A computing device

Abstract

The embodiment of the present application provides a kind of computing device, which includes liquid cooling structure, multiple heat-conducting structures and multiple different height heat-generating devices.Each heat-conducting structure includes connected first and second vapor chambers, and the first vapor chamber in each heat-conducting structure is located above the corresponding different height heat-generating device, and the second vapor chamber is connected with the liquid cooling structure.In this way, the embodiment of the present application can transfer the heat generated by the heat-generating device to the liquid cooling structure for heat dissipation by setting the heat-conducting structure without directly setting the liquid cooling structure above the heat-generating device, solve the problem of heat dissipation weakening caused by multi-component height tolerance and the risk of heat dissipation, and make the computing device easy to maintain and disassemble, reduce the operation of the heat-generating device.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to a computing device. Background Technology

[0002] With the continuous development of technology, the operating capabilities of servers have also developed rapidly. As the server industry grows and user needs diversify, server configurations are becoming increasingly complex. The heat dissipation requirements of various components within servers are constantly increasing, and the arrangement of these components within the server is becoming more compact. If the heat inside the server cannot be dissipated through effective thermal paths, the server junction temperature will rise sharply. When the actual operating junction temperature exceeds its maximum allowable junction temperature, the server's performance will degrade or even fail. Therefore, improving server heat dissipation is crucial.

[0003] Currently, server cooling methods mainly include air cooling, cold plate liquid cooling, and immersion liquid cooling. Due to the increasing power consumption of devices and the requirements of data center total energy consumption / equipment energy efficiency (PUE), general air cooling technology has basically reached its limit, and liquid cooling technology with stronger heat dissipation capabilities is needed to replace air cooling technology.

[0004] However, as server performance becomes increasingly powerful and server components are arranged more compactly, current methods of using cold plates for cooling multiple components suffer from the problem of integrated cold plates, requiring removal of the entire cold plate during maintenance, which is cumbersome. Furthermore, the height tolerances between components cannot be resolved by integrated cold plates, affecting the heat dissipation performance of the components. Additionally, space constraints in servers sometimes prevent the cold plate from being placed directly above components (such as chips). Summary of the Invention

[0005] This application provides a computing device that addresses the problems mentioned in the background art, such as the current practice of using cold plates to cool multiple devices, where the integrated cold plates require removal during maintenance, leading to complex operations. Furthermore, the integrated cold plate cannot resolve height tolerance issues between components, affecting their heat dissipation performance. Additionally, server space limitations prevent the cold plate from being positioned directly above devices (such as chips).

[0006] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0007] This invention provides a computing device, including a liquid cooling structure, multiple heat-conducting structures, and multiple heat-generating devices of different heights;

[0008] Each heat-conducting structure includes a first heat-equalizing plate and a second heat-equalizing plate connected together. The first heat-equalizing plate in each heat-conducting structure is located on the heat-generating device at a corresponding height, and the second heat-equalizing plate is connected to the liquid cooling structure.

[0009] Based on the above technical solution, the present invention can be further improved as follows.

[0010] In one possible implementation, the liquid cooling structure includes several cold plates connected in series, with the second heat-conducting plate in each structure connected to the corresponding cold plate.

[0011] In one possible implementation, the second heat exchanger is vertically positioned, and the first heat exchanger and the second heat exchanger are perpendicular to each other.

[0012] In one possible implementation, the heat-conducting structure further includes: a third heat-dissipating plate, which is connected to the first heat-dissipating plate and the second heat-dissipating plate respectively;

[0013] The second heat exchanger is positioned horizontally, and the first heat exchanger and the second heat exchanger are parallel to each other.

[0014] In one possible implementation, the first and second heat spreaders are located on opposite sides of the third heat spreader along the length of the heating element, and the first and second heat spreaders are offset along the height of the heating element.

[0015] In one possible implementation, the first and second heat spreaders are located on the same side of the third heat spreader in the height direction of the heating device, and the first and second heat spreaders overlap in the height direction of the heating device.

[0016] In one possible implementation, the heat-conducting structure further includes: a first heat-conducting plate and a second heat-conducting plate;

[0017] The first heat-conducting plate is located between the first heat-dissipating plate and the heating element, and the second heat-conducting plate is located between the second heat-dissipating plate and the cold plate.

[0018] In one possible implementation, the computing device further includes: a housing and a mounting section located within the housing;

[0019] The heat-conducting structure, heat-generating devices, and cold plate are all located inside the enclosure;

[0020] The mounting part is located on the outside of the cold plate and on the side of the cold plate away from the second heat exchange plate; the mounting part is used to press the side of the cold plate toward the second heat exchange plate.

[0021] In one possible implementation, the computing device also includes: a spring and a latch;

[0022] One end of the spring is connected to one end of the mounting part, and the other end of the spring is connected to the housing;

[0023] A pin passes through the other end of the housing and connects it to the mounting part.

[0024] In one possible implementation, the mounting part has an inclined surface on the side facing the housing, and the housing remains tilted at the position corresponding to the inclined surface;

[0025] The thickness of the mounting part near the spring end is less than the thickness of the mounting part near the pin end.

[0026] This invention provides a computing device comprising a liquid cooling structure, multiple heat-conducting structures, and multiple heat-generating devices at different heights. Each heat-conducting structure includes a first vapor chamber and a second vapor chamber connected together. The first vapor chamber in each heat-conducting structure is located above the corresponding heat-generating device at a different height, and the second vapor chamber is connected to the liquid cooling structure. This invention addresses the issue of reduced heat dissipation caused by height tolerances of multiple components and potential heat dissipation risks by using heat-conducting structures instead of directly placing the liquid cooling structure on the heat-generating devices. It also facilitates maintenance and disassembly of the computing device, reducing the need for manipulation of the heat-generating devices. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a structural schematic diagram of a cold plate assembly;

[0029] Figure 2 This is a structural schematic diagram and a partially enlarged schematic diagram of a cold plate assembly;

[0030] Figure 3 This is a schematic diagram of an L-shaped heat-conducting structure in a computing device according to an embodiment of the present invention;

[0031] Figure 4 This is a schematic diagram of the structure of several cold plates connected in a computing device according to an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of a Z-shaped heat conduction structure in a computing device according to an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram of a C-type heat-conducting structure in a computing device according to an embodiment of the present invention;

[0034] Figure 7 This is a side view of a computing device provided according to an embodiment of the present invention;

[0035] Figure 8 A side view of a computing device provided in one embodiment of the present invention from another angle;

[0036] Figure 9 This is a schematic diagram of the cold plate connection method in a computing device according to an embodiment of the present invention;

[0037] Figure 10 This is a schematic diagram of the L-shaped heat-conducting structure installation method in a computing device according to an embodiment of the present invention;

[0038] Figure 11 This is a schematic diagram of the Z-shaped heat conduction structure installation method in a computing device according to an embodiment of the present invention;

[0039] Figure 12 This is a schematic diagram of the C-type heat-conducting structure installation method in a computing device according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100 - Computing devices;

[0042] 200-Liquid-cooled structure;

[0043] 210 - Cold plate; 220 - Liquid inlet; 221 - Liquid inlet hose; 230 - Liquid outlet; 231 - Liquid outlet hose; 240 - Liquid cooling channel; 250 - Clamp;

[0044] 300 - Thermally conductive structure;

[0045] 310 - First heat spreader; 320 - Second heat spreader; 330 - Third heat spreader; 340 - Heat pipe; 350 - First heat conduction plate; 360 - Second heat conduction plate;

[0046] 400 - Heating element;

[0047] 410 - Chip; 420 - Circuit board;

[0048] 500- Enclosure;

[0049] 510 - Mounting part; 520 - Spring; 530 - Pin; 540 - Inclined surface; 550 - Buffer pad. Detailed Implementation

[0050] As described in the background section, current methods of using cold plates to cool multiple components present challenges. The integrated cold plate, requiring removal during maintenance, complicates the process. Furthermore, the integrated cold plate cannot address height tolerances between components, impacting their heat dissipation performance. Additionally, server space constraints sometimes prevent the cold plate from being positioned directly above components (such as chips).

[0051] To address the aforementioned technical problems, embodiments of the present invention provide a computing device comprising a liquid cooling structure, multiple heat-conducting structures, and multiple heat-generating devices at different heights. Each heat-conducting structure includes a connected first and second vapor chamber. The first vapor chamber in each heat-conducting structure is located above a corresponding heat-generating device at a different height, and the second vapor chamber is connected to the liquid cooling structure. Thus, embodiments of the present invention can dissipate heat generated by the heat-generating devices by transferring the heat to the liquid cooling structure instead of directly placing the liquid cooling structure on top of the heat-generating devices, thereby solving the problems of reduced heat dissipation caused by height tolerances of multiple components and potential heat dissipation risks. Simultaneously, it facilitates maintenance and disassembly of the computing device, reducing the need for manipulation of the heat-generating devices.

[0052] To make the above-mentioned objectives, features, and advantages of the embodiments of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] Figure 1 This is a structural schematic diagram of a cold plate assembly 10. (Refer to...) Figure 1 As shown, the cold plate assembly 10 may include a liquid cooling plate 2, a circuit board 3, and several chip components 4. One end of each chip component 4 is connected to the liquid cooling plate 2, and the other end is connected to the circuit board 3. Several chip components 4 are arranged side-by-side and spaced apart between the liquid cooling plate 2 and the circuit board 3. One end of the liquid cooling plate 2 has a coolant inlet 21, and the other end has a coolant outlet 22. Coolant enters the liquid cooling plate 2 through the coolant inlet 21 and flows out through the coolant outlet 22, thereby achieving the heat dissipation function for the chip components 4 and the circuit board 3.

[0054] However, Figure 1 The cold plate assembly 10 shown has the following defects: several chip elements 4 may have different heights, so it may not be possible to ensure that each chip element 4 can make sufficient contact with the liquid cooling plate 2 for chip elements 4 of different heights, resulting in certain heat dissipation problems.

[0055] For the cold plate assembly 10 with the same height chip element 4, refer to Figure 2 As shown. However, Figure 2 The cold plate assembly 10 shown has the following defects: for chip elements 4 of the same height, there may also be high tolerance, which makes it impossible for chip elements 4 to make sufficient contact with the liquid cooling plate 2, resulting in the heat dissipation of chip elements 4 not reaching the expected level.

[0056] To address the aforementioned problems, embodiments of the present invention provide a computing device that, by not directly placing the liquid cooling structure on the heat-generating components, uses a heat-conducting structure to transfer the heat generated by the heat-generating components to the liquid cooling structure for heat dissipation. This solves the problems of reduced heat dissipation caused by height tolerances of multiple components and the potential heat dissipation risks. The specific structure of the computing device provided in this application embodiment will be described below with reference to the accompanying drawings.

[0057] refer to Figure 3 This invention provides a computing device 100. The computing device 100 can be a server or a computing module. In this embodiment, the computing device 100 may include a liquid cooling structure 200, a heat-conducting structure 300, and a heat-generating device 400. In one possible implementation, the number of heat-conducting structures 300 and heat-generating devices 400 can be multiple; this invention does not limit the number of heat-conducting structures 300 and heat-generating devices 400. Furthermore, since different heat-generating devices 400 have different sizes, multiple heat-generating devices 400 may have different heights. In this embodiment, each heat-conducting structure 300 may include a first heat-equalizing plate 310 and a second heat-equalizing plate 320, wherein the first heat-equalizing plate 310 and the second heat-equalizing plate 320 are connected. In one possible implementation, the first heat-equalizing plate 310 of each heat-conducting structure 300 may be located above heat-generating devices 400 of corresponding different heights, while the second heat-equalizing plate 320 may be connected to the liquid cooling structure 200.

[0058] refer to Figure 4 In this specific implementation, the liquid cooling structure 200 may include a cold plate 210. In one possible implementation, the number of cold plates 210 can be several, and the present invention does not limit the number of cold plates 210. In this embodiment, several cold plates 210 can be connected in series. In this way, the second heat spreader 320 in each heat-conducting structure 300 can be connected to the corresponding cold plate 210.

[0059] Continue to refer to Figure 3In one possible implementation, the area of ​​the first heat spreader 310 can be greater than or equal to the area of ​​its corresponding heat-generating device 400, so that the first heat spreader 310 can completely cover the heat-generating device 400. Correspondingly, the area of ​​the second heat spreader 320 can be greater than or equal to the area of ​​its corresponding cold plate 210, so that the second heat spreader 320 can completely cover the cold plate 210. In this way, the heat generated by the heat-generating device 400 can be transferred to the cold plate 210 for heat dissipation through the first heat spreader 310 and the second heat spreader 320, ensuring that each heat-generating device 400 can make sufficient contact with the cold plate 210 through the first heat spreader 310 and the second heat spreader 320.

[0060] Continue to refer to Figure 3 In one possible implementation, the second heat spreader 320 can be vertically arranged in the height direction of the heating device 400, and the first heat spreader 310 and the second heat spreader 320 are perpendicularly connected to each other. Based on the above embodiment, the first heat spreader 310 and the second heat spreader 320 can be L-shaped.

[0061] refer to Figure 5 In one possible implementation, the second heat spreader 320 can be arranged laterally along the length of the heating device 400, and the first heat spreader 310 and the second heat spreader 320 are parallel to each other. In this embodiment, the heat-conducting structure 300 may further include a third heat spreader 330. The third heat spreader 330 can be connected to both the first heat spreader 310 and the second heat spreader 320, i.e., one end of the third heat spreader 330 is connected to the first heat spreader 310, and the other end is connected to the second heat spreader 320. It is understood that the third heat spreader 330 can be perpendicular to both the first heat spreader 310 and the second heat spreader 320. Of course, in other embodiments, the third heat spreader 330 may not be perpendicular to the first heat spreader 310 and the second heat spreader 320. Based on the above embodiments, the first heat spreader 310, the second heat spreader 320, and the third heat spreader 330 can be Z-shaped.

[0062] Continue to refer to Figure 5 Based on the above embodiments, the first heat spreader 310 and the second heat spreader 320 can be located on different sides of the third heat spreader 330. In one possible implementation, the first heat spreader 310 and the second heat spreader 320 can be located on the left and right sides of the third heat spreader 330 along the length of the heating device 400, and the first heat spreader 310 and the second heat spreader 320 are offset along the height of the heating device 400.

[0063] refer to Figure 6In one possible implementation, the first heat spreader 310 and the second heat spreader 320 can be located on the same side of the third heat spreader 330 in the height direction of the heating device 400. Alternatively, the first heat spreader 310 and the second heat spreader 320 can be located on the same side of the third heat spreader 330 in the length direction of the heating device 400, and the first heat spreader 310 and the second heat spreader 320 can overlap in the height direction of the heating device 400. Based on the above embodiments, the first heat spreader 310, the second heat spreader 320, and the third heat spreader 330 can be C-shaped.

[0064] refer to Figure 7 Based on the above embodiments, the heat-conducting structure 300 may further include a heat pipe 340. In one possible implementation, the number of heat pipes 340 may be several, and the present invention does not limit the number of heat pipes 340. In the embodiments of this application, several heat pipes 340 may be embedded at intervals on the first heat spreader 310 and the second heat spreader 320.

[0065] Continue to refer to Figure 3 Based on the above embodiments, the heat-conducting structure 300 may further include a first heat-conducting sheet 350 and a second heat-conducting sheet 360. The first heat-conducting sheet 350 may be located between the first heat spreader 310 and the heating device 400, and correspondingly, the second heat-conducting sheet 360 may be located between the second heat spreader 320 and the cold plate 210. In one possible implementation, the first heat-conducting sheet 350 and the second heat-conducting sheet 360 may be made of graphene pads or other easily removable heat-conducting materials.

[0066] refer to Figure 8 Based on the above embodiments, the cold plate 210 may include a liquid inlet 220 and a liquid outlet 230. The liquid inlet 220 may be connected to the liquid outlet 230. In one possible implementation, the liquid inlet 220 and the liquid outlet 230 may form a liquid cooling channel 240 within the cold plate 210 along its length, allowing coolant to flow in from the liquid inlet 220 and then out through the liquid cooling channel 240 to the liquid outlet 230.

[0067] refer to Figure 9 as well as Figure 4Based on the above embodiments, several cold plates 210 can be connected together via flexible hoses to allow them to be connected in series. In one possible implementation, the hoses can be made of rubber. As shown in the figure, an inlet hose 221 can be provided at the liquid inlet 220 of the cold plate 210, and correspondingly, an outlet hose 231 can be provided at the liquid outlet 230 of the cold plate 210. The inlet hose 221 can be connected to the liquid inlet 220 via a clamp 250, and the outlet hose 231 can also be connected to the liquid inlet 220 via a clamp 250, allowing the coolant to flow smoothly between the cold plates 210.

[0068] Continue to refer to Figure 3 Based on the above embodiments, the heating device 400 may include a chip 410 and a circuit board 420. The chip 410 may be located on the circuit board 420. In one possible implementation, a first heat spreader 310 may be located on the chip 410, and the first heat spreader 310 is connected to the chip 410.

[0069] refer to Figure 10 Based on the above embodiments, the installation method of the computing device 100 can be as shown in the figure. In one possible implementation, the computing device 100 may further include: a housing 500 and a mounting part 510. The heat-conducting structure 300, the heat-generating device 400, and the cold plate 210 can all be located inside the housing 500. The mounting part 510 can be located outside the cold plate 210, and the mounting part 510 can be located on the side of the cold plate 210 away from the second heat spreader 320. It is understood that the mounting part 510 can be used to press the cold plate 210 toward the side facing the second heat spreader 320.

[0070] Continue to refer to Figure 10 Based on the above embodiments, the computing device 100 may further include a spring 520 and a pin 530. The mounting portion 510 may be located on the side of the cold plate 210 away from the second heat spreader 320. In the height direction of the heating element 400, one end of the mounting portion 510 may be connected to the spring 520, and the other end of the mounting portion 510 may be connected to the pin 530. In one possible implementation, one end of the spring 520 may be connected to one end of the mounting portion 510, and the other end of the spring 520 may be connected to the housing 500. The housing 500 may have a through hole through which the pin 530 passes, so that the pin 530 passes through the housing 500 and connects to the other end of the mounting portion 510. In this embodiment, the lower end of the mounting portion 510 may be connected to the spring 520, and the upper end of the mounting portion 510 may be connected to the pin 530. It is understandable that the housing 500 can be located outside the mounting part 510, so that the housing 500 can encompass the mounting part 510, the pin 530 and the spring 520 within the housing 500.

[0071] Continue to refer to Figure 10 Based on the above embodiments, when the first heat spreader 310 and the second heat spreader 320 are L-shaped, in one possible implementation, the mounting portion 510 can be a trapezoidal mounting portion 510. The end of the mounting portion 510 connected to the pin 530 can be larger than the end of the mounting portion 510 connected to the spring 520. In this embodiment, the side of the mounting portion 510 facing the housing 500 can have a slope 540, and the housing 500 is inclined at the position corresponding to the slope 540. The thickness of the end of the mounting portion 510 near the spring 520 is less than the thickness of the end of the mounting portion 510 near the pin 530. The end of the mounting portion 510 near the spring 520 and the end of the mounting portion 510 near the pin 530 can be connected by the slope 540. It is worth mentioning that the housing 500 can also be a trapezoidal housing 500, and the shape of the housing 500 can be set along the outer shape of the mounting portion 510. In this way, by tightening the locking pin 530, the mounting part 510 is pressed down toward the spring 520. Due to the reduced space in the lower part of the housing 500, the vertical force provided by the locking pin 530 can be converted into a lateral force to lock the cold plate 210 and the second heat exchange plate 320. In order to reduce the impact of the lateral force on the cold plate 210, a buffer pad 550 can be set between the cold plate 210 and the mounting part 510 to provide some protection for the cold plate 210.

[0072] refer to Figure 11 as well as Figure 12 Based on the above embodiments, when the first heat spreader 310 and the second heat spreader 320 are Z-shaped or C-shaped, in one possible implementation, the mounting portion 510 can be a rectangular mounting portion 510. It is worth mentioning that the housing 500 can also be a rectangular housing 500, and the shape of the housing 500 can be set along the outline of the mounting portion 510. In this way, by locking the pin 530, the mounting portion 510 is pressed down towards the spring 520, thereby converting the vertical force provided by the pin 530 into a lateral force, thus locking the cold plate 210 and the second heat spreader 320. To mitigate the impact of the lateral force on the cold plate 210, a buffer pad 550 can be provided on the side of the cold plate 210 away from the second heat spreader 320 to provide some protection for the cold plate 210.

[0073] In this embodiment, a liquid cooling structure 200, a heat-conducting structure 300, and a heating device 400 are provided. Each heat-conducting structure 300 may include a first heat spreader 310 and a second heat spreader 320, which are connected to each other. The first heat spreader 310 in each heat-conducting structure 300 can be located on the heating device 400 at different heights, and the second heat spreader 320 can be connected to the liquid cooling structure 200. This allows the liquid cooling structure 200 to be placed on top of the heating device 400 without being directly placed on top of it, solving the problem that the liquid cooling structure 200 cannot be arranged above the heating device 400 due to space constraints. By using the heat-conducting structure 300 to transfer the heat generated by the heating device 400 to the liquid cooling structure 200 for heat dissipation, the problem of reduced heat dissipation caused by height tolerances of multiple components and the potential heat dissipation risks are solved. In addition, the cold plate 210 and the second heat spreader 320 are clamped together by the housing 500, the mounting part 510, the spring 520 and the pin 530, which facilitates the disassembly of the computing device 100 and reduces the operation of the heat-generating device 400.

[0074] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0075] It should be noted that phrases such as "in specific implementations," "in some embodiments," "in this embodiment," and "exemplarily" in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0076] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0077] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0078] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A computing device, characterized in that, include: Liquid cooling structure, multiple heat-conducting structures, multiple heat-generating devices of different heights, housing, mounting part located inside the housing, spring and pin; Each of the heat-conducting structures includes a first heat-dissipating plate and a second heat-dissipating plate connected together. The first heat-dissipating plate in each heat-conducting structure is located above the heat-generating device at a corresponding different height, and the second heat-dissipating plate is connected to the liquid cooling structure. The liquid cooling structure includes a plurality of cold plates connected in series, and the second heat spreader in each of the heat-conducting structures is connected to the corresponding cold plate. The mounting portion is located on the outside of the cold plate, and the mounting portion is located on the side of the cold plate away from the second heat exchange plate; the mounting portion is used to press the side of the cold plate toward the second heat exchange plate. The mounting part has an inclined surface on the side facing the box body, and the box body is tilted at the position corresponding to the inclined surface; The thickness of the mounting portion near the spring end is less than the thickness of the mounting portion near the pin end.

2. The computing device according to claim 1, characterized in that, The second heat spreader is vertically positioned, and the first heat spreader and the second heat spreader are perpendicular to each other.

3. The computing device according to claim 1, characterized in that, The heat-conducting structure further includes: a third heat-dissipating plate, which is connected to the first heat-dissipating plate and the second heat-dissipating plate respectively; The second heat spreader is arranged horizontally, and the first heat spreader and the second heat spreader are parallel to each other.

4. The computing device according to claim 3, characterized in that, The first and second heat spreaders are located on opposite sides of the third heat spreader along the length of the heating device, and the first and second heat spreaders are offset along the height of the heating device.

5. The computing device according to claim 3, characterized in that, The first and second heat spreaders are located on the same side of the third heat spreader in the height direction of the heating device, and the first and second heat spreaders overlap in the height direction of the heating device.

6. The computing device according to claim 1, characterized in that, The heat-conducting structure further includes: a first heat-conducting sheet and a second heat-conducting sheet; The first heat-conducting sheet is located between the first heat spreader and the heating element, and the second heat-conducting sheet is located between the second heat spreader and the cold plate.

7. The computing device according to claim 1, characterized in that, The heat-conducting structure, the heat-generating device, and the cold plate are all located inside the housing.

8. The computing device according to claim 7, characterized in that, One end of the spring is connected to one end of the mounting part, and the other end of the spring is connected to the housing; The pin passes through the housing and connects to the other end of the mounting part.

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