An IPA-based displacement drying method and apparatus

Abstract

The application discloses a kind of IPA-based replacement drying method and device, applied to the field of semiconductor preparation, the method includes: the wafer box loaded with several wafers is placed in the bearing part of drying groove body, swing component drives bearing part to carry out periodic swing along wafer arrangement direction;Wherein, periodic swing includes: first stage periodic swing is carried out with first swing angle, the position relationship of wafer and wafer box card slot is adjusted by high-radiation swing;Second stage periodic swing is carried out with second swing angle, and wafer is positioned to dry wafer by low-radiation swing;First swing angle is greater than second swing angle.The application is by setting swing component, simultaneously utilize swing component to drive wafer to carry out periodic swing along arrangement direction with large swing amplitude, to adjust the position relationship of wafer and wafer box, and combine with the periodic swing of small swing amplitude, so that wafer position is locked, and the drying process to wafer is completed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor fabrication, and in particular to a displacement drying method and apparatus based on IPA. Background Technology

[0002] In the field of semiconductor fabrication, existing IPA (isopropanol) displacement drying methods mainly involve spraying heated nitrogen gas onto wafers immersed in IPA solution to vaporize the IPA on the wafer surface, causing water molecules attached to the wafer surface to detach and achieve the drying effect. However, existing IPA displacement drying methods all involve placing the wafer statically in the drying tank and using exhaust gas to drive airflow to promote drying. This method is not very effective for drying wafers, especially for wafers with complex surface patterns. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide an IPA-based displacement drying method and apparatus, which solves the problems of insignificant wafer drying effect and wafer damage during the drying process in the prior art.

[0004] To solve the above technical problems, the present invention provides an IPA-based displacement drying method, comprising:

[0005] A wafer box containing several wafers is placed in a drying tank and supported by a swinging component, which drives the supporting component to swing periodically along the wafer arrangement direction.

[0006] The periodic oscillation includes:

[0007] The first stage of cyclic oscillation is performed at the first oscillation angle, and the positional relationship between the wafer and the wafer cassette slot is adjusted by high-amplitude oscillation.

[0008] The second stage of cyclic oscillation is performed at the second oscillation angle, and the wafer is positioned and dried by low-amplitude oscillation.

[0009] The first swing angle is greater than the second swing angle.

[0010] Optionally, the first stage of periodic oscillation further includes: assisting in fixing the wafer by providing a limiting component on the supporting component; and / or,

[0011] The second stage of periodic oscillation also includes: using a limiting component on the bearing component to assist in fixing the wafer.

[0012] Optional,

[0013] Before the oscillating component drives the carrier component to oscillate periodically along the wafer alignment direction, it also includes:

[0014] IPA is injected into the drying tank, and the IPA wets the wafer beyond its maximum height.

[0015] Phased emission of IPA;

[0016] Heating nitrogen gas is injected into the drying tank.

[0017] Optionally, the second-stage periodic oscillation is performed simultaneously with the process of venting the drying tank.

[0018] Optionally, the connecting rod of the swing component is connected to the swing fulcrum of the bearing component to perform lever-type back-and-forth swinging.

[0019] Optionally, the supporting component carries a single-wafer box or a dual-wafer box to perform periodic oscillations.

[0020] Optionally, when the single-crystal cell performs periodic oscillation, the first oscillation angle is 10-15 degrees and the second oscillation angle is 7-8 degrees.

[0021] Optionally, when the dual-wafer box type performs periodic oscillation, the first oscillation angle is 5-8 degrees, and the second oscillation angle is 2-3 degrees. The present invention also provides an IPA-based displacement drying device, comprising:

[0022] The drying tank contains a wafer box carrying several wafers for the drying process.

[0023] The supporting component is located at the bottom of the drying tank and supports the wafer cassette.

[0024] The oscillating component drives the supporting component to oscillate periodically along the wafer alignment direction;

[0025] The control component controls the oscillating component to perform a first-stage periodic oscillation at a first oscillation angle, so as to adjust the positional relationship between the wafer and the wafer cassette slot through high-amplitude oscillation;

[0026] The second stage of cyclic oscillation is performed at the second oscillation angle to position the wafer for drying by low-amplitude oscillation;

[0027] Wherein, the first swing angle is greater than the second swing angle.

[0028] Optionally, the supporting component is provided with a limiting component corresponding to the wafer cassette slot to assist in fixing the wafer during the wafer's periodic oscillation.

[0029] Optionally, the limiting component is a double-tooth bracket.

[0030] Optionally, the spacing of the double-toothed bracket is smaller than the spacing of the wafer cassette slot.

[0031] Optionally, the double-toothed bracket is misaligned with the wafer cassette slot.

[0032] As can be seen, the IPA-based displacement drying method provided by this invention includes a wafer cassette containing several wafers placed in a drying tank, and a swinging component driving the carrier component to periodically swing along the wafer arrangement direction. The periodic swinging includes: a first-stage periodic swing at a first swing angle, adjusting the positional relationship between the wafers and the wafer cassette slots through high-amplitude swinging; and a second-stage periodic swing at a second swing angle, positioning the wafers for drying through low-amplitude swinging. The first swing angle is greater than the second swing angle. This invention, by setting up a swinging component and simultaneously utilizing it to drive the wafers to perform large-amplitude periodic swings along the arrangement direction, adjusts the positional relationship between the wafers and the wafer cassette, and combines this with small-amplitude periodic swings to lock the wafer position and complete the wafer drying process.

[0033] In addition, the present invention also provides an IPA-based displacement drying device, which also has the above-mentioned beneficial effects. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0035] Figure 1 A flowchart of an IPA-based displacement drying method provided in an embodiment of the present invention;

[0036] Figure 2 A schematic diagram of a displacement drying device based on IPA provided in an embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram of a structure with a V-shaped groove for a wafer provided in an embodiment of the present invention;

[0038] Figure 4 A schematic diagram of another IPA-based displacement drying device provided in an embodiment of the present invention;

[0039] Figure 5 An example diagram of an IPA-based displacement drying process provided in an embodiment of the present invention;

[0040] Figure 6 Another example diagram of an IPA-based displacement drying process provided in an embodiment of the present invention;

[0041] Figures 2 to 4 The reference numerals in the attached figures are explained as follows:

[0042] 10-Drying tank, 11-Nitrogen inlet, 12-Gas exhaust channel, 13-Gas exhaust port;

[0043] 20 - Load-bearing components;

[0044] 30 - Oscillating component;

[0045] 40 - Limiting component; 41 - Double toothed bracket; 42 - V-shaped groove;

[0046] 50 - Cover;

[0047] 60 - Wafer box, 61 - Wafer;

[0048] 70 - Positioning block. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] Example 1:

[0051] Please refer to Figure 1 , Figure 1 A flowchart illustrating an IPA-based displacement drying method provided in an embodiment of the present invention. The method may include:

[0052] S101: A wafer box containing several wafers is placed in a drying tank and supported by a swinging component, which drives the supporting component to swing periodically along the wafer arrangement direction.

[0053] Periodic oscillations include:

[0054] Step S1: Perform the first stage of periodic oscillation at the first oscillation angle, and adjust the positional relationship between the wafer and the wafer cassette slot through high-amplitude oscillation;

[0055] Step S2: Perform a second-stage periodic oscillation at the second oscillation angle to position the wafer for drying by low-amplitude oscillation;

[0056] The first swing angle is greater than the second swing angle. The main body of this embodiment is a drying device. In this embodiment, the wafer is placed in a wafer cassette and then placed inside the drying tank. The wafer cassette is connected to a support component, which is connected to a swinging component. The swinging component drives the wafer cassette to swing through the support component, thereby causing the wafer to swing. In this embodiment, during the wafer drying process, isopropanol is introduced into the cleaned wafer. After the isopropanol is discharged, heated nitrogen gas is introduced into the drying tank, and the exhaust port of the drying tank is prepared to be opened to simultaneously discharge the gas in the drying tank when heated nitrogen gas is introduced. This includes discharging the mixed gas formed during the reaction of heated nitrogen gas with isopropanol and moisture. This embodiment does not limit the specific swing angle values ​​of the first and second swing angles, as long as they can improve the wafer drying effect without damaging the wafer.

[0057] Furthermore, to prevent collision damage to the wafers within the wafer cassette when the oscillating component drives the wafers to oscillate, and to prevent stacking of adjacent wafers within the wafer cassette, the aforementioned first-stage periodic oscillation may further include: using a limiting component on the supporting component to assist in fixing the wafers; and / or,

[0058] The second-stage periodic oscillation may also include: using limiting components on the carrier component to assist in fixing the wafer.

[0059] It should be noted that, in this embodiment, because the wafer thickness in the wafer cassette is not fixed, when the wafer is placed in the wafer cassette and the wafer cassette is oscillating, the thin wafers inside may experience stacking or collision damage due to their large range of movement. To avoid the above defects, in this embodiment, when the wafer cassette is connected to the carrier component, a limiting component provided on the carrier component is used to assist in fixing the wafer, thereby limiting the wafer position. For example, at least a portion of the edge region of the wafer can be set in the limiting component, wherein the at least a portion of the edge region of the wafer may include a portion of the arcuate side surface of the wafer, or the entire exposed area of ​​the arcuate side surface of the wafer, or the at least a portion of the edge region of the wafer may also include a region on the circular surface of the wafer that is less than a preset distance from the edge, or it may be a combination of the above regions. Accordingly, this embodiment does not limit the specific method of using the limiting component to limit the wafer position. Further, in order to ensure that the wafer can complete the drying step, before the oscillating component drives the carrier component to oscillate periodically along the wafer arrangement direction, the following may also be included:

[0060] Step S11: IPA is injected into the drying tank, and the IPA wetting exceeds the maximum height of the wafer;

[0061] Step S12: Staged emission of IPA;

[0062] Step S13: Inject heated nitrogen gas into the drying tank.

[0063] It should be noted that in this embodiment, IPA is injected into the drying tank until it completely submerges the wafer. The IPA is then discharged in stages, causing the surface of the wafer containing residual moisture to be coated with IPA. Heated nitrogen is then injected into the tank, causing the heated nitrogen, IPA, and residual moisture to form an azeotrope, which is then discharged through the drying tank along with the heated nitrogen, thus drying the wafer surface. This embodiment does not limit the specific triggering time for the venting step of the drying tank. For example, the venting can be performed before the oscillating component moves the wafer, or it can be performed when the oscillating component moves the wafer at a first oscillation angle during the first stage of a cycle, or it can be performed when the oscillating component moves the wafer at a second oscillation angle during the second stage of a cycle.

[0064] Furthermore, in order to improve the drying efficiency and ensure that the heated nitrogen gas reacts fully with the IPA, the aforementioned second-stage periodic oscillation can be carried out simultaneously with the process of venting the drying tank.

[0065] It should be noted that in this embodiment, the second-stage periodic oscillation is set to be performed simultaneously with the exhaust process of the drying tank. When the oscillating component drives the wafer to perform the first-stage periodic oscillation, the wafer is in the positioning and adjustment stage, and the oscillation process is unstable. In order to ensure that the heated nitrogen gas fully reacts with the residual IPA after being injected into the drying tank and to improve the utilization rate of the heated nitrogen gas, the drying tank starts to exhaust gas when the oscillating component drives the wafer to perform the second-stage periodic oscillation, so as to ensure the drying effect of the wafer.

[0066] Furthermore, to ensure the drying process can proceed stably, the aforementioned second-stage periodic oscillation and the process of venting the drying tank are carried out simultaneously, and may include the following steps:

[0067] Step S21: If the temperature inside the drying tank is greater than the preset temperature (e.g., 50 degrees Celsius), and / or the gas concentration inside the drying tank reaches the preset gas concentration, then start venting the drying tank; the preset gas concentration is the gas concentration when the heated nitrogen and IPA in the drying tank reach saturation.

[0068] It should be noted that in this embodiment, the temperature and gas concentration inside the drying tank are used to determine when the water molecules on the wafer surface are undergoing the replacement process of heated nitrogen and isopropanol. At this time, the exhaust outlet can be opened to exhaust the gas.

[0069] Step S22: When the drying tank is vented, the oscillating component is used to drive the wafer to perform a second-stage periodic oscillation, and the wafer in the wafer box is locked in the limiting component.

[0070] In this embodiment, during the venting process, the oscillating component is used to drive the wafer to perform a second-stage periodic oscillation. When the wafer is locked in the limiting component, the oscillation continues to make it easier for moisture on the surface of the wafer to be removed.

[0071] The IPA-based displacement drying method and apparatus provided in this invention are applied to the semiconductor fabrication field. The method includes: a wafer cassette carrying several wafers is placed in a drying tank by a supporting component; a swinging component drives the supporting component to periodically swing along the wafer arrangement direction; wherein the periodic swinging includes: a first-stage periodic swinging at a first swing angle, adjusting the positional relationship between the wafer and the wafer cassette slot through high-amplitude swinging; and a second-stage periodic swinging at a second swing angle, positioning the wafer for drying through low-amplitude swinging; the first swing angle is greater than the second swing angle. This invention, by setting up a swinging component and simultaneously utilizing the swinging component to drive the wafer to perform large-amplitude periodic swinging along the arrangement direction to adjust the positional relationship between the wafer and the wafer cassette, and combining this with small-amplitude periodic swinging, locks the wafer position and completes the wafer drying process. Furthermore, in this embodiment of the invention, by using limiting components on the supporting component to assist in fixing the wafer during the first-stage periodic oscillation, and / or by using limiting components on the supporting component to assist in fixing the wafer during the second-stage periodic oscillation, it is possible to avoid collision damage to the wafers in the wafer cassette when the oscillating component drives the wafers to oscillate, and to avoid stacking of adjacent wafers in the wafer cassette. By injecting IPA into the drying tank to the height of immersing all the wafers, and by discharging IPA in stages, IPA is adsorbed on the surface of residual moisture in the wafers. By injecting heated nitrogen into the tank, the heated nitrogen, IPA, and residual moisture form an azeotrope, which is then discharged through the exhaust port of the drying tank along with the heated nitrogen, ensuring the drying effect on the wafer surface. By simultaneously performing the second-stage periodic oscillation and the exhaust process of the drying tank, the drying efficiency is improved, and the heated nitrogen and IPA are ensured to react fully.

[0072] Example 2:

[0073] The displacement drying method based on IPA provided in this embodiment of the invention may include:

[0074] A wafer box containing several wafers is placed in a drying tank and supported by a swinging component, which drives the supporting component to swing periodically along the wafer arrangement direction.

[0075] The connecting rod of the swing component is connected to the swing fulcrum of the bearing component, and swings back and forth in a lever-like manner;

[0076] Periodic oscillations include:

[0077] The first stage of cyclic oscillation is performed at the first oscillation angle, and the positional relationship between the wafer and the wafer cassette slot is adjusted by high-amplitude oscillation.

[0078] The second stage of cyclic oscillation is performed at the second oscillation angle, and the wafer is positioned and dried by low-amplitude oscillation.

[0079] The first swing angle is greater than the second swing angle.

[0080] It should be noted that in this embodiment, by connecting the connecting rod of the swing component to the swing fulcrum of the bearing component, a lever-like back-and-forth swing is achieved, ensuring continuous and stable swing. This reduces the space occupied during the swing process.

[0081] Furthermore, in order to ensure the stability of the oscillation, the aforementioned supporting component can support a single-wafer box or a dual-wafer box for periodic oscillation.

[0082] It should be noted that in this embodiment, a support component carries a single-wafer box-type or dual-wafer box-type structure and drives the structure to oscillate periodically, ensuring effective drying of moisture on the wafer surface. To ensure the oscillating component can drive the wafer to oscillate periodically and to reduce the complexity of the oscillating component structure, the support component carrying the single-wafer box-type or dual-wafer box-type structure to oscillate periodically may include the following steps:

[0083] Step S31: Use the swinging component to swing the wafer cassette to one side along the preset plane from the initial position, and use the swinging component to return the wafer cassette to the initial position.

[0084] This embodiment utilizes a swinging component to swing the wafer cassette to one side along a preset plane and return it to its initial position, which constitutes half a swing cycle. This embodiment does not limit the specific plane containing the preset plane; any plane that allows the wafer cassette to swing along both sides of the preset plane with the swinging component is acceptable. For example, the preset plane can be a plane perpendicular to the wafer alignment direction, or it can be a plane parallel to the wafer alignment direction. To ensure efficient wafer drying, a plane parallel to the wafer alignment direction can be selected as the preset plane.

[0085] Step S32: When the wafer cassette returns to its initial position, the oscillating component continues to drive the wafer cassette to swing to the other side along the preset plane, and the oscillating component drives the wafer cassette to return to its initial position, which is one oscillation cycle.

[0086] In this embodiment, the oscillating component drives the wafer cassette to oscillate along a preset plane to the other side and return to the initial position. As one oscillation cycle, the efficiency of drying moisture on the wafer surface can be improved.

[0087] Step S33: Use the oscillating component to drive the wafer cassette to repeatedly oscillate in an oscillation cycle.

[0088] This embodiment utilizes a swinging component to drive the wafer cassette to perform the aforementioned periodic swinging motion, which ensures drying efficiency while preventing wafer collisions and damage within the wafer cassette, thereby improving the yield of high-quality wafers.

[0089] Furthermore, in order to ensure a reasonable swing angle when the supporting component drives the single-crystal wafer to swing periodically, thereby improving drying efficiency and preventing damage to the wafer, the first swing angle of the aforementioned single-crystal wafer cassette during periodic swing can be, for example, 10-15 degrees, and the second swing angle can be, for example, 7-8 degrees. The specific swing angle can be set and adjusted according to actual needs.

[0090] In this embodiment, when the supporting component drives the single wafer cassette to oscillate periodically, the first oscillation angle is set to 10 to 15 degrees to adjust the positional relationship between the wafer and the wafer cassette slot, and the second oscillation angle is set to 7 to 8 degrees to position the wafer.

[0091] Furthermore, in order to ensure a reasonable swing angle when the supporting component drives the dual-wafer box to swing periodically, thereby improving drying efficiency and preventing damage to the wafers, the first swing angle of the aforementioned dual-wafer box during periodic swinging can be, for example, 5-8 degrees, and the second swing angle can be, for example, 2-3 degrees. The specific swing angle can be set and adjusted according to actual needs.

[0092] It should be noted that in this embodiment, when the supporting component drives the dual wafer cassette to swing periodically, the first swing angle is set to 5 to 8 degrees to adjust the positional relationship between the wafer and the wafer cassette slot, and the second swing angle is set to 2 to 3 degrees to position the wafer.

[0093] The IPA-based displacement drying method and apparatus provided in this invention are applied to the semiconductor fabrication field. The method includes: a wafer cassette carrying several wafers is placed in a drying tank by a supporting component; a swinging component drives the supporting component to periodically swing along the wafer arrangement direction; a connecting rod of the swinging component is connected to the swing fulcrum of the supporting component, performing lever-like back-and-forth swinging. The periodic swinging includes: a first-stage periodic swing at a first swing angle, adjusting the positional relationship between the wafer and the wafer cassette slot through high-amplitude swinging; and a second-stage periodic swing at a second swing angle, positioning the wafer for drying through low-amplitude swinging; the first swing angle is greater than the second swing angle. This invention, by setting up a swinging component and simultaneously utilizing it to drive the wafer to perform large-amplitude periodic swinging along the arrangement direction to adjust the positional relationship between the wafer and the wafer cassette, combined with small-amplitude periodic swinging, locks the wafer position and completes the wafer drying process. By connecting the connecting rod of the swinging component to the swing fulcrum of the supporting component for lever-like back-and-forth swinging, continuous and stable swinging is ensured, reducing the space occupied by the swinging process. Furthermore, in this embodiment of the invention, a single-wafer cassette or dual-wafer cassette structure is supported by a supporting component, and the structure is driven to oscillate periodically, which can ensure effective drying of moisture on the wafer surface. When the single-wafer cassette is oscillated periodically, the first oscillation angle can be 10-15 degrees and the second oscillation angle can be 7-8 degrees. When the dual-wafer cassette is oscillated periodically, the first oscillation angle can be 5-8 degrees and the second oscillation angle can be 2-3 degrees. This ensures that when the supporting component drives the wafer cassette to oscillate periodically, a reasonable oscillation angle is maintained, improving drying efficiency without damaging the wafer.

[0094] The displacement drying apparatus based on IPA provided in the embodiments of the present invention will be described below. The displacement drying apparatus based on IPA described below can be referred to in correspondence with the displacement drying method based on IPA described above.

[0095] Please refer to the details. Figure 2 , Figure 2 A schematic diagram of a displacement drying device based on IPA provided in an embodiment of the present invention may include:

[0096] The drying tank 10 contains a wafer box 60 carrying a number of wafers 61 for drying process.

[0097] The supporting component 20 is disposed at the bottom of the drying tank 10 and supports the wafer cassette 60.

[0098] The oscillating component 30 drives the supporting component 20 to oscillate periodically along the arrangement direction of the wafer 61;

[0099] The control component controls the swing component to swing at a first swing angle for a first stage of periodic swing, so as to adjust the positional relationship between the wafer 61 and the wafer cassette slot through high-amplitude swing;

[0100] The second stage of cyclic oscillation is performed at the second oscillation angle to position wafer 61 for drying by low-amplitude oscillation;

[0101] The first swing angle is greater than the second swing angle.

[0102] It should be noted that, in this embodiment, a nitrogen inlet 11 is provided in the cover 50 at the top of the drying tank 10 to supply heating nitrogen into the drying tank 10. The cover 50 creates a closed space inside the drying tank 10. A gas outlet 13 is provided on the bottom side of the drying tank 10 to allow gas to enter the gas outlet channel 12 and exit, forming a downward gas flow field within the drying tank 10. Furthermore, the unlabeled parts in this embodiment can adopt the same structure as a conventional drying tank. A positioning block 70 is provided in this embodiment for connection. Further, to ensure that the wafer 61 inside the wafer cassette 60 is locked within the wafer cassette 60 during oscillation, a limiting component 40 is provided on the bearing component 20 corresponding to the wafer cassette slot to assist in fixing the wafer 61 during periodic oscillation.

[0103] It should be noted that the specific structure of the limiting component 40 is not limited in this embodiment. For example, the limiting component 40 can be a groove-type structure, or it can be other structures. In this embodiment, by setting at least a portion of the edge region of the wafer in the limiting component 40, when the wafer needs to be oscillated, the wafer is fixed in the wafer cassette 60 and the limiting component 40, avoiding wafer stacking and collision damage, and improving the product yield. In this embodiment, the limiting component 40 is particularly effective in fixing thin wafers; therefore, the wafer is preferably a thin wafer in this embodiment.

[0104] Furthermore, in order to improve the limiting effect of the limiting component 40 on the wafer 61, the limiting component 40 can be a double-toothed bracket.

[0105] It should be noted that in this embodiment, each wafer 61 corresponds to a set of grooves in the double-tooth carrier, that is, each set of grooves is used to limit the position of a wafer, thereby improving the wafer yield. A set of grooves consists of two grooves corresponding to each other in the double tooth carrier.

[0106] Furthermore, in order to ensure the auxiliary fixing effect of the double-tooth bracket on the wafer 61, the spacing of the double-tooth bracket can be smaller than the spacing of the wafer cassette slot.

[0107] It should be noted that, in this embodiment, by setting the size of each groove in the double-tooth bracket to be smaller than the size of each wafer cassette slot, it is possible to secure the wafer 61 with a smaller movable space, so as to ensure that the wafer 61 is locked in the slot of the wafer cassette 60 during the swinging process.

[0108] Furthermore, in order to ensure that the double-toothed bracket assists the wafer 61 in being fixed in the wafer cassette slot, the double-toothed bracket can be offset from the wafer cassette slot.

[0109] It should be noted that in this embodiment, the double-tooth bracket is set to be misaligned with the wafer cassette slot, that is, the groove in the double-tooth bracket is misaligned with the wafer cassette slot, to ensure that the wafer is fixed in the wafer cassette slot at an angle, thereby further ensuring the stability of the wafer during the swinging process and avoiding collision damage.

[0110] Furthermore, to ensure the stability of the double-toothed bracket in assisting wafer fixation, the groove in the double-toothed bracket can be a V-shaped groove. See reference [link / reference needed] for details. Figure 3 , Figure 3 This is a schematic diagram of a structure with a V-shaped groove for a wafer provided in an embodiment of the present invention.

[0111] It should be noted that in this embodiment, when the wafer swings, the upper and lower centers of gravity of the wafer shift under the action of the swing, causing the contact surface at the bottom of the wafer to move upwards to the locking surface of the V-shaped groove 42. The upper end of the wafer is then subjected to the effect of the center of gravity distribution adjustment, resulting in a slightly backward tilt, which locks the wafer in the V-shaped groove 42.

[0112] Furthermore, to ensure that the oscillating component 30 can drive the wafer to oscillate, reference can be made to... Figure 4 , Figure 4 This is a schematic diagram of another IPA-based displacement drying device provided in an embodiment of the present invention. The aforementioned oscillating component 30 can be a crank-rocker oscillating component 30;

[0113] A swing fulcrum is provided in the load-bearing component 20.

[0114] In this embodiment, by setting the swing component 30 as a crank-rocker swing component 30 and setting a corresponding swing fulcrum in the bearing component 20, it is possible to ensure that the wafer is driven to swing by the crank-rocker swing component 30, thereby reducing the manufacturing cost.

[0115] It should be further noted that the IPA-based displacement drying device provided in this embodiment has a wafer-limiting effect that can be referenced during operation. Figure 5 and Figure 6 , Figure 5 This is an example diagram of an IPA-based displacement drying process provided in an embodiment of the present invention. Figure 6This is an example diagram of another IPA-based displacement drying process provided in an embodiment of the present invention. Figure 5 and Figure 6 In the corresponding diagrams, the upper diagram shows an example of the direction in which the double-toothed carrier drives the wafer to swing, while the lower diagram shows an example of the specific posture of the wafer under the action of the double-toothed carrier and the wafer cassette slot. Figure 5 When the wafer is not oscillating, it maintains its original posture. When the oscillating component drives the wafer cassette to oscillate to the right, the V-shaped groove and the wafer cassette slot work together to limit the wafer to one edge of the V-shaped groove. The wafer then experiences a large-angle oscillation, causing it to slide towards the central axis of the V-shaped groove in the double-toothed bracket due to the inertia of the bracket. This further limits the wafer's position within the V-shaped groove, preventing stacking and other issues. Similarly, Figure 6 The middle section describes the process of the V-shaped groove and the wafer cassette slot limiting the wafer when the swinging component drives the wafer cassette to swing to the left.

[0116] The IPA-based displacement drying apparatus provided in this invention includes a drying tank containing a wafer cassette carrying several wafers for drying. A supporting component, located at the bottom of the drying tank, supports the wafer cassette. A swinging component drives the supporting component to periodically swing along the wafer arrangement direction. A control component controls the swinging component to perform a first-stage periodic swing at a first swing angle to adjust the positional relationship between the wafers and the wafer cassette slots through high-amplitude swinging, and a second-stage periodic swing at a second swing angle to position the wafers for drying through low-amplitude swinging. The first swing angle is greater than the second swing angle. This invention, by incorporating a swinging component and simultaneously using it to drive the wafers to perform large-amplitude periodic swinging along the arrangement direction to adjust the positional relationship between the wafers and the wafer cassette, combined with small-amplitude periodic swinging, locks the wafer position and completes the wafer drying process. Furthermore, in this embodiment of the invention, a limiting component is provided on the supporting component corresponding to the wafer cassette slot to assist in fixing the wafer during the wafer's periodic oscillation, ensuring that the wafer inside the wafer cassette can be locked in the wafer cassette slot during oscillation; the limiting component is set as a double-tooth bracket, which improves the limiting effect of the limiting component on the wafer; by setting the size of each groove in the double-tooth bracket to be smaller than the size of each wafer cassette slot, it is possible to fix the wafer using a smaller movable space, so as to ensure that the wafer is locked in the wafer cassette slot during oscillation; by setting the double-tooth bracket to be offset from the wafer cassette slot, it is ensured that the wafer is fixed in the wafer cassette slot at an angle, further ensuring the stability of the wafer during oscillation and avoiding collision damage.

[0117] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0118] Finally, it should be noted that in this document, relationships such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0119] The above provides a detailed description of the IPA-based displacement drying method and apparatus provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A displacement drying method based on IPA, characterized in that, include: A wafer box containing several wafers is placed in a drying tank and supported by a swinging component, which drives the supporting component to swing periodically along the wafer arrangement direction. The periodic oscillation includes: The first stage of the cycle is oscillating at a first oscillation angle, and the positional relationship between the wafer and the wafer cassette slot is adjusted by high-amplitude oscillation; the first stage of the cycle oscillation also includes: the wafer is fixed by a double-tooth bracket provided on the bearing component; due to the large-angle oscillation, the wafer is affected by the inertia of the double-tooth bracket and slides towards the central axis of the V-shaped groove in the double-tooth bracket, so as to limit the wafer in the V-shaped groove; The second-stage periodic oscillation is performed at a second oscillation angle, and the wafer is positioned and dried by low-amplitude oscillation; the second-stage periodic oscillation also includes: the wafer is fixed by the double-tooth bracket provided on the bearing component; under the action of oscillation, the upper and lower center of gravity of the wafer shifts, so that the contact surface of the bottom of the wafer and the V-shaped groove are pushed upward to the locking surface of the V-shaped groove, and the upper end of the wafer is adjusted by the distribution of the center of gravity again, producing a slightly backward tilt, locking the wafer in the V-shaped groove; The first swing angle is greater than the second swing angle.

2. The IPA-based displacement drying method according to claim 1, characterized in that, Before the oscillating component drives the carrier component to oscillate periodically along the wafer alignment direction, it also includes: IPA is injected into the drying tank, and the IPA wets the wafer beyond its maximum height. Phased emission of IPA; Heating nitrogen gas is injected into the drying tank.

3. The IPA-based displacement drying method according to claim 1, characterized in that, The second stage of periodic oscillation occurs simultaneously with the process of venting the drying tank.

4. The IPA-based displacement drying method according to any one of claims 1 to 3, characterized in that, The connecting rod of the swing component is connected to the swing fulcrum of the bearing component, and swings back and forth in a lever-like manner.

5. The IPA-based displacement drying method according to claim 4, characterized in that, The supporting component supports the single-wafer box or dual-wafer box to oscillate periodically.

6. The IPA-based displacement drying method according to claim 5, characterized in that, When the single-crystal cell performs periodic oscillation, the first oscillation angle is 10-15 degrees and the second oscillation angle is 7-8 degrees.

7. The IPA-based displacement drying method according to claim 5, characterized in that, When the bi-wafer box type performs periodic oscillation, the first oscillation angle is 5-8 degrees and the second oscillation angle is 2-3 degrees.

8. A displacement drying device based on IPA, characterized in that, include: The drying tank contains a wafer box carrying several wafers for the drying process. The supporting component is located at the bottom of the drying tank and supports the wafer cassette. The supporting component is provided with a double toothed bracket corresponding to the wafer cassette slot. The groove in the double toothed bracket is a V-shaped groove, which helps to fix the wafer during the wafer's periodic oscillation. The oscillating component drives the supporting component to oscillate periodically along the wafer alignment direction; The control component controls the swing component to swing at a first swing angle for a first stage of periodic swing, so as to adjust the positional relationship between the wafer and the wafer cassette slot through high-amplitude swing; under the influence of the inertia of the double-toothed bracket, the wafer slides towards the central axis of the V-shaped groove in the double-toothed bracket, so as to limit the wafer in the V-shaped groove. The wafer is positioned and dried by low-amplitude oscillation at the second oscillation angle in the second stage of cyclic oscillation. Under the action of oscillation, the upper and lower center of gravity of the wafer shifts, so that the contact surface at the bottom of the wafer and the V-shaped groove are pushed upward to the locking surface of the V-shaped groove. The upper end of the wafer is then adjusted by the distribution of the center of gravity, resulting in a slightly backward tilt, which locks the wafer in the V-shaped groove. Wherein, the first swing angle is greater than the second swing angle.

9. The IPA-based displacement drying apparatus according to claim 8, characterized in that, The double-tooth bracket is misaligned with the wafer cassette slot.

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