Method for building flexible electronic devices based on suspension 3D printing

Abstract

This invention discloses a method for constructing flexible electronic devices based on suspension 3D printing. The method includes: preparing a biphase elastomer ink, wherein the biphase elastomer ink is a printing ink with printable properties after rheological modification of an elastomer material; preparing a conductive ink, wherein the conductive ink is a printing ink made by combining an elastomer material with a conductive carrier; printing the biphase elastomer ink in a suspension medium to construct an insulating encapsulation structure for the flexible electronic device; printing the conductive ink inside the insulating encapsulation structure of the flexible electronic device to construct a three-dimensional free-form electrode network; and after the flexible electronic device containing the three-dimensional free-form electrode network is integrally cross-linked and fixed, dissolving it from the suspension medium to obtain the target flexible electronic device containing three-dimensional free-form electrodes. This invention achieves the construction of flexible electronic devices with three-dimensional free-form electrode networks through controllable, step-by-step suspension printing of novel biphase elastomer ink and conductive ink.

Description

Technical Field

[0001] This invention relates to the interdisciplinary field of flexible electronic materials and additive manufacturing, and in particular to a method for constructing flexible electronic devices based on levitation 3D printing. Background Technology

[0002] This section is intended to provide background or context for the embodiments of the invention set forth in the claims. The description herein is not an admission that it is prior art simply because it is included in this section.

[0003] Flexible electronic devices are those that can be bent, folded, twisted, compressed, stretched, and even deformed into arbitrary shapes while maintaining high electrical performance, reliability, and integration. They are generally composed of an electrode network consisting of an encapsulated elastic matrix material and internal conductive materials, enabling them to adapt to different working environments and be compatible with various objects and machines. Flexible electronic devices need to have good stretchability and bendability without compromising their intrinsic electrical properties, which places high demands on the composition of circuits, packaging materials, and the overall manufacturing process of the device.

[0004] Traditional flexible electronic device manufacturing methods primarily employ mask printing, where printing ink is extruded into specific shapes through a patterned film-like mesh and then applied to a substrate using a forward-moving scraper, achieving high-precision device construction. However, this strategy typically requires complex, costly, and time-consuming transfer processes, and high-precision molds need to be manufactured through chemical etching or photolithography, severely limiting the diversity of device structures and manufacturing efficiency. In recent years, with the rapid development of 3D printing technology, bottom-up flexible electronic device construction strategies are gradually becoming mainstream. This strategy, represented by 3D printing technology, involves layer-by-layer deposition of elastomeric and conductive inks along predefined paths to form flexible electronic devices with complex structures. Among these, inkjet printing-based flexible electronics manufacturing processes typically print wires or other structures on a pre-fabricated flexible substrate, a non-contact printing process, and has become the mainstream method for flexible electronic device manufacturing. However, this point-to-line processing method is not only very inefficient when manufacturing flexible electronics with complex three-dimensional geometries, but the processing accuracy is also related to the diameter of the extrusion nozzle; therefore, higher printing accuracy results in slower printing speeds. Inkjet printing often requires the use of prefabricated flexible substrates, making it impossible to achieve integrated manufacturing of elastic substrates and conductive structures.

[0005] A novel approach utilizes alternating printing to achieve high-precision, high-efficiency, low-cost, and integrated manufacturing of flexible electronic devices. Existing research proposes a dual-nozzle 3D printing method for manufacturing flexible hybrid electronics and has developed a system comprising key modules such as a 3D motion platform, a computer control module, a material supply module, and a temperature control module. The system's two nozzles respectively print the flexible substrate material PDMS and the conductive silver paste for wiring, and this system has been used to manufacture wireless charging circuits. However, when constructing complex flexible electronic devices with multi-layered 3D circuits, alternating printing requires cumbersome printing parameter design, making it difficult to guarantee high printing accuracy and limiting its practicality.

[0006] In summary, while the aforementioned processes have certain advantages in constructing flexible electronic devices, they still face significant challenges in fabricating complex flexible electronic devices that are personalized, high-precision, functional, and three-dimensional, greatly limiting the application of flexible electronic devices in fields such as flexible sensing and bioelectronic interfaces. Summary of the Invention

[0007] This invention provides a method for constructing flexible electronic devices based on levitation 3D printing. By developing levitation printing technology based on novel biphase elastomer inks and conductive inks, it enables the construction of flexible electronic devices with a three-dimensional free-form electrode network. This provides a basis for manufacturing high-performance functional flexible electronic devices in fields such as flexible energy storage, flexible sensing, bioelectronic interfaces, and soft robotics. The method includes:

[0008] The preparation of biphase elastomer ink, wherein the biphase elastomer ink is a printing ink with printing properties after rheological modification of elastomer material; the preparation of biphase elastomer ink includes: mixing elastomer microspheres, all made of elastomer material, with a precursor solution to obtain biphase elastomer ink;

[0009] Prepare conductive ink, wherein the conductive ink is a printing ink made by combining an elastomer material with a conductive carrier;

[0010] The biphase elastomer ink is printed in a suspension medium to construct an insulating encapsulation structure for flexible electronic devices;

[0011] The conductive ink is printed inside the insulating encapsulation structure of the flexible electronic device to construct a three-dimensional freeform electrode network;

[0012] After the flexible electronic device containing a three-dimensional free-form electrode network is integrally cross-linked and fixed, the suspension medium is dissolved to obtain the target flexible electronic device containing three-dimensional free-form electrodes.

[0013] This invention also provides a flexible electronic device constructed using the aforementioned method.

[0014] In this embodiment of the invention, a biphase elastomer ink is prepared, which is a printing ink with printability after rheological modification of an elastomer material; a conductive ink is prepared, which is a printing ink made by compositing an elastomer material with a conductive carrier; the biphase elastomer ink is printed in a suspension medium to construct an insulating encapsulation structure for a flexible electronic device; inside the insulating encapsulation structure of the flexible electronic device, the conductive ink is printed to construct a three-dimensional freeform electrode network; after the flexible electronic device containing the three-dimensional freeform electrode network is cross-linked as a whole, the suspension medium is dissolved to obtain the target flexible electronic device containing three-dimensional freeform electrodes. This embodiment of the invention is based on a biphase elastomer ink with both shear-thinning and self-healing properties and a conductive ink with both good printability, high conductivity, and stretchability. These two printing inks can not only be printed in a suspension medium but can also be used as a suspension medium for printing the next stage structure. This is suitable for constructing flexible electronic devices with three-dimensional complex elastomer structures and conductive electrodes, providing a basis for manufacturing functional flexible electronic devices with excellent performance in fields such as flexible energy storage, flexible sensing, bioelectronic interfaces, and soft robotics. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0016] Figure 1 This is a flowchart of a flexible electronic device construction method based on levitation 3D printing in an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of PDMS microspheres in an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram illustrating the rheological properties of PDMS-based biphase elastomer ink and pure PDMS ink in embodiments of the present invention;

[0019] Figure 4 Examples of various models printed using PDMS-based biphase elastomer ink in embodiments of the present invention;

[0020] Figure 5 The image shows the scanning electron microscope morphology of the ink printed using PDMS-based biphase elastomer in an embodiment of the present invention.

[0021] Figure 6 This is a demonstration of the mechanical properties of the structure printed using PDMS-based biphase elastomer ink in an embodiment of the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention.

[0023] The inventors discovered that levitation printing technology allows for the direct printing of low-viscosity, low-modulus, or slow-curing inks using a levitation medium. For example, silver-based conductive ink can be used to levitation print complex three-dimensional electrode networks within a hydrogel elastomer matrix, creating high-performance flexible electronic devices such as pressure sensors and bioelectronic interfaces. Liquid metal conductive ink can also be used to levitation print within an acrylamide / nanoclay elastomer, utilizing the oxidation of gallium on the liquid metal surface by hydrogen peroxide to create high-performance flexible electronic devices with free-form electrode networks. While these levitation printing processes can construct free-form electrode networks within elastomers, the elastomer structure is determined by the container shape, making it impossible to simultaneously print flexible electronic devices with complex three-dimensional elastomer structures and conductive electrodes, thus preventing integrated printing.

[0024] Therefore, this invention targets flexible electronic devices, especially complex flexible electronic devices. By developing novel biphase elastomer inks and conductive inks, and researching a step-by-step suspension printing technology for various inks, it enables the construction of flexible electronic devices with three-dimensional free-form electrode networks. This provides a basis for manufacturing functional flexible electronic devices with excellent performance in fields such as flexible energy storage, flexible sensing, bioelectronic interfaces, and soft robots.

[0025] Figure 1 The flowchart of the flexible electronic device construction method based on levitation 3D printing in this embodiment of the invention includes:

[0026] Step 101: Prepare biphase elastomer ink, wherein the biphase elastomer ink is a printing ink that has printing properties after rheological modification of elastomer material; the preparation of biphase elastomer ink includes: mixing elastomer microspheres, all made of elastomer material, with a precursor solution to obtain biphase elastomer ink;

[0027] Step 102: Prepare conductive ink, wherein the conductive ink is a printing ink made by combining an elastomer material with a conductive carrier;

[0028] Step 103: Print the biphase elastomer ink in a suspension medium to construct an insulating encapsulation structure for the flexible electronic device;

[0029] Step 104: Print the conductive ink inside the flexible electronic device structure to construct a three-dimensional freeform electrode network;

[0030] Step 105: After the flexible electronic device containing the three-dimensional free-form electrode network is integrally cross-linked and fixed, the suspension medium is dissolved to obtain the target flexible electronic device containing the three-dimensional free-form electrode.

[0031] The steps are described in detail below.

[0032] In step 101, the method further includes:

[0033] By adding a modifier to an elastomer material, a biphase elastomer ink can be obtained.

[0034] In one embodiment, the method further includes:

[0035] Elastomer microspheres are prepared using at least one of the following methods: droplet microfluidics, emulsification, and mechanical fragmentation.

[0036] The diameter of the elastomer microspheres is 10μm~1000μm; such as 10μm~50μm, 100μm~150μm, 400μm~450μm or 450μm~500μm, which can be determined according to the actual situation.

[0037] The mass ratio of the elastomeric microspheres in the biphase elastomer ink is 40% to 80%.

[0038] In one embodiment, the elastomer material is a natural polymer hydrogel material and / or a synthetic polymer hydrogel material;

[0039] The natural polymer hydrogel material is at least one of alginate, gelatin, chitosan, silk fibroin, hyaluronic acid, chondroitin sulfate, and methacrylamide products (such as methacrylamide gelatin (GelMA), methacrylamide sodium alginate (AlgMA), etc.).

[0040] The synthetic polymer hydrogel material may be at least one of polydimethylsiloxane (PDMS), polyethylene glycol (PEG), polyacrylamide (PVA), polyethylene glycol diacrylate (PEGDA), polyacrylamide (PAM), polyacrylic acid (PAA), polyphosphazene (PAMPS), poly(N-isopropylacrylamide) hydrogel (PNIPAAm), and their methacrylated products (such as concave-arm polyethylene glycol acrylate (4-arm-PEG-AC), methacrylated polyvinyl alcohol (PVAMA), etc.).

[0041] In one embodiment, the mass-volume concentration of the precursor solution is 1 mg / mL to 100 mg / mL, such as 4 mg / mL to 25 mg / mL.

[0042] In one embodiment, the modifier comprises nano-clay materials and / or long-chain polymers;

[0043] The nano-clay material is at least one of nano-montmorillonite, nano-kaolinite, nano-sepiolite, nano-piperite, and nano-vermiculite;

[0044] The long-chain polymer is at least one of polyamide, polyethylene, polypropylene, polyester, epoxy resin, polyurethane, and phenolic resin;

[0045] The mass-volume concentration of the modifier is 10 mg / mL to 100 mg / mL, such as 20 mg / mL to 50 mg / mL.

[0046] In step 102, the elastomeric material of the conductive ink is a natural polymer hydrogel material and / or a synthetic polymer hydrogel material;

[0047] In one embodiment, the conductive carrier is at least one of a metal-based conductive material and a carbon-based conductive material;

[0048] The metal-based conductive material is at least one of gold nanoparticles, silver nanoparticles, silver nanowires, and micron-sized silver sheets.

[0049] The carbon-based conductive material is at least one of carbon black, carbon fiber, graphene oxide, and carbon nanotubes.

[0050] In one embodiment, the conductive ink is prepared by a hybrid centrifugation method at a rotation speed of 1,000 rpm to 10,000 rpm.

[0051] In step 103, the suspension medium is a hydrogel material with self-healing properties;

[0052] The hydrogel material with self-healing properties includes supramolecular self-healing hydrogels and / or microgel structures;

[0053] The supramolecular self-healing hydrogel is at least one of cyclodextrin-based supramolecular hydrogel, DNA supramolecular hydrogel, polyurethane urea supramolecular hydrogel, hyaluronic acid-dextran supramolecular hydrogel, tanshinone II-A polypeptide supramolecular hydrogel, and graphene composite supramolecular hydrogel.

[0054] The size of the microgel structure is 1μm~50μm;

[0055] The microgel structure is at least one of carbomer, gelatin, and sodium alginate.

[0056] The gelatin and sodium alginate are prepared by a stirring process, wherein the stirring speed is 1000 rpm to 10000 rpm.

[0057] In one embodiment, the gelatin is prepared by the following steps via a composite coagulation reaction of gelatin and gum arabic:

[0058] Add the first preset weight (e.g., 3-5 grams) of gelatin, the second preset weight (e.g., 0.2-0.5 grams) of gum arabic, and the third preset weight (e.g., 0.5-1.0 grams) of Pronic F127 sequentially to a preset volume (e.g., 200 ml) of a water and alcohol mixture (volume ratio in the range of 1:2 to 2:1), and stir to dissolve at a preset temperature (e.g., 50°C to 60°C) to obtain a solution.

[0059] The solution pH is adjusted to a preset value (e.g., 6.2~6.7) by titration with hydrochloric acid (e.g., 1 mol / L), and then cooled to room temperature to obtain gelatin with a preset diameter (e.g., 10 μm~50 μm), wherein the gelatin with the preset diameter is gelatin microspheres.

[0060] In one embodiment, the insulating encapsulation structure of the flexible electronic device includes at least one of a three-dimensional layered structure, a tubular structure, and a block structure that closely adheres to cerebral cortex tissue, bone tissue, muscle tissue, vascular tissue, and nerve tissue;

[0061] The size of the insulating packaging structure of the flexible electronic device is 300μm~100mm.

[0062] The three-dimensional free-form electrode network of this invention can be constructed step-by-step, specifically including:

[0063] The number of printing stages is determined based on the type of the target flexible electronic device. For example, two-stage printing is required when constructing an implantable flexible cooling device, and three-stage printing is required when constructing an implantable multifunctional biosensor.

[0064] Depending on the printing level, conductive ink is printed inside the insulating encapsulation structure of the flexible electronic device to construct a three-dimensional freeform electrode network of different levels. For example, when constructing an implantable flexible cooling device, conductive ink is used to print a secondary electrode network; when constructing an implantable multifunctional biosensor, a secondary electrode network and a tertiary electrode network are printed sequentially.

[0065] This invention also proposes another method for constructing a three-dimensional freeform electrode network, including:

[0066] Inside the insulating packaging structure of flexible electronic devices, sacrificial ink is used to print flow channels to form a three-dimensional freeform electrode network.

[0067] In step 105, the three-dimensional freeform electrode network needs to be cross-linked as a whole. At least one of the following methods is used to cross-link the three-dimensional freeform electrode network as a whole:

[0068] Crosslinking by light and temperature, crosslinking by ions, crosslinking by enzymes, and crosslinking by covalent bonding.

[0069] In one embodiment, dissolving the suspension medium includes:

[0070] When the suspension medium is not a thermosensitive gel material, at least one of the following methods shall be used to dissolve the suspension medium: shaking, washing with water, and enzyme dissolution.

[0071] When the suspension medium is a thermosensitive gel material (i.e., including gelatin, Pluronic-F127 gelatin), the suspension medium is dissolved at the gel temperature point by utilizing the thermosensitive properties of the gel-sol transition.

[0072] Two specific embodiments are given below to illustrate the application of the method proposed in the embodiments of the present invention.

[0073] Example 1: Preparation of PDMS-based biphase elastomer ink and conductive ink

[0074] To thoroughly remove air bubbles from the PDMS precursor material, the PDMS precursor material after bubble removal was mixed with a 3% PVA aqueous solution at a volume ratio of 1:15. The mixture was stirred at high speed at 9000 rpm for 10 minutes, and then transferred to a magnetic stirrer and stirred at 90°C and 1200 rpm for two hours to form a PVA solution containing PDMS microspheres.

[0075] At room temperature, a solution containing PDMS microspheres is subjected to a series of steps including filtration, centrifugation, enrichment, and freeze-drying to remove impurities and liquid water from the PDMS microspheres, resulting in solid PDMS microspheres with a size of 10–25 micrometers, i.e., elastomer microspheres. Figure 2 This is a schematic diagram of PDMS microspheres in an embodiment of the present invention, wherein, Figure 2 Image A in the middle is a scanning electron microscope image of the microspheres; Figure 2 (B) Statistical analysis of microsphere sizes prepared with different process parameters. Scale bar: 20 μm.

[0076] The prepared elastomer microspheres were mixed with a PDMS precursor solution at a mass ratio of 43:57 to prepare a PDMS-based biphase elastomer ink; the prepared elastomer microspheres were mixed with a graphene oxide solution at a mass ratio of 60:40 to obtain a conductive ink. Rheological tests showed that both the PDMS-based biphase elastomer ink and the conductive ink exhibited good shear thinning and self-healing properties, demonstrating excellent printing performance and supporting levitation printing to construct flexible electronic devices with complex electrode networks. Figure 3 This is a schematic diagram illustrating the rheological properties of PDMS-based biphase elastomer ink and pure PDMS ink in embodiments of the present invention. Figure 3(A) shows that PDMS biphase elastomer ink has shear-thinning properties, while the viscosity of pure PDMS ink is independent of the shear rate; Figure 3 (B) shows that PDMS-based biphase elastomer ink has strain yielding characteristics, while the modulus of pure PDMS ink is independent of the shear strain rate. Figure 3 The image (C) shows that the PDMS-based biphase elastomer ink has self-healing properties, while the pure PDMS ink remains in a liquid state. Figure 4 These are examples of various models printed using PDMS-based biphase elastomer ink in embodiments of the present invention, wherein... Figure 4 Image (A) shows that PDMS-based biphase elastomer ink can be continuously extruded into filaments. Figure 4 Image (B) shows a hemispherical model printed with PDMS-based biphase elastomer ink. Figure 4 Image C shows a cylinder model printed with PDMS-based biphase elastomer ink. Figure 4 Image (D) shows a hemispherical bronchus model printed with PDMS-based biphase elastomer ink. Figure 4 Image (E) shows an ear model printed with PDMS-based biphase elastomer ink, demonstrating that PDMS-based biphase elastomer ink has good 3D printing performance. Figure 5 The image shows the scanning electron microscope morphology printed using PDMS-based biphase elastomer ink in an embodiment of the present invention. Figure 5 (A) represents the overall morphology. Figure 5 In the middle, (B), (C), and (D) are partial magnifications of (A), with a scale bar of 100 μm. It can be seen that the PDMS-based biphase elastomer ink is composed of microspheres and another continuous phase material. Figure 6 This invention demonstrates the mechanical properties of structures printed using PDMS-based biphase elastomer ink in an embodiment of the invention. Figure 6 (A) shows the degree of deformation of the cyclic compression structure. Figure 6 Figure (B) shows the stress-strain curves after 500 cycles of compression, demonstrating that the structure printed with PDMS-based biphase elastomer ink has good mechanical properties.

[0077] This invention also proposes a flexible electronic device constructed using a suspension 3D printing method.

[0078] The method proposed in this invention involves preparing a biphase elastomer ink, which is a printing ink with printable properties after rheological modification of an elastomer material; preparing a conductive ink, which is a printing ink made by combining an elastomer material with a conductive carrier; printing the biphase elastomer ink in a suspension medium to construct an insulating encapsulation structure for a flexible electronic device; printing the conductive ink inside the insulating encapsulation structure of the flexible electronic device to construct a three-dimensional free-form electrode network; and after the flexible electronic device containing the three-dimensional free-form electrode network is integrally cross-linked and fixed, dissolving out of the suspension medium to obtain the target flexible electronic device containing three-dimensional free-form electrodes. This invention is based on a biphase elastomer ink with both shear-thinning and self-healing properties and a conductive ink with good printability, high conductivity, and stretchability. These two printing inks can not only be printed in a suspension medium but can also serve as a suspension medium for printing the next stage of the structure. This makes them suitable for constructing flexible electronic devices with three-dimensional complex elastomer structures and conductive electrodes, providing a basis for manufacturing high-performance functional flexible electronic devices in fields such as flexible energy storage, flexible sensing, bioelectronic interfaces, and soft robotics.

[0079] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for constructing flexible electronic devices based on levitation 3D printing, characterized in that, include: Prepare a biphase elastomer ink, wherein the biphase elastomer ink is a printing ink with printing properties after rheological modification of an elastomer material; The preparation of biphase elastomer ink includes: mixing elastomer microspheres, all made of elastomer material, with a precursor solution to obtain biphase elastomer ink; Prepare conductive ink, wherein the conductive ink is a printing ink made by combining an elastomer material with a conductive carrier; The biphase elastomer ink is printed in a suspension medium to construct an insulating encapsulation structure for flexible electronic devices; The conductive ink is printed inside the insulating encapsulation structure of the flexible electronic device to construct a three-dimensional freeform electrode network; After the flexible electronic device containing a three-dimensional free-form electrode network is integrally cross-linked and fixed, the suspension medium is dissolved to obtain the target flexible electronic device containing three-dimensional free-form electrodes.

2. The method as described in claim 1, characterized in that, It may also include: By adding a modifier to an elastomer material, a biphase elastomer ink can be obtained.

3. The method as described in claim 2, characterized in that, Also includes: Elastomer microspheres are prepared using at least one of the following methods: droplet microfluidics, emulsification, and mechanical fragmentation. The diameter of the elastomer microspheres is 10 μm to 1000 μm; The mass ratio of the elastomeric microspheres in the biphase elastomer ink is 40% to 80%.

4. The method as described in claim 2, characterized in that, The mass-volume concentration of the precursor solution is 1 mg / mL to 100 mg / mL.

5. The method as described in claim 2, characterized in that, The modifier includes nano-clay materials and / or long-chain polymers; The nano-clay material is at least one of nano-montmorillonite, nano-kaolinite, nano-sepiolite, nano-piperite, and nano-vermiculite; The long-chain polymer is at least one of polyamide, polyethylene, polypropylene, polyester, epoxy resin, polyurethane, and phenolic resin; The mass-volume concentration of the modifier is 10 mg / mL to 100 mg / mL.

6. The method as described in claim 1, characterized in that, The elastomer material is a natural polymer hydrogel material and / or a synthetic polymer hydrogel material; The elastomeric material of the conductive ink is a natural polymer hydrogel material and / or a synthetic polymer hydrogel material.

7. The method as described in claim 1, characterized in that, The conductive carrier is a metal-based conductive material and / or a carbon-based conductive material; The metal-based conductive material is at least one of gold nanoparticles, silver nanoparticles, silver nanowires, and micron-sized silver sheets. The carbon-based conductive material is at least one of carbon black, carbon fiber, graphene oxide, and carbon nanotubes.

8. The method as described in claim 1, characterized in that, The insulating packaging structure of the flexible electronic device includes at least one of the following: a three-dimensional layered structure, a tubular structure, and a block structure that closely adheres to the cerebral cortex, bone tissue, muscle tissue, vascular tissue, and nerve tissue. The size of the insulating packaging structure of the flexible electronic device is 300μm~100mm.

9. The method as described in claim 1, characterized in that, Dissolving the suspension medium includes: When the suspension medium is not a thermosensitive gel material, at least one of the following methods shall be used to dissolve the suspension medium: shaking, washing with water, and enzyme lysis. When the suspension medium is a thermosensitive gel material, the suspension medium is dissolved at the gel temperature point by utilizing the thermosensitive properties of the gel-sol transition.

10. A flexible electronic device constructed by the method of any one of claims 1 to 9.

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