Transfer mold for light emitting elements and transfer method thereof

Abstract

The application discloses a transfer mold for a light-emitting element and a transfer method thereof. The transfer mold comprises a transfer substrate, a limiting mold and an auxiliary detection mold. Fixed points on the transfer substrate are used to fix a plurality of light-emitting elements to be transferred to a target substrate. An opening on the limiting mold penetrates the limiting mold, and the cross-sectional size of the opening is greater than the cross-sectional size of the light-emitting element. When the light-emitting element is transferred, the limiting mold and the auxiliary detection mold are arranged between the target substrate and the transfer substrate. A receiving area on the bearing surface of the target substrate corresponds to the opening. The connecting electrode on the auxiliary detection mold is at least partially located in the opening, and the connecting electrode is in electrical contact with the receiving area. The light-emitting element is located in the opening and in electrical contact with the connecting electrode. The transfer mold can reduce the probability of rotation deviation of the light-emitting element, and can detect the light-emitting condition of the light-emitting element in advance, accurately transfer the normally light-emitting element, and reduce the process of mass transfer of the light-emitting element on the target substrate.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a transfer mold for a light-emitting element and a transfer method thereof. Background Technology

[0002] Currently, during the bonding of light-emitting elements in Micro LED display panels, the LED chips may become misaligned during the release and hot-pressing process, leading to a reduced transfer yield. Furthermore, since the luminous status of the LED chips cannot be detected in advance, damaged LED chips are typically repaired using laser technology after a large-scale transfer. This inevitably increases the difficulty of the display panel's manufacturing process and fabrication. Excessive damage can also result in lower luminous efficiency, affecting the display panel's overall performance. Summary of the Invention

[0003] This invention provides a transfer mold and transfer method for light-emitting elements, which reduces the probability of rotational misalignment of the light-emitting elements. At the same time, during the mass transfer process, the light emission status of the light-emitting elements can be detected in advance, and normal light-emitting elements can be accurately transferred, reducing the process steps of mass transfer of light-emitting elements on the target substrate.

[0004] In a first aspect, this application provides a transfer mold for a light-emitting element, comprising:

[0005] A transfer substrate, the transfer substrate including a plurality of fixing points, the fixing points being used to fix a plurality of light-emitting elements to be transferred to a target substrate;

[0006] A limiting mold, the limiting mold including multiple openings, the openings penetrating the limiting mold, the cross-sectional dimension of the openings being larger than the cross-sectional dimension of the light-emitting element;

[0007] An auxiliary testing mold, the auxiliary testing mold comprising a plurality of connecting electrodes, the connecting electrodes being electrically insulated from each other;

[0008] When transferring the light-emitting element, the limiting mold and the auxiliary detection mold are disposed between the target substrate and the transfer substrate; the target substrate bearing surface is provided with a plurality of receiving areas, the receiving areas corresponding to the opening; the connecting electrode is at least partially located in the opening, and the connecting electrode is in electrical contact with the receiving area, and the light-emitting element is located in the opening and in electrical contact with the connecting electrode.

[0009] Secondly, this application provides a method for transferring a light-emitting element, wherein the light-emitting element is transferred to a target substrate using a transfer mold provided in the first aspect, the transfer method comprising:

[0010] A transfer substrate is provided, and multiple light-emitting elements are transferred onto the transfer substrate, wherein the light-emitting elements correspond to fixed points;

[0011] A limiting mold is provided, which is disposed between the transfer substrate and the target substrate to control the receiving area on the target substrate to be located within the opening;

[0012] An auxiliary detection mold is provided, which is disposed between the transfer substrate and the target substrate, and the connecting electrode is controlled to be at least partially located within the opening and in electrical contact with the receiving area;

[0013] Transfer multiple light-emitting elements into the opening, and control the light-emitting elements to make electrical contact with the connecting electrode;

[0014] The yield of the light-emitting element is detected to obtain a good light-emitting element;

[0015] Remove the auxiliary detection mold, the transfer substrate, and the defective light-emitting elements on the transfer substrate;

[0016] Electrically connect the good quality light-emitting element to the receiving area, and remove the limiting mold.

[0017] In summary, the transfer mold for light-emitting elements provided in this application, by adding a limiting mold and an auxiliary detection mold between the transfer substrate and the target substrate, uses the opening on the limiting mold to restrict the position of the light-emitting element, reducing the probability of rotational misalignment of the light-emitting element and improving the alignment accuracy between the light-emitting element and the receiving area on the target substrate. The connecting electrodes on the auxiliary detection mold make the light-emitting element press-fitted and conductive, and the light-emitting status of the light-emitting element is detected in advance. Normal light-emitting elements are accurately transferred, thereby reducing the process of mass transfer of light-emitting elements on the target substrate, and ultimately achieving the goal of improving the transfer yield and luminous efficiency of mass transfer of light-emitting elements. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the transfer process of a light-emitting element provided in this application;

[0019] Figure 2 This is a structural schematic diagram of a limiting mold provided in this application;

[0020] Figure 3 This is a structural schematic diagram of an auxiliary testing mold provided in this application;

[0021] Figure 4 This is a schematic diagram of the detection process of a light-emitting element provided in this application;

[0022] Figure 5 This is a schematic diagram of the bonding process of the light-emitting element provided in the embodiments of this application;

[0023] Figure 6 This is a schematic diagram of a method for transferring a light-emitting element according to an embodiment of the present invention;

[0024] Figure 7 yes Figure 6 A flowchart illustrating a method for transferring light-emitting elements is provided.

[0025] Figure 8 This is a schematic diagram of another method for transferring a light-emitting element provided in an embodiment of the present invention;

[0026] Figure 9 yes Figure 8 A flowchart illustrating a method for transferring light-emitting elements is provided.

[0027] Figure 10 This is a schematic diagram of a display device provided in this application. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0029] The present invention provides a display panel in view of one or more of the above-mentioned problems existing in the prior art. Figure 1 This is a schematic diagram of the transfer process of a light-emitting element provided in this application; Figure 2 This is a structural schematic diagram of a limiting mold provided in this application; Figure 3 This is a structural schematic diagram of an auxiliary testing mold provided in this application; Figure 4 This is a schematic diagram illustrating the detection process of a light-emitting element provided in this application. (Reference) Figures 1-4As shown in the embodiment of this application, a transfer mold for a light-emitting element includes a transfer substrate 10, a limiting mold 30, and an auxiliary detection mold 40. The transfer substrate 10 includes multiple fixing points 11 for fixing multiple light-emitting elements 21 to be transferred to a target substrate 20. The limiting mold 30 includes multiple openings 31 that penetrate the limiting mold 30, and the cross-sectional dimension L1 of the openings 31 is larger than the cross-sectional dimension of the light-emitting element 21. The auxiliary detection mold 40 includes multiple connecting electrodes 41 that are electrically insulated from each other. When transferring the light-emitting element 21, the limiting mold 30 and the auxiliary detection mold 40 are disposed between the target substrate 20 and the transfer substrate 10. Multiple receiving areas 22 are provided on the bearing surface of the target substrate 20, and the receiving areas 22 correspond to the openings 31. The connecting electrodes 41 are at least partially located within the openings 31 and are in electrical contact with the receiving areas 22. The light-emitting element 21 is located within the openings 31 and is in electrical contact with the connecting electrodes 41.

[0030] For details, please refer to Figures 1-2 As shown, the transfer mold provided in this embodiment includes a transfer substrate 10, a limiting mold 30, and an auxiliary detection mold 40. The transfer substrate 10 has multiple fixing points 11 on one side surface for temporarily fixing multiple light-emitting elements 21 to be transferred to the target substrate 20. To clearly illustrate the working principle of the transfer mold, [details omitted]. Figure 1 The target substrate 20 is shown in the figure. Depending on the light-emitting requirements of the light-emitting element 21 in the target substrate 20, the fixing points 11 can be arranged in various ways. In some embodiments, the fixing points 11 can be arranged in an array; in other embodiments, the fixing points 11 can be arranged irregularly. No specific limitations are made here. The light-emitting element 21 can be an LED (Light Emitting Diode), Micro LED (Micro Light Emitting Diode), Mini LED (Mini Light Emitting Diode), etc., and no specific limitations are made in this embodiment.

[0031] Among them, reference Figure 1As shown, the target substrate 20 typically has multiple receiving regions 22. The receiving regions 22 of the target substrate 20 are provided with bonding electrodes 221 for bonding with the light-emitting element 21. The receiving regions 22 are used to bond the light-emitting element 21 and provide a driving voltage to the light-emitting element 21. It should be noted that the target substrate 20 also includes various film layer structures such as a substrate substrate and a driving substrate. The driving substrate includes a driving circuit layer, which includes a pixel driving circuit. The pixel driving circuit can be a 2T1C, 4T1C, 7T1C, 7T2C, 8T1C, 8T2C, etc. The pixel driving circuit includes multiple thin film transistors (TFTs), storage capacitors, and metal traces (not shown in the figure). The drain of the thin film transistor TFT is electrically connected to the anode of the light-emitting element 21. The driving circuit layer is used to provide a driving voltage to the light-emitting element to drive the light-emitting element 21 to emit light. These details will not be elaborated further in the embodiments of this application.

[0032] Further, refer to Figure 1 and Figure 2 As shown, the limiting mold 30 and the auxiliary detection mold 40 are independent of each other and electrically insulated. Multiple openings 31 are formed in the limiting mold 30, and the openings 31 penetrate the limiting mold 30. Figure 1 In the XY plane, the cross-sectional dimension L1 of the opening 31 is larger than the cross-sectional dimension L2 of the light-emitting element 21, where, Figure 1 The XY plane is parallel to the plane containing the target substrate 20. Figure 2 The XY plane is parallel to the plane containing the limiting mold 30. It should be noted that the cross-sectional dimension L1 of the opening 31 should be slightly larger than the cross-sectional dimension L2 of the light-emitting element 21 to ensure that the light-emitting element 21 does not flip or otherwise shift during its fall. The shape of the opening 31 can be rectangular, such as a rectangle or square, to accommodate the shape of the light-emitting element 21 in most applications. Alternatively, it can be set to other shapes such as circles to accommodate the transfer of light-emitting elements 21 with special shapes.

[0033] Further, refer to Figure 1 and Figure 3 As shown, the auxiliary detection mold 40, also known as the electrical connection layer, is a conductive layer that can be used for electrical connection between upper and lower parts. Its materials can include, but are not limited to, metals such as aluminum (Al), silver (Ag), chromium (Cr), titanium (Ti), tantalum (Ta), and molybdenum (Mo), their alloys, their nitrides, conductive metal oxides, and transparent conductive materials. Multiple electrically insulated connection electrodes 41 are provided on the auxiliary detection mold 40, and these connection electrodes 41 serve as auxiliary connection electrodes for the light-emitting element 21.

[0034] Combination Figure 1 and Figure 4As shown, when multiple light-emitting elements 21 need to be transferred to the target substrate 20, the light-emitting elements 21 can first be placed on one side surface of the transfer substrate 10, the limiting mold 30 is placed between the target substrate 20 and the transfer substrate 10, and the auxiliary detection mold 40 is placed between the target substrate 20 and the transfer substrate 10. The placement order and vertical position relationship of the limiting mold 30 and the auxiliary detection mold 40 are not limited in this application. During the process of the light-emitting elements 21 falling to 22, the limiting mold 30 is used to transfer the light-emitting elements 21 to the bearing surface of the target substrate 20, so that the light-emitting elements 21 are nested in the opening 31. The light-emitting elements 21 are electrically connected to the receiving area 22 through each set of connecting electrodes 41, and the connection method is a simple press-fit contact conductivity. Further, the target substrate 20 is controlled to provide a driving voltage to the light-emitting elements 21 to perform pre-press-fit detection to check whether the light-emitting elements 21 emit light normally. After the detection is completed, the auxiliary detection mold 40 is simply removed, and the normally detected light-emitting elements 21 are removed and bonded to the receiving area 22 of the target substrate 20. On the one hand, the embodiment of this application uses an auxiliary detection mold 40 for pre-detection, which can detect the light emission status of the light-emitting element 21 before the actual transfer and bonding of the light-emitting element 21, thereby pre-removing damaged light-emitting elements 21. This eliminates the need for laser repair after mass transfer to repair damaged light-emitting elements 21, avoids particles in the process, and reduces redundant design, thereby reducing the difficulty of the target substrate fabrication process and increasing the pixel density (Pixels Per Inch, PPI) of the product. On the other hand, the opening 31 can reduce the probability of rotational misalignment of the light-emitting element 21, improve the alignment accuracy between the light-emitting element 21 and the receiving area 22 on the target substrate 20, thereby improving the transfer yield of the mass transfer process. This is beneficial for further improving the luminous efficiency of the display panel in the later stages, thus comprehensively improving the display effect of the display panel.

[0035] In summary, the transfer mold for light-emitting elements provided in this application adds a limiting mold and an auxiliary detection mold between the transfer substrate and the target substrate. The opening on the limiting mold restricts the position of the light-emitting element, reducing the probability of rotational misalignment and improving the alignment accuracy between the light-emitting element and the receiving area on the target substrate. The connecting electrodes on the auxiliary detection mold make the light-emitting element press-fitted and conductive, and the light-emitting status of the light-emitting element is detected in advance. Normal light-emitting elements are accurately transferred, thereby reducing the process of mass transfer of light-emitting elements on the target substrate and ultimately improving the transfer yield and luminous efficiency of mass transfer of light-emitting elements.

[0036] Based on the above embodiments, continue to refer to Figure 1 As shown, the arrangement of fixed points 11 corresponds one-to-one with the arrangement of openings 31.

[0037] For details, please refer to Figure 1 and Figure 2 As shown, based on the arrangement of the light-emitting elements 21 on the transfer substrate 10, multiple openings 31 arranged in an array are also provided on the limiting mold 30. The arrangement of the fixing points 11 adopts the same array arrangement as the openings 31. During the mass transfer process, the limiting mold 30 is set between the target substrate 20 and the transfer substrate 10, and each light-emitting element 21 is nested into the corresponding opening 31 to reduce the rotational displacement of the light-emitting element 21. At the same time, multiple receiving areas 22 arranged in an array are provided on the bearing surface of the target substrate 20. The multiple receiving areas 22 correspond one-to-one with the multiple openings 31, that is, the receiving areas 22 on the bearing surface can be exposed from the openings 31.

[0038] Based on the above embodiments, continue to refer to Figure 1 As shown, the thickness H1 of the limiting mold 30 is greater than the thickness H2 of the light-emitting element 21.

[0039] Specifically, along Figure 1 In the Z direction, the thickness H1 of the limiting mold 30 can also be called the depth H1 of the opening 31. The depth H1 of the opening 31 is set to be greater than the thickness H2 of the light-emitting element 21, that is, the space formed by the opening 31 can completely accommodate the light-emitting element 21, thereby limiting the light-emitting element 21.

[0040] For example, the thickness H2 of the light-emitting element 21 ranges from 8 to 10 μm, and the thickness H1 of the limiting mold 30 ranges from 100 to 200 μm. In other embodiments, the thickness H1 of the limiting mold 30 may also be adjusted appropriately, and this application embodiment does not impose specific limitations.

[0041] Based on the above embodiments, continue to refer to Figure 1 As shown, the arrangement of the connecting electrodes 41 corresponds one-to-one with the arrangement of the openings 31; when transferring the light-emitting element 21, the connecting electrodes 41 are located inside the openings 31.

[0042] Specifically, in combination Figure 1 and Figure 3 As shown, according to the arrangement of the light-emitting elements 21 on the transfer substrate 10, the auxiliary detection mold 40 is also provided with an array of connecting electrodes 41. During the mass transfer process, the limiting mold 30 and the auxiliary detection mold 40 are set between the target substrate 20 and the transfer substrate 10. Each light-emitting element 21 is nested in the corresponding opening 31. The connecting electrodes 41 are connected to the light-emitting elements 21 in the corresponding opening 31 and the receiving area 22. The receiving area 22 corresponds to the opening 31 one by one. That is, the receiving area 22 on the bearing surface can be exposed from the opening 31 to press the electrical contact, which is beneficial to realize the light emission detection of multiple light-emitting elements 21 on the transfer substrate 10.

[0043] Optional, see reference Figure 3As shown, two connecting electrodes 41 are used as a group, serving as auxiliary connecting electrodes for the anode and cathode of the light-emitting element 21. The space occupied by each group of connecting electrodes 41 is set smaller than the space occupied by the opening 31. Figure 1 and Figure 4 As shown, when the limiting mold 30 and the auxiliary detection mold 40 are stacked, at least a portion of each group of connecting electrodes 41 is located within the same opening 31, so that during the pre-detection process of the light-emitting element 21, the receiving area 22, the connecting electrodes 41 and the light-emitting element 21 form a pressurized contact for conductivity.

[0044] Optional, continue to refer to Figure 4 As shown, multiple connecting electrodes 41 are fixedly connected by insulating material to fix the connecting electrodes 41 and avoid crosstalk between electrical signals.

[0045] As an example, combined Figure 4 As shown in the figure, the connecting line 42 connects the individual connecting electrodes 41 into a whole, which facilitates placement, alignment, removal, etc.

[0046] Based on the above embodiments, Figure 5 This is a schematic diagram of the bonding process of the light-emitting element provided in the embodiments of this application, referring to... Figure 5 As shown, the transfer mold also includes an auxiliary bonding mold 50, which includes an auxiliary substrate 51 and a plurality of pressing structures 52. The cross-sectional dimension L3 of the pressing structure 52 is smaller than the cross-sectional dimension L1 of the opening 31. When transferring the light-emitting element 21, the pressing structure 52 is located inside the opening 31 and is used to press the light-emitting element 21 to electrically connect with the receiving area 22.

[0047] For details, please refer to Figure 5 As shown, the auxiliary bonding mold 50 includes an auxiliary substrate 51 and multiple pressing structures 52 located on the auxiliary substrate 51. The shape of the auxiliary bonding mold 50 is similar to a piston-type mold, and the pressing structures 52 are similar to piston structures. Their materials include, but are not limited to, insulating and non-conductive rubber materials, and they can have a certain degree of elasticity. The size of the pressing structure 52 is the same as the size of a single light-emitting element 21, and different molds can be made according to different product designs.

[0048] After pre-inspecting the light-emitting element 21, the auxiliary inspection mold 40 is removed. The light-emitting element 21 that has passed inspection is removed and aligned with the receiving area 22 of the target substrate 20. The transfer substrate 10 is removed, and the pressing structure 52 of the auxiliary bonding mold 50 is aligned with the opening 31 of the limiting mold 30. The auxiliary substrate 51 is pressed together using a hot pressing process. During hot pressing, the limiting mold 30 continues to limit the light-emitting element 21, thereby preventing the light-emitting element 21 from moving under pressure. This achieves bonding between the light-emitting element 21 and the target substrate 20, and also improves the bonding effect between the light-emitting element 21 and the bonding electrode 221, thus improving the stability of the bonding.

[0049] Optional, continue to refer to Figure 4 As shown, the arrangement of the pressing structure 51 corresponds one-to-one with the arrangement of the opening 31.

[0050] Specifically, based on the array arrangement of the light-emitting elements 21 on the transfer substrate 10, multiple pressing structures 52 on the auxiliary bonding mold 50 are arranged in the same array, which is beneficial to realize the mass transfer of the light-emitting elements 21.

[0051] Based on the same inventive concept, this embodiment of the invention also provides a method for transferring a light-emitting element, wherein the light-emitting element 21 is transferred to the target substrate 20 using the transfer mold provided in the above embodiment. Figure 6 This is a schematic diagram of a method for transferring a light-emitting element according to an embodiment of the present invention; Figure 7 yes Figure 6 A flowchart illustrating a method for transferring light-emitting elements is provided. (Combined with...) Figures 1-7 As shown, the light-emitting element transfer method provided in this embodiment of the invention includes:

[0052] S101. Provide a transfer substrate to transfer multiple light-emitting elements onto the transfer substrate, with the light-emitting elements corresponding to the fixing points.

[0053] For details, please refer to Figure 7 As shown in Figure (a), a transfer substrate 10 is provided, and multiple fixing points 11 are pre-set on the transfer substrate 10. Multiple light-emitting elements 21 are transferred to the transfer substrate 10, and the light-emitting elements 21 correspond to the fixing points 11.

[0054] S102. Provide a limiting mold, set the limiting mold between the transfer substrate and the target substrate, and control the receiving area on the target substrate to be located within the opening.

[0055] For details, please refer to Figure 7As shown in Figure (b), a target substrate 20 is provided, on which multiple receiving areas 22 are provided, and multiple bonding electrodes 221 are provided. A limiting mold 30 is placed between the transfer substrate 10 and the target substrate 20, controlling the two bonding electrodes 221 of the receiving area 22 on the target substrate 20 to be located in the opening 31, while the light-emitting element 21 at the fixed point 11 on the transfer substrate 10 is located in the opening 31.

[0056] S103. Provide an auxiliary detection mold, place the auxiliary detection mold between the transfer substrate and the target substrate, and control the connection electrode to be at least partially located in the opening and in electrical contact with the receiving area.

[0057] For details, please refer to [link / reference]. Figure 7 As shown in Figure (b), the auxiliary detection mold 40 is placed between the transfer substrate 10 and the target substrate 20, and the connecting electrode 41 on the auxiliary detection mold 40 is controlled to be located in the opening 31.

[0058] S104. Transfer multiple light-emitting elements into the opening, control the light-emitting elements to make electrical contact with the connecting electrodes, detect the yield of the light-emitting elements, and obtain good light-emitting elements.

[0059] For details, please refer to Figure 7 As shown in Figure (c), the distance between the transfer substrate 10 and the target substrate 20 is reduced to ensure that the light-emitting element 21 is located within the opening 31 until the light-emitting element 21, the connecting electrode 41 and the bonding electrode 221 form a pressurized contact for conductivity. The target substrate 20 is controlled to provide a driving voltage to the light-emitting element 21 in the receiving area 22. The light-emitting yield of the light-emitting element 21 in each opening 31 is detected, and the position parameters of the normally emitting light-emitting element 21 are recorded to obtain a good light-emitting element 21.

[0060] S105. Remove the auxiliary inspection mold, transfer substrate, and defective light-emitting elements on the transfer substrate.

[0061] For details, please refer to Figure 7 As shown in Figure (d), the auxiliary detection mold 40, the transfer substrate 10, and the defective light-emitting element 21 on the transfer substrate 10 are removed (as shown in the dashed box in the figure).

[0062] S106. Connect the good light-emitting element to the receiving area electrically, and remove the limiting mold.

[0063] For details, please refer to Figure 7 As shown in Figures (d) and (e), the good light-emitting element 21 is electrically connected to the bonding electrode 221 of the receiving area 22 on the target substrate 20, and the limiting mold 30 is removed at the same time to complete the transfer of the good light-emitting element 21 from the target substrate 20.

[0064] Based on the above embodiments, Figure 8This is a schematic diagram of another method for transferring a light-emitting element provided in an embodiment of the present invention; Figure 9 yes Figure 8 A flowchart illustrating a method for transferring light-emitting elements is provided. (Combined with...) Figures 1-9 As shown, the transfer mold also includes an auxiliary bonding mold 50, which includes multiple pressing structures 52. The method for transferring a light-emitting element provided in this embodiment of the invention includes:

[0065] S201. Provide a transfer substrate to transfer multiple light-emitting elements onto the transfer substrate, with the light-emitting elements corresponding to the fixing points.

[0066] like Figure 8 As shown in Figure (a), please continue to refer to... Figure 7 As described in (a), it will not be repeated here.

[0067] S202. Provide a limiting mold, set the limiting mold between the transfer substrate and the target substrate, and control the receiving area on the target substrate to be located within the opening.

[0068] like Figure 8 As shown in Figure (b), please continue to refer to... Figure 7 As described in (b), it will not be repeated here.

[0069] S203. Provide an auxiliary detection mold, place the auxiliary detection mold between the transfer substrate and the target substrate, and control the connection electrode to be at least partially located in the opening and in electrical contact with the receiving area.

[0070] like Figure 8 As shown in Figure (b), please continue to refer to... Figure 7 As described in (b), it will not be repeated here.

[0071] S204. Transfer multiple light-emitting elements into the opening, control the light-emitting elements to make electrical contact with the connecting electrodes, detect the yield of the light-emitting elements, and obtain good light-emitting elements.

[0072] like Figure 8 As shown in Figure (c), please continue to refer to... Figure 7 As described in section (c), it will not be repeated here.

[0073] S205. Remove the auxiliary inspection mold, transfer substrate, and defective light-emitting elements on the transfer substrate.

[0074] like Figure 8 As shown in Figure (d), please continue to refer to... Figure 7 As described in (d), it will not be repeated here.

[0075] S206. Detect the receiving area on the target substrate where a defective light-emitting element is missing, and continue to transfer the defective light-emitting element to that receiving area.

[0076] For details, please refer to... Figure 8 As shown in Figures (d) and (c), the receiving area 22 on the target substrate 20 where a defective light-emitting element 21 is missing is detected, as indicated by the dotted box in the figure. Steps 201 to 205 are then performed, and a transfer substrate 10 is provided to transfer the light-emitting element 21 on the fixing point 11 of the transfer substrate 10 to the receiving area 22.

[0077] S207. Provide an auxiliary bonding mold to align the pressing structure with the good light-emitting element, control the auxiliary bonding mold to provide bonding pressure so that the good light-emitting element is electrically connected to the receiving area, and remove the limiting mold.

[0078] For details, please refer to Figure 8 As shown in Figures (e) and (f), an auxiliary bonding mold 50 is provided. The pressing structure 52 on the auxiliary bonding mold 50 is aligned with the opening 31 of the limiting mold 30. The auxiliary substrate 51 is pressed together using a hot pressing process. During hot pressing, the good light-emitting element 21 is electrically connected to the bonding electrode 221 of the receiving area 22 on the target substrate 20. After bonding is formed, the limiting mold 30 is removed, and the transfer of the good light-emitting element 21 at all transfer positions on the target substrate 20 is completed.

[0079] Based on the above embodiments, the transfer method in steps S103 and S203 includes:

[0080] An auxiliary testing mold is provided between the transfer substrate and the limiting mold.

[0081] Alternatively, an auxiliary testing mold can be placed between the limiting mold and the target substrate.

[0082] For details, please refer to [link / reference]. Figure 1 , Figure 4 , Figure 7 (c) Figure 8 (c) It is only necessary to satisfy that the connecting electrode 41 of the auxiliary detection mold 40, the light-emitting element 21, the receiving area 22 of the target substrate 20 and the opening 31 of the limiting mold 30 correspond one-to-one. When the light-emitting state of the light-emitting element 21 is detected in advance, a pressure contact can be formed to conduct electricity. In this embodiment, there are no specific restrictions on the vertical positional relationship and placement order between the transfer substrate and the limiting mold.

[0083] It should be noted that there is no specific order between steps S102 and S103; there is no specific order between steps S202 and S203. As an example, step S102 can be executed first, followed by step S103; or step S103 can be executed first, followed by step S102. This application embodiment does not impose any restrictions.

[0084] Based on the same inventive concept, embodiments of the present invention also provide a display panel. This display panel includes any of the target substrates provided in the above embodiments. Therefore, this display panel also possesses the beneficial effects of the target substrates in the above embodiments. The similarities can be understood with reference to the explanation of the target substrates above, and will not be repeated below.

[0085] Based on the same inventive concept, embodiments of the present invention also provide a display device. This display device includes any of the display panels provided in the above embodiments. Figure 10 This is a schematic diagram of the structure of the display device provided in an embodiment of the present invention, such as... Figure 10 As shown, for example, the display device 300 includes a display panel 200. Therefore, the display device also has the beneficial effects of the target substrate in the above embodiments. The similarities can be understood with reference to the explanation of the target substrate above, and will not be repeated below.

[0086] The display device 300 provided in this embodiment of the invention can be Figure 10 The mobile phone shown can also be any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, in-vehicle display, industrial control equipment, medical display screen, touch interactive terminal, etc. The embodiments of the present invention do not make any special limitations on this.

[0087] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A transfer mold for a light-emitting element, characterized in that, include: A transfer substrate, the transfer substrate including a plurality of fixing points, the fixing points being used to fix a plurality of light-emitting elements to be transferred to a target substrate; A limiting mold, the limiting mold including multiple openings, the openings penetrating the limiting mold, the cross-sectional dimension of the openings being larger than the cross-sectional dimension of the light-emitting element; An auxiliary testing mold, the auxiliary testing mold comprising a plurality of connecting electrodes, the connecting electrodes being electrically insulated from each other; When transferring the light-emitting element, the limiting mold and the auxiliary detection mold are disposed between the target substrate and the transfer substrate; The target substrate bearing surface is provided with multiple receiving areas, and the receiving areas correspond to the openings; The connecting electrode is at least partially located within the opening and is in electrical contact with the receiving area. The light-emitting element is located within the opening and is in electrical contact with the connecting electrode.

2. The transfer mold according to claim 1, characterized in that, The arrangement of the fixed points corresponds one-to-one with the arrangement of the openings.

3. The transfer mold according to claim 1, characterized in that, The thickness of the limiting mold is greater than the thickness of the light-emitting element.

4. The transfer mold according to claim 1, characterized in that, The arrangement of the connecting electrodes corresponds one-to-one with the arrangement of the openings; When the light-emitting element is transferred, the connecting electrode is located inside the opening.

5. The transfer mold according to claim 4, characterized in that, The multiple connecting electrodes are fixedly connected by insulating material.

6. The transfer mold according to claim 1, characterized in that, It also includes an auxiliary binding mold, which comprises multiple pressing structures, the cross-sectional dimensions of which are smaller than the cross-sectional dimensions of the opening; When the light-emitting element is transferred, the pressing structure is located inside the opening and is used to press the light-emitting element into an electrical connection with the receiving area.

7. The transfer mold according to claim 6, characterized in that, The arrangement of the pressing structure corresponds one-to-one with the arrangement of the openings.

8. A method for transferring a light-emitting element, comprising using a transfer mold according to any one of claims 1-7 to transfer the light-emitting element to a target substrate, characterized in that, The transfer method includes: A transfer substrate is provided, and multiple light-emitting elements are transferred onto the transfer substrate, wherein the light-emitting elements correspond to fixed points; A limiting mold is provided, which is disposed between the transfer substrate and the target substrate to control the receiving area on the target substrate to be located within the opening; An auxiliary detection mold is provided, which is disposed between the transfer substrate and the target substrate, and the connecting electrode is controlled to be at least partially located within the opening and in electrical contact with the receiving area; Transfer multiple light-emitting elements into the opening, and control the light-emitting elements to make electrical contact with the connecting electrode; The yield of the light-emitting element is detected to obtain a good light-emitting element; Remove the auxiliary detection mold, the transfer substrate, and the defective light-emitting elements on the transfer substrate; Electrically connect the good quality light-emitting element to the receiving area, and remove the limiting mold.

9. The transfer method according to claim 8, characterized in that, The transfer mold further includes an auxiliary bonding mold, which comprises multiple pressing structures; electrically connecting the finished light-emitting element to the receiving area includes: An auxiliary bonding mold is provided to align the pressing structure with the finished light-emitting element; The auxiliary bonding mold is controlled to provide bonding pressure so that the good light-emitting element is electrically connected to the receiving area.

10. The transfer method according to claim 8, characterized in that, The auxiliary detection mold is disposed between the transfer substrate and the target substrate, including: The auxiliary detection mold is disposed between the transfer substrate and the limiting mold; Alternatively, the auxiliary detection mold can be positioned between the limiting mold and the target substrate.

11. The transfer method according to claim 8, characterized in that, The target substrate includes a driving circuit, which is used to provide a driving voltage to the receiving area; The process of detecting the yield of the light-emitting element and obtaining a good light-emitting element includes: The driving circuit is controlled to provide a driving voltage to the receiving area, and the light emission yield of the plurality of light-emitting elements is detected to obtain good light-emitting elements.

12. The transfer method according to claim 8, characterized in that, Before electrically connecting the finished light-emitting element to the receiving area and removing the limiting mold, the process further includes: Detect the receiving area on the target substrate that lacks a defective light-emitting element; Continue transferring the good quality light-emitting element to the receiving area.

Images