Method and apparatus for pick-up
By using a carrier plate and a material trough to form a buffer zone in the adhesive device, and by using a pneumatic unit to bend the carrier plate, the problem that existing devices cannot meet the requirements of curved surface adhesive is solved, and uniform adhesive and flexible adaptation of multiple welding parts are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GALLANT MICRO MACHINING
- Filing Date
- 2022-06-23
- Publication Date
- 2026-05-12
AI Technical Summary
Existing coating devices cannot effectively meet the requirements of coating on curved surfaces, and cannot achieve uniform and effective coating application when the object shape is diverse.
An adhesion device is used, which includes an adhesion table, a support plate and a pneumatic unit. By forming a buffer zone between the support plate and the material trough, and by using the pneumatic unit to inflate or de-inflate the buffer zone, the support plate is elastically bent, thereby causing the adhesion layer to bend synchronously to adapt to the curved bottom surface and achieve uniform adhesion.
It achieves uniform adhesion of multiple welded parts on a curved bottom surface, avoids electrical short circuits, adapts to the diverse needs of object shapes, and improves the flexibility and efficiency of adhesion.
Smart Images
Figure CN117300287B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an adhesion method, and more particularly to an adhesion method and adhesion apparatus for forming a curved adhesion layer. Background Technology
[0002] Existing coating devices typically consist of a tank capable of holding the coating material for application to an object. The surface of the coating material within these devices is horizontal, allowing the coating area to be controlled by the depth to which the object is immersed. However, the increasing variety of object shapes has led to a demand for coating curved surfaces, rendering existing coating devices inadequate for meeting these requirements.
[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention
[0004] The present invention provides an adhesion method and adhesion device that can effectively improve the defects that may occur in existing adhesion devices.
[0005] This invention discloses an adhesion method applicable to multiple solder joints on the curved bottom surface of an electronic component. The adhesion method includes: a pre-step: providing an adhesion device, the adhesion device comprising: an adhesion table having a reference plane and a material placement groove recessed from the reference plane; and a support plate, the periphery of the support plate being installed in the material placement groove so that the bottom surface of the support plate and the material placement groove together form a buffer zone; a filling step: placing an adhesion material in the material placement groove and located on the top surface of the support plate; and a planarization step: removing any material placed in the material placement groove but protruding from the base plate. The excess portion of the adhesive on the quasi-plane forms an adhesive layer whose outer surface is coplanar with the reference plane; an adjustment step: inflating or deflating the buffer zone to make the carrier plate elastically bend in a curved shape corresponding to the curved bottom surface, and making the adhesive layer bend synchronously with the carrier plate; and an adhesion step: moving multiple solder joints of the electronic component toward the carrier plate and abutting against the top surface of the carrier plate, and the curved carrier plate can elastically bend accordingly with the arrangement of the multiple solder joints to abut against the multiple solder joints, thereby making the multiple solder joints adhere to the adhesive layer.
[0006] Preferably, in the planarization step, a scraper is moved relative to the reference plane across the material trough to scrape off excess material.
[0007] Preferably, in the planarization step, the thickness of the adhesive layer is less than the thickness of any of the solder joints; in the adhesion step, the curved bottom surface of the electronic component remains in contact with the adhesive layer.
[0008] Preferably, the dipstick is further defined as a flux.
[0009] Preferably, during the adjustment step, the outer surface of the adhesive layer remains parallel to the top surface of the support plate.
[0010] Preferably, the curved bottom surface is further defined as a curved concave surface; in the adjustment step, a pneumatic unit inflates the buffer zone to cause the support plate to bend elastically toward the bottom of the feeding trough away from the bottom of the trough; in the adhesion step, a suction nozzle picks up the electronic component and moves the electronic component toward the support plate.
[0011] This invention also discloses an adhesion device, comprising: an adhesion table having a reference plane and a material placement groove recessed from the reference plane; a support plate, the periphery of which is installed in the material placement groove so that the bottom surface of the support plate and the material placement groove together form a buffer zone; wherein the material placement groove is used to accommodate an adhesion material and is located on the top surface of the support plate; a scraper, corresponding to the reference plane, for scraping away excess portions of the adhesion material disposed in the material placement groove but protruding from the reference plane along the reference plane, thereby forming an adhesion layer with its outer surface coplanar with the reference plane; and a pneumatic unit connected to the buffer zone; wherein the pneumatic unit can be used to inflate or de-inflate the buffer zone to cause the support plate to bend elastically into a curved shape.
[0012] Preferably, the support plate is disposed at the bottom of the material storage tank, and the pneumatic unit is connected to the bottom of the material storage tank and communicates with the buffer zone. The pneumatic unit is specifically designed to inflate the buffer zone.
[0013] Preferably, the adsorption device further includes a lifting platform, and the platform surface of the lifting platform is located within a buffer zone, while the support plate is disposed on the platform surface.
[0014] Preferably, the platform of the lifting platform can move between a first position and a second position relative to the bottom of the material trough; when the platform is in the first position, the material trough is used for material preparation; when the platform is in the second position, the pneumatic unit can be used to evacuate the buffer zone.
[0015] Preferably, the platform of the lifting platform can move between a first position and a second position relative to the bottom of the material trough; when the platform is in the first position, the pneumatic unit can be used to inflate the buffer zone.
[0016] In summary, the adhesion method and adhesion device disclosed in the embodiments of the present invention, by possessing the aforementioned specific technical features (such as: the bottom surface of the support plate and the material placement groove together constitute the buffer zone, and the buffer zone can be inflated or deflated so that the support plate can be elastically bent in accordance with the curved bottom surface to form a curved shape), facilitates the formation of the adhesion layer that can bend synchronously with the support plate, and the support plate, by possessing the characteristic of elastic bending, enables the plurality of welding portions located on the curved bottom surface to be adhered with sufficient adhesion as needed.
[0017] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the pre-adhesion steps and the filling steps of the adhesion method in Embodiment 1 of the present invention.
[0019] Figure 2 This is a schematic diagram of the planarization step of the adhesion method in Embodiment 1 of the present invention.
[0020] Figure 3 This is a schematic diagram of the adjustment steps of the adhesion method in Embodiment 1 of the present invention.
[0021] Figure 4 This is a schematic diagram of the adhesion steps in the adhesion method of Embodiment 1 of the present invention.
[0022] Figure 5 for Figure 4 The following is a diagram illustrating the subsequent operations.
[0023] Figure 6 This is a schematic diagram of the adhesion device according to Embodiment 2 of the present invention when the platform of the lifting platform is in the first position.
[0024] Figure 7 for Figure 6 A schematic diagram of an adhesion device applied to electronic components with a curved bottom surface that is concave.
[0025] Figure 8 This is a schematic diagram of the adhesion device according to Embodiment 2 of the present invention when the platform of the lifting platform is in the second position.
[0026] Figure 9 for Figure 8 A schematic diagram of an adhesion device applied to electronic components with a curved bottom surface that is also curved and convex.
[0027] Figure 10 for Figure 9 The following is a diagram illustrating the subsequent operations. Detailed Implementation
[0028] The following specific embodiments illustrate the implementation of the "adhesion method and adhesion device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.
[0029] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.
[0030] [Example 1]
[0031] Please see Figures 1 to 5 The image shows an embodiment of the present invention. This embodiment discloses an adhesion method and an adhesion apparatus 100, which can be applied to multiple solder parts E2 (e.g., solder pads or solder balls) on a curved bottom surface E1 of an electronic component E; that is, the adhesion method and adhesion apparatus 100 facilitate the adhesion of a coating material S to the multiple solder parts E2, but the curved bottom surface E1 can remain uncontacted by the coating material S. In this embodiment, the curved bottom surface E1 is further defined as a curved concave surface, and the coating material S is described as a material with semi-curing properties (e.g., flux), but the present invention is not limited thereto.
[0032] It should be noted that the adhesion method described in this embodiment is based on the adhesion device 100. Therefore, for ease of understanding, the structure of the adhesion device 100 will be described first, followed by the adhesion method. However, this invention is not limited thereto. For example, in other embodiments of this invention not shown, the detailed structure of the adhesion device 100 used in the adhesion method may differ slightly from that described in this embodiment.
[0033] In this embodiment, the coating device 100 includes a coating table 1, a support plate 2 disposed within the coating table 1, a scraper 3 corresponding to the coating table 1, and a pneumatic unit 4 installed on the coating table 1. The coating table 1 has a reference plane 11 (e.g., ...). Figure 1 The top surface of the dip plate 1 and a material placement groove 12 recessed from the reference plane 11, and the depth of each part of the material placement groove 12 is preferably equal and less than the thickness of any of the welding parts E2, but the present invention is not limited thereto.
[0034] In this embodiment, the support plate 2 is disposed at the bottom of the material placement groove 12, and the periphery of the support plate 2 is installed (e.g., inserted) into the material placement groove 12, so that the bottom surface 21 of the support plate 2 and the material placement groove 12 together form a buffer zone 122, while the top surface 22 of the support plate 2 and the material placement groove 12 surround each other to form a material placement area 121. That is, the material placement groove 12 can be divided by the support plate 2 into the material placement area 121 and the buffer zone 122. The material placement groove 12 is used for the coating material S to be placed inside and located on the top surface 22 of the support plate 2 (that is, the coating material S is filled into the material placement area 121).
[0035] The scraper 3 is disposed corresponding to the reference plane 11 and is used to scrape off excess portions S' of the adhesive material S that are disposed within the material tray 12 (or the material tray area 121) but protrude from the reference plane 11, so as to form an adhesive layer S' whose outer surface S1' is coplanar with the reference plane 11. That is, in this embodiment, the adhesive device 100 can be used to form an adhesive layer S' of uniform thickness from the adhesive material S.
[0036] The pneumatic unit 4 is connected to the buffer zone 122 and can be used to inflate or de-inflate the buffer zone 122 to cause the support plate 2 (in the direction away from the bottom of the tank) to bend elastically into a curved shape. That is, in this embodiment, the adhesive device 100 can cause the support plate 2 to bend approximately corresponding to the curved bottom surface E1 (or the arrangement of the plurality of welding parts E2) so that the adhesive layer S' can bend synchronously and approximately correspond to the shape of the curved bottom surface E1.
[0037] More specifically, in this embodiment, the pneumatic unit 4 is connected to the bottom of the material trough 12 and communicates with the buffer zone 122. The pneumatic unit 4 is defined to inflate the buffer zone 122 so that the volume of the buffer zone 122 can expand, thereby forcing the support plate 2 and the adhesive layer S' to be bent into a predetermined curved shape, but the present invention is not limited thereto.
[0038] The above is a structural description of the adhesion device 100 of this embodiment. The adhesion method using the adhesion device 100 will be described below. Figures 1 to 5 As shown, the adhesion method sequentially includes a preparatory step S110, a filling step S130, a planarization step S150, an adjustment step S170, and an adhesion step S190, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the above-mentioned multiple steps S110 to S190 of the adhesion method can be adjusted and varied according to design requirements. The various steps S110 to S190 of the adhesion method will be described below.
[0039] The preceding step S110: as follows Figure 1 As shown, the adhesion device 100 is provided. The adhesion device 100 is as described above and will not be repeated here. It should be noted that, in other embodiments not illustrated in this invention, the adhesion device 100 used in the preceding step S110 can be adjusted and varied according to design requirements.
[0040] The filling step S130: as follows Figure 1 As shown, the adhesive S is placed in the material storage tank 12 and located on the top surface 22 of the support plate 2; that is, the material storage area 121 of the adhesive device 100 is filled with the adhesive S, but a portion of the adhesive S (e.g., the excess portion described below) may overflow the material storage area 121 or protrude from the reference plane 11.
[0041] The flattening step S150: as follows: Figure 2 As shown, the excess portion S' of the adhesive S, which is disposed within the material tray 12 but protrudes from the reference plane 11, is removed to form an adhesive layer S' whose outer surface is coplanar with the reference plane 11. In this embodiment, the thickness of the adhesive layer S' is preferably uniform and less than the thickness of any of the welded portions E2.
[0042] Furthermore, in this embodiment, the planarization step S150 involves the scraper 3 moving relative to the reference plane 11 across the material tray 12 to scrape off the excess portion S” of the adhesive material S. The scraper 3 can be driven manually or mechanically, and its structure can be adjusted and varied according to requirements; this invention does not impose any limitations on this. For example, in other embodiments not illustrated in this invention, the planarization step S150 may also involve moving the material tray 1 so that the excess portion S” of the adhesive material S disposed thereon is removed by the scraper 3.
[0043] The adjustment step S170: as follows: Figure 3As shown, the buffer zone 122 is inflated or deflated to cause the support plate 2 to bend elastically in relation to the curved bottom surface E1 (or the arrangement of the plurality of welding parts E2), and the adhesive layer S' bends synchronously with the support plate 2. In this embodiment, the adjustment step S170 involves inflating the buffer zone 122 with the pneumatic unit 4 to cause the support plate 2 to bend elastically away from the bottom of the material placement groove 12, and the outer surface S1' of the adhesive layer S' preferably remains parallel to the top surface 22 of the support plate 2, but the invention is not limited thereto.
[0044] The adhesion step S190: as follows Figure 4 and Figure 5 As shown, the plurality of solder parts E2 of the electronic component E are moved toward the carrier plate 2 and abut against the top surface 22 of the carrier plate 2. The curved carrier plate 2 can be elastically bent in accordance with the arrangement of the plurality of solder parts E2 to abut against the plurality of solder parts E2, thereby causing the plurality of solder parts E2 to adhere to the adhesive layer S'.
[0045] Furthermore, in this embodiment, the adhesion step S190 involves the nozzle 200 picking up the electronic component E and moving it toward the carrier plate 2. The areas where each of the solder parts E2 of the electronic component E is adhered to the adhesive layer S' can be substantially the same, while the curved bottom surface E1 of the electronic component E can remain in contact with the adhesive layer S', thereby avoiding any two solder parts E2 from forming an electrical connection and short-circuiting. However, the present invention is not limited to this.
[0046] As described above, in this embodiment, the adhesion method and the adhesion device 100 can utilize specific technical features (such as: the bottom surface 21 of the support plate 2 and the material placement groove 12 together constitute the buffer zone 122, and the buffer zone 122 can be inflated or deflated so that the support plate 2 can be elastically bent in accordance with the curved bottom surface E1 to form a curved shape), to facilitate the formation of the adhesion layer S' that can bend synchronously with the support plate 2, and the support plate 2, by having the characteristic of elastic bending, can ensure that the plurality of welding parts E2 located on the curved bottom surface E1 can be adhered with sufficient adhesion S as needed.
[0047] [Example 2]
[0048] Please see Figures 6 to 10 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:
[0049] In this embodiment, the adhesion device 100 further includes a lifting platform 5, and the platform 51 of the lifting platform 5 is located within the buffer zone 122, while the support plate 2 is disposed on the platform 51. The platform 51 of the lifting platform 5 can be positioned relative to the bottom of the material storage tank 12 at a first position (e.g., ...). Figure 6 and Figure 7 ) and a second position (e.g.: Figures 8 to 10 The platform 51 located in the first position is away from the bottom of the groove and abuts against the bottom surface 21 of the support plate 2, while the platform 51 located in the second position is adjacent to the bottom of the groove and away from the support plate 2.
[0050] More specifically, such as Figure 6 As shown, when the platform 51 is in the first position, the material placement groove 12 is used to place the adhesive S and can form the adhesive layer S' as described in Embodiment 1. Furthermore, after the adhesive layer S' is formed, the adhesive device 100 can adjust its operating mode according to whether the curved bottom surface E1 of the electronic component E is a curved concave surface or a curved convex surface.
[0051] For example, such as Figure 7 As shown, when the platform 51 is in the first position, the pneumatic unit 4 can be used to inflate the buffer zone 122 and apply the various steps as described in Embodiment 1 (e.g., the area between the bottom surface 21 of the support plate 2 and the platform 51 of the lifting platform 5 expands due to inflation, so that the support plate 2 and the adhesive layer S' can be bent synchronously), thereby facilitating the adhesion of multiple welding parts E2 to the electronic component E with the curved bottom surface E1 being a curved concave surface.
[0052] Or, such as Figures 8 to 10 As shown, when the platform 51 is in the second position, the pneumatic unit 4 can be used to evacuate the buffer zone 122 so that the support plate 2 is elastically bent towards the bottom of the groove and becomes curved (the adhesive layer S' is simultaneously bent), thereby facilitating the adhesion of multiple welding parts E2 of the electronic component E with the curved bottom surface E1 being a curved convex surface.
[0053] [Technical Effects of the Embodiments of the Invention]
[0054] In summary, the adhesion method and adhesion device disclosed in the embodiments of the present invention, by possessing the aforementioned specific technical features (such as: the bottom surface of the support plate and the material placement groove together constitute the buffer zone, and the buffer zone can be inflated or deflated so that the support plate can be elastically bent in accordance with the curved bottom surface to form a curved shape), facilitates the formation of the adhesion layer that can bend synchronously with the support plate, and the support plate, by possessing the characteristic of elastic bending, enables the plurality of welding portions located on the curved bottom surface to be adhered with sufficient adhesion as needed.
[0055] Furthermore, the adhesion device disclosed in the embodiments of the present invention can be further provided with a lifting platform for mounting the carrier plate, so that the adhesion device can adjust its operating mode accordingly based on whether the curved bottom surface of the electronic component is a curved concave surface or a curved convex surface, so as to meet a wider range of adhesion needs.
[0056] The above-disclosed content is only a preferred and feasible embodiment of the present invention and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included within the patent scope of the present invention.
Claims
1. An adhesion method, characterized in that, The adhesion method is applicable to multiple solder joints on the curved bottom surface of an electronic component, and the adhesion method includes: A preliminary step: providing an adhesion device, the adhesion device comprising: A material-applying platform has a reference plane and a material-placing groove recessed from the reference plane; and A support plate, the periphery of which is installed in the material placement groove, so that the bottom surface of the support plate and the material placement groove together form a buffer zone; A filling step: A filler material is placed in the material placement trough and located on the top surface of the support plate; A planarization step: Remove excess portions of the adhesive material disposed in the material tray but protruding from the reference plane, so as to form an adhesive layer with its outer surface coplanar with the reference plane; One adjustment step: Inflate or deflate the buffer zone to cause the support plate to bend elastically corresponding to the curved bottom surface, and simultaneously cause the adhesive layer to bend along with the support plate; and One adhesion step: The plurality of solder parts of the electronic component are moved toward the carrier plate and abut against the top surface of the carrier plate, and the curved carrier plate can be elastically bent accordingly with the arrangement of the plurality of solder parts to abut against the plurality of solder parts, thereby causing the plurality of solder parts to be adhered to the adhesive layer.
2. The adhesion method according to claim 1, characterized in that, In the planarization step, a scraper is moved relative to the reference plane across the material trough to scrape off the excess material.
3. The adhesion method according to claim 1, characterized in that, In the planarization step, the thickness of the adhesive layer is less than the thickness of any of the solder joints; in the adhesion step, the curved bottom surface of the electronic component remains in contact with the adhesive layer.
4. The adhesion method according to claim 3, characterized in that, The coating material is further defined as a flux.
5. The adhesion method according to claim 1, characterized in that, During the adjustment step, the outer surface of the adhesive layer remains parallel to the top surface of the support plate.
6. The adhesion method according to claim 1, characterized in that, The curved bottom surface is further defined as a curved concave surface; in the adjustment step, the buffer zone is inflated by a pneumatic unit to cause the support plate to bend elastically toward the bottom of the material trough away from the bottom of the trough; in the adhesion step, the electronic component is picked up by a suction nozzle and moved toward the support plate.
7. An adhesion device, characterized in that, The adhesion device includes: A material-sticking station has a reference plane and a material-placing groove recessed from the reference plane; A support plate, the periphery of which is installed in the material placement groove, such that the bottom surface of the support plate and the material placement groove together form a buffer zone; wherein, the material placement groove is used to accommodate a coating material and is located on the top surface of the support plate; A scraper, disposed corresponding to the reference plane, is used to scrape off excess material disposed within the material tray but protruding from the reference plane along the reference plane, thereby forming a material layer with its outer surface coplanar with the reference plane; and A pneumatic unit is connected to the buffer zone; wherein the pneumatic unit can be used to inflate or de-inflate the buffer zone to cause the support plate to bend elastically into a curved shape.
8. The adhesion apparatus according to claim 7, characterized in that, The support plate is disposed at the bottom of the material trough, and the pneumatic unit is connected to the bottom of the material trough and communicates with the buffer zone, the pneumatic unit being configured to inflate the buffer zone.
9. The adhesion apparatus according to claim 7, characterized in that, The adhesion device further includes a lifting platform, the platform of which is located within the buffer zone, and the support plate is disposed on the platform.
10. The adhesion apparatus according to claim 9, characterized in that, The platform of the lifting platform can move between a first position and a second position relative to the bottom of the material placement trough; when the platform is in the first position, the material placement trough is used for the material to be applied; when the platform is in the second position, the pneumatic unit can be used to evacuate the buffer zone.
11. The adhesion apparatus according to claim 9, characterized in that, The platform of the lifting platform can move between a first position and a second position relative to the bottom of the material trough; when the platform is in the first position, the pneumatic unit can be used to inflate the buffer zone.