Chip electronic component sorting device and sorting method

Abstract

The present application relates to the technical field of electronic components, and discloses a chip electronic component sorting device and a sorting method. The sorting device comprises a first receiving member and a second receiving member. The first receiving member is provided with a plurality of guide-in channels. One end of each guide-in channel is provided with a guide-in port, and the other end is provided with a guide-out port. The inner wall of each guide-in channel is provided with an extension part. The extension part moves towards or away from the inner wall of the guide-in channel to adjust the inner diameter of the guide-in channel at the position of the extension part. The guide-in channel between the guide-in port and the extension part can accommodate two chip electronic components with end faces overlapping. The guide-out port and the extension part can accommodate at least one chip electronic component. The second receiving member is provided with a plurality of adhesive receiving holes. The diameters of the adhesive receiving holes can be adjusted. Each adhesive receiving hole has a corresponding guide-in channel. The first receiving member is placed on the second receiving member. Each adhesive receiving hole is in communication with the corresponding guide-in channel. The present application can improve the sorting effect and efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to a chip electronic component sorting device and sorting method. BACKGROUND

[0002] Chip electronic components are tiny components without leads or short leads, including chip capacitors, chip resistors, chip inductors and other types. Chip electronic components may sometimes be adhered to each other during the production process. The chip electronic components adhered to each other are referred to as adhered chips, and the single chip electronic components are referred to as good products. The sorting process is an important process in the production process of chip electronic components, and the adhered chips and good products are sorted by the sorting process to collect the good products.

[0003] At present, the sorting device used in the sorting process is generally a screen or a screen plate, which sorts the chip electronic components by screening to screen out the adhered chips. On the one hand, the screen or the screen plate can only sort out the adhered chips in a side-by-side or close-to-side-by-side posture, and it is difficult to screen out long strip-shaped adhered chips, and the sorting effect is poor. On the other hand, only one good product can pass through a single screen hole at a time, and the sorting efficiency is low. SUMMARY

[0004] The purpose of the present application is to provide a chip electronic component sorting device and sorting method to improve the sorting effect and sorting efficiency.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0006] One aspect of the present application is to provide a chip electronic component sorting device, taking a set first direction as a reference direction, comprising:

[0007] A first receiving member is provided with a plurality of guide channels, the guide channels extend along the first direction, one end of the guide channel is provided with a guide inlet for the end face of a single chip electronic component to pass through, and the other end of the guide channel is provided with a guide outlet. The inner wall of the guide channel is provided with an expansion part, the expansion part moves close to or away from the inner wall of the guide channel to adjust the inner diameter of the guide channel at the position of the expansion part. The guide inlet and the expansion part between the guide channel can place two chip electronic components with overlapping end faces, and the guide outlet and the expansion part between the guide channel can place at least one chip electronic component;

[0008] A second receiving member is provided with a plurality of adhered chip receiving holes, the hole diameter of each adhered chip receiving hole is adjustable, and each adhered chip receiving hole has a corresponding guide channel;

[0009] The first receiving member is placed on the second receiving member, and each adhered chip receiving hole is in communication with the corresponding guide channel.

[0010] Preferably, the telescopic part has a receiving surface, the distance between the inlet and the receiving surface of the telescopic part is H1, and the length of the chip electronic component is L, where H1 = (1.7~2.2)L.

[0011] Preferably, the distance between the side of the telescopic part near the outlet and the outlet is H2, where H2 = (1.2~1.5)L.

[0012] Preferably, the first storage component includes an inlet layer, a storage layer, and an outlet layer, wherein the inlet layer, the storage layer, and the outlet layer are arranged sequentially along the first direction, the inlet layer has an inlet hole, the storage layer has a storage hole, and the outlet layer has an outlet hole, wherein the inlet hole, the storage hole, and the outlet hole are connected to form the inlet channel; the telescopic part is provided on the inner wall of the storage hole.

[0013] Preferably, the inlet hole, the receiving hole, and the outlet hole are coaxially arranged; the receiving hole has a first state and a second state, in the first state, the diameter of the receiving hole is smaller than the diameters of the inlet hole and the outlet hole; in the second state, the diameter of the receiving hole is equal to the diameters of the inlet hole and the outlet hole.

[0014] Preferably, the telescopic part is a first buffer layer.

[0015] Preferably, both the storage layer and the telescopic part are made of rubber, and the telescopic part is integrally formed with the storage layer.

[0016] Preferably, the material of the inlet layer is one of metal, resin, and plexiglass, and the material of the outlet layer is one of metal, resin, and plexiglass.

[0017] Preferably, the inner wall of the adhesive sheet receiving hole is provided with a second buffer layer.

[0018] Another aspect of the present invention is to provide a method for sorting surface-mount electronic components using the surface-mount electronic component sorting apparatus as described above, comprising:

[0019] Step S1: Place the surface-mount electronic components to be sorted on the first receiving component, apply vibration to drive the surface-mount electronic components and adhesive sheets into the inlet channel from the end face, and remove the surface-mount electronic components that have not entered the inlet channel.

[0020] Step S2: Push the adhesive sheet and the surface-mount electronic component in the guide channel, so that the lower surface-mount electronic component of the two surface-mount electronic components with overlapping end faces is pushed to the position of the telescopic part and is clamped by the telescopic part.

[0021] Step S3: Flip the first storage piece and pour out the sheet electronic components that are not held by the telescopic part;

[0022] Step S4: Reset the first storage component, place the first storage component on the second storage component, and connect the adhesive patch storage hole and the corresponding inlet channel;

[0023] Step S5: Push the remaining single-chip electronic components and adhesive pads in the inlet channel to make the single-chip electronic components fall onto the second storage component, and the adhesive pads are clamped in the adhesive pad storage hole.

[0024] Step S6: Remove the first storage component, flip the second storage component, and pour out the surface-mount electronic components on the second storage component.

[0025] Compared with the prior art, the beneficial effects of the chip electronic component sorting device and sorting method of this invention are as follows:

[0026] The chip electronic component sorting device of this invention includes a first receiving component and a second receiving component. The first receiving component has an inlet channel. The inlet of the inlet channel allows only the end face of a single chip electronic component to pass through, making it difficult for adhesive sheets adhered in a side-by-side or near-side-side configuration to enter the inlet channel, thereby sorting out adhesive sheets adhered in a side-by-side or near-side-side configuration. The inlet channel between the inlet and the telescopic part can hold two chip electronic components with overlapping end faces. The telescopic part can receive a single chip electronic component, two chip electronic components with overlapping end faces, or adhesive sheets adhered in a long strip configuration. By adjusting the inner diameter of the inlet channel at the location of the telescopic part, the telescopic part can clamp the lower chip electronic component among the long strip adhesive sheet and two chip electronic components with overlapping end faces. The unclamped single chip electronic component is free in the inlet channel. By flipping the first receiving component, the unclamped single chip electronic component can be tilted out for recycling. Place the first receiving component on top of the second receiving component, aligning the adhesive strip receiving holes of the second receiving component with the outlet. Continue pushing the elongated adhesive strip and the surface-mount electronic component, causing the individual surface-mount electronic component to detach from the telescopic part and fall onto the second receiving component. The elongated adhesive strip detaches from the telescopic part and is clamped in the adhesive strip receiving hole. The individual surface-mount electronic component on the second receiving component is then in a free state. At this point, remove the first receiving component and flip the second receiving component. The individual surface-mount electronic component on the second receiving component can then be poured out for recycling, while the elongated adhesive strip is fixed in the adhesive strip receiving hole, thus separating the elongated adhesive strip and improving the sorting effect. Because it is easy to generate two overlapping surface-mount electronic components in most of the inlet channels, a greater number of individual surface-mount electronic components can be sorted in one sorting cycle, improving sorting efficiency. Attached Figure Description

[0027] Figure 1This is a schematic diagram of the structure of the chip electronic component sorting device according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the first storage component in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the import layer structure in an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the structure of the storage layer in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the structure of the derived layer in an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the structure of the second storage component in an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of the chip electronic component in an embodiment of the present invention;

[0034] Figure 8 This is a schematic diagram of the sorting process of the chip electronic component sorting device in an embodiment of the present invention. Figure 1 ;

[0035] Figure 9 This is a schematic diagram of the sorting process of the chip electronic component sorting device in an embodiment of the present invention. Figure 2 ;

[0036] Figure 10 This is a schematic diagram of the sorting process of the chip electronic component sorting device in an embodiment of the present invention. Figure 3 ;

[0037] Figure 11 This is a schematic diagram of the sorting process of the chip electronic component sorting device in an embodiment of the present invention. Figure 4 ;

[0038] Figure 12 This is a schematic diagram of the sorting process of the chip electronic component sorting device in an embodiment of the present invention. Figure 5 ;

[0039] Figure 13 This is a schematic diagram of the sorting process of the chip electronic component sorting device in an embodiment of the present invention. Figure 6 ;

[0040] In the diagram, 10 is the first storage component; 101 is the inlet channel; 1011 is the inlet port; 1012 is the outlet port; 102 is the telescopic part; 1021 is the receiving surface; 11 is the inlet layer; 111 is the inlet hole; 12 is the storage layer; 121 is the storage hole; 13 is the outlet layer; and 131 is the outlet hole.

[0041] 20. Second storage component; 21. Adhesive patch storage hole; 211. Second buffer layer;

[0042] 30. Surface mount electronic components; 31. End face;

[0043] 40. Gluing sheets;

[0044] A. First direction. Detailed Implementation

[0045] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0048] See Figures 1-13This invention provides a chip electronic component sorting device, taking a set first direction A as a reference direction, including a first receiving component 10 and a second receiving component 20. The first receiving component 10 is provided with a plurality of inlet channels 101, which extend along the first direction A. One end of the inlet channel 101 is provided with an inlet 1011 for the end face 31 of a single chip electronic component 30 to pass through, and the other end of the inlet channel 101 is provided with an outlet 1012. The inner wall of the inlet channel 101 is provided with a telescopic part 102, which moves closer to or further away from the inner wall of the inlet channel 101 to adjust the telescopic part 102. The inner diameter of the inlet channel 101 at the location 2; the inlet channel 101 between the inlet port 1011 and the telescopic part 102 can hold two chip electronic components 30 with overlapping end faces 31, and the inlet channel 101 between the outlet port 1012 and the telescopic part 102 can hold at least one chip electronic component 30; the second storage member 20 is provided with a plurality of adhesive chip storage holes 21, the diameter of each adhesive chip storage hole 21 is adjustable, and each adhesive chip storage hole 21 has a corresponding inlet channel 101; the first storage member 10 is placed on the second storage member 20, and each adhesive chip storage hole 21 is connected to the corresponding inlet channel 101.

[0049] An inlet channel 101 is provided in the first storage component 10. The inlet 1011 of the inlet channel 101 is only for the end face 31 of a single chip electronic component 30 to pass through, making it difficult for adhesive pieces that are attached in a side-by-side or near-side-by-side posture to enter the inlet channel 101. Thus, adhesive pieces that are attached in a side-by-side or near-side-by-side posture can be sorted out by tilting the first storage component 10. The inlet channel 101 between the inlet 1011 and the telescopic part 102 can hold two chip electronic components 30 with overlapping end faces 31. The telescopic part 102 can receive a single chip electronic component 30, two chip electronic components 30 with overlapping end faces 31, or a strip-shaped adhesive sheet 40. By adjusting the inner diameter of the inlet channel 101 at the location of the telescopic part 102, the telescopic part 102 can clamp the lower chip electronic component 30 among the strip-shaped adhesive sheet 40 and the two chip electronic components 30 with overlapping end faces 31. The single chip electronic component 30 that is not clamped is in a free state in the inlet channel 101. By flipping the first storage member 10, the single chip electronic component 30 that is not clamped can be poured out and recycled. Place the first storage component 10 on the second storage component 20, so that the adhesive strip storage hole 21 of the second storage component 20 is aligned with the outlet 1012. Continue to push the long strip adhesive strip 40 and the chip electronic component 30, so that the single chip electronic component 30 is dislodged from the telescopic part 102 and falls onto the second storage component 20. The long strip adhesive strip 40 is dislodged from the telescopic part 102 and clamped in the adhesive strip storage hole 21. The single chip electronic component 30 on the second storage component 20 is in a free state. At this time, remove the first storage component 10 and flip the second storage component 20. The single chip electronic component 30 on the second storage component 20 can be poured out for recycling, while the long strip adhesive strip 40 is fixed in the adhesive strip storage hole 21, thereby sorting out the long strip adhesive strip 40 and improving the sorting effect. Since it is easy to generate two overlapping chip electronic components 30 in most of the inlet channels 101, more individual chip electronic components 30 can be sorted in one sorting cycle, thereby improving sorting efficiency.

[0050] See Figure 7 The surface-mount electronic component 30 is rectangular in shape, and its length is greater than its width and thickness. The surfaces containing the width and thickness of the surface-mount electronic component 30 are called end faces 31. The surface-mount electronic component 30 can be a surface-mount capacitor, surface-mount resistor, surface-mount inductor, surface-mount filter, etc. Hereinafter, a single surface-mount electronic component 30 without bonding is referred to as a good product. Unless otherwise specified, the term "bonded piece 40" refers to a strip-shaped bonded piece 40, including bonded pieces 40 bonded in a strip-like shape and bonded pieces 40 bonded in a near-strip-like shape.

[0051] See Figure 1In some embodiments, the first receiving member 10 is flat, and the first direction A is the height direction of the first receiving member 10. The inlet channel 101 extends through the first receiving member 10 along the first direction A. The inlet 1011 of the inlet channel 101 is formed on the surface of the first receiving member 10, and multiple inlets 1011 are arranged in an array on the surface of the first receiving member 10, in multiple rows and columns. The inlet 1011 is circular, and the diameter of the inlet 1011 is slightly larger than the length of the diagonal of the end face 31 of the surface-mount electronic component 30, so that the surface-mount electronic component 30 can only pass through from the end where the end face 31 is located.

[0052] In some embodiments, the telescopic portion 102 moves closer to or further away from the inner wall of the inlet channel 101 to adjust the inner diameter of the inlet channel 101 at the location of the telescopic portion 102, such that the inner diameter of the inlet channel 101 at the location of the telescopic portion 102 is smaller than the length of the diagonal of the end face 31 of the chip electronic component 30, so that the telescopic portion 102 can receive the elongated adhesive sheet 40 and the good product, and a single good product, two good products with overlapping end faces 31, or the elongated adhesive sheet 40 can be placed between the inlet 1011 and the telescopic portion 102; or, the inner diameter of the inlet channel 101 at the location of the telescopic portion 102 is equal to the length of the diagonal of the end face 31 of the chip electronic component 30, so that the good product and the elongated adhesive sheet 40 can pass through the inlet channel 101 at the location of the telescopic portion 102. The extension and retraction of the telescopic part 102 can be achieved by pushing the adhesive sheet 40 or by using a good product. Taking the adhesive sheet 40 as an example, when pushing the adhesive sheet 40, the adhesive sheet 40 squeezes the telescopic part 102, causing the telescopic part 102 to approach the inner wall of the inlet channel 101 under the squeezing force of the adhesive sheet 40, thereby increasing the inner diameter of the inlet channel 101. Under the action of the pushing force, the adhesive sheet 40 can enter the inlet channel 101 at the location of the telescopic part 102. When the pushing force is removed, the telescopic part 102 has a tendency to return to its original position. Under the action of the return elastic force, the adhesive sheet 40 can be clamped in the inlet channel 101 at the location of the telescopic part 102. If the adhesive sheet 40 is pushed further, the adhesive sheet 40 can pass through the inlet channel 101 at the location of the telescopic part 102 under the action of the pushing force, and the squeezing effect of the adhesive sheet 40 is lost, and the telescopic part 102 returns to its original position.

[0053] See Figure 1 In some embodiments, the telescopic portion 102 is a first buffer layer laid on the inner wall of the inlet channel 101. The first buffer layer is elastic. Under the compression of the adhesive sheet 40 or the good product, the first buffer layer deforms, causing the adhesive sheet 40 or the good product to be clamped within the inlet channel 101. After the adhesive sheet 40 or the good product passes through the inlet channel 101 at the location of the telescopic portion 102, the first buffer layer returns to its original position. The first buffer layer can support the good product and the adhesive sheet 40, and can clamp the good product or the adhesive sheet 40 after deformation. The first buffer layer is annular and coaxially disposed within the inlet channel 101. The first buffer layer is a rubber layer made of rubber.

[0054] See Figure 1 In some embodiments, the telescopic part 102 has a receiving surface 1021, the distance between the inlet 1011 and the receiving surface 1021 of the telescopic part 102 is H1, and the length of the chip electronic component 30 is L, where H1 = (1.7~2.2)L. When H1 < 1.7L, when the first receiving member 10 is tilted to remove excess chip electronic components 30 that have not entered the inlet channel 101 on the first receiving member 10, the upper good product among two overlapping good products is easy to detach from the inlet 1011, making it difficult for two good products to overlap between the inlet 1011 and the receiving surface 1021 of the telescopic part 102, resulting in lower sorting efficiency. When H1 > 2.2L, it is easy for three or more good products to overlap, which may result in the long strip adhesive sheet 40 overlapping with a good product vertically, making effective sorting impossible. Preferably, H1 = 2L, which allows two good products to overlap in most of the inlet channels 101 and avoids the situation where a long strip adhesive sheet 40 overlaps with a good product. Furthermore, setting H1 to between (1.7 and 2.2)L ensures that once one end of the adhesive sheet 40 in an L-shaped posture enters the inlet channel 101, it cannot rotate and is thus sorted out. Combined with the fact that the inlet 1011 only allows the end face 31 of a single good product to pass through, this ensures that only good products and long strip or near-long strip adhesive sheets 40 can fall into the inlet channel 101, while adhesive sheets 40 in other postures cannot enter the inlet channel 101 and are thus screened out.

[0055] See Figure 1 In some embodiments, the distance between the side of the telescopic part 102 near the outlet 1012 and the outlet 1012 is H2, where H2 > L. Preferably, H2 = (1.2~1.5)L, ensuring that after the good product and the elongated adhesive strip 40 are pushed out of the telescopic part 102, the elongated adhesive strip 40 can continue to be pushed without contacting the good product. Thus, only the elongated adhesive strip 40 can be pushed into the adhesive strip receiving hole 21, while the good product remains in a free state on the second receiving member 20. When H2 is too small, the good product will be pushed into the adhesive strip receiving hole 21 along with the elongated adhesive strip 40, making effective sorting impossible. When H2 is too large, the pushing stroke increases, which is not conducive to saving sorting time. Therefore, H2 must be at least greater than the length L of the surface-mount electronic component 30.

[0056] See Figures 2-5In some embodiments, the first receiving member 10 includes an inlet layer 11, a receiving layer 12, and an outlet layer 13. The inlet layer 11, the receiving layer 12, and the outlet layer 13 are arranged sequentially along a first direction A. The inlet layer 11 has an inlet hole 111, the receiving layer 12 has a receiving hole 121, and the outlet layer 13 has an outlet hole 131. There are multiple inlet holes 111, receiving holes 121, and outlet holes 131, and each inlet hole 111, receiving hole 121, and outlet hole 131 is arranged in a one-to-one correspondence. The corresponding inlet holes 111, receiving holes 121, and outlet holes 131 are connected to form an inlet channel 101. The telescopic part 102 is provided on the inner wall of the receiving hole 121, so that the diameter of the receiving hole 121 is adjustable. The inlet port 1011 is provided at one end of the inlet hole 111, and the outlet port 1012 is provided at one end of the outlet hole 131. The inlet holes 111 are circular holes, and their diameter is slightly larger than the diagonal length of the end face 31 of the surface-mount electronic component 30, so that the surface-mount electronic component 30 can only pass through from the end where the end face 31 is located. There is no particular limitation on the spacing between the inlet holes 111. To improve sorting speed, the spacing between the inlet holes 111 can be set to be smaller, for example, smaller than the width of the surface-mount electronic component 30. To improve the strength of the first receiving member 10, the spacing between the inlet holes 111 can be set to be larger, for example, larger than the length of the surface-mount electronic component 30.

[0057] The first receiving component 10 is flat. The inlet layer 11, the receiving layer 12, and the outlet layer 13 are all flat structures. The first direction A is the thickness direction of the first receiving component 10. The thickness of the inlet layer 11 is equal to the distance between the inlet port 1011 and the receiving surface 1021 of the telescopic part 102, which is 1.7 to 2.2 times the length of the surface-mount electronic component 30. The thickness of the outlet layer 13 is equal to the distance between the side of the telescopic part 102 near the outlet port 1012 and the outlet port 1012, which is 1.2 to 1.5 times the length of the surface-mount electronic component 30. The thickness of the receiving layer 12 is not particularly limited. In order to reduce the pushing stroke during sorting and save sorting time, the thickness of the receiving layer 12 is preferably less than 2 mm.

[0058] See Figure 2In some embodiments, the inlet hole 111, the receiving hole 121, and the outlet hole 131 are coaxially arranged, with the central axis extending along a first direction A, to facilitate pushing the good product or elongated adhesive strip 40 in the inlet hole 111 into the receiving hole 121, or pushing the good product or elongated adhesive strip 40 in the receiving hole 121 into the outlet hole 131. The receiving hole 121 has a first state and a second state. In the first state, the diameter of the receiving hole 121 is smaller than the diameters of the inlet hole 111 and the outlet hole 131; in the second state, the diameter of the receiving hole 121 is equal to the diameters of the inlet hole 111 and the outlet hole 131. The first state of the receiving hole 121 is an idle state, preventing the elongated adhesive strip 40 and the good product from falling into the receiving hole 121 on their own. By pushing the adhesive strip 40 or the good product, the adhesive strip 40 or the good product squeezes the telescopic part 102, causing the telescopic part 102 to gradually move closer to the inner wall of the receiving hole 121, switching the receiving hole 121 from the first state to the second state, allowing the good product or the adhesive strip 40 to enter or pass through the receiving hole 121. In the first state, the diameter of the receiving hole 121 is smaller than the length of the diagonal of the end face 31 of the surface-mount electronic component 30, and in the second state, the diameter of the receiving hole 121 is equal to the length of the diagonal of the end face 31 of the surface-mount electronic component 30.

[0059] In some embodiments, a first buffer layer is laid on the inner wall of the receiving hole 121 to form a telescopic portion 102.

[0060] See Figure 2 In some embodiments, both the storage layer 12 and the telescopic part 102 are made of rubber. The telescopic part 102 is integrally formed with the storage layer 12, allowing the storage holes 121 in the storage layer 12 to deform under compression. During manufacturing, multiple through holes can be formed on the rubber storage layer 12, with the holes having rubber walls. This allows the inner diameter of the through holes to change under external force, thus forming the storage holes 121. This simplifies the structure of the first storage component 10 and facilitates manufacturing, while also ensuring that the rubber-formed storage holes 121 have sufficient clamping force to hold the adhesive sheet 40 or other good products.

[0061] In some embodiments, the inlet layer 11 is made of one of metal, resin, or plexiglass, and the outlet layer 13 is made of one of metal, resin, or plexiglass. The first receiving component 10 has greater strength than the screen, is less prone to deformation, and can improve sorting accuracy and increase service life. The materials of the inlet layer 11 and the outlet layer 13 can be the same or different.

[0062] In some embodiments, the adhesive receiving hole 21 is circular, and its diameter is adjustable. The diameter of the adhesive receiving hole 21 is smaller than the diagonal length of the end face 31 of the surface-mount electronic component 30, allowing the good component to fall onto the second receiving member 20 without falling into the adhesive receiving hole 21 on its own. Alternatively, the diameter of the adhesive receiving hole 21 is equal to the diagonal length of the end face 31 of the surface-mount electronic component 30, allowing the adhesive piece 40 to be held within the adhesive receiving hole 21. In some embodiments, a second buffer layer 211 is provided on the inner wall of the adhesive receiving hole 21, and the diameter of the adhesive receiving hole 21 is adjusted by the deformation of the second buffer layer 211. When the adhesive piece 40 is pushed, the second buffer layer 211 deforms under the pressure of the adhesive piece 40, allowing the adhesive piece 40 to enter the adhesive receiving hole 21 and be held within it. The second buffer layer 211 supports the good product, preventing it from spontaneously falling into the adhesive pad storage hole 21. After deformation, the second buffer layer 211 can hold the adhesive pad 40. The second buffer layer 211 is annular in shape. The second buffer layer 211 is a rubber layer made of rubber.

[0063] See Figure 6 In some embodiments, the second receiving component 20 is flat and has a metal frame structure. The top and bottom surfaces are die-cast with rubber, or a layer of die-cast rubber is sandwiched in the middle. Through holes are formed in the rubber surface to create adhesive chip receiving holes 21. The thickness of the second receiving component 20 is not particularly limited; for example, it can be 0.5 to 1 times the length of the chip electronic component 30.

[0064] The second storage component 20 and the first storage component 10 can be two independent parts, or they can be connected in a detachable manner.

[0065] The present invention also provides a method for sorting surface-mount electronic components using the surface-mount electronic component sorting device described above, comprising the following steps:

[0066] Step S1: Place the surface-mount electronic components 30 to be sorted on the first receiving component 10, with the inlet layer 11 on top and the outlet layer 13 on the bottom; apply vibration to drive the surface-mount electronic components 30 and adhesive sheets 40 into the inlet channel 101 from the end where the end face 31 is located. At this time, the inlet channel 101 can contain elongated adhesive sheets 40, single good products, or two good products with overlapping end faces 31; when approximately all inlet channels 101 contain surface-mount electronic components 30, remove the surface-mount electronic components 30 that have not entered the inlet channel 101 (including adhesive sheets 40 glued in a side-by-side or near-side-by-side posture, adhesive sheets 40 glued in an L-shaped posture, and excess single good products), refer to Figure 8 As shown; specifically, the cleaning operation can be carried out by tilting the first storage component 10 and applying vibration to the first storage component 10. After cleaning, the first storage component 10 is reset so that the inlet layer 11 is on top and the outlet layer 13 is on the bottom.

[0067] Step S2: Push the adhesive sheet 40 and the good product into the channel 101 along the first direction A, so that the lower good product of the two good products overlapping the adhesive sheet 40 and the end face 31 is pushed to the position of the telescopic part 102 and clamped by the telescopic part 102. (Refer to...) Figure 9 As shown; at this time, when there is only a single good product in the inlet channel 101, the single good product is not subjected to the pushing force; in some embodiments, a punch can be used to push the adhesive sheet 40 and the good product. The pushing position of the punch is controlled by controlling the stroke of the punch, so that the punch pushes the lower good product of the two good products overlapping the adhesive sheet 40 and the end face 31 to the point that it can be firmly held by the rubber of the receiving hole 121 and then stops moving. In addition, the distance between the punch and the lower opening of the inlet hole 111 cannot be less than the length of the chip electronic component 30. In this way, the lower good product of the two overlapping good products is held by the rubber of the receiving hole 121, the long strip adhesive sheet 40 is held by the rubber of the receiving hole 121, and the upper good product of the two overlapping good products does not enter the receiving hole 121; in addition, the good products that originally only had one good product in the inlet hole 111 do not enter the receiving hole 121 because they were not contacted by the punch.

[0068] Step S3: Flip the first receiving component 10 so that the inlet layer 11 is below and the outlet layer 13 is above. Pour out the surface-mount electronic components 30 that are not held by the telescopic part 102, including a single good component present only in the inlet channel 101, or the upper good component among two good components with overlapping end faces 31 in the inlet channel 101. These good components can be poured into the good component recycling bin for recycling. (Refer to...) Figure 10 As shown;

[0069] Step S4: Reset the first receiving component 10 so that the import layer 11 is on top and the export layer 13 is on the bottom; (Refer to...) Figure 11 Place the first storage component 10 on the second storage component 20, and connect the adhesive patch storage hole 21 with the corresponding inlet channel 101. Preferably, the adhesive patch storage hole 21 and the outlet 1012 are one-to-one, so that the second storage component 20 can receive the good product or adhesive patch 40 in the inlet channel 101.

[0070] Step S5, refer to Figure 12The remaining single good product and adhesive sheet 40 are pushed along the first direction A into the guide channel 101, causing the single good product to fall onto the second receiving component 20, while the adhesive sheet 40 is clamped in the adhesive sheet receiving hole 21. In some embodiments, a punch can be used to push the adhesive sheet 40 and the good product. The pushing position of the punch is controlled by controlling the punch stroke, so that the punch pushes the adhesive sheet 40 and the good product out of the receiving hole 121 and stops moving. The distance between the punch and the upper opening of the adhesive sheet receiving hole 21 is not less than the length of the chip electronic component 30. In this way, after the good product comes out of the receiving hole 121, it falls onto the surface of the second receiving component 20 under the action of gravity and will not be pushed into the adhesive sheet receiving hole 21 by the punch. The long strip adhesive sheet 40 comes out of the receiving hole 121 and is then pushed into the adhesive sheet receiving hole 21 by the punch and clamped by the rubber of the adhesive sheet receiving hole 21.

[0071] Step S6, refer to Figure 13 Remove the first storage component 10, flip the second storage component 20, and pour out the good products on the second storage component 20. These good products can be poured into the good product recycling box for recycling. At this time, the adhesive sheet 40 is left in the adhesive sheet storage hole 21. The adhesive sheet 40 can be pushed out by the punch and recycled into the adhesive sheet 40 recycling box.

[0072] It should be noted that steps S1-S6 constitute one sorting cycle, and steps S1-S6 can be repeated until the entire batch of products is sorted.

[0073] It should be noted that other specific embodiments of the chip electronic component sorting method of the present invention are largely the same as other specific embodiments of the chip electronic component sorting device described above, and will not be described in detail here.

[0074] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A chip electronic component sorting device, using a set first direction (A) as a reference direction, characterized in that, include: The first receiving component (10) is provided with multiple inlet channels (101), which extend along the first direction (A). One end of the inlet channel (101) is provided with an inlet (1011) for the end face (31) of a single chip electronic component (30) to pass through, and the other end of the inlet channel (101) is provided with an outlet (1012). The inner wall of the inlet channel (101) is provided with a telescopic part (102). The telescopic part (102) moves closer to or further away from the inner wall of the inlet channel (101) to adjust the inner diameter of the inlet channel (101) at the location of the telescopic part (102). The inlet channel (101) between the inlet (1011) and the telescopic part (102) can hold two chip electronic components (30) with overlapping end faces (31), and the inlet channel (101) between the outlet (1012) and the telescopic part (102) can hold at least one chip electronic component (30). The second storage component (20) is provided with a plurality of adhesive strip storage holes (21), the diameter of each adhesive strip storage hole (21) is adjustable, and each adhesive strip storage hole (21) has a corresponding inlet channel (101). The first storage component (10) is placed on the second storage component (20), and each of the adhesive strip storage holes (21) is connected to the corresponding inlet channel (101); The telescopic part (102) has a receiving surface (1021). The first storage member (10) includes an inlet layer (11), a storage layer (12), and an outlet layer (13). The inlet layer (11), the storage layer (12), and the outlet layer (13) are arranged sequentially along the first direction (A). The inlet layer (11) has an inlet hole (111), the storage layer (12) has a storage hole (121), and the outlet layer (13) has an outlet hole (131). The inlet hole (111), the storage hole (121), and the outlet hole (131) are connected in sequence. The inlet channel (101) is formed by connecting the inlet and outlet holes (131); the telescopic part (102) is provided on the inner wall of the receiving hole (121); the inlet hole (111), the receiving hole (121), and the outlet hole (131) are coaxially arranged; the receiving hole (121) has a first state and a second state. In the first state, the diameter of the receiving hole (121) is smaller than the diameter of the inlet hole (111) and the outlet hole (131); in the second state, the diameter of the receiving hole (121) is equal to the diameter of the inlet hole (111) and the outlet hole (131).

2. The chip electronic component sorting device according to claim 1, characterized in that, The distance between the inlet (1011) and the receiving surface (1021) of the telescopic part (102) is H1, and the length of the chip electronic component (30) is L, H1 = (1.7~2.2)L.

3. The chip electronic component sorting device according to claim 1, characterized in that, The distance between the side of the telescopic part (102) near the outlet (1012) and the outlet (1012) is H2, where H2 = (1.2~1.5)L.

4. The chip electronic component sorting device according to claim 1, characterized in that, The telescopic part (102) is the first buffer layer.

5. The chip electronic component sorting device according to claim 1, characterized in that, The storage layer (12) and the telescopic part (102) are both made of rubber, and the telescopic part (102) and the storage layer (12) are integrally formed.

6. The chip electronic component sorting device according to claim 1, characterized in that, The material of the inlet layer (11) is either metal or resin, and the material of the outlet layer (13) is either metal or resin.

7. The chip electronic component sorting device according to claim 1, characterized in that, The inner wall of the adhesive strip receiving hole (21) is provided with a second buffer layer (211).

8. A method for sorting surface-mount electronic components using a surface-mount electronic component sorting apparatus as described in any one of claims 1-7, characterized in that, include: Step S1: Place the chip electronic components (30) to be sorted on the first receiving component (10), apply vibration to drive the chip electronic components (30) and adhesive sheets (40) to enter the inlet channel (101) from the end face (31), and remove the chip electronic components (30) that have not entered the inlet channel (101). Step S2, push the adhesive sheet (40) and the chip electronic component (30) in the guide channel (101) so that the lower chip electronic component (30) of the two chip electronic components (30) overlapping the adhesive sheet (40) and the end face (31) is pushed to the position of the telescopic part (102) and is clamped by the telescopic part (102); Step S3: Flip the first storage piece (10) and pour out the chip electronic components (30) that are not held by the telescopic part (102). Step S4: Reset the first storage component (10), place the first storage component (10) on the second storage component (20), and connect the adhesive patch storage hole (21) and the corresponding inlet channel (101); Step S5: Push the remaining single-chip electronic components (30) and adhesive strips (40) in the inlet channel (101) so that the single-chip electronic components (30) fall onto the second storage component (20) and the adhesive strips (40) are held in the adhesive strip storage hole (21). Step S6: Remove the first storage component (10), flip the second storage component (20), and pour out the chip electronic components (30) on the second storage component (20).

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