一种arm平台下的温度传感器的采样底层驱动方法
By providing a low-level driver method for temperature sensor sampling on the ARM platform, including board initialization and timer configuration, the problem of temperature sensor interface driver is solved, simplifying the driver process and saving development costs and time.
CN117453587BActive Publication Date: 2026-07-17TIANJIN JINHANG COMP TECH RES INST
Patent Information
- Application Number
- CN202311340579.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-17
- Publication Date
- 2026-07-17
- Estimated Expiration
- 2043-10-17
AI Technical Summary
Technical Problem
On the ARM platform, existing technologies struggle to effectively drive temperature sensor interfaces, resulting in high development costs and long development times.
Method used
A low-level driver method for sampling a temperature sensor is provided, including board initialization, initialization and configuration of ordinary timers and capture timers. The capture timer is used to acquire temperature sensor pulses and calculate the real-time temperature, which is then provided to the application.
Benefits of technology
It simplifies the temperature interface driver under the ARM system, saves development costs, shortens development time, and provides a secondary encapsulated interface driver for easy application operation.
✦ Generated by Eureka AI based on patent content.
Abstract
本发明公开了一种arm平台下的温度传感器的采样底层驱动方法，在系统为通用性MCU的GD32系列的应用场景下，针对芯片特点，并结合芯片接口函数设计，设计实现了一种基于板卡接口的底层驱动的方法。本发明为板卡为GD32系列下，首先使用板卡自带的接口函数对板卡进行初始化，然后针对应用层使用场景设计基于温度传感器接口的驱动，为应用程序的开发设计提供温度封装接口，节省开发成本。本发明可以为单板内的应用程序提供二次封装的接口驱动，方便应用程序对接口设备进行操作，节省开发成本，有效缩短开发时间。
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Transformer winding temperature measuring device based on fluorescent fiber technique
CN102636289A
Online upgrading method for application program of DSP board card class
CN111857776A