereinafter collectively referred to as the conveying area). Among them, the substrate loading station, tray loading station and assembly station belonging to the loading functional area 1 are arranged on the right half of the conveying area (the left and right directions referred to here are parallel to the track 7), and the separation station, tray unloading station and substrate unloading station belonging to the unloading functional area 2 are arranged on the left half of the conveying area. In addition, in order to facilitate loading and unloading and docking with MOCVD equipment, the substrate loading station, tray loading station, tray unloading station and substrate unloading station are arranged on the front side of the conveying area, and the rear side of the conveying area is used to dock the vacuum module of the MOCVD equipment (including the vacuum transmission loading part and the vacuum transmission unloading part), and the assembly station and separation station are arranged on the right side and the left side of the conveying area respectively.

[0068] A substrate gripper 31 for manipulating a substrate is installed at the end of the substrate transport robot arm 3 , and a tray gripper 41 for manipulating a tray is installed at the end of the tray transport robot arm 4 .

[0069] In this embodiment, the pallet gripper 41 is configured as a supporting friction gripper, that is, it carries out the pallet handling operation from the bottom side in a supporting manner, and the surface in contact with the pallet is provided with a friction structure for increasing friction to prevent the pallet from slipping. Figure 3 As shown, the pallet gripper 41 includes a support plate 411. The support plate is a flat structure that can be circular or rectangular, and is made of a material with a certain degree of rigidity and flatness, such as ceramic, carbon fiber, or aluminum alloy. Several (for example, three) rubber rings 412 are fixedly mounted on its top surface and evenly distributed around the center of the support plate 411. In addition, to further prevent the pallet from slipping, stoppers 413 are provided around one side of the top surface of the support plate 411.

[0070] In this embodiment, the substrate gripper 31 is configured as a clamping gripper, that is, the substrate is transported by grasping the edge of the substrate. Figure 4 As shown, the clamping gripper specifically includes a base plate 311 and a movable clamping block 312 and a fixed clamping block 313 mounted on one side of the bottom surface of the base plate 311. The base plate 311 can be circular, rectangular or a combination thereof, and can be made of a material with a certain rigidity and flatness, such as ceramic, carbon fiber or aluminum alloy. The movable clamping block 312 is slidably connected to the proximal end of the base plate 311 (the side for connecting to the end of the substrate transport robot 3), and there are two fixed clamping blocks 313 arranged at the distal end of the base plate 311, and the two fixed clamping blocks 313 are symmetrically arranged with respect to the sliding direction of the movable clamping block 312. In addition, the clamping gripper also includes a linear drive mechanism (not shown in the figure) fixedly mounted on the base plate 311 and used to drive the movement of the movable clamping block 312, such as an electric cylinder, a pneumatic cylinder or a hydraulic cylinder.

[0071] It is easy to understand that before the epitaxial processing, the substrate gripper 31 grabs the substrate from the top side, but after the epitaxial processing, the part of the substrate protruding from the tray is not obvious, which makes it difficult for the substrate gripper 31 to grab the substrate from the top side. Therefore, it is necessary to use a separation device to separate the epitaxially processed substrate from the tray from the top side. Thereafter, the substrate gripper 31 grabs the bottom side of the separated substrate. Therefore, when the substrate gripper 31 is configured as a clamping gripper, it is also necessary to configure the end of the substrate transport robot 3 with a rotating shaft, and the substrate gripper 31 is fixedly mounted on the rotating shaft, with the axis of the rotating shaft parallel to the plane of the substrate 311. With this arrangement, the substrate gripper 31 can be driven to flip by the rotation of the rotating shaft, so that the substrate can be grabbed from the top or bottom side, meeting the different requirements for grabbing postures at different workstations.

[0072] In other preferred embodiments, the substrate gripper 31 may also be a vacuum gripper or a Bernoulli gripper. Figure 5As shown, it includes a plate-shaped structural member made of materials with certain rigidity and flatness such as ceramics, carbon fiber or aluminum alloy. A plurality of air outlet holes are provided on the surface (working surface) of the structural member facing the substrate. When the working surface of the structural member is close to the substrate and ejects airflow, the substrate can be adsorbed according to the Bernoulli effect. The working surface of the structural member is usually provided with a plurality of pads for limiting the position of the substrate, such as rubber pads. The pads are arranged in a ring shape and only contact the 3mm portion of the front edge of the substrate, thereby preventing the substrate from slipping during the adsorption process while avoiding damage to the front of the substrate. For vacuum adsorption grippers, such as Figure 6 As shown, it also includes a structural member, on which a number of suction holes or suction nozzles (made of rubber) are arranged in a ring shape, and the suction holes or suction nozzles correspond to the range of 3mm from the edge of the substrate, thereby protecting the central part of the front side (i.e., the top surface) of the substrate. Among them, the vacuum adsorption gripper is usually only suitable for occasions where contact with the front side of the substrate is allowed.

[0073] For the substrate loading station, a platform for carrying a substrate loading box 11 is provided on the support 6, wherein a substrate loading box 11 for loading substrates is provided. The shape and structure of the substrate loading box 11 comply with the SEMI standard. Multiple substrates (usually 25 layers) can be stacked therein, and there is a gap between adjacent substrates for the substrate gripper 31 to extend therein. The substrate loading box 11 is a well-known technology and will not be described in detail in this embodiment.

[0074] For the tray loading station, a corresponding platform for supporting a tray loading cassette 12 is provided on the bracket 6. The tray loading cassette 12 is provided with a tray for loading trays. The shape and structure of the trays are adapted to the substrates they support. Its top surface is provided with a recess for placing the substrates. The depth of the recess is less than the thickness of the substrate, meaning that when a substrate is placed inside, it will partially protrude. The shape and structure of the tray loading cassette 12 are essentially the same as those of the substrate loading cassette 11. Multiple layers of trays can be placed within it, with a gap between adjacent layers for the tray gripper 41 to extend into. The tray loading cassette 12 is typically configured with 5-10 layers, for example, 10 layers, depending on the needs.

[0075] For the assembly station, the bracket 6 is also provided with a corresponding plate-shaped platform, on which at least two circumferentially arranged support blocks are provided. The top surfaces of the support blocks together form a bearing plane for placing the tray. The gaps between the support blocks are used for the tray gripper 41 at the end of the tray handling robot 4 to pass through, thereby realizing the tray handling operation from the bottom side. When the substrate and tray are combined, the tray handling robot 4 first removes the tray from the tray loading box 12 and then places the tray in the assembly station. The substrate handling robot 3 then removes the substrate from the substrate loading box 11 and then places the substrate in the tray in the assembly station (specifically, in the groove on its top surface), thereby completing the tray and substrate combination operation.

[0076] When performing the combination operation of the tray and the substrate, it is first necessary to locate the position of the tray. In this embodiment, the precise positioning of the tray is achieved through a dual positioning method of mechanical positioning and sensor positioning. The mechanical positioning can be configured as a three-claw or multi-claw chuck, that is, it is fixedly mounted on the platform in the combination station, and each "claw" is fixed with the above-mentioned support block. In terms of sensor positioning, it specifically includes a pressure sensor arranged on each support block, and whether the tray is in place is determined by detecting whether the pressure sensor has a value. When the tray is in place, the chuck can be moved to center the tray at the specified position.

[0077] Furthermore, the substrate handling robot 3 is required to align the center of the substrate with the center of the tray, minimizing the distance between the substrate and the tray. After releasing the substrate gripper 31, the substrate will fall under its own weight, landing in the tray's groove. It's easy to understand that the substrate doesn't always fit perfectly into the tray during assembly. Therefore, a detection device 13 is provided on the platform in the assembly station to detect the state of the substrate-to-tray assembly. This state can include accurate or inaccurate assembly, which is detected by the detection device 13.

[0078] In this embodiment, the configuration detection device 13 includes a through-beam sensor having a transmitter and a receiver, which are arranged opposite to each other and fixedly mounted on the platform in the assembly station, and the optical axis of the through-beam sensor is located above the top surface of the tray in the assembly station. Usually, there is a certain gap between the optical axis and the top surface of the tray in the assembly station, such as Figure 7-8As shown, the gap is suitable for: when the substrate and the tray are accurately combined (i.e., when the substrate completely falls into the groove of the tray), the optical axis is located on the upper side of the substrate, i.e., the optical axis is not blocked, and the through-beam sensor is in a signal-on state; when the substrate and the tray are not accurately combined (i.e., when the substrate only partially falls into the groove of the tray), the substrate is in a tilted state and has a higher height position, resulting in the optical axis being blocked by the substrate, and the through-beam sensor is in a signal-off state. Based on this, the host computer 5 connected to the detection device 13 can judge the combination state between the substrate and the tray based on the on-off state of the optical axis. More preferably, multiple through-beam sensors are configured, and the optical axes are staggered and converge at one point (the intersection point is above the center point of the tray). In this way, no matter which direction the substrate is tilted, the corresponding optical axis is blocked. Only when all the optical axes are in a conductive state can the substrate and the tray be considered to be accurately combined.

[0079] After the substrate and the tray are combined, the tray (carrying the substrate) can be transported into the MOCVD equipment by the tray transport robot 4 for epitaxial processing.

[0080] The separation station is similarly equipped with a plate-shaped platform and a plurality of support blocks mounted on the platform to support the tray. The separation station is specifically used to separate the substrate from the tray, and a separation device 21 is provided in the corresponding separation station to separate the substrate from the tray. During the separation operation, the tray transport robot 4 first removes the tray from the MOCVD equipment and places it in the separation station. The separation device 21 then grabs the substrate from the tray from the upper side after epitaxial processing in the MOCVD equipment. It is easy to understand that, like the assembly station, the separation station also typically achieves precise positioning of the tray through a dual positioning method of mechanical positioning and sensor positioning.

[0081] In this embodiment, the separation device 21 includes a lifting mechanism fixedly mounted in the separation station (specifically, on the support 6 or on a platform within the separation station), and a substrate gripping mechanism fixedly mounted at the output end of the lifting mechanism. The lifting mechanism is configured as a vertically arranged linear drive mechanism, such as an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder, secured by a mounting frame. The substrate gripping mechanism is configured as either the aforementioned vacuum gripper or a Bernoulli gripper. This arrangement eliminates the need to consider whether the portion of the substrate edge protruding from the tray after epitaxial processing is still suitable for gripping.

[0082] In addition, the tray unloading station is equipped with a tray unloading box 22 for loading trays (transferred from the separation station), and the substrate unloading station is equipped with a substrate unloading box 23 for loading substrates (substrates that have undergone epitaxial processing). The shape and structure of the tray unloading box 22 and the substrate unloading box 23, as well as their arrangement on the bracket 6, are consistent with those of the loading functional area and will not be described in detail in this embodiment.

[0083] The host computer 5 is electrically connected to the substrate handling robot 3 (including the substrate gripper 31), the tray handling robot 4, the detection device 13, and the separation device 21 via cables. The host computer 5 is used to issue control commands to the connected devices or equipment to achieve operations such as the combination and detection of the substrate and tray, the subsequent delivery of the combined substrate to the MOCVD equipment, the removal of the tray from the MOCVD equipment, the separation of the tray and substrate, and the unloading of the substrate. The specific operation process will be described in detail in the subsequent embodiments.

[0084] Example 2

[0085] In this embodiment, the detection device 13 can also be configured as a detection camera, which is arranged at a high position of the assembly station, with its field of view facing downward and used to shoot the assembly station, thereby obtaining a detection image including the outline of the substrate and the outline of the tray, such as Figure 9 shown.

[0086] The host computer 5 is connected to the detection camera via a cable. On the one hand, it is used to send shooting instructions to the detection camera, and on the other hand, it is used to process the detection image. The host computer 5 obtains the outline of the substrate and the outline of the tray from the detection image through the contour recognition algorithm it carries, and judges the combination state between the substrate and the tray based on the relative position relationship between the outline of the substrate and the outline of the tray in the detection image. That is, after extracting the outline of the substrate and the outline of the tray, the center of the substrate is first calculated based on the outline of the substrate and the center of the tray is calculated based on the outline of the tray. Secondly, when the substrate and the tray are concentric (the center distance is less than or equal to the threshold), it is determined that the tray and the substrate are accurately combined; when the substrate and the tray are not concentric (the center distance is greater than the threshold), it is determined that the tray and the substrate are not accurately combined.

[0087] Of course, in other preferred embodiments, the detection devices in this embodiment and the above embodiments may be used simultaneously, and the two groups may verify each other, thereby improving the accuracy of detection.

[0088] Example 3

[0089] It is understandable that in the solutions disclosed in the above embodiments, the substrate gripper 31 needs to be flipped under the drive of the rotating shaft so as to be suitable for the combination operation and separation operation between the substrate and the tray.

[0090] In this embodiment, the substrate grippers 31 include a loading gripper and a unloading gripper arranged in opposite directions, i.e., spaced 180° apart. These grippers are used for substrate handling operations in the loading and unloading functional areas, respectively. The loading gripper is located on the side opposite the bottom surface and is used to grasp substrates from above. It can be configured as a clamping gripper, a vacuum gripper, or a Bernoulli gripper. The unloading gripper is located on the side opposite the top surface and is used to grasp substrates from below. In addition to clamping grippers, vacuum grippers, and Bernoulli grippers, it can also be the aforementioned support friction gripper.

[0091] like Figure 10 As shown, the loading gripper is configured as a clamping gripper, and the unloading gripper is configured as a supporting friction gripper.

[0092] Such an arrangement makes it unnecessary to flip the substrate gripper 31, and only the position of the substrate gripper 31 needs to be adjusted so that: in the loading functional area, the substrate is gripped from above by the loading gripper, and in the unloading functional area, the substrate is gripped or supported from below by the unloading gripper.

[0093] Example 4

[0094] Based on the above embodiment, the configuration system of this embodiment also includes a side filter unit 8 and a top filter unit 9. Both groups are fixed based on the bracket 6. The structures and functions of the two are the same. The only difference is the working parameters and the installation position. Taking the side filter unit 8 as an example, it includes air filters and fans arranged in sequence according to the direction of air flow. The air intake end of the fan faces the air filter. Figure 11 shown.

[0095] Among them, the top filter unit 9 is used to blow clean air to the upper material function area 1 and the lower material function area 2 from the upper side at the same time, and the side filter unit 8 blows clean air toward the upper material function area 1 along the direction from the upper material function area 1 to the lower material function area 2 (from right to left).

[0096] This arrangement prevents side reaction particles attached to the tray and substrate after epitaxial processing from diffusing into the loading functional area 1 , thereby protecting the substrate and tray in the loading functional area 1 .

[0097] Example 5

[0098] The substrate is generally 6 inches or 8 inches, wherein the edge of the 6-inch substrate has a flat edge notch, and the edge of the 8-inch substrate has an arc-shaped notch. Figure 12As shown in the figure, for a 6-inch substrate, the corresponding groove on the top surface of the tray also has a flat-edge stop. Therefore, when assembling, not only must the 6-inch substrate be concentric with the tray, but the 6-inch substrate must also maintain a specific angle (with the notch on the substrate aligned with the stop on the tray groove) to fully place it in the tray groove and achieve accurate assembly. For an 8-inch substrate, the corresponding groove on the top surface of the tray is a complete circle, so the 8-inch substrate only needs to keep its center aligned with the center of the tray.

[0099] Therefore, when the substrate is a 6-inch substrate, it is also necessary to add a calibration station to the system. A calibrator 14 is provided in the calibration station. The calibrator 14 is used to perform calibration operations on the substrate and the tray. The calibration content includes finding the center and flat edge notch of the substrate, and finding the center and flat edge stop of the tray. It can be seen that the calibration operation on the substrate and the calibration operation on the tray are highly similar, so a common calibrator can be used for the calibration operation. In this embodiment, a common wafer calibrator can be selected. The wafer calibrator is fixedly mounted on the platform in the combination station, that is, the calibration station and the combination station share a platform. The structure and principle of the calibrator are well-known technologies and will not be repeated in this embodiment. Of course, in other embodiments, two calibrators can also be arranged, namely a substrate calibrator for locating the center of the substrate and the flat edge notch on it, and a tray calibrator for locating the center of the tray and the flat edge stop on it.

[0100] Among them, the calibrator 14 is connected to the host computer 5 through a cable. After the calibrator 14 calibrates the substrate (or tray), the center of the substrate (or tray) and the position of the flat edge notch (or flat edge stop) are determined and facing the specified direction. At this time, the host computer 5 can control the tray transporting robot 4 to transfer the tray from the calibrator 14 to the assembly station, and control the substrate transporting robot 3 to transfer the substrate to the tray in the assembly station. Since the center of the substrate (or tray) and the flat edge notch (or flat edge stop) are determined and meet the requirements before transportation, the substrate will be accurately combined with the tray after transportation (that is, in the assembly station).

[0101] Example 6

[0102] The embodiment of the present invention provides a method for loading and unloading materials for MOCVD equipment, which is applied to the systems disclosed in embodiments 1 to 4. Figure 13 As shown, the method specifically includes the following steps:

[0103] Step S1. In response to the start signal, the host computer 5 sends a substrate loading instruction and a tray loading instruction to the substrate transport robot 3 and the tray transport robot 4 respectively;

[0104] The start signal may be sent manually (or by a terminal) to the upper computer 5 , and may be sent in the form of a keystroke or an instruction.

[0105] The substrate transport robot 3 takes out the substrate from the substrate loading box 11 after executing the substrate loading instruction, and the tray transport robot 4 takes out the tray from the tray loading box 12 after executing the tray loading instruction.

[0106] Step S2. The host computer 5 sends a combination instruction to the tray transport robot 4 and the substrate transport robot 3 respectively;

[0107] The tray transport robot 4 places the tray in the assembly station after executing the assembly instruction, and the substrate transport robot 3 places the substrate in the tray in the assembly station after executing the assembly instruction.

[0108] It is understood that the combination command is executed sequentially, namely, by the tray transport robot 4 and then by the substrate transport robot 3. In specific implementations, a time delay can be set; on the other hand, a sensor (such as a pressure sensor) can be installed in the combination station. This means that the tray transport robot 4 executes the combination command first, and when the pressure value detected by the sensor changes from zero to a certain value (the weight of the tray), the substrate transport robot 3 then executes the combination command.

[0109] Step S3. The host computer 5 sends a detection instruction to the detection device 13;

[0110] After executing the detection instruction, the detection device 13 obtains a detection result indicating the assembly state between the substrate and the tray, and sends the detection result to the host computer 5 .

[0111] Step S4. The host computer 5 determines whether the substrate and the tray are correctly assembled based on the received detection results. If so, it proceeds to the next step. Otherwise, it sends an adjustment instruction to the substrate transport robot 3 and returns to the previous step after the adjustment instruction is executed.

[0112] After the substrate transport robot arm 3 executes the adjustment instruction, it repositions the substrate in the assembly station.

[0113] Step S5. The host computer 5 sends a feeding instruction to the pallet transport robot 4;

[0114] After executing the feeding instruction, the tray transport robot arm 4 transports the tray (carrying the substrate) in the assembly station into the MOCVD equipment, and the MOCVD equipment performs epitaxial processing.

[0115] Step S6. In response to the discharge signal, the host computer 5 sends a discharge instruction to the pallet transport robot 3;

[0116] The discharge signal is associated with the shutdown action of the MOCVD device, or the discharge signal is associated with the vacuum module of the MOCVD device, and the discharge signal is issued when the sealed door of the vacuum module is opened.

[0117] Among them, after executing the discharge instruction, the tray transport robot arm 3 transports the tray from the MOCVD equipment to the separation station.

[0118] Step S7. The host computer 5 sends a separation instruction to the separation device 21;

[0119] After executing the separation instruction, the separation device 21 picks up the epitaxially processed substrate from the tray to a set height.

[0120] Step S8. The host computer 5 sends a substrate unloading instruction and a tray unloading instruction to the substrate transport robot 3 and the tray transport robot 4;

[0121] After executing the substrate unloading instruction, the substrate handling robot 3 takes the epitaxially processed substrate from the separation device 21 and places it into the substrate unloading box 23. Moreover, after the substrate handling robot 3 grabs the substrate in the separation station, the separation device 21 releases the substrate.

[0122] Among them, after executing the tray unloading instruction, the tray transport robot arm 4 takes the tray from the separation station and puts it into the tray unloading box 22.

[0123] It is understandable that in step S8 , there is no sequential relationship between the two actions of the substrate transport robot 3 executing the substrate unloading instruction and the tray transport robot 4 executing the tray unloading instruction, and both actions can be executed synchronously or asynchronously.

[0124] By repeating the process from step S1 to step S8, loading and unloading services can be continuously provided for the substrate epitaxial processing step.

[0125] Example 7

[0126] The embodiment of the present invention also provides a method for loading and unloading materials for MOCVD equipment, the difference being that the method is applied to the system disclosed in the fifth embodiment, that is, applied to the loading and unloading materials for epitaxial processing of 6-inch substrates, such as Figure 14 As shown, the method includes the following steps:

[0127] Step S11. In response to the start signal, the host computer 5 sends a substrate loading instruction and a tray loading instruction to the substrate transport robot 3 and the tray transport robot 4 respectively;

[0128] The start signal may be sent manually (or by a terminal) to the upper computer 5 , and may be sent in the form of a keystroke or an instruction.

[0129] Among them, after executing the substrate loading instruction, the substrate transport robot arm 3 takes out the substrate from the substrate loading box 11 and puts it into the substrate calibrator. After executing the tray loading instruction, the tray transport robot arm 4 takes out the tray from the tray loading box 12 and puts it into the tray calibrator.

[0130] Step S12: The host computer 5 sends calibration instructions to the substrate calibrator and the tray calibrator respectively;

[0131] After executing the calibration command, the substrate calibrator performs a calibration operation on the substrate and sends the calibration result to the host computer 5. After executing the calibration command, the tray calibrator performs a calibration operation on the tray and sends the calibration result to the host computer 5. For the substrate, the calibration result includes the center position of the substrate and the orientation of the flat edge notch; for the tray, the calibration result includes the center position of the tray and the orientation of the flat edge stop.

[0132] Step S13. The host computer sends a combination instruction to the tray transport robot 4 and the substrate transport robot 3 respectively according to the received calibration results;

[0133] Among them, after executing the combination instruction, the tray transport robot arm 4 transports the tray from the tray calibrator to the combination station, and after executing the combination instruction, the substrate transport robot arm 3 transports the substrate from the substrate calibrator and places it in the tray in the combination station.

[0134] The combination instructions are executed sequentially: tray transport robot 4 executes the instruction, followed by substrate transport robot 3. In practice, a time delay can be set, and a sensor (e.g., a pressure sensor) can be installed in the combination station. This means that tray transport robot 4 executes the combination instruction first, and when the pressure detected by the sensor changes from zero to a certain value (the weight of the tray), the substrate transport robot 3 executes the combination instruction.

[0135] It is understood that when both a substrate calibrator and a tray calibrator are present in the calibration station, the substrate loading instructions and tray loading instructions can be executed simultaneously. However, when only one common calibrator is present in the calibration station, the host computer 5 first sends the tray loading instruction, tray calibration instruction, and assembly instruction to the tray transport robot 4. The host computer then sends the substrate loading instruction, substrate calibration instruction, and assembly instruction to the substrate transport robot 3, thereby completing the substrate and tray loading, calibration, and assembly operations.

[0136] Step S14. The host computer 5 sends a detection instruction to the detection device 13;

[0137] After executing the detection instruction, the detection device 13 obtains a detection result indicating the assembly state between the substrate and the tray, and sends the detection result to the host computer 5 .

[0138] Step S15. The host computer 5 determines whether the substrate and the tray are correctly assembled based on the received detection results. If so, it proceeds to the next step. Otherwise, it sends an adjustment instruction to the substrate transport robot 3 and returns to the previous step after the adjustment instruction is executed.

[0139] After the substrate transport robot arm 3 executes the adjustment instruction, it repositions the substrate in the assembly station.

[0140] Step S16: The host computer 5 sends a feeding instruction to the pallet transport robot 4;

[0141] After executing the feeding instruction, the tray transport robot arm 4 transports the tray (carrying the substrate) in the assembly station into the MOCVD equipment, and the MOCVD equipment performs epitaxial processing.

[0142] Step S17. In response to the discharge signal, the host computer 5 sends a discharge instruction to the pallet transport robot 3;

[0143] The discharge signal is associated with the shutdown action of the MOCVD device, or the discharge signal is associated with the vacuum module of the MOCVD device, and the discharge signal is issued when the sealed door of the vacuum module is opened.

[0144] Among them, after executing the discharge instruction, the tray transport robot arm 3 transports the tray from the MOCVD equipment to the separation station.

[0145] Step S18. The host computer 5 sends a separation instruction to the separation device 21;

[0146] After executing the separation instruction, the separation device 21 picks up the epitaxially processed substrate from the tray to a set height.

[0147] Step S19. The host computer 5 sends a substrate unloading instruction and a tray unloading instruction to the substrate transport robot 3 and the tray transport robot 4;

[0148] After executing the substrate unloading instruction, the substrate handling robot 3 takes the epitaxially processed substrate from the separation device 21 and places it into the substrate unloading box 23. Moreover, after the substrate handling robot 3 grabs the substrate in the separation station, the separation device 21 releases the substrate.

[0149] Among them, after executing the tray unloading instruction, the tray transport robot arm 4 takes the tray from the separation station and puts it into the tray unloading box 22.

[0150] It is understandable that in step S19 , there is no sequential relationship between the two actions of the substrate transport robot 3 executing the substrate unloading instruction and the tray transport robot 4 executing the tray unloading instruction, and both actions can be executed synchronously or asynchronously.

[0151] By repeating the process of step S11 to step S19, loading and unloading services can be continuously provided for the substrate epitaxial processing step.

[0152] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.

Claims

1. A method for loading and unloading MOCVD equipment, characterized in that: The method is applied to the loading and unloading system of MOCVD equipment. The system can automatically realize the combination and separation of substrates and trays in an atmospheric environment through the loading functional area, the unloading functional area, the substrate transporting robot arm, the tray transporting robot arm, and the host computer. The loading functional area is provided with a substrate loading station, a tray loading station and a combination station. The substrate loading station is provided with a substrate loading box for loading substrates, the tray loading station is provided with a tray loading box for loading trays, the combination station is used to combine substrates and trays, and the combination station is provided with a detection device for detecting the combination state between the substrate and the tray; The unloading functional area is provided with a separation station, a tray unloading station and a substrate unloading station. The separation station is used to separate the substrate from the tray, and the separation station is provided with a separation device for separating the substrate from the tray. The tray unloading station is provided with a tray unloading box for loading the tray, and the substrate unloading station is provided with a substrate unloading box for loading the substrate. A substrate gripper for manipulating a substrate is mounted at the end of the substrate transport robot arm, and a tray gripper for manipulating a tray is mounted at the end of the tray transport robot arm. The substrate transport robot arm and the tray transport robot arm are integrated on the same robot drive mechanism, which includes a lifting mechanism and a rotating mechanism. Wherein, the host computer is electrically connected to the substrate transport robot arm, the tray transport robot arm, the detection device and the separation device; The method comprises the following steps: In response to the start signal, the host computer sends a substrate loading instruction and a tray loading instruction to the substrate transport robot arm and the tray transport robot arm respectively, wherein the substrate transport robot arm takes out the substrate from the substrate loading box after executing the substrate loading instruction, and the tray transport robot arm takes out the tray from the tray loading box after executing the tray loading instruction; The host computer sends a combination instruction to the tray transport robot arm and the substrate transport robot arm respectively, and the tray transport robot arm places the tray in the combination station after executing the combination instruction, and the substrate transport robot arm places the substrate in the tray in the combination station after executing the combination instruction; The host computer sends a detection instruction to the detection device, and the detection device obtains a detection result indicating the assembly state between the substrate and the tray after executing the detection instruction; The host computer determines whether the substrate and the tray are accurately assembled based on the detection result. If yes, the process proceeds to the next step. Otherwise, the host computer sends an adjustment instruction to the substrate transport robot arm and returns to the previous step after the adjustment instruction is executed. After the substrate transport robot arm executes the adjustment instruction, it repositions the substrate in the assembly station. The host computer sends a feeding instruction to the tray transporting robot arm, and after executing the feeding instruction, the tray transporting robot arm sends the tray in the combination station into the MOCVD equipment; In response to the discharge signal, the host computer sends a discharge instruction to the tray transport robot arm, and after executing the discharge instruction, the tray transport robot arm transports the tray from the MOCVD equipment to the separation station; The host computer sends a separation instruction to the separation device, and the separation device picks up the epitaxially processed substrate from the tray after executing the separation instruction; The host computer sends substrate unloading instructions and tray unloading instructions to the substrate transporting robot arm and the tray transporting robot arm, wherein, after executing the substrate unloading instruction, the substrate transporting robot arm takes the epitaxially processed substrate from the separation device and places it into the substrate unloading box; after executing the tray unloading instruction, the tray transporting robot arm takes the tray from the separation station and places it into the tray unloading box.

2. The method according to claim 1, wherein: The combined workstation achieves precise positioning of the tray through dual positioning methods of mechanical positioning and sensor positioning; the substrate gripper is a clamping gripper, and the clamping position is the side wall of the substrate to avoid direct contact with the front and back sides of the substrate; and the end of the substrate transport robot arm has a rotating shaft, and the substrate gripper is fixedly installed on the rotating shaft.

3. The method according to claim 1, wherein: The substrate gripper includes a loading gripper and a unloading gripper that are arranged away from each other. The loading gripper is a clamping gripper, and the unloading gripper is a clamping gripper, a vacuum adsorption gripper, a Bernoulli gripper or a supporting friction gripper.

4. The method according to claim 1, wherein: The detection device includes a through-beam sensor, the optical axis of which is located above the top surface of the tray in the assembly station; the combination state between the substrate and the tray includes accurate combination and inaccurate combination. When the substrate and the tray are accurately combined, there is no interference between the optical axis and the substrate; when the substrate and the tray are inaccurately combined, the optical axis is blocked by the substrate; the host computer is used to judge the combination state between the substrate and the tray based on the on-off state of the optical axis.

5. The method according to claim 1, wherein: The detection device includes a detection camera, which is used to photograph the combination station and obtain a detection image containing the outline of the substrate and the tray. The host computer is used to judge the combination state between the substrate and the tray based on the relative position relationship between the outline of the substrate and the outline of the tray in the detection image.

6. The method according to claim 1, wherein: The separation device is used to grab the substrate from the tray from the upper side. The separation device includes a lifting mechanism fixedly installed in the separation station and a substrate grabbing mechanism fixedly installed on the output end of the lifting mechanism, wherein the substrate grabbing mechanism is a vacuum adsorption gripper or a Bernoulli gripper.

7. The method according to claim 1, wherein: The system also includes a lateral filter unit and a top filter unit. The top filter unit is used to blow clean air from the upper side to the loading functional area and the unloading functional area. The lateral filter unit blows clean air toward the loading functional area along the direction from the loading functional area to the unloading functional area.

8. The method according to claim 1, wherein: The substrate transport robot arm and the tray transport robot arm both move linearly on the track, thereby completing the switching between the various workstations in the loading function area and the unloading function area.

9. The method according to claim 8, characterized in that: The substrate loading station, the tray loading station, the assembly station, the separation station, the tray unloading station and the substrate unloading station are arranged around the track.

10. The method according to claim 1, wherein: The substrate is made of silicon, sapphire or silicon carbide; the tray is made of graphite or silicon carbide.

11. A method for loading and unloading MOCVD equipment, characterized in that: The method is applied to the loading and unloading system of MOCVD equipment. The system can automatically realize the combination and separation of substrates and trays in an atmospheric environment through the loading functional area, the unloading functional area, the substrate transporting robot arm, the tray transporting robot arm, and the host computer. The loading functional area is provided with a substrate loading station, a tray loading station and a combination station. The substrate loading station is provided with a substrate loading box for loading substrates, the tray loading station is provided with a tray loading box for loading trays, the combination station is used to combine substrates and trays, and the combination station is provided with a detection device for detecting the combination state between the substrate and the tray; The unloading functional area is provided with a separation station, a tray unloading station and a substrate unloading station. The separation station is used to separate the substrate from the tray, and the separation station is provided with a separation device for separating the substrate from the tray. The tray unloading station is provided with a tray unloading box for loading the tray, and the substrate unloading station is provided with a substrate unloading box for loading the substrate. A substrate gripper for manipulating a substrate is mounted at the end of the substrate transport robot arm, and a tray gripper for manipulating a tray is mounted at the end of the tray transport robot arm. The substrate transport robot arm and the tray transport robot arm are integrated on the same robot drive mechanism, which includes a lifting mechanism and a rotating mechanism. Wherein, the host computer is electrically connected to the substrate transport robot arm, the tray transport robot arm, the detection device and the separation device; The system further includes a substrate calibration station and a tray calibration station. The substrate calibration station is provided with a substrate calibrator for locating the center of the substrate and the flat edge notch thereof. The tray calibration station is provided with a tray calibrator for locating the center of the tray and the flat edge stop thereof. The substrate calibrator and the tray calibrator are both electrically connected to the host computer. The method comprises the following steps: In response to the start signal, the host computer sends a substrate loading instruction and a tray loading instruction to the substrate transport robot arm and the tray transport robot arm respectively, wherein, after executing the substrate loading instruction, the substrate transport robot arm takes out the substrate from the substrate loading box and places it into the substrate aligner, and after executing the tray loading instruction, the tray transport robot arm takes out the tray from the tray loading box and places it into the tray aligner; The host computer sends calibration instructions to the substrate calibrator and the tray calibrator respectively. After executing the calibration instructions, the substrate calibrator performs a calibration operation on the substrate and sends the calibration result to the host computer. After executing the calibration instructions, the tray calibrator performs a calibration operation on the tray and sends the calibration result to the host computer. The host computer sends a combination instruction to the tray transport robot arm and the substrate transport robot arm respectively according to the received calibration result, and the tray transport robot arm places the tray in the combination station after executing the combination instruction, and the substrate transport robot arm places the substrate in the tray in the combination station after executing the combination instruction; The host computer sends a detection instruction to the detection device, and the detection device obtains a detection result indicating the assembly state between the substrate and the tray after executing the detection instruction; The host computer determines whether the substrate and the tray are accurately assembled based on the detection result. If yes, the process proceeds to the next step. Otherwise, the host computer sends an adjustment instruction to the substrate transport robot arm and returns to the previous step after the adjustment instruction is executed. After the substrate transport robot arm executes the adjustment instruction, it repositions the substrate in the assembly station. The host computer sends a feeding instruction to the tray transporting robot arm, and after executing the feeding instruction, the tray transporting robot arm sends the tray in the combination station into the MOCVD equipment; In response to the discharge signal, the host computer sends a discharge instruction to the tray transport robot arm, and after executing the discharge instruction, the tray transport robot arm transports the tray from the MOCVD equipment to the separation station; The host computer sends a separation instruction to the separation device, and the separation device picks up the epitaxially processed substrate from the tray after executing the separation instruction; The host computer sends substrate unloading instructions and tray unloading instructions to the substrate transporting robot arm and the tray transporting robot arm, wherein, after executing the substrate unloading instruction, the substrate transporting robot arm takes the epitaxially processed substrate from the separation device and places it into the substrate unloading box; after executing the tray unloading instruction, the tray transporting robot arm takes the tray from the separation station and places it into the tray unloading box.

Images