A heat dissipation material for electronic packaging and a method for preparing the same

By coating the surface of tourmaline with a tungsten-copper-silver alloy and a graphene oxide layer, and then sintering copper powder under high temperature and pressure, a heat dissipation material with high thermal conductivity for electronic packaging was prepared. This solved the problems of thermal conductivity and cost of existing ceramic substrate materials and enabled a wider range of heat dissipation applications.

CN117464000BActive Publication Date: 2026-06-12HUNAN YUEMO ADVANCED SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUNAN YUEMO ADVANCED SEMICON CO LTD
Filing Date
2023-10-23
Publication Date
2026-06-12

AI Technical Summary

⚠Technical Problem

Existing ceramic substrate materials such as Al2O3 and BeO are insufficient in terms of thermal conductivity, cost, and environmental friendliness, making it difficult to meet the high heat dissipation requirements of modern miniaturized electrical products.

⚗Method used

Using tourmaline as the core material, nano-scale ultrafine powder was obtained by ball milling, and a tungsten-copper-silver alloy and graphene oxide layer were coated on its surface. After mixing with copper powder, the powder was sintered at high temperature and pressure to prepare a heat dissipation material with high thermal conductivity.

🎯Benefits of technology

It improves the thermal conductivity and mechanical properties of heat dissipation materials, effectively shortens the heat transfer path, enhances heat dissipation, and is suitable for SiP packaging, thick mold packaging, and high heat dissipation packaging technologies.

✦ Generated by Eureka AI based on patent content.
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Abstract

The application provides a heat dissipation material for electronic packaging and a preparation method thereof, and belongs to the technical field of heat dissipation materials. After tourmaline is subjected to ball milling and cleaning treatment, the surface of the tourmaline is coated with a layer of tungsten-copper-silver alloy, and a layer of graphene oxide is further deposited on the surface; after reduction by hydrazine hydrate, modified nanoballs are obtained; the modified nanoballs are uniformly mixed with red copper powder, ball milled, cold-pressed, and sintered at high temperature and high pressure to obtain the heat dissipation material for electronic packaging. The application prepares a heat dissipation material for electronic packaging with high heat dissipation and high mechanical properties, and the heat dissipation material has higher thermal conductivity than a traditional heat dissipation substrate, so that heat can be directly dissipated through the substrate in SiP packaging, thick mold packaging and high heat dissipation packaging technology, the heat transfer path is shortened, the heat dissipation effect is enhanced, and the application range is wider.
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