Process for improving the yield of silicon micro-powder for TFT-LCD glass substrate

Abstract

The application discloses a process for improving the finished product rate of silicon powder for TFT-LCD glass substrates and relates to the technical field of silicon powder processing. The process for improving the finished product rate of silicon powder for TFT-LCD glass substrates is characterized in that an iron-removing assembly is arranged, when mixed quartz powder is subjected to iron-removing operation, iron contained in the mixed quartz powder can be subjected to adsorption treatment through cooperation of an electromagnet mechanism, automatic output operation of the iron is completed through a running cylindrical cleaning pipe frame, and through cooperation of a positioning ring, an arc-shaped connecting plate and an arc-shaped material shifting plate, the arc-shaped connecting plate and the arc-shaped material shifting plate can be driven to run when the cylindrical cleaning pipe frame runs, the mixed quartz powder is conveyed into a discharging frame, the maintenance convenience of the equipment is improved, and the iron-removing effect of the subsequent mixed quartz powder is ensured.

Description

Technical Field

[0001] This invention relates to the field of silicon micropowder processing technology, specifically to a process for improving the yield of silicon micropowder for TFT-LCD glass substrates. Background Technology

[0002] TFT-LCD is currently the mainstream in the field of liquid crystal flat panel displays, and liquid crystal glass substrate is the most important upstream raw material for TFT-LCD. In TFT glass substrate, SiO2 is an important structural element, accounting for 58% to 63%. It can reduce the thermal expansion coefficient of glass and improve the thermal stability, chemical stability, softening temperature, hardness, and mechanical strength of glass. Referring to Chinese patent application number "201811029548.3" "A method for preparing silicon micro powder for TFT-LCD glass substrate", this patent solves the problem that the unique particle size composition of existing quartz powder raw materials, which is ≤3% for particles larger than 106μm, ≥75% for particles between 106 and 45μm, and D50 = 57 to 62μm, leads to a low yield of qualified products and produces 30% to 40% fine powder, greatly reducing the added value. However, the iron contained in the quartz powder raw material is still difficult to remove, which affects the yield of silicon micro powder. In response, we propose a process to improve the yield of silicon micro powder for TFT-LCD glass substrate to solve the above problems. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a process for improving the yield of silicon micropowder for TFT-LCD glass substrates, solving the problem that the iron content contained in the quartz powder raw material is difficult to remove, which affects the yield of silicon micropowder.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: A process for improving the yield of silicon micropowder for TFT-LCD glass substrates specifically includes the following steps;

[0005] S1. Select quartz sand particles with a particle size distribution of 0.1 to 0.4 mm; use a ball mill for grinding, and add a grinding aid and dispersant during the grinding process to obtain mixed quartz powder;

[0006] S2. The mixed quartz powder is sieved to remove iron, and then classified by an air classifier to obtain silicon micro powder for glass substrates.

[0007] The screening device in S2 includes an organic body. A conical hopper is fixed on one side of the top surface of the body, and bottom supports are fixed on both sides of the bottom of the body. An adsorption and iron removal component is provided inside the body.

[0008] The adsorption and iron removal component includes an electromagnet mechanism. A hollow connecting rod is fixedly installed at the end of the electromagnet mechanism. The electromagnet mechanism and the hollow connecting rod are fixedly installed inside the machine body. A connecting wire is provided at the end of the electromagnet mechanism, and the end of the connecting wire passes through the interior of the hollow connecting rod. The installation position of the electromagnet mechanism is directly below the conical feeding hopper. A feeding component is provided below the conical feeding hopper. A sealing partition plate is fixed inside the machine body. An annular feeding port is fixed inside the sealing partition plate. The electromagnet mechanism passes through the interior of the annular feeding port. A cleaning feeding component is provided on the outside of the electromagnet mechanism. A discharge component is provided at the bottom inside the machine body. A waste slag collection rack is fixed on one side inside the machine body. A waste slag discharging rack is fixed at the bottom of the waste slag collection rack.

[0009] Preferably, the cleaning and feeding assembly includes a cylindrical cleaning tube frame, which is rotatably sleeved on the outside of the electromagnet mechanism and the hollow connecting rod. A driving assembly is provided between the outside of the machine body and the cylindrical cleaning tube frame. A positioning ring is fixedly sleeved at the end of the cylindrical cleaning tube frame. Several arc-shaped connecting plates are fixedly installed on the outside of the positioning ring, and arc-shaped material-pulling plates are rotatably installed on the outside of each of the arc-shaped connecting plates. A limiting baffle adapted to the arc-shaped material-pulling plates is provided above the unloading assembly.

[0010] Preferably, the drive assembly includes a drive motor, which is fixed to the outside of the machine body, and a drive track is rotatably connected between the output end of the drive motor and the end of the cylindrical cleaning pipe frame.

[0011] Preferably, each of the arc-shaped material feeding plates has a rotating shaft rotatably mounted at its end, and the arc-shaped material feeding plates are rotatably mounted on the outside of the corresponding arc-shaped connecting plate through the rotating shaft at their ends, and each of the rotating shafts has a return spring sleeved at its end.

[0012] Preferably, the feeding assembly includes a feeding frame, which is fixed inside the machine body and is installed directly above the electromagnet mechanism. The feeding frame has an inclined arc-shaped feeding groove inside, and several feeding ports are opened through the arc-shaped feeding groove. The limiting baffle is fixedly installed on the top surface of the feeding frame and its installation position corresponds to the arc-shaped feeding plate.

[0013] Preferably, the sealing separator is installed in the middle of the inner side of the machine body, and the waste collection rack is installed directly below the hollow connecting rod.

[0014] Preferably, the discharge assembly includes a bottom suction pipe, which is fixed to the lower inner side of the machine body. The bottom of the bottom suction pipe has several symmetrically arranged suction ports. A discharge pump is fixed to the outer side of the machine body. Both the inlet and outlet ends of the discharge pump are connected to corrugated guide pipes. A section of corrugated guide pipe is connected between the inlet end of the discharge pump and the end of the bottom suction pipe.

[0015] Preferably, a distance is left between the bottom of the bottom extraction pipe and the inner bottom of the machine body.

[0016] Preferably, the discharge assembly includes a discharge sealing plate, the discharge sealing plate is provided on the inner bottom of the machine body, the discharge sealing plate is provided on one side of the rotating shaft and is rotatably installed on the inner bottom of the machine body through the rotating shaft, a hydraulic cylinder is fixed at the bottom of the machine body, and the end of the hydraulic cylinder is rotatably connected to the middle of the side of the discharge sealing plate.

[0017] Beneficial effects

[0018] This invention provides a process for improving the yield of silicon micropowder for TFT-LCD glass substrates. Compared with the prior art, it has the following advantages:

[0019] (1) The process for improving the yield of silicon micro powder for TFT-LCD glass substrates, by setting up an adsorption and iron removal component, when the mixed quartz powder is undergoing iron removal, the iron contained in the mixed quartz powder can be adsorbed and treated by the cooperation of the electromagnet mechanism, and the iron is automatically output by the running column cleaning tube rack. On the one hand, it improves the ease of equipment maintenance, and on the other hand, it ensures the iron removal effect of the subsequent mixed quartz powder.

[0020] (2) The process for improving the yield of silicon micro powder for TFT-LCD glass substrates, through the cooperation of positioning ring, arc connecting plate and arc feeding plate, can drive the positioning ring to run at the same time when the column cleaning tube rack is running, so that several arc connecting plates and arc feeding plates can rotate inside the machine body through the cooperation of positioning ring until they contact the limit baffle and transport the mixed quartz powder to the inside of the unloading rack, completing the secondary circulation operation of mixed quartz powder and improving the iron removal effect of mixed quartz powder.

[0021] (3) The process of improving the yield of silicon micro powder for TFT-LCD glass substrates, through the setting of the feeding rack, allows the mixed quartz powder to enter the inside of the feeding rack when it falls through the conical feeding hopper, and then falls evenly to the outside of the electromagnet mechanism along the arc-shaped feeding groove and the feeding port, thereby improving the adsorption effect of iron. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the cross-sectional structure of the body of the present invention;

[0024] Figure 3 For the present invention Figure 2 Enlarged structural diagram of point A in the middle;

[0025] Figure 4 This is a schematic diagram of the iron adsorption and removal component structure of the present invention;

[0026] Figure 5 This is an exploded view of the electromagnet mechanism, hollow connecting rod, and cylindrical cleaning pipe rack of the present invention.

[0027] Figure 6 This is a schematic diagram of the arc-shaped connecting plate and the arc-shaped material feeding plate of the present invention.

[0028] In the diagram: 1. Machine body; 101. Conical hopper; 102. Sealed partition plate; 1021. Annular feed port; 103. Bottom support; 2. Drive motor; 201. Drive track; 3. Discharge pump; 301. Corrugated guide pipe; 4. Bottom extraction pipe; 401. Extraction port; 5. Electromagnet mechanism; 501. Connecting wire; 6. Hollow connecting rod; 7. Columnar cleaning pipe rack; 8. Discharge rack; 801. Arc-shaped discharge chute; 802. Discharge port; 803. Limiting baffle; 9. Waste collection rack; 901. Waste discharge rack; 10. Positioning ring; 11. Arc-shaped connecting plate; 12. Arc-shaped material feeding plate; 1201. Rotating shaft; 1202. Return spring; 13. Discharge sealing plate; 1301. Hydraulic cylinder. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-6 The present invention provides two technical solutions, specifically including the following embodiments:

[0031] Example 1:

[0032] A process for improving the yield of silicon micropowder for TFT-LCD glass substrates specifically includes the following steps;

[0033] S1. Select quartz sand particles with a particle size distribution of 0.1 to 0.4 mm; use a ball mill for grinding, and add a grinding aid and dispersant during the grinding process to obtain mixed quartz powder;

[0034] S2. The mixed quartz powder is sieved to remove iron, and then classified by an air classifier to obtain silicon micro powder for glass substrates.

[0035] Among them, the screening device in S2 includes an organic body 1, a conical hopper 101 is fixed on one side of the top surface of the organic body 1, and bottom supports 103 are fixed on both sides of the bottom of the organic body 1. An adsorption and iron removal component is provided inside the organic body 1.

[0036] The adsorption and iron removal component includes an electromagnet mechanism 5. A hollow connecting rod 6 is fixedly installed at the end of the electromagnet mechanism 5. The electromagnet mechanism 5 and the hollow connecting rod 6 are fixedly installed inside the machine body 1. The end of the electromagnet mechanism 5 has a connecting wire 501, and the end of the connecting wire 501 passes through the interior of the hollow connecting rod 6. The installation position of the electromagnet mechanism 5 is directly below the conical feeding hopper 101. A feeding component is provided below the conical feeding hopper 101. A sealing partition plate 102 is fixed inside the machine body 1. An annular feeding port 1021 is fixed inside the sealing partition plate 102. The electromagnet mechanism 5 passes through the interior of the annular feeding port 1021. A cleaning feeding component is provided on the outside of the electromagnet mechanism 5. A discharge component is provided at the bottom of the inner side of the machine body 1. A waste collection rack 9 is fixed on one side of the interior of the machine body 1. A waste feeding rack 901 is fixed at the bottom of the waste collection rack 9. The electromagnet mechanism 5 is an existing mechanism, which is cylindrical in shape and has the same diameter as the hollow connecting rod 6.

[0037] The cleaning and feeding assembly includes a cylindrical cleaning tube frame 7, which is rotatably sleeved on the outside of the electromagnet mechanism 5 and the hollow connecting rod 6. A drive assembly is provided between the outside of the machine body 1 and the cylindrical cleaning tube frame 7. A positioning ring 10 is fixedly sleeved at the end of the cylindrical cleaning tube frame 7. Several arc-shaped connecting plates 11 are fixedly installed on the outside of the positioning ring 10, and an arc-shaped material-pulling plate 12 is rotatably installed on the outside of each of the arc-shaped connecting plates 11. A limit baffle 803 adapted to the arc-shaped material-pulling plate 12 is provided above the unloading assembly.

[0038] The drive assembly includes a drive motor 2, which is fixed on the outside of the machine body 1. The output end of the drive motor 2 is rotatably connected to the end of the cylindrical cleaning tube frame 7 by a drive track 201. The ends of several arc-shaped material-pulling plates 12 are rotatably mounted with rotating shafts 1201, and the arc-shaped material-pulling plates 12 are rotatably mounted on the outside of the corresponding arc-shaped connecting plates 11 through the rotating shafts 1201 at their ends. The ends of several rotating shafts 1201 are all sleeved with return springs 1202.

[0039] The feeding assembly includes a feeding rack 8, which is fixed inside the machine body 1 and is installed directly above the electromagnet mechanism 5. The feeding rack 8 has an inclined arc-shaped material drop groove 801 inside, and several material drop ports 802 are opened through the arc-shaped material drop groove 801. The limiting baffle 803 is fixedly installed on the top surface of the feeding rack 8 and its installation position corresponds to the arc-shaped material pusher plate 12. The sealing partition plate 102 is installed in the middle of the inner side of the machine body 1. The waste collection rack 9 is installed directly below the hollow connecting rod 6.

[0040] The discharge assembly includes a bottom suction pipe 4, which is fixed to the lower inner side of the machine body 1. Several suction ports 401 are symmetrically opened at the bottom of the bottom suction pipe 4. A discharge pump 3 is fixed to the outer side of the machine body 1. Corrugated guide pipes 301 are connected to both the inlet and outlet ends of the discharge pump 3. A section of corrugated guide pipe 301 is connected between the inlet end of the discharge pump 3 and the end of the bottom suction pipe 4. A distance is left between the bottom of the bottom suction pipe 4 and the bottom inner side of the machine body 1 to avoid affecting the rotation of the arc-shaped connecting plate 11. The discharge pump 3 is an existing mechanism used to realize the material transfer operation.

[0041] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0042] During operation, the mixed quartz powder that needs to be de-ironed is poured into the machine body 1 through the conical feed hopper 101. At the same time as it is poured in, the electromagnet mechanism 5 is energized. When the mixed quartz powder moves down through the electromagnet mechanism 5, the electromagnet mechanism 5 can adsorb the iron contained in the mixed quartz powder. After adsorption, the mixed quartz powder falls to the bottom of the machine body 1 to wait for subsequent airflow classification.

[0043] Furthermore, through the cooperation of the adsorption and iron removal component on the outside of the electromagnet mechanism 5 and the feeding rack 8 inside the machine body 1, when the mixed quartz powder falls through the conical feeding hopper 101, it can enter the feeding rack 8, and then fall evenly to the outside of the electromagnet mechanism 5 along the arc-shaped feeding groove 801 and the feeding port 802, thus improving the adsorption effect of iron. At the same time, through the operation of the drive motor 2, the cylindrical cleaning tube rack 7 can rotate outside the electromagnet mechanism 5 and the hollow connecting rod 6, through the column The rotation of the cylindrical cleaning tube frame 7 can scrape the iron adsorbed on the outside of the electromagnet mechanism 5 towards the hollow connecting rod 6, so that the adsorbed iron can move with the cylindrical cleaning tube frame 7 until it passes through the annular feeding port 1021 installed inside the sealed partition plate 102. The adsorbed iron moves to the hollow connecting rod 6. As the iron separates from the electromagnet mechanism 5 and the adsorption force disappears, the iron can fall into the waste slag collection rack 9 and then be discharged through the waste slag discharge rack 901, completing the automatic cleaning operation of the iron.

[0044] Furthermore, when the cylindrical cleaning tube frame 7 rotates outside the electromagnet mechanism 5 and the hollow connecting rod 6, it can drive the positioning ring 10 to rotate, so that several arc-shaped connecting plates 11 can rotate inside the machine body 1 along with the positioning ring 10. Through the arc-shaped connecting plates 11, the arc-shaped material feeding plate 12 can rotate inside the machine body 1, which can scrape the mixed quartz powder that has fallen to the bottom of the machine body 1 upward. As the arc-shaped connecting plate 11 drives the arc-shaped material feeding plate 12 to move to the limit baffle 803, the arc-shaped material feeding plate 12 can rotate along the rotating shaft 1201 by the push of the limit baffle 803 until the arc-shaped connecting plate 11 passes the limit baffle 803. Then the arc-shaped material feeding plate 12 is reset by the cooperation of the rotating shaft 1201 and the return spring 1202. When the arc-shaped material feeding plate 12 rotates, it can send the scraped mixed quartz powder to the inside of the feeding rack 8, so that the mixed quartz powder that has completed the iron removal returns to the inside of the feeding rack 8 for cyclic adsorption treatment, which improves the working effect of the equipment.

[0045] Furthermore, after the mixed quartz powder has undergone iron removal, the discharge assembly is set up and the discharge pump 3 is operated. Through the cooperation of the corrugated guide pipe 301, a negative pressure is generated inside the bottom suction pipe 4, so that the mixed quartz powder falling to the bottom of the machine body 1 can be extracted through several suction ports 401 and then transported to the air classifier for classification.

[0046] Example 2:

[0047] A process for improving the yield of silicon micropowder for TFT-LCD glass substrates specifically includes the following steps;

[0048] S1. Select quartz sand particles with a particle size distribution of 0.1 to 0.4 mm; use a ball mill for grinding, and add a grinding aid and dispersant during the grinding process to obtain mixed quartz powder;

[0049] S2. The mixed quartz powder is sieved to remove iron, and then classified by an air classifier to obtain silicon micro powder for glass substrates.

[0050] Among them, the screening device in S2 includes an organic body 1, a conical hopper 101 is fixed on one side of the top surface of the organic body 1, and bottom supports 103 are fixed on both sides of the bottom of the organic body 1. An adsorption and iron removal component is provided inside the organic body 1.

[0051] The adsorption and iron removal component includes an electromagnet mechanism 5. A hollow connecting rod 6 is fixedly installed at the end of the electromagnet mechanism 5. The electromagnet mechanism 5 and the hollow connecting rod 6 are fixedly installed inside the machine body 1. The end of the electromagnet mechanism 5 has a connecting wire 501, and the end of the connecting wire 501 passes through the interior of the hollow connecting rod 6. The installation position of the electromagnet mechanism 5 is directly below the conical feeding hopper 101. A feeding component is provided below the conical feeding hopper 101. A sealing partition plate 102 is fixed inside the machine body 1. An annular feeding port 1021 is fixed inside the sealing partition plate 102. The electromagnet mechanism 5 passes through the interior of the annular feeding port 1021. A cleaning feeding component is provided on the outside of the electromagnet mechanism 5. A discharge component is provided at the bottom of the inner side of the machine body 1. A waste collection rack 9 is fixed on one side of the interior of the machine body 1. A waste feeding rack 901 is fixed at the bottom of the waste collection rack 9. The electromagnet mechanism 5 is an existing mechanism, which is cylindrical in shape and has the same diameter as the hollow connecting rod 6.

[0052] The cleaning and feeding assembly includes a cylindrical cleaning tube frame 7, which is rotatably sleeved on the outside of the electromagnet mechanism 5 and the hollow connecting rod 6. A drive assembly is provided between the outside of the machine body 1 and the cylindrical cleaning tube frame 7. A positioning ring 10 is fixedly sleeved at the end of the cylindrical cleaning tube frame 7. Several arc-shaped connecting plates 11 are fixedly installed on the outside of the positioning ring 10, and an arc-shaped material-pulling plate 12 is rotatably installed on the outside of each of the arc-shaped connecting plates 11. A limit baffle 803 adapted to the arc-shaped material-pulling plate 12 is provided above the unloading assembly.

[0053] The drive assembly includes a drive motor 2, which is fixed on the outside of the machine body 1. The output end of the drive motor 2 is rotatably connected to the end of the cylindrical cleaning tube frame 7 by a drive track 201. The ends of several arc-shaped material-pulling plates 12 are rotatably mounted with rotating shafts 1201, and the arc-shaped material-pulling plates 12 are rotatably mounted on the outside of the corresponding arc-shaped connecting plates 11 through the rotating shafts 1201 at their ends. The ends of several rotating shafts 1201 are all sleeved with return springs 1202.

[0054] The feeding assembly includes a feeding rack 8, which is fixed inside the machine body 1 and is installed directly above the electromagnet mechanism 5. The feeding rack 8 has an inclined arc-shaped material drop groove 801 inside, and several material drop ports 802 are opened through the arc-shaped material drop groove 801. The limiting baffle 803 is fixedly installed on the top surface of the feeding rack 8 and its installation position corresponds to the arc-shaped material pusher plate 12. The sealing partition plate 102 is installed in the middle of the inner side of the machine body 1. The waste collection rack 9 is installed directly below the hollow connecting rod 6.

[0055] The discharge assembly includes a discharge sealing plate 13. The discharge sealing plate 13 is provided on the inner bottom of the machine body 1. A rotating shaft is provided on one side of the discharge sealing plate 13 and is rotatably installed on the inner bottom of the machine body 1 through the rotating shaft. A hydraulic cylinder 1301 is fixed at the bottom of the machine body 1. The end of the hydraulic cylinder 1301 is rotatably connected to the middle of the side of the discharge sealing plate 13.

[0056] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0057] During operation, the mixed quartz powder that needs to be de-ironed is poured into the machine body 1 through the conical feed hopper 101. At the same time as it is poured in, the electromagnet mechanism 5 is energized. When the mixed quartz powder moves down through the electromagnet mechanism 5, the electromagnet mechanism 5 can adsorb the iron contained in the mixed quartz powder. After adsorption, the mixed quartz powder falls to the bottom of the machine body 1 to wait for subsequent airflow classification.

[0058] Furthermore, through the cooperation of the adsorption and iron removal component on the outside of the electromagnet mechanism 5 and the feeding rack 8 inside the machine body 1, when the mixed quartz powder falls through the conical feeding hopper 101, it can enter the feeding rack 8, and then fall evenly to the outside of the electromagnet mechanism 5 along the arc-shaped feeding groove 801 and the feeding port 802, thus improving the adsorption effect of iron. At the same time, through the operation of the drive motor 2, the cylindrical cleaning tube rack 7 can rotate outside the electromagnet mechanism 5 and the hollow connecting rod 6, through the column The rotation of the cylindrical cleaning tube frame 7 can scrape the iron adsorbed on the outside of the electromagnet mechanism 5 towards the hollow connecting rod 6, so that the adsorbed iron can move with the cylindrical cleaning tube frame 7 until it passes through the annular feeding port 1021 installed inside the sealed partition plate 102. The adsorbed iron moves to the hollow connecting rod 6. As the iron separates from the electromagnet mechanism 5 and the adsorption force disappears, the iron can fall into the waste slag collection rack 9 and then be discharged through the waste slag discharge rack 901, completing the automatic cleaning operation of the iron.

[0059] Furthermore, when the cylindrical cleaning tube frame 7 rotates outside the electromagnet mechanism 5 and the hollow connecting rod 6, it can drive the positioning ring 10 to rotate, so that several arc-shaped connecting plates 11 can rotate inside the machine body 1 along with the positioning ring 10. Through the arc-shaped connecting plates 11, the arc-shaped material feeding plate 12 can rotate inside the machine body 1, which can scrape the mixed quartz powder that has fallen to the bottom of the machine body 1 upward. As the arc-shaped connecting plate 11 drives the arc-shaped material feeding plate 12 to move to the limit baffle 803, the arc-shaped material feeding plate 12 can rotate along the rotating shaft 1201 by the push of the limit baffle 803 until the arc-shaped connecting plate 11 passes the limit baffle 803. Then the arc-shaped material feeding plate 12 is reset by the cooperation of the rotating shaft 1201 and the return spring 1202. When the arc-shaped material feeding plate 12 rotates, it can send the scraped mixed quartz powder to the inside of the feeding rack 8, so that the mixed quartz powder that has completed the iron removal returns to the inside of the feeding rack 8 for cyclic adsorption treatment, which improves the working effect of the equipment.

[0060] Furthermore, after the mixed quartz powder has undergone iron removal, the discharge assembly, through the operation of the hydraulic cylinder 1301, can drive the end-rotatingly connected discharge sealing plate 13 to rotate and open, allowing the mixed quartz powder at the bottom to fall. The falling mixed quartz powder is then transported to the air classifier for classification.

[0061] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A process for improving the yield of silicon micropowder for TFT-LCD glass substrates, characterized in that, Specifically, it includes the following steps; S1. Select quartz sand particles with a particle size distribution of 0.1 to 0.4 mm; use a ball mill for grinding, and add a grinding aid and dispersant during the grinding process to obtain mixed quartz powder; S2. The mixed quartz powder is sieved to remove iron, and then classified by an air classifier to obtain silicon micro powder for glass substrates. The screening device in S2 includes an organic body (1), a conical hopper (101) is fixed on one side of the top surface of the organic body (1), and bottom supports (103) are fixed on both sides of the bottom of the organic body (1). The interior of the organic body (1) is equipped with an adsorption and iron removal component. The adsorption and iron removal component includes an electromagnet mechanism (5), with a hollow connecting rod (6) fixedly installed at the end of the electromagnet mechanism (5). The electromagnet mechanism (5) and the hollow connecting rod (6) are fixedly installed inside the machine body (1). The end of the electromagnet mechanism (5) has a connecting wire (501), and the end of the connecting wire (501) passes through the interior of the hollow connecting rod (6). The installation position of the electromagnet mechanism (5) is directly below the conical hopper (101). Below the conical hopper (101) is a... The machine body (1) has a feeding assembly. A sealing partition plate (102) is fixed inside the machine body (1). An annular feeding port (1021) is fixed inside the sealing partition plate (102). The electromagnet mechanism (5) passes through the annular feeding port (1021). A cleaning feeding assembly is provided on the outside of the electromagnet mechanism (5). A discharge assembly is provided on the bottom inside the machine body (1). A waste collection rack (9) is fixed on one side inside the machine body (1). A waste discharge rack (901) is fixed at the bottom of the waste collection rack (9). The cleaning and feeding assembly includes a cylindrical cleaning tube frame (7), which is rotatably sleeved on the outside of the electromagnet mechanism (5) and the hollow connecting rod (6). A driving assembly is provided between the outside of the machine body (1) and the cylindrical cleaning tube frame (7). A positioning ring (10) is fixedly sleeved at the end of the cylindrical cleaning tube frame (7). Several arc-shaped connecting plates (11) are fixedly installed on the outside of the positioning ring (10), and an arc-shaped material-pulling plate (12) is rotatably installed on the outside of each of the arc-shaped connecting plates (11). A limiting baffle (803) adapted to the arc-shaped material-pulling plate (12) is provided above the unloading assembly. Each of the arc-shaped material feeding plates (12) has a rotating shaft (1201) rotatably mounted at its end, and the arc-shaped material feeding plates (12) are respectively rotatably mounted on the outside of the corresponding arc-shaped connecting plate (11) through the rotating shaft (1201) at their ends. Each of the rotating shafts (1201) is fitted with a return spring (1202). The feeding assembly includes a feeding rack (8), which is fixed inside the body (1) and is located directly above the electromagnet mechanism (5). The feeding rack (8) has an inclined arc-shaped material drop groove (801) inside, and several material drop ports (802) are opened through the arc-shaped material drop groove (801). The limiting baffle (803) is fixedly installed on the top surface of the feeding rack (8) and its installation position corresponds to the arc-shaped material pusher plate (12).

2. The process for improving the yield of silicon micropowder for TFT-LCD glass substrates according to claim 1, characterized in that: The drive assembly includes a drive motor (2), which is fixed on the outside of the body (1). The output end of the drive motor (2) is rotatably connected to the end of the cylindrical cleaning tube frame (7) by a drive track (201).

3. The process for improving the yield of silicon micropowder for TFT-LCD glass substrates according to claim 1, characterized in that: The sealing separator (102) is installed in the middle of the inner side of the body (1), and the waste collection rack (9) is installed directly below the hollow connecting rod (6).

4. The process for improving the yield of silicon micropowder for TFT-LCD glass substrates according to claim 1, characterized in that: The discharge assembly includes a bottom suction pipe (4), which is fixed to the lower inner side of the machine body (1). Several suction ports (401) are symmetrically opened at the bottom of the bottom suction pipe (4). A discharge pump (3) is fixed to the outer side of the machine body (1). Corrugated guide pipes (301) are connected to both the inlet and outlet ends of the discharge pump (3). A section of corrugated guide pipe (301) is connected between the inlet end of the discharge pump (3) and the end of the bottom suction pipe (4).

5. The process for improving the yield of silicon micropowder for TFT-LCD glass substrates according to claim 4, characterized in that: A distance is left between the bottom of the bottom extraction pipe (4) and the inner bottom of the machine body (1).

6. The process for improving the yield of silicon micropowder for TFT-LCD glass substrates according to claim 1, characterized in that: The discharge assembly includes a discharge sealing plate (13). The discharge sealing plate (13) is provided on the bottom inner side of the machine body (1). A rotating shaft is provided on one side of the discharge sealing plate (13) and is rotatably installed on the bottom inner side of the machine body (1) through the rotating shaft. A hydraulic cylinder (1301) is fixed at the bottom of the machine body (1). The end of the hydraulic cylinder (1301) is rotatably connected to the middle of the side of the discharge sealing plate (13).

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