Method, medium and equipment for improving surface temperature uniformity of Peltier hot and cold stages

Abstract

The present invention discloses a method for improving the surface temperature uniformity of a Peltier hot / cold stage. The method utilizes a method of adding a thermal resistor with high transverse thermal conductivity and low longitudinal thermal conductivity of a suitable material to the surface of the Peltier plate. By setting five temperature measurement points on the Peltier surface, the temperature distribution data of the Peltier surface is obtained through a five-point thermocouple patch measurement method, and the surface temperature uniformity is calculated. Based on the relationship between the thermal resistor thickness and temperature uniformity, the thermal resistor thickness is continuously adjusted to ensure that the temperature uniformity meets the requirements. Increasing the thermal resistor with high transverse thermal conductivity and low longitudinal thermal conductivity can help evenly distribute heat, reduce the occurrence of hot spots and cold spots, and improve the temperature uniformity of the hot / cold stage based on the Peltier effect. The higher the transverse thermal conductivity, the faster the heat can be conducted on the surface, improving the heat conduction efficiency. The thermal resistor with low longitudinal thermal conductivity can reduce the difference between the thermal resistors, making the temperature more uniform.

Description

Technical Field

[0001] The present invention relates to the field of thermoelectric conversion technology, and in particular to a method, a medium and a device for improving the surface temperature uniformity of a Peltier hot and cold stage. Background Art

[0002] Peltier heating and cooling stages are commonly used for thermal testing of electronic components, biomaterials, polymers, and other materials. They provide a stable temperature environment for the test object by heating or cooling it to simulate various operating conditions or ambient temperatures. However, traditional Peltier heating and cooling stages have several issues with temperature control, the most prominent of which is uneven surface temperature.

[0003] Traditional Peltier heating and cooling stages typically use a TEC (Thermoelectric Cooler Module) and a heat sink attached to its top to control temperature. A Peltier chip consists of two alternating conductors of different materials. The flow of current creates a cooling and heating effect on both sides of the chip. During cooling, when current flows through the Peltier chip, one side absorbs heat while the other releases it.

[0004] A TEC (Thermoelectric Cooler Module) is a thermoelectric module based on the Peltier effect that can achieve cooling or heating functions. In a TEC, temperature non-uniformity mainly comes from the following aspects:

[0005] 1. Thermoelectric Material Properties: TECs use semiconductor materials with thermoelectric properties, such as bismuth telluride (Bi2Te3). However, different thermoelectric materials have different temperature characteristics and thermoelectric performance. These differences can cause temperature non-uniformity in different areas of the TEC2.

[0006] 2. Thermoelectric chip layout: In a TEC, multiple thermoelectric chips are stacked in a cross-stack configuration. Due to the design and layout of the thermoelectric chips, heat transfer within the chip can be uneven. This unevenness can lead to uneven temperature distribution in different areas during cooling or heating.

[0007] 3. Insulation material and heat dissipation structure: In TEC, the selection and design of insulation material and heat dissipation structure will also affect the uniformity of temperature distribution. Inappropriate insulation material or heat dissipation structure may lead to uneven heat transfer, which in turn affects the temperature distribution of TEC.

[0008] 4. Control current and voltage: The temperature uniformity of TEC is also affected by the control factors of current and voltage. If the current or voltage is unevenly distributed in different chips of TEC, it will lead to uneven temperature distribution.

[0009] To solve the problem of TEC temperature non-uniformity, the following measures are generally taken:

[0010] Optimize thermoelectric material selection and chip layout, select thermoelectric materials with more uniform performance and design a suitable chip layout; design and select appropriate insulation materials and heat dissipation structures to ensure uniform heat transfer inside the TEC; control the uniform distribution of current and voltage, and ensure the uniform distribution of TEC temperature throughout the module through appropriate current and voltage control strategies.

[0011] However, the above optimization also has some disadvantages and limitations, as follows:

[0012] 1. High cost: TEC optimization requires consideration of multiple aspects, including material selection, design layout, and heat dissipation structure, which can increase manufacturing costs. Especially in high-performance or high-precision applications, where temperature uniformity is a higher requirement, optimization costs can further increase.

[0013] 2. Increased complexity: Optimizing thermoelectric materials, chip layout, insulation materials, and heat dissipation structures increases the complexity of TEC design and manufacturing. More engineering calculations and testing are required to ensure that the optimization solution is implemented correctly and is feasible.

[0014] 3. Generalizability limitations: Optimization solutions may require customization for specific application scenarios, potentially limiting the widespread adoption of TECs. Different applications have different requirements for temperature uniformity, and optimization solutions need to be tailored and implemented based on these specific needs.

[0015] 4. Increased energy consumption: To optimize temperature uniformity, it may be necessary to increase current and voltage control, resulting in increased energy consumption. This may not be ideal for applications that are sensitive to energy consumption or require long-term operation.

[0016] For some key areas, such as electronic equipment testing, medical instruments, and aerospace, these optimizations are still necessary in specific application areas and under high requirements, and these areas are willing to pay higher costs and complexity. However, for ordinary applications, they are more inclined to choose more cost-effective and simplified solutions.

[0017] The existing technology lacks a simple and effective method to solve the problem of uneven temperature distribution on the surface of the Peltier hot and cold stages and improve the test accuracy and reliability. Summary of the Invention

[0018] In response to the above technical problems and needs, the present invention provides a method for improving the surface temperature uniformity of a Peltier heating and cooling stage, comprising the following steps:

[0019] S1. Set five temperature measurement points on the Peltier surface and obtain temperature distribution data of the Peltier surface using a five-point thermocouple patch measurement method, wherein measurement point 0 is set at the center of the Peltier surface, and the remaining four measurement points are evenly distributed on a circle with a radius of r and a center of the Peltier surface;

[0020] S2. Calculate the effective area of ​​the Peltier surface based on the Peltier geometry and operating conditions, and determine the target temperature uniformity. Temperature uniformity is the absolute value of the maximum temperature difference between any temperature point in the working area and the geometric center of the surface temperature source under steady state.

[0021] S3. Based on the effective area of ​​the Peltier surface, add a thermal resistor with a long side a, a short side b, and a thickness c on the Peltier surface, establish a heat conduction model for the thermal resistor, and calculate the longitudinal and transverse thermal resistances of the thermal resistor;

[0022] S4. Obtain temperature distribution data of the Peltier surface after the thermal resistance is increased according to the method of S1, and calculate the temperature uniformity of the Peltier surface after the thermal resistance is increased based on the temperature distribution data of the Peltier surface after the thermal resistance is increased;

[0023] S5. If the power load of the Peltier sheet cannot meet the requirements, return to S3 to select a suitable thermal resistor material; if the power load of the Peltier sheet meets the requirements but the temperature uniformity cannot meet the target temperature uniformity, increase the thermal resistor thickness, and return to S4 to recalculate the temperature uniformity of the Peltier surface after the thermal resistor is increased; if the target temperature uniformity requirements are met, end the calculation.

[0024] Furthermore, the thermal resistance in S3 is selected from a material with a longitudinal thermal conductivity / transverse thermal conductivity ratio of less than 1.

[0025] Furthermore, in S4, the temperature uniformity of the Peltier surface before or after adding the thermal resistance is calculated according to the following formula:

[0026]

[0027] Where ΔTu represents the temperature uniformity of the Peltier surface before or after adding thermal resistance at temperature T. Indicates the average temperature measurement of measuring point i at temperature T, i = 1, 2, 3, 4, Indicates the average temperature measurement at the center measurement point 0 at temperature T.

[0028] Furthermore, in S4, the formulas for calculating the longitudinal thermal resistance and the transverse thermal resistance of the thermal resistance are:

[0029]

[0030]

[0031] Among them, R z is the longitudinal thermal resistance of the thermal resistance, R xy is the lateral thermal resistance of the thermal resistance, L z The length of the longitudinal heat conduction path is c; k z is the longitudinal thermal conductivity of the thermal resistance, A z The cross-sectional area of ​​the longitudinal heat transfer resistance is a×b; L xy is the length of the transverse heat conduction path of thermal resistance, b is the short side of the bottom surface of the thermal resistance; k ky is the transverse thermal conductivity of the thermal resistance, A xy The cross-sectional area of ​​the thermal resistance for transverse heat transfer is A×c;

[0032] The ratio of the transverse thermal resistance to the longitudinal thermal resistance is:

[0033]

[0034] The relationship between the new temperature uniformity of the Peltier hot / cold stage surface after adding the thermal resistance and the thickness of the thermal resistance and the temperature uniformity of the Peltier hot / cold stage surface before adding the thermal resistance is fitted by the following formula:

[0035] ΔT u-new =a n c n +a n-1 c n +...a1c+ΔT u0

[0036] Where ΔT u-new The new temperature uniformity of the Peltier hot and cold stage surface after increasing the thermal resistance, a1-a n is the coefficient, c is the thermal resistance thickness, ΔT u0 To increase the thermal resistance, the temperature uniformity of the Peltier hot and cold stage surface is improved.

[0037] Furthermore, the ratio of the transverse thermal resistance to the longitudinal thermal resistance of the thermal resistor after increasing the thermal resistor thickness is α new ,

[0038]

[0039] Where, ΔT u-new To increase the thermal resistance thickness, the new temperature uniformity of the Peltier hot and cold stage surface, ΔT u-ref It represents the reference temperature uniformity of the Peltier hot and cold stage surface after adding the reference thickness thermal resistance. It represents a function that describes the effect of the relationship between the new temperature uniformity and the reference temperature uniformity on the ratio of the transverse thermal resistance to the longitudinal thermal resistance of the thermal resistor.

[0040] The present invention also provides a storage medium storing a computer program, which, when executed by a processor, implements the steps of the above-mentioned method for improving the surface temperature uniformity of a Peltier heating and cooling stage.

[0041] The present invention also proposes an electronic device, comprising a processor and a memory, wherein the processor and the memory are interconnected, wherein the memory is used to store a computer program, the computer program including computer-readable instructions, and the processor is configured to call the computer-readable instructions to execute a method for improving the surface temperature uniformity of a Peltier hot and cold stage.

[0042] The beneficial effects brought about by the technical solution provided by the present invention are:

[0043] The present invention proposes a method of inserting thermal resistors to provide an improvement solution for the temperature uniformity of the current Peltier-based hot and cold stages. By calculating the optimal material and thickness, the device can achieve optimal temperature uniformity under hardware limitations. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a flow chart of a method for improving the surface temperature uniformity of a Peltier hot and cold stage according to the present invention;

[0045] Figure 2 Schematic diagram of the distribution of Peltier surface temperature measurement points according to an embodiment of the present invention;

[0046] Figure 3 This is a structural diagram of a Peltier heating and cooling stage according to an embodiment of the present invention. In the figure, 1-copper plate, 2-thermal resistor; 3-Peltier, 4-water cooling plate, 5-base;

[0047] Figure 4 is the surface temperature uniformity of the Peltier hot and cold stage at -35°C in the embodiment of the present invention before and after the treatment of the present invention, where Figure 4 (a) is the surface temperature uniformity of the Peltier hot and cold stage at -35°C before being treated by the present invention, where Figure 4 (b) shows the surface temperature uniformity of the Peltier hot and cold stage at -35°C after being treated by the present invention;

[0048] Figure 5 It is a block diagram of an electronic device in an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0049] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0050] The flow chart of the method for improving the surface temperature uniformity of the Peltier hot and cold stage in this embodiment is as follows: Figure 1 , specifically including the following steps:

[0051] S1. Set five temperature measurement points on the Peltier surface to obtain temperature distribution data of the Peltier surface, wherein measurement point 0 is set at the center of the Peltier surface, and the remaining four measurement points are evenly distributed on a circle with a radius of r and a center of the Peltier surface.

[0052] Figure 2 This is a schematic diagram of the Peltier surface temperature measurement point distribution in an embodiment of the present invention. In this embodiment of the present invention, the TEC sheet is a square with a side length of l, and the measurement point 0 is located at the center of the TEC sheet. The remaining four measurement points are evenly distributed on the circumference of a circle with a radius of r and a center of the measurement point 0. Generally, the measurement points are selected according to the needs.

[0053] Figure 3 This is a diagram of the structure of a Peltier heating and cooling stage according to an embodiment of the present invention, comprising a copper plate 1, a thermal resistor 2, a Peltier 3, a water-cooled plate 4, and a base 5. The bottom surface of the thermal resistor completely covers the effective surface area of ​​the Peltier, which is the area actually used by the Peltier.

[0054] S2. Calculate the effective area of ​​the Peltier surface based on the Peltier geometry and usage conditions, and determine the target temperature uniformity. The effective area of ​​the Peltier surface is the area of ​​the Peltier surface actually used.

[0055] S3. Based on the effective area of ​​the Peltier surface, add a thermal resistor with a long side a, a short side b, and a thickness c to the surface of the Peltier. The bottom surface of the thermal resistor is equal to the effective area of ​​the Peltier surface. The bottom surface of the thermal resistor needs to completely cover the effective surface of the Peltier surface. The thermal resistor should be made of a material with a longitudinal thermal conductivity / transverse thermal conductivity less than 1. Establish a thermal conduction model for the thermal resistor and calculate the longitudinal thermal resistance and transverse thermal resistance of the thermal resistor.

[0056] Select a suitable thermal resistor material whose chemical and physical properties are relatively stable within the temperature range. Obtain the transverse thermal conductivity of the thermal resistor from relevant literature, material suppliers, or experimental results. Select a material with a longitudinal thermal conductivity / transverse thermal conductivity ratio of less than 1.

[0057] Generally speaking, the longitudinal thermal conductivity of polymer sheets is usually higher because the molecules are more densely packed in the longitudinal direction, allowing heat to be transferred more easily along this direction. However, there are some special cases where the transverse thermal conductivity of the sheet is higher than the longitudinal thermal conductivity.

[0058] Thin sheets of fiber-reinforced composite materials, such as carbon fiber composites, exhibit a higher transverse thermal conductivity than a longitudinal thermal conductivity. This is because the fibers are more densely packed in the transverse direction, while there are larger interfiber gaps in the longitudinal direction, which limits longitudinal heat conduction.

[0059] In addition, some thin sheets with special structures, such as ordered nanomaterial sheets, may also exhibit greater transverse thermal conductivity than longitudinal thermal conductivity. This is because these thin sheets have better crystallinity or interface coupling in the transverse direction, making heat transfer easier in the transverse direction.

[0060] It's important to note that this characteristic of greater transverse thermal conductivity than longitudinal thermal conductivity isn't universal; it's a result of specific materials, structures, or processing methods. Heat transfer properties vary depending on the material and conditions. Therefore, the most reliable method for accurate information in specific applications is to conduct experimental measurements or consult existing thermal conductivity data.

[0061] S4. Obtain temperature distribution data of the Peltier surface after adding thermal resistance according to the method of S1, and calculate the temperature uniformity of the Peltier surface after adding thermal resistance based on the temperature distribution data of the Peltier surface after adding thermal resistance.

[0062] The temperature uniformity formula of the Peltier surface after adding thermal resistance is calculated based on the temperature distribution data of the Peltier surface before or after adding thermal resistance as follows:

[0063]

[0064] Where ΔTu represents the temperature uniformity of the Peltier before or after adding thermal resistance at temperature T. Indicates the average temperature measurement of measuring point i at temperature T, i = 1, 2, 3, 4, Indicates the average temperature measurement at the center measurement point 0 at temperature T.

[0065] Equivalently place the heat source at the center of the bottom of the cuboid and use the transverse thermal resistance and longitudinal thermal resistance to further express the thermal resistance of the material. The longitudinal conduction distance is the thickness c, and the transverse conduction distance is

[0066] The formula for calculating the longitudinal thermal resistance and the transverse thermal resistance is:

[0067]

[0068]

[0069] Among them, R z is the longitudinal thermal resistance of the thermal resistance, R xyis the lateral thermal resistance of the thermal resistance, L z The length of the longitudinal heat conduction path is c; k z is the longitudinal thermal conductivity of the thermal resistance, A z The cross-sectional area of ​​the longitudinal heat transfer resistance is a×b; L xy is the length of the transverse heat conduction path of thermal resistance, b is the short side of the bottom surface of the thermal resistance; k xy is the transverse thermal conductivity of the thermal resistance, A xy The cross-sectional area of ​​the thermal resistance for lateral heat transfer is a×c.

[0070] The ratio of the transverse thermal resistance to the longitudinal thermal resistance is:

[0071]

[0072] When the material of the thermal resistor is determined and the bottom surface is confirmed, the smaller α is, the more favorable it is for achieving uniform temperature. Based on previous experience or initial estimation, an initial thickness of the thermal resistor material is first set.

[0073] The relationship between the new temperature uniformity of the Peltier hot / cold stage surface after adding the thermal resistance and the thickness of the thermal resistance and the temperature uniformity of the Peltier hot / cold stage surface before adding the thermal resistance is fitted by the following formula:

[0074] ΔT u-new =a n c n +a n-1 c n +...a1c+ΔT u0

[0075] Where ΔT u-new The new temperature uniformity of the Peltier hot and cold stage surface after increasing the thermal resistance, a1-a n is the coefficient, c is the thermal resistance thickness, ΔT u0 To increase the thermal resistance, the temperature uniformity of the Peltier hot and cold stage surface is improved.

[0076] In this embodiment, at -35°C, without heating resistor, the surface temperature uniformity of the Peltier hot / cold stage is measured to be: ΔTu = 6.8°C;

[0077] At -35℃, the thermal resistance of the rubber material was increased by 0.4mm, and the surface temperature uniformity of the Peltier hot and cold table was measured to be 2.2℃.

[0078] Under -35℃ condition, the thermal resistance of the rubber material is increased by 0.5mm, and the surface temperature uniformity of the Peltier hot and cold table is measured to be 1.5℃.

[0079] At -35℃, the thermal resistance of the rubber material was increased by 0.6mm, and the surface temperature uniformity of the Peltier hot and cold table was measured to be 0.88℃.

[0080] At -35℃, the thermal resistance of the rubber material was increased by 0.7mm, and the surface temperature uniformity of the Peltier hot and cold table was measured to be 0.46℃.

[0081] At -35℃, the thermal resistance of the rubber material was increased by 0.8mm, and the surface temperature uniformity of the Peltier hot and cold table was measured to be 0.2℃.

[0082] At -35℃, the thermal resistance of the rubber material with a thickness of 0.9mm was increased, and the surface temperature uniformity of the Peltier hot and cold table was measured to be 0.12℃.

[0083] Under -35℃ condition, the thermal resistance of the rubber material was increased by 1mm, and the surface temperature uniformity of the Peltier hot and cold table was measured to be 0.2℃.

[0084] The above measured data are fitted, with the thermal resistance thickness as the variable c and the Peltier hot and cold stage surface temperature uniformity as the variable ΔT u-new , we get a fitting equation: ΔT u-new =8.1667c 2 Under the conditions of -14.767c+6.8 and -35℃, the thermal resistance is increased by 0.9mm, and the surface temperature uniformity of the Peltier hot and cold stage is optimal.

[0085] S5. If the power load of the Peltier sheet cannot meet the requirements, return to S3 to select a suitable thermal resistance material; if the power load of the Peltier sheet meets the requirements but the temperature uniformity cannot meet the target temperature uniformity, increase the thermal resistance thickness, and return to S4 to recalculate the temperature uniformity of the Peltier surface after the thermal resistance is increased.

[0086] The ratio of the transverse thermal resistance to the longitudinal thermal resistance of the thermal resistor after increasing the thermal resistor thickness is α new ,

[0087]

[0088] Where, ΔT u-new To increase the new temperature uniformity after the thermal resistance thickness is increased, It represents a function that describes the effect of the relationship between the new temperature uniformity and the reference temperature uniformity on the ratio of the transverse thermal resistance to the longitudinal thermal resistance of the thermal resistor.

[0089] Verify the effectiveness of the calculated final thermal resistance thickness using experimental data or numerical simulations. Repeat the measurement steps in steps 1 and 2 to assess whether the target temperature uniformity meets the requirements. If so, terminate the calculation. If not, continue the iterative calculation.

[0090] Effect after implementation

[0091] Through the above method, in view of the fact that the temperature non-uniformity of the Peltier hot and cold stage is greater than 5°C in the range of -35 to 15°C and 60 to 130°C, a more suitable rubber material is selected as the thermal resistance material. Its transverse thermal conductivity is generally 0.08W / (m·K) and its longitudinal thermal conductivity is generally 0.04W / (m·K). The TEC piece is square with a surface area of ​​0.0016m 2 , the optimal thickness of thermal resistance was determined to be 0.7 mm, and a good uniform temperature was achieved in the surface temperature range of -35 to 130 °C on the Peltier hot and cold stage, with a temperature uniformity of less than 0.8 °C.

[0092] Results Reference Figure 4 and Table 1, Figure 4 The surface temperature uniformity of the Peltier hot and cold stage at -35°C is shown in Table 1. The test results and surface temperature uniformity of the five measuring points of the Peltier hot and cold stage after adding the optimal thickness thermal resistance at temperatures of -35°C, -15°C, 0°C, 30°C, 80°C, and 130°C are shown in Table 1.

[0093] Table 1

[0094] Temperature (℃) -35.00 -15.00 0.00 30.00 80.00 130.00 Measuring point 1 -34.88 -14.93 0.06 29.99 79.80 129.75 Measuring point 2 -34.89 -14.90 0.06 30.01 79.82 129.71 Measuring point 3 -35 -14.99 0.01 30.00 79.75 129.71 Measuring point 4 -35 -14.95 0.02 29.99 79.73 129.50 Measuring point 0 -35.08 -15.04 -0.03 30.00 79.98 130.02 Temperature uniformity (℃) 0.2 0.14 0.09 0.01 0.25 0.52

[0095] By using the method of the embodiment of the present invention, it is possible to:

[0096] 1. Improve Peltier temperature uniformity: Increasing the thermal resistance with higher lateral thermal conductivity and lower longitudinal thermal conductivity can help evenly distribute heat, reduce the occurrence of hot and cold spots, and thus improve the temperature uniformity of the hot and cold stages based on the Peltier effect.

[0097] 2. Improve heat conduction efficiency: Due to the higher lateral thermal conductivity, heat can be conducted faster on the surface, thereby improving heat conduction efficiency.

[0098] 3. Reduce the difference in thermal resistance: The thermal resistance with lower longitudinal thermal conductivity can reduce the difference between thermal resistances and make the temperature more uniform.

[0099] In an exemplary embodiment, a storage medium is further included. The storage medium stores a computer program. When the computer program is executed by a processor, the steps of the method for improving the surface temperature uniformity of the Peltier heating and cooling stage are implemented.

[0100] See also Figure 5 In an exemplary embodiment, an electronic device 700 is further included, including at least one processor 701 , at least one memory 702 , and at least one communication bus 703 .

[0101] The memory 702 stores a computer program including computer-readable instructions. The processor 701 calls the computer-readable instructions stored in the memory 702 via the communication bus 703 to execute the method for improving the surface temperature uniformity of the Peltier heating and cooling stage.

[0102] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for improving the surface temperature uniformity of a Peltier hot and cold stage, characterized in that: The following steps are involved: S1. Set 5 temperature measurement points on the Peltier surface to obtain the temperature distribution data of the Peltier surface, wherein the measurement point 0 is set at the center of the Peltier surface, and the other 4 measurement points are evenly distributed in a circle with a radius of 0 and a center of the Peltier surface. r On the circumference of S2. Calculate the effective area of ​​the Peltier surface based on the Peltier geometry and usage conditions, and determine the target temperature uniformity; S3. According to the effective area of ​​the Peltier surface, add a long side to the Peltier surface. a , the short side is b , thickness is c Thermal resistance, establish the thermal conduction model of thermal resistance, calculate the longitudinal thermal resistance and transverse thermal resistance of thermal resistance, and select the material with longitudinal thermal conductivity / transverse thermal conductivity <1 as the thermal resistance material; S4. Obtain temperature distribution data of the Peltier surface after the thermal resistance is increased according to the method of S1, and calculate the temperature uniformity of the Peltier surface after the thermal resistance is increased based on the temperature distribution data of the Peltier surface after the thermal resistance is increased; S5. If the power load of the Peltier does not meet the requirements, return to S3 to select a suitable thermal resistor material. If the power load of the Peltier meets the requirements but the temperature uniformity does not meet the target temperature uniformity, increase the thickness of the thermal resistor and return to S4 to recalculate the temperature uniformity of the Peltier surface after the thermal resistor is increased. If the target temperature uniformity requirements are met, end the calculation.

2. The method for improving the surface temperature uniformity of a Peltier heating and cooling stage according to claim 1, characterized in that: The temperature uniformity of the Peltier surface before or after adding thermal resistance is calculated according to the following formula: Where, Indicates temperature T Temperature uniformity of the Peltier before or after adding thermal resistance, Indicates temperature T Lower measuring point i The average temperature measurement, i =1,2,3,4, Indicates temperature T Average value of the temperature measurement at the lower center measuring point 0.

3. The method for improving the surface temperature uniformity of a Peltier heating and cooling stage according to claim 2, characterized in that: In S3, the formulas for calculating the longitudinal thermal resistance and the transverse thermal resistance are: in, is the longitudinal thermal resistance of the thermal resistance, is the lateral thermal resistance of the thermal resistance, is the length of the longitudinal heat conduction path of thermal resistance, c ; is the longitudinal thermal conductivity of the thermal resistance, is the cross-sectional area of ​​the longitudinal heat transfer resistance, ; is the length of the transverse heat conduction path of thermal resistance, , b is the short side of the bottom surface of the thermal resistance; is the transverse thermal conductivity of the thermal resistance, is the cross-sectional area of ​​the thermal resistance lateral heat transfer, .

4. A storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 3 are implemented.

5. An electronic device, characterized in that: The method comprises a processor and a memory, wherein the processor and the memory are interconnected, wherein the memory is used to store a computer program, the computer program includes computer-readable instructions, and the processor is configured to call the computer-readable instructions to execute the method according to any one of claims 1 to 3.

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