Lens module, control method and control device thereof, and electronic device
By introducing an airbag cavity and adjustment components into the lens module, adaptive fine-tuning of the optical path is achieved, solving the problem of the lens module's performance being affected by external structural deformation and improving imaging results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2023-12-06
- Publication Date
- 2026-05-12
AI Technical Summary
Existing lens modules, due to their fixed object distance and focal length design, cannot adapt to changes in the optical path caused by phenomena such as battery expansion and screen deformation during the use of electronic devices, thus affecting the performance of the lens module.
Design a lens module comprising a lens, a chip, a circuit board, a support assembly, and an adjustment component. The adjustment component is electrically connected to the circuit board to control the expansion or contraction of the airbag cavity, thereby moving the chip closer to or further away from the lens, adjusting the optical focal length, and achieving adaptive fine-tuning of the optical path.
Effective adjustment of the optical path ensures that the lens module maintains excellent performance under external structural deformation, thereby improving image quality.
Smart Images
Figure CN117596471B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic equipment technology, specifically relating to a lens module and its control method, control device and electronic equipment. Background Technology
[0002] In related technologies, the lens module adopts a fixed object distance and focal length design, and the optical path is fixed at the factory. However, during actual use, phenomena such as battery swelling and screen deformation can affect the factory-set optical path. Because existing lens modules are designed with a fixed object distance and focal length, they cannot be adaptively fine-tuned, thus affecting the performance of the lens module. Summary of the Invention
[0003] This application aims to provide a lens module and its control method, control device and electronic device, at least to solve the problem in the related art that the lens module cannot perform adaptive fine-tuning of the optical path, which affects the performance of the lens module.
[0004] To solve the above-mentioned technical problems, this application is implemented as follows:
[0005] In a first aspect, embodiments of this application propose a lens module for use in electronic devices. The lens module includes: a lens; a chip disposed opposite to the lens; a circuit board located on the side of the chip away from the lens; a support assembly disposed on the circuit board between the circuit board and the chip, the support assembly and the circuit board enclosing an airbag cavity, the chip being supported in the airbag cavity; and an adjustment member electrically connected to the circuit board, the adjustment member being capable of expanding the airbag cavity toward the lens to move the chip closer to the lens, or contracting the airbag cavity away from the lens to move the chip away from the lens.
[0006] Secondly, embodiments of this application propose a control method for a lens module, used for a lens module as described in any of the above claims. The control method includes: acquiring state information of the lens module; determining the height compensation amount between the chip and the lens based on the state information; and controlling the adjustment component to operate based on the height compensation amount, so that the airbag cavity drives the chip to move by the height compensation amount.
[0007] Thirdly, embodiments of this application propose a control device for a lens module, used for a lens module as described in any of the above claims, comprising: an acquisition module for acquiring state information of the lens module; a control module for determining the height compensation amount between the chip and the lens based on the state information; and controlling an adjustment component to operate based on the height compensation amount, so that the airbag cavity drives the chip to move by the height compensation amount.
[0008] Fourthly, embodiments of this application provide an electronic device comprising: a lens module as described in any of the preceding claims.
[0009] In the embodiments of this application, the lens module includes a lens, a chip, a circuit board, a support assembly, and an adjustment component. The chip is disposed opposite to the lens, and the circuit board is disposed on the side of the chip away from the lens. Light enters the chip through the lens, realizing the imaging function of the lens module. The support assembly is disposed on the circuit board, and the support assembly and the circuit board enclose an airbag cavity. The chip is disposed on the airbag cavity, so that the chip can move when the airbag cavity deforms. The adjustment component is electrically connected to the circuit board, so that the circuit board can control the adjustment component, thereby causing the airbag cavity to deform, and thus causing the airbag cavity to move towards or away from the lens. When the airbag cavity expands towards the lens, the airbag cavity can move the chip closer to the lens; when the airbag cavity contracts away from the lens, it can move the chip away from the lens, thereby adjusting the optical focal length of the lens module, achieving the effect of adaptive adjustment of the optical path, thereby ensuring the working performance of the lens module and avoiding the influence of external structural deformation on the optical path.
[0010] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0012] Figure 1 This is one of the structural schematic diagrams of a lens module according to an embodiment of this application;
[0013] Figure 2 This is a second schematic diagram of the lens module according to an embodiment of this application;
[0014] Figure 3 This is the third schematic diagram of the lens module according to an embodiment of this application;
[0015] Figure 4 This is the fourth schematic diagram of the lens module according to an embodiment of this application;
[0016] Figure 5 This is the fifth schematic diagram of the lens module according to an embodiment of this application;
[0017] Figure 6 This is the sixth schematic diagram of the lens module according to an embodiment of this application;
[0018] Figure 7 This is the seventh schematic diagram of the lens module according to an embodiment of this application;
[0019] Figure 8This is the eighth schematic diagram of the lens module according to an embodiment of this application;
[0020] Figure 9 This is the ninth schematic diagram of the lens module according to an embodiment of this application;
[0021] Figure 10 This is the tenth schematic diagram of the structure of the lens module according to an embodiment of this application;
[0022] Figure 11 This is a structural schematic diagram of the elastic support member according to an embodiment of this application;
[0023] Figure 12 This is a schematic block diagram of a temperature regulating component according to an embodiment of this application;
[0024] Figure 13 This is one of the flowcharts illustrating a control method for a lens module according to an embodiment of this application;
[0025] Figure 14 This is a second schematic flowchart of the control method for the lens module according to an embodiment of this application;
[0026] Figure 15 This is a schematic block diagram of a control device for a lens module according to an embodiment of this application;
[0027] Figure 16 This is one of the schematic block diagrams of an electronic device according to an embodiment of this application;
[0028] Figure 17 This is a second schematic block diagram of an electronic device according to an embodiment of this application.
[0029] Figure label:
[0030] 10 Lens, 11 Chip, 110 Adhesive Layer, 12 Circuit Board, 13 Support Assembly, 130 Elastic Support, 1302 Elastic Support Sheet, 1304 Rigid Support Sheet, 132 Sealing Part, 134 Airbag Cavity, 136 Support Column, 14 Adjustment Part, 140 Temperature Adjustment Part, 142 Heating Part, 144 Cooling Part, 16 Filter, 17 Gold Wire. Detailed Implementation
[0031] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects.
[0033] In the description of this application, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0035] The following is combined Figures 1-17 This application describes a lens module and its control method, control device, and electronic device according to embodiments thereof.
[0036] like Figure 1 , Figure 2 and Figure 7 As shown, according to some embodiments of this application, this application proposes a lens module for electronic devices. The lens module includes: a lens 10; a chip 11 disposed opposite to the lens 10; a circuit board 12 located on the side of the chip 11 away from the lens 10; a support assembly 13 disposed on the circuit board 12, located between the circuit board and the chip 11, the support assembly 13 and the circuit board 12 enclosing an airbag cavity 134, the chip 11 being supported in the airbag cavity 134; and an adjusting member 14 electrically connected to the circuit board 12, the adjusting member 14 being able to expand the airbag cavity 134 toward the lens 10 to move the chip 11 closer to the lens 10, or to contract the airbag cavity 134 away from the lens 10 to move the chip 11 away from the lens 10.
[0037] In the embodiments of this application, the lens module includes a lens 10, a chip 11, a circuit board 12, a support assembly 13, and an adjustment member 14. The chip 11 is disposed opposite to the lens 10, and the circuit board 12 is disposed on the side of the chip 11 away from the lens 10. Light enters the chip 11 through the lens 10, realizing the imaging function of the lens module. The support assembly 13 is disposed on the circuit board 12, and the support assembly 13 and the circuit board 12 together enclose an airbag cavity 134. The chip 11 is disposed on the airbag cavity 134, so that the deformation of the airbag cavity 134 can drive the movement of the chip 11. The adjustment member 14 is electrically connected to the circuit board 12, so that the circuit board 12 can control the adjustment member 14. Controlling the adjustment member 14 causes the airbag cavity 134 to deform, thereby causing the airbag cavity 134 to move towards or away from the lens 10. When the airbag cavity 134 expands towards the lens 10, it can move the chip 11 closer to the lens 10. When the airbag cavity 134 contracts away from the lens 10, it can move the chip 11 away from the lens 10, thereby adjusting the optical focal length of the lens module and achieving the effect of adaptive adjustment of the optical path. This ensures the working performance of the lens module and avoids the optical path being affected by deformation of the external structure.
[0038] It is understood that chip 11 is electrically connected to circuit board 12. Optionally, chip 11 and circuit board 12 are electrically connected via gold wire 17.
[0039] Optionally, the chip 11 is bonded to the airbag cavity 134 by an adhesive layer 110.
[0040] Optionally, a filter 16 is provided on the side of the chip 11 facing the lens 10.
[0041] According to some embodiments of this application, the regulating member 14 includes: a temperature regulating member 140, electrically connected to the circuit board 12, for heating or cooling the airbag cavity 134; when the temperature regulating member 140 heats the airbag cavity 134, the airbag cavity 134 expands towards the lens 10; when the temperature regulating member 140 cools the airbag cavity 134, the airbag cavity 134 contracts away from the lens 10.
[0042] In this embodiment, such as Figure 8 As shown, when the temperature regulator 140 heats the airbag cavity 134, the air inside the airbag cavity 134 expands, the pressure increases, and it expands towards the lens 10, driving the chip 11 to move towards the lens 10; as Figure 9 As shown, when the temperature regulator 140 cools the airbag cavity 134, the air inside the airbag cavity 134 will contract, the pressure will decrease, and it will then contract away from the lens 10, thereby driving the chip 11 away from the lens 10.
[0043] In some possible designs, the adjusting member 14 can also be an inflation and suction device, which can cause the airbag cavity 134 to expand when the adjusting member 14 inflates the airbag cavity 134, and cause the airbag cavity 134 to contract when the adjusting member 14 suctions air from the airbag cavity 134.
[0044] like Figure 12 As shown, according to some embodiments of this application, the temperature regulating member 140 includes a heating part 142 and a cooling part 144.
[0045] In this embodiment, the temperature regulating member 140 includes a heating part 142 and a cooling part 144. The heating part 142 is used to heat the airbag cavity 134, thereby increasing the temperature of the air in the airbag cavity 134 and causing the air in the airbag cavity 134 to expand, driving the chip 11 to move closer to the lens 10. The cooling part 144 is used to cool the airbag cavity 134, thereby causing the air in the airbag cavity 134 to contract, thereby driving the chip 11 to move away from the lens 10.
[0046] According to some embodiments of this application, the heating section 142 includes a heating wire, and the cooling section 144 includes a cooling plate.
[0047] In this embodiment, the heating unit 142 includes a heating wire, which, when turned on, heats the air inside the airbag cavity 134. The cooling unit 144 includes a cooling plate, which, when turned on, cools the air inside the airbag cavity 134.
[0048] In practical applications, the cooling chip includes a cold end and a hot end. The cold end of the cooling chip is set to correspond to the airbag cavity 134 to achieve cooling of the air inside the airbag cavity 134.
[0049] Optionally, the heating section 142 can also be the hot end of a cooling element. The cooling section 144 can also be a water-cooled structure, a condenser, etc.
[0050] like Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, according to some embodiments of this application, the support assembly 13 further includes: a sealing portion 132 disposed on the circuit board 12; an elastic support member 130, the elastic support member 130 being supported on the sealing portion 132, the elastic support member 130, the sealing portion 132 and the circuit board 12 enclosing an airbag cavity 134, and a chip 11 disposed on the elastic support member 130; when the airbag cavity 134 expands, the elastic support member 130 protrudes towards the lens 10, and when the airbag cavity 134 contracts, the elastic support member 130 is recessed away from the lens 10.
[0051] In this embodiment, the support assembly 13 further includes a sealing portion 132 and an elastic support member 130. The elastic support member 130 is supported by the sealing portion 132 and together with the sealing portion 132 and the circuit board 12, forms an airbag cavity 134. When the airbag cavity 134 expands, the elastic support member 130 protrudes towards the lens 10, causing the chip 11 to move closer to the lens 10; when the airbag cavity 134 contracts, the elastic support member 130 recedes away from the lens 10, causing the chip to move away from the chip 11.
[0052] In specific applications, the regulating component 14 includes a temperature regulating component 140, which is disposed within the airbag cavity 134. The circuit board 12 is electrically connected to the temperature regulating component 140 and is used to regulate the temperature value of the temperature regulating component 140, thereby achieving heating or cooling of the airbag cavity 134. When heating or cooling the airbag cavity 134, the pressure of the gas inside the airbag cavity 134 changes. Since the elastic support component 130 has deformation properties, when the pressure inside the airbag cavity 134 changes, the elastic support component 130 deforms, causing it to bulge towards the lens 10 or to recede away from the lens 10, thereby driving the chip 11 to move and adjust the distance between the chip 11 and the lens 10.
[0053] In specific applications, such as Figure 8 As shown, when the temperature regulator 140 heats the airbag cavity 134, the air inside the airbag cavity 134 expands, increasing the pressure. Consequently, the elastic support 130 protrudes towards the lens 10, and the drive chip 11 moves towards the lens 10. Figure 9 As shown, when the temperature regulating component 140 cools the airbag cavity 134, the air inside the airbag cavity 134 will contract and the pressure will decrease, which will cause the elastic support component 130 to be recessed away from the lens 10, so as to drive the chip 11 away from the lens 10.
[0054] like Figure 4 and Figure 10 As shown, according to some embodiments of this application, the support component 13 further includes a support column 136, which is disposed on the circuit board 12 and located within the airbag cavity 134.
[0055] In this embodiment, the support component 13 further includes a support column 136, which is disposed in the airbag cavity 134 to support and limit the elastic support member 130, thereby preventing the elastic support member 130 from being too concave and causing imaging failure.
[0056] like Figure 7As shown, according to some embodiments of this application, the airbag cavity 134 has an initial state; when the airbag cavity 134 is in the initial state, there is a gap between the elastic support 130 and the end of the support column 136 away from the circuit board 12.
[0057] In this embodiment, the airbag cavity 134 has an initial state. When the airbag cavity 134 is in the initial state, there is a gap between the elastic support member 130 and the end of the support column 136 away from the circuit board 12, which can provide movement space for the elastic support member 130 and the chip 11 in the direction away from the lens 10, thereby realizing the adjustment of the distance between the chip 11 and the lens 10.
[0058] In practical applications, when the airbag cavity 134 is in its initial state, the elastic support 130 is in a flat state.
[0059] According to some embodiments of this application, there are multiple support columns 136, which are spaced apart.
[0060] In this embodiment, there are multiple support columns 136, which are spaced apart to limit the elastic support member 130 at various positions and ensure that there is enough space in the airbag cavity 134.
[0061] Understandably, the adjacent support columns 136 are filled with air.
[0062] Optionally, the support column 136 can be strip-shaped, such as a long strip extending in one direction, or it can be dot-shaped, such as having multiple support columns 136 in one direction, such as each support column 136 being distributed in a dot-shaped manner, like a cylinder.
[0063] like Figure 7 , Figure 8 , Figure 9 and Figure 11 As shown, according to some embodiments of this application, the elastic support member 130 includes: an elastic support sheet 1302 and a rigid support sheet 1304 stacked together. The elastic support sheet 1302 protrudes from the edge of the rigid support sheet 1304 around its periphery. The portion of the elastic support sheet 1302 protruding from the edge of the rigid support sheet 1304 is connected to the sealing portion 132. The chip 11 is disposed on the rigid support sheet 1304. The portion of the elastic support sheet 1302 protruding from the rigid support sheet 1304 can deform to move the rigid support sheet 1304 closer to or away from the lens 10.
[0064] In this embodiment, the elastic support 130 includes a stacked elastic support sheet 1302 and a rigid support sheet 1304. The elastic support sheet 1302 has deformable properties, while the rigid support sheet 1304 ensures effective support for the chip 11. The elastic support sheet 1302 protrudes circumferentially from the edge of the rigid support sheet 1304, and the portion of the elastic support sheet 1302 protruding from the edge of the rigid support sheet 1304 is connected to the sealing portion 132. This achieves both the deformation of the elastic support 130 and the support for the chip 11. Specifically, the portion of the elastic support sheet 1302 protruding from the rigid support sheet 1304 can deform, thereby moving the rigid support sheet 1304 closer to or further away from the lens 10, thus adjusting the distance between the lens 10 and the chip 11.
[0065] The rigid support sheet 1304 can be disposed on the side of the elastic support sheet 1302 close to the lens 10, or on the side of the elastic support sheet 1302 away from the lens 10.
[0066] Optionally, the size of the rigid support plate 1304 is smaller than the size of the sealing portion 132. In this way, the portion of the elastic support plate 1302 protruding from the rigid support plate 1304 is connected to the sealing portion 132, and the other portion is used to deform, thereby realizing the deformation of the elastic support member 130.
[0067] Optionally, the portion where the elastic support sheet 1302 connects to the rigid support sheet 1304 can be either a rigid structure or an elastic structure.
[0068] like Figures 7 to 9 As shown, according to some embodiments of this application, the rigid support sheet 1304 is located on the side of the elastic support sheet 1302 near the lens 10, and the chip 11 is disposed on the rigid support sheet 1304.
[0069] In this embodiment, the rigid support sheet 1304 is disposed on the side of the elastic support sheet 1302 near the lens 10, and the chip 11 is disposed on the rigid support sheet 1304, thereby achieving support for the chip 11 and improving the support effect for the chip 11.
[0070] In practical applications, this application provides a fingerprint module design scheme, which adds an airbag cavity mechanism to the fingerprint module. By controlling the height change caused by the expansion or contraction of the airbag cavity, the height position of the chip 11 in the fingerprint module is adjusted, thereby adjusting the optical focal length and achieving the function of adaptive fine adjustment of the optical fingerprint optical path.
[0071] This application adds a temperature-regulating circuit to the flexible printed circuit (FPC) at the bottom of the chip 11 (e.g., a fingerprint chip). A strip-shaped support post 136 is provided at the upper end of the corresponding circuit. This design forms an airbag-like cavity adjustment structure, ensuring stable support for the chip 11 during bonding. A support sheet (e.g., an elastic support member 130) with sealing rings (e.g., a sealing part 132) is added to the support post 136, enclosing the adjustment circuit and support post 136 in a sealed cavity (e.g., an airbag cavity 134). Air exists between the support posts 136 within the cavity, and this air can expand and contract under the temperature regulation of the circuit. The fingerprint chip is bonded to the support sheet, and during airbag adjustment, it moves up and down as a whole, achieving a more consistent overall movement of the chip 11. Whether to connect the cavity circuit can be determined by the performance system software of the fingerprint module after evaluation. Adjustments are made according to the set step steps, and the expansion height is adjusted according to the condition of the photoelectric fingerprint to achieve the purpose of dynamically adjusting the focal length of the chip 11, and ultimately ensuring the performance of the photoelectric fingerprint in the best state.
[0072] Specifically, an electrical heating / cooling circuit is added to the FPC at the bottom of the fingerprint chip; support pillars 136 are added to the circuit layer, and the shape of the support pillars 136 can be strip-shaped or dot-shaped; a support sheet is added to the support pillars 136 for bonding and fixing the chip 11. The support sheet is composed of a rigid support film and a flexible support film, such as a rigid PET (Polyethylene terephthalate) film and a flexible PET film. The support sheet is surrounded by a sealed adhesive frame, forming a sealed airbag cavity after assembly.
[0073] According to one embodiment of this application, a control method for a lens module is also proposed for the lens module proposed in any of the above embodiments.
[0074] like Figure 13 The diagram illustrates a control method for a lens module according to an embodiment of this application. The control method includes:
[0075] S202: Obtain the status information of the lens module;
[0076] S204: Determine the height compensation amount between the chip and the lens based on the status information;
[0077] S206: Based on the height compensation amount, control the adjustment component to work so that the airbag cavity drives the chip to move by the height compensation amount.
[0078] In this embodiment, the control method includes acquiring the status information of the lens module, determining whether the distance between the chip and the lens needs to be adjusted based on the status information, determining the height compensation amount between the chip and the lens when adjustment is needed, and then controlling the adjustment component to work, so that the airbag cavity moves, so that the chip moves by the height compensation amount, thereby adjusting the distance between the chip and the lens and making the optical path within the lens module accurate.
[0079] It should be noted that the height compensation amount can be set according to the actual situation. For example, the distance between the chip and the lens is calculated as the first distance, and the distance between the chip and the lens needs to be controlled within the second distance range. Therefore, the distance that the chip needs to move can be determined based on the first distance and the second distance range, that is, the height compensation amount is determined.
[0080] It is understandable that in the environment where the lens module is located, structural changes due to collisions or prolonged use can cause changes in the optical path of the lens module. Therefore, the state information of the lens module can be the state information of the environment in which the lens module is located, such as changes in the optical path between the display screen and the lens of the electronic device in which the lens module is located, or the distance between the chip and the lens caused by the expansion of the whole battery. It can also be the imaging information of the lens module. For example, when the image quality is blurry, the distance between the chip and the lens can be adjusted by the lens module control method proposed in this application to improve the image quality.
[0081] According to some embodiments of this application, the control method for the lens module further includes: after the step of controlling the adjustment member to work so that the airbag cavity drives the chip to move by a height compensation amount, the method further includes: returning to the step of obtaining the state information of the lens module to perform cyclic detection on the lens module.
[0082] In this embodiment, the control method for the lens module further includes, after controlling the adjustment component to work and adjusting the chip position, returning to the step of obtaining the state information of the lens module, adjusting the chip position multiple times, realizing cyclic detection of the lens module, and ensuring optimal performance of the lens module.
[0083] According to some embodiments of this application, before the step of obtaining the status information of the lens module, the method further includes: obtaining the on / off state of the electronic device; when the electronic device is in the on state, proceeding to the step of obtaining the status information of the lens module; or obtaining the number of times the lens module has been used; when the number of times it has been used is greater than or equal to the target number of times, proceeding to the step of obtaining the status information of the lens module.
[0084] In this embodiment, the on / off state of the electronic device is obtained. When the electronic device is on, the state information of the lens module is detected, and the position of the chip is adjusted accordingly. Alternatively, when the lens module has been used a certain number of times, the state information of the lens module is detected, and the position of the chip is adjusted accordingly, thereby achieving adaptive fine-tuning of the optical path.
[0085] It should be noted that the target number of times can be set according to the actual situation, such as 1,000 times, 10,000 times, etc.
[0086] According to some embodiments of this application, the electronic device includes a display screen, and the status information includes a distance value between the display screen and a lens.
[0087] In this embodiment, the status information can be the distance between the display screen and the lens. For example, when the display screen of an electronic device is deformed or the battery is swollen, the distance between the display screen and the lens changes, which in turn causes a change in the optical path.
[0088] Alternatively, the height compensation amount can be determined based on the imaging information of the lens module. For example, a first image can be acquired, the first image can be compared with a preset image, and the compensation amount can be determined. The distance between the lens and the chip can be adjusted by adjusting the compensation amount, thereby adjusting the focal length of the lens module.
[0089] In specific applications, electronic devices include mobile phones. For example... Figure 14 As shown, when the phone is powered on or the fingerprint sensor has been used a certain number of times, the system automatically initiates the fingerprint module's application environment change detection. Based on the previously detected data, it calculates the hardware (chip height) compensation amount and sets the electrical requirements for activating the heating circuit, thus automatically adjusting the optical focus. This function can serve as a cyclic testing function to ensure optimal fingerprint usage environment. Combining this with software functionality can increase the adjustment range and yield even better results.
[0090] like Figure 15 As shown, according to some embodiments of this application, a control device 600 for a lens module is proposed for a lens module as described in any of the above claims, comprising: an acquisition module 602 for acquiring state information of the lens module; a control module 604 for determining the height compensation amount between the chip and the lens based on the state information; and controlling the adjustment member to work based on the height compensation amount so that the airbag cavity drives the chip to move by the height compensation amount.
[0091] In the embodiments proposed in this application, the control device 600 of the lens module includes an acquisition module 602 and a control module 604. The acquisition module 602 is used to acquire the status information of the lens module. The control module 604 can determine whether the distance between the chip and the lens needs to be adjusted based on the status information. When adjustment is needed, the control module 604 determines the height compensation amount between the chip and the lens, and then controls the adjustment component to work, so that the airbag cavity moves, so that the chip moves by the height compensation amount, thereby realizing the adjustment of the distance between the chip and the lens, and making the optical path in the lens module accurate.
[0092] It should be noted that the height compensation amount can be set according to the actual situation. For example, the distance between the chip and the lens is calculated as the first distance, and the distance between the chip and the lens needs to be controlled within the second distance range. Therefore, the distance that the chip needs to move can be determined based on the first distance and the second distance range, that is, the height compensation amount is determined.
[0093] It is understandable that in the environment where the lens module is located, structural changes due to collisions or prolonged use can cause changes in the optical path of the lens module. Therefore, the state information of the lens module can be the state information of the environment in which the lens module is located, such as changes in the optical path between the display screen and the lens of the electronic device in which the lens module is located, or the distance between the chip and the lens caused by the expansion of the whole battery. It can also be the imaging information of the lens module. For example, when the image quality is blurry, the distance between the chip and the lens can be adjusted by the lens module control method proposed in this application to improve the image quality.
[0094] According to some embodiments of this application, after the control module 604 controls the adjustment member to work so that the airbag cavity drives the chip to move by a height compensation amount, it is further configured to: return to the step of obtaining the status information of the lens module to perform cyclic detection of the lens module.
[0095] In this embodiment, the control method for the lens module further includes, after controlling the adjustment component to work and adjusting the chip position, returning to the step of obtaining the state information of the lens module, adjusting the chip position multiple times, realizing cyclic detection of the lens module, and ensuring optimal performance of the lens module.
[0096] According to some embodiments of this application, before the step of obtaining the status information of the lens module, the control module 604 is further configured to: obtain the on / off state of the electronic device, and when the electronic device is in the on state, proceed to the step of obtaining the status information of the lens module; or obtain the number of times the lens module has been used, and when the number of times it has been used is greater than or equal to the target number, proceed to the step of obtaining the status information of the lens module.
[0097] In this embodiment, the on / off state of the electronic device is obtained. When the electronic device is on, the state information of the lens module is detected, and the position of the chip is adjusted accordingly. Alternatively, when the lens module has been used a certain number of times, the state information of the lens module is detected, and the position of the chip is adjusted accordingly, thereby achieving adaptive fine-tuning of the optical path.
[0098] It should be noted that the target number of times can be set according to the actual situation, such as 1,000 times, 10,000 times, etc.
[0099] According to some embodiments of this application, the electronic device includes a display screen, and the status information includes a distance value between the display screen and a lens.
[0100] In this embodiment, the status information can be the distance between the display screen and the lens, such as the change in the distance between the display screen and the lens caused by the deformation of the electronic device's display screen or the expansion of the battery, which in turn causes a change in the optical path.
[0101] The device in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television set (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the device.
[0102] The device in this application embodiment can be a device with an operating system. The operating system can be Android, iOS, or other possible operating systems, and this application embodiment does not specifically limit it.
[0103] The apparatus provided in this application embodiment can achieve... Figure 13 The various processes implemented in the method implementation examples will not be described again here to avoid repetition.
[0104] like Figure 16 As shown, according to some embodiments of this application, an electronic device 700 is proposed, including: a processor 702 and a memory 704. The memory 704 stores programs or instructions that can run on the processor 702. When the program or instructions are executed by the processor 702, they implement the steps of the control method for the lens module as proposed in any of the above claims.
[0105] It should be noted that the electronic device 700 in this application embodiment includes the aforementioned mobile electronic device and non-mobile electronic device.
[0106] Figure 17 A schematic diagram of the hardware structure of an electronic device 800 to implement an embodiment of this application.
[0107] The electronic device 800 includes, but is not limited to, components such as: radio frequency unit 801, network module 802, audio output unit 803, input unit 804, sensor 805, display unit 806, user input unit 807, interface unit 808, memory 809, and processor 810.
[0108] Those skilled in the art will understand that the electronic device 800 may also include a power supply (such as a battery) for supplying power to various components. The power supply may be logically connected to the processor 810 through a power management system, thereby enabling functions such as managing charging, discharging, and power consumption through the power management system. Figure 17 The electronic device structure shown does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which will not be elaborated here.
[0109] The processor 810 is used to acquire the status information of the lens module; determine the height compensation amount between the chip and the lens based on the status information; and control the adjustment component to work based on the height compensation amount so that the airbag cavity drives the chip to move by the height compensation amount.
[0110] In this embodiment, the processor 810 acquires the status information of the lens module. Based on the status information, it can determine whether the distance between the chip and the lens needs to be adjusted. If adjustment is needed, it determines the height compensation amount between the chip and the lens, and then controls the adjustment component to work, so that the airbag cavity moves, so that the chip moves by the height compensation amount, thereby adjusting the distance between the chip and the lens and making the optical path within the lens module accurate.
[0111] It should be noted that the height compensation amount can be set according to the actual situation. For example, the distance between the chip and the lens is calculated as the first distance, and the distance between the chip and the lens needs to be controlled within the second distance range. Therefore, the distance that the chip needs to move can be determined based on the first distance and the second distance range, that is, the height compensation amount is determined.
[0112] It is understandable that in the environment where the lens module is located, structural changes due to collisions or prolonged use can cause changes in the optical path of the lens module. Therefore, the state information of the lens module can be the state information of the environment in which the lens module is located, such as changes in the optical path between the display screen and the lens of the electronic device in which the lens module is located, or the distance between the chip and the lens caused by the expansion of the whole battery. It can also be the imaging information of the lens module. For example, when the image quality is blurry, the distance between the chip and the lens can be adjusted by the lens module control method proposed in this application to improve the image quality.
[0113] According to some embodiments of this application, after the step of controlling the adjustment member to work so that the elastic support member drives the chip to move by a height compensation amount, the processor 810 is further configured to: return to the step of obtaining the status information of the lens module to perform cyclic detection of the lens module.
[0114] In this embodiment, the control method for the lens module further includes, after controlling the adjustment component to work and adjusting the chip position, returning to the step of obtaining the state information of the lens module, adjusting the chip position multiple times, realizing cyclic detection of the lens module, and ensuring optimal performance of the lens module.
[0115] According to some embodiments of this application, before the step of obtaining the status information of the lens module, the processor 810 is further configured to: obtain the on / off state of the electronic device, and when the electronic device is in the on state, proceed to the step of obtaining the status information of the lens module; or obtain the number of times the lens module has been used, and when the number of times it has been used is greater than or equal to the target number, proceed to the step of obtaining the status information of the lens module.
[0116] In this embodiment, the on / off state of the electronic device is obtained. When the electronic device is on, the state information of the lens module is detected, and the position of the chip is adjusted accordingly. Alternatively, when the lens module has been used a certain number of times, the state information of the lens module is detected, and the position of the chip is adjusted accordingly, thereby achieving adaptive fine-tuning of the optical path.
[0117] It should be noted that the target number of times can be set according to the actual situation, such as 1,000 times, 10,000 times, etc.
[0118] According to some embodiments of this application, the electronic device includes a display screen, and the status information includes a distance value between the display screen and a lens.
[0119] In this embodiment, the status information can be the distance between the display screen and the lens. For example, when the display screen of an electronic device is deformed or the battery is expanded, the distance between the display screen and the lens changes, which in turn causes a change in the optical path.
[0120] It should be understood that, in this embodiment, the input unit 804 may include a graphics processing unit (GPU) 8041 and a microphone 8042. The GPU 8041 processes image data of still images or videos obtained by an image capture device (such as a camera) in video capture mode or image capture mode. The display unit 806 may include a display panel 8061, which may be configured in the form of a liquid crystal display, an organic light-emitting diode, or the like. The user input unit 807 includes at least one of a touch panel 8071 and other input devices 8072. The touch panel 8071 is also called a touch screen. The touch panel 8071 may include a touch detection device and a touch controller. Other input devices 8072 may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, power buttons, etc.), trackballs, mice, and joysticks, which will not be described in detail here.
[0121] The memory 809 can be used to store software programs and various data. The memory 809 may primarily include a first storage area for storing programs or instructions and a second storage area for storing data. The first storage area may store the operating system, application programs or instructions required for at least one function (such as sound playback, image playback, etc.). Furthermore, the memory 809 may include volatile memory or non-volatile memory, or both. The non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct memory bus RAM (DRRAM). The memory 809 in the embodiments of this application includes, but is not limited to, these and any other suitable types of memory.
[0122] Processor 810 may include one or more processing units; optionally, processor 810 integrates an application processor and a modem processor, wherein the application processor mainly handles operations involving the operating system, user interface, and applications, and the modem processor mainly handles wireless communication signals, such as a baseband processor. It is understood that the aforementioned modem processor may also not be integrated into processor 810.
[0123] Wherein, processor 810 is the processor in the electronic device of the above embodiment.
[0124] This application embodiment also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above-described control method embodiment for the lens module, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0125] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.
[0126] This application provides a computer program product, which is stored in a storage medium and executed by at least one processor to implement the various processes of the control method embodiment of the lens module described above, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0127] According to some embodiments of this application, a readable storage medium is proposed that stores a program or instructions thereon, which, when executed by a processor, performs the control method for the lens module as proposed in any of the above claims.
[0128] Readable storage media include computer-readable storage media such as computer read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0129] According to some embodiments of this application, an electronic device is proposed, comprising: a lens module as proposed in any of the preceding claims.
[0130] According to some embodiments of this application, the lens module includes either a camera module or a fingerprint module.
[0131] In this embodiment, the lens module can be either a camera module or a fingerprint module.
[0132] In practical applications, fingerprint modules include lens-type photoelectric fingerprint modules and ultra-thin photoelectric fingerprint modules.
[0133] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0134] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A lens module for use in electronic devices, characterized in that, The lens module includes: lens; The chip is positioned opposite the lens; A circuit board is located on the side of the chip that faces away from the lens; A support component is disposed on the circuit board and located between the circuit board and the chip. The support component and the circuit board together form an airbag cavity, and the chip is supported in the airbag cavity. An adjusting member, electrically connected to the circuit board, is capable of expanding the airbag cavity toward the lens to move the chip closer to the lens, or contracting the airbag cavity away from the lens to move the chip away from the lens. The support components include: A sealing portion is provided on the circuit board; An elastic support member is provided, which is supported on the sealing part. The elastic support member, the sealing part, and the circuit board together enclose the airbag cavity, and the chip is disposed on the elastic support member. When the airbag cavity expands, the elastic support protrudes towards the lens; when the airbag cavity contracts, the elastic support recedes away from the lens.
2. The lens module according to claim 1, characterized in that, The adjusting element includes: A temperature regulating component, electrically connected to the circuit board, is used to heat or cool the airbag cavity. When the temperature regulator heats the airbag cavity, the airbag cavity expands towards the lens; when the temperature regulator cools the airbag cavity, the airbag cavity contracts away from the lens.
3. The lens module according to claim 1 or 2, characterized in that, The support components also include: A support column is disposed on the circuit board and located within the airbag cavity.
4. The lens module according to claim 3, characterized in that, The airbag cavity has an initial state; When the airbag cavity is in the initial state, there is a gap between the elastic support and the end of the support column away from the circuit board.
5. The lens module according to claim 3, characterized in that, The number of support columns is multiple, and the multiple support columns are arranged at intervals.
6. The lens module according to claim 1 or 2, characterized in that, The elastic support member includes: The elastic support sheet and the rigid support sheet are stacked together. The elastic support sheet protrudes from the edge of the rigid support sheet around its periphery. The portion of the elastic support sheet protruding from the edge of the rigid support sheet is connected to the sealing portion. The chip is disposed on the rigid support sheet. The portion of the elastic support sheet that protrudes from the rigid support sheet can deform to move the rigid support sheet closer to or away from the lens.
7. The lens module according to claim 6, characterized in that, The rigid support sheet is located on the side of the elastic support sheet closer to the lens, and the chip is disposed on the rigid support sheet.
8. A control method for a lens module, used for a lens module as described in any one of claims 1 to 7, characterized in that, The control method includes: Obtain the status information of the lens module; The height compensation amount between the chip and the lens is determined based on the status information; Based on the height compensation amount, the adjusting component is controlled to operate so that the airbag cavity moves the chip by the height compensation amount.
9. The control method for the lens module according to claim 8, characterized in that, After the step of controlling the adjustment member to operate so that the airbag cavity drives the chip to move by the height compensation amount, the method further includes: Return to the step of obtaining the status information of the lens module to perform cyclic detection on the lens module.
10. The control method for the lens module according to claim 8, characterized in that, Before the step of obtaining the status information of the lens module, the method further includes: Obtain the on / off state of the electronic device; if the electronic device is in the on state, proceed to the step of obtaining the state information of the lens module; or The number of times the lens module has been used is obtained. If the number of times the lens module has been used is greater than or equal to the target number, the step of obtaining the status information of the lens module is initiated.
11. The control method for a lens module according to claim 8, wherein the electronic device includes a display screen, characterized in that, The status information includes the distance value between the display screen and the lens.
12. A control device for a lens module, used in any one of claims 1 to 7, characterized in that, include: The acquisition module is used to acquire the status information of the lens module; The control module is used to determine the height compensation amount between the chip and the lens based on the status information; and to control the adjustment component to work based on the height compensation amount so that the airbag cavity drives the chip to move by the height compensation amount.
13. An electronic device, characterized in that, include: The lens module as described in any one of claims 1 to 7.
14. The electronic device according to claim 13, characterized in that, The lens module includes either a camera module or a fingerprint module.