Display panel and display device

Abstract

This invention provides a display panel and display device, comprising a substrate, an inorganic insulating layer, an organic insulating layer, a light-emitting layer, an encapsulation layer, and a touch layer. The touch layer includes a first insulator layer and a first metal sublayer. The first metal sublayer includes touch traces, and the first insulator layer is disposed between the touch traces and the organic insulating portion of the organic insulating layer. The first insulator layer also includes a second wire-changing hole corresponding to a first wire-changing hole. In this embodiment, after etching the encapsulation layer, the first insulator layer is provided to improve the problem of poor film leveling caused by the large surface roughness of the etched film layer, thereby improving the etching effect and overall performance of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display panel design and manufacturing technology, and more particularly to a display panel and display device. Background Technology

[0002] With the continuous development of display panel manufacturing technology, people have put forward higher requirements for the various performance characteristics of display panels and devices.

[0003] In the process of fabricating a display panel, multiple functional film layers need to be prepared, corresponding to various fabrication processes, such as multiple photomask passes and etching. After each functional film layer is prepared, it needs to be encapsulated, for example, by forming an encapsulation layer to effectively prevent external moisture from entering the panel and causing panel failure. Simultaneously, multiple metal traces, such as multiple touch metal lines, need to be fabricated within the display panel, typically located on the encapsulation layer. In existing technologies, when forming the encapsulation layer, the corresponding position between the display area and the bonding area typically has a large tilt angle. This large tilt angle results in a steep transition of the encapsulation layer in this area. When metal traces are placed on this steep encapsulation layer and etching is performed, the large etching amount leads to a large surface roughness of the etched film layer. Furthermore, etching residue is prone to appear at the tilt angle, resulting in poor film leveling and short circuits between different metal traces. This causes the display panel to malfunction, thereby reducing its reliability and overall performance.

[0004] In summary, in the process of manufacturing a display panel, the encapsulation layer inside the panel usually has a steep tilt angle. If metal traces are set and etched at this tilt angle, metal residue will remain, which will lead to short circuits inside the panel, thereby reducing the reliability and overall performance of the display panel. Summary of the Invention

[0005] This invention provides a display panel and display device to effectively improve the problems of poor etching effect caused by the steep tilt angle of the encapsulation layer inside the panel in the prior art, such as metal etching residue and poor film leveling effect.

[0006] To address the aforementioned technical problems, the present invention provides a display panel, including a display area and a non-display area disposed on one side of the display area, the display panel comprising:

[0007] substrate;

[0008] An inorganic insulating layer is disposed on one side of the substrate, the inorganic insulating layer including a first groove disposed in a non-display area;

[0009] An organic insulating layer is disposed on the side of the inorganic insulating layer away from the substrate. The organic insulating layer includes: a barrier structure disposed between the first groove and the display area; an organic insulating portion disposed on the side of the barrier structure away from the display area; a second groove disposed between the barrier structure and the organic insulating portion; and a first cable replacement hole disposed on the organic insulating portion and located on the side of the first groove near the display area.

[0010] A light-emitting layer is disposed on the side of the organic insulating layer away from the substrate and corresponding to the display area;

[0011] An encapsulation layer is disposed on the side of the light-emitting layer away from the substrate. The encapsulation layer is disposed in the display area and extends to the non-display area. The encapsulation layer covers a portion of the organic insulating portion and does not extend to the first switching hole.

[0012] A touch layer is disposed on the side of the encapsulation layer away from the substrate. The touch layer includes a first insulator layer and a first metal sublayer. The first insulator layer covers a portion of the encapsulation layer and a portion of the organic insulating portion. The first insulator layer includes a second switching hole corresponding to the first switching hole. The first metal sublayer includes touch traces. The touch traces are disposed on the side of the first insulator layer away from the substrate and extend to the second switching hole.

[0013] According to one embodiment of the present invention, the encapsulation layer includes: a first side surface near the first switching hole; the first insulator layer includes: a stepped slope corresponding to the first side surface;

[0014] There is a first included angle between the first side and the substrate located on the first side near the display area;

[0015] The inclined surface of the step has a second included angle with the substrate located on the inclined surface of the step near the display area;

[0016] Wherein, both the first included angle and the second included angle are less than 90 degrees, and the first included angle is greater than the second included angle.

[0017] According to one embodiment of the present invention, the thickness of the first insulator layer on the side of the stepped slope closer to the display area is greater than the thickness of the first insulator layer on the side of the stepped slope farther from the display area.

[0018] According to one embodiment of the present invention, the thickness of the first insulator layer on the side of the stepped slope closer to the display area is greater than the thickness of the first insulator layer on the side of the stepped slope farther from the display area.

[0019] According to one embodiment of the present invention, the second insulator layer comprises an inorganic insulating material, and the first insulator layer comprises an organic insulating material.

[0020] According to one embodiment of the present invention, the touch layer further includes:

[0021] A second metal sublayer is disposed on the side of the second insulator layer away from the substrate, and the second metal sublayer includes: a plurality of touch leads;

[0022] The first insulator layer covers at least a portion of the touch leads. The first insulator layer includes a third wire exchange hole disposed between the stepped slope and the display area. One end of the touch lead extends to the display area and the other end extends to the third wire exchange hole. At least a portion of the touch traces are electrically connected to the corresponding touch leads through the third wire exchange hole.

[0023] According to one embodiment of the present invention, the touch layer further includes:

[0024] A third insulator layer is disposed between the second metal sublayer and the first metal sublayer. The third insulator layer comprises an inorganic insulating material, and the first insulator layer comprises an organic insulating material. The first insulator layer is disposed only in the non-display area and does not overlap with the third insulator layer.

[0025] The first metal sublayer includes: a touch electrode disposed in the display area;

[0026] The third insulator layer includes a plurality of fourth switching holes, and some of the touch electrodes are electrically connected to the corresponding touch leads through the fourth switching holes.

[0027] According to one embodiment of the present invention, the first insulator layer further covers the display area and is disposed between the second metal sublayer and the first metal sublayer, and the first insulator layer further includes: a fifth switching hole disposed near the display area in the third switching hole;

[0028] The first metal sublayer includes: a touch electrode disposed in the display area, and a portion of the touch electrode is electrically connected to the corresponding touch lead through the fifth wire switching hole.

[0029] According to one embodiment of the present invention, the first included angle is set to 75°-90°, and the second included angle is set to 30°-60°.

[0030] According to one embodiment of the present invention, the surface roughness of the organic insulating portion away from the substrate and not covered by the encapsulation layer is greater than the surface roughness of the area covered by the encapsulation layer.

[0031] According to a second aspect of the present invention, a display device is also provided, the display device including the display panel provided in the embodiments of the present application.

[0032] The beneficial effects of the embodiments of the present invention are as follows: Compared with the prior art, the embodiments of the present invention provide a display panel and a display device. The display panel includes a display area and a non-display area, a substrate, an inorganic insulating layer, an organic insulating layer, a light-emitting layer, an encapsulation layer, and a touch layer. The touch layer includes a first insulator layer and a first metal sublayer. The first metal sublayer includes touch traces, and the first insulator layer includes a second wire-changing hole corresponding to a first wire-changing hole. The touch traces are disposed on the side of the first insulator layer away from the substrate and extend to the second wire-changing hole. In the embodiments of this application, after the encapsulation layer is etched, the first insulator layer is provided to improve the large surface roughness of the etched film layer, which leads to poor film layer leveling and etched metal residue, thereby improving the overall performance of the display panel. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic diagram of the planar structure of a display panel provided in the prior art.

[0035] Figure 2 This is a schematic diagram of the film layer structure of the display panel provided in the embodiments of this application.

[0036] Figure 3 The corresponding film layer structure in a certain area of ​​the display panel provided in the embodiments of this application.

[0037] Figures 4-6 This is a schematic diagram of the film layer corresponding to the display panel manufacturing process provided in this application embodiment. Detailed Implementation

[0038] The following description, in conjunction with the accompanying drawings of the embodiments of the present invention, provides different implementation methods or examples to realize different structures of the present invention. To simplify the present invention, the components and arrangements of specific examples are described below. Furthermore, the various specific processes and materials provided in the present invention are examples that those skilled in the art will recognize for the application of other processes. All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0040] With the continuous development of display panel and device manufacturing technology, people have put forward higher requirements for the performance and display effect of display devices.

[0041] Compared to traditional display panels, such as Figure 1 As shown, Figure 1 This is a schematic diagram of the planar structure of a display panel provided in the prior art. After the various functional film layers on the display panel 100 are prepared, each film layer of the display panel 100 needs to be encapsulated. The display panel 100 includes a display area 140 and a non-display area 141. In this embodiment, when setting the aforementioned non-display area, a line-changing area 39 and a bending area 40 are provided in the non-display area. Among them, a plurality of first line-changing holes are provided in the line-changing area 39, and the line-changing area 39 is located on the side close to the display area, and the bending area 40 is located on the side close to the edge of the display panel. At the same time, an encapsulation layer is also provided on the panel. Specifically, the encapsulation layer is at least provided in the display area and extends into the non-display area, such as extending into the bending area within the non-display area. The inner boundary of the encapsulation layer is 143, and the corresponding outer boundary of the encapsulation layer is 142, so that an encapsulation area with a certain width is formed between the inner boundary 143 and the outer boundary 142, thereby effectively encapsulating the panel.

[0042] In the bonding area of ​​the display panel, multiple wire exchange holes 301 are also provided. The metal layer on the encapsulation layer is electrically connected to the array substrate through these wire exchange holes. However, in the prior art, the encapsulation layer needs to be etched. The tilt angle formed by etching the inner and outer boundaries of the encapsulation layer is relatively large, which ultimately leads to a large amount of etching during the etching process, resulting in etched metal residue. Moreover, the surface roughness of the etched film layer is large and the leveling is poor. If the touch layer is further fabricated on the encapsulation layer, due to the above-mentioned problems in the corresponding film layer after etching, it is easy for short circuits to occur between the touch metal layer and other metals in this area, thereby reducing the reliability and overall performance of the display panel.

[0043] This application provides a display panel and a display device to effectively improve the problem that the etching effect in the area is unsatisfactory because the etching angle of the encapsulation layer in the display panel is large and the leveling of the film layer after etching is poor.

[0044] like Figure 2 As shown, Figure 2 This is a schematic diagram of the film layer structure of the display panel provided in an embodiment of this application. In the following embodiments, the corresponding film layer structure is a schematic diagram of a portion of the film layer structure within the encapsulation area. Specifically, the display panel includes a substrate and various functional film layers disposed on the substrate.

[0045] Specifically, in the following embodiments, the substrate is illustrated using a commonly used array substrate as an example.

[0046] Figure 2 This is only a schematic diagram of the film layer structure in a portion of the display panel; specifically... Figure 2 The diagram illustrates a portion of the display panel's display area 140, a line-changing area 39, and a portion of the bending area 40. The display panel includes a substrate 119, an inorganic insulating layer 200, an organic insulating layer 17, a first signal routing layer 404, a barrier structure 63, a second signal routing layer 104, a light-emitting layer 174, a pixel definition layer 175, and an encapsulation layer 20.

[0047] Specifically, when setting the above-mentioned film layers, the substrate 119 is described using a commonly used array substrate 119 as an example. The inorganic insulating layer 200 is disposed on the array substrate 119, and the first signal trace layer 404 is disposed on the organic insulating layer 17. In the following embodiments, when setting the organic insulating layer 17 provided in the embodiments of this application, the organic insulating layer 17 is described using the first planarization layer 171 and the second planarization layer 105 as examples.

[0048] Specifically, the first planarization layer 171 is disposed on the inorganic insulating layer 200, and the first planarization layer 171 covers the first signal trace layer 404. At the same time, the second signal trace layer 104 is disposed on the first planarization layer 171, and the second planarization layer 105 is disposed on the first planarization layer 171 and covers the second signal trace layer 104.

[0049] In this embodiment, the inorganic insulating layer 200, the first planarization layer 171, and the second planarization layer 105 are all disposed within the display area and extend into the non-display area. Furthermore, within the non-display area, the inorganic insulating layer 200 also includes a first groove. Specifically, Figure 2The structure of the first groove is not specifically shown. The first groove is located within the bending area 40 corresponding to the non-display area 141, such as on the side of the bending area 40 away from the display area. By providing the first groove within the bending area 40, a portion of the material in the inorganic insulating layer can be removed, thereby reducing the bending stress required when the panel is bent and improving the panel's bending performance. Simultaneously, the first groove can also be used to bridge different signal lines.

[0050] Simultaneously, when fabricating the first signal routing layer 404 in the non-display area, it can be fabricated in the same layer as the source / drain metal layers in the array substrate within the display area. For example, when fabricating the first source / drain metal layer of the array substrate, this first source / drain metal layer corresponds to the first signal routing layer 404 in the non-display area. Similarly, when fabricating the second source / drain metal layer of the array substrate, this second source / drain metal layer corresponds to the second signal routing layer 104 in the non-display area. Further details are omitted here. Thus, the control signal is controlled and transmitted through the first signal routing layer 404 and the second signal routing layer 104, ensuring the normal operation of the display panel.

[0051] In this embodiment, within the non-display area, the second signal routing layer 104 is primarily disposed within the switching area 39, enabling signal transmission and conversion within this area. Simultaneously, the second signal routing layer 104 is electrically connected to the first signal routing layer 404, such as through via structures to achieve electrical connection between the two different signal routing layers.

[0052] See details Figure 2 When the second planarization layer 105 is provided, the second planarization layer 105 may include a barrier structure 63 provided between the first groove and the display area 140, and an organic insulating portion 1721 provided on the side of the barrier structure 63 away from the display area.

[0053] Furthermore, a second groove 65 is correspondingly provided between the retaining wall structure 63 and the organic insulating part 1721, and a first wire-changing hole K1 is provided on the side of the organic insulating part 1721 away from the second groove 65. In this embodiment, the first wire-changing hole K1 is correspondingly provided in the wire-changing area 39, and the first wire-changing hole K1 penetrates the second planarization layer 105, thereby realizing the electrical connection between different signal lines.

[0054] In this embodiment, the light-emitting layer 174 is disposed within the display area and on the side of the second planarization layer 105 away from the substrate. Simultaneously, a pixel definition layer 175 is also disposed correspondingly with the light-emitting layer 174. In this embodiment, within the area of ​​the second groove 65, the pixel definition layer 175 can also be stacked with the second planarization layer 105 to jointly form the barrier structure 63 in this embodiment.

[0055] Furthermore, the encapsulation layer 20 is disposed on the side of the light-emitting layer 174 away from the substrate, and the encapsulation layer 20 is disposed within the display area and extends into the non-display area. Since a barrier structure 63 is also etched and formed in the non-display area, the multiple raised barrier structures 63 can further increase the contact area between the encapsulation layer 20 and other film layers, thereby improving its encapsulation effect. In this embodiment, the area corresponding to the barrier structure 63 is the effective encapsulation area 38 of the display panel, thereby ensuring the panel's sealing effect.

[0056] In this embodiment, when the encapsulation layer 20 is provided, it at least covers a portion of the organic insulating portion 1721 of the second planarization layer 105, and does not extend to the first transponder hole K1. Simultaneously, the encapsulation layer covers the second groove 65, and within this area, the encapsulation layer 20 directly contacts and seals the surface of the inorganic insulating layer 200 away from the substrate 119. Furthermore, the thickness of the encapsulation layer 20 at the second groove 65 is greater than the thickness of the encapsulation layer 20 at the corresponding organic insulating portion 1721.

[0057] Furthermore, the touch layer of the display panel is disposed on the side of the encapsulation layer 20 away from the substrate 119, and the touch function of the panel is realized through the touch layer. In this embodiment, the touch layer 16 may include a first insulator layer 106, a second insulator layer 203, a first metal sublayer 19, and a second metal sublayer 201. The first metal sublayer 19 may include touch traces 107.

[0058] When setting the above-mentioned film layers, the second insulator layer 203 is disposed on the side of the encapsulation layer away from the substrate, the second metal sublayer 201 is disposed on the second insulator layer 203, and the first insulator layer 106 is disposed on the second insulator layer 203 and covers the second metal sublayer 201. At the same time, the touch trace 107 is disposed on the first insulator layer 106.

[0059] In this embodiment, when the first insulator layer 106 is provided, the first insulator layer 106 also includes a second switching hole K2 corresponding to the first switching hole K1. The second switching hole K2 is located above the first switching hole K1 and is connected to it. Simultaneously, the touch trace 107 extends to the second switching hole K2 and is electrically connected to the second signal trace layer 104 through the first switching hole K1 and the second switching hole K2 to realize the transmission of touch signals.

[0060] In this embodiment, the first insulator layer 106 simultaneously covers a portion of the encapsulation layer 20 and a portion of the organic insulating portion 1721. Because the encapsulation layer 20 is etched with a large amount of material, the surface roughness of the organic insulating portion 1721, which is away from the substrate and not covered by the encapsulation layer 20, is greater than the surface roughness of the area covered by the encapsulation layer 20.

[0061] Specifically, the surface roughness of the area of ​​the organic insulating portion 1721 not covered by the encapsulation layer 20 is 5-11.5, while the surface roughness of the area covered by the encapsulation layer 20 is 1.5-3.5. Optionally, the surface roughness of the area not covered by the encapsulation layer 20 is 6, 8, or 10. This area has a relatively high surface roughness, poor leveling properties, and is not conducive to the deposition of other film layers. It also presents the problem of over-etching and resulting in metal residue. In contrast, the surface roughness of the organic insulating portion 1721 in the area covered by the encapsulation layer 20 is 1.6 or 2. Since this area is not etched, its surface roughness is low, resulting in good flatness.

[0062] Therefore, in this embodiment, by providing the first insulator layer 106, the organic insulating layer in the area not covered by the encapsulation layer 20 can be covered again by the first insulator layer 106. This covers the film layer with a larger roughness and ensures the leveling of subsequent film layers.

[0063] See details Figure 2 In this embodiment of the application, the encapsulation layer 20 also includes a first side surface 188 on the edge away from the display area, such as near the first switching hole K1. In this embodiment of the application, when setting the encapsulation layer 20, the encapsulation layer 20 can also be configured as an organic-inorganic stacked structure. When etching the encapsulation layer formed by the above-mentioned organic-inorganic stack, a flush first side surface 188 can also be etched at the edge, which will not be described in detail here.

[0064] Furthermore, in this embodiment of the application, when the first insulator layer 106 is provided, the first insulator layer 106 includes a stepped inclined surface 191 corresponding to the first side surface 188.

[0065] Meanwhile, when the first side surface 188 and the first insulator layer 106 are configured, the first side surface 188 and the substrate located near the display area 140 of the first side surface 188 have a first included angle α1. This first included angle α1 can be defined as the acute angle formed between the plane corresponding to the first side surface 188 and the plane corresponding to the upper surface of the substrate. Similarly, the stepped inclined surface 191 and the substrate located near the display area of ​​the stepped inclined surface have a second included angle α2.

[0066] In defining the first included angle α1 and the second included angle α2, both are acute angles formed between corresponding planes, meaning that both the first included angle α1 and the second included angle α2 are less than 90°. Furthermore, the first included angle α1 is greater than the second included angle α2.

[0067] Specifically, the first included angle α1 is set to 75°~90°, and the second included angle α2 is set to 30°~60°. Optionally, the first included angle α1 is set to 80°, and the second included angle α2 is set to 50°. Furthermore, in order to reduce the discontinuity of the stepped slope 191, when setting the first included angle α1 and the second included angle α2, the difference between the first included angle α1 and the second included angle α2 can be made less than or equal to 30°, thereby avoiding the first included angle α1 being too large, which would lead to the second included angle α2 being too large and causing the stepped slope 191 to be too steep, which is not conducive to the preparation of other film layers.

[0068] Furthermore, when the first insulator layer 106 is provided, the thickness of the first insulator layer 106 on the side of the stepped slope 191 closer to the display area is greater than the thickness of the first insulator layer 106 on the side of the stepped slope 191 away from the display area.

[0069] Furthermore, the second insulator layer 203 is disposed within the display area and extends into the non-display area, such that the outer boundary of the second insulator layer 203 within the non-display area does not exceed the boundary of the encapsulation layer 20.

[0070] In one embodiment, the outer boundary of the second insulator layer 203 may be flush with the boundary of the encapsulation layer 20 on the side away from the display area. In this case, the second insulator layer 203 and the encapsulation layer 20 may have the same first side surface 188.

[0071] Furthermore, the first insulator layer 106 simultaneously covers a portion of the second insulator layer 203 and a portion of the organic insulating portion 1721.

[0072] In this embodiment of the application, when the first insulator layer 106 and the second insulator layer 203 of the touch layer are provided, the first insulator layer 106 and the second insulator layer 203 can be made of organic or inorganic materials. Optionally, the first insulator layer 106 can be made of an organic insulating material, and the second insulator layer 203 can be made of an inorganic insulating material. By making the first insulator layer 106 an organic insulating material, it has better leveling properties and ensures the flatness of its upper surface.

[0073] See details Figure 2 In this embodiment, the first insulator layer 106 further includes a third switching hole K3, which is located at a corresponding position between the stepped inclined surface 191 and the display area 140. Simultaneously, the second metal sublayer 201 may include multiple touch leads, wherein the first insulator layer 106 covers at least a portion of the touch leads. In this embodiment, one end of each touch lead may extend into the display area, and the other end may extend to the third switching hole K3. Optionally, at least a portion of the touch traces are electrically connected to the corresponding touch leads through the third switching hole K3. In this embodiment, by providing the aforementioned third switching hole K3, the switching of touch traces within different layers is achieved, effectively reducing the area of ​​the touch traces and realizing a narrow-bezel display panel.

[0074] In one embodiment, the first insulator layer 106 may be disposed only in the non-display area. In this case, when the touch layer is configured, it may further include a third insulator layer disposed between the second metal sub-layer 201 and the first metal sub-layer 19. The third insulator layer may be made of an inorganic insulating material, while the first insulator layer may be made of an organic insulating material. Furthermore, the first insulator layer is disposed only in the non-display area and does not overlap with the third insulator layer.

[0075] The third insulator layer also includes multiple fourth switching holes (not shown in the accompanying drawings), such as multiple fourth switching holes corresponding to the third switching hole K3 on the side near the display area. Furthermore, when the third insulator layer is provided, the first metal sublayer also includes touch electrodes disposed within the display area. The third insulator layer and the corresponding touch electrodes are located in... Figure 2 (Not shown in the diagram). During setup and connection, some touch electrodes are first switched to the lower touch lead through the fourth switching hole, then switched to the upper one, and electrically connected to the corresponding touch lead. This allows for the switching of touch signals within different film layers through the aforementioned different switching holes, ensuring the overall performance of the display panel.

[0076] In another embodiment, the first insulator layer may also cover a portion of the display area and be disposed between the second metal sublayer and the first metal sublayer. In this case, the first insulator layer may include a fifth switching hole (not shown in the figures) disposed on the side of the third switching hole K3 near the display area. The first metal sublayer may include touch electrodes disposed within the display area. Referring to the above embodiment, some touch electrodes are also electrically connected to corresponding touch leads through the fifth switching hole. Thus, the switching of touch signals within different film layers is achieved through the aforementioned different switching holes, ensuring the overall performance of the display panel.

[0077] like Figure 3 As shown, Figure 3 This refers to the film layer structure corresponding to a certain area of ​​the display panel provided in this embodiment. Specifically, when setting the touch layer, the touch layer further includes a transition platform 192. The transition platform 192 is connected to the stepped inclined surface 191 and is disposed on the side away from the display area. The transition platform 192 is configured as a horizontal plane and is parallel to the upper surface of the substrate.

[0078] Combination Figure 2 In the structure described in this embodiment, when the stepped inclined surface 191 is provided, the orthographic projection of the first side surface 188 on the substrate partially overlaps with the orthographic projection of the stepped inclined surface 191 on the substrate. Specifically, the projection of the first side surface 188 may be located within the orthographic projection of the stepped inclined surface 191. Furthermore, the inclined surface length of the stepped inclined surface 191 is greater than the length of the first side surface 188. This ensures the inclination of the stepped inclined surface 191 and guarantees its etching effect.

[0079] like Figures 4-6 As shown, Figures 4-6 This is a schematic diagram of the film layers corresponding to the display panel fabrication process provided in this application embodiment. The structures shown in the following diagrams are only the film layer structures corresponding to certain areas of the display panel. For example, the fabrication process of the film layers above the second planarization layer and the encapsulation layer will be used as an example. The fabrication processes of other film layers not shown can be carried out according to conventional fabrication processes, and will not be described in detail here.

[0080] See details Figure 4 As shown, each film layer is deposited sequentially to form an array substrate, which can be fabricated using conventional array substrate fabrication processes. An inorganic insulating layer 200 is then deposited on this substrate. Simultaneously, a second signal routing layer 104 and a first planarization layer 171 are deposited on the inorganic insulating layer 200, and the first planarization layer is patterned and etched. The first planarization layer covers the second signal routing layer 104.

[0081] Furthermore, an encapsulation layer 20 is deposited on the inorganic insulating layer 200. After the above film layers are deposited, an etching process is performed, and the encapsulation layer 20 forms a first side surface 188 on the side away from the display area, and a first line switching hole K1 is formed at the corresponding position in the line switching area 39.

[0082] See details Figure 5 As shown, after etching is completed, a touch layer 16 is deposited on the encapsulation layer. Specifically, a second insulator layer 203 can be deposited first on the encapsulation layer 20, which can be disposed in the display area and extend to the non-display area. Simultaneously, a second metal sublayer 201 is deposited on the second insulator layer 203. After the second metal sublayer 201 is deposited, a first insulator layer 106 is deposited on the second insulator layer 203, covering the second metal sublayer 201. The first insulator layer is then dry-etched to form a second switching hole K2 and a third switching hole K3.

[0083] In this embodiment of the application, during the etching process of the first insulator layer, the first insulator layer includes a stepped inclined surface 191, and the acute angle formed between the stepped inclined surface 191 and the horizontal plane of the substrate is a second included angle α2. The size of the second included angle α2 is set to 30°~60°. This results in a smaller inclination of the stepped inclined surface 191, facilitating the deposition of other film layers and ensuring the performance of the film layers.

[0084] See details Figure 6 As shown, after the first insulator layer 106 is fabricated, a touch trace 107 is then fabricated on the first insulator layer 106. The touch trace 107 is deposited on the first insulator layer 106 and extends to the second switching hole K2. It is electrically connected to the underlying second signal trace layer 104 through the second switching hole K2 and the first switching hole K1, thereby enabling the transmission of touch signals.

[0085] After the touch layer is fabricated, an insulating protective layer 108 is deposited on the touch layer. The insulating protective layer 108 completely covers and protects the touch traces 107 of the touch layer. Finally, the touch display panel provided in the embodiment of this application is formed.

[0086] In this embodiment, the first insulator layer 106 can improve the elevation of the terrain formed after the encapsulation layer is etched, and further reduce its etching angle through the stepped slope, thereby ensuring that the touch trace 107 transitions smoothly on the first insulator layer 106, ensuring the etching effect of each film layer, and preventing the touch layer from breaking.

[0087] Furthermore, this application embodiment also provides a display device, which includes the display panel in this application embodiment, and the encapsulation layer and other film layers in the display panel are all set according to the structure provided in this application embodiment. By setting different insulating layers, the etching tilt angle is reduced, and the etching effect in the display panel manufacturing process is effectively improved, avoiding the problems of large film surface roughness and poor film leveling during the etching process, thereby effectively improving the etching effect and overall performance of the display panel.

[0088] In this embodiment, the flexible display device can also be any product or component with display function or touch operation function, such as a foldable mobile phone, computer, electronic paper, or monitor, and its specific type is not specifically limited.

[0089] In summary, the above description provides a detailed overview of the display panel and display device provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the technical solution and core ideas of the present invention. Although the present invention has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is based on the scope defined by the claims.

Claims

1. A display panel, characterized by, The display panel comprises a display area and a non-display area arranged on one side of the display area, and comprises: a substrate; an inorganic insulating layer arranged on one side of the substrate, the inorganic insulating layer comprising a first groove arranged in the non-display area; an organic insulating layer arranged on one side of the inorganic insulating layer away from the substrate, the organic insulating layer comprising a barrier structure arranged between the first groove and the display area, an organic insulating portion arranged on one side of the barrier structure away from the display area, a second groove arranged between the barrier structure and the organic insulating portion, and a first wire changing hole arranged in the organic insulating portion and located on one side of the first groove close to the display area; a light-emitting layer arranged on one side of the organic insulating layer away from the substrate and corresponding to the display area; an encapsulating layer arranged on one side of the light-emitting layer away from the substrate, the encapsulating layer being arranged in the display area and extending to the non-display area, the encapsulating layer covering part of the organic insulating portion and not extending to the first wire changing hole; a touch layer arranged on one side of the encapsulating layer away from the substrate, the touch layer comprising a first insulating sub-layer and a first metal sub-layer, the first insulating sub-layer simultaneously covering part of the encapsulating layer and part of the organic insulating portion, the first insulating sub-layer comprising a second wire changing hole arranged corresponding to the first wire changing hole, and the first metal sub-layer comprising a touch wire, the touch wire being arranged on one side of the first insulating sub-layer away from the substrate and extending to the second wire changing hole; wherein the encapsulating layer comprises a first side surface on one side close to the first wire changing hole, and the first insulating sub-layer comprises a stepped inclined surface arranged corresponding to the first side surface.

2. The display panel of claim 1, wherein, The first side surface and the substrate located on one side of the first side surface close to the display area form a first included angle; the stepped inclined surface and the substrate located on one side of the stepped inclined surface close to the display area form a second included angle; wherein the first included angle and the second included angle are both less than 90 degrees, and the first included angle is greater than the second included angle.

3. The display panel of claim 2, wherein, The thickness of the first insulating sub-layer on one side of the stepped inclined surface close to the display area is greater than the thickness of the first insulating sub-layer on one side of the stepped inclined surface away from the display area.

4. The display panel of claim 2, wherein, The touch layer further comprises: a second insulating sub-layer arranged on one side of the encapsulating layer away from the substrate, the second insulating sub-layer being arranged in the display area and extending to the non-display area, and the boundary of the second insulating sub-layer in the non-display area not exceeding the boundary of the encapsulating layer; the first insulating sub-layer simultaneously covering part of the second insulating sub-layer and part of the organic insulating portion.

5. The display panel of claim 4, wherein, The second insulating sub-layer comprises an inorganic insulating material, and the first insulating sub-layer comprises an organic insulating material.

6. The display panel of claim 4, wherein, The touch layer further comprises: a second metal sub-layer arranged on one side of the second insulating sub-layer away from the substrate, the second metal sub-layer comprising a plurality of touch leads. The first insulating sub-layer covers at least part of the touch lead lines, the first insulating sub-layer comprises a third wire changing hole arranged between the step slope and the display area, one end of the touch lead line extends to the display area and the other end extends to the third wire changing hole, and at least part of the touch trace is electrically connected to the corresponding touch lead line through the third wire changing hole.

7. The display panel of claim 6, wherein, The touch layer further comprises: The third insulating sub-layer is arranged between the second metal sub-layer and the first metal sub-layer, the third insulating sub-layer comprises inorganic insulating material, the first insulating sub-layer comprises organic insulating material, and the first insulating sub-layer is arranged only in the non-display area and does not overlap with the third insulating sub-layer; The first metal sub-layer comprises touch electrodes arranged in the display area. The third insulating sub-layer comprises a plurality of fourth wire changing holes, and part of the touch electrodes are electrically connected to the corresponding touch lead lines through the fourth wire changing holes.

8. The display panel of claim 6, wherein, The first insulating sub-layer further covers the display area and is arranged between the second metal sub-layer and the first metal sub-layer, and the first insulating sub-layer further comprises a fifth wire changing hole arranged close to the display area at the third wire changing hole. The first metal sub-layer comprises touch electrodes arranged in the display area, and part of the touch electrodes are electrically connected to the corresponding touch lead lines through the fifth wire changing hole.

9. The display panel of claim 2, wherein, The first included angle is arranged to be 75°-90°, and the second included angle is arranged to be 30°-60°.

10. The display panel of claim 1, wherein, The surface roughness of the area not covered by the encapsulation layer is greater than the surface roughness of the area covered by the encapsulation layer.

11. A display device comprising: The display device comprises the display panel according to any one of claims 1-10.

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