Synchronous control method, control device and laser of dual-cavity excimer laser

Abstract

The embodiment of the present application provides a synchronous control method, control device and laser of a dual-cavity excimer laser. In the embodiment of the present application, for each discharge process of the dual-cavity excimer laser, the corresponding advanced preset time is collected, and the parameters corresponding to the delay time for determining the discharge of each cavity are collected; according to the collected preset time, parameters and preset control relationship, the preset time of the next discharge is determined to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge. Since the parameters are used to determine the delay time, the discharge synchronization control with high precision can be performed for the delay time of the dual cavity, and the discharge signal of the dual cavity can be captured and collected in real time, forming a fast feedback, and realizing the effect of real-time adjustable synchronization delay.

Description

Technical Field

[0001] The invention relates to the field of control, and in particular to a synchronous control method, control equipment and laser of a dual-cavity excimer laser. Background Art

[0002] Excimer laser is a pulsed gas laser for deep ultraviolet characteristic applications. It has the characteristics of high repetition rate, high energy, short wavelength, narrow linewidth, etc. It is an excellent laser light source for lithography systems. Among them, the dual-cavity excimer laser with oscillation-amplification (MOPA) structure occupies a dominant position in lasers and has become the main lithography light source. Since the discharge duration of the dual-cavity laser is extremely short, and the particle number inversion produced by the discharge decays very quickly, it can only exist effectively during the discharge period. In order for the dual-cavity laser to work correctly, the seed beam of the master cavity must pass through its discharge area during the period when the particle number of the power amplifier cavity is reversed to form amplification. Therefore, the dual-cavity laser requires that the main cavity discharges ahead of the power amplifier cavity for a certain time in the working sequence, and the discharge sequence of the two cavities needs to remain synchronized and stable within this certain time. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the existing technology and provide a synchronous control method, control device and laser of a dual-cavity excimer laser, which can make the discharge timing of the two discharge cavities in the dual-cavity excimer laser be more accurately controlled.

[0004] To achieve the above technical objectives, on the one hand, the present invention provides a synchronous control method for a dual-cavity excimer laser, wherein the dual-cavity excimer laser includes a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity is discharged, the power amplifier cavity discharges based on the discharge result output by the master cavity; the method comprises: for each discharge process of the dual-cavity excimer laser, collecting the corresponding advanced preset time, and collecting parameters corresponding to the delay time for determining the discharge of each cavity, wherein the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending a discharge signal indicating discharge to the end of the discharge of the corresponding cavity; according to the collected preset time, parameters and preset control relationship, determining the preset time for the next discharge to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, wherein the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0005] Specifically, the collecting of the corresponding advanced preset time includes: collecting the discharge signals of the zero-crossing points corresponding to each cavity, and determining the corresponding preset time between the corresponding discharge signals according to a filtering algorithm as the collected preset time.

[0006] In addition, the method also includes: after collecting the discharge signal, obtaining the discharge signal of the zero-crossing point corresponding to each cavity through the MCU, collecting the preset time according to the filtering algorithm, and sending the collected preset time to the CPU through the MCU to complete the collection of the preset time.

[0007] Specifically, the method of obtaining the discharge signal of the zero-crossing point corresponding to each cavity through the MCU, collecting the preset time according to a filtering algorithm, and sending the collected preset time to the CPU through the MCU includes: obtaining the discharge signal of the zero-crossing point corresponding to each cavity through a high-speed microcontroller (402) in the MCU, and collecting the preset time according to the filtering algorithm; sending the collected preset time to a low-speed microcontroller (401) in the MCU through the high-speed microcontroller (402), and sending the collected preset time to a delay controller (301) in the CPU through the low-speed microcontroller (401), so that the delay controller (301) determines the preset time for the next discharge according to the received preset time.

[0008] Specifically, the acquisition is used to determine the parameters corresponding to the delay time of each cavity discharge, including: acquiring the temperature of the main oscillation cavity through a temperature collector (601) of the main oscillation cavity in the disturbance variable feedback unit, acquiring the temperature of the power amplifier cavity through a temperature collector (602) of the power amplifier cavity in the disturbance variable feedback unit, acquiring the temperature of the magnetic switch of the main oscillation cavity through a temperature collector (603) of the magnetic switch of the main oscillation cavity in the disturbance variable feedback unit, and acquiring the temperature of the magnetic switch of the power amplifier cavity through a temperature collector (604) of the magnetic switch of the power amplifier cavity in the disturbance variable feedback unit; obtaining the preset charging voltage of the resonant power supply of the main oscillation cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity, so that the collected corresponding temperature and the obtained corresponding charging voltage are used as parameters for the preset time of the next discharge.

[0009] In addition, the method further comprises: after determining the preset time for the next discharge, sending the determined preset time to the low-speed microcontroller (401) in the MCU through the delay controller (301), and then sending it to the high-speed microcontroller (402) through the low-speed microcontroller (401), and controlling the pulse output trigger unit (205) through the high-speed microcontroller (402) to send corresponding pulse signals to the corresponding cavities according to the determined preset time to trigger discharge; the method further comprises: controlling the ignition trigger (302) in the CPU to work through the delay controller (301), so as to provide charging signals to the resonant power supply of the main oscillation cavity and the resonant power supply of the power amplifier cavity respectively through the ignition trigger (302), so as to charge the corresponding resonant power supplies; setting the voltage of the resonant power supply of the main oscillation cavity and the voltage of the resonant power supply of the power amplifier cavity respectively through the delay controller (301); and providing a trigger signal to the MCU through the ignition trigger (302), so that the MCU is initialized according to the trigger signal.

[0010] In addition, the method further comprises: receiving the corresponding temperature collected by the corresponding temperature collector through the low-speed microcontroller (401) in the MCU, and sending the corresponding temperature to the delay controller (301) in the CPU to determine the preset time for the next discharge.

[0011] In addition, the method of collecting the discharge signals corresponding to the zero-crossing points of each cavity comprises: dividing the ultra-high voltage discharge signal of the master cavity and the ultra-high voltage discharge signal of the power amplifier cavity according to the resistor-capacitor voltage dividing circuit through the pulse voltage dividing sampler (501) in the discharge timing feedback unit; sampling the light output signal of the master cavity and the light output signal of the power amplifier cavity through the photoelectric detector (502) in the discharge timing feedback unit; performing impedance transformation on the divided discharge signal and the light output signal of the master cavity through the impedance matching module (503) in the discharge timing feedback unit, and filtering and limiting the transformed corresponding signals through the signal conditioning module (504) in the discharge timing feedback unit, so that the corresponding signals are proportionally attenuated to match the voltage level of the AD conversion module (505) at the subsequent stage; and converting the proportionally attenuated corresponding discharge signals and the light output signals into digital signals that can be processed by the MCU through the AD conversion module (505) in the discharge timing feedback unit, and storing them in the high-speed microcontroller (402), so as to obtain the discharge signals at the zero-crossing points.

[0012] On the other hand, the present invention provides a control device for synchronously controlling a dual-cavity excimer laser, wherein the dual-cavity excimer laser includes a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity discharges, the power amplifier cavity discharges based on the discharge result output by the master cavity; the device includes: a processor and a microcontroller unit; the microcontroller unit is used to: for each discharge process of the dual-cavity excimer laser, collect the corresponding advanced preset time, and collect parameters corresponding to the delay time for determining the discharge of each cavity, wherein the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending a discharge signal indicating discharge to the end of the discharge of the corresponding cavity; the processor is used to: determine the preset time for the next discharge according to the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0013] On the other hand, the present invention provides a dual-cavity excimer laser, comprising a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity is discharged, the power amplifier cavity discharges based on the discharge result output by the master cavity; the laser further comprises: a processor and a microcontroller unit; the microcontroller unit is used to: for each discharge process of the dual-cavity excimer laser, collect the corresponding advanced preset time, and collect parameters corresponding to the delay time for determining the discharge of each cavity, wherein the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending a discharge signal indicating discharge to the end of the discharge of the corresponding cavity; the processor is used to: determine the preset time for the next discharge according to the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0014] In the embodiment of the present application, for each discharge process of the dual-cavity excimer laser, the corresponding advanced preset time is collected, and the parameters corresponding to the delay time for determining the discharge of each cavity are collected. The delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity from sending the discharge signal indicating discharge to the end of the discharge of the corresponding cavity; according to the collected preset time, parameters and preset control relationship, the preset time of the next discharge is determined to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge. Since the parameters are used to determine the delay time, the discharge synchronization control with high precision can be performed for the delay time of the dual cavity, and the discharge signal of the dual cavity can be captured and collected in real time to form a fast feedback, so as to achieve the effect of real-time adjustable synchronization delay. It is ensured that the dual-cavity excimer laser can have a discharge timing with small relative jitter under high repetition rate synchronous operation below 6kHz. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic flow chart of a synchronous control method for a dual-cavity excimer laser according to an embodiment of the present application;

[0017] Figure 2 A schematic diagram of a control system according to an embodiment of the present application;

[0018] Figure 3 A schematic diagram of a CPU main control unit according to an embodiment of the present application;

[0019] Figure 4 A schematic diagram of an MCU microcontroller unit according to an embodiment of the present application;

[0020] Figure 5 Schematic diagram of a discharge timing feedback unit according to an embodiment of the present application;

[0021] Figure 6 A schematic diagram of a disturbance variable feedback unit according to an embodiment of the present application;

[0022] Figure 7 Schematic diagram of the framework of the synchronization control device of the dual-cavity excimer laser according to an embodiment of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] like Figure 1 As shown, the present application provides a synchronization control method for a dual-cavity excimer laser, wherein the dual-cavity excimer laser includes a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity discharges, the power amplifier cavity discharges based on the discharge result output by the master cavity; the method 100 includes:

[0025] 101: For each discharge process of the dual-cavity excimer laser, the corresponding advanced preset time is collected, and the parameters corresponding to the delay time for determining the discharge of each cavity are collected.

[0026] The delay time refers to the delay time from the time when the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sends a discharge signal indicating discharge to the time when the discharge of the corresponding cavity ends.

[0027] 102: Determine the preset time of the next discharge according to the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0028] It should be noted that the master cavity can also be called the MO cavity, and the power amplifier cavity can also be called the PA cavity. The discharge duration of each cavity is extremely short, which is 20ns to 40ns nanoseconds respectively. In order for the dual-cavity excimer laser to work correctly, the dual cavity requires that the MO cavity discharges 20 to 40ns ahead of the PA cavity in the working timing, and the discharge timing of the two cavities needs to remain synchronized and stable within this range. The seed beam of the master cavity (MO cavity) must pass through its discharge area during the period when the particle number of the power amplifier cavity (PA cavity) is reversed in order to form amplification. The laser in the embodiment of the present application operates at a pulse frequency of less than 6 kHz, that is, each pulse of this frequency triggers the discharge of the two cavities once, and thus, the laser is pulsed approximately every 167us microseconds.

[0029] In order to achieve high-precision advanced synchronous discharge of the dual-cavity, it is necessary to control the discharge timing of the two discharge cavities (i.e., the main oscillator cavity and the power amplifier cavity) more accurately. However, the traditional dual-cavity advanced synchronous discharge control accuracy is poor, and there is a long inherent delay, which will lead to continuous occasional dual-cavity asynchronous phenomenon. As the dual-cavity excimer laser has higher requirements for the response speed and synchronization delay accuracy of the dual-cavity synchronous discharge, the embodiment of the present application can synchronously control the dual-cavity discharge with faster feedback, high precision and low jitter.

[0030] The execution subject of the method 100 may be a control device or a control system deployed in the control device. The control device may be a terminal with computing functions, such as a laser.

[0031] The following is a detailed description of the above steps:

[0032] 101: For each discharge process of the dual-cavity excimer laser, the corresponding advanced preset time is collected, and the parameters corresponding to the delay time for determining the discharge of each cavity are collected.

[0033] Among them, the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending a discharge signal indicating discharge to the end of discharge in the corresponding cavity. Among them, the power switch device can be an IGBT (Insulated Gate Bipolar Transistor), a thyristor, and a MOS (short for MOSFET, Metal-Oxide-Semiconductor Field-Effect Transistor, Metal-Oxide Semiconductor Field-Effect Transistor, abbreviated as MOSFET), etc. For example, the IGBT (Insulated Gate Bipolar Transistor) in the solid-state switch magnetic pulse boost power supply MO corresponding to the cavity of the MO cavity has a delay time of 3us microseconds from triggering a discharge signal to the end of discharge in the cavity, and the IGBT in the solid-state switch magnetic pulse boost power supply PA corresponding to the cavity of the PA cavity has a delay time of 3us microseconds from triggering a discharge signal to the end of discharge in the cavity.

[0034] Among them, the parameters may include the charging voltage of the two-way (i.e., the paths for the two cavities) resonant power supply (i.e., each cavity corresponds to a resonant power supply charging voltage), the temperature of the magnetic pulse compression switch (i.e., the magnetic switch of the main oscillator cavity and the magnetic switch of the power amplifier cavity) and the temperature of the discharge cavity (i.e., the temperature of the main oscillator cavity and the temperature of the power amplifier cavity), etc. As the parameters change, the delay time will also change. Among them, the charging voltage is preset and can be directly obtained without calculation.

[0035] For example, when the laser is working, for each discharge, the current advance preset time and the above-mentioned multiple parameters can be collected through the MCU (Microcontroller Unit) of the control system (it can also be a control device, which will not be described later).

[0036] Specifically, collecting the corresponding advanced preset time includes: collecting the discharge signals of the zero-crossing points corresponding to each cavity, and determining the corresponding preset time between the corresponding discharge signals according to a filtering algorithm as the collected preset time.

[0037] For example, as mentioned above, the laser collects dual-channel V CP The zero-crossing signal of the discharge signal, that is, corresponding to each cavity, collects a zero-crossing discharge signal, which can be a pulse signal. And by using the filtering algorithm, the discharge delay difference corresponding to this pulse (that is, the trigger pulse corresponding to the discharge just completed, which can also be understood as the previous pulse), that is, the preset time, can be collected.

[0038] Since the preset time can be collected by MCU, the preset time can be collected by MCU. It should be understood that in addition to MCU, other control function units or devices can also be used for processing, which will not be described in detail.

[0039] Specifically, the method 100 also includes: after collecting the discharge signal, obtaining the discharge signal of the zero-crossing point corresponding to each cavity through the MCU, collecting the preset time according to the filtering algorithm, and sending the collected preset time to the CPU through the MCU to complete the collection of the preset time.

[0040] For example, continuing from the above, Figure 2 As shown, after the discharge signal is collected, the dual-channel V CP The zero-crossing signal of the discharge signal can be a pulse signal, and according to the filtering algorithm, the preset time is collected to complete the collection of the preset time, and the collected preset time is sent to the CPU (central processing unit, central processing unit), that is, the CPU main control unit 201, through the MCU micro control unit 202, so that the preset time is processed by the CPU main control unit 201 to determine the preset time for the next discharge.

[0041] It should be noted that the CPU main control unit 201 can be used to receive the delay difference between the two discharge signals of the master oscillator cavity (MO cavity) and the power amplifier cavity (PA cavity) obtained by analysis and processing by the MCU micro-control unit 202, that is, the collected preset time, and can also receive the disturbance variable feedback value collected by the MCU micro-control unit 202, and at the same time formulate a synchronous control strategy to set the optimal delay setting value for the next pulse discharge, that is, the determined preset time, and then transmit the optimal delay setting value to the MCU micro-control unit 202.

[0042] Among them, Figure 2 As shown, the MCU microcontroller unit 202 can be used to receive the sampling data of the discharge timing feedback unit 203 and the disturbance variable feedback unit 204, and perform analysis and processing, and upload the analyzed and processed data to the CPU main control unit 201, while receiving the optimal delay setting value of the next pulse discharge issued by the CPU main control unit 201, and providing a dual-channel discharge signal trigger to the pulse output trigger unit 205, namely, the pulse output of the main oscillator cavity and the pulse output of the power amplifier cavity.

[0043] In order to enable the MCU to complete the acquisition more effectively and quickly, the MCU may be further divided, wherein the MCU may include a high-speed microcontroller 402 and a low-speed microcontroller 401 .

[0044] Specifically, the discharge signal of the zero-crossing point corresponding to each cavity is obtained through the MCU, and the preset time is collected according to the filtering algorithm, and the collected preset time is sent to the CPU through the MCU, including: obtaining the discharge signal of the zero-crossing point corresponding to each cavity through the high-speed microcontroller 402 in the MCU, and collecting the preset time according to the filtering algorithm; sending the collected preset time to the low-speed microcontroller 401 through the high-speed microcontroller 402, and sending the collected preset time to the delay controller 301 of the CPU through the low-speed microcontroller 401, so that the delay controller 301 determines the preset time of the next discharge according to the received preset time.

[0045] For example, continuing from the above, Figure 4 As shown, after the above signals are collected, the high-speed microcontroller 402 in the MCU obtains the dual-channel V CPThe zero-crossing signal of the discharge signal (such as the zero-crossing discharge signal of the main oscillator cavity and the zero-crossing discharge signal of the power amplifier cavity) can be a pulse signal. By using a filtering algorithm, the delay difference of the discharge of this pulse, that is, the preset time, can be collected. This preset time is sent to the low-speed microcontroller 401 through SPI (Serial Peripheral Interface) communication or other parallel communication methods. The low-speed microcontroller 401 then transmits the collected preset time (that is, the delay difference) to the CPU through the communication interface EIA-422 or EIA-485. More specifically, it can be the delay controller 301 in the CPU.

[0046] It should be noted that the GPIO (General-purpose input / output) interface flip accuracy of the high-speed microcontroller 402 is less than or equal to 2ns, and its operating main frequency and GPIO interface frequency must meet ≥500MHz. Since the flip accuracy of the GPIO interface must be less than or equal to 2ns, and its operating main frequency and GPIO interface frequency must meet ≥500MHz, it is ensured that the discharge timing relative jitter of the dual-cavity excimer laser can be less than ±3ns when operating synchronously at a high repetition rate of 6kHz, and the adjustment accuracy of the preset time of the two channels is less than or equal to 2ns, which also enables the high-speed microcontroller 402 to achieve high-precision and fast collection of the preset time.

[0047] In addition, the high-speed microcontroller 402 mainly performs two steps: obtaining the dual-path V CP The zero-crossing signal of the discharge signal and the use of a filtering algorithm can collect the delay difference of the discharge of this pulse, so that the high-speed microcontroller 402 can quickly collect the delay difference.

[0048] It should also be noted that, according to the foregoing, since the MCU can include a high-speed microcontroller 402 and a low-speed microcontroller 401, the high-speed microcontroller 402 and the low-speed microcontroller 401 are independently decoupled to perform corresponding tasks. Among them, the high-speed microcontroller 402 can be mainly used to collect the delay difference, without having to perform the tasks of the low-speed microcontroller 401, such as collecting parameters, etc., which can make the high-speed microcontroller 402 more focused on collecting delays and improve the collection rate.

[0049] The process of collecting the above discharge signal is as follows: the discharge signal can be collected through a discharge timing feedback unit.

[0050] Among them, Figure 2 As shown, the discharge timing feedback unit 203 collects the discharge signals of the MO cavity and the PA cavity, as well as the light output signals of the two paths, and adjusts the two paths V CPThe discharge signal is captured at the zero-crossing point and fed back to the MCU micro control unit 202 .

[0051] Specifically, the discharge signals of the zero-crossing points corresponding to each cavity are collected, including: dividing the ultra-high voltage discharge signal of the main oscillator cavity and the ultra-high voltage discharge signal of the power amplifier cavity according to the resistor-capacitor voltage-dividing circuit through the pulse voltage-dividing sampler 501 in the discharge timing feedback unit 203; sampling the light-emitting signal of the main oscillator cavity and the light-emitting signal of the power amplifier cavity through the photodetector 502 in the discharge timing feedback unit 203; performing impedance transformation on the divided discharge signal and the light-emitting signal of the main oscillator cavity through the impedance matching module 503 in the discharge timing feedback unit 203, and filtering and limiting the transformed corresponding signals through the signal conditioning module 504 in the discharge timing feedback unit 203, so that the corresponding signals are proportionally attenuated to match the voltage level of the AD conversion module 505 of the subsequent stage; converting the proportionally attenuated corresponding discharge signals and the light-emitting signals into digital signals that can be processed by the MCU through the AD conversion module 505 in the discharge timing feedback unit, and storing them in the high-speed microcontroller 402, so as to obtain the discharge signals of the zero-crossing points.

[0052] For example, as mentioned above, the discharge signal is collected by the discharge timing feedback unit 203. Figure 5 As shown, the discharge timing feedback unit 203 includes a pulse voltage divider sampler 501, a photodetector 502, an impedance matching module 503, a signal conditioning module 504, and an AD (analogue-to-digital conversion) conversion module 505, which can also be called a high-speed AD conversion module.

[0053] The pulse voltage divider sampler 501 can convert the peak 20kV kV MO cavity and PA cavity discharge signal MO V CP , P A V CP(i.e., the discharge signal of the main oscillator cavity and the discharge signal of the power amplifier cavity) is divided into several tens of volts, wherein waveform A506 is the waveform of the discharge signal. The photodetector 502 simultaneously samples and captures the light output signals of the gas in the MO cavity and the PA cavity (i.e., the light output signal of the main oscillator cavity and the light output signal of the power amplifier cavity), wherein waveform B507 is the waveform of the light output signal. Since the discharge signal and the light output signal are both nanosecond pulse signals, the sampled and captured discharge signal and the light output signal need to be potential-shifted and impedance-transformed by the impedance matching module 503 to improve the signal-to-noise ratio, prevent the signal from being greatly attenuated, and ensure the signal integrity. The signal conditioning module 504 is used to filter and limit the transformed discharge signal and the light output signal to achieve proportional attenuation of the signal to match the voltage level of the AD conversion circuit in the post-stage AD conversion module 505. The AD conversion module 505 is used to convert the proportionally attenuated discharge signal and the light output signal into digital signals that can be processed by the MCU micro-control unit 202, and store them in the high-speed microcontroller 402. The sampled signal here is a nanosecond pulse signal, and the pulse rise time is less than 60ns. In order to accurately capture the zero-crossing point of the pulse signal, the sampling rate of the AD conversion module 505 must at least meet 500MSPS (Million Samples per Second), that is, 2ns / step.

[0054] It should be noted that the pulse voltage divider sampler 501 can convert the peak ultra-high voltage such as the 20kV kV MO cavity and PA cavity discharge signal MO V CP , P A V CP The voltage of the main oscillator cavity and the power amplifier cavity (i.e., the discharge signal) is divided into several tens of volts, thereby enabling fast and accurate sampling of the voltage signal in the ultra-high voltage environment of 20 kilovolts.

[0055] In addition, through the pulse voltage divider sampler 501, the photodetector 502, the impedance matching module 503, the signal conditioning module 504, and the AD (analogue-to-digital conversion) conversion module 505 in the discharge timing feedback unit 203, the sampled signal can be a nanosecond pulse signal, and the pulse rise time is less than 60ns, so that the embodiment of the present application can collect ultra-high voltage narrow pulse signals. At the same time, the sampling rate of the AD conversion module 505 must at least meet 500MSPS (Million Samples per Second), that is, 2ns / step (nanoseconds / step), so that the zero crossing point of the pulse signal can be accurately captured later.

[0056] And since the embodiment of the present application discharges at a frequency of 6 kHz, according to the foregoing, it can be known that it is triggered approximately every 167 us, and the embodiment of the present application can collect a 60 ns narrow pulse signal from 167 us, and it is necessary to collect every 2 ns therein, and a frequency of 500 MHz is required for collection, which means that the collection speed is extremely fast and the collection accuracy is also very high.

[0057] Therefore, the embodiment of the present application can realize high-precision synchronous control of delayed discharge of the dual cavity, can capture and collect the steep pulse signal of 10,000 volts high voltage nanosecond level of the dual cavity in real time, form fast feedback, and make the synchronous delay of pulse frequency below 6kHz adjustable in real time. It is ensured that the relative jitter of the discharge timing of the dual cavity excimer laser in synchronous operation at a high repetition rate of 6kHz is less than ±3ns.

[0058] The above parameter collection process can be performed through the disturbance variable feedback unit 204. Figure 2 As shown, the disturbance variable feedback unit 204 collects multiple status signals and feeds back the monitoring of multiple temperature states to the MCU micro control unit 202.

[0059] Specifically, the parameters corresponding to the delay time for determining the discharge of each cavity are collected, including: collecting the temperature of the main oscillation cavity through the temperature collector 601 of the main oscillation cavity in the disturbance variable feedback unit 204, collecting the temperature of the power amplifier cavity through the temperature collector 602 of the power amplifier cavity in the disturbance variable feedback unit 204, collecting the temperature of the magnetic switch of the main oscillation cavity through the temperature collector 603 of the magnetic switch of the main oscillation cavity in the disturbance variable feedback unit 204, and collecting the temperature of the magnetic switch of the power amplifier cavity through the temperature collector 604 of the magnetic switch of the power amplifier cavity in the disturbance variable feedback unit 204.

[0060] For example, continuing from the above, Figure 6 As shown, the disturbance variable feedback unit 204 includes a temperature collector 601 of the main oscillating cavity (i.e., MO cavity), a temperature collector 602 of the power amplifier cavity (PA cavity), a temperature collector 603 of the magnetic switch of the main oscillating cavity (i.e., MO magnetic switch), and a temperature collector 604 of the magnetic switch of the power amplifier cavity (i.e., PA magnetic switch). The temperature is collected by the above-mentioned temperature collectors. Among them, the temperature collector 601 of the main oscillating cavity (i.e., MO cavity) and the temperature collector 602 of the power amplifier cavity use a temperature-sensitive current source to convert the collected temperatures of the dual cavities into current signals, and then through precision resistors, convert them into voltage values ​​that can be recognized by the low-speed microcontroller 401 in the MCU. The above-mentioned MO magnetic switch and PA magnetic switch are high-voltage environments of 20kV level, and ordinary temperature sensors cannot meet the insulation withstand voltage requirements. Here, an optical fiber temperature sensor is used for temperature sampling, and then sent to a low-speed microcontroller.

[0061] Among them, Figure 4 As shown, the collected temperature is fed back as a parameter to the low-speed microcontroller 401. After receiving these parameters, the low-speed microcontroller 401 sends the parameters to the delay controller 301.

[0062] Specifically, the method 100 further includes: receiving the corresponding temperature collected by the corresponding temperature collector through the low-speed microcontroller 401 in the MCU, and sending the corresponding temperature to the delay controller 301 in the CPU, with a preset time for the next discharge.

[0063] The preset time sent by the delay controller is received by the low-speed microcontroller 401, and the preset time is sent to the high-speed microcontroller 402 in the MCU, so that the pulse output trigger unit 205 is controlled by the high-speed microcontroller 402 to output the corresponding pulse signal to the corresponding cavity according to the determined preset time.

[0064] For example, continuing from the above, Figure 4 As shown, the low-speed microcontroller 401 is used to collect feedback signals of low-frequency disturbances of each channel through disturbance feedback, including the temperature of the MO cavity, the temperature of the PA cavity, the temperature of the MO magnetic switch, the temperature of the PA magnetic switch, and the slow variable of the 4-channel temperature. For each pulse discharge, the disturbance values ​​of the above 4 channels are transmitted to the delay controller 301 in the CPU main control unit 201 through the communication interface EIA-422 or EIA-485. At the same time, the optimal delay setting value of the next pulse discharge given by the delay controller 301, that is, the preset time (that is, the optimal delay setting performed by the delay controller 301), is received and sent to the high-speed microcontroller 402 through SPI communication or other parallel communication methods, and the pulse output trigger unit 205 is controlled to provide a dual-channel discharge high-precision trigger signal to the two channels corresponding to the MO and PA cavities, so as to realize the trigger discharge of the main oscillator cavity and the trigger discharge of the power amplifier cavity.

[0065] 102: Determine the preset time of the next discharge according to the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0066] The preset control relationship may be control implemented by a preset PID control algorithm, or may be implemented by a preset neural network model, etc.

[0067] In addition to the corresponding temperature, the above parameters also include the charging voltage of the resonant power supply of the main oscillator cavity and the charging voltage of the resonant power supply of the power amplifier cavity. Therefore, specifically, collecting the parameters corresponding to the delay time for determining the discharge of each cavity can also include: obtaining the preset charging voltage of the resonant power supply of the main oscillator cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity, so that the collected corresponding temperature and the obtained corresponding charging voltage are used as parameters for the preset time of the next discharge.

[0068] Since the charging voltage is preset, it can be directly determined by a set value, and the charging voltage can be directly fed back to the CPU main control unit 201 by the MCU micro control unit 202, or the CPU main control unit 201 can directly obtain the charging voltage.

[0069] For example, continuing from the above, Figure 3 As shown, the delay controller 301 sets the optimal delay, i.e., the preset time, for the next pulse discharge according to the delay difference, i.e., the preset time, of the discharge signals of the two paths fed back by the feedback sampling, and the feedback amount of each disturbance (i.e., the delay difference + the feedback amount). The main difficulty in closed-loop control of dual-cavity discharge is the 3us delay between the triggering and cavity discharge of the power switching devices, such as IGBT, in the solid-state switch magnetic pulse boost power supply MO and the solid-state switch magnetic pulse boost power supply PA. This delay will vary greatly with the size of the charging voltage of the two-path resonant power supply, the temperature of the magnetic pulse compression switch (i.e., the temperature of the magnetic switch), and the temperature of the discharge cavity. Therefore, the delay controller 301 is used to establish the relationship between the delay difference t0 (i.e., the preset time to be determined) of the two paths and the charging voltage VC0, the temperature T1 of the magnetic switch, and the temperature T2 of the discharge cavity according to the established synchronous control algorithm, i.e., the control relationship, i.e., t0=y(VC0, T1, T2).

[0070] Based on this, the above control relationship can also be transformed as follows, so that t0 has a control relationship with the above parameters VC0, T1 or T2, that is, t0=y(VC0), t0=y(VC0, T1), or t0=y(VC0, T2), etc.

[0071] It should be noted that the charging voltage VC0, the temperature T1 of the magnetic switch, and the temperature T2 of the discharge cavity involved here are for the main oscillator cavity and the power amplifier cavity respectively, that is, each cavity has a charging voltage VC0, a temperature T1 of the magnetic switch, and a temperature T2 of the discharge cavity. All need to be considered. At the same time, the preset time collected can be t1, which is related to the control relationship y and can be input into y. Thus, the final preset time can be obtained.

[0072] In addition, the temperature T1 of the magnetic switch and the temperature T2 of the discharge cavity have a cumulative effect with time t. The speed of temperature rise is affected by the discharge frequency f and the discharge duty cycle D of the dual-cavity excimer laser. Therefore, a relationship t0=y(VC0, t, f, D) can also be established. Based on the established synchronous control algorithm, the optimal delay for each pulse discharge is given.

[0073] Based on this, the above-mentioned control relationship t0=y(VC0, t, f, D) can also be transformed as follows, so that t0 has a control relationship with the above-mentioned parameters VC0, t, f or D, that is, t0=y(VC0), t0=y(VC0, t), t0=y(VC0, t, f), t0=y(VC0, f), t0=y(VC0, D), or t0=y(VC0, t, D), etc., and will not be repeated here.

[0074] In the relationship t0=y(VC0, t, f, D), the collected preset time may also be t1, which is also related to the control relationship y and can be input into y. Thus, the final preset time can be obtained.

[0075] It should also be noted that the method 100 also includes: controlling the ignition trigger 302 in the CPU to work through the delay controller 301, so as to provide charging signals to the resonant power supply of the main oscillator cavity and the resonant power supply of the power amplifier cavity respectively through the ignition trigger 302, so as to charge the corresponding resonant power supplies; setting the voltage of the resonant power supply of the main oscillator cavity and the voltage of the resonant power supply of the power amplifier cavity respectively through the delay controller 301; providing a trigger signal to the MCU through the ignition trigger 302, so that the MCU is initialized according to the trigger signal.

[0076] like Figure 3 As shown, the CPU main control unit 201 also includes an ignition trigger 302, and the delay controller 301 is used to control the ignition trigger 302 to work. The ignition trigger 302 is used to provide an ignition trigger signal to the resonant power supply of the main oscillator cavity (i.e., the resonant power supply MO), the resonant power supply of the power amplifier cavity (i.e., the resonant power supply PA) and the MCU micro-control unit, that is, to provide a charging signal and a trigger signal respectively. The ignition trigger 302 simultaneously outputs three TTL (Transistor-Transistor Logic, transistor-transistor logic) narrow pulse trigger signals, and specifically, a strictly equal-length 50Ω impedance coaxial cable can be used to provide a charging signal to the resonant power supply MO, i.e., the power supply MO304, and the resonant power supply PA, i.e., the power supply PA303, and at the same time provide an initialization enable signal, i.e., a trigger signal, to the MCU micro-control unit 202, so that the MCU micro-control unit 202 is initialized before each discharge and the corresponding resonant power supply is charged.

[0077] In addition, the delay controller 301 can also set the voltage of the power supply MO304 and the power supply PA303.

[0078] Continuing from the above, the delay controller 301 in the CPU main control unit 201 determines the preset time of the next pulse, that is, the advanced preset time between the corresponding pulse signals of the two cavities, and triggers the output of the pulse through the pulse output trigger unit 205, so that the two cavities discharge successively according to the preset time.

[0079] The method 100 further includes: after determining the preset time for the next discharge, sending corresponding pulse signals to corresponding cavities to trigger the discharge according to the determined preset time.

[0080] For example, as mentioned above, the delay controller 301 in the CPU main control unit 201 can determine t0, i.e., the preset time, based on the above parameters collected later, such as the corresponding temperature and the corresponding charging voltage. The determined preset time is sent to the low-speed microcontroller 401 in the MCU microcontroller unit 202, and then sent to the high-speed microcontroller 402. Then, the high-speed microcontroller 402 controls the pulse output trigger unit 205 to trigger the pulse signal according to the preset time, so as to realize the discharge of the main oscillator cavity ahead of the power amplifier cavity by the preset time. Among them, the pulse output trigger unit 205 can be used to realize the nanosecond delay adjustment of the dual-channel trigger signal.

[0081] It should be noted that, according to the foregoing, since the embodiments of the present application can achieve high-precision signal sampling, the triggering of high-precision and low-jitter discharge timing can be achieved through the above-mentioned pulse output trigger unit 205, so that the relative jitter of the dual-cavity discharge timing is less than ±3ns.

[0082] Therefore, the embodiment of the present application can realize high-precision and low-jitter synchronous control of the dual-path trigger pulse of the excimer laser and realize the rapid feedback function of the dual-path discharge signal. The control system of the embodiment of the present application is in a strong electromagnetic interference environment of high voltage, high current, and narrow pulse, and the high-precision synchronous control method therein realizes nanosecond delay control of the dual-path pulse, ensuring that the system itself has strong anti-electromagnetic interference capability, and at the same time has the characteristics of nanosecond low delay jitter and nanosecond high-precision adjustment.

[0083] The embodiment of the present application also provides a synchronous control device for a dual-cavity excimer laser, which can be applied to a dual-cavity excimer laser in a laser, etc. The dual-cavity excimer laser includes a master cavity and a power amplifier cavity, and the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity discharges, the power amplifier cavity discharges based on the discharge result output by the master cavity. Figure 7 As shown, the device 700 includes:

[0084] The acquisition module 701 is used to acquire the corresponding advanced preset time for each discharge process of the dual-cavity excimer laser, and to acquire the parameters corresponding to the delay time for determining the discharge of each cavity.

[0085] The delay time refers to the delay time from the time when the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sends a discharge signal indicating discharge to the time when the discharge of the corresponding cavity ends.

[0086] The determination module 702 is used to determine the preset time of the next discharge according to the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0087] Specifically, the acquisition module 701 is specifically used to: acquire the discharge signals of the zero-crossing points corresponding to each cavity, and determine the corresponding preset time between the corresponding discharge signals according to the filtering algorithm as the acquired preset time.

[0088] In addition, the device 700 also includes: an acquisition module, which is used to acquire the discharge signal of the zero-crossing point corresponding to each cavity through the MCU after the discharge signal is collected, so as to collect the preset time according to the filtering algorithm, and send the collected preset time to the CPU through the MCU to complete the collection of the preset time.

[0089] Specifically, the acquisition module includes: a first acquisition unit, which is used to obtain the discharge signal of the zero-crossing point corresponding to each cavity through the high-speed microcontroller in the MCU, and collect the preset time according to the filtering algorithm; a determination unit, which is used to send the collected preset time to the low-speed microcontroller in the MCU through the high-speed microcontroller, and send the collected preset time to the delay controller in the CPU through the low-speed microcontroller, so that the delay controller determines the preset time of the next discharge according to the received preset time.

[0090] Specifically, the acquisition module 701 includes: an acquisition unit, which is used to acquire the temperature of the main oscillation cavity through the temperature collector of the main oscillation cavity in the disturbance variable feedback unit, acquire the temperature of the power amplifier cavity through the temperature collector of the power amplifier cavity in the disturbance variable feedback unit, acquire the temperature of the magnetic switch of the main oscillation cavity through the temperature collector of the magnetic switch of the main oscillation cavity in the disturbance variable feedback unit, and acquire the temperature of the magnetic switch of the power amplifier cavity through the temperature collector of the magnetic switch of the power amplifier cavity in the disturbance variable feedback unit; a second acquisition unit, which is used to acquire the preset charging voltage of the resonant power supply of the main oscillation cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity, so that the corresponding temperature acquired and the corresponding charging voltage acquired are used as parameters for the preset time of the next discharge.

[0091] In addition, the determination module 702 is also used to: after determining the preset time for the next discharge, send the determined preset time to the low-speed microcontroller in the MCU through the delay controller in the CPU, and then send it to the high-speed microcontroller through the low-speed microcontroller, and control the pulse output trigger unit through the high-speed microcontroller to send corresponding pulse signals to the corresponding cavity according to the determined preset time to trigger discharge; the device 700 also includes: a control module, which is used to control the ignition trigger in the CPU to work through the delay controller, so as to provide charging signals to the resonant power supply of the main oscillation cavity and the resonant power supply of the power amplifier cavity respectively through the ignition trigger, so as to charge the corresponding resonant power supply; a setting module, which is used to set the voltage of the resonant power supply of the main oscillation cavity and the voltage of the resonant power supply of the power amplifier cavity respectively through the delay controller; and a providing module, which is used to provide a trigger signal to the MCU through the ignition trigger, so that the MCU is initialized according to the trigger signal.

[0092] In addition, the acquisition module 701 is also used to: receive the corresponding temperature collected by the corresponding temperature collector through the low-speed microcontroller in the MCU, and send the corresponding temperature to the delay controller in the CPU to determine the preset time for the next discharge.

[0093] Specifically, the acquisition module 701 includes: a voltage division unit, which is used to divide the ultra-high voltage discharge signal of the main oscillator cavity and the ultra-high voltage discharge signal of the power amplifier cavity according to the resistor-capacitor voltage division circuit through the pulse voltage division sampler in the discharge timing feedback unit; the acquisition unit is also used to sample the light output signal of the main oscillator cavity and the light output signal of the power amplifier cavity through the photodetector in the discharge timing feedback unit; a processing unit, which is used to perform impedance transformation on the voltage-divided discharge signal and the light output signal of the main oscillator cavity through the impedance matching module in the discharge timing feedback unit, and filter and limit the transformed corresponding signal through the signal conditioning module in the discharge timing feedback unit, so that the corresponding signal is proportionally attenuated to match the voltage level of the AD conversion module of the subsequent stage; a conversion unit, which is used to convert the proportionally attenuated corresponding discharge signal and the light output signal into a digital signal that can be processed by the MCU through the AD conversion module in the discharge timing feedback unit, and store it in the high-speed microcontroller to obtain the discharge signal crossing the zero point.

[0094] As the specific implementation method of the device 700 can be found in the above description, it will not be described here in detail.

[0095] The embodiment of the present application also provides a control device for synchronously controlling a dual-cavity excimer laser, wherein the dual-cavity excimer laser includes a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity is discharged, the power amplifier cavity discharges based on the discharge result output by the master cavity; the device includes: a processor and a microcontroller unit; the microcontroller unit is used to: for each discharge process of the dual-cavity excimer laser, collect the corresponding advanced preset time, and collect parameters corresponding to the delay time for determining the discharge of each cavity, the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending a discharge signal indicating discharge to the end of the discharge of the corresponding cavity; the processor is used to: determine the preset time for the next discharge based on the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0096] This may also be a control system for synchronously controlling a dual-cavity excimer laser, wherein the dual-cavity excimer laser includes a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity is discharged, the power amplifier cavity discharges based on the discharge result output by the master cavity; the device includes: a processor and a microcontroller unit; the microcontroller unit is used to: for each discharge process of the dual-cavity excimer laser, collect the corresponding advanced preset time, and collect the parameters corresponding to the delay time for determining the discharge of each cavity, the delay time refers to the delay time from the sending of the discharge signal indicating discharge to the end of the discharge of the corresponding cavity by the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity; the processor is used to: determine the preset time for the next discharge according to the collected preset time parameters and the preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0097] Among them, the control system or control device may include a CPU main control unit (i.e., a processor), an MCU microcontroller unit (i.e., a microcontroller unit), and may also include: a discharge timing feedback unit, a disturbance variable feedback unit, and a pulse output trigger unit. Among them, the CPU main control unit is used to receive the discharge signal delay difference of the master oscillator cavity (MO cavity) and the power amplifier cavity (PA cavity) obtained by the analysis and processing of the MCU microcontroller unit, that is, the preset time, and the disturbance variable feedback value, that is, the above parameters, formulate a synchronous control strategy, set the optimal delay setting value for the next pulse discharge, that is, the preset time, and transmit the optimal delay setting value to the MCU microcontroller unit. The MCU microcontroller unit is used to receive the sampled data of the discharge timing feedback unit and the disturbance variable feedback unit, analyze and process, upload the data to the CPU main control unit, and receive the optimal delay setting value for the next pulse discharge of the CPU at the same time, and provide a trigger for the discharge signal to the MO cavity and the PA cavity. The discharge timing feedback unit is used to sample the discharge signal of the MO cavity and the PA cavity, and the light output signal, and adjust the dual-channel V CP The zero-crossing point is captured and fed back to the MCU microcontroller unit. The disturbance variable feedback unit collects multi-channel state signals to form multi-point temperature state monitoring (i.e. the corresponding temperature mentioned above) and feeds back to the MCU microcontroller unit. The pulse output trigger unit is used to realize nanosecond delay adjustment of dual-channel trigger signals.

[0098] The CPU main control unit may include a delay controller and an ignition trigger. The delay controller sets the optimal delay of the next pulse discharge, i.e., the preset time, according to the delay difference of the discharge signals of the two paths, i.e., the preset time and each disturbance feedback amount. The ignition trigger is used to provide an ignition trigger signal to the resonant power supply MO, the resonant power supply PA and the MCU microcontroller unit.

[0099] The MCU microcontroller unit may include a high-speed microcontroller and a low-speed microcontroller. The high-speed microcontroller generates a signal based on the collected dual-channel V CP The zero-crossing signal is filtered by a filtering algorithm to obtain the delay difference of the previous pulse discharge, i.e. the preset time, and at the same time receive the optimal delay setting value of the next pulse discharge transmitted to the low-speed microcontroller through the CPU main control unit, i.e. the preset time, and provide a dual-channel high-precision discharge trigger signal to the MO cavity and the PA cavity. The low-speed microcontroller is used for the collection and processing of various disturbance variable feedback signals, as well as the direct signal transmission between the CPU main control unit and the MCU microcontroller.

[0100] The discharge timing feedback unit includes a pulse voltage divider sampler, a photodetector, an impedance matching module, a signal conditioning module, and an AD conversion module. The pulse voltage divider sampler is used to measure the discharge signal MO V of the MO cavity and the PA cavity. CP , P A V CPThe 10,000-volt high-voltage nanosecond-level steep pulse is sampled. The photodetector is used to sample and capture the light output signal of the gas in the MO cavity and the PA cavity. The impedance matching module is used to transform the impedance of the sampled signal to improve the signal-to-noise ratio. The signal conditioning module is used to filter and limit the sampled signal to achieve proportional attenuation of the signal. The AD conversion module converts the sampled signal into a digital signal that can be processed by the MCU microcontroller unit and stores it in the high-speed microcontroller.

[0101] The disturbance variable feedback unit includes a temperature collector of the MO cavity, a temperature collector of the PA cavity, a temperature collector of the MO magnetic switch, and a temperature collector of the PA magnetic switch.

[0102] I will not go into details here. For any details that are not detailed, please refer to the previous content.

[0103] The embodiment of the present application also provides a dual-cavity excimer laser, including a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a preset time, so that after the master cavity is discharged, the power amplifier cavity discharges based on the discharge result output by the master cavity; the laser also includes: a processor and a microcontroller unit; the microcontroller unit is used to: for each discharge process of the dual-cavity excimer laser, collect the corresponding advanced preset time, and collect parameters corresponding to the delay time for determining the discharge of each cavity, wherein the delay time refers to the delay time from the sending of the discharge signal indicating discharge to the end of the discharge of the corresponding cavity by the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity; the processor is used to: determine the preset time for the next discharge according to the collected preset time, parameters and preset control relationship, so as to determine the corresponding preset time between the corresponding discharge signals of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge.

[0104] I will not go into details here. For any details that are not detailed, please refer to the previous content.

[0105] It should be understood that the specific order or hierarchy of steps in the disclosed process is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process can be rearranged without departing from the scope of protection of the present disclosure. The attached method claims present the elements of the various steps in an exemplary order and are not intended to be limited to the specific order or hierarchy described.

[0106] In order to make the description of the present disclosure more detailed and complete, the above description is provided for the implementation and specific embodiments of the present invention; however, this is not the only form of implementing or using the specific embodiments of the present invention. The implementation covers the features of multiple specific embodiments and the method steps and sequences used to construct and operate these specific embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences.

[0107] In the above detailed description, various features are grouped together in a single embodiment to simplify the disclosure. This method of disclosure should not be interpreted as reflecting an intention that the embodiments of the claimed subject matter require more features than are clearly stated in each claim. On the contrary, as reflected in the appended claims, the invention is in a state of having less than all the features of the disclosed individual embodiments. Therefore, the appended claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the invention.

[0108] The disclosed embodiments are described above to enable any person skilled in the art to implement or use the present invention. Various modifications of these embodiments are obvious to those skilled in the art, and the general principles defined herein may also be applied to other embodiments without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure is not limited to the embodiments given herein, but is consistent with the broadest scope of the principles and novel features disclosed in this application.

[0109] The above description includes examples of one or more embodiments. Of course, it is impossible to describe all possible combinations of components or methods for the purpose of describing the above embodiments, but it should be recognized by those skilled in the art that the various embodiments may be further combined and arranged. Therefore, the embodiments described herein are intended to cover all such changes, modifications and variations that fall within the scope of protection of the appended claims. In addition, with respect to the term "comprising" used in the specification or claims, the word is covered in a manner similar to the term "including", just as "including," is explained as a transitional word in the claims. In addition, any term "or" used in the specification of the claims is intended to mean "non-exclusive or".

[0110] Those skilled in the art may also understand that the various illustrative logical blocks, units, and steps listed in the embodiments of the present invention may be implemented by electronic hardware, computer software, or a combination of the two. In order to clearly demonstrate the interchangeability of hardware and software, the various illustrative components, units, and steps described above have generally described their functions. Whether such functions are implemented by hardware or software depends on the specific application and the design requirements of the entire system. Those skilled in the art may use various methods to implement the described functions for each specific application, but such implementation should not be understood as exceeding the scope of protection of the embodiments of the present invention.

[0111] The various illustrative logic blocks or units described in the embodiments of the present invention can be implemented or operated by a general-purpose processor, a digital signal processor, an application-specific integrated circuit (ASIC), a field programmable gate array or other programmable logic device, a discrete gate or transistor logic, a discrete hardware component, or any combination of the above. The general-purpose processor can be a microprocessor, and optionally, the general-purpose processor can also be any conventional processor, controller, microcontroller or state machine. The processor can also be implemented by a combination of computing devices, such as a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors combined with a digital signal processor core, or any other similar configuration.

[0112] The steps of the method or algorithm described in the embodiments of the present invention can be directly embedded in hardware, a software module executed by a processor, or a combination of the two. The software module can be stored in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or other storage media of any form in the art. Exemplarily, the storage medium can be connected to the processor so that the processor can read information from the storage medium and can write information to the storage medium. Optionally, the storage medium can also be integrated into the processor. The processor and the storage medium can be arranged in an ASIC, and the ASIC can be arranged in a user terminal. Optionally, the processor and the storage medium can also be arranged in different components in the user terminal.

[0113] In one or more exemplary designs, the above functions described in the embodiments of the present invention can be implemented in hardware, software, firmware or any combination of the three. If implemented in software, these functions can be stored on a computer-readable medium, or transmitted in the form of one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media that facilitate the transfer of computer programs from one place to another. The storage medium can be any available medium that can be accessed by any general or special computer. For example, such computer-readable media can include but are not limited to RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store program codes in the form of instructions or data structures and other forms that can be read by general or special computers, or general or special processors. In addition, any connection can be appropriately defined as a computer-readable medium, for example, if the software is transmitted from a website site, server or other remote resource through a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL) or wirelessly, such as infrared, wireless and microwave, it is also included in the defined computer-readable medium. The disk and disc include compact disk, laser disk, optical disk, DVD, floppy disk and blue-ray disk. Disks usually copy data magnetically, while discs usually copy data optically with lasers. The above combination can also be included in computer readable media.

[0114] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A synchronous control method for a dual-cavity excimer laser, characterized in that: The dual-cavity excimer laser comprises a master cavity and a power amplifier cavity, wherein the master cavity discharges ahead of the power amplifier cavity by a time delay difference, so that after the master cavity discharges, the power amplifier cavity discharges based on the discharge result output by the master cavity; The laser operates at a pulse frequency of less than 6 kHz, and the method comprises: For each discharge process of the dual-cavity excimer laser, the corresponding advanced delay difference is collected, and the parameters corresponding to the delay time for determining the discharge of each cavity are collected. The delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending the discharge signal indicating discharge to the end of the discharge of the corresponding cavity; According to the collected delay difference, parameters and preset control relationship, the optimal delay setting value for the next discharge is determined, so as to determine the optimal delay setting value corresponding to the discharge signal of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge; The optimal delay setting value for the next discharge is determined according to the collected delay difference, parameters and preset control relationship, wherein the parameters include: obtaining the preset charging voltage of the resonant power supply of the main oscillator cavity, the preset charging voltage of the resonant power supply of the power amplifier cavity, the magnetic switch temperature and the discharge cavity temperature, so that the collected corresponding temperature and the obtained corresponding charging voltage are used as parameters and input into the control relationship together with the delay difference to determine the optimal delay setting value for the next discharge; The control relationship is determined by establishing the relationship between the optimal delay setting value t0 of the dual-path and the charging voltage VC0, the magnetic switch temperature T1, and the discharge chamber temperature T2, t0=y(VC0, T1, T2), and the charging voltage VC0 includes the preset charging voltage of the resonant power supply of the resonant cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity.

2. The method according to claim 1, characterized in that The advanced delay difference corresponding to the acquisition includes: The discharge signals of the zero-crossing points corresponding to each cavity are collected, and the corresponding delay differences between the corresponding discharge signals are determined according to the filtering algorithm as the collected delay differences.

3. The method according to claim 1 or 2, characterized in that: The method further comprises: After the discharge signal is collected, the discharge signal of the zero-crossing point corresponding to each cavity is obtained through the MCU to collect the delay difference according to the filtering algorithm, and the collected delay difference is sent to the CPU through the MCU to complete the collection of the delay difference.

4. The method according to claim 3, characterized in that The method of obtaining the discharge signal of the zero-crossing point corresponding to each cavity through the MCU to collect the delay difference according to the filtering algorithm, and sending the collected delay difference to the CPU through the MCU includes: Obtaining the discharge signal of the zero-crossing point corresponding to each cavity through a high-speed microcontroller (402) in the MCU, and collecting the delay difference according to a filtering algorithm; The collected delay difference is sent to the low-speed microcontroller (401) in the MCU via the high-speed microcontroller (402), and the collected delay difference is sent to the delay controller (301) in the CPU via the low-speed microcontroller (401), so that the delay controller (301) determines the optimal delay setting value for the next discharge according to the received delay difference.

5. The method according to claim 1, characterized in that The acquisition is used to determine the parameters corresponding to the delay time of each cavity discharge, including: The temperature of the main oscillation cavity is collected by the temperature collector of the main oscillation cavity in the disturbance variable feedback unit, the temperature of the power amplification cavity is collected by the temperature collector of the power amplification cavity in the disturbance variable feedback unit, the temperature of the magnetic switch of the main oscillation cavity is collected by the temperature collector of the magnetic switch of the main oscillation cavity in the disturbance variable feedback unit, and the temperature of the magnetic switch of the power amplification cavity is collected by the temperature collector of the magnetic switch of the power amplification cavity in the disturbance variable feedback unit; The preset charging voltage of the resonant power supply of the main oscillator cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity are obtained, so that the collected corresponding temperature and the obtained corresponding charging voltage are used as parameters to determine the optimal delay setting value for the next discharge.

6. The method according to claim 1, characterized in that The method further comprises: After determining the optimal delay setting value for the next discharge, the optimal delay setting value is sent to the low-speed microcontroller (401) in the MCU via the delay controller (301) in the CPU, and then sent to the high-speed microcontroller (402) via the low-speed microcontroller (401), and the pulse output trigger unit (205) is controlled by the high-speed microcontroller (402) to send corresponding pulse signals to corresponding cavities according to the determined optimal delay setting value to trigger discharge; The method further comprises: controlling an ignition trigger (302) in a CPU to work through a delay controller (301), so as to provide charging signals to the resonant power supply of the main oscillator cavity and the resonant power supply of the power amplifier cavity through the ignition trigger (302), so as to charge the corresponding resonant power supplies; The voltage of the resonant power supply of the main oscillator cavity and the voltage of the resonant power supply of the power amplifier cavity are respectively set by a delay controller (301); A trigger signal is provided to the MCU via an ignition trigger (302), so that the MCU is initialized according to the trigger signal.

7. The method according to claim 5, characterized in that The method further comprises: The corresponding temperature collected by the corresponding temperature collector is received by the low-speed microcontroller (401) in the MCU, and the corresponding temperature is sent to the delay controller (301) in the CPU to determine the optimal delay setting value for the next discharge.

8. The method according to claim 2, characterized in that: The collecting of the discharge signals of the zero-crossing points corresponding to each cavity includes: The pulse voltage dividing sampler (501) in the discharge timing feedback unit divides the ultra-high voltage discharge signal of the main oscillator cavity and the ultra-high voltage discharge signal of the power amplifier cavity according to the resistance-capacitance voltage dividing circuit; Sampling the light output signal of the main oscillator cavity and the light output signal of the power amplifier cavity through a photoelectric detector (502) in a discharge timing feedback unit; The impedance matching module (503) in the discharge timing feedback unit performs impedance transformation on the discharge signal and the light output signal after the voltage division of the main oscillator cavity, and the signal conditioning module (504) in the discharge timing feedback unit performs filtering and amplitude limiting on the transformed corresponding signal, so that the corresponding signal is proportionally attenuated to match the voltage level of the AD conversion module (505) at the subsequent stage; The AD conversion module (505) in the discharge timing feedback unit converts the corresponding discharge signal and light output signal after proportional attenuation into a digital signal that can be processed by the MCU, and stores it in the high-speed microcontroller (402) to obtain the discharge signal at the zero point.

9. A control device, characterized in that: Used for synchronously controlling a dual-cavity excimer laser, the dual-cavity excimer laser comprising a master cavity and a power amplifier cavity, the master cavity discharges ahead of the power amplifier cavity by a time delay difference, so that after the master cavity discharges, the power amplifier cavity discharges based on the discharge result output by the master cavity; the laser operates at a pulse frequency below 6 kHz, and the device comprises: a processor and a microcontroller unit; The microcontroller unit is used to: collect the corresponding advanced delay difference value for each discharge process of the dual-cavity excimer laser, and collect the parameters corresponding to the delay time for determining the discharge of each cavity, wherein the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending the discharge signal indicating discharge to the end of the discharge of the corresponding cavity; The processor is configured to: According to the collected delay difference, parameters and preset control relationship, the optimal delay setting value for the next discharge is determined, so as to determine the optimal delay setting value corresponding to the discharge signal of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge; The parameters include: obtaining the preset charging voltage of the resonant power supply of the main oscillator cavity, the preset charging voltage of the resonant power supply of the power amplifier cavity, the magnetic switch temperature and the discharge cavity temperature, so that the collected corresponding temperature and the obtained corresponding charging voltage are used as parameters and input into the control relationship together with the delay difference to determine the optimal delay setting value for the next discharge; The control relationship is determined by establishing the relationship between the optimal delay setting value t0 of the dual-path and the charging voltage VC0, the magnetic switch temperature T1, and the discharge chamber temperature T2, t0=y(VC0, T1, T2), and the charging voltage VC0 includes the preset charging voltage of the resonant power supply of the resonant cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity.

10. A dual-cavity excimer laser, characterized in that: The laser comprises a main oscillator cavity and a power amplifier cavity, wherein the main oscillator cavity discharges ahead of the power amplifier cavity by a time delay difference, so that after the main oscillator cavity discharges, the power amplifier cavity discharges based on the discharge result output by the main oscillator cavity; the laser operates at a pulse frequency below 6 kHz, and the laser further comprises: a processor and a micro control unit; The microcontroller unit is used to: collect the corresponding advanced delay difference value for each discharge process of the dual-cavity excimer laser, and collect the parameters corresponding to the delay time for determining the discharge of each cavity, wherein the delay time refers to the delay time from the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity sending the discharge signal indicating discharge to the end of the discharge of the corresponding cavity; The processor is configured to: According to the collected delay difference, parameters and preset control relationship, the optimal delay setting value for the next discharge is determined, so as to determine the optimal delay setting value corresponding to the discharge signal of each cavity, so as to trigger the corresponding discharge signal, and the corresponding discharge signal is used to trigger the corresponding cavity to discharge; The parameters include: obtaining the preset charging voltage of the resonant power supply of the main oscillator cavity, the preset charging voltage of the resonant power supply of the power amplifier cavity, the magnetic switch temperature and the discharge cavity temperature, so that the collected corresponding temperature and the obtained corresponding charging voltage are used as parameters and input into the control relationship together with the delay difference to determine the optimal delay setting value for the next discharge; The control relationship is determined by establishing the relationship between the optimal delay setting value t0 of the dual-path and the charging voltage VC0, the magnetic switch temperature T1, and the discharge chamber temperature T2, t0=y(VC0, T1, T2), and the charging voltage VC0 includes the preset charging voltage of the resonant power supply of the resonant cavity and the preset charging voltage of the resonant power supply of the power amplifier cavity.

Images