Apparatus, method and computer program product for inspecting at least side surfaces of a semiconductor device

Abstract

An apparatus, method and computer program product for inspecting at least a side surface of a semiconductor device are disclosed. A frame construction is provided that holds a camera that defines an imaging light beam path. The semiconductor device is inserted into a mirror block. The mirror block has a first mirror, a second mirror, a third mirror and a fourth mirror, wherein the mirrors are arranged such that they surround a free space in the form of a rectangle. The opposing first and third mirrors are fixedly mounted and the opposing second and fourth mirrors are movably mounted. A tilt mirror directs an image of the side surface of the semiconductor device generated by the mirror block to the camera.

Description

[0001] Information related to divisional application

[0002] This application is a divisional application of the invention patent application filed on July 27, 2015, with application number 201580080747.5 and entitled "Apparatus, Method and Computer Program Product for Inspecting at Least Side Surfaces of a Semiconductor Device".

[0003] Cross-reference of related applications

[0004] This application claims priority to U.S. Provisional Application No. 62 / 171,906, filed June 5, 2015, the entire contents of which are incorporated herein by reference. Technical Field

[0005] The present invention relates to an apparatus for inspecting at least the side surfaces of a semiconductor device.

[0006] Furthermore, the present invention relates to a method for inspecting at least the side surfaces of a semiconductor device.

[0007] Additionally, the present invention relates to a computer program product disposed on a non-transitory computer-readable medium for inspecting at least the side surface of a semiconductor device, the product comprising computer-executable process steps operable to control a computer. Background Technology

[0008] For example, U.S. Patent 6,339,337B1 discloses an infrared test for semiconductor chips. The test is performed by the following steps: irradiating the bottom surface of the semiconductor chip with infrared light; receiving the infrared light reflected from the bonding pads; and displaying an image of the bonding pads on a monitor. The image obtained from the infrared light contains information about whether the bonding pads themselves or the portion of the silicon substrate beneath them has defects or whether there is any misalignment of the bonding pads relative to bumps.

[0009] Chinese utility model CN ​​2791639(Y) discloses a detection device, which is mainly used to detect internal defects in semiconductor materials with a band gap greater than 1.12 eV. The detection device for detecting internal defects in semiconductor materials consists of an optical microscope, an infrared CCD camera, a video cable, an analog image monitor, a digital image acquisition card, a computer, and analysis and display software.

[0010] Additionally, EP 2 699 071 A2 discloses a photoelectronic method for recording the temperature distribution of the ground in the form of a thermal map, wherein an infrared scanning system is used in an aircraft. The device utilizes a rotating scanning mirror system that receives thermal radiation passing through a window. The mirror system has four reflective sides and rotates about an axis via an electric motor. The radiation is guided through the mirror to an IR lens and thus to a row of photoelectronic receiver elements. The row of receiver elements is parallel to the rotation axis of the mirror system, and each receiver element is individually connected to a corresponding one of several light-emitting diodes via leads and an amplification device.

[0011] Figure 1 illustrates a conventional method for locating side defects 9 in a semiconductor device 2. Four- or five-sided inspection is performed. The semiconductor device 2 has a first side surface 31, a second side surface 32, a third side surface 33, a fourth side surface 34, a top surface 4, and a bottom surface 5. In the setup of Figure 1, a camera 6 with a lens 7 examines the bottom surface 5 of the semiconductor device 2. Mirrors 8 are arranged at 45-degree angles to each of the first side surface 31, second side surface 32, third side surface 33, and fourth side surface 34 of the semiconductor device 2. In Figure 1, only the second mirror 82, arranged relative to the second side surface 32 of the semiconductor device 2, and the fourth mirror 84, arranged relative to the fourth side surface 34 of the semiconductor device 2, are shown.

[0012] The setup of Figure 1 is used to obtain images 10 of the first side surface 31, the second side surface 32, the third side surface 33, the fourth side surface 34, and the bottom surface 5 (see Figure 2). The setup of Figure 1 has significant drawbacks. The optical length 11 of the bottom surface 5 view differs from the optical length 12 of the first side surface 31, the second side surface 32, the third side surface 33, and the fourth side surface 34 views. Therefore, the focal point is always a compromise between the focal point on the bottom surface 5 of the semiconductor device 2 and the focal points on the first side surface 31, the second side surface 32, the third side surface 33, and the fourth side surface 34, respectively. If images showing both the four side surfaces 31, 32, 33, 34, and the bottom surface 5 are obtained, then during what is commonly referred to as the 5S test, the optical system requires a very large depth of focus to keep both the four side surfaces 31, 32, 33, 34, and the bottom surface 5 in focus. This is extremely challenging at increased magnification.

[0013] According to existing techniques, custom mirror blocks are interchangeable. For a range of semiconductor device sizes, custom mirror blocks (blocks with four 40- to 48-degree mirrors) are used. When another range of semiconductor devices needs to be inspected, the entire mirror block must be swapped. The disadvantages are the need to retain expensive conversion parts and lead time. The main disadvantages are: cost, flexibility, manual conversion, and the risk of error. Each range of semiconductor device sizes requires conversion parts. These parts are custom-made and therefore must be designed and manufactured before they are available. This results in a loss of flexibility, as design must begin just before the range of semiconductor devices is ready to be brought online. When converting tools, line technicians or operators need to manually change the mirror blocks. Installing the wrong type can lead to damage to the tool or semiconductor device.

[0014] Another existing technical solution involves mechanizing the mirrors in two separate inspection stations. A front and rear image of the semiconductor device's side surface is acquired via an automated optical setup. A left and right image of the semiconductor device's side surface is also acquired via a separate automated optical setup. Therefore, the mirrors are automatically adjusted at both inspection stations when the size of the semiconductor device changes. The disadvantages are that the semiconductor device needs to pass through two inspection stations, which increases cost and space consumption.

[0015] A further existing technique involves moving a cell or mirror block. In this concept, the front / left surface of the semiconductor device is inspected, then the cell or mirror block is moved, and subsequently the rear / right surface of the semiconductor device is inspected (other substitutions are possible while always inspecting two adjacent sides). The main drawback is the slow inspection speed, which reduces throughput.

[0016] Figure 3A The 3C demonstration showcases the mobility of all four mirrors 81, 82, 83, and 84, designed according to existing technology. Here, the assembly of the first mirror 81 and the third mirror 83, as well as the assembly of the second mirror 82 and the fourth mirror 84, are moved and adapted to the size of the semiconductor device 2. The disadvantage of this arrangement is its extreme complexity and its applicability only to semiconductor devices of a limited size range. Summary of the Invention

[0017] The purpose of this invention is to provide an apparatus for inspecting at least the side surfaces of a semiconductor device, the apparatus being cost-effective, flexible, reliable, economical and easy to use in a variety of applications.

[0018] The above objective is achieved by an apparatus for inspecting at least the side surfaces of a semiconductor device. The apparatus includes:

[0019] The camera defines the path of the imaging beam;

[0020] A mirror block having a first mirror, a second mirror, a third mirror, and a fourth mirror, the mirrors being arranged such that they surround free space in a rectangular form, and the opposing first and third mirrors being fixedly mounted while the opposing second and fourth mirrors are movably mounted; and

[0021] A tilting mirror is used to guide the image from the side surface of the mirror block to the camera.

[0022] The advantage of the device of the present invention is its flexibility. Once the device of the present invention (the optical module of the present invention) is installed, it can handle the entire range of semiconductor device sizes (square and rectangular) without the need for new components. The optical resolution remains equal for the full range of semiconductor device types. Therefore, there is no need for recalibration or resolution modeling. In addition, the compactness of the device of the present invention allows the entire assembly to be installed in a single slot in a rotary table-based machine.

[0023] A further object of the present invention is to provide a method for inspecting at least the side surfaces of a semiconductor device, wherein the method is easy to apply, applicable to a variety of different types of semiconductor devices, cost-effective, flexible, reliable, economical and easy to use in a variety of applications.

[0024] This objective is achieved through a method for inspecting at least the side surfaces of a semiconductor device. The method includes:

[0025] The semiconductor device is placed centrally in a free space defined by a mirror block, the mirror block having a first fixed mirror and a third fixed mirror, as well as a second movable mirror and a fourth movable mirror;

[0026] Information about the type of the semiconductor device is provided to the control unit;

[0027] Move the second mirror and the fourth mirror such that a second distance between the corresponding side surface of the semiconductor device and the second mirror and the fourth mirror is equal to a first distance between the corresponding side surface of the semiconductor device and the first fixed mirror and the third fixed mirror; and

[0028] The camera's focal position is adjusted along the imaging beam path to compensate for the change in focal length.

[0029] The advantage of the method of this invention is its flexibility, as it can handle a full range of semiconductor device sizes (square and rectangular) without requiring the exchange of parts for ongoing inspection processes. Using the method of this invention, semiconductor devices can be inspected reliably, quickly, and uncomplicatedly.

[0030] The present invention also aims to provide a computer program product disposed on a non-transitory computer-readable medium for inspecting at least the side surface of a semiconductor device, the product allowing for the inspection of multiple semiconductor devices of various types, and being flexible in use while avoiding damage to the semiconductor device being inspected.

[0031] The above objective is achieved by a computer program product disposed on a non-transitory computer-readable medium for inspecting at least the side surfaces of a semiconductor device, the product comprising computer-executable process steps operable to control a computer to perform the following actions:

[0032] The semiconductor device is placed into the free space of the mirror block using a placement mechanism;

[0033] Determine the type of the semiconductor device;

[0034] According to the type of the semiconductor device, the second and fourth mirrors of the mirror block are moved such that a second distance between the corresponding side surface of the semiconductor device and the second and fourth mirrors is equal to a first distance between the corresponding side surface of the semiconductor device and the first and third fixed mirrors of the mirror block; and

[0035] The camera's focal position is adjusted along the imaging beam path to obtain focused images of at least four side surfaces of the semiconductor device.

[0036] Typical defects detected by this invention are side cracks generated during the dicing process of a semiconductor device or embedded cracks caused by internal stress in the workpiece. If the workpiece is a semiconductor device, then internal stress may exist, for example, between the dielectric layer and the silicon structure. It should be noted that this invention (apparatus, method, and computer program) is generally not limited to semiconductor devices and is applicable to both side and internal defects.

[0037] The main innovation of this device is the combination of two symmetrical moving mirrors to fix two other mirrors. When the semiconductor device is replaced by a semiconductor device of a different size, the moving mirrors are repositioned such that the distance between the side surface of the semiconductor device and the fixed mirror is equal to the distance between the side surface of the semiconductor device and the moving mirror. To compensate for changes in focal length, the camera is moved linearly. This can also be achieved by using a zoom lens setting and autofocus.

[0038] Due to the compactness of the device of the present invention (which is an elongated module), the present invention is a key building block for wafer-to-assembly inspection machines based on a transposeer. In this tool, a compact, automatically switching optical setup is required.

[0039] According to an embodiment of the present invention, an apparatus for inspecting at least the side surfaces of a semiconductor device has a housing defining a compact module. Inside the housing, a camera defining an imaging beam path is linearly movable along the imaging beam path. A mirror block is used to image at least four side surfaces of the semiconductor device. The mirror block includes a first mirror, a second mirror, a third mirror, and a fourth mirror. The mirrors are arranged such that they surround a free space in a rectangular form. The free space of the mirror block is accessible from outside the housing. The opposing first and third mirrors are fixedly mounted, and the opposing second and fourth mirrors are movably mounted, allowing the apparatus of the present invention to be adjusted for various types of semiconductor devices. A tilting mirror is arranged in the housing relative to the camera and the mirror block such that the image of at least the side surfaces of the semiconductor device in the mirror block is guided to the camera.

[0040] A first motor, disposed within the housing, is used to linearly move the camera along the direction of the imaging beam path. A second motor, disposed within the housing, is assigned to the opposing second and fourth mirrors to position the mirrors such that a first distance between the side surface of the semiconductor device and the corresponding first and third fixed mirrors is equal to a second distance between the side surface of the semiconductor device and the corresponding second and fourth mirrors. A tilting mirror is disposed within the housing relative to the camera and the mirror block such that the image of at least the side surface of the semiconductor device in the mirror block is guided to the camera. Combined with a zoom lens / autofocus moving mirror, this allows for adjustment of the focus position, enabling all types of semiconductor devices to image with the correct focus position.

[0041] Using this invention, interchangeable custom mirror blocks are no longer necessary. For a range of semiconductor device sizes, a mirror block with two opposing movable mirrors is used. Extensive replacement of the entire mirror block is no longer required. This saves costs because it eliminates the need for expensive conversion parts and reduces lead time.

[0042] Another embodiment relates to an apparatus that includes a light source in a housing for generating light to illuminate the side surface of a semiconductor device.

[0043] It should be understood that the foregoing general description and the following detailed description are merely illustrative and not intended to limit the invention. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the objectives of the invention. The description and drawings together serve to explain the principles of the invention. Attached Figure Description

[0044] The invention and its advantages will be further described below with reference to the accompanying drawings, in which:

[0045] Figure 1 shows a prior art setup for detecting internal defects by viewing the side of a semiconductor device;

[0046] Figure 2 is a schematic diagram of the image obtained through the settings shown in Figure 1;

[0047] Figure 3A The diagram at 3C is a traditional arrangement of four motorized mirrors to accommodate various sizes of semiconductor devices;

[0048] Figure 4 This is a schematic diagram of the semiconductor device to be tested;

[0049] Figure 5 This is a schematic top view of an apparatus used to perform inspection of the four side surfaces of a first-type semiconductor device;

[0050] Figure 6 This is a schematic top view of an apparatus used to perform inspection of the four side surfaces of a second type of semiconductor device;

[0051] Figure 7 This is a schematic top view of an apparatus used to inspect the four side surfaces of a third type of semiconductor device;

[0052] Figure 8 This is a schematic top view of an apparatus used to perform inspection of the four side surfaces of a type 4 semiconductor device;

[0053] Figure 9 It is used to implement such Figure 5 A schematic side view of the apparatus for inspecting the four side surfaces of the semiconductor device shown in the image;

[0054] Figure 10 This is a perspective view of an embodiment of the apparatus of the present invention for inspecting the side surfaces of a semiconductor device;

[0055] Figure 11 It is used for such as Figure 10 The diagram shows a perspective view of an embodiment of the invention's device for inspecting the side surface of a semiconductor device, with the housing portion removed.

[0056] Figure 12 It is used for such as Figure 10 The diagram shows a top view of an embodiment of the invention's device for inspecting the side surface of a semiconductor device, with the housing portion removed.

[0057] Figure 13 yes Figure 10 , 11 Or an enlarged perspective view of the mirror block of the embodiment shown in 12; and

[0058] Figure 14 This is a schematic view of a mount used to feed semiconductor devices to a mirror block. Detailed Implementation

[0059] In the figures, similar element symbols are used for similar elements or elements with similar functions. Furthermore, for the sake of simplicity, only the element symbols necessary for discussing the corresponding figures are shown in the figures.

[0060] Figure 4 This is a schematic diagram of a semiconductor device 2 tested by the device or method of the present invention. The semiconductor device 2 has a cubic form having a first side surface 31, a second side surface 32, a third side surface 33, a fourth side surface 34, a top surface 4, and a bottom surface 5. Different types of semiconductor devices exist with different external dimensions.

[0061] Figure 5 This is a schematic top view of a device 20 used for inspecting the first side surface 31, second side surface 32, third side surface 33, and fourth side surface 34 of a first-type semiconductor device 2. According to... Figure 5 The top view shown depicts various types of semiconductor devices 2 in rectangular or square form. A mirror block 18 defines a free space 16 in which the semiconductor device 2 to be tested is positioned. The free space 16 of the mirror block 18 is defined by a first mirror 81, a second mirror 82, a third mirror 83, and a fourth mirror 84. The free space 16 has a rectangular shape 17 (see [reference]). Figure 5 (The dashed lines in the image). The first mirror 81, the second mirror 82, the third mirror 83, and the fourth mirror 84 are arranged parallel to the sides of the rectangle 17.

[0062] The first mirror 81 and the third mirror 83 are fixedly mounted. The second mirror 82 and the fourth mirror 84 are movably mounted. The second mirror 82 and the fourth mirror 84 are coupled to the second motor 14. Using the second motor 14, the symmetrical positions of the second mirror 82 and the fourth mirror 84 can be changed. Through the position change, the second distance 22 between the second mirror 82 and the corresponding side surface of the semiconductor device 2 and the second distance 22 between the fourth mirror 84 and the corresponding side surface of the semiconductor device 2 can be made equal to the first distance 21 between the first mirror 81 and the corresponding side surface of the semiconductor device 2 and the first distance 21 between the third mirror 83 and the corresponding side surface of the semiconductor device 2.

[0063] Camera 6 uses its lens 7 to capture images of the four side surfaces 31, 32, 33, and 34 of semiconductor device 2 (see [link]). Figure 4 Camera 6 defines an imaging beam path 24 and can be moved linearly along said imaging beam path 24 by a first motor 13. The movement of camera 6 is necessary to compensate for changes in the focal length of device 20. According to another embodiment of the invention, the linear movement of camera 6 can be replaced by a zoom lens setting and autofocus.

[0064] Figure 6 , Figure 7 and Figure 8The apparatus 20 of the present invention is shown, in which different types of semiconductor devices 2 are inspected. Once the mirror block 18 is installed in the apparatus 20, the apparatus 20 achieves full flexibility to inspect the entire range of sizes (square and rectangular) of the semiconductor devices 2. The semiconductor devices 2 can be disposed of without new parts.

[0065] Figure 6 A scenario for inspecting a large square semiconductor device 2 is presented. The second motor 14 performs a symmetrical position change of the second mirror 82 and the fourth mirror 84. This position change makes the second distance 22 between the second mirror 82 and the corresponding side surface of the semiconductor device 2, and the second distance 22 between the fourth mirror 84 and the corresponding side surface of the semiconductor device 2, equal to the first distance 21 between the first mirror 81 and the corresponding side surface of the semiconductor device 2, and the first distance 21 between the third mirror 83 and the corresponding side surface of the semiconductor device 2. The camera adjusts its focal position along the imaging beam path 24. According to a preferred embodiment, the first motor 13 moves the camera 6 along the imaging beam path 24. The movement of the camera 6 is necessary to compensate for changes in the focal length of the device 20.

[0066] Figure 7 A scenario for inspecting a rectangular semiconductor device 2 is presented. The second motor 14 performs a symmetrical positional change of the second mirror 82 and the fourth mirror 84. Through this positional change, the second distance 22 between the second mirror 82 and the corresponding side surface of the semiconductor device 2, and the second distance 22 between the fourth mirror 84 and the corresponding side surface of the semiconductor device 2, can be made equal to the first distance 21 between the first mirror 81 and the corresponding side surface of the semiconductor device 2, and equal to the first distance 21 between the third mirror 83 and the corresponding side surface of the semiconductor device 2. This can be determined according to… Figure 5 and 6 The process described herein adjusts the focus position of the camera.

[0067] Figure 8 The scenario for testing rectangular semiconductor device 2 is illustrated, in which... Figure 7 Compared to the scenario shown, the semiconductor device 2 rotates 90°. The second motor 14 performs a symmetrical position change of the second mirror 82 and the fourth mirror 84. Through this position change, the second distance 22 between the second mirror 82 and the corresponding side surface of the semiconductor device 2, and the second distance 22 between the fourth mirror 84 and the corresponding side surface of the semiconductor device 2, can be equal to the first distance 21 between the first mirror 81 and the corresponding side surface of the semiconductor device 2, and equal to the first distance 21 between the third mirror 83 and the corresponding side surface of the semiconductor device 2.

[0068] Figure 9 It is used to implement such Figure 5The schematic side view of the apparatus 20 of the present invention for inspecting at least four side surfaces 31, 32, 33, and 34 of the semiconductor device 2 is shown. A mirror block 18 having a first mirror 81, a second mirror 82, a third mirror 83, and a fourth mirror 84 surrounds the semiconductor device 2 for inspection. Each of the four mirrors 81, 82, 83, and 84 has a mirror surface 25 tilted at 40 to 48 degrees relative to the side surfaces 31, 32, 33, and 34 of the semiconductor device 2. Images from the side surfaces 31, 32, 33, and 34 are reflected downwards to the tilting mirror 27. The tilting mirror 27 guides the images from the side surfaces 31, 32, 33, and 34 of the mirror block 18 to the camera 6 along the imaging beam path 24.

[0069] Figure 10 This is a perspective view of an embodiment of the apparatus 20 of the present invention used for inspecting the side surface of a semiconductor device 2 (not shown). Several wall panels 31 define a housing 30 of the apparatus 20. The housing 30 at least surrounds the camera 6 and the lens block 18. The lens block 18 is disposed at a first end 33 of the housing 30. As mentioned above, the lens block 18 includes a first lens 81, a second lens 82, a third lens 83, and a fourth lens 84 (see [link to documentation]). Figures 5 to 8 ). Mirror block 18 defines a free space 16 accessible from the outside of housing 30 (see Figure 5 ).

[0070] Figure 11 This is a perspective view of the device 20 of the present invention for inspecting the side surfaces of a semiconductor device, with the wall panel 31 of the housing 30 removed. The device 20 has a frame structure 40 comprising: a camera 6 having a lens 7 and an electronic back 32; a mirror block 18; a tilting mirror 27; and at least one illumination device (see [link to documentation]). Figure 13 ).according to Figures 10 to 13 In the embodiments described herein, device 20 is formed as a single module. Once this optical module is installed, the entire range of semiconductor device sizes (square and rectangular) can be handled without installing new parts. The module allows for easy mobility. A first motor 13 is assigned to camera 6 for adjusting the focus position of camera 6. A second motor 14 is assigned to opposing second mirror 82 and fourth mirror 84 (see...). Figures 5 to 8 This is used to adjust its position relative to the semiconductor device. The first motor 13 and the second motor 14 are not coupled.

[0071] The first motor 13 can also be used for the camera 6, which has a zoom lens 7 and is equipped with autofocus. In order to adjust the focus of the camera 6, the first motor 13 is coupled to the slider 15 via a lead screw to perform linear movement 35 of the camera 6 and / or lens 7 along the imaging beam path 24.

[0072] The second motor 14 drives the lead screw 34 and moves the second mirror 82 and the fourth mirror 84 simultaneously via the cam mechanism 36.

[0073] The tilting mirror 27 guides the image of the mirror block 18 to the camera 6 along the imaging optical path.

[0074] Figure 12 This is a top view of the apparatus 20 of the present invention used for inspecting the side surfaces of semiconductor devices. (See attached image.) Figure 11 As mentioned in the description, the housing portion has been removed. The free space 16 of the mirror block 18 can accommodate the entire range of sizes of the semiconductor device to be tested without the need for new sections. The entire device 20 has a compact and elongated design. The device 20 extends from the first end 33 to the electronic back 32 of the camera. The first motor 13 and the second motor 14 are also fitted into the compact and elongated design.

[0075] Figure 13 yes Figure 10 and 11 An enlarged perspective view of the mirror block 18 at the first end 33 of the embodiment shown. Each of the first mirror 81, second mirror 82, third mirror 83, and fourth mirror 84 has a mirror surface 25 tilted at 40 to 48 degrees. Below the mirror block 18, an illumination device 38 is provided to illuminate a semiconductor device positioned within the free space 16 defined by the first mirror 81, second mirror 82, third mirror 83, and fourth mirror 84 of the mirror block 18 for inspection. An image of the side surface of the semiconductor device is reflected to the camera via a tilting mirror 27. Although not shown in the embodiments described above, a view of the bottom surface of the semiconductor device may also be used, allowing for bottom surface inspection. To perform the so-called five-side inspection (5S inspection), a very large depth of focus is required to keep both the side and bottom surfaces in focus.

[0076] Due to the compactness of device 20 (see...) Figure 10 The entire assembly can be installed in a single slot of the rotary table-based machine 41. Figure 14 This is a schematic view of a rotary table 42 of a rotary table-based machine 41 used to feed semiconductor devices 2 to a mirror block 18. The rotary table 42 has multiple retaining arms 43. The rotary table 42 is rotated by a controller 23 to position the retaining arms 43 relative to the mirror block 18. Each retaining arm 43 is configured to place the semiconductor device in the free space of the mirror block 18. Images from at least four side surfaces are sent to a computer 26 for data processing. Using the rotary table 42, a series of semiconductor devices 2 can be automatically positioned in the mirror block 18 for inspection.

[0077] Numerous specific details have been set forth in the foregoing description to provide a thorough understanding of embodiments of the invention. However, the foregoing description of the illustrative embodiments of the invention is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Those skilled in the art will recognize that the invention may be practiced without one or more of the specific details or by using other methods, components, etc. In other instances, well-known structures or operations have not been shown or described in detail so as not to obscure aspects of the invention. As those skilled in the art will recognize, although specific embodiments and examples of the invention have been described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention.

[0078] Given the detailed description above, such modifications may be made to the invention. The terminology used in the following claims should not be construed as limiting the invention to the specific embodiments disclosed in this specification and claims. Rather, the scope of the invention will be determined by the following claims as interpreted according to the established principles set forth in the claims.

[0079] Component Symbol List

[0080] 2 Semiconductor devices

[0081] 31 First side surface

[0082] 32 Second side surface

[0083] 33 Third side surface

[0084] 34 Fourth side surface

[0085] 4. Top surface

[0086] 5 Bottom surface

[0087] 6 cameras

[0088] 7 Lenses

[0089] 81 First Shot

[0090] 82 Second Shot

[0091] 83 Third Frame

[0092] 84 Fourth Frame

[0093] 9 Defects / Internal Defects

[0094] 10 images

[0095] 11 optical length

[0096] 12 optical length

[0097] 13 First Motor

[0098] 14 Second Motor

[0099] 15 sliding parts

[0100] 16 Free Space

[0101] 17 rectangles

[0102] 18 mirror blocks

[0103] 20 devices

[0104] 21 First Distance

[0105] 22 Second Distance

[0106] 23 controllers

[0107] 24 Imaging Beam Paths

[0108] 25 mirror surface

[0109] 26 Computers

[0110] 27 Tilting Mirror

[0111] 30 casing

[0112] 31 wall panels

[0113] 32 Electronic Back

[0114] 33 First End

[0115] 34 lead screw

[0116] 35 linear shift

[0117] 36 Cam Mechanism

[0118] 38 lighting fixtures

[0119] 40-frame construction

[0120] 41. Rotary-based machines

[0121] 42-spinner

[0122] 43 Keep arm

Claims

1. An apparatus for inspecting at least one side surface of a semiconductor device, comprising: Framework construction; A camera, which is mounted to the frame structure, defines the imaging beam path; A mirror block is arranged at the first end of the frame structure, wherein the mirror block has a first mirror, a second mirror, a third mirror and a fourth mirror, which are arranged such that they surround a free space in a rectangular form and the free space can be accessed from outside the frame structure, and wherein the opposing first mirror and the third mirror are fixedly installed and the opposing second mirror and the fourth mirror are movably installed. A tilting mirror, which is mounted to the frame configuration relative to the camera and the mirror block, such that an image of at least the side surface of the semiconductor device in the mirror block is guided to the camera; A first motor is mounted to the frame structure for adjusting the focus position of the camera; A second motor is mounted to the frame structure for positioning the second and fourth mirrors such that a first distance between the side surface of the semiconductor device and the corresponding first and third mirrors is equal to a second distance between the side surface of the semiconductor device and the corresponding second and fourth mirrors. as well as An illumination device is arranged below the mirror block to illuminate the semiconductor device positioned in the free space defined by the first, second, third, and fourth mirrors of the mirror block for testing, wherein: The frame structure, the camera, the lens block, the tilting mirror, the first motor, the second motor, and the lighting device are arranged in a single module. The individual module has an elongated shape and the mirror block is disposed at the first end along the longitudinal direction of the individual module. The device further includes a plurality of holding arms, each holding arm configured to hold the semiconductor device to be inspected, and each of the plurality of holding arms is further configured to place the semiconductor device in the free space of the mirror block.

2. The device according to claim 1, wherein the first motor is a portion of the camera having a zoom lens setting and autofocus.

3. The device according to claim 1, wherein the lead screw is driven by the first motor and coupled to the slider of the camera via the driven lead screw.

4. The device according to claim 1, wherein the lead screw is driven by the second motor and moves the second mirror and the fourth mirror simultaneously via a cam mechanism.

5. The device of claim 1, wherein the first mirror, the second mirror, the third mirror, and the fourth mirror of the mirror block define a mirror surface inclined at 40 to 48 degrees relative to the side surface of the semiconductor device.

6. The device of claim 1, wherein the camera is capable of linear movement along the imaging beam path.

7. The device of claim 1, wherein the first motor and the second motor are arranged to face different sides relative to the camera.

8. The device of claim 1, wherein the first motor is arranged to face a first side relative to the camera, and the second motor is arranged to face a second side opposite to the first side.

9. An apparatus for inspecting at least one side surface of a semiconductor device, comprising: Framework construction; A camera, which is mounted to the frame structure, defines the imaging beam path; A mirror block is arranged at the first end of the frame structure, wherein the mirror block has a first mirror, a second mirror, a third mirror and a fourth mirror, which are arranged such that they surround a free space in a rectangular form and the free space can be accessed from outside the frame structure, and wherein the opposing first mirror and the third mirror are fixedly installed and the opposing second mirror and the fourth mirror are movably installed. A tilting mirror, which is mounted to the frame configuration relative to the camera and the mirror block, such that an image of at least the side surface of the semiconductor device in the mirror block is guided to the camera; as well as A rotating base having a plurality of retaining arms, each retaining arm configured to hold a semiconductor device to be inspected, and each of the plurality of retaining arms being further configured to place the semiconductor device in the free space of the mirror block, wherein: The frame structure, the camera, the lens block, and the tilting mirror are arranged in a single module, and the single module has an elongated shape and the lens block is disposed at the first end along the longitudinal direction of the single module.

10. The device according to claim 9, further comprising: A first motor is mounted to the frame structure for adjusting the focus position of the camera; in The first motor is the part of the camera that has a zoom lens and autofocus.

11. The device according to claim 10, further comprising: A second motor is mounted to the frame configuration for positioning the second and fourth mirrors such that a first distance between the side surface of the semiconductor device and the corresponding first and third mirrors is equal to a second distance between the side surface of the semiconductor device and the corresponding second and fourth mirrors.

12. The device of claim 10, wherein the lead screw is driven by the first motor and coupled to the slider of the camera via the driven lead screw.

13. The device of claim 9, wherein the first mirror, the second mirror, the third mirror, and the fourth mirror of the mirror block define a mirror surface inclined at 40 to 48 degrees relative to the side surface of the semiconductor device.

14. The device according to claim 9, further comprising: An illumination device is arranged below the mirror block to illuminate the semiconductor device positioned in the free space defined by the first, second, third, and fourth mirrors of the mirror block for inspection.

15. The device of claim 10, wherein the camera is capable of linear movement along the imaging beam path.

16. The device of claim 11, wherein the first motor and the second motor are arranged to face different sides relative to the camera.

17. The device of claim 11, wherein the first motor is arranged to face a first side relative to the camera, and the second motor is arranged to face a second side opposite to the first side.

Images