A transceiver integrated package optical device

Abstract

This invention provides an integrated transceiver packaged optical device, relating to the field of optical modules. The integrated transceiver packaged optical device includes a package housing, and a PIC chip, an EIC chip, a DFB laser, a heat dissipation element, and a fiber array mounted within the package housing. A ceramic substrate is provided on one inner wall of the package housing. The PIC chip is mounted on the ceramic substrate, the EIC chip is mounted on the side of the PIC chip, and the DFB laser is embedded in a recessed area within the PIC chip. The PIC chip also has a receiving optical path and a transmitting optical path internally, with the receiving optical path having a receiving port located at the edge of the PIC chip. The DFB laser is arranged correspondingly to the transmitting optical path, with a transmitting optical port located at the edge of the PIC chip. The fiber array is located on one inner wall of the package housing, opposite to the PIC chip, and has receiving optical fibers corresponding to the receiving optical port and transmitting optical fibers corresponding to the transmitting optical port.

Description

Technical Field

[0001] This invention relates to the field of optical module technology, and in particular to an integrated packaged optical device that combines transceiver functions. Background Technology

[0002] Optical transceiver modules (or simply optical modules / devices) are crucial components in fiber optic communication systems. With the rapid development of big data and cloud computing technologies, higher demands are being placed on the transmission rate, bandwidth, integration, and power consumption of optical devices.

[0003] For example, Chinese invention patents with authorization announcement numbers CN215416013U and 2022.01.04 disclose a hermetically sealed silicon photonics 400G optical module. The optical module includes a shell and a silicon photonics module. The shell includes a mounting base and a top cover. The mounting base is fixedly connected to the top cover and protects the silicon photonics module. The silicon photonics module includes a PCB board, a housing, and a silicon photonics chip. The main chip is soldered and fixed on the PCB board. One end of the PCB board is provided with a conductive contact. The other end of the PCB board penetrates the side wall of the housing and is fixedly connected to the inside of the housing. The silicon photonics chip is disposed inside the housing and located on one side of the PCB board. The silicon photonics chip is bonded to the PCB board. The silicon photonics chip is provided with an incident light waveguide, a silicon photonics modulator, and a photodetector. At least one set of laser chips is provided on one side of the housing. A coupling lens is provided on the side of the laser chip close to the silicon photonics chip.

[0004] The existing hermetically sealed silicon photonics 400G optical module design includes a shell, PCB board, tube shell, and silicon photonics chip. The laser chip is located on one side of the tube shell. While ensuring heat dissipation efficiency, it is difficult to provide reliable encapsulation and protection for the laser chip. Moreover, the PCB board, silicon photonics chip, and laser chip are essentially arranged side by side inside the shell, resulting in a large overall size of the optical module and low optical communication transmission efficiency. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide an integrated transceiver packaged optical device that solves the issues of laser chips being located on one side of the housing, making it difficult to reliably protect the laser chips, and the PCB board, silicon photonics chip, and laser chip being arranged side-by-side within the housing, resulting in a large overall size of the optical module and low optical communication transmission efficiency.

[0006] The technical solution of the transceiver integrated packaged optical device of the present invention is as follows:

[0007] The transceiver integrated packaged optical device includes a package housing, a PIC chip, an EIC chip, a DFB laser, a heat dissipation element, and a fiber array, wherein the PIC chip, the EIC chip, the DFB laser, the heat dissipation element, and the fiber array are respectively installed in the package housing;

[0008] A ceramic substrate is provided on one inner wall of the packaging shell. The PIC chip is mounted on the ceramic substrate. The EIC chip is mounted on the side of the PIC chip facing away from the ceramic substrate. A groove is also provided on one side of the PIC chip. The DFB laser is embedded in the groove.

[0009] The PIC chip also has a receiving optical path and a transmitting optical path inside, and the receiving optical path is located at the edge of the PIC chip with a receiving optical port; the DFB laser is arranged correspondingly to the transmitting optical path, and the transmitting optical path is located at the edge of the PIC chip with a transmitting optical port;

[0010] The fiber array is disposed on one inner wall of the package housing and is disposed opposite to the PIC chip. The fiber array has a receiving end fiber corresponding to the receiving optical port and a transmitting end fiber corresponding to the transmitting optical port.

[0011] Furthermore, a ball grid array layer is electrically connected between the PIC chip and the ceramic substrate. The EIC chip and the DFB laser are flip-chip mounted on the surface of the PIC chip and in the sink, respectively, and a ball grid array layer is electrically connected between the EIC chip and the PIC chip, and between the DFB laser and the PIC chip.

[0012] Furthermore, the ball grid array layer is formed by thermoforming or reflow soldering of a copper pillar bump array.

[0013] Furthermore, the EIC chip integrates a driving element for the optical emitting component and a transimpedance amplifier for the optical receiving component.

[0014] Furthermore, the encapsulation shell includes a box-shaped shell and a cover plate. The cover plate and the box-shaped shell are hermetically sealed by parallel seam welding. The ceramic base layer is disposed on the inner bottom surface of the box-shaped shell, and the surface of the ceramic base layer is also printed with solder pads.

[0015] Furthermore, the fiber array is provided with an isolator on the side corresponding to the PIC chip. The fiber array is also connected to a receiving fiber, a transmitting fiber, and a socket. The packaging shell has a connection hole. The socket is fixed to the packaging shell by laser welding, and the receiving fiber and the transmitting fiber are sealed and inserted into the socket.

[0016] Furthermore, the receiving optical path is also provided with a first polarization beam splitter, an adjustable optical attenuator, and a photodiode. The first polarization beam splitter is arranged close to the receiving optical port, and the adjustable optical attenuator and the photodiode are arranged sequentially along the signal direction of the receiving optical path.

[0017] Furthermore, the emission optical path is also provided with a modulator, a second polarization beam splitter and a third polarization beam splitter. There are multiple modulators and multiple second polarization beam splitters. The emission optical path between the DFB laser and the multiple modulators is a tree-shaped optical path. The modulators and the second polarization beam splitters are arranged correspondingly. The third polarization beam splitter is arranged close to the emission port.

[0018] Furthermore, the heat dissipation element is attached to the back of the PIC chip corresponding to the DFB laser to form a heat conduction path between the DFB laser, the PIC chip, the heat dissipation element and the package housing.

[0019] Furthermore, the heat dissipation element is a semiconductor cooler, the thickness of the heat dissipation element is less than the wall thickness of one side of the package shell, and an accommodating groove is formed on one side of the inner wall of the package shell, the accommodating groove and the heat dissipation element are in concave-convex fit.

[0020] The integrated transceiver packaged optical device of the present invention offers the following advantages compared to existing technologies: This integrated transceiver packaged optical device employs a package housing and a design containing a PIC chip, an EIC chip, a DFB laser, a heat sink, and a fiber array mounted within the package housing. The package housing provides hermetical protection for the PIC chip, EIC chip, DFB laser, heat sink, and fiber array, ensuring the reliability of the internal laser and other optoelectronic components. The EIC chip is mounted on the PIC chip, and the DFB laser is embedded in a recess within the PIC chip. The EIC chip and DFB laser occupy only the surface space of the PIC chip, fully utilizing this surface space and improving the chip's integration density.

[0021] The PIC chip, along with the EIC chip and DFB laser, is directly mounted on the ceramic substrate of the package. This ceramic substrate replaces a separate PCB board, simplifying the structural layout of the packaged optical device and effectively improving the utilization of the internal space, thus reducing the overall size of the packaged optical device. The PIC chip also internally houses receiving and transmitting optical paths. The receiving fiber of the fiber array corresponds to the receiving port, accurately transmitting external optical signals to the receiving optical path. The transmitting fiber of the fiber array corresponds to the transmitting port, transmitting the optical signals emitted by the DFB laser through the transmitting optical path to the transmitting fiber, achieving integrated optical signal transmission and reception.

[0022] The heat generated by the DFB laser can be conducted to the package shell through heat dissipation components, balancing the hermeticity of the package and heat dissipation. Furthermore, the mounting method of the EIC chip, DFB laser, and PIC chip, compared to gold wire bonding, shortens the transmission distance of optical / electrical signals, ensures the stability of optical / electrical signal transmission, and effectively improves signal transmission efficiency and product performance. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the internal structure of the integrated packaged optical device in a specific embodiment of the transceiver integrated packaged optical device of the present invention;

[0024] Figure 2 This is a three-dimensional schematic diagram of a PIC chip, an EIC chip, and a DFB laser in a specific embodiment of the transceiver integrated packaged optical device of the present invention.

[0025] Figure 3 This is a three-dimensional schematic diagram of the PIC chip and heat dissipation element in a specific embodiment of the transceiver integrated packaged optical device of the present invention;

[0026] Figure 4 This is a cross-sectional schematic diagram of the integrated packaged optical device in a specific embodiment of the transceiver integrated packaged optical device of the present invention;

[0027] Figure 5 This is a schematic diagram of the internal optical path of the PIC chip in a specific embodiment of the integrated transceiver packaged optical device of the present invention.

[0028] In the diagram: 1-Encapsulation shell, 11-Ceramic base layer, 12-Box-shaped shell, 13-Cover plate, 2-PIC chip, 20-Submerged slot, 21-Receiver optical path, 22-Emitter optical path, 23-First polarization beam splitter, 24-Tuned optical attenuator, 25-Photodiode, 26-Modulator, 27-Second polarization beam splitter, 28-Third polarization beam splitter, 3-EIC chip, 30-Ball grating array layer, 4-DFB laser, 5-Heat dissipation element, 6-Fiber array, 61-Receiver fiber, 62-Emitter fiber, 63-Isolator, 64-Socket. Detailed Implementation

[0029] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0030] This embodiment describes an integrated transceiver packaged optical device, such as... Figures 1 to 5As shown, the transceiver integrated packaged optical device includes a package housing 1, a PIC chip 2, an EIC chip 3, a DFB laser 4, a heat dissipation element 5, and a fiber array 6. The PIC chip 2, EIC chip 3, DFB laser 4, heat dissipation element 5, and fiber array 6 are respectively installed in the package housing 1. A ceramic substrate 11 is provided on one inner wall of the package housing 1. The PIC chip 2 is mounted on the ceramic substrate 11, and the EIC chip 3 is mounted on the side of the PIC chip 2 facing away from the ceramic substrate 11. A groove 20 is also provided on one side of the PIC chip 2, and the DFB laser 4 is embedded in the groove 20.

[0031] The PIC chip 2 is internally provided with a receiving optical path 21 and a transmitting optical path 22, and the receiving optical path 21 is located at the edge of the PIC chip 2 with a receiving optical port; the DFB laser 4 is arranged corresponding to the transmitting optical path 22, and the transmitting optical path 22 is located at the edge of the PIC chip 2 with a transmitting optical port; the fiber array 6 is disposed on one side of the inner wall of the packaging shell 1, and the fiber array 6 is arranged opposite to the PIC chip 2. The fiber array 6 has a receiving end fiber 61 corresponding to the receiving optical port and a transmitting end fiber 62 corresponding to the transmitting optical port.

[0032] This integrated transceiver optical device employs a packaged housing 1, and a design housing 2, an EIC chip 3, a DFB laser 4, a heat sink 5, and a fiber array 6 mounted within the packaged housing 1. The packaged housing 1 provides hermetical protection for the PIC chip 2, EIC chip 3, DFB laser 4, heat sink 5, and fiber array 6, ensuring the reliability of the internal laser and other optoelectronic components. The EIC chip 3 is mounted on the PIC chip 2, and the DFB laser 4 is embedded in a recess 20 within the PIC chip 2. The EIC chip 3 and DFB laser 4 occupy only the surface space of the PIC chip 2, making full use of the surface space and improving the chip's integration density.

[0033] The PIC chip 2, along with the EIC chip 3 and the DFB laser 4, are directly mounted on the ceramic substrate 11 of the package housing 1. The ceramic substrate 11 replaces the separate PCB board, simplifying the structural layout of the packaged optical device and effectively improving the utilization rate of the internal space of the package housing 1, thus reducing the overall size of the packaged optical device. The PIC chip 2 also internally includes a receiving optical path 21 and a transmitting optical path 22. The receiving optical fiber 61 of the fiber array 6 corresponds to the receiving port, accurately transmitting external optical signals to the receiving optical path 21. The transmitting optical fiber 62 of the fiber array 6 corresponds to the transmitting port, transmitting the optical signals emitted by the DFB laser 4 through the transmitting optical path 22 to the transmitting optical fiber 62, achieving integrated optical signal transmission and reception.

[0034] The heat emitted by the DFB laser 4 can be conducted to the package housing 1 through the heat dissipation element 5, thus balancing the hermeticity of the package and the heat dissipation effect. In addition, the mounting method of the EIC chip 3, DFB laser 4 and PIC chip 2, compared with the gold wire bonding process, shortens the transmission distance of optical / electrical signals, ensures the transmission stability of optical / electrical signals, and effectively improves the signal transmission efficiency and product performance.

[0035] In this embodiment, a ball grid array layer 30 is electrically connected between the PIC chip 2 and the ceramic substrate 11. The EIC chip 3 and the DFB laser 4 are flip-chip mounted in the PIC chip 2 and the recess 20, respectively, and the ball grid array layer 30 is electrically connected between the EIC chip 3 and the PIC chip 2, and between the DFB laser 4 and the PIC chip 2. Ball grid array (BGA) is a surface-mount packaging technology that uses solder balls arranged in an array on the bottom of the chip to achieve electrical connectivity, shortening the electrical interconnection path and avoiding signal interference and noise problems. The ball grid array layer 30 is a copper pillar bump array formed by thermoforming or reflow soldering, ensuring the stability of the electrical connections between the ball grid array layer 30 and the PIC chip 2, between the EIC chip 3 and the PIC chip 2, and between the DFB laser 4 and the PIC chip 2.

[0036] As a further preferred option, the EIC chip 3 integrates the driving element of the optical emitting component and the transimpedance amplifier of the optical receiving component, enabling the EIC chip 3 to handle both the transmission and reception of optical signals. Furthermore, the package housing 1 includes a box-shaped housing 12 and a cover plate 13. The cover plate 13 and the box-shaped housing 12 are hermetically sealed using parallel seam welding. A ceramic substrate 11 is disposed on the inner bottom surface of the box-shaped housing 12, and the surface of the ceramic substrate 11 is also printed with solder pads. These solder pads on the surface of the ceramic substrate 11 replace the original PCB board, allowing not only the mounting of the PIC chip 2 but also the installation of capacitors, resistors, and inductors, ensuring the completeness of the circuit functionality of the packaged optical device.

[0037] The fiber optic array 6 includes an isolator 63 on the side corresponding to the PIC chip 2. The fiber optic array 6 is also connected to a receiving fiber 61, a transmitting fiber 62, and a socket 64. The encapsulation housing 1 has connection holes. The socket 64 is laser-welded to the encapsulation housing 1, and both the receiving fiber 61 and the transmitting fiber 62 are sealed within the socket 64. The connection holes and socket 64 ensure that the receiving fiber 61 and the transmitting fiber 62 can smoothly pass through the inside and outside of the encapsulation housing 1, improving the airtightness between the fiber optics and the connection holes in the encapsulation housing 1.

[0038] In this embodiment, the receiving optical path 21 is further provided with a first polarization beam splitter 23, an adjustable optical attenuator 24, and a photodiode 25. The first polarization beam splitter 23 is arranged close to the receiving optical port. The adjustable optical attenuator 24 and the photodiode 25 are arranged sequentially along the signal direction of the receiving optical path 21. The received external optical signal is processed by the receiving optical path 21 and each component, thereby converting it into a corresponding electrical signal. Furthermore, the transmitting optical path 22 is provided with a modulator 26, a second polarization beam splitter 27, and a third polarization beam splitter 28. Multiple modulators 26 and multiple second polarization beam splitters 27 are provided. The transmitting optical path 22 between the DFB laser 4 and the multiple modulators 26 is a tree-shaped optical path, and the modulators 26 are arranged correspondingly to the second polarization beam splitters 27. The third polarization beam splitter 28 is arranged close to the transmitting optical port. The optical signal emitted by the DFB laser 4 is processed by the transmitting optical path 22 and each component, and then further transmitted outward through the transmitting optical fiber 62.

[0039] Additionally, the heat dissipation element 5 is mounted on the back of the PIC chip 2 corresponding to the DFB laser 4, forming a heat conduction path between the DFB laser 4, the PIC chip 2, the heat dissipation element 5, and the package housing 1. The heat dissipation element 5 is a thermoelectric cooler, and its thickness is less than the wall thickness of one side of the package housing 1. A receiving groove is formed on the inner wall of one side of the package housing 1, and the receiving groove fits into the heat dissipation element 5. The thermoelectric cooler (TEC) can quickly conduct the heat generated by the DFB laser 4 to the package housing 1, and the package housing 1 diffuses the heat outward, ensuring the heat dissipation effect of the entire integrated packaged optical device.

[0040] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. An integrated packaged optical transceiver device, characterized in that, The package includes a housing (1), a PIC chip (2), an EIC chip (3), a DFB laser (4), a heat dissipation element (5), and a fiber array (6), wherein the PIC chip (2), the EIC chip (3), the DFB laser (4), the heat dissipation element (5), and the fiber array (6) are respectively installed in the housing (1); A ceramic substrate (11) is provided on one inner wall of the encapsulation shell (1). The PIC chip (2) is mounted on the ceramic substrate (11). The EIC chip (3) is mounted on the side of the PIC chip (2) facing away from the ceramic substrate (11). A groove (20) is also provided on one side of the PIC chip (2). The DFB laser (4) is embedded in the groove (20). The PIC chip (2) is further provided with a receiving optical path (21) and a transmitting optical path (22), and the receiving optical path (21) is provided with a receiving optical port at the edge of the PIC chip (2); the DFB laser (4) is arranged correspondingly to the transmitting optical path (22), and the transmitting optical path (22) is provided with a transmitting optical port at the edge of the PIC chip (2); The fiber array (6) is disposed on one inner wall of the packaging shell (1), and the fiber array (6) is disposed opposite to the PIC chip (2). The fiber array (6) has a receiving end fiber (61) corresponding to the receiving optical port and a transmitting end fiber (62) corresponding to the transmitting optical port.

2. The transceiver integrated packaged optical device according to claim 1, characterized in that, A ball grid array layer (30) is electrically connected between the PIC chip (2) and the ceramic substrate (11). The EIC chip (3) and the DFB laser (4) are flip-chip mounted on the surface of the PIC chip (2) and in the sink (20), respectively. A ball grid array layer (30) is electrically connected between the EIC chip (3) and the PIC chip (2) and between the DFB laser (4) and the PIC chip (2).

3. The transceiver integrated packaged optical device according to claim 2, characterized in that, The ball grid array layer (30) is formed by hot press welding or reflow welding of copper pillar bump array.

4. The transceiver integrated packaged optical device according to claim 1, characterized in that, The EIC chip (3) integrates a driving element for the optical emission component and a transimpedance amplifier for the optical receiving component.

5. The transceiver integrated packaged optical device according to claim 1, characterized in that, The encapsulation shell (1) includes a box-shaped shell (12) and a cover plate (13). The cover plate (13) and the box-shaped shell (12) are hermetically sealed by parallel seam welding. The ceramic base layer (11) is disposed on the inner bottom surface of the box-shaped shell (12), and the surface of the ceramic base layer (11) is also printed with solder pads.

6. The transceiver integrated packaged optical device according to claim 1, characterized in that, The fiber array (6) is also provided with an isolator (63) on one side corresponding to the PIC chip (2). The fiber array (6) is also connected to a receiving fiber (61), a transmitting fiber (62) and a socket (64). The encapsulation shell (1) is provided with a connection hole. The socket (64) is fixed to the encapsulation shell (1) by laser welding. The receiving fiber (61) and the transmitting fiber (62) are sealed and installed in the socket (64).

7. The transceiver integrated packaged optical device according to claim 1, characterized in that, The receiving optical path (21) is also provided with a first polarization beam splitter (23), an adjustable light attenuator (24) and a photodiode (25). The first polarization beam splitter (23) is arranged close to the receiving optical port, and the adjustable light attenuator (24) and the photodiode (25) are arranged sequentially along the signal direction of the receiving optical path (21).

8. The transceiver integrated packaged optical device according to claim 1, characterized in that, The emission optical path (22) is also provided with a modulator (26), a second polarization beam splitter (27) and a third polarization beam splitter (28). There are multiple modulators (26) and second polarization beam splitters (27). The emission optical path (22) between the DFB laser (4) and the multiple modulators (26) is a tree-shaped optical path. The modulators (26) and the second polarization beam splitters (27) are arranged correspondingly. The third polarization beam splitter (28) is arranged close to the emission port.

9. The transceiver integrated packaged optical device according to claim 1, characterized in that, The heat dissipation element (5) is attached to the back of the PIC chip (2) corresponding to the DFB laser (4) to form a heat conduction path between the DFB laser (4), the PIC chip (2), the heat dissipation element (5) and the package housing (1).

10. The transceiver integrated packaged optical device according to claim 9, characterized in that, The heat dissipation element (5) is a semiconductor cooler. The thickness of the heat dissipation element (5) is less than the wall thickness of one side of the package shell (1). A receiving groove is provided on one side of the inner wall of the package shell (1). The receiving groove is in concave-convex fit with the heat dissipation element (5).

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