A method and related device for evaluating the state of a current-carrying connection structure

Abstract

The present application discloses a state assessment method and related devices for a current-carrying connection structure. The method combines the temperature distribution characteristics of the temperature sensor layout and the layout points, adopts differentiated evaluation weight indicators, and constructs a temperature field distribution inside a device containing a current-carrying connection structure based on a limited set of sensor data, which greatly improves the accuracy. Compared with the existing digital twin technology of power equipment, which mainly focuses on the three-dimensional visualization of the equipment appearance and the data visualization of the sensor, the present application can effectively construct the temperature field distribution inside the device through a limited set of sensor data, so that the equipment state assessment evolves from a single-point sensor distribution to a visual assessment of the internal multi-physical field, thereby increasing the accuracy of the assessment and analysis. In the present application, the reconstruction process of the temperature field distribution inside the device adopts a fast calculation method, which can greatly increase the timeliness of the process of reconstructing the temperature field distribution of the device through sensor measurement values, and greatly reduce the time of visual online assessment.

Description

Technical Field

[0001] The present application relates to the technical field of status assessment of power transmission and transformation equipment, and in particular to a status assessment method and related device for a current-carrying connection structure. Background Art

[0002] The digital twin of power transmission and transformation equipment is a mirror image of the equipment entity in virtual space. In order to deeply analyze the internal equipment of the equipment during operation and provide early warning and maintenance measures to the operation and maintenance personnel in a timely manner, it is necessary to realize the visualization of the multi-physical field distribution of the equipment in the digital twin, and evaluate the health status of the equipment in combination with the multi-physical field distribution. However, due to the limitations of the current sensing technology and insulation structure design of power transmission and transformation equipment, most sensors cannot effectively penetrate into the equipment, and the number of measurement points is limited. Therefore, it is difficult to construct the multi-physical field distribution characteristics to comprehensively and accurately evaluate the equipment. Therefore, it is of great significance to reconstruct the state of the multi-physical field distribution inside the power transmission and transformation equipment through limited sensing data combined with multi-physical field simulation computing technology.

[0003] The current-carrying connection structure is a key component used in transformers and switch-type equipment. Bushing devices, switch contacts, etc. all use a large number of contact finger designs of the current-carrying connection structure. However, affected by external factors such as installation and long-term wear, the current-carrying connection structure has increased contact resistance and deteriorated microscopic contact surfaces. Diagnosis of the current-carrying connection status through multi-physical field distribution is an important method for current analysis and evaluation.

[0004] Therefore, according to the real-time requirements of digital twins, it is urgent to further improve the speed of reconstructing the multi-physical field distribution state inside the equipment in order to quickly evaluate the internal state of the equipment and provide support for equipment fault repair and operation. Summary of the invention

[0005] The present application provides a state assessment method and related device for a current-carrying connection structure, which is used to effectively combine sensors to quickly analyze the multi-physical field distribution inside the output device under the current state, providing a technical basis for the state assessment of the device and the visualization of the internal characteristics of the digital twin.

[0006] In view of this, a first aspect of the present application provides a method for evaluating the state of a current-carrying connection structure, the method comprising:

[0007] S1. Establish a rapid calculation model for the temperature field distribution of the whole view of the equipment including the current-carrying connection structure;

[0008] S2. Determine a sensor arrangement scheme for the device including the current-carrying connection structure, wherein the sensor arrangement scheme is: setting the number of sensors and measuring points based on the sensor arrangeable interval, and obtaining temperature values ​​of several measuring points in the sensor arrangement scheme as actual measurement values;

[0009] S3, calculating the temperature field distribution characteristics of the equipment containing the current-carrying connection structure under normal operating conditions through the temperature field distribution rapid calculation model, and extracting the temperature value of the measuring point as a simulation measurement value based on the temperature field distribution characteristics;

[0010] S4, subtracting the actual measurement value from the simulated measurement value to obtain an error value, and calculating an evaluation index of the error value;

[0011] S5, when the evaluation index is not less than the preset threshold, changing the contact state of the contact of the current-carrying connection structure, returning to step S3, when the evaluation index is less than the preset threshold, outputting the temperature field distribution characteristic;

[0012] S6. Evaluate the state of the current-carrying connection structure according to the temperature field distribution characteristics.

[0013] Optionally, the step of establishing a rapid calculation model for the temperature field distribution of a panoramic view of the current-carrying connection structure equipment specifically includes:

[0014] The sampling method is used to determine several groups of condition combinations, including: different current carrying capacity, ambient temperature, external ventilation, and plug contact status;

[0015] According to the combination of conditions, the temperature field distribution and the fluid field distribution of the finite element simulation are obtained, wherein the plug contact state is characterized by the contact resistance ρ and used as the boundary condition of the finite element input;

[0016] The fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution is constructed to obtain a rapid calculation model for the temperature field distribution.

[0017] Optionally, the constructing of the fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution specifically includes:

[0018] Based on the second-order type formula, the fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution;

[0019] Among them, the second-order type formula is:

[0020]

[0021] Where b is the value of the grid node in the temperature field distribution and fluid field distribution; ε is the observation error; β0, β i , β ii , β ji is the fitting coefficient; p i and p j is the value under each condition; q is the total number of conditions in the condition combination.

[0022] Optionally, the setting of the number and measuring points of sensors based on the sensor deployable interval specifically includes:

[0023] Based on the sensor arrangement range, no less than 4 temperature sensors are set, and are respectively arranged at the upper part, lower part and left and right sides around the current-carrying connection structure.

[0024] Optionally, the calculating of the temperature field distribution characteristics of the current-carrying connection structure equipment to be evaluated under normal operating conditions by using the temperature field distribution rapid calculation model specifically includes:

[0025] Obtaining the operating parameters and environmental parameters of the current-carrying connection structure equipment to be evaluated during normal operation through a real-time monitoring system;

[0026] The operating parameters and the environmental parameters are input into a temperature field distribution fast calculation model for calculation, so as to obtain the temperature field distribution characteristics of the equipment containing a current-carrying connection structure to be evaluated under normal operating conditions.

[0027] Optionally, the evaluation index for calculating the error value specifically includes:

[0028] Calculate the evaluation index of the error value based on the normalized weight index calculation formula;

[0029] The normalized weight index calculation formula is:

[0030]

[0031] Where, T nt , T ns is the actual measurement value and the simulated measurement value of the temperature at the nth measurement point; ω n The weight of the evaluation index composed of the nth measuring point in the total evaluation index.

[0032] Optionally, step S6 specifically includes:

[0033] Outputting a temperature field distribution cloud map to the upper computer software according to the temperature field distribution characteristics;

[0034] Extracting the maximum temperature of several parts in the temperature field distribution characteristics, so as to determine whether the metal part of the contact of the current-carrying connection structure exceeds the preset temperature threshold, and determine whether the temperature of the polymer material exceeds its glass transition temperature;

[0035] When the metal part of the contact of the current-carrying connection structure exceeds a preset temperature threshold, or the temperature of the polymer material of the current-carrying connection structure exceeds its glass transition temperature, it is determined that there is a problem with the current-carrying connection structure, otherwise continue to monitor. The second aspect of the present application provides a state assessment system for a current-carrying connection structure, the system comprising:

[0036] Establish a unit for establishing a rapid calculation model of the temperature field distribution of the whole view of the equipment including the current-carrying connection structure;

[0037] A first measuring unit is used to determine a sensor arrangement scheme of the device including the current-carrying connection structure, wherein the sensor arrangement scheme is: setting the number of sensors and measuring points based on the sensor arrangeable interval, and obtaining temperature values ​​of several measuring points in the sensor arrangement scheme as actual measurement values;

[0038] A second measuring unit is used to calculate the temperature field distribution characteristics of the equipment containing the current-carrying connection structure under normal operating conditions through the temperature field distribution rapid calculation model, and extract the temperature value of the measuring point as a simulation measurement value based on the temperature field distribution characteristics;

[0039] A calculation unit, used for obtaining an error value by subtracting the actual measurement value from the simulated measurement value, and calculating an evaluation index of the error value;

[0040] A changing unit, used for changing the contact state of the contact of the current-carrying connection structure when the evaluation index is not less than a preset threshold value, and triggering the second measuring unit, and outputting the temperature field distribution characteristic when the evaluation index is less than the preset threshold value;

[0041] An evaluation unit is used to evaluate the state of the current-carrying connection structure according to the temperature field distribution characteristics.

[0042] A third aspect of the present application provides a device for evaluating the state of a current-carrying connection structure, the device comprising a processor and a memory:

[0043] The memory is used to store program codes and transmit the program codes to the processor;

[0044] The processor is used to execute the steps of the method for evaluating the state of a current-carrying connection structure as described in the first aspect according to the instructions in the program code.

[0045] A fourth aspect of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium is used to store program code, and the program code is used to execute the state assessment method of the current-carrying connection structure described in the first aspect above.

[0046] It can be seen from the above technical solutions that this application has the following advantages:

[0047] The present application provides a method for evaluating the state of a current-carrying connection structure, which combines the temperature distribution characteristics of the temperature sensor layout and the layout points, and adopts differentiated evaluation weight indicators to greatly improve the accuracy of the temperature field distribution inside the equipment containing the current-carrying connection structure constructed by a limited set of sensor data; compared with the existing digital twin technology of power equipment, which mainly focuses on the three-dimensional visualization of the equipment appearance and the data visualization of the sensor, the present application can effectively construct the temperature field distribution inside the equipment through a limited set of sensor data, so that the equipment state evaluation evolves from a single-point sensor distribution to a visual evaluation of the internal multi-physical field, thereby increasing the accuracy of the evaluation and analysis; the reconstruction process of the temperature field distribution inside the equipment in the present application adopts a fast calculation method, which can greatly increase the timeliness of the process of reconstructing the temperature field distribution of the equipment through sensor measurement values, and greatly reduce the time of visual online evaluation. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 A schematic flow chart of a method for evaluating a state of a current-carrying connection structure provided in an embodiment of the present application;

[0049] Figure 2 A sensor arrangement scheme including a current-carrying connection structure device provided in an embodiment of the present application;

[0050] Figure 3 A schematic structural diagram of a state assessment system for a current-carrying connection structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0051] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0052] See also Figure 1 , a method for evaluating the state of a current-carrying connection structure provided in an embodiment of the present application includes:

[0053] Step 101: Establish a rapid calculation model for the temperature field distribution of a panoramic view of the current-carrying connection structure equipment.

[0054] It should be noted that, in one embodiment, step 101 specifically includes:

[0055] The sampling method is used to determine several groups of condition combinations, including: different current carrying capacity, ambient temperature, external ventilation, and plug contact status;

[0056] The temperature field distribution and fluid field distribution of the finite element simulation are obtained according to the combination of conditions. Those skilled in the art may also obtain the temperature field distribution and fluid field distribution of the finite volume simulation, which is not limited here. The plug-in contact state is characterized by the contact resistance ρ, which is used as the boundary condition of the finite element input;

[0057] The fitting relationship between each group of condition combinations and the temperature field distribution and fluid field distribution is constructed to obtain a rapid calculation model for the temperature field distribution.

[0058] Furthermore, the fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution is constructed, specifically including:

[0059] Based on the second-order type formula, the fitting relationship between each group of condition combinations and the temperature field distribution and fluid field distribution;

[0060] Among them, the second-order form formula is:

[0061]

[0062] Where b is the value of the grid node in the temperature field distribution and fluid field distribution; ε is the observation error; β0, β i , β ii , β ji is the fitting coefficient; p is the value under each condition; q is the total number of conditions in the condition combination.

[0063] Step 102: determine a sensor arrangement scheme for the device including the current-carrying connection structure, wherein the sensor arrangement scheme is: setting the number of sensors and measuring points based on the sensor arrangeable interval, and obtaining temperature values ​​of several measuring points in the sensor arrangement scheme as actual measurement values.

[0064] It should be noted that the sensor arrangement scheme in this embodiment is specifically as follows: based on the sensor arrangement interval, no less than 4 temperature sensors are arranged, and are respectively arranged at the upper part, the lower part and the left and right sides around the current-carrying connection structure, such as Figure 2 As shown; those skilled in the art can arrange sensors according to actual conditions, which is not limited here. Next, the temperature values ​​of the four measuring points in the sensor arrangement scheme are obtained as actual measurement values.

[0065] Step 103: Calculate the temperature field distribution characteristics of the equipment containing the current-carrying connection structure under normal operating conditions through the temperature field distribution rapid calculation model, and extract the temperature value of the measuring point based on the temperature field distribution characteristics as the simulation measurement value.

[0066] It should be noted that, in one embodiment, step 103 specifically includes: first, obtaining the operating parameters and environmental parameters of the current-carrying connection structure to be evaluated during normal operation through a real-time monitoring system, specifically including: heat sources and heat dissipation conditions such as download flow, ambient temperature, and external ventilation under normal operating conditions; inputting the operating parameters and environmental parameters into a temperature field distribution fast calculation model for calculation, and obtaining the temperature field distribution characteristics of the current-carrying connection structure equipment to be evaluated under normal operating conditions; then, based on the temperature field distribution characteristics, obtaining the temperature values ​​of the sensor measuring points arranged in step 102 as simulation measurement values.

[0067] Step 104: Subtract the actual measurement value from the simulated measurement value to obtain an error value, and calculate an evaluation index of the error value.

[0068] It should be noted that, first, the actual measurement values ​​and the simulated measurement values ​​obtained in step 102 and step 103 are subtracted to obtain an error value; then, an evaluation index of the error value is calculated. In one embodiment, the evaluation index specifically includes:

[0069] Based on the normalized weight index calculation formula, the evaluation index of the error value is calculated;

[0070] Among them, the calculation formula of normalized weight index is:

[0071]

[0072] Where, T nt , T ns is the actual measured value and simulated measured value of the temperature at the nth measuring point; ω n The weight of the evaluation index composed of the nth measuring point in the total evaluation index.

[0073] Step 105, when the evaluation index is not less than the preset threshold, the contact state of the current-carrying connection structure is changed, and the process returns to step 103. When the evaluation index is less than the preset threshold, the temperature field distribution characteristic is output.

[0074] It should be noted that, in one embodiment, the evaluation index F(T) < 0.005 is used as a criterion. When this condition is not met, the contact state of the sliding contact is changed by a machine learning method, and the process returns to step 103 so that F(T) meets the requirement. In this process, the temperature field distribution after the sliding contact state is changed is solved by the above-mentioned fast calculation method. When the evaluation index is less than the preset threshold, the temperature field distribution characteristics are output.

[0075] Step 106: Evaluate the state of the current-carrying connection structure according to the temperature field distribution characteristics.

[0076] It should be noted that, in one embodiment, step 106 specifically includes:

[0077] Output the temperature field distribution cloud map to the upper computer software according to the temperature field distribution characteristics;

[0078] Extract the maximum temperature of key parts in the temperature field distribution characteristics, so as to determine whether the metal part of the contact of the current-carrying connection structure exceeds 105°C, and determine whether the temperature of the polymer material exceeds its glass transition temperature;

[0079] When the temperature of the metal part of the contact of the current-carrying connection structure exceeds 105°C, or the temperature of the polymer material exceeds its glass transition temperature, it is determined that there is a problem with the current-carrying connection structure, otherwise continue monitoring.

[0080] A state assessment method for a current-carrying connection structure provided in an embodiment of the present application combines the temperature sensor layout and the temperature distribution characteristics of the layout points, and adopts differentiated evaluation weight indicators to greatly improve the accuracy of constructing the temperature field distribution inside the equipment containing the current-carrying connection structure based on a limited set of sensor data; compared with the existing digital twin technology of power equipment, which mainly focuses on the three-dimensional visualization of the equipment appearance and the data visualization of the sensor, the present application can effectively construct the temperature field distribution inside the equipment through a limited set of sensor data, so that the equipment state assessment evolves from a single-point sensor distribution to a visual assessment of the internal multi-physical field, thereby increasing the accuracy of the assessment and analysis; the reconstruction process of the temperature field distribution inside the equipment in the present application adopts a fast calculation method, which can greatly increase the timeliness of the process of reconstructing the temperature field distribution of the equipment through sensor measurement values, and greatly reduce the time of visual online assessment.

[0081] The above is a method for evaluating the status of a current-carrying connection structure provided in an embodiment of the present application, and the following is a system for evaluating the status of a current-carrying connection structure provided in an embodiment of the present application.

[0082] See also Figure 3 , a state assessment system for a current-carrying connection structure provided in an embodiment of the present application includes:

[0083] The establishing unit 201 is used to establish a rapid calculation model of the temperature field distribution of the whole view of the equipment including the current-carrying connection structure.

[0084] The first measuring unit 202 is used to determine a sensor arrangement scheme for a device having a current-carrying connection structure, wherein the sensor arrangement scheme is: setting the number of sensors and measuring points based on the sensor arrangeable interval, and obtaining temperature values ​​of several measuring points in the sensor arrangement scheme as actual measurement values.

[0085] The second measurement unit 203 is used to calculate the temperature field distribution characteristics of the equipment containing the current-carrying connection structure under normal operating conditions through a temperature field distribution fast calculation model, and extract the temperature value of the measuring point based on the temperature field distribution characteristics as a simulation measurement value.

[0086] The calculation unit 204 is used to obtain an error value by subtracting the actual measurement value from the simulated measurement value, and calculate an evaluation index of the error value.

[0087] The changing unit 205 is used to change the contact state of the contact of the current-carrying connection structure when the evaluation index is not less than the preset threshold value, and trigger the second measuring unit to output the temperature field distribution characteristics when the evaluation index is less than the preset threshold value.

[0088] The evaluation unit 206 is used to evaluate the state of the current-carrying connection structure according to the temperature field distribution characteristics.

[0089] Furthermore, an embodiment of the present application also provides a state assessment device for a current-carrying connection structure, the device comprising a processor and a memory:

[0090] The memory is used to store program codes and transmit the program codes to the processor;

[0091] The processor is used to execute the steps of the state evaluation method of the current-carrying connection structure as described in the above method embodiment according to the instructions in the program code.

[0092] Furthermore, a computer-readable storage medium is provided in an embodiment of the present application, and the computer-readable storage medium is used to store program code, and the program code is used to execute the state assessment method of the current-carrying connection structure described in the above method embodiment.

[0093] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0094] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0095] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0096] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0097] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0098] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0099] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (full name in English: Read-Only Memory, English abbreviation: ROM), random access memory (full name in English: Random Access Memory, English abbreviation: RAM), disk or optical disk and other media that can store program codes.

[0100] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for evaluating the state of a current-carrying connection structure, characterized in that: include: S1. Establish a rapid calculation model for the temperature field distribution of the whole view of the equipment including the current-carrying connection structure; S2. Determine a sensor arrangement scheme for the device including the current-carrying connection structure, wherein the sensor arrangement scheme is: setting the number of sensors and measuring points based on the sensor arrangeable interval, and obtaining temperature values ​​of several measuring points in the sensor arrangement scheme as actual measurement values; S3, calculating the temperature field distribution characteristics of the equipment containing the current-carrying connection structure under normal operating conditions through the temperature field distribution rapid calculation model, and extracting the temperature value of the measuring point as a simulation measurement value based on the temperature field distribution characteristics; S4, subtracting the actual measurement value from the simulated measurement value to obtain an error value, and calculating an evaluation index of the error value; S5, when the evaluation index is not less than the preset threshold, changing the contact state of the contact of the current-carrying connection structure, returning to step S3, when the evaluation index is less than the preset threshold, outputting the temperature field distribution characteristic; S6. Evaluating the state of the current-carrying connection structure according to the temperature field distribution characteristics; The establishment of a rapid calculation model for the temperature field distribution of the entire device including the current-carrying connection structure specifically includes: The sampling method is used to determine several groups of condition combinations, including: different current carrying capacity, ambient temperature, external ventilation, and plug contact status; According to the combination of conditions, the temperature field distribution and the fluid field distribution of the finite element simulation are obtained, wherein the plug contact state is characterized by the contact resistance ρ and used as the boundary condition of the finite element input; The fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution is constructed to obtain a rapid calculation model for the temperature field distribution.

2. The method for evaluating the state of a current-carrying connection structure according to claim 1, characterized in that: The constructing of the fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution specifically includes: Based on the second-order type formula, the fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution; Among them, the second-order type formula is: Where b is the value of the grid node in the temperature field distribution and fluid field distribution; ε is the observation error; β0, β i , β ii , β ji is the fitting coefficient; p i and p j is the value under each condition; q is the total number of conditions in the condition combination.

3. The method for evaluating the state of a current-carrying connection structure according to claim 1, characterized in that: The step of setting the number of sensors and measuring points based on the sensor deployable interval specifically includes: Based on the sensor arrangement range, no less than 4 temperature sensors are set, and are respectively arranged at the upper part, lower part and left and right sides around the current-carrying connection structure.

4. The method for evaluating the state of a current-carrying connection structure according to claim 1, characterized in that: The temperature field distribution fast calculation model is used to calculate the temperature field distribution characteristics of the current-carrying connection structure equipment to be evaluated under normal operating conditions, specifically including: Obtaining the operating parameters and environmental parameters of the current-carrying connection structure equipment to be evaluated during normal operation through a real-time monitoring system; The operating parameters and the environmental parameters are input into a temperature field distribution fast calculation model for calculation, so as to obtain the temperature field distribution characteristics of the equipment containing a current-carrying connection structure to be evaluated under normal operating conditions.

5. The method for evaluating the state of a current-carrying connection structure according to claim 1, characterized in that: The evaluation index for calculating the error value specifically includes: Calculate the evaluation index of the error value based on the normalized weight index calculation formula; The normalized weight index calculation formula is: Where, T nt , T ns is the actual measurement value and the simulated measurement value of the temperature at the nth measurement point; ω n The weight of the evaluation index composed of the nth measuring point in the total evaluation index.

6. The method for evaluating the state of a current-carrying connection structure according to claim 1, characterized in that: Step S6 specifically includes: Outputting a temperature field distribution cloud map to the upper computer software according to the temperature field distribution characteristics; Extracting the maximum temperature of several parts in the temperature field distribution characteristics, so as to determine whether the metal part of the contact of the current-carrying connection structure exceeds the preset temperature threshold, and determine whether the temperature of the polymer material exceeds its glass transition temperature; When the metal part of the contact of the current-carrying connection structure exceeds the preset temperature threshold, or the temperature of the polymer material of the current-carrying connection structure exceeds its glass transition temperature, it is determined that there is a problem with the current-carrying connection structure, otherwise monitoring continues.

7. A system for evaluating the state of a current-carrying connection structure, characterized in that: include: Establish a unit for establishing a rapid calculation model of the temperature field distribution of the whole view of the equipment including the current-carrying connection structure; A first measuring unit is used to determine a sensor arrangement scheme of the device including the current-carrying connection structure, wherein the sensor arrangement scheme is: setting the number of sensors and measuring points based on the sensor arrangeable interval, and obtaining temperature values ​​of several measuring points in the sensor arrangement scheme as actual measurement values; A second measuring unit is used to calculate the temperature field distribution characteristics of the equipment containing the current-carrying connection structure under normal operating conditions through the temperature field distribution rapid calculation model, and extract the temperature value of the measuring point as a simulation measurement value based on the temperature field distribution characteristics; A calculation unit, used for obtaining an error value by subtracting the actual measurement value from the simulated measurement value, and calculating an evaluation index of the error value; A changing unit, used for changing the contact state of the contact of the current-carrying connection structure when the evaluation index is not less than a preset threshold value, and triggering the second measuring unit, and outputting the temperature field distribution characteristic when the evaluation index is less than the preset threshold value; an evaluation unit, configured to evaluate a state of the current-carrying connection structure according to the temperature field distribution characteristics; Wherein, the establishing unit is specifically used for: The sampling method is used to determine several groups of condition combinations, including: different current carrying capacity, ambient temperature, external ventilation, and plug contact status; According to the combination of conditions, the temperature field distribution and the fluid field distribution of the finite element simulation are obtained, wherein the plug contact state is characterized by the contact resistance ρ and used as the boundary condition of the finite element input; The fitting relationship between each group of condition combinations and the temperature field distribution and the fluid field distribution is constructed to obtain a rapid calculation model for the temperature field distribution.

8. A device for evaluating the state of a current-carrying connection structure, characterized in that: The device comprises a processor and a memory: The memory is used to store program code and transmit the program code to the processor; The processor is used to execute the state assessment method of the current-carrying connection structure according to any one of claims 1 to 6 according to the instructions in the program code.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium is used to store program codes, and the program codes are used to execute the state evaluation method of the current-carrying connection structure according to any one of claims 1 to 6.

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