Pneumatic microtransport device

Abstract

This invention discloses a pneumatic micro-transport device, including an air compressor connected to a pneumatic solenoid valve via an air pump pipe. The pneumatic solenoid valve is connected to a microcontroller via a relay, and the microcontroller is connected to a LabVIEW host computer via a USB interface. The pneumatic solenoid valve is also connected to a micro-transport array via the air pump pipe, and a transport plate is placed above the micro-transport array. This device is designed based on pneumatic principles. Compared to traditional contact-type transport devices, its transport method avoids failures caused by friction-induced wear. Furthermore, thanks to its non-contact transport characteristics, its application range is further expanded. It employs deep silicon etching micromachining technology, with the silicon plate structure serving as the air chamber channel and nozzle of the micro-transport device, significantly reducing the structural size of the micro-transport device, improving space utilization, and solving problems such as low integration in traditional micro-transport devices.

Description

Technical Field

[0001] This invention belongs to the field of mechanical planar micro-transportation, specifically relating to a pneumatic transport device. Background Technology

[0002] In micro-manufacturing, numerous microelectromechanical systems (MEMS) devices are involved in motion or positioning tasks for microrobots or microchips. Currently, most micro-transport devices are contact-based, while non-contact transport devices hold great promise. Contact-based devices primarily include electrothermal and piezoelectric actuations. This type mainly uses an actuator to generate a force that causes stress and strain on the working surface or directly acts on the driven object to induce displacement. However, this type of contact-based micro-transport device relies on the machining precision of the working surface, which often experiences wear. Furthermore, when the device operates under variable loads, surface wear is exacerbated, affecting actual transport efficiency. This wear can be particularly damaging when transporting fragile workpieces. Non-contact methods include electrostatic, electromagnetic, and gas-driven actuations. Electrostatically driven micro-transport devices exhibit low energy consumption, fast response, and compact structure; however, the electrostatic force is too weak, significantly limiting their application. Electromagnetically driven devices can levitate the transported target by generating a strong electromagnetic force, but prolonged energy supply can exacerbate the Joule heating effect on the coils, even posing a risk of overheating and burnout. Gas-driven systems overcome these shortcomings by controlling the flow rate and direction of compressed gas through multi-directional gas nozzles to achieve multi-degree-of-freedom transport. This method is not only highly efficient but also widely applicable. However, gas-driven systems still have some drawbacks. The complex gas pipelines and nozzles are difficult to integrate into microelectromechanical systems (MEMS). This limitation can be addressed using micro / nano fabrication techniques.

[0003] A micro-transport device is a platform-type device that can efficiently move a micro-workpiece or microchip to the processing position within a micro-working plane. Currently, most of these micro-transport devices use a contact-driven principle. However, this method not only has low applicability, but its working surface inevitably experiences wear, which severely affects its working efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a pneumatic micro-transport device that can accurately transport micro-workpieces or micro-chips to the processing area.

[0005] To achieve the above objectives, the present invention employs the following technical solution:

[0006] A pneumatic micro-transport device includes an air compressor, characterized in that the air compressor is connected to a pneumatic solenoid valve via an air pump pipe, the pneumatic solenoid valve is connected to a microcontroller via a relay, and the microcontroller is connected to a LabVIEW host computer via a USB interface; the pneumatic solenoid valve is also connected to a micro-transport array via an air pump pipe, and a transport plate is disposed above the micro-transport array.

[0007] According to the present invention, the air compressor is model 12LKOMAX, with a discharge capacity of 0.11 m³ and a maximum pressure of 0.8 MPa.

[0008] Specifically, the air pump tube is a high-pressure resistant hose with an inner diameter of 5mm and an outer diameter of 8mm.

[0009] Furthermore, the micro-transport array is composed of two stacked silicon plates of different thicknesses, with the upper silicon plate having a thickness of 2 mm and the lower silicon plate having a thickness of 1 mm, wherein:

[0010] The upper silicon plate adopts a double-sided deep silicon etching process from top to bottom and from bottom to top. The depth of both etching surfaces is 1mm. The upper silicon plate has an etching groove from bottom to top. This etching groove is the gas chamber branch channel of the micro transport array. The width of the gas chamber branch channel is 2mm. The part where the two etching grooves intersect is the gas nozzle of the micro transport array.

[0011] The lower silicon plate is processed using deep silicon etching technology with an etching depth of 1 mm. The lower silicon plate has etching grooves, which are the main channels of the gas chambers of the micro transport array. The width of the main channel of the gas chamber is 3 mm.

[0012] Preferably, the micro transport array includes four gas inlets in different directions and corresponding main gas chamber pipes. Each gas outlet of the micro transport array includes nozzles in the east, west, south, and north directions and gas chamber branch pipes. Each main gas chamber pipe is connected to at least three gas chamber branch pipes, and each gas chamber branch pipe is connected to at least three nozzles.

[0013] The beneficial technical effects of the pneumatic micro-transport device of the present invention are as follows:

[0014] (1) Based on the pneumatic principle, the transportation method avoids failure caused by friction wear compared with the traditional contact transportation device, and thanks to the characteristics of non-contact transportation, its application scope is further expanded.

[0015] (2) Due to the use of deep silicon etching micromachining technology, the structure of the silicon plate serves as the air chamber channel and nozzle of the micro-transport device, which greatly reduces its structural size, improves space utilization, and solves the problem of low integration of the micro-transport device. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the pneumatic micro-transport device of the present invention;

[0017] Figure 2 This is a schematic cross-sectional view of the pneumatic micro-transport device of the present invention;

[0018] Figure 3 This is a schematic diagram of an embodiment of the pneumatic micro-transport device of the present invention;

[0019] The markings in the diagram represent: 1. Air compressor, 2. Air pump pipe, 3. Pneumatic solenoid valve, 4. Relay, 5. Microcontroller, 6. LabVIEW host computer, 7. Miniature transport array, 71. Gas inlet, 72. Main channel of air chamber, 73. Branch channel of air chamber, 74. Nozzle, 8. Transport plate.

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. Detailed Implementation

[0021] This embodiment provides a pneumatic micro-transport device, such as... Figure 1 The diagram shown is a structural schematic of a pneumatic micro-transport device. Figure 2 The diagram shows a cross-sectional view of a pneumatic micro transport array, including an air compressor 1. The air compressor 1 is connected to the input end of a pneumatic solenoid valve 3 via an air pump pipe 2. The pneumatic solenoid valve 3 is connected to a microcontroller 5 via a relay 4. The microcontroller 5 is connected to a LabVIEW host computer via a USB interface. The pneumatic solenoid valve 3 is also connected to a micro transport array 7 via the air pump pipe 2. A transport plate 8 is placed above the micro transport array 7.

[0022] The micro-transport array 7 is composed of two stacked silicon plates of different thicknesses. The upper silicon plate is 2 mm thick, and the lower silicon plate is 1 mm thick.

[0023] The upper silicon plate adopts a double-sided deep silicon etching process from top to bottom and from bottom to top. The depth of both etching surfaces is 1mm. The upper silicon plate has an etching groove from bottom to top. The etching groove is the gas chamber branch channel 73 of the micro transport array 7. The width of the gas chamber branch channel 73 is 2mm. The part where the two etching grooves intersect is the gas nozzle 74 of the micro transport array 7.

[0024] The lower silicon plate is processed using deep silicon etching technology with an etching depth of 1 mm. The lower silicon plate has an etching groove, which is the main gas chamber channel 72 of the micro transport array 7. The width of the main gas chamber channel 72 is 3 mm.

[0025] The micro transport array 7 includes four gas inlets 71 in different directions and corresponding main gas chamber pipes 72. Each gas outlet of the micro transport array 7 includes nozzles 74 in the east, west, south and north directions and gas chamber branch pipes 73. Each main gas chamber pipe 72 is connected to at least three gas chamber branch pipes 73, and each gas chamber branch pipe 73 is connected to at least three nozzles 74.

[0026] In this embodiment, the pneumatic solenoid valve 3 is connected to a power source, and the air compressor 1 is model 12LKOMAX with a discharge capacity of 0.11 m³ and a maximum pressure of 0.8 MPa.

[0027] The air pump pipe 2 is a high-pressure resistant flexible tube with an inner diameter of 5mm and an outer diameter of 8mm.

[0028] The LabVIEW host computer 6 sends commands to the microcontroller 5 via a serial communication USB interface. The microcontroller 5 controls the on / off state of the relay 4 via signal lines. The output of the relay 4 is connected to the control terminal of the pneumatic solenoid valve 3, thereby enabling control of the pneumatic solenoid valve 3 through the host computer program. The output of the pneumatic solenoid valve 3 is connected to the miniature transport array 7 via the air pump tube 2. First, high-pressure gas enters the main channel 72 of the air chamber from the gas inlet 71 of the miniature transport array 7. The four gas inlets 71 correspond to the airflow directions of the east, west, south, and north positions, respectively, and each main channel 72 of the air chamber is connected to the six branch channels 73 of the air chamber. Figure 1 For ease of illustration, only three gas chamber branch channels are shown. Then, the high-pressure gas flows through the main gas chamber channel 72 to the gas chamber branch channel 73, and finally is ejected from the nozzle 74 at the gas outlet, thereby pushing the transport plate 8 to move.

[0029] The pneumatic micro-transport device in this embodiment is used as follows:

[0030] Figure 3 A schematic diagram of the implementation of the pneumatic micro-transport device is given. In step (1), the LabVIEW host computer 6 sends an instruction to the microcontroller 5 to control the relay 4 and open the switches of the four pneumatic solenoid valves 3, so that the high-pressure gas is injected into the micro-transport array 7 from the air compressor 1 through the air pump pipe 2 and the pneumatic solenoid valves 3. The high-pressure gas enters the corresponding air chamber main channel 72 from the four inlets 71, and then is ejected from the nozzle 74 at the gas outlet position through the air chamber branch channel 73. At this time, gas is ejected from the four directions of each gas outlet, so that the transport plate 8 is in a suspended state.

[0031] In step (2), the LabVIEW host computer 6 sends instructions to the microcontroller 5 to control the relay 4 and open the switches of three pneumatic solenoid valves 3, so that high-pressure gas enters the micro transport array 7 from the three gas inlets 71 respectively. The gas flow direction is the same as in step (1). At this time, only the nozzles 74 at the south, north and east positions of each gas outlet spray out. Under the combined action of these three airflows, the transport plate 8 is driven along the positive x-axis direction.

[0032] In step (3), by opening the pneumatic solenoid valve 3 corresponding to the nozzle 74 in the south, east, and west directions, the transport plate 8 can move along the positive y-axis.

[0033] In addition, the suspension height of the transport plate 8 and the speed of movement of the transport plate 8 can be adjusted by changing the air pressure.

Claims

1. A pneumatic micro-transport device comprising an air compressor (1), characterized in that, An air compressor (1) is connected to a pneumatic solenoid valve (3) via an air pump pipe (2). The pneumatic solenoid valve (3) is connected to a microcontroller (5) via a relay (4). The microcontroller (5) is connected to a LabVIEW host computer via a USB interface. The pneumatic solenoid valve (3) is also connected to a micro transport array (7) via an air pump pipe (2). A transport plate (8) is set above the micro transport array (7). The micro-transport array (7) is composed of two stacked silicon plates of different thicknesses, with the upper silicon plate having a thickness of 2 mm and the lower silicon plate having a thickness of 1 mm, wherein: The upper silicon plate adopts a double-sided deep silicon etching process from top to bottom and from bottom to top. The depth of both etching surfaces is 1mm. The upper silicon plate has an etching groove from bottom to top. The etching groove is the gas chamber branch pipe (73) of the micro transport array (7). The width of the gas chamber branch pipe (73) is 2mm. The part where the two etching grooves intersect is the gas nozzle (74) of the micro transport array (7). The lower silicon plate is processed using deep silicon etching technology with an etching depth of 1 mm. The lower silicon plate has an etching groove, which is the main gas chamber pipe (72) of the micro transport array (7). The width of the main gas chamber pipe (72) is 3 mm.

2. The aerodynamic microtransporter of claim 1, wherein, The air compressor (1) is model 12LKOMAX, with a discharge capacity of 0.11 m and a maximum pressure of 0.8 MPa.

3. The aerodynamic microtransporter of claim 1, wherein, The air pump pipe (2) is a high-pressure resistant hose with an inner diameter of 5mm and an outer diameter of 8mm.

4. The aerodynamic microtransporter of claim 1, wherein, The micro transport array (7) includes four gas inlets (71) in different directions and corresponding gas chamber main pipes (72). Each gas outlet position of the micro transport array (7) includes nozzles (74) in the east, west, south and north directions and gas chamber branch pipes (73). Each gas chamber main pipe (72) is connected to at least three gas chamber branch pipes (73), and each gas chamber branch pipe (73) is connected to at least three nozzles (74).

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