A method for improving reliability of a COB packaged high-speed optical transmitting device

Abstract

The application provides a method for improving the reliability of a COB packaged high-speed optical transmitting device, comprising the following steps: S1, determining the three-axis relative positions of each component through optical simulation, and processing the non-airtight shell; S2, inserting the ferrule adapter into the non-airtight shell and then performing laser welding; S3, assembling the ferrule adapter shell integrated piece with a PCBA circuit board; S4, sequentially pasting each component; S5, connecting each component with the PCBA circuit board; S6, bonding the converging lens into the metal frame through structural glue; S7, coupling the converging lens integrated piece; S8, coupling the collimating lens; and S9, bonding the non-airtight shell with the cover plate. The application can greatly reduce the failure probability of the COB packaged high-speed optical transmitting device caused by the change of the optical center, and effectively improve the stability and reliability of the device.

Description

Technical Field

[0001] This invention relates to a method for packaging high-speed optical emitting devices, and more particularly to a method for improving the reliability of COB-packaged high-speed optical emitting devices. Background Technology

[0002] Due to its superior overall advantages, the optical communication industry now widely uses COB (Chip on Board) packaging technology in the design and manufacturing of optical transceiver modules, specifically for high-speed optical transmitters. Compared to traditional TO-CAN (Transistor Outline-CAN) packaging, COB-packaged high-speed optical transmitters offer greater component layout space, facilitating the use of array chips in high-speed communications. Furthermore, compared to BOX (a type of butterfly packaging) packaging, it saves on the high cost of the BOX casing, resulting in a significant cost advantage.

[0003] However, COB-packaged high-speed optical emitters, due to their non-hermetic packaging, still have some disadvantages, such as poor reliability and poor heat dissipation. The most prominent issue is poor reliability. In the atmosphere, moisture can easily damage internal chips such as laser diodes and photodiodes. Furthermore, moisture is easily absorbed by the adhesive, causing expansion and altering the optical center of optical components including lenses, multiplexers, and demultiplexers, ultimately leading to the failure of the COB-packaged high-speed optical emitter. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a method for improving the reliability of COB packaged high-speed optical emitting devices, aiming to reduce the probability of changes in the optical center of optical components in COB packaged high-speed optical emitting devices, and improve the stability and reliability of the products.

[0005] To address this issue, the present invention provides a method for improving the reliability of COB-packaged high-speed optical emitting devices, comprising the following steps:

[0006] Step S1: Determine the triaxial relative positions of the laser diode chip, collimating lens, optical multiplexer, converging lens, and ferrule adapter in the non-airtight housing through optical simulation, and design the corresponding mounting structure in the non-airtight housing based on the triaxial relative positions, and process the non-airtight housing accordingly.

[0007] Step S2: Insert the ferrule adapter into the opening of the non-airtight housing, and use a laser welding device to make laser weld points at the gap where the ferrule adapter and the non-airtight housing contact each other, and use the laser weld points to melt and weld the ferrule adapter and the non-airtight housing to obtain a ferrule adapter housing integral part;

[0008] Step S3: Assemble the ferrule adapter housing unit with the PCBA circuit board, fill the connection gap between the ferrule adapter housing unit and the PCBA circuit board with structural adhesive, and bake and cure it at a first preset temperature for a first preset time.

[0009] Step S4: In the integrated ferrule adapter housing, the semiconductor thermoelectric cooler, collimating lens carrier, laser diode chip, thermistor and optical multiplexer are sequentially attached to the non-airtight housing. After attaching each component, they are baked and cured at a second preset temperature for a second preset time.

[0010] Step S5: Electrically connect each component and PCBA circuit board;

[0011] Step S6: The converging lens is bonded to the metal frame with structural adhesive and then baked and cured at a third preset temperature for a third preset time to obtain an integral converging lens.

[0012] Step S7: Couple the converging lens assembly using a coupling device;

[0013] Step S8: Use a coupling device to couple the four collimating lenses until the optical power received by the ferrule adapter is within a preset range. Use UV-curing adhesive to bond the collimating lens to the collimating lens carrier plate and cure it by UV irradiation.

[0014] Step S9: Use structural adhesive to bond the non-airtight shell to the cover plate, and bake and cure it at a fourth preset temperature for a fourth preset time.

[0015] A further improvement of the present invention is that, in step S1, a corresponding first groove is designed in the non-airtight housing according to the triaxial relative positions of the laser diode chip and the collimating lens. The collimating lens is disposed in the first groove through a collimating lens carrier and a semiconductor thermoelectric cooler. The laser diode chip is disposed on the collimating lens carrier through a diode chip carrier, and the position of the laser diode chip corresponds to the position of the collimating lens.

[0016] A further improvement of the present invention is that, in step S1, a corresponding boss is designed in the non-airtight housing according to the triaxial relative position of the optical multiplexer. The multiplexer is disposed on the side of the collimating lens away from the laser diode chip through the boss, and the position of the multiplexer corresponds to the position of the collimating lens.

[0017] A further improvement of the present invention is that, in step S1, a corresponding second groove is designed in the non-airtight housing according to the triaxial relative position of the converging lens, and a corresponding mounting hole is designed at the end of the non-airtight housing away from the laser diode chip according to the triaxial relative position of the ferrule adapter. The ferrule adapter is inserted into the mounting hole, and the converging lens is disposed between the ferrule adapter and the optical multiplexer through the second groove.

[0018] A further improvement of the present invention is that step S4 includes the following sub-steps:

[0019] Step S401: The semiconductor thermoelectric cooler is attached to the non-airtight housing and baked and cured at a second preset temperature for a second preset time.

[0020] Step S402: The collimating lens carrier plate is attached to the semiconductor thermoelectric cooler and baked and cured at a second preset temperature for a second preset time.

[0021] Step S403: The laser diode chip is attached to the collimating lens carrier plate via the laser diode carrier plate, and then baked and cured at a second preset temperature for a second preset time.

[0022] Step S404: The thermistor and the optical multiplexer are respectively attached to the non-airtight housing and baked and cured at a second preset temperature for a second preset time.

[0023] A further improvement of the present invention is that step S5 includes the following sub-steps:

[0024] Step S501: Electrically connect the laser diode carrier board to the PCBA circuit board using a wire bonding machine;

[0025] Step S502: Electrically connect the semiconductor thermoelectric cooler to the PCBA circuit board using a wire bonding machine;

[0026] In step S503, the thermistor is electrically connected to the PCBA circuit board and the collimating lens carrier plate respectively by a wire bonding machine.

[0027] A further improvement of the present invention is that step S7 includes the following sub-steps:

[0028] Step S701: Power the laser diode chip to emit light through the power supply, clamp the converging lens assembly through the coupling device, and perform optical path coupling together with the adjustment ring to scan in the XYZ three-axis direction, while reading the optical power received by the ferrule adapter.

[0029] Step S702: When the optical power received by the coupling to the ferrule adapter reaches its maximum value, the coupling device clamps the converging lens assembly and the adjustment ring and moves them synchronously, moving a preset distance from the focal position to the ferrule direction in the optical axis direction to the designated position.

[0030] Step S703: Recouple the X-axis and Y-axis of the optical path until the optical power received by the ferrule adapter reaches its maximum value, and record the three-axis position coordinates at this time as the first coordinate;

[0031] Step S704: The converging lens assembly and the adjusting ring are clamped by the coupling device and moved downward synchronously until they come into contact with the non-airtight housing. Laser welding equipment is used to make laser weld points at the first gap of the contact surface between the adjusting ring and the non-airtight housing for laser welding fixation.

[0032] Step S705: Using the coupling device, the converging lens assembly is clamped back to the first coordinate, and the X and Y axes of the optical path are coupled again until the optical power received by the ferrule adapter reaches its maximum value. Then, a laser welding device is used to make laser weld points at the second gap where the adjusting ring and the converging lens assembly contact, and laser welding is performed to fix them.

[0033] A further improvement of the present invention is that the converging lens is semi-accommodatingly disposed above the adjusting ring.

[0034] A further improvement of the present invention is that the ferrule adapter is an integrated ferrule adapter and isolator, which are combined into one ferrule adapter and isolator.

[0035] A further improvement of the present invention is that, in step S2, a limiting component is provided at one end of the ferrule adapter near the non-airtight housing, and the ferrule adapter is inserted into the opening of the non-airtight housing, and is limited and connected to the non-airtight housing by the limiting component.

[0036] Compared with the prior art, the beneficial effects of the present invention are as follows: After the converging lens is fabricated, it is connected to the non-hermetic housing by laser welding in a manner that cooperates with the adjustment ring; according to a fixed sequence, the semiconductor thermoelectric cooler, collimating lens carrier, laser diode chip, thermistor and optical multiplexer are pasted into the non-hermetic housing using a patch device and silver paste, thereby effectively avoiding the problem of glue absorbing moisture and expanding, thus changing the optical center. This significantly reduces the probability of failure of COB packaged high-speed light emitting devices due to changes in the optical center, and effectively improves the stability and reliability of the product. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the workflow of one embodiment of the present invention;

[0038] Figure 2 This is an optical path diagram of one embodiment of the present invention;

[0039] Figure 3 This is a top view of one embodiment of the present invention.

[0040] Figure 4 This is a cross-sectional structural schematic diagram of an embodiment of the present invention;

[0041] Figure 5 This is a schematic diagram of the laser welding structure of a converging lens integral component according to an embodiment of the present invention;

[0042] Figure 6 This is a three-dimensional structural schematic diagram of an embodiment of the present invention.

[0043] Figure labels: 1-Laser diode chip; 2-Collimating lens; 3-Optical multiplexer; 4-Converging lens; 5-Intercalator adapter; 6-Non-hermetic housing; 7-PCBA circuit board; 8-Semiconductor thermoelectric cooler; 9-Collimating lens carrier; 10-Thermistor; 11-Converging lens assembly; 12-First groove; 13-Boss; 14-Second groove; 15-Adjusting ring; 16-First slit; 17-Second slit. Detailed Implementation

[0044] In the description of this invention, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing the invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. If a technical feature is referred to as "set," "fixed," "connected," or "installed" on another technical feature, it can be directly set, fixed, or connected to the other technical feature, or it can be indirectly set, fixed, connected, or installed on the other technical feature.

[0045] In the description of this invention, the term "several" means one or more; the term "multiple" means two or more; the terms "greater than," "less than," and "exceeding" are all understood to exclude the stated number; and the terms "above," "below," and "within" are all understood to include the stated number. The terms "first," "second," etc., are understood to be used only to distinguish identical or similar technical feature names, and should not be construed as implying / indicating the relative importance of the technical features, the number of technical features, or the sequential relationship between the technical features.

[0046] The preferred embodiments of the present invention will now be described in further detail with reference to the accompanying drawings.

[0047] like Figures 1 to 6 As shown, this embodiment provides a method for improving the reliability of COB-packaged high-speed optical emitting devices, including the following steps:

[0048] Step S1: Determine the triaxial relative positions of the laser diode chip 1, collimating lens 2, optical multiplexer 3, converging lens 4, and ferrule adapter 5 in the non-airtight housing 6 through optical simulation, and design the corresponding mounting structure in the non-airtight housing 6 based on the triaxial relative positions, and process the non-airtight housing 6 accordingly.

[0049] Step S2: Insert the ferrule adapter 5 into the opening of the non-airtight housing 6, and use a laser welding device to make laser weld points at the gap where the ferrule adapter 5 and the non-airtight housing 6 meet, and use the laser weld points to melt and weld the ferrule adapter 5 and the non-airtight housing 6 to obtain a ferrule adapter housing integral part;

[0050] Step S3: Assemble the ferrule adapter housing unit with the PCBA circuit board 7, fill the connection gap between the ferrule adapter housing unit and the PCBA circuit board 7 with structural adhesive, and bake and cure it at a first preset temperature for a first preset time; the first preset temperature and the first preset time can be set and adjusted according to actual conditions and requirements.

[0051] Step S4: In the integrated ferrule adapter housing, the semiconductor thermoelectric cooler 8, collimating lens carrier plate 9, laser diode chip 1, thermistor 10 and optical multiplexer 3 are sequentially attached to the non-airtight housing 6, and after attaching each component, they are baked and cured at a second preset temperature for a second preset time.

[0052] Step S5: Electrically connect each component and PCBA circuit board 7;

[0053] Step S6: The converging lens 4 is bonded to the metal frame with structural adhesive, and then baked and cured at a third preset temperature for a third preset time to obtain the integrated converging lens component 11. That is, the integrated converging lens component 11 refers to the integrated component after the converging lens 4 and the metal frame are bonded together. The third preset temperature and the third preset time can also be set and adjusted according to actual conditions and requirements. The third preset time is preferably less than the first preset time and greater than the second preset time to ensure the reliable performance of the integrated converging lens component 11.

[0054] Step S7: Couple the converging lens assembly 11 using a coupling device;

[0055] Step S8: Use a coupling device to couple the four collimating lenses 2 until the optical power received by the ferrule adapter 5 is within a preset range. Use UV-curing adhesive to bond the collimating lens 2 to the collimating lens carrier plate 9 and cure it by UV irradiation.

[0056] Step S9: Use structural adhesive to bond the non-airtight shell 6 to the cover plate, and bake and cure it at a fourth preset temperature for a fourth preset time.

[0057] like Figure 2As shown, the specific solution of this embodiment is that a 4-channel laser diode chip 1 serves as the laser, a 4-channel collimating lens 2, an optical multiplexer 3, a converging lens 4, an optical isolator, and a ferrule adapter 5 constitute the entire optical path. The ferrule adapter 5 is preferably an integrated ferrule adapter and isolator unit. The laser diode chip 1 and the optical multiplexer 3 are connected to the substrate of the non-hermetic housing 6 using silver paste. The optical isolator and the ferrule adapter 5 are passively assembled to the non-hermetic housing 6. The converging lens 4 is laser-welded to the substrate of the non-hermetic housing 6 using an adjustment ring 15. The non-hermetic housing 6 is assembled to a printed circuit board (PCBA) 7 using structural adhesive.

[0058] In this embodiment, step S1 is used to determine the optical center position of each optical component through optical simulation design. The three-axis relative position refers to the relative position of the laser diode chip 1, collimating lens 2, optical multiplexer 3, converging lens 4, and ferrule adapter 5 in the non-hermetic housing 6 along the X-axis, Y-axis, and Z-axis.

[0059] like Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, in step S1 of this embodiment, a corresponding first groove 12 is designed in the non-airtight housing 6 according to the triaxial relative positions of the laser diode chip 1 and the collimating lens 2. The collimating lens 2 is disposed in the first groove 12 through the collimating lens carrier plate 9 and the semiconductor thermoelectric cooler 8. The laser diode chip 1 is disposed on the collimating lens carrier plate 9 through the diode chip carrier, and the position of the laser diode chip 1 corresponds to the position of the collimating lens 2.

[0060] In step S1 of this embodiment, a corresponding boss 13 is designed in the non-hermetic housing 6 according to the triaxial relative position of the optical multiplexer 3. The multiplexer is positioned on the side of the collimating lens 2 away from the laser diode chip 1 via the boss 13, that is, between the collimating lens 2 and the converging lens 4, and the position of the multiplexer corresponds to the position of the collimating lens 2. A corresponding second groove 14 is designed in the non-hermetic housing 6 according to the triaxial relative position of the converging lens 4, and a corresponding mounting hole is designed at the end of the non-hermetic housing 6 away from the laser diode chip 1 according to the triaxial relative position of the ferrule adapter 5. The ferrule adapter 5 is inserted into the mounting hole, and the converging lens 4 is positioned between the ferrule adapter 5 and the optical multiplexer 3 via the second groove 14, so as to provide a better hardware foundation for realizing a complete optical path.

[0061] In step S2 of this embodiment, a limiting component is provided at one end of the ferrule adapter 5 near the non-airtight housing 6. The ferrule adapter 5 is inserted into the opening of the non-airtight housing 6 and is limited to the non-airtight housing 6 by the limiting component. The limiting connection can be understood as a tight connection, so as to ensure the reliability of the passive assembly and connection between the ferrule adapter 5 and the non-airtight housing 6.

[0062] In this embodiment, after the ferrule adapter 5, the non-airtight housing 6, and the PCBA circuit board 7 are assembled into a single unit in step S4, steps S401 to S404 are completed using a surface mount device and silver paste. Specifically, step S4 in this embodiment includes the following sub-steps:

[0063] Step S401: The semiconductor thermoelectric cooler 8 is attached to the non-airtight housing 6, that is, the bottom of the first groove 12, and baked and cured at a second preset temperature for a second preset time.

[0064] Step S402: The collimating lens carrier plate 9 is attached to the semiconductor thermoelectric cooler 8 and baked and cured at a second preset temperature for a second preset time.

[0065] Step S403: The laser diode chip 1 is attached to the collimating lens carrier plate 9 via the laser diode carrier plate, and then baked and cured at a second preset temperature for a second preset time. The laser diode carrier plate refers to the carrier plate of the laser diode chip 1.

[0066] In step S404, the thermistor 10 and the optical multiplexer 3 are respectively attached to the non-airtight housing 6, and then baked and cured at a second preset temperature for a second preset time.

[0067] It is worth noting that in step S4 of this embodiment, after each component is pasted, it must first be baked and cured at a second preset temperature for a second preset time before proceeding to the next step of pasting another component, thereby ensuring the reliability of the structural pasting. The second preset temperature is preferably 150℃, and the second preset time is preferably 0.5 hours. Of course, in practical applications, the second preset temperature and the second preset time can also be adjusted according to the actual situation and needs. The first preset time is preferably longer than the second preset time. Based on this, the pasting order of each component cannot be changed in order to ensure the efficiency of the process and reduce the product rework rate and defect rate.

[0068] Step S5 in this embodiment includes the following sub-steps:

[0069] Step S501: Electrically connect the laser diode carrier board to the PCBA circuit board 7 using a wire bonding machine;

[0070] Step S502: Electrically connect the semiconductor thermoelectric cooler 8 to the PCBA circuit board 7 using a wire bonding machine;

[0071] In step S503, the thermistor 10 is electrically connected to the PCBA circuit board 7 and the collimating lens carrier plate 9 respectively by a wire bonding machine.

[0072] In this embodiment, step S7 preferably includes the following sub-steps:

[0073] Step S701: Power on the laser diode chip 1 to emit light, and clamp the converging lens assembly 11 through a coupling device, such as a mechanical claw / manipulator, and perform optical path coupling together with the adjustment ring 15; performing optical path coupling together means scanning the XYZ three-axis direction during the clamping process, and reading the magnitude of the optical power received by the ferrule adapter 5 at the same time.

[0074] In step S702, when the optical power received by the coupling to the ferrule adapter 5 reaches its maximum value, the converging lens assembly 11 and the adjusting ring 15 are clamped by the coupling device and moved synchronously. They move a preset distance from the focal position towards the ferrule direction along the optical axis to a designated position. This preset distance can be customized and adjusted according to actual conditions and needs, and is preferably 195µm. That is, the converging lens assembly 11 and the adjusting ring 15 preferably move 195µm from the focal position towards the ferrule direction along the optical axis. The optical axis direction refers to the Z-axis direction. The preset distance refers to the pre-set defocus distance between the focal position and the focal position, providing a basis for matching the optical path after adding the collimating lens. This preset distance can also be set and adjusted according to actual needs. The designated position refers to the position reached after moving the preset distance from the focal position along the optical axis.

[0075] Step S703: Recouple the X-axis and Y-axis of the optical path until the optical power received by the ferrule adapter 5 reaches its maximum value, and record the three-axis position coordinates at this time as the first coordinate; that is, recouple the other two axes besides the optical axis direction so that the optical power received by the ferrule adapter 5 reaches its maximum value at this position.

[0076] Step S704: The converging lens assembly 11 and the adjusting ring 15 are clamped by the coupling device and moved downwards synchronously until they contact the non-airtight housing 6. That is, the converging lens assembly 11 and the adjusting ring 15 contact the bottom of the second groove 14 together. A laser welding device is used to make laser weld points at the first gap 16 on the contact surface between the adjusting ring 15 and the non-airtight housing 6. Figure 5 As shown, laser welding is performed to fix the converging lens 4 in the optical axis direction (also known as the Z direction). At this time, the adjusting ring 15 has been fixed on the non-airtight housing 6.

[0077] In step S705, the coupling device releases the adjusting ring 15, and the converging lens assembly 11 is clamped back to the first coordinate by the coupling device to perform a small-range fine coupling process, that is, to re-couple the X-axis and Y-axis of the optical path until the optical power received by the ferrule adapter 5 reaches its maximum value. Then, a laser welding device is used to make a laser weld point at the second gap 17 where the adjusting ring 15 and the converging lens assembly 11 are in contact. Figure 5 As shown, laser welding is performed to fix the converging lens 4 in the X and Y axis directions, thus completing the coupling of the converging lens 4. The converging lens assembly 11 is semi-accommodatingly fixed above the adjusting ring 15. It is worth noting that the above coupling process is designed for the overall technical solution of this application, and its order cannot be changed; otherwise, the reliability of the product cannot be guaranteed.

[0078] In step S8 of this embodiment, a coupling device is used to couple the four collimating lenses 2 to ensure that the optical power received by the ferrule adapter 5 is within a preset range. UV-curing adhesive is then used to bond the collimating lenses 2 to the collimating lens carrier plate 9, followed by UV curing. The preset range can be customized according to actual conditions and requirements, with a default value of 1-3 dBm. In step S9, structural adhesive is used to bond the non-hermetic housing 6 to the cover plate, followed by baking and curing at a fourth preset temperature for a fourth preset time. The fourth preset temperature and fourth preset time can also be set and adjusted according to actual conditions and requirements. This completes the high-reliability COB-packaged high-speed optical emitting device.

[0079] To illustrate the reliability performance of the COB-packaged high-speed optical emitting device implemented in this application, this embodiment conducts damp heat reliability tests using three different existing UV-curing adhesives for 168 hours, 500 hours, and 1000 hours, respectively. The experimental results show that even with existing UV-curing adhesives, the average change rate can be maintained between 0.50% and 0.77%, effectively reducing the impact of damp heat conditions on the optical center of the COB-packaged high-speed optical emitting device and significantly lowering the probability of failure due to changes in the optical center.

[0080]

[0081]

[0082]

[0083] In summary, after fabricating the converging lens assembly 11, this embodiment connects it to the non-hermetic housing 6 via laser welding in conjunction with the adjusting ring 15. Following a fixed sequence, a patch device and silver paste are used to attach the semiconductor thermoelectric cooler 8, collimating lens carrier 9, laser diode chip 1, thermistor 10, and optical multiplexer 3 to the non-hermetic housing 6. This effectively avoids the problem of adhesive absorbing moisture and expanding, thus altering the optical center. It significantly reduces the probability of failure of COB-packaged high-speed optical emitting devices due to changes in the optical center, effectively improving the stability and reliability of the product.

[0084] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A method for improving the reliability of COB-packaged high-speed optical emitting devices, characterized in that, Includes the following steps: Step S1: Determine the triaxial relative positions of the laser diode chip, collimating lens, optical multiplexer, converging lens, and ferrule adapter in the non-airtight housing through optical simulation, and design a corresponding mounting structure in the non-airtight housing based on the triaxial relative positions, and process the non-airtight housing accordingly; the mounting structure includes mounting holes; Step S2: Insert the ferrule adapter into the mounting hole of the non-airtight housing, and use a laser welding device to make laser weld points at the gap where the ferrule adapter and the non-airtight housing contact each other, and use the laser weld points to melt and weld the ferrule adapter and the non-airtight housing to obtain a ferrule adapter housing integral part; Step S3: Assemble the ferrule adapter housing unit with the PCBA circuit board, fill the connection gap between the ferrule adapter housing unit and the PCBA circuit board with structural adhesive, and bake and cure it at a first preset temperature for a first preset time. Step S4: In the integrated ferrule adapter housing, the semiconductor thermoelectric cooler, collimating lens carrier, laser diode chip, thermistor and optical multiplexer are sequentially attached to the non-airtight housing using a patch device and silver paste. After attaching each component, the components are baked and cured at a second preset temperature for a second preset time. Step S5: Electrically connect the laser diode chip, the semiconductor thermoelectric cooler, and the thermistor to the PCBA circuit board respectively; Step S6: The converging lens is bonded to the metal frame with structural adhesive and then baked and cured at a third preset temperature for a third preset time to obtain an integral converging lens. Step S7: Couple the converging lens assembly using a coupling device; Step S8: Use a coupling device to couple the four collimating lenses until the optical power received by the ferrule adapter is within a preset range. Use UV-curing adhesive to bond the collimating lens to the collimating lens carrier plate and cure it by UV irradiation. Step S9: Use structural adhesive to bond the non-airtight shell to the cover plate, and bake and cure it at a fourth preset temperature for a fourth preset time.

2. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to claim 1, characterized in that, In step S1, a corresponding first groove is designed in the non-airtight housing according to the triaxial relative positions of the laser diode chip and the collimating lens. The collimating lens is disposed in the first groove through a collimating lens carrier and a semiconductor thermoelectric cooler. The laser diode chip is disposed on the collimating lens carrier through a diode chip carrier, and the position of the laser diode chip corresponds to the position of the collimating lens.

3. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to claim 1, characterized in that, In step S1, a corresponding boss is designed in the non-airtight housing according to the triaxial relative position of the optical multiplexer. The multiplexer is set on the side of the collimating lens away from the laser diode chip through the boss, and the position of the multiplexer corresponds to the position of the collimating lens.

4. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to claim 1, characterized in that, In step S1, a corresponding second groove is designed in the non-airtight housing according to the triaxial relative position of the converging lens, and a corresponding mounting hole is designed at the end of the non-airtight housing away from the laser diode chip according to the triaxial relative position of the ferrule adapter. The ferrule adapter is inserted into the mounting hole, and the converging lens is disposed between the ferrule adapter and the optical multiplexer through the second groove.

5. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to any one of claims 1 to 4, characterized in that, Step S4 includes the following sub-steps: Step S401: The semiconductor thermoelectric cooler is attached to the non-airtight housing and baked and cured at a second preset temperature for a second preset time. Step S402: The collimating lens carrier plate is attached to the semiconductor thermoelectric cooler and baked and cured at a second preset temperature for a second preset time. Step S403: The laser diode chip is attached to the collimating lens carrier plate via the laser diode carrier plate, and then baked and cured at a second preset temperature for a second preset time. Step S404: The thermistor and the optical multiplexer are respectively attached to the non-airtight housing and baked and cured at a second preset temperature for a second preset time.

6. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to any one of claims 1 to 4, characterized in that, Step S5 includes the following sub-steps: Step S501: Electrically connect the laser diode carrier board to the PCBA circuit board using a wire bonding machine; Step S502: Electrically connect the semiconductor thermoelectric cooler to the PCBA circuit board using a wire bonding machine; In step S503, the thermistor is electrically connected to the PCBA circuit board and the collimating lens carrier plate respectively by a wire bonding machine.

7. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to any one of claims 1 to 4, characterized in that, Step S7 includes the following sub-steps: Step S701: Power the laser diode chip to emit light through the power supply, clamp the converging lens assembly through the coupling device, and perform optical path coupling together with the adjustment ring to scan in the XYZ three-axis direction, while reading the optical power received by the ferrule adapter. Step S702: When the optical power received by the coupling to the ferrule adapter reaches its maximum value, the coupling device clamps the converging lens assembly and the adjustment ring and moves them synchronously, moving a preset distance from the focal position to the ferrule direction in the optical axis direction to the designated position. Step S703: Recouple the X-axis and Y-axis of the optical path until the optical power received by the ferrule adapter reaches its maximum value, and record the three-axis position coordinates at this time as the first coordinate; Step S704: The converging lens assembly and the adjusting ring are clamped by the coupling device and moved downward synchronously until they come into contact with the non-airtight housing. Laser welding equipment is used to make laser weld points at the first gap of the contact surface between the adjusting ring and the non-airtight housing for laser welding fixation. Step S705: Using the coupling device, the converging lens assembly is clamped back to the first coordinate, and the X and Y axes of the optical path are coupled again until the optical power received by the ferrule adapter reaches its maximum value. Then, a laser welding device is used to make laser weld points at the second gap where the adjusting ring and the converging lens assembly contact, and laser welding is performed to fix them.

8. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to claim 7, characterized in that, The converging lens is semi-accommodatingly positioned above the adjustment ring.

9. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to any one of claims 1 to 4, characterized in that, The ferrule adapter is an integrated ferrule adapter and isolator, which is a ferrule adapter isolation unit.

10. The method for improving the reliability of COB-packaged high-speed optical emitting devices according to any one of claims 1 to 4, characterized in that, In step S2, a limiting component is provided at one end of the ferrule adapter near the non-airtight housing. The ferrule adapter is inserted into the mounting hole of the non-airtight housing and is limited and connected to the non-airtight housing by the limiting component.

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