A kind of air supply device for effectively and quickly drying wafer

Abstract

The application discloses a kind of effective fast drying wafer air supply device, it relates to a kind of effective fast drying wafer air supply device.The effective fast drying wafer air supply device, including support, drying cabinet, blowing pipe, locking mechanism, clamping mechanism and limiting mechanism, the blowing pipe pipeline is arranged and is opened with multiple groups of 45 ° angle wind direction air outlet, the clamping mechanism includes T-shaped support rod, connecting rod, first spring, clamping plate, electric push rod, transmission rod and object table.The effective fast drying wafer air supply device, by 45 ° angle wind direction blowing pipe, can make the wind direction of blowing pipe blow in the same area, and make the center focal point of the area be in wafer center, make wafer fast and effective dry, there is no dead angle and angle leakage phenomenon, by 4 groups of clamping mechanism, when a group of wafer is dried, other 3 groups will be blown simultaneously, to reduce the drying time of next group, finally improve the drying efficiency of whole wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer drying, in particular to an air supply device for effectively and quickly drying wafers. BACKGROUND

[0002] During the manufacturing process of semiconductor chips, wafer cleaning involves multiple process fields. After a certain stage of process is completed, the wafer needs to be cleaned, such as after etching, oxidation, and electroplating processes, wet cleaning is performed to clean the impurities on the surface of the wafer, and the wafer can be transferred to the next process after being cleaned.

[0003] In the wet cleaning equipment, the device for quickly drying the wafer is performed in the drying tank. Generally, high-temperature gaseous isopropyl alcohol (IPA) in the nitrogen heater is used to dry the surface of the wafer in the drying tank. Currently, there are still some problems in the basic performance of the working principle of the drying tank of the wet cleaning equipment.

[0004] 1. The high-temperature nitrogen gas in the nitrogen heater carries the IPA liquid to the drying tank. The existing device uses high-purity stainless steel corrugated pipe + PFA hose connection for transportation.

[0005] 2. PFA hose is used for blowing in the drying tank. However, the drying tank is a sealed tank, and the process temperature in the drying tank needs to be maintained at 110 degrees for a long time. Although the theoretical value of PFA plastic hose can withstand a temperature of 260 degrees or less, it will still deform after long-term use, which will cause uneven gas output and defects in the drying and cleaning of the wafer.

[0006] 3. After long-term operation of the existing drying tank, the wafer cleaning and drying will be uneven. Once this happens, the cleaning machine will alarm and stop cleaning, and manual intervention is required to proceed to the next process. SUMMARY

[0007] (I) Technical problems to be solved

[0008] The present application aims to at least solve one of the technical problems existing in the prior art, and provides an air supply device for effectively and quickly drying wafers, which solves the problems of low efficiency, high nitrogen consumption, and easy deformation of plastic PFA blowing pipe in the drying process of the wafer surface on the market.

[0009] (II) Technical solutions

[0010] The application is to solve the above technical problems by adopting the following technical scheme: an air supply device for effectively and quickly drying wafer, comprising a support, a drying box is fixed on the support, four groups of air blowing pipes are fixed on the inner wall of the drying box, a sliding guide rail is fixed at the bottom of the drying box, a conveying platform is slidably connected to the sliding guide rail, a sealing plate is fixed on one side of the conveying platform, a locking mechanism is fixed on the sealing plate, two corresponding support plates are fixed on the surface of the conveying platform, a rotating shaft is rotatably connected between the two support plates, the rotating shaft is drivenly connected to the motor fixed on the side wall of the support plate, and four groups of clamping mechanisms are fixed on the circumference of the rotating shaft.

[0011] Preferably, the clamping mechanism comprises two groups of T-shaped support rods, two connecting rods are slidably connected in the through slot at the top of the T-shaped support rod, the two connecting rods are connected by a first spring, a clamping plate is fixedly connected to the end of the two connecting rods away from the first spring, an electric push rod is arranged in the T-shaped support rod, two corresponding transmission rods are rotatably connected to the telescopic end of the electric push rod, the ends of the two transmission rods away from the electric push rod are rotatably connected to the two connecting rods respectively, a moving slot is formed on the side of the T-shaped support rod corresponding to the other, a carrier is slidably connected to the moving slot, and a limiting mechanism is arranged in the moving slot.

[0012] Preferably, the limiting mechanism comprises a limiting block and a second spring, the limiting block is slidably connected in the limiting slot formed in the inner wall of the moving slot, one end of the second spring is fixedly connected to the limiting block, and the other end is fixedly connected to the inner wall of the limiting slot, a clamping groove is formed on the contact surface of the carrier and the moving slot, and the clamping groove is matched with the limiting block.

[0013] Preferably, the locking mechanism comprises a locking shell, sliding grooves are formed on the two sides of the locking shell, a sliding block is slidably connected in the sliding groove, an insertion block is fixedly connected to the upper end of the sliding block, and a third spring is arranged in the sliding groove, one end of the third spring is fixedly connected to the sliding block, and the other end is fixedly connected to the sliding groove.

[0014] Preferably, an insertion slot for matching with the insertion block is fixedly connected to the outer wall of the drying box, and a sealing strip is arranged at the connection between the drying box and the sealing plate.

[0015] Preferably, the air blowing pipe is made of quartz, and the four groups of air blowing pipes are arranged in a rectangular shape, a plurality of air outlets are arranged on the pipeline of the air blowing pipe, the air outlets of the air blowing pipe are arranged in a 45° angle wind direction, and the wind direction blows to the same area.

[0016] Preferably, clamping grooves for mounting the wafer are arranged on the carrier and the clamping plate.

[0017] Preferably, a handle is fixedly connected to the sealing plate.

[0018] (III) Beneficial Effects

[0019] In summary, the present application has the following beneficial effects:

[0020] 1. The air supply device for effectively and quickly drying the wafer, by adopting the rectangular arrangement mode to install the blowing pipe and the 45° wind direction angle opened on the pipeline, can make the wind direction of 4 groups of blowing pipes blow in the same area, and make the center focus of the area in the center of the wafer, so that the wafer can be quickly and effectively dried, and there will be no dead angle and missing angle phenomenon, and the working efficiency is improved; and the wafer is blown by the blowing mode, which can quickly dry the water stains on the wafer, and can reduce the use amount of IPA liquid, which is much faster than the previous high-temperature drying in the drying tank, and can truly save energy and cost.

[0021] 2. The air supply device for effectively and quickly drying the wafer, by adopting the quartz tube to replace the PFA hose, which can resist high temperature and solve the problem of metal ion particles, maintain the purity of the input IPA liquid, and improve the cleanliness of the wafer.

[0022] 3. The air supply device for effectively and quickly drying the wafer, by the cooperation of the object table, the T-shaped support rod, the clamping plate, the electric push rod, the connecting rod and the first spring, the wafer can be transported to the clamping mechanism by the object table during the installation of the wafer, and the wafer can be clamped and fixed automatically by the electric push rod and the clamping plate, which replaces the manual clamping work and avoids the pollution to the wafer, improves the cleanliness of the wafer, and at the same time, 4 groups of clamping mechanisms are used for clamping and drying treatment, when the first group of wafers is treated by blowing, the remaining 3 groups of wafers will still be blown, so that the next group of wafers will be dried faster than the previous group, and so on, so as to improve the drying efficiency of the whole 4 groups of wafers. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0024] Figure 1 It is a structural schematic diagram of the present application;

[0025] Figure 2 It is a structural schematic diagram of the whole clamping mechanism of the present application;

[0026] Figure 3 It is a structural schematic diagram of a single clamping mechanism of the present application;

[0027] Figure 4 is a sectional view of a T-shaped support rod of the present application;

[0028] Figure 5 is a sectional view of a limiting mechanism of the present application;

[0029] Figure 6 is a sectional view of a locking mechanism of the present application;

[0030] Figure 7 is a schematic view of the direction of air flow of the air blowing pipe of the present application;

[0031] In the figure: 1 - support, 2 - drying box, 3 - air blowing pipe, 4 - sliding guide rail, 5 - transport platform, 6 - sealing plate, 7 - locking mechanism, 701 - locking shell, 702 - sliding groove, 703 - sliding block, 704 - insertion block, 705 - third spring, 8 - support plate, 9 - rotating shaft, 10 - motor, 11 - clamping mechanism, 111 - T-shaped support rod, 112 - connecting rod, 113 - first spring, 114 - clamping plate, 115 - electric push rod, 116 - transmission rod, 117 - moving groove, 118 - object carrier, 12 - limiting mechanism, 121 - limiting block, 122 - second spring, 123 - clamping groove, 13 - insertion slot. DETAILED DESCRIPTION

[0032] In order to enable a person skilled in the art to better understand the technical solutions of the present application, the present application will be described in detail below in combination with the drawings and specific embodiments.

[0033] In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0034] Please refer to the drawings Figure 1 to the drawings Figure 7The application provides a kind of technical scheme: a kind of effective fast drying wafer air supply device, it includes support 1, support 1 is fixed with drying oven 2, 4 groups of air pipe 3 are fixed on the inner wall of drying oven 2, sliding guide 4 is fixed at the bottom of drying oven 2, sliding guide 4 is slidably connected with transport platform 5, one side of transport platform 5 is fixed with sealing plate 6, locking mechanism 7 is fixed on sealing plate 6, two corresponding support plates 8 are fixed on the surface of transport platform 5, rotating shaft 9 is rotatably connected between two support plates 8, rotating shaft 9 is drivenly connected by motor 10 fixed with the side wall of support plate 8, and 4 groups of clamping mechanisms 11 are fixed on the circumference of rotating shaft 9.

[0035] Further, clamping mechanism 11 includes two T-shaped support rods 111, two connecting rods 112 are slidably connected in the top through slot of two T-shaped support rods 111, two connecting rods 112 are connected by first spring 113, clamping plate 113 is fixedly connected to the end of two connecting rods 112 away from first spring 113, electric push rod 115 is arranged in the inside of two T-shaped support rods 111, two corresponding transmission rods 116 are rotatably connected to the extension end of electric push rod 115, two transmission rods 116 are rotatably connected to two connecting rods 113 at the end away from electric push rod 115, movement slot 117 is formed on the side corresponding to two T-shaped support rods 111, and object table 118 is slidably connected to movement slot 117 (such as Figure 2 all object tables 118 are not shown in the figure).

[0036] It should be noted that electric push rod 115 drives connecting rod 112 to move outward through transmission rod 116, so as to open two clamping plates 114, then object table 118 loaded with wafer is sent into the movement slot 117 of T-shaped support rod 111 by moving mechanism, electric push rod 115 is closed, connecting rod 112 moves inward under the tension of first spring, so as to realize the clamping work of clamping plate 114 on wafer, and self-clamping replaces manual clamping, which avoids pollution to wafer and improves the cleanliness of wafer.

[0037] Further, limit mechanism 12 includes limit block 121 and second spring 122, limit block 121 is slidably connected in the limit slot formed in the inner wall of movement slot 117, one end of second spring 122 is fixedly connected with limit block 121, and the other end is fixedly connected with the inner wall of limit slot, clamping groove 123 is formed on the contact surface of object table 118 and movement slot 117, and clamping groove 123 cooperates with limit block 121.

[0038] It should be noted that when the wafer on the stage 118 is clamped and fixed, the stage 118 is continuously pushed to move downward in the moving groove 117, so that the wafer is separated from the stage 118, and the stage 118 is in contact with the clamping groove 123 and the limiting block 121 on the surface of the moving groove 117, which are mutually clamped to play a fixed role, preventing the stage 118 from interfering with the blowing work of the blowing pipe 3 when the wafer on the clamping plate 114 is being dried.

[0039] Further, the locking mechanism 7 comprises a locking shell 701, sliding grooves 702 are formed on both sides of the locking shell 701, sliding blocks 703 are slidably connected in the sliding grooves 702, plug blocks 704 are fixedly connected to the upper ends of the sliding blocks 703, third springs 705 are arranged in the sliding grooves 702, one end of each third spring 705 is fixedly connected with a sliding block 703, and the other end is fixedly connected with the sliding groove 702.

[0040] Further, the drying box 2 is fixedly connected with plug slots 13 matched with the plug blocks 704, and sealing strips are arranged at the connection between the drying box 2 and the sealing plate 6.

[0041] It should be noted that the sliding block 703 on the moving sliding groove 702 is retracted, and the plug block 704 on the sliding block 703 is retracted. When the wafer is sent into the drying box 2, the sealing plate 6 seals the drying box 2, the sliding block 702 is loosened, the plug block 704 is moved upward under the action of the third spring 705 and inserted into the plug slot 13 on the drying box 2, and the sealing work of the drying box 2 is ensured.

[0042] Further, the blowing pipe 3 is made of quartz, and the four groups of blowing pipes 3 are arranged in a rectangular shape. A plurality of air outlets are arranged on the pipeline of the blowing pipe 3, the air outlets of the blowing pipe 3 are arranged at an angle of 45°, and the air direction is arranged to blow to the same area.

[0043] It should be noted that by arranging the blowing pipe 3 in a rectangular shape and arranging the air direction angle of 45° on the pipeline, the air direction of the four groups of blowing pipes 3 can blow to the same area, and the center focal point of the area is located at the center of the wafer, so that the wafer can be quickly and effectively dried, and there is no dead angle and missing angle phenomenon, and the work efficiency is improved.

[0044] Further, clamping grooves for mounting wafers are arranged on the stage 118 and the clamping plate 114.

[0045] Further, the sealing plate 6 is fixedly connected with a handle.

[0046] Working principle: when in use, the electric push rod 115 is started, and the connecting rod 112 is pushed to move outward through the transmission rod 116, so as to open the two clamping plates 114, then the wafer loading platform 118 loaded with wafers is sent to the moving groove 117 of the T-shaped support rod 111 through the external moving mechanism, the electric push rod 115 is closed, the connecting rod 112 moves inward under the pulling force of the first spring 113, the clamping plate 114 realizes the clamping work on the wafer, then the wafer loading platform 118 continues to move downward in the moving groove 117, so that the wafer is separated from the wafer loading platform 118, and the clamping groove 123 on the contact surface of the wafer loading platform 118 and the limiting block 121 are clamped with each other, the above actions are repeated until four groups of wafers are clamped, then the sliding block 703 on the sliding groove 702 of the locking shell 701 is moved, the plug block 704 on the sliding block 703 is retracted, the wafer is sent into the drying box 2 through the transport platform 5, the sealing plate 6 seals the drying box 2, the sliding block 703 is loosened, the plug block 704 moves upward under the elastic force of the third spring 705 and is inserted into the plug groove 13 on the drying box 2, so that the sealing work of the drying box 2 is ensured, finally the motor 10 is started to rotate the clamping mechanism 11, so that the wafer is rotated to the center focal point of the air blowing pipe 3 for blowing dry treatment, after drying, the motor continues to rotate the clamping mechanism 11, so that the next group of wafers is to the center focal point of the air blowing pipe 3 for blowing dry treatment, the above actions are repeated until four groups of wafers are dried.

[0047] Although the embodiments of the present application have been disclosed as above, it is not limited to the application listed in the specification and the embodiments, and can be fully applied to various fields suitable for the present application, and other modifications can be easily realized by those skilled in the art, therefore, the present application is not limited to specific details and the figures shown and described herein, without departing from the general concept defined by the claims and the equivalent scope.

Claims

1. An air supply device for effectively and rapidly drying a wafer, characterized by: The utility model provides a drying box and the transport platform of its, the drying box and the transport platform are connected through the sealing plate, the sealing plate is fixed on the transport platform one side, and the sealing plate is fixed with the locking mechanism, the locking mechanism includes locking shell, locking shell both sides are equipped with the sliding slot, the sliding slot is equipped with the sliding block in, the sliding block upper end is fixed with the plug -in block, the sliding slot is equipped with the third spring, the third spring one end is fixed with the sliding block, and the other end is fixed with the sliding slot, the drying box is fixed with the plug -in groove for cooperation with the plug -in block, and the drying box and the sealing plate connection place are equipped with sealing strip.

2. The air supply device for effectively and rapidly drying a wafer according to claim 1, wherein: The utility model provides a drying box and the transport platform of its, the drying box and the transport platform are connected through the sealing plate, the sealing plate is fixed on the transport platform one side, and the sealing plate is fixed with the locking mechanism, the locking mechanism includes locking shell, locking shell both sides are equipped with the sliding slot, the sliding slot is equipped with the sliding block in, the sliding block upper end is fixed with the plug -in block, the sliding slot is equipped with the third spring, the third spring one end is fixed with the sliding block, and the other end is fixed with the sliding slot, the drying box is fixed with the plug -in groove for cooperation with the plug -in block, and the drying box and the sealing plate connection place are equipped with sealing strip.

3. The air supply device for effectively and rapidly drying a wafer according to claim 1, wherein: The blowing pipe (3) is made of quartz material, and four groups of blowing pipes (3) are arranged in a rectangular shape, a plurality of air outlet holes are arranged on the blowing pipe (3) pipeline, the blowing pipe (3) air outlet hole is arranged in a 45° angle wind direction, and the wind direction blows to the same area.

4. The air supply device for effectively and rapidly drying a wafer according to claim 1, wherein: A clamping groove for mounting a wafer is arranged on the object table (118) and the clamping plate (114).

5. The air supply device for effectively and rapidly drying a wafer according to claim 1, wherein: The sealing plate (6) is fixedly connected with a handle.

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