Inhibitor-free cleaning agent and method for cleaning conductive member for organic electroluminescent display device using the same

Abstract

This invention provides an inhibitor-free cleaning agent and a cleaning method using the same. The inhibitor-free cleaning agent comprises an alkaline salt, a water-soluble organic acid salt, an organic additive, an emulsifier, and an aromatic alcohol. The concentration ranges of the water-soluble organic acid salt and the aromatic alcohol are 1 g / L to 25 g / L and 10 g / L to 200 g / L, respectively.

Description

Technical Field

[0001] This disclosure relates to a cleaning agent without inhibitors and a method for cleaning conductive components of an organic electroluminescent display device using the same. Background Technology

[0002] The demand for display devices that output image information is increasing in various ways, and therefore various flat panel display devices are being researched, developed and used, such as LCD (Liquid Crystal Display) or PDP (Plasma Display Panel), OLED (Organic Luminescent Emission Diode), VFD (Vacuum Fluorescent Display), etc.

[0003] Among these flat panel display devices, organic electroluminescent display devices utilize organic light-emitting layers, which are self-emissive elements that emit light from phosphors through the recombination of electrons and holes. Due to their excellent display characteristics such as contrast ratio and response time, as well as their ease of realization into flexible displays, they have attracted attention as the most ideal next-generation display.

[0004] Organic light emitting diode display devices consist of multiple pixel areas arranged in a matrix, with micro-patterns formed in each pixel area, such as driving elements used to drive each pixel.

[0005] Furthermore, organic electroluminescent displays are self-emissive elements, eliminating the need for a separate light source as used in liquid crystal displays (LCDs), which are non-emissive elements, thus enabling thinner and lighter designs. Moreover, compared to LCDs, they offer superior viewing angles and contrast, lower power consumption, low DC voltage operation, and faster response times. Because their internal components are solid-state, they are also more resistant to external impacts and have a wider operating temperature range.

[0006] Typically, the fabrication process of these organic electroluminescent display devices includes the deposition and patterning of various materials on a substrate, using conductive components such as metal masks. The metal masks used in these deposition and patterning processes can be contaminated by organic substances, potentially leading to defects in the organic electroluminescent display device; therefore, a cleaning process for the metal masks is necessary.

[0007] Furthermore, with improvements in masking technology for organic electroluminescent display devices, organic and inorganic masks are now used separately. However, a method is under development to deposit organic and inorganic layers using the same mask. Even when using the same mask to deposit organic and inorganic layers, the mask cleaning process still presents the problem of requiring separate organic and inorganic cleaning steps when using traditional mask cleaning solutions. Summary of the Invention

[0008] Technical issues

[0009] One embodiment aims to provide a cleaning solution for conductive components used in the manufacturing process of organic electroluminescent display devices, which can be used to clean organic and inorganic deposits on conductive components used in the manufacturing process of organic electroluminescent display devices through a single process using a single cleaning agent.

[0010] In addition, one embodiment aims to provide a cleaning fluid for conductive components used in the manufacturing process of organic electroluminescent display devices, which cleans organic and inorganic substances adhering to conductive components through a single process, thereby improving productivity and reducing costs.

[0011] In addition, one embodiment aims to provide a cleaning solution for conductive components used in the manufacturing process of organic electroluminescent display devices, which can be used for cleaning more effectively.

[0012] In addition, one embodiment aims to provide a cleaning fluid for conductive components used in the manufacturing process of organic electroluminescent display devices, which can significantly reduce the product defect rate caused by uncleaned deposits and reduce operating costs by improving the cleaning performance degradation caused by continuous use of the cleaning fluid (cleaning agent).

[0013] In addition, one embodiment aims to provide a cleaning fluid for conductive components used in the manufacturing process of organic electroluminescent display devices, which can increase product productivity by reducing the cleaning time required for conventional cleaning fluids to remove deposits on conductive components and cleaning more products in the same amount of time.

[0014] In addition, one embodiment aims to provide a conductive component cleaning agent used in the manufacturing process of organic electroluminescent display devices. By improving the phenomenon of residual cleaning liquid on the conductive components during the process of water rinsing and drying after cleaning the deposits on the conductive components to remove the residual cleaning liquid, the product defect rate caused by the outgassing of the cleaning liquid remaining in the conductive components in the deposition equipment can be significantly reduced.

[0015] Another embodiment aims to provide a cleaning method that uses the cleaning agent to remove organic and inorganic substances adhering to conductive components used in the manufacturing process of organic electroluminescent display devices.

[0016] Technical solution

[0017] One embodiment provides an inhibitor-free cleaning agent comprising an alkaline salt, a water-soluble organic acid salt, an organic additive, an emulsifier, and an aromatic alcohol, wherein the concentrations of the water-soluble organic acid salt and the aromatic alcohol range from 1 g / L to 25 g / L and from 10 g / L to 200 g / L, respectively.

[0018] The concentration range of the alkaline salt can be from 10 g / L to 200 g / L.

[0019] The concentration range of the organic additive can be from 50 g / L to 500 g / L.

[0020] The concentration range of the emulsifier can be from 50 g / L to 300 g / L.

[0021] The aromatic alcohol can be represented by the following chemical formula 1.

[0022] [Chemical Formula 1]

[0023]

[0024] In the above chemical formula 1,

[0025] R 1 It is a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group.

[0026] n is an integer from 0 to 5.

[0027] L 1 It can be a substituted or unsubstituted C1 to C20 alkylene group or represented by the following chemical formula L.

[0028] [Chemical formula L]

[0029]

[0030] In the above chemical formula L,

[0031] L 2 For substituted or unsubstituted C1 to C10 alkylene groups,

[0032] m is an integer from 1 to 10.

[0033] The aromatic alcohol can only have one hydroxyl group.

[0034] The aromatic alcohol may include benzyl alcohol, 4-methoxybenzyl alcohol, 4-methylbenzyl alcohol, 2,6-dimethylbenzyl alcohol, 4-ethoxybenzyl alcohol, 4-isopropylbenzyl alcohol, 4-butoxybenzyl alcohol, 2-phenoxyethanol, 2-methyl-1-phenyl-2-propanol, 1-phenyl-1-propanol, or combinations thereof.

[0035] The alkaline salt may include hydroxides, carbonates, silicates, phosphates, ammonium salts, or combinations thereof.

[0036] The water-soluble organic acid salts may include citrate, succinate, acetate, oxalate, glycolate, gluconate, tartrate, or combinations thereof.

[0037] The organic additive may contain N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), dimethyl sulfoxide (DMSO), tetrahydrofurfuryl alcohol (THFA), 1,3-dimethyl-2-imidazolidinone, amide compounds, C1 to C20 alkanols, C1 to C20 alkanolamines, glycol ethers, or combinations thereof.

[0038] The amide compound may comprise N,N-Dimethylacetamide (DMAC), N,N-Diethylacetamide (DEAC), N,N-Dimethylformamide (DMF), N,N-Diethylformamide (DEF), N,N-Dimethylpropionamide (DMPA), N,N-Diethylpropionamide (DEPA), N,N-Dimethylacryamide (DMAA), N,N-Diethylacryamide (DEAA), or combinations thereof.

[0039] The glycol ether may include ethylene glycol monomethyl ether (Methyl Glycol, MG), diethylene glycol monomethyl ether (Methyl Di Glycol, MDG), triethylene glycol monomethyl ether (Methyl Tri Glycol, MTG), polyethylene glycol monomethyl ether (Methyl Poly Glycol, MPG), ethylene glycol monoisopropyl ether (iso-Propyl Glycol, iPG), ethylene glycol monoisopropyl ether (Butyl Glycol, BG), diethylene glycol monobutyl ether (Butyl Di Glycol, BDG), and triethylene glycol monobutyl ether (Butyl Tri Glycol, BDG). Glycol (BTG), ethylene glycol monoisopropyl ether (iBG), diethylene glycol monoisobutyl ether (iBDG), ethylene glycol monohexyl ether (HeG), diethylene glycol monohexyl ether (HeDG), ethylene glycol mono-2-ethylhexyl ether (EHG), diethylene glycol mono-2-ethylhexyl ether (EHDG), ethylene glycol monoallyl ether (EHDG), ethylene glycol monoallyl ether (BTG), ethylene glycol monoisopropyl ether (iBG), diethylene glycol monoisobutyl ether (IBDG), ethylene glycol monohexyl ether (IBDG), ethylene glycol monohexyl ether (IHG), ethylene glycol mono-2-ethylhexyl ether (EHDG), ethylene glycol monoallyl ether (I ... MonoallylEther;Allyl Glycol (AG), Ethylene Glycol Monophenyl Ether (Phenyl Glycol, PhG), Diethylene Glycol Monophenyl Ether (Phenyl DiGlycol, PhDG), Propylene Glycol Monomethyl Ether (Methyl Propylene Glycol, MFG), Dipropylene Glycol Monomethyl Ether (Methyl Propylene Di Glycol, MFDG), Tripropylene Glycol Monomethyl Ether (Methyl Propylene Tri Glycol, MFTG), Propylene Glycol Monobutyl Ether (Butyl Propylene Glycol, BFG), Dipropylene Glycol Monobutyl Ether (Butyl Propylene Di... Glycol (BFDG), propylene glycol monomethyl ether acetate (Propylene Glycol Monomethyl Ether Acetate; Methyl Propylene Glycol Acetate, MFG-AC), or combinations thereof.

[0040] The emulsifier may contain monoethanolamine (MEA), triethanolamine (TEA), aminoethylethanolamine (AEEA), glycerol, polyethylene glycol (PEG), polypropylene glycol (PPG), or combinations thereof.

[0041] The inhibitor-free cleaning agent may also contain surfactants.

[0042] The inhibitor-free cleaning agent may also contain water.

[0043] The inhibitor-free cleaning agent can be used to clean conductive components used in the manufacturing process of organic electroluminescent display devices.

[0044] The conductive component may include a fine metal mask (FMM), an open metal mask (OMM), or a combination thereof.

[0045] Another embodiment aims to provide a cleaning method for removing organic and inorganic substances adhering to conductive components used in the manufacturing process of organic electroluminescent display devices, the method comprising: preparing conductive components with adhering organic and inorganic substances; immersing the conductive components in a cleaning agent; maintaining the temperature of the cleaning agent between 20°C and 90°C; and cleaning the conductive components by simple immersion, providing ultrasonic waves, CDA (clean dry air), and / or electric current.

[0046] Specific details of other aspects of the invention are contained in the following detailed description.

[0047] Invention Effects

[0048] The conductive component cleaning agent used in the manufacturing process of an organic electroluminescent display device according to one embodiment has the first advantage that it can be used to treat organic and inorganic deposits on the conductive components used in the manufacturing process using a single solution through a single process.

[0049] The conductive component cleaning agent used in the manufacturing process of an organic electroluminescent display device according to one embodiment has the second effect of cleaning organic and inorganic substances adhering to the conductive components through a single process, thereby improving productivity and reducing costs.

[0050] A third effect of the conductive component cleaning agent used in the manufacturing process of an organic electroluminescent display device according to one embodiment is that it can be cleaned more effectively.

[0051] A fourth effect of the conductive component cleaning agent used in the manufacturing process of an organic electroluminescent display device according to one embodiment is that, by improving the degradation of cleaning performance caused by continuous use of the cleaning agent, it can significantly reduce the product defect rate caused by uncleaned deposits and reduce running costs.

[0052] The fifth effect of the conductive component cleaning agent used in the manufacturing process of an organic electroluminescent display device according to one embodiment is that it can increase product productivity by reducing the cleaning time required to remove deposits on conductive components and cleaning more products in the same amount of time.

[0053] The sixth effect of the conductive component cleaning agent used in the manufacturing process of an organic electroluminescent display device according to one embodiment is that, by improving the phenomenon of residual cleaning liquid on the conductive components during the process of water rinsing and drying after cleaning the deposits on the conductive components to remove the residual cleaning liquid, the product defect rate caused by the outgassing of the cleaning liquid remaining in the conductive components in the deposition equipment can be significantly reduced. Attached Figure Description

[0054] Figure 1 The accompanying drawing illustrates a method for cleaning conductive components used in the manufacturing process of an organic electroluminescent display device by simply immersing them in a cleaning agent (cleaning solution) according to one embodiment.

[0055] Figure 2 The accompanying drawing illustrates a method for cleaning conductive components used in the manufacturing process of an organic electroluminescent display device by immersing them in a cleaning agent (cleaning solution) according to one embodiment and then providing ultrasonic cleaning.

[0056] Figure 3 The accompanying drawing illustrates a method for cleaning conductive components used in the manufacturing process of an organic electroluminescent display device by immersing them in a cleaning agent (cleaning solution) according to one embodiment and then providing CDA (clean dry air).

[0057] Figure 4 The accompanying drawing illustrates a method for cleaning conductive components used in the manufacturing process of an organic electroluminescent display device by immersing them in a cleaning agent (cleaning solution) according to one embodiment and then providing an electric current. Detailed Implementation

[0058] Embodiments of the present invention will be described in detail below. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments; the scope of the claims is the sole determining factor.

[0059] The embodiments of the present invention can be modified in various ways, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to describe the invention more completely to those skilled in the art. Therefore, for clarity, the shapes and sizes of elements are enlarged in the drawings, and the same reference numerals denote the same elements in the drawings.

[0060] Throughout the specification, when a section is described as "containing" a component, unless otherwise stated, it means that other components may also be included, not that other components are excluded.

[0061] In this specification, unless otherwise stated, "alkyl" refers to C1 to C20 alkyl, "alkenyl" refers to C2 to C20 alkenyl, "cycloalkenyl" refers to C3 to C20 cycloalkenyl, "heterocyclic alkenyl" refers to C3 to C20 heterocyclic alkenyl, "aryl" refers to C6 to C20 aryl, "aralkyl" refers to C7 to C20 aralkyl, "alkylene" refers to C1 to C20 alkylene, "arylene" refers to C6 to C20 arylene, "alkylarylene" refers to C7 to C20 alkylarylene, "heteroarylene" refers to C3 to C20 heteroarylene, and "alkoxide" refers to C1 to C20 alkoxide.

[0062] In this specification, unless otherwise stated, “substitution” means that at least one hydrogen atom is substituted by a halogen atom (F, Cl, Br, I), a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amino group, an imino group, an azide group, an amido group, a hydrazine group, an imine group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocyclic alkyl group, a C2 to C20 heterocyclic alkenyl group, a C2 to C20 heterocyclic alkynyl group, a C3 to C20 heteroaryl group, or a combination thereof.

[0063] In this specification, unless otherwise defined, “combination” means mixture or copolymerization.

[0064] In the chemical formulas of this specification, unless otherwise defined, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it indicates that a hydrogen atom is bonded at that position.

[0065] The fabrication process of an organic light-emitting diode (OLED) display device includes the deposition and patterning of various materials on a substrate. Specifically, to form the OLED display device, patterns of organic light-emitting materials that generate red, green, and blue light must be formed on the substrate. Furthermore, metal electrode patterns, such as the cathode of an organic light-emitting diode (OLED), must be formed on the substrate. At this time, a metal mask is disposed on the substrate, and the organic light-emitting material patterns or electrode patterns are formed using the metal mask.

[0066] The metal mask is a conductor and is made of Invar or stainless steel. The metal mask can be used multiple times to form organic light-emitting material patterns, and multiple masks can be used to form electrode patterns.

[0067] At this time, organic substances, such as those used for the organic light-emitting material pattern, or inorganic substances, such as those used for the electrode pattern, may adhere to the metal mask, potentially causing defects in the manufacturing of the organic electroluminescent display device. In other words, due to the adhesion of organic or inorganic substances, an organic light-emitting material pattern different from the desired pattern may be formed on the substrate. When forming the electrode pattern, organic and inorganic layers may be stacked.

[0068] Examples of the organic material could be organic light-emitting material patterning material, photoresist residue used to manufacture the metal mask, tape residue used to package the metal mask, or residue that may adhere during handling or cleaning. Examples of the inorganic material could be materials formed into electrode patterns. In addition, various organic or inorganic materials may adhere to the metal mask.

[0069] According to one embodiment, the cleaning agent, as an inhibitor-free cleaning agent, comprises an alkaline salt, a water-soluble organic acid salt, an organic additive, an emulsifier, and an aromatic alcohol. In this case, the concentration ranges of the water-soluble organic acid salt and the aromatic alcohol are 1 g / L to 25 g / L and 10 g / L to 200 g / L, respectively.

[0070] When using conventional cleaning solutions to continuously clean conductive components used in the manufacturing process of organic electroluminescent display devices, a rapid decline in cleaning performance occurs. This leads to prolonged cleaning times and the presence of unremoved deposits or residues, further contributing to product defects. Furthermore, as described below, conventional cleaning solutions contain inhibitors, making them unsuitable for prolonged use and necessitating frequent replacements, thus increasing operating costs.

[0071] As mentioned above, the rapid decline in cleaning performance due to continuous use of conventional cleaning solutions is caused by the concentration of inhibitors, one of the components of these solutions. Inhibitors, as chemical reaction inhibitors, are added to conventional cleaning solutions to prevent corrosion of conductive components or damage due to over-reaction. However, they also have the negative effect of slowing down the cleaning speed of inorganic substances adhering to conductive components. The degree of slowing varies depending on the type of inhibitor, but generally, the higher the amount of inhibitor, the stronger the chemical reaction inhibition, and therefore the slower the cleaning time of inorganic substances. Common inhibitors include thiourea, 1,2,3-benzotriazole, pyridyl compounds, or organic cyclic compounds, where the pyridyl compound can be a nitrogen or sulfur compound with unshared electron pairs.

[0072] The cleaning solution used in the manufacturing process of organic electroluminescent display devices is typically used for several days to several weeks. During this period, water and some highly volatile components in the cleaning solution evaporate, resulting in concentration. During this concentration process, alkali salts, water-soluble organic acid salts, and inhibitors, as raw materials that are either solids or have low volatility, hardly evaporate. Because the water and some highly volatile components evaporate, the overall volume of the cleaning solution decreases, but the alkali salts, water-soluble organic acid salts, and inhibitors hardly evaporate, thus their concentration relatively increases. Therefore, as traditional cleaning solutions become increasingly concentrated over long-term use, the concentration of inhibitors increases, leading to a rapid slowdown in cleaning speed and the presence of unremoved deposits or residues.

[0073] To address the problems of conventional cleaning solutions as described above, the inventors conducted a component analysis of conventional cleaning agents. After confirming that the inhibitor component in conventional cleaning solutions was a problem, they eliminated the inhibitor. This improves the situation where the cleaning performance rapidly declines due to inhibitor concentration caused by prolonged continuous use of the cleaning solution. Furthermore, it reduces the decrease in cleaning speed caused by continuous use of the cleaning solution and the product defect rate caused by unwashed deposits or residues. Since the cleaning solution replacement cycle is extended, it can be used for a longer period, thereby reducing operating costs.

[0074] On the other hand, the conductive components used in the manufacturing process of organic light-emitting display devices mainly use Invar or SUS (Steel Use Stainless) metals made of iron (Fe) alloys. In environments with high concentrations of alkaline salts in the cleaning solution, corrosion or excessive reactions may occur, leading to damage. Generally, iron alloys are easily corroded and damaged in acidic environments, but in alkaline environments, a passivation film forms on the metal surface to prevent damage. However, even in alkaline environments, at high concentrations of alkaline salts exceeding 200 g / L, even with the formation of a passivation film, it cannot withstand the high concentration of alkaline environment and is gradually destroyed, potentially causing corrosion or excessive reactions that damage the iron alloy. Therefore, the inventors have limited the cleaning solution for conductive components used in the manufacturing process of organic light-emitting display devices to an alkaline environment rather than an acidic environment. In this case, since the concentration of alkaline salts is not higher than 200 g / L (because the concentration of alkaline salts is below 200 g / L), even without the use of inhibitors, the conductive components used in the manufacturing process of organic light-emitting display devices can be protected from damage by the cleaning solution.

[0075] Furthermore, the cleaning agent according to one embodiment maintains the alkaline environment as described above, thereby preventing damage to conductive components by conventional cleaning solutions containing inhibitors, even without the presence of inhibitors. In one embodiment, the concentration ranges of the water-soluble organic acid salts and aromatic alcohols constituting the cleaning agent are limited to 1 g / L to 25 g / L and 10 g / L to 200 g / L, respectively, thereby optimizing the composition of the inhibitor-free cleaning agent (cleaning solution).

[0076] Furthermore, compared to conventional cleaning solutions used to remove organic and inorganic substances adhering to conductive components used in the manufacturing process of organic electroluminescent display devices, the cleaning agent according to one embodiment further contains an aromatic alcohol, specifically an aromatic alcohol represented by Chemical Formula 1. The aromatic alcohol represented by Chemical Formula 1 improves product productivity and enhances the cleaning power of organic substances and the water washability of the cleaning solution, thereby reducing product defect rates.

[0077] The primary function is to disperse organic matter. Organic matter dispersed and fragmented by the aromatic alcohol represented by Formula 1 is dissolved more quickly by organic additives due to its wider reaction surface area, thereby shortening the cleaning time of conductive components used in the manufacturing process of organic electroluminescent display devices. Therefore, more conductive components can be cleaned in the same amount of time, increasing product productivity. Furthermore, organic matter is more easily removed from structurally difficult-to-clean areas within the conductive components, significantly reducing the defects caused by residual organic matter after cleaning. Residual organic matter within the conductive components becomes impurities in the deposition equipment used to produce the product, leading to product defects; therefore, it is necessary to minimize residue.

[0078] The second function is to improve water washability. After cleaning the organic and inorganic substances from the conductive components used in the manufacturing process of organic electroluminescent display devices, cleaning fluid adheres to the surface of the conductive components, metal overlaps, and welded joints. To remove the cleaning fluid adhering to the conductive components, the next step is to wash the conductive components with washing water. During this process, conventional cleaning fluids are difficult to remove from the metal overlaps and welded joints of the conductive components, leaving residues that cause defects. As mentioned above, if cleaning fluid remains on the metal overlaps and welded joints of the conductive components, it will evaporate in the deposition equipment used to produce the product, damaging the organic and inorganic substances deposited on the product and potentially leading to product defects. On the other hand, the cleaning agent according to one embodiment further contains the aromatic alcohol represented by Chemical Formula 1, which facilitates the removal of cleaning fluid from the metal overlaps and welded joints of the conductive components by washing water, thereby reducing cleaning fluid residue and significantly reducing product defects.

[0079] The constituent elements constituting an inhibitor-free cleaning agent according to one embodiment will be described in further detail below.

[0080] Water-soluble organic acid salts

[0081] As a component that prevents sudden pH changes in the cleaning agent according to one embodiment, prevents the hydroxide precipitation of metal ions, and assists in the removal of organic and inorganic substances, the water-soluble organic acid salt may include citrate, succinate, acetate, oxalate, glycolate, gluconate, tartrate, or combinations thereof. For example, the water-soluble organic acid salt may be one or a mixture of two selected from citrate, succinate, acetate, oxalate, glycolate, gluconate, and tartrate. From the perspective of the stability of the cleaning agent, gluconate is preferred, but not necessarily limited to this. Here, the salt may be an alkali metal such as sodium or potassium, or an alkaline earth metal such as calcium or barium.

[0082] Examples of water-soluble organic acid salts include potassium citrate, sodium citrate, potassium succinate, sodium succinate, potassium acetate, sodium acetate, potassium oxalate, sodium oxalate, potassium glycolate, sodium glycolate, potassium gluconate, sodium gluconate, potassium tartrate, and sodium tartrate, but they are not necessarily limited to these.

[0083] Furthermore, in the inhibitor-free cleaning agent component according to one embodiment, the concentration range of the water-soluble organic acid salt should be from 1 g / L to 25 g / L, for example, from 1 g / L to 12 g / L. If the concentration of the water-soluble organic acid salt is less than 1 g / L, the pH of the cleaning agent will change abruptly or hydroxide precipitates will form. If the concentration of the water-soluble organic acid salt is greater than 25 g / L, it will react excessively with organic and inorganic substances, potentially impairing solubility stability, and therefore may not be desirable. In any case, when the concentration of the water-soluble organic acid salt is greater than 25 g / L, due to the impaired solubility stability of organic and inorganic substances, it may be more suitable to use an inhibitor-containing cleaning agent compared to an inhibitor-free cleaning agent. This is because, as chemical reaction inhibitors, inhibitors suppress excessive reactions between organic and inorganic substances. That is, in order for the cleaning agent according to one embodiment to be an inhibitor-free cleaning agent, it is preferable that the concentration of the water-soluble organic acid salt is kept below 25 g / L, for example below 20 g / L, for example below 15 g / L, for example below 12 g / L.

[0084] Aromatic alcohols

[0085] As a component that increases the reaction surface area by dispersing organic matter, thereby shortening the dissolution time and improving water washability to reduce the phenomenon of residual cleaning agent on conductive components used in the manufacturing process of organic electroluminescent display devices, the aromatic alcohol can be represented by the following chemical formula 1.

[0086] [Chemical Formula 1]

[0087]

[0088] In the above chemical formula 1,

[0089] R 1 It is a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group.

[0090] n is an integer from 0 to 5.

[0091] L 1 It can be a substituted or unsubstituted C1 to C20 alkylene group or represented by the following chemical formula L.

[0092] [Chemical formula L]

[0093]

[0094] In the above chemical formula L,

[0095] L 2 For substituted or unsubstituted C1 to C10 alkylene groups,

[0096] m is an integer from 1 to 10.

[0097] For example, the aromatic alcohol specifically represented by the above-described chemical formula 1 can only have one hydroxyl group. Aromatic alcohols with two or more hydroxyl groups (represented by the above-described chemical formula 1) also contribute to preventing corrosion of metals, thus being disadvantageous in terms of cleaning speed and washability. It is likely preferable that the aromatic alcohol represented by the above-described chemical formula 1 has only one hydroxyl group. In other words, when the aromatic alcohol (represented by the above-described chemical formula 1) has two or more hydroxyl groups, compared to the case with only one hydroxyl group, while it provides good protection against metal corrosion, the cleaning power and washability decrease, which may be undesirable.

[0098] For example, the aromatic alcohol may be one or a mixture of two selected from benzyl alcohol, 4-methoxybenzyl alcohol, 4-methylbenzyl alcohol, 2,6-dimethylbenzyl alcohol, 4-ethoxybenzyl alcohol, 4-isopropylbenzyl alcohol, 4-butoxybenzyl alcohol, 2-phenoxyethanol, 2-methyl-1-phenyl-2-propanol, and 1-phenyl-1-propanol. From the perspective of the stability of the cleaning agent, benzyl alcohol may be preferred, but it is not necessarily limited to this.

[0099] Furthermore, in the inhibitor-free cleaning agent component according to one embodiment, the concentration range of the aromatic alcohol is preferably from 10 g / L to 200 g / L. If the concentration of the aromatic alcohol is less than 10 g / L, product defects may occur due to outgassing in the deposition equipment because of the large amount of cleaning agent residue in the conductive components used in the organic electroluminescent display device manufacturing process. If the concentration of the aromatic alcohol is greater than 200 g / L, it may impair the solubility stability of inorganic substances, and therefore may not be desirable.

[0100] Alkali salts

[0101] As a component for dissolving inorganic substances and organic substances with ester functional groups, the alkaline salt may include hydroxides, carbonates, silicates or phosphates, ammonium salts, or combinations thereof. For example, the alkaline salt may be at least one or a mixture of two selected from hydroxides, carbonates, silicates, phosphates, and ammonium salts. Hydroxides may be preferred from the perspective of the stability of the cleaning agent, but are not necessarily limited thereto. Here, the salt may be an alkali metal such as sodium or potassium, or an alkaline earth metal such as calcium or barium.

[0102] Examples of alkaline salts include potassium hydroxide, sodium hydroxide, potassium carbonate, sodium carbonate, potassium silicate, sodium silicate, potassium phosphate, sodium phosphate, and ammonium carbonate, but they are not necessarily limited to these.

[0103] Furthermore, in the inhibitor-free cleaning agent component according to one embodiment, the concentration range of the alkaline salt is preferably from 10 g / L to 200 g / L. If the concentration of the alkaline salt is less than 10 g / L, the cleaning speed becomes slow, making it impossible to quickly clean organic and inorganic substances. If the concentration of the alkaline salt is greater than 200 g / L, it may damage the conductive components used in the manufacturing process of organic electroluminescent display devices, and therefore may not be desirable.

[0104] Organic additives

[0105] As a component for dissolving organic matter, the organic additives may include N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), dimethyl sulfoxide (DMSO), tetrahydrofurfuryl alcohol (THFA), 1,3-dimethyl-2-imidazolidinone, amide compounds, alkanols with 1 to 20 carbon atoms (C1 to C20), alkanol amines with 1 to 20 carbon atoms (C1 to C20), glycol ethers, or combinations thereof. For example, the organic additive may be one or a mixture of two selected from N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), dimethyl sulfoxide (DMSO), tetrahydrofurfuryl alcohol (THFA), 1,3-dimethyl-2-imidazolidinone, amide compounds, alkanols with 1 to 20 carbon atoms (C1 to C20), alkanol amines with 1 to 20 carbon atoms (C1 to C20), and glycol ethers. Glycol ethers may be preferred from the perspective of the stability of the cleaning agent, but are not necessarily limited thereto.

[0106] Examples of the amide compounds include, but are not limited to, N,N-Dimethylacetamide (DMAC), N,N-Diethylacetamide (DEAC), N,N-Dimethylformamide (DMF), N,N-Diethylformamide (DEF), N,N-Dimethylpropionamide (DMPA), N,N-Diethylpropionamide (DEPA), N,N-Dimethylacryamide (DMAA), and N,N-Diethylacryamide (DEAA).

[0107] For example, the glycol ethers mentioned can include ethylene glycol monomethyl ether (Methyl Glycol, MG), diethylene glycol monomethyl ether (Methyl Di Glycol, MDG), triethylene glycol monomethyl ether (Methyl Tri Glycol, MTG), polyethylene glycol monomethyl ether (Methyl Poly Glycol, MPG), ethylene glycol monoisopropyl ether (iso-Propyl Glycol, iPG), ethylene glycol monoisopropyl ether (Butyl Glycol, BG), diethylene glycol monobutyl ether (Butyl Di Glycol, BDG), and triethylene glycol monobutyl ether (Butyl Tri Glycol, BDG). Glycol (BTG), ethylene glycol monoisopropyl ether (iBG), diethylene glycol monoisobutyl ether (iBDG), ethylene glycol monohexyl ether (HeG), diethylene glycol monohexyl ether (HeDG), ethylene glycol mono-2-ethylhexyl ether (EHG), diethylene glycol mono-2-ethylhexyl ether (EHDG), ethylene glycol monoallyl ether (BTG), ethylene glycol monoisopropyl ether (iBG), diethylene glycol monoisobutyl ether (iBDG), ethylene glycol monohexyl ether (HeG), diethylene glycol monohexyl ether (EHDG), ethylene glycol monoallyl ether (EHDG), ethylene glycol monoallyl ether (EHDG), ethylene glycol monoallyl ether (EHDG), ethylene glycol monoallyl ether (BTG), ethylene glycol monoisopropyl ether (BTG), ethylene glycol monohexyl ether (BTG), ethylene glycol monohexyl ether (BTG), ethylene glycol monohexyl ether (BTG), ethylene glycol monohexyl ether (BTG), ethylene glycol monoallyl ether (BTG), ethylene glycol monohexyl ... MonoallylEther;Allyl Glycol (AG), Ethylene Glycol Monophenyl Ether (Phenyl Glycol, PhG), Diethylene Glycol Monophenyl Ether (Phenyl DiGlycol, PhDG), Propylene Glycol Monomethyl Ether (Methyl Propylene Glycol, MFG), Dipropylene Glycol Monomethyl Ether (Methyl Propylene Di Glycol, MFDG), Tripropylene Glycol Monomethyl Ether (Methyl Propylene Tri Glycol, MFTG), Propylene Glycol Monobutyl Ether (Butyl Propylene Glycol, BFG), Dipropylene Glycol Monobutyl Ether (Butyl Propylene Di... Glycol (BFDG), propylene glycol monomethyl ether acetate (Propylene Glycol Monomethyl Ether Acetate; Methyl Propylene Glycol Acetate, MFG-AC), etc., but not necessarily limited to these.

[0108] Furthermore, in the inhibitor-free cleaning agent component according to one embodiment, the concentration range of the organic additive is preferably from 50 g / L to 500 g / L. If the concentration of the organic additive is less than 50 g / L, the cleaning speed is slowed down, and organic substances cannot be cleaned quickly. If the concentration of the organic additive is greater than 500 g / L, it may impair the solubility stability of inorganic substances, and therefore may not be desirable.

[0109] emulsifier

[0110] As a component that acts as a mediator for mixing the alkali salt and organic additives, the emulsifier may comprise monoethanolamine (MEA), triethanolamine (TEA), aminoethylethanolamine (AEEA), glycerol, polyethylene glycol (PEG), polypropylene glycol (PPG), or combinations thereof. For example, the emulsifier may be one or a mixture of two selected from monoethanolamine (MEA), triethanolamine (TEA), aminoethylethanolamine (AEEA), glycerol, polyethylene glycol (PEG), and polypropylene glycol (PPG). Triethanolamine may be preferred from the perspective of cleaning agent stability, but is not necessarily limited to this.

[0111] Furthermore, in the inhibitor-free cleaning agent component according to one embodiment, the concentration range of the emulsifier is preferably from 50 g / L to 300 g / L. If the concentration of the emulsifier is less than 50 g / L, the alkaline salt and the organic additive will not mix. If the concentration of the emulsifier is greater than 300 g / L, it may be undesirable due to the increased viscosity of the cleaning agent, which presents management difficulties.

[0112] Other ingredients

[0113] According to one embodiment, the cleaning agent, which is used to remove organic and inorganic substances adhering to conductive components used in the manufacturing process of organic electroluminescent display devices, may also contain surfactants.

[0114] For example, the surfactant may also comprise at least one selected from anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. When the cleaning agent according to one embodiment further comprises the surfactant as described above, the surface tension of the cleaning agent is reduced, which can improve its permeability.

[0115] For example, anionic surfactants may include monoalkyl sulfates, alkyl polyoxyethylene sulfates, alkylbenzene sulfonates, monoalkyl phosphates, etc.; cationic surfactants may include dialkyl dimethyl ammonium salts, alkylbenzene methyl ammonium salts, etc.; nonionic surfactants may include polyoxyethylene alkyl ethers, fatty acid dehydrated sorbitol esters, fatty acid diethanolamine, alkyl monoglyceride ethers, etc.; and amphoteric surfactants may include alkyl sulfobetaine, alkyl carboxybetaine, etc., but are not necessarily limited to these.

[0116] The cleaning agent may also contain water. That is, the components are dissolved in water, thereby easily preparing an inhibitor-free cleaning agent according to one embodiment. The water is preferably water that has removed ionic substances and impurities, such as ion-exchanged water, pure water, ultrapure water, etc.

[0117] The temperature of the cleaning agent can be above 20°C, for example, from 20°C to 90°C, from 40°C to 90°C, or from 50°C to 90°C. When the temperature of the cleaning agent according to one embodiment is controlled within this range, organic and inorganic substances adhering to conductive components used in the manufacturing process of organic electroluminescent display devices can be removed most effectively. That is, the inhibitor-free cleaning agent can be a cleaning agent used for cleaning conductive components used in the manufacturing process of organic electroluminescent display devices.

[0118] The conductive component may include a fine metal mask (FMM), an open metal mask (OMM), or a combination thereof.

[0119] According to another embodiment, a cleaning method using the cleaning agent is provided, specifically a cleaning method for removing organic and inorganic substances adhering to conductive components used in the manufacturing process of organic electroluminescent display devices.

[0120] Specifically, according to another embodiment, a cleaning method for removing organic and inorganic substances adhering to conductive components used in the manufacturing process of an organic electroluminescent display device includes: preparing conductive components with adhering organic and inorganic substances; immersing the conductive components in the cleaning agent; maintaining the temperature of the cleaning agent between 20°C and 90°C; and cleaning the conductive components by simple immersion, providing ultrasonic waves, CDA (clean dry air), and / or electric current.

[0121] In the following description, a cleaning method using a cleaning agent according to one embodiment will be described with reference to the accompanying drawings. Descriptions of the cleaning agent that are repeated above may be omitted. Figures 1 to 4The figures are attached to illustrate a cleaning method using a cleaning agent according to one embodiment.

[0122] Figure 1 This illustrates a cleaning method that involves simply immersing conductive components in a cleaning agent (cleaning solution) for cleaning.

[0123] Figure 2 This describes a cleaning method in which conductive components are immersed in a cleaning agent (cleaning solution) and then cleaned using ultrasonic waves.

[0124] Figure 3 This describes a cleaning method in which conductive components are immersed in a cleaning agent (cleaning solution) and then cleaned with CDA (clean dry air).

[0125] Figure 4 This describes a cleaning method in which conductive components are immersed in a cleaning agent (cleaning solution) and then an electric current is applied for cleaning.

[0126] Of the four cleaning methods mentioned, the following will be referred to Figure 4 A detailed description is needed of the cleaning method that uses electric current for cleaning.

[0127] Reference Figure 4 According to another embodiment, the cleaning method can utilize the cleaning agent 20 according to one embodiment. Furthermore, the cleaning method can utilize the cleaning agent 20 and a cleaning apparatus to clean the conductive components 10 used in the manufacturing process of organic electroluminescent display devices. The cleaning method can be performed by electrolysis. In this case, the cleaning apparatus includes an electrolytic cell 100, a power supply device 200, terminals 300, and electrodes 400. The cleaning method is further described in detail below.

[0128] First, a conductive component 10 is prepared for use in the manufacturing process of an organic electroluminescent display device. For example, the step of preparing the conductive component 10 is to arrange the conductive component 10 on a substrate for forming the organic electroluminescent display device, and to sequentially form a pattern composed of the organic material and a pattern composed of the inorganic material on the substrate using the conductive component 10. Then, the conductive component 10 is separated from the substrate.

[0129] In other words, the conductive component 10 used in the manufacturing process of the organic electroluminescent display device can be a metal mask used to form patterns of organic light-emitting materials or electrode patterns. Therefore, organic or inorganic substances may adhere to the conductive component 10. Furthermore, the conductive component 10 can be made of Invar or stainless steel.

[0130] The electrolytic cell 100 is filled with cleaning agent 20. As mentioned above, cleaning agent 20 may be, for example, an aqueous solution containing an alkaline salt, a water-soluble organic acid salt, an organic additive, an emulsifier, an aromatic alcohol, and water. In this case, the alkaline salt can form conductive ions through electrolysis.

[0131] The conductive component 10 can be connected to the terminal 300. The terminal 300 is electrically connected to the power supply device 200 and connected to the conductive component 10. At this time, the terminal 300 can have a clamp shape. Then, the conductive component 10 is immersed in the cleaning agent 20.

[0132] Furthermore, electrode 400 is immersed in cleaning agent 20. Electrode 400 is electrically connected to power supply device 200 and receives voltage from power supply device 200. Electrode 400 may be formed of any one selected from iridium oxide, titanium, platinum and nickel.

[0133] The power supply device 200 can apply voltage to the conductive component 10 to be cleaned via terminal 300. Furthermore, the power supply device 200 can apply voltage to electrode 400. For example, the power supply device 200 can apply a negative voltage to the conductive component 10 and a positive voltage to electrode 400. Alternatively, the power supply device 200 can apply a positive voltage to the conductive component 10 and a negative voltage to electrode 400.

[0134] The power supply device 200 allows current to flow through the conductive component 10 and the electrode 400 by applying a voltage to them. At this time, the current density is 1 to 12 A / dm². 2 The current can flow through the conductive component 10 and the electrode 400.

[0135] When a voltage is applied to the conductive component 10 and the electrode 400, which are immersed in the cleaning agent 20, and a current flows through them, bubbles are generated on the surface of the conductive component 10. Through these bubbles, organic and inorganic substances adhering to the conductive component 10 can be electrolytically cleaned.

[0136] Specifically, when a negative voltage is applied to the conductive component 10 and a positive voltage is applied to the electrode 400, as shown in [Reaction 1], hydrogen bubbles will be generated on the surface of the conductive component 10.

[0137] [Reaction Formula 1]

[0138] 2H + +2e→H2

[0139] Furthermore, as shown in [Reaction 2], oxygen bubbles are generated on the surface of electrode 400.

[0140] [Reaction 2]

[0141] 4OH - →4e+O2+H2O

[0142] Organic and inorganic substances adhering to the conductive component 10 can be physically removed by the hydrogen bubbles. Alternatively, organic and inorganic substances adhering to the conductive component 10 can be chemically removed by the cleaning agent 20.

[0143] In other words, organic and inorganic substances can be removed by immersing the conductive parts 10 with organic and inorganic substances in the cleaning agent 20, but electrolysis can remove them more quickly and effectively.

[0144] For example, when electrolysis is used, it can even remove magnesium (Mg) and silver (Ag) residues that are difficult to remove by simply immersing in cleaning agent 20. Furthermore, it can shorten the removal time for both organic and inorganic substances.

[0145] Referring to [Reaction Formula 1] and [Reaction Formula 2], the amount of hydrogen bubbles produced is twice that of oxygen bubbles. Therefore, when a negative voltage is applied to the conductive component 10, organic and inorganic substances can be removed more effectively. Furthermore, because hydrogen ions are removed from the surface of the conductive component 10, the electrolyte adjacent to the surface of the conductive component 10 will have a stronger alkalinity than other parts.

[0146] Furthermore, by using ultrasonic waves during electrolytic cleaning, the cleaning time can be further shortened.

[0147] Therefore, by using the cleaning agent 20 according to one embodiment and the cleaning method utilizing the cleaning agent 20, organic and inorganic substances adhering to the conductive components 10 used in the manufacturing process can be cleaned using a single solution in a single process. Furthermore, this method can improve productivity and reduce costs, allowing for more efficient cleaning. In particular, by using a cleaning agent that does not contain any inhibitors, i) by mitigating the decline in cleaning performance caused by the continuous use of cleaning agents containing conventional inhibitors, the product defect rate caused by uncleaned deposits can be significantly reduced, as well as operating costs can be reduced; ii) by greatly shortening the cleaning time required to remove deposits from conductive components, more products can be cleaned in the same amount of time, thereby improving product productivity; iii) by improving the process of water rinsing and drying after cleaning deposits from conductive components to remove residual cleaning agent, the product defect rate caused by outgassing of cleaning fluid remaining in the conductive components in the deposition equipment can be significantly reduced—an effect that cannot be achieved with conventional cleaning agents.

[0148] Preferred embodiments of the present invention are described below. However, the following embodiments are merely one preferred embodiment of the present invention, and the present invention is not limited to the following embodiments.

[0149] (Example)

[0150] Residue removal time and metal mask washing effect

[0151] Experimental Example 1

[0152] The experimental conditions are as follows.

[0153] First, the cleaning agent was an aqueous solution at 20°C, containing 40 g / L of potassium hydroxide, potassium citrate, 150 g / L of ethylene glycol monomethyl ether, 100 g / L of triethanolamine, and benzyl alcohol. The changes in the photoresist residue removal rate were observed by varying the contents of the potassium citrate and benzyl alcohol, as shown in Tables 1 and 2 below.

[0154] A voltage of 1.5 A / dm is applied to the metal mask and electrodes via a power supply device. 2 The current flows through a metal mask made of Invar.

[0155] Photoresist will be attached to the metal mask.

[0156] After removing photoresist residue by applying voltage to a metal mask with photoresist attached, the metal mask with the photoresist residue removed is washed with washing water, and the cleaning agent attached to the metal mask is observed to be washed away by the water.

[0157] The results in Tables 1 and 2 below, based on Experiment 1, were obtained through visual observation using SEM equipment. The results are presented below.

[0158] Residue removal effect

[0159] ○ (Excellent): Photoresist residue removal time is less than 2 minutes.

[0160] △(Normal): Photoresist residue removal time requires more than 2 minutes but less than 10 minutes.

[0161] × (Defect): Photoresist residue removal takes more than 10 minutes.

[0162] Water washing effect

[0163] ○ (Excellent): The area where residual cleaning agent was found was less than 1% of the metal mask area.

[0164] △(Normal): Residual cleaning agent was found in more than 1% but less than 10% of the metal mask area.

[0165] × (Defective): Residual cleaning agent was found in more than 10% of the metal mask area.

[0166] [Table 1]

[0167]

[0168] [Table 2]

[0169]

[0170] Experiment Example 2

[0171] In the example used in Experiment 1, 5 g / L of inhibitor (thiourea) was added. Otherwise, it was the same as in Experiment 1, and the results are shown in Tables 3 and 4 below.

[0172] [Table 3]

[0173]

[0174] [Table 4]

[0175]

[0176] Experimental Example 3

[0177] In the example used in Experimental Example 1, 2-methyl-1-phenyl-2-propanol was used instead of benzyl alcohol. Otherwise, it was the same as in Experimental Example 1, and the results are shown in Tables 5 and 6 below.

[0178] [Table 5]

[0179]

[0180] [Table 6]

[0181]

[0182]

[0183] Experiment Example 4

[0184] In the example used in Experimental Example 1, 4-hydroxybenzyl alcohol was used instead of benzyl alcohol. Otherwise, it was the same as in Experimental Example 1, and the results are shown in Tables 7 and 8 below.

[0185] [Table 7]

[0186]

[0187] [Table 8]

[0188]

[0189]

[0190] Experimental Example 5

[0191] Instead of providing current, the metal mask with photoresist was simply immersed in the cleaning agent used in Example 1. Otherwise, it was the same as in Example 1, and the results are shown in Tables 9 and 10 below.

[0192] [Table 9]

[0193]

[0194] [Table 10]

[0195]

[0196] Experimental Example 6

[0197] Instead of providing an electric current, an ultrasonic wave was provided after immersing a metal mask coated with photoresist in the cleaning agent used in Example 1. Otherwise, it was the same as in Example 1, and the results are shown in Tables 11 and 12 below.

[0198] [Table 11]

[0199]

[0200] [Table 12]

[0201]

[0202] Experimental Example 7

[0203] Instead of providing current, the metal mask with photoresist was immersed in the cleaning agent used in Example 1 and then CDA (clean dry air) was provided. Otherwise, it was the same as in Example 1, and the results are shown in Tables 13 and 14 below.

[0204] [Table 13]

[0205]

[0206] [Table 14]

[0207]

[0208] As confirmed by Examples 1 and 2, the cleaning agent according to one embodiment can remove photoresist very quickly and also has excellent water washability, even without the presence of inhibitors. Furthermore, as confirmed by Examples 3 and 4, even when 2-methyl-1-phenyl-2-propanol is used instead of benzyl alcohol as an aromatic alcohol, it has the same level of effectiveness; however, when 4-hydroxybenzyl alcohol with two hydroxyl groups is used, the residue removal and water washability are halved. Additionally, as confirmed by Examples 5 to 7, the residue removal and etching effects are equivalent regardless of whether any of the following methods are used: simple immersion, ultrasonication, CDA (clean dry air), or electric current.

[0209] This invention can be implemented in various ways and is not limited to the embodiments described above. Those skilled in the art will understand that this invention can be implemented in other specific ways without changing the technical concept or essential features of the invention. Therefore, it should be understood that the above embodiments are exemplary and not intended to limit the invention.

[0210] Explanation of reference numerals in the attached figures

[0211] 10. Conductive components

[0212] 20. Cleaning agent (cleaning solution)

[0213] 100 Electrolytic Cell

[0214] 200 power supply unit

[0215] 300 terminal

[0216] 400 electrode

Claims

1. A non-inhibitor cleaning agent, wherein The inhibitor-free cleaning agent comprises an alkaline salt, a water-soluble organic acid salt, an organic additive, an emulsifier, and an aromatic alcohol having only one hydroxyl group. The concentration ranges of the water-soluble organic acid salts and aromatic alcohols are 1 g / L to 25 g / L and 10 g / L to 100 g / L, respectively. The concentration range of the alkaline salt is from 10 g / L to 200 g / L. The concentration range of the organic additive is from 50 g / L to 500 g / L. The concentration range of the emulsifier is from 50 g / L to 300 g / L. The alkaline salt comprises sodium hydroxide, potassium hydroxide, carbonate, silicate, phosphate, ammonium salt, or a combination thereof, and The organic additives comprise N-methylpyrrolidone, N-ethylpyrrolidone, dimethyl sulfoxide, tetrahydrofurfuryl alcohol, 1,3-dimethyl-2-imidazolinone, amide compounds, C1 to C20 alkanols, C1 to C20 alkanolamines, ethylene glycol ethers, or combinations thereof.

2. The inhibitor-free cleaning agent according to claim 1, wherein, The aromatic alcohol is represented by the following chemical formula 1: [Chemical Formula 1] In the above chemical formula 1, R 1 It is a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, or a substituted or unsubstituted C1 to C20 alkoxy group. n is an integer from 0 to 5. L 1 It can be a substituted or unsubstituted C1 to C20 alkylene group or represented by the following chemical formula L. [Chemical formula L] In the above chemical formula L, L 2 For substituted or unsubstituted C1 to C10 alkylene groups, m is an integer from 1 to 10.

3. The inhibitor-free cleaning agent according to claim 1, wherein, The aromatic alcohols comprise benzyl alcohol, 4-methoxybenzyl alcohol, 4-methylbenzyl alcohol, 2,6-dimethylbenzyl alcohol, 4-ethoxybenzyl alcohol, 4-isopropylbenzyl alcohol, 4-butoxybenzyl alcohol, 2-phenoxyethanol, 2-methyl-1-phenyl-2-propanol, 1-phenyl-1-propanol, or combinations thereof.

4. The inhibitor-free cleaning agent according to claim 1, wherein, The water-soluble organic acid salts include citrate, succinate, acetate, oxalate, glycolate, gluconate, tartrate, or combinations thereof.

5. The inhibitor-free cleaning agent according to claim 1, wherein, The amide compound comprises dimethylacetamide, diethylacetamide, dimethylformamide, diethylformamide, dimethylpropionamide, diethylpropionamide, dimethylacrylamide, diethylacrylamide, or combinations thereof.

6. The inhibitor-free cleaning agent according to claim 1, wherein, The ethylene glycol ethers comprise ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, polyethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol mono-2-ethylhexyl ether, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monoallyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, tripropylene glycol monomethyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, or combinations thereof.

7. The inhibitor-free cleaning agent according to claim 1, wherein, The emulsifier comprises monoethanolamine, triethanolamine, aminoethylethanolamine, glycerol, polyethylene glycol, polypropylene glycol, or combinations thereof.

8. The inhibitor-free cleaning agent according to claim 1, wherein, The inhibitor-free cleaning agent also contains surfactants.

9. The inhibitor-free cleaning agent according to claim 1, wherein, The inhibitor-free cleaning agent also contains water.

10. The inhibitor-free cleaning agent according to claim 1, wherein, The inhibitor-free cleaning agent is used to clean conductive components used in the manufacturing process of organic electroluminescent display devices.

11. The inhibitor-free cleaning agent according to claim 10, wherein, The conductive component comprises a fine metal mask, an open metal mask, or a combination thereof.

12. A cleaning method for removing organic and inorganic substances adhering to conductive components used in the manufacturing process of an organic electroluminescent display device, the method comprising: Steps for preparing conductive components with attached organic and inorganic substances; The step of immersing the conductive component in the cleaning agent according to any one of claims 1 to 11; The step of maintaining the temperature of the cleaning agent between 20°C and 90°C; and The conductive components are cleaned by simple immersion, providing ultrasonic waves, clean dry air, and / or electric current.

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