Chip cooling system and control method

Abstract

The present invention relates to the field of chip cooling technology, and in particular to a chip cooling system and control method. A chip cooling system comprises: a package cooling module, the package cooling module comprises a heat exchange cavity, at least one heat generating chip is arranged above the heat exchange cavity, a heat exchange medium and a sharp corner are arranged in the heat exchange cavity, and the sharp corner is arranged corresponding to the chip; a vibration control component, the vibration control component comprises at least one vibration exciter, and the vibration exciter is arranged below the heat exchange cavity. The present invention solves the problem that during the operation of the chip, due to insufficient convective heat exchange capacity in the cooling channel, heat exchange failure is prone to occur in and around the chip, causing "hot spot temperature", affecting chip performance, and in severe cases, causing functional failure, thereby providing a chip cooling system and control method.

Description

Technical Field

[0001] The present invention relates to the technical field of chip cooling, and in particular to a chip cooling system and a control method. Background Art

[0002] Thermal design is critical to chip performance and reliability. As temperature rises, the failure rate of electronic components and equipment increases exponentially. Breakthroughs in high-performance electronic systems increasingly depend on the ability to safely dissipate excess heat. Existing chip heat dissipation is mainly achieved through heat conduction and convection. According to the cooling medium and its flow state, these heat dissipation technologies are divided into natural air convection cooling, forced air convection cooling and single-phase liquid cooling, with corresponding heat dissipation capacities of 0.1 to 1 W / cm 2 , 1~10W / cm 2 and 10~1000W / cm 2 At present, the equivalent heat flux density inside some power chips has exceeded 100W / cm 2 , the air cooling method can no longer meet the thermal design requirements of the chip.

[0003] Microfluidic cooling technology, which is developed around liquid working fluids and microscale characteristics, has become the focus of chip thermal design. The existing microchannel cooling technology has limited heat exchange capacity and cannot control hot spot temperatures. Since the fluid flow in the existing microchannel cooling channels is mostly in a laminar flow state, the fluid velocity near the wall boundary is low, and heat can only be transferred by heat conduction, and the convective heat transfer capacity is limited. When the chip is running at high speed, due to insufficient convective heat transfer capacity in the cooling channel, heat exchange failure is likely to occur in and around the chip, causing "hot spot temperatures", affecting chip performance, and in severe cases, causing functional failure. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that during operation, due to insufficient convective heat transfer capacity in the cooling channel, heat exchange failure may easily occur in and around the chip, causing "hot spot temperature", affecting chip performance and even leading to functional failure in severe cases, thereby providing a chip cooling system and control method.

[0005] In order to solve the above problems, the present invention provides a chip cooling system, comprising:

[0006] A packaged cooling module, the packaged cooling module comprising a heat exchange cavity, at least one heat generating chip is arranged above the heat exchange cavity, a heat exchange medium and a sharp corner are arranged in the heat exchange cavity, and the sharp corner is arranged corresponding to the chip;

[0007] A vibration control component includes at least one vibration exciter, and the vibration exciter is arranged below the heat exchange cavity.

[0008] Optionally, the package cooling module further includes a chip substrate, wherein the chip substrate is disposed between the heat generating chip and the heat exchange cavity, and the heat generating chip is arranged above the chip substrate.

[0009] Optionally, the number of the heating chips is three, and the first heating chip, the second heating chip and the third heating chip are arranged on the chip base. The number of the sharp corners is three, and the sharp corners are arranged on the bottom surface of the heat exchange cavity. The first heating chip corresponds to the first sharp corner, the second heating chip corresponds to the second sharp corner, and the third heating chip corresponds to the third sharp corner.

[0010] Optionally, an insulating heat-conducting substrate is provided between the heat generating chip and the chip base.

[0011] Optionally, the vibration control component also includes a first vibration exciter, a second vibration exciter, a third vibration exciter, a fourth vibration exciter, a fifth vibration exciter and a sixth vibration exciter, the first sharp corner is provided with the first vibration exciter and the second vibration exciter on both sides, the second sharp corner is provided with the third vibration exciter and the fourth vibration exciter on both sides, the third sharp corner is provided with the fifth vibration exciter and the sixth vibration exciter on both sides.

[0012] Optionally, it also includes a branch component, a liquid storage component and a working fluid cooling component.

[0013] Optionally, the branch assembly includes a first outlet flow channel and a second outlet flow channel, the working fluid cooling assembly includes a working fluid cooler, the first outlet flow channel and the second outlet flow channel are respectively arranged on two sides of a corresponding arrangement of a heat exchange cavity, one end of the first outlet flow channel is connected to the heat exchange cavity, the other end of the first outlet flow channel is connected to the working fluid cooler, one end of the second outlet flow channel is connected to the heat exchange cavity, and the other end of the second outlet flow channel is connected to the working fluid cooler.

[0014] Optionally, the liquid storage assembly includes a liquid storage cavity, and the liquid storage cavity is connected to a working fluid cooler pipeline.

[0015] Optionally, the branch assembly further includes a main flow path control valve, a backup pump, and a backup flow path control valve. The backup pump and the backup flow path control valve are connected in series, and the flow path formed by the main flow path control valve is arranged in parallel with the flow path formed by the backup pump and the backup flow path control valve.

[0016] Optionally, one end of the flow path formed by the main flow path control valve is connected to the liquid storage chamber, and the other end is connected to the working fluid reflux channel, and one end of the flow path formed by the backup pump and the backup flow path control valve is connected to the liquid storage chamber, and the other end is connected to the working fluid reflux channel.

[0017] Optionally, the working fluid reflux channel is connected to the heat exchange cavity by branching into a first reflux branch, a second reflux branch, a third reflux branch, a fourth reflux branch, a fifth reflux branch and a sixth reflux branch, wherein the first reflux branch and the second reflux branch are arranged on both sides of the first sharp corner, the third reflux branch and the fourth reflux branch are arranged on both sides of the second sharp corner, and the fifth reflux branch and the sixth reflux branch are arranged on both sides of the third sharp corner.

[0018] Optionally, the vibration control component also includes a signal processor, a signal amplifier and a controller, the signal amplifier is respectively connected to the first vibration exciter, the second vibration exciter, the third vibration exciter, the fourth vibration exciter, the fifth vibration exciter, the sixth vibration exciter and the signal processor circuit, and the controller is respectively connected to the main flow control valve, the backup pump, the backup flow control valve and the signal processor circuit.

[0019] Optionally, the liquid storage chamber pipeline is connected to a one-way valve.

[0020] A control method for a chip cooling system, a vibration exciter drives a sharp corner and a heat exchange medium near the sharp corner to produce an acoustic flow effect, so as to enhance heat exchange at a high temperature load position of a heat generating chip.

[0021] Optionally, when in normal operation, the controller issues an instruction to open the main flow path control valve, close the standby flow path control valve and the standby pump, and the first vibration exciter, the second vibration exciter, the third vibration exciter, the fourth vibration exciter, the fifth vibration exciter and the sixth vibration exciter all operate at the designed frequency;

[0022] When in a multi-point overload state, that is, the controller sends an instruction, the main flow path control valve is closed, the backup flow path control valve and the backup pump are started, and the circulation of the heat exchange medium is completed by relying on the power provided by the backup pump. After the signal processor receives the overload operation status signal of the first heating chip, the second heating chip and the third heating chip, it sends a signal to the signal amplifier and sends instructions to the first vibration exciter, the second vibration exciter, the third vibration exciter, the fourth vibration exciter, the fifth vibration exciter and the sixth vibration exciter to generate different excitation frequencies to meet the independent control of the hot spot temperatures of different heating chips.

[0023] The technical solution of the present invention has the following advantages:

[0024] 1. The chip cooling system provided by the present invention is a packaged cooling module, which includes a heat exchange cavity, at least one heat-generating chip is arranged above the heat exchange cavity, and a heat exchange medium and a sharp corner are arranged in the heat exchange cavity, and the sharp corner is arranged corresponding to the chip; a vibration control component, the vibration control component includes at least one vibration exciter, and the vibration exciter is arranged below the heat exchange cavity. The vibration exciter drives the sharp corner and the heat exchange medium near the sharp corner to produce an acoustic flow effect, so as to enhance the heat exchange at the high-temperature load position of the heat-generating chip. Through the design of the sharp corner, the acoustic flow effect is induced by the vibration exciter, and the effective control of the "hot spot temperature" of the heat-generating chip is achieved through local heat transfer enhancement. The jet impact of the acoustic flow effect causes the flow boundary layer of the heat exchange surface of the heat-generating chip to decrease, and the heat exchange at the high-temperature load position of the heat-generating chip can be enhanced through the position of the sharp corner, effectively preventing the sintering of the heat-generating chip caused by the "hot spot temperature" in the center of the heat-generating chip;

[0025] 2. The chip cooling system provided by the present invention, the packaging cooling module also includes a chip base, the chip base is arranged between the heating chip and the heat exchange cavity, the heating chip is arranged above the chip base, and the heating chip is arranged on the chip base.

[0026] 3. The chip cooling system provided by the present invention has three heating chips, and the first heating chip, the second heating chip and the third heating chip are arranged on the chip substrate. The number of sharp corners is three, and the sharp corners are arranged on the bottom surface of the heat exchange cavity. The first heating chip corresponds to the first sharp corner, the second heating chip corresponds to the second sharp corner, and the third heating chip corresponds to the third sharp corner, thereby realizing a one-to-one correspondence between the heating chips and the sharp corners, so as to effectively control the "hot spot temperature" of the heating chips.

[0027] 4. In the chip cooling system provided by the present invention, an insulating heat-conducting substrate is provided between the heat-generating chip and the chip base to quickly conduct heat.

[0028] 5. The chip cooling system provided by the present invention, the vibration control component also includes a first vibration exciter, a second vibration exciter, a third vibration exciter, a fourth vibration exciter, a fifth vibration exciter and a sixth vibration exciter, the first vibration exciter and the second vibration exciter are respectively provided on both sides of the first sharp corner, the third vibration exciter and the fourth vibration exciter are respectively provided on both sides of the second sharp corner, and the fifth vibration exciter and the sixth vibration exciter are respectively provided on both sides of the third sharp corner, so that vibration exciters are arranged at different sharp corners to realize flow control of heat exchange medium near different heat-generating chips.

[0029] 6. The chip cooling system provided by the present invention, the branch component includes a first outlet flow channel and a second outlet flow channel, the working fluid cooling component includes a working fluid cooler, the first outlet flow channel and the second outlet flow channel are respectively arranged on two sides of the corresponding arrangement of the heat exchange cavity, one end of the first outlet flow channel is connected to the heat exchange cavity, the other end of the first outlet flow channel is connected to the working fluid cooler, one end of the second outlet flow channel is connected to the heat exchange cavity, and the other end of the second outlet flow channel is connected to the working fluid cooler, so that the working fluid cooler is connected to the heat exchange cavity through the first outlet flow channel and the second outlet flow channel.

[0030] 7. The chip cooling system provided by the present invention, the liquid storage component includes a liquid storage cavity, the liquid storage cavity is connected to the working fluid cooler pipeline, and the liquid storage cavity is used to store heat exchange working fluid.

[0031] 8. The chip cooling system provided by the present invention, the branch assembly also includes a main flow path control valve, a backup pump, and a backup flow path control valve. The backup pump and the backup flow path control valve are connected in series, and the flow path formed by the main flow path control valve is arranged in parallel with the flow path formed by the backup pump and the backup flow path control valve. One end of the flow path formed by the main flow path control valve is connected to the liquid storage chamber, and the other end is connected to the working fluid reflux channel. One end of the flow path formed by the backup pump and the backup flow path control valve is connected to the liquid storage chamber, and the other end is connected to the working fluid reflux channel, so as to form different working states.

[0032] 9. In the chip cooling system provided by the present invention, the working fluid reflux channel is connected to the heat exchange cavity by branching into a first reflux branch, a second reflux branch, a third reflux branch, a fourth reflux branch, a fifth reflux branch and a sixth reflux branch, the first reflux branch and the second reflux branch are arranged on both sides of the first sharp corner, the third reflux branch and the fourth reflux branch are arranged on both sides of the second sharp corner, the fifth reflux branch and the sixth reflux branch are arranged on both sides of the third sharp corner, so as to perform precise control according to the heating conditions of different heat-generating chips.

[0033] 10. The chip cooling system provided by the present invention, the vibration control component also includes a signal processor, a signal amplifier and a controller, the signal amplifier is respectively connected to the first vibration exciter, the second vibration exciter, the third vibration exciter, the fourth vibration exciter, the fifth vibration exciter, the sixth vibration exciter and the signal processor circuit, and the controller is respectively connected to the main flow control valve, the backup pump, the backup flow control valve and the signal processor circuit for real-time control.

[0034] 11. In the chip cooling system provided by the present invention, a one-way valve is connected to the liquid storage chamber pipeline to prevent the heat exchange medium in the liquid storage chamber from overflowing. When the pressure of the heat exchange medium inside the system is higher than the maximum bearing pressure of the chip cooling system, the one-way valve implements overpressure protection to prevent the heat exchange medium from overheating and causing the system to fail due to overpressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 A schematic diagram of a chip cooling system provided in an embodiment of the present invention;

[0037] Figure 2 A schematic diagram of a liquid supply flow path under normal operating conditions provided in an embodiment of the present invention;

[0038] Figure 3 Schematic diagram of the liquid supply flow path under a multi-point overload state provided in an embodiment of the present invention.

[0039] Explanation of the reference numerals: 1. package cooling module; 101. heat exchange cavity; 102. chip substrate; 103. insulating heat-conducting substrate; 104. first heat generating chip; 105. second heat generating chip; 106. third heat generating chip; 107. first sharp corner; 108. second sharp corner; 109. third sharp corner; 110. heat exchange medium; 2. branch assembly; 201. first outlet flow channel; 202. second outlet flow channel; 203. standby pump; 204. medium reflux channel; 205. first reflux branch; 206. second reflux branch; 207. third reflux branch; 208. fourth reflux branch; 209. fifth Return branch; 210, sixth return branch; 211, main flow control valve; 212, standby flow control valve; 3, working fluid cooling assembly; 301, working fluid cooler; 302, remote cooling medium; 4, liquid storage assembly; 401, liquid storage chamber; 402, one-way valve; 5, vibration control assembly; 501, signal input interface; 502, signal processor; 503, signal amplifier; 504, controller; 505, first vibration exciter; 506, second vibration exciter; 507, third vibration exciter; 508, fourth vibration exciter; 509, fifth vibration exciter; 510, sixth vibration exciter. DETAILED DESCRIPTION

[0040] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] like Figure 1 A specific implementation of the chip cooling system shown in -3 includes: a packaging cooling module 1 and a vibration control component 5.

[0045] like Figure 1 As shown, the package cooling module 1 includes a heat exchange cavity 101, a chip base 102 and an insulating heat conductive substrate 103 are arranged on the heat exchange cavity 101 in sequence, and a first heat generating chip 104, a second heat generating chip 105 and a third heat generating chip 106 are arranged on the insulating heat conductive substrate 103. Figure 1 As shown, the bottom surface of the heat exchange cavity 101 is provided with a first sharp corner 107, a second sharp corner 108 and a third sharp corner 109, and the first heating chip 104 corresponds to the first sharp corner 107, the second heating chip 105 corresponds to the second sharp corner 108, and the third heating chip 106 corresponds to the third sharp corner 109. Figure 1 As shown, a liquid heat exchange medium 110 flows in the heat exchange cavity 101. Specifically, the heat exchange medium 110 is deionized water. Figure 1 As shown, the shapes of the first sharp corner 107, the second sharp corner 108 and the third sharp corner 109 are not the same.

[0046] like Figure 1As shown, the vibration control component 5 includes a first vibration exciter 505, a second vibration exciter 506, a third vibration exciter 507, a fourth vibration exciter 508, a fifth vibration exciter 509 and a sixth vibration exciter 510, and the six vibration exciters are all arranged below the heat exchange cavity 101. It should be noted that the six vibration exciters are all piezoelectric ultrasonic transducers with a thickness of 1 to 10 μm, a diameter of 500 to 1000 μm, and a vibration frequency of 0.1 MHz to 1.0 MHz. Figure 1 As shown, the first sharp corner 107 is provided with a first vibration exciter 505 and a second vibration exciter 506 on both sides, the second sharp corner 108 is provided with a third vibration exciter 507 and a fourth vibration exciter 508 on both sides, and the third sharp corner 109 is provided with a fifth vibration exciter 509 and a sixth vibration exciter 510 on both sides. Figure 1 As shown, the vibration control component 5 also includes a signal processor 502, a signal amplifier 503 and a controller 504, and the signal amplifier 503 is respectively connected to the first vibration exciter 505, the second vibration exciter 506, the third vibration exciter 507, the fourth vibration exciter 508, the fifth vibration exciter 509, the sixth vibration exciter 510 and the signal processor 502, and the signal processor 502 is provided with a signal input interface 501.

[0047] like Figure 1 As shown, it also includes a branch component 2, a liquid storage component 4 and a working fluid cooling component 3.

[0048] like Figure 1 As shown, the working medium cooling assembly 3 includes a working medium cooler 301 and a remote cooling medium 302 located in the working medium cooler 301. The remote cooling medium 302 cools the heat exchange working medium 110 flowing in the working medium cooler 301 by liquid cooling. Figure 1 As shown, the horizontal height of the working medium cooler 301 is lower than the height of the bottom surface of the heat exchange cavity 101 , so that the heat exchange working medium 110 flows back into the working medium cooler 301 by gravity.

[0049] like Figure 1 As shown, the liquid storage assembly 4 includes a liquid storage chamber 401 and a one-way valve 402 connected to the liquid storage chamber 401 through a pipeline. The liquid storage chamber 401 is connected to the working medium cooler 301 through a pipeline. The heat exchange working medium 110 is stored in the liquid storage chamber 401. Figure 1 As shown, the level of the liquid storage chamber 401 is slightly lower than the working medium cooler 301 , so that the heat exchange working medium 110 can flow back into the liquid storage chamber 401 by gravity.

[0050] like Figure 1As shown, the branch assembly 2 includes a first outlet flow channel 201 and a second outlet flow channel 202, which are respectively arranged on the two sides of the heat exchange cavity 101 correspondingly arranged, one end of the first outlet flow channel 201 is connected to the heat exchange cavity 101, and the other end of the first outlet flow channel 201 is connected to the working fluid cooler 301; one end of the second outlet flow channel 202 is connected to the heat exchange cavity 101, and the other end of the second outlet flow channel 202 is connected to the working fluid cooler 301. Figure 1 As shown, the first sharp corner 107 is inclined toward the first outlet flow channel 201, and the third sharp corner 109 is inclined toward the third outlet flow channel to drive the pumping effect of the heat exchange medium 110 toward the outlet flow channel. Figure 1 , Figure 2 and Figure 3 As shown, the branch assembly 2 also includes a main flow control valve 211, a backup pump 203, a backup flow control valve 212 and a working medium reflux channel 204. The backup pump 203 and the backup flow control valve 212 are connected in series, and the flow path formed by the main flow control valve 211 is arranged in parallel with the flow path formed by the backup pump 203 and the backup flow control valve 212. Specifically, the main flow control valve 211 and the backup flow control valve 212 are piezoelectrically actuated microvalves, and the backup pump 203 is a piezoelectric micropump. Figure 1 As shown, one end of the flow path formed by the main flow path control valve 211 is connected to the liquid storage chamber 401, and the other end is connected to the working fluid reflux channel 204; one end of the flow path formed by the backup pump 203 and the backup flow path control valve 212 is connected to the liquid storage chamber 401, and the other end is connected to the working fluid reflux channel 204.

[0051] like Figure 1 As shown, the working medium reflux channel 204 is connected to the heat exchange cavity 101 by branching into a first reflux branch 205, a second reflux branch 206, a third reflux branch 207, a fourth reflux branch 208, a fifth reflux branch 209 and a sixth reflux branch 210. The first reflux branch 205 and the second reflux branch 206 are arranged on both sides of the first sharp corner 107, the third reflux branch 207 and the fourth reflux branch 208 are arranged on both sides of the second sharp corner 108, and the fifth reflux branch 209 and the sixth reflux branch 210 are arranged on both sides of the third sharp corner 109. Figure 1As shown, the connection between the first return branch 205 and the heat exchange cavity 101 is located between the first sharp corner 107 and the first vibration exciter 505, the connection between the second return branch 206 and the heat exchange cavity 101 is located between the second sharp corner 108 and the second vibration exciter 506, the connection between the third return branch 207 and the heat exchange cavity 101 is located between the third sharp corner 109 and the third vibration exciter 507, the connection between the fourth return branch 208 and the heat exchange cavity 101 is located between the fourth sharp corner and the fourth vibration exciter 508, the connection between the fifth return branch 209 and the heat exchange cavity 101 is located between the fifth sharp corner and the fifth vibration exciter 509, and the connection between the sixth return branch 210 and the heat exchange cavity 101 is located between the sixth sharp corner and the sixth vibration exciter 510. It should be noted that the distance between the first return branch 205 and the second return branch 206 and the first sharp corner 107 is 5 to 10 times the boundary layer thickness, the distance between the third return branch 207 and the fourth return branch 208 and the second sharp corner 108 is 5 to 10 times the boundary layer thickness, and the distance between the fifth return branch 209 and the sixth return branch 210 and the third sharp corner 109 is 5 to 10 times the boundary layer thickness. The boundary layer thickness is calculated as follows: Wherein v and ω are the kinematic viscosity of the heat exchange medium 110 and the vibration angular frequency of the vibration exciter, respectively.

[0052] To realize the control of the main flow control valve, the standby pump 203 and the standby flow control valve 212, as shown in FIG. Figure 1 As shown, the controller 504 is connected to the main flow path control valve 211, the backup pump 203, the backup flow path control valve 212 and the signal processor 502 respectively.

[0053] A control method of a chip cooling system is used to control the above chip cooling system, comprising the following steps:

[0054] 1) A signal is received through the signal input interface 501. After the signal is processed by the signal processor 502, when the chip is in normal operation, that is, the heating chip is operating normally, the controller 504 issues an instruction to open the main flow control valve 211, close the standby flow control valve 212 and the standby pump 203, and the first vibration exciter 505, the second vibration exciter 506, the third vibration exciter 507, the fourth vibration exciter 508, the fifth vibration exciter 509 and the sixth vibration exciter 510 all work at the design frequency to drive the heat exchange medium 110 near the first sharp corner 107, the second sharp corner 108 and the third sharp corner 109 to form an acoustic flow effect, pump the cooling medium into the heat exchange cavity 101, and form a jet impact along the axis direction of the sharp corner to cool the chip substrate 102. After the heat exchange is completed, the heat exchange medium flows out to both sides of the heat exchange cavity 101 through the acoustic flow vortex and fluid pumping action. The entire system relies on the pumping action of the acoustic flow of the sharp corner to complete the circulation of the heat exchange medium 110;

[0055] 2) When in a multi-point overload state, that is, the heating chip is in overload operation, the controller 504 issues an instruction, the main flow path control valve 211 is closed, the backup flow path control valve 212 and the backup pump 203 are started, and the power provided by the backup pump 203 is relied on to complete the circulation of the heat exchange medium 110, thereby improving the system's medium transportation capacity. After the signal processor 502 receives the overload operation state signal of the first heating chip 104, the second heating chip 105 and the third heating chip 106, it sends a signal to the signal amplifier 503, and issues instructions to the first vibration exciter 505, the second vibration exciter 506, the third vibration exciter 507, the fourth vibration exciter 508, the fifth vibration exciter 509 and the sixth vibration exciter 510 to generate different excitation frequencies to meet the independent control of the hot spot temperature of different heating chips and maintain the normal working temperature of each heating chip.

[0056] The chip cooling system provided by the present invention has the following advantages: 1) in view of the spatial distribution characteristics of the heat load of the heat-generating chip, the spatial distribution design of the micro-scale sharp corner characteristics is carried out, so that the acoustic flow direction and acoustic flow intensity generated by vibration induction have spatial distribution characteristics, matching the acoustic flow jet impact formed by the heat exchange medium 110 at the top of the sharp corner, reducing the flow boundary layer thickness of the impact interface, thereby achieving effective control of the "hot spot temperature" through local heat transfer enhancement; 2) under normal operation, with the help of the acoustic flow force of the acoustic flow effect near the sharp corner boundary layer, in the absence of external transport pump work, the system pumping power is directly provided for the heat exchange medium 110, and at the same time, the angle along the sharp corner wall surface can be realized. 1) The flow organization with different degree characteristics can effectively reduce the pump power consumption of the system; 2) According to the heat load characteristics of the heating chip in different working modes, the acoustic flow intensity is controlled by controlling the energy intensity of the vibration exciter, so as to effectively maintain the flow size and flow condition of the heat exchange medium 110 in the flow channel, realize the effective control of the working temperature of the heating interface of the heating chip, thereby reducing the thermal stress of the heating chip package and improving the reliability of the heating chip; 3) Through the power bypass branch of the heat exchange medium 110, the pump of the system flow path is configured / omitted, while reducing the complexity of the cooling system installation and design, the bypass redundancy of the auxiliary working medium flow path is used to further improve the reliability of the chip and system operation.

[0057] As an alternative implementation, the number of the heating chips may be 1, 2, 4 or even more.

[0058] As an alternative implementation, the number of sharp corners can be 1, 2, 4 or even more, and the sharp corners are set in one-to-one correspondence with the number of heating chips, and the sharpness of the angle of the sharp corner is greater, the greater the heating power, the sharper the angle of the sharp corner.

[0059] As an alternative implementation, there may be two sharp corners corresponding to one heating chip, or three sharp corners corresponding to one heating chip; or one sharp corner corresponding to two heating chips.

[0060] As an alternative embodiment, the number of vibration agitators can be 1, 2, 3, 4 or even more.

[0061] As an alternative implementation, the heat exchange medium 110 may also be an ethylene glycol aqueous solution.

[0062] As an alternative implementation, the shapes of the first sharp corner 107 , the second sharp corner 108 , and the third sharp corner 109 may be the same.

[0063] As an alternative implementation, the remote cooling medium 302 may also cool the heat exchange working medium 110 flowing in the working medium cooler 301 by air cooling or phase change cooling.

[0064] Obviously, the above embodiments are merely examples for clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from them are still within the protection scope of the invention.

Claims

1. A chip cooling system, characterized in that: include: A packaged cooling module (1), the packaged cooling module (1) comprising a heat exchange cavity (101), at least one heat generating chip being arranged above the heat exchange cavity (101), a heat exchange medium (110) and a sharp corner being arranged in the heat exchange cavity (101), the sharp corner being arranged on the bottom surface of the heat exchange cavity (101), and the sharp corner being arranged corresponding to the chip; A vibration control component (5), the vibration control component (5) comprising at least one vibration exciter, the vibration exciter being arranged below the heat exchange cavity (101).

2. The chip cooling system according to claim 1, characterized in that: The package cooling module (1) further comprises a chip substrate (102), wherein the chip substrate (102) is arranged between the heat generating chip and the heat exchange cavity (101), and a heat generating chip is arranged above the chip substrate (102).

3. The chip cooling system according to claim 2, characterized in that: The number of the heating chips is three, and the chip substrate (102) is provided with a first heating chip (104), a second heating chip (105) and a third heating chip (106). The number of the sharp corners is three, the first heating chip (104) corresponds to a first sharp corner (107), the second heating chip (105) corresponds to a second sharp corner (108), and the third heating chip (106) corresponds to a third sharp corner (109).

4. The chip cooling system according to claim 2, characterized in that: An insulating heat-conducting substrate (103) is provided between the heat-generating chip and the chip base (102).

5. The chip cooling system according to claim 3, characterized in that: The vibration control component (5) also includes a first vibration exciter (505), a second vibration exciter (506), a third vibration exciter (507), a fourth vibration exciter (508), a fifth vibration exciter (509) and a sixth vibration exciter (510), wherein the first sharp angle (107) is provided with the first vibration exciter (505) and the second vibration exciter (506) on both sides, the second sharp angle (108) is provided with the third vibration exciter (507) and the fourth vibration exciter (508) on both sides, and the third sharp angle (109) is provided with the fifth vibration exciter (509) and the sixth vibration exciter (510) on both sides.

6. The chip cooling system according to any one of claims 1 to 5, characterized in that: It also includes a branch circuit component (2), a liquid storage component (4) and a working fluid cooling component (3).

7. The chip cooling system according to claim 6, characterized in that: The branch flow assembly (2) comprises a first outlet flow channel (201) and a second outlet flow channel (202); the working fluid cooling assembly (3) comprises a working fluid cooler (301); the first outlet flow channel (201) and the second outlet flow channel (202) are respectively arranged on two sides of a heat exchange cavity (101) correspondingly arranged; one end of the first outlet flow channel (201) is connected to the heat exchange cavity (101); the other end of the first outlet flow channel (201) is connected to the working fluid cooler (301); one end of the second outlet flow channel (202) is connected to the heat exchange cavity (101); the other end of the second outlet flow channel (202) is connected to the working fluid cooler (301).

8. The chip cooling system according to claim 7, characterized in that: The liquid storage assembly (4) comprises a liquid storage chamber (401), and the liquid storage chamber (401) is connected to a pipeline of a working fluid cooler (301).

9. The chip cooling system according to claim 8, characterized in that: The branch path component (2) further comprises a main path control valve (211), a backup pump (203), and a backup path control valve (212); the backup pump (203) and the backup path control valve (212) are connected in series, and the flow path formed by the main path control valve (211) is arranged in parallel with the flow path formed by the backup pump (203) and the backup path control valve (212).

10. The chip cooling system according to claim 9, characterized in that: One end of the flow path formed by the main flow path control valve (211) is in communication with the liquid storage chamber (401), and the other end is in communication with the working fluid reflux channel (204); one end of the flow path formed by the standby pump (203) and the standby flow path control valve (212) is in communication with the liquid storage chamber (401), and the other end is in communication with the working fluid reflux channel (204).

11. The chip cooling system according to claim 10, characterized in that: The working medium reflux channel (204) is connected to the heat exchange cavity (101) by being divided into a first reflux branch (205), a second reflux branch (206), a third reflux branch (207), a fourth reflux branch (208), a fifth reflux branch (209) and a sixth reflux branch (210); the first reflux branch (205) and the second reflux branch (206) are arranged on both sides of the first sharp corner (107); the third reflux branch (207) and the fourth reflux branch (208) are arranged on both sides of the second sharp corner (108); and the fifth reflux branch (209) and the sixth reflux branch (210) are arranged on both sides of the third sharp corner (109).

12. The chip cooling system according to claim 11, characterized in that: The vibration control component (5) also includes a signal processor (502), a signal amplifier (503) and a controller (504); the signal amplifier (503) is respectively connected to the first vibration exciter (505), the second vibration exciter (506), the third vibration exciter (507), the fourth vibration exciter (508), the fifth vibration exciter (509), the sixth vibration exciter (510) and the signal processor (502); the controller (504) is respectively connected to the main flow path control valve (211), the standby pump (203), the standby flow path control valve (212) and the signal processor (502).

13. The chip cooling system according to claim 8, characterized in that: The pipeline of the liquid storage chamber (401) is connected to a one-way valve (402).

14. A control method for a chip cooling system, used to control the chip cooling system according to claim 1, characterized in that: The vibration exciter drives the sharp corner and the heat exchange medium (110) near the sharp corner to produce an acoustic flow effect, so as to enhance heat exchange at the high temperature load position of the heat generating chip.

15. The control method of the chip cooling system according to claim 14, characterized in that: When in a normal operating state, the controller (504) issues a command to open the main flow path control valve (211), close the standby flow path control valve (212) and the standby pump (203), and the first vibration exciter (505), the second vibration exciter (506), the third vibration exciter (507), the fourth vibration exciter (508), the fifth vibration exciter (509) and the sixth vibration exciter (510) all operate at the designed frequency; When in a multi-point overload state, that is, the controller (504) issues an instruction, the main flow path control valve (211) is closed, the backup flow path control valve (212) and the backup pump (203) are started, and the circulation of the heat exchange medium (110) is completed by relying on the power provided by the backup pump (203). After the signal processor (502) receives the overload operation state signal of the first heating chip (104), the second heating chip (105) and the third heating chip (106), it sends a signal to the signal amplifier (503) and issues instructions to the first vibration exciter (505), the second vibration exciter (506), the third vibration exciter (507), the fourth vibration exciter (508), the fifth vibration exciter (509) and the sixth vibration exciter (510) to generate different excitation frequencies to meet the independent control of the hot spot temperatures of different heating chips.

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