A method for simulating workpiece topography and damage in grinding silicon carbide ceramics considering strain rate effect

By establishing a simulation model for grinding silicon carbide ceramics that considers the strain rate effect, the problem of poor surface integrity during the grinding process was solved, and efficient and accurate grinding process prediction and optimization were achieved.

CN117313505BActive Publication Date: 2026-06-12NANJING AGRICULTURAL UNIVERSITY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANJING AGRICULTURAL UNIVERSITY
Filing Date
2023-09-26
Publication Date
2026-06-12

AI Technical Summary

⚠Technical Problem

Existing technologies fail to effectively consider the strain rate effect during silicon carbide ceramic grinding, resulting in poor surface integrity of the ground workpiece, high processing costs, and inaccurate predictions from traditional models.

⚗Method used

A mathematical simulation model considering the strain rate effect was established. By using a single-layer diamond grinding wheel with ordered abrasive grains, combined with kinematic analysis and the influence of strain rate effect, the surface morphology and damage of silicon carbide ceramic grinding workpieces were predicted, and the simulation was carried out using numerical simulation technology.

🎯Benefits of technology

It improves the accuracy and reliability of grinding process prediction, reduces costs, optimizes process parameters, improves processing efficiency and quality, and expands the scope of applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application aims to optimize the abrasive grain arrangement and grinding parameters of the grinding wheel to accurately predict the surface topography and damage of silicon carbide ceramic materials during the grinding process. A new mathematical simulation model is established, considering the influence of strain rate effect on material damage, and the grinding process control is realized through the ordered abrasive grain single-layer diamond grinding wheel. A simulation model for predicting the topography and damage of silicon carbide ceramic considering the strain rate effect is successfully established. First, the surface topography model of the ordered abrasive grain single-layer diamond grinding wheel is established, and then the kinematics analysis of the diamond abrasive grain grinding process is carried out to generate the workpiece surface topography model after grinding. Further, considering the damage of silicon carbide ceramic, a damage model considering the strain rate effect is established. This innovation helps to improve the accuracy of grinding workpiece topography prediction, improve the efficiency and precision of grinding process, and promote the development of grinding technology.
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