A material loading and unloading device and method for wafer processing

Abstract

The invention relates to the technical field of wafer processing, and discloses a loading and unloading device and method for wafer processing, which solves the problem that the wafer loading and unloading cycle is long and affects the work efficiency. The device comprises a mounting seat, a rotating frame is provided below the mounting seat, a connecting plate is provided above the rotating frame, a rotating shaft is provided above the mounting seat, a driving member for driving the rotating shaft to rotate is provided on the mounting seat, the rotating shaft and the connecting plate are connected by a friction transmission structure, the connecting plate and the rotating frame are connected by a stretching stopper, a pressing ring is provided above the rotating frame, the rotating shaft and the pressing ring are connected by a friction reciprocating moving component, the top of the rotating frame is fixedly connected to a limiting block, two avoidance grooves matching the limiting block are provided on the pressing ring, and the bottom of the rotating frame is fixedly connected to a first wafer adsorption mechanism and a second wafer adsorption mechanism; unloading is carried out while loading, thereby reducing the wafer loading and unloading cycle and increasing the work efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing, and specifically relates to a loading and unloading device and method for wafer processing. Background Art

[0002] As the basic material for manufacturing semiconductor devices and chips, wafers play a pivotal role in the semiconductor industry. The wafer manufacturing process includes ingot manufacturing and chip manufacturing, among which chip manufacturing includes ingot cutting and testing, outer diameter grinding, slicing, rounding, grinding, etching, defect removal, cleaning, inspection, packaging and other steps. In the process of wafer processing, it is necessary to load and unload the wafers by using a robot device, wherein the robot places the wafer in the processing position for processing. When the processing is completed, the processed wafer needs to be taken down by the robot and placed in the unloading position. After the robot places the processed wafer in the unloading position, the robot moves from the unloading position to the loading position and absorbs and takes the wafer. After the wafer is absorbed and fixed, the robot places the wafer in the processing position for processing. The wafer loading and unloading cycle is long, which affects the work efficiency. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a loading and unloading device and method for wafer processing, which effectively solves the problem of long wafer loading and unloading cycle in the above background technology, which affects work efficiency.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a loading and unloading device for wafer processing, comprising a mounting seat, a rotating frame is provided below the mounting seat, a connecting plate is provided above the rotating frame, a rotating shaft is provided above the mounting seat, a driving member for driving the rotating shaft to rotate is provided on the mounting seat, the rotating shaft and the connecting plate are connected by a friction transmission structure, the connecting plate and the rotating frame are connected by a stretching stopper, a pressing ring is provided above the rotating frame, the rotating shaft and the pressing ring are connected by a friction reciprocating moving component, a limiting block is fixedly connected to the top of the rotating frame, and a pressing ring is provided on the pressing ring There are two avoidance grooves that cooperate with the limit blocks, the bottom of the rotating frame is fixedly connected with the first wafer adsorption mechanism and the second wafer adsorption mechanism, the mounting seat is provided with a control unit that cooperates with the first wafer adsorption mechanism and the second wafer adsorption mechanism respectively, the rotating frame is fixedly connected with a stop frame, two baffles that cooperate with the stop frame are provided below the mounting seat, the stop frame is fixedly connected with a pressing column, a movable plate is provided on one side of the baffle, the movable plate is provided with an inclined surface that cooperates with the pressing column, and the mounting seat is provided with a stop sliding avoidance structure that cooperates with the baffle and the movable plate respectively.

[0005] Preferably, the stop sliding avoidance structure includes a slide plate mounted on the outside of the movable plate, the slide plate and the mounting seat are connected by an upward reset unit, the movable plate is fixedly connected to a side plate, the slide plate is fixedly connected to a first support portion, the first support portion and the side plate are connected by a first tension spring, the first stop column is fixedly connected to the first support portion, and the first stop column and the side plate are in contact, and the mounting seat is provided with meshing synchronization parts that respectively cooperate with the slide plate and the baffle.

[0006] Preferably, the meshing synchronous component includes a first tooth plate fixedly mounted on the skateboard, a first fixed plate is provided on one side of the first tooth plate, a first connecting shaft passes through the first fixed plate, a bearing is provided at the connection between the first connecting shaft and the first fixed plate, the first fixed plate and the bottom of the mounting seat are fixedly connected, a gear is fixedly connected to the first connecting shaft, a second tooth plate is fixedly connected to the baffle plate, a first guide groove is opened on the first fixed plate, a guide bar is fixedly connected to the second tooth plate, and the guide bar passes through the first guide groove, and the first tooth plate and the second tooth plate are respectively meshed with the gear.

[0007] Preferably, the upward resetting unit includes a second fixed plate arranged above the slide, the second fixed plate and the bottom of the mounting seat are fixedly connected, a sliding groove is provided at the bottom of the second fixed plate, the top of the slide is located in the sliding groove, the top of the slide and the top inner wall of the sliding groove are connected by a compression spring, a second guide groove is provided on the inner wall of the sliding groove, a guide block is provided in the second guide groove, and the guide block and the slide are fixedly connected.

[0008] Preferably, the control unit includes a first switch and a second switch respectively fixedly mounted on the bottom of the rotating frame, the first switch is electrically connected to the first wafer adsorption mechanism, the second switch is electrically connected to the second wafer adsorption mechanism, and three control frames are fixedly connected to the bottom of the mounting base, and the control frames cooperate with the first switch and the second switch respectively.

[0009] Preferably, the driving member includes a motor seat fixedly mounted on the mounting seat, a motor is fixedly connected to the motor seat, an output end of the motor is fixedly connected to the top of the rotating shaft, the friction transmission structure includes a second connecting shaft fixedly mounted on the top of the connecting disk, the second connecting shaft passes through the mounting seat, a bearing is provided at the connection between the second connecting shaft and the mounting seat, a first friction disk is fixedly connected to the top of the second connecting shaft, a second friction disk is fixedly connected to the bottom of the rotating shaft, and the second friction disk is in contact with the first friction disk.

[0010] Preferably, the stretching stopper includes a second stop column fixedly mounted on the bottom of the connecting disk, the bottom of the second stop column is in contact with the top of the rotating frame, a plurality of guide columns are fixedly connected to the bottom of the connecting disk, the guide columns pass through the rotating frame, a second stretching spring is sleeved on the outside of the guide columns, and both ends of the second stretching spring are respectively fixedly connected to the connecting disk and the rotating frame.

[0011] Preferably, the friction reciprocating assembly includes a third connecting shaft arranged above the mounting seat, the outer sleeve of the third connecting shaft is provided with a second supporting portion, a bearing is provided at the connection between the third connecting shaft and the second supporting portion, the second supporting portion and the mounting seat are fixedly connected, the first bevel gear and the third friction disk are fixedly connected to the third connecting shaft, the outer fixed sleeve of the rotating shaft is provided with a second bevel gear meshing with the first bevel gear, a fourth connecting shaft is provided on one side of the third friction disk, the outer sleeve of the fourth connecting shaft is provided with a third supporting portion, a bearing is provided at the connection between the fourth connecting shaft and the third supporting portion, the third supporting portion and the mounting seat are fixedly connected, the fourth friction disk is fixedly connected to the fourth connecting shaft, the fourth friction disk is in contact with the third friction disk, and the fourth connecting shaft and the pressing ring are connected through a vertical reciprocating unit.

[0012] Preferably, the vertical reciprocating unit includes a movable frame arranged above the mounting seat, the movable frame and the pressing ring are connected by a plurality of connecting columns, and the connecting columns pass through the mounting seat, a rectangular hole is opened on the movable frame, a fixed column is arranged in the rectangular hole, and the fixed column and the fourth connecting shaft are connected by a connecting block.

[0013] The present invention also provides a loading and unloading method for wafer processing, comprising the loading and unloading device for wafer processing as described above, comprising the following steps:

[0014] Step 1: The driving member drives the rotating shaft to rotate, and the rotating shaft drives the connecting plate to rotate through the friction transmission structure, so that the rotating frame rotates synchronously. When the first wafer adsorption mechanism rotates to the processing position, the limit block moves to the bottom of another avoidance groove, and the stop frame contacts the baffle at the processing position;

[0015] Step 2: As the shaft continues to rotate, the first wafer adsorption mechanism drives the wafer to descend synchronously. When the wafer descends to the lowest position, the control unit controls the first wafer adsorption mechanism to release the fixation of the wafer, and the wafer is placed in the processing position;

[0016] Step 3: As the shaft continues to rotate, the rotating frame and the pressing ring move up again and reset to the initial heights in sequence. After the rotating frame and the pressing ring reset to the initial heights, the rotating shaft drives the rotating frame to rotate again. When the wafer processing is completed, as the rotating frame continues to rotate, the second wafer adsorption mechanism moves to the processing position, the first wafer adsorption mechanism moves to the loading position, and the rotating frame stops rotating;

[0017] Step 4: As the shaft continues to rotate, the first wafer adsorption mechanism again adsorbs and fixes the wafer at the loading position, and the second wafer adsorption mechanism adsorbs and fixes the processed wafer at the processing position. When the rotating frame and the pressing ring move up again and reset to the initial heights in turn, as the shaft continues to rotate, the rotating frame drives the first wafer adsorption mechanism to move to the loading position, and the second wafer adsorption mechanism moves to the unloading position. At this time, the rotating frame stops moving. As the shaft continues to rotate, the second wafer adsorption mechanism places the unprocessed wafer at the processing position again, and the first wafer adsorption mechanism places the processed wafer at the unloading position. Repeat the above loading and unloading steps until the wafers no longer need to be loaded and unloaded.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The rotating shaft drives the connecting plate to rotate through the friction transmission structure so that the rotating frame rotates synchronously. When the first wafer adsorption mechanism rotates to the processing position, the limit block moves to the bottom of another avoidance groove, and the stop frame contacts the baffle at the processing position. Similarly, with the continuous rotation of the rotating shaft, the first wafer adsorption mechanism drives the wafer to descend synchronously. When the wafer descends to the lowest position, similarly, the control unit controls the first wafer adsorption mechanism to release the fixation of the wafer, and the wafer is placed in the processing position. With the continuous rotation of the rotating shaft, the rotating frame and the pressing ring move up again and reset to the initial height in turn. After the rotating frame and the pressing ring are reset to the initial height, the rotating shaft drives the rotating frame to rotate again. When the wafer processing is completed, with the continuous rotation of the rotating frame, the second wafer adsorption mechanism moves to the processing position, and the first wafer adsorption mechanism moves When it reaches the loading position, the rotating frame stops rotating. With the continuous rotation of the rotating shaft, the wafer at the loading position is adsorbed and fixed by the first wafer adsorption mechanism again. The second wafer adsorption mechanism adsorbs and fixes the processed wafer at the processing position. When the rotating frame and the pressing ring move up again and reset to the initial heights in turn, with the continuous rotation of the rotating shaft, the rotating frame drives the first wafer adsorption mechanism to move to the loading position, and the second wafer adsorption mechanism moves to the unloading position. At this time, the rotating frame stops moving. Similarly, with the continuous rotation of the rotating shaft, the second wafer adsorption mechanism places the unprocessed wafer at the processing position again, and the first wafer adsorption mechanism places the processed wafer at the unloading position. The above loading and unloading steps are repeated, so that unloading can be carried out at the same time as loading, thereby reducing the wafer unloading cycle and increasing work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0021] In the attached picture:

[0022] Figure 1It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the rotating frame of the present invention;

[0024] Figure 3 It is a schematic diagram of the structure of the disassembled stretching stopper of the present invention;

[0025] Figure 4 This is one of the structural schematic diagrams of the stop sliding avoidance structure of the present invention;

[0026] Figure 5 This is the second structural schematic diagram of the stop sliding avoidance structure of the present invention;

[0027] Figure 6 It is a schematic structural diagram of a cutaway section of the second fixing plate of the present invention;

[0028] Figure 7 It is a structural schematic diagram of the movable frame of the present invention;

[0029] Figure 8 It is a schematic structural diagram of the fourth connecting shaft of the present invention.

[0030] In the figure: 1, mounting seat; 2, rotating frame; 3, connecting plate; 4, rotating shaft; 5, pressing ring; 6, limiting block; 7, avoiding groove; 8, first wafer adsorption mechanism; 9, second wafer adsorption mechanism; 10, stopping frame; 11, baffle plate; 12, pressing column; 13, movable plate; 14, sliding plate; 15, side plate; 16, first supporting part; 17, first tension spring; 18, first stopping column; 19, first tooth plate; 20, gear; 21, first connecting shaft; 22, first fixed plate; 23, second tooth plate; 24, first guide groove; 25, guide strip; 26, second fixed plate; 27, slide groove; 28, compression spring; 29. Second guide groove; 30. Guide block; 31. First switch; 32. Second switch; 33. Control frame; 34. Motor seat; 35. Motor; 36. Second connecting shaft; 37. First friction disc; 38. Second friction disc; 39. Second stop post; 40. Guide post; 41. Second tension spring; 42. Third connecting shaft; 43. First bevel gear; 44. Second bevel gear; 45. Second support part; 46. Third friction disc; 47. Fourth friction disc; 48. Fourth connecting shaft; 49. Third support part; 50. Movable frame; 51. Connecting post; 52. Rectangular hole; 53. Fixed post; 54. Connecting block. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0032] Embodiment 1, by Figures 1 to 8The present invention includes a mounting seat 1, a rotating frame 2 is provided below the mounting seat 1, a connecting plate 3 is provided above the rotating frame 2, a rotating shaft 4 is provided above the mounting seat 1, a driving member for driving the rotating shaft 4 to rotate is provided on the mounting seat 1, the rotating shaft 4 and the connecting plate 3 are connected by a friction transmission structure, the connecting plate 3 and the rotating frame 2 are connected by a stretching stopper, a pressing ring 5 is provided above the rotating frame 2, the rotating shaft 4 and the pressing ring 5 are connected by a friction reciprocating motion component, the top of the rotating frame 2 is fixedly connected to a limiting block 6, and the pressing ring 5 is provided with two avoidance grooves 7 that cooperate with the limiting block 6, the bottom of the rotating frame 2 is fixedly connected to a first wafer adsorption mechanism 8 and a second wafer adsorption mechanism 9, and the mounting seat 1 is provided with a driving member for driving the rotating shaft 4 to rotate, the rotating shaft 4 and the connecting plate 3 are connected by a friction transmission structure, the connecting plate 3 and the rotating frame 2 are connected by a stretching stopper, a pressing ring 5 is provided above the rotating frame 2, the rotating shaft 4 and the pressing ring 5 are connected by a friction reciprocating motion component, the top of the rotating frame 2 is fixedly connected to a limiting block 6, and the pressing ring 5 is provided with two avoidance grooves 7 that cooperate with the limiting block 6, the bottom of the rotating frame 2 is fixedly connected to a first wafer adsorption mechanism 8 and a second wafer adsorption mechanism 9, and The control unit cooperates with the structure 8 and the second wafer adsorption mechanism 9, a stop frame 10 is fixedly connected to the rotating frame 2, two baffles 11 cooperating with the stop frame 10 are arranged under the mounting seat 1, a pressing column 12 is fixedly connected to the stop frame 10, a movable plate 13 is arranged on one side of the baffle 11, and an inclined surface cooperating with the pressing column 12 is arranged on the movable plate 13, and a stop sliding avoidance structure cooperating with the baffle 11 and the movable plate 13 is respectively arranged on the mounting seat 1; the rotating shaft 4 drives the connecting plate 3 to rotate through the friction transmission structure to make the rotating frame 2 rotate synchronously, and when the first wafer adsorption mechanism 8 rotates to the processing position, the limit block 6 moves to the right below the other avoidance groove 7, and the stop frame 10 and the baffle 11 located at the processing position Contact, similarly, with the continuous rotation of the rotating shaft 4, the first wafer suction mechanism 8 drives the wafer to descend synchronously, when the wafer descends to the lowest position, similarly, the control unit controls the first wafer suction mechanism 8 to release the fixation of the wafer, and the wafer is placed in the processing position, with the continuous rotation of the rotating shaft 4, the rotating frame 2 and the pressing ring 5 move up again and reset to the initial height in turn, after the rotating frame 2 and the pressing ring 5 are reset to the initial height, the rotating shaft 4 drives the rotating frame 2 to rotate again, when the wafer processing is completed, with the continuous rotation of the rotating frame 2, the second wafer suction mechanism 9 moves to the processing position, the first wafer suction mechanism 8 moves to the loading position, the rotating frame 2 stops rotating, with the continuous rotation of the rotating shaft 4, it passes through the first wafer suction mechanism 8 again The wafer at the loading position is adsorbed and fixed, and the second wafer adsorption mechanism 9 adsorbs and fixes the processed wafer at the processing position. When the rotating frame 2 and the pressing ring 5 move up again and reset to the initial heights in turn, with the continuous rotation of the rotating shaft 4, the rotating frame 2 drives the first wafer adsorption mechanism 8 to move to the loading position, and the second wafer adsorption mechanism 9 moves to the unloading position. At this time, the rotating frame 2 stops moving. Similarly, with the continuous rotation of the rotating shaft 4, the second wafer adsorption mechanism 9 places the unprocessed wafer at the processing position again, and the first wafer adsorption mechanism 8 places the processed wafer at the unloading position. Repeat the above loading and unloading steps, and unloading can be carried out at the same time as loading, reducing the wafer loading and unloading cycle and increasing work efficiency.

[0033] Embodiment 2, based on embodiment 1, Figure 1 , Figure 4 , Figure 5 and Figure 6 The stop sliding avoidance structure includes a slide plate 14 sleeved on the outside of the movable plate 13, the slide plate 14 and the mounting seat 1 are connected by an upward reset unit, the movable plate 13 is fixedly connected with a side plate 15, the slide plate 14 is fixedly connected with a first support portion 16, the first support portion 16 and the side plate 15 are connected by a first tension spring 17, the first support portion 16 is fixedly connected with a first stop column 18, and the first stop column 18 is in contact with the side plate 15, the mounting seat 1 is provided with a meshing synchronous member respectively matched with the slide plate 14 and the baffle plate 11, the meshing synchronous member includes a first tooth plate 19 fixedly installed on the slide plate 14, a first fixed plate 22 is provided on one side of the first tooth plate 19, a first connecting shaft 21 passes through the first fixed plate 22, a bearing is provided at the connection between the first connecting shaft 21 and the first fixed plate 22, and the first fixed plate 22 and the mounting seat 1 are connected. The bottom is fixedly connected, a gear 20 is fixedly connected to the first connecting shaft 21, a second toothed plate 23 is fixedly connected to the baffle 11, a first guide groove 24 is provided on the first fixed plate 22, a guide bar 25 is fixedly connected to the second toothed plate 23, and the guide bar 25 passes through the first guide groove 24, the first toothed plate 19 and the second toothed plate 23 are respectively meshed with the gear 20, and the upward resetting unit includes a second fixed plate 26 arranged above the slide plate 14, the second fixed plate 26 is fixedly connected to the bottom of the mounting seat 1, a slide groove 27 is provided at the bottom of the second fixed plate 26, the top end of the slide plate 14 is located in the slide groove 27, the top end of the slide plate 14 and the top inner wall of the slide groove 27 are connected by a compression spring 28, a second guide groove 29 is provided on the inner wall of the slide groove 27, a guide block 30 is provided in the second guide groove 29, and the guide block 30 is fixedly connected to the slide plate 14;

[0034] When the rotating frame 2 and the stop frame 10 move downward so that the pressing column 12 pushes the movable plate 13 to move horizontally, the movable plate 13 drives the side plate 15 to move, and the first tension spring 17 is in a tensioned state. At this time, the bottom of the guide block 30 contacts the bottom inner wall of the second guide groove 29. When the pressing column 12 slides over one side of the movable plate 13 and the pressing column 12 moves to the lowest position, the first tension spring 17 drives the side plate 15 and the movable plate 13 to move in the opposite direction so that the movable plate 13 moves to the top of the pressing column 12. At the same time, the first stop column 18 contacts the side plate 15 to reset the movable plate 13 to its initial position. When the rotating frame 2 and the stop frame 10 move upward, the pressing column 12 pushes the movable plate 13 to move upward synchronously. The movable plate 13 drives the slide plate 14 and the first tooth plate 19 to move upward. The compression spring 28 is in a compressed state. The first tooth plate 19 passes through the gear 2 0 drives the second tooth plate 23 to move horizontally, and the second tooth plate 23 drives the baffle 11 to move relative to the stop frame 10, and the guide bar 25 slides in the first guide groove 24. Through the design of the first guide groove 24 and the guide bar 25, the second tooth plate 23 can move smoothly in the horizontal direction relative to the first fixed plate 22 and the mounting seat 1. When the rotating frame 2 moves up to the initial height, the baffle 11 is no longer in contact with the stop frame 10, and the position restriction of the stop frame 10 and the rotating frame 2 is released. When the rotating frame 2 rotates, the pressing column 12 and the stop frame 10 slide under the movable plate 13 to release the support for the movable plate 13, and the compression spring 28 drives the slide plate 14 and the first tooth plate 19 to move downward, and the first tooth plate 19 drives the gear 20 to rotate in the opposite direction, and the gear 20 drives the second tooth plate 23 and the baffle 11 to move in the opposite direction, so that the baffle 11 and the movable plate 13 are reset to the initial position.

[0035] Embodiment 3, based on embodiment 1, Figure 1 and Figure 2It is given that the control unit includes a first switch 31 and a second switch 32 respectively fixedly mounted on the bottom of the rotating frame 2, the first switch 31 is electrically connected to the first wafer adsorption mechanism 8, the second switch 32 is electrically connected to the second wafer adsorption mechanism 9, and three control frames 33 are fixedly connected to the bottom of the mounting seat 1, and the control frames 33 cooperate with the first switch 31 and the second switch 32 respectively; when the rotating frame 2 moves downward to make the first wafer adsorption mechanism 8 contact with the wafer at the loading position, the first switch 31 on the rotating frame 2 contacts with the control frame 33 located at the loading position, and the first switch 31 controls the first wafer adsorption mechanism 8 to adsorb and fix the wafer, and when the rotating frame 2 drives the first wafer adsorption mechanism 8 to rotate to the processing position, as the rotating frame 2 moves downward, when the first wafer adsorption mechanism 8 drives the wafer to descend to the lowest position, the first switch 31 on the rotating frame 2 The first switch 31 contacts the control frame 33 located at the processing position, and controls the first wafer adsorption mechanism 8 to release the fixation of the wafer. Similarly, when the second wafer adsorption mechanism 9 is located at the processing position, as the rotating frame 2 moves downward, when the second wafer adsorption mechanism 9 drops to the lowest position and the second wafer adsorption mechanism 9 contacts the processed wafer, the second switch 32 on the rotating frame 2 contacts the control frame 33 located at the processing position, and controls the second wafer adsorption mechanism 9 to adsorb and fix the wafer. When the second wafer adsorption mechanism 9 is located at the unloading position, as the rotating frame 2 moves downward, when the second wafer adsorption mechanism 9 drops to the lowest position, the second switch 32 contacts the control frame 33 located at the unloading position, and controls the second wafer adsorption mechanism 9 to release the fixation of the wafer, so that the processed wafer can be placed at the unloading position.

[0036] Embodiment 4, based on embodiment 1, Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8The driving member includes a motor seat 34 fixedly mounted on the mounting seat 1, a motor 35 is fixedly connected to the motor seat 34, an output end of the motor 35 is fixedly connected to the top of the rotating shaft 4, and the friction transmission structure includes a second connecting shaft 36 fixedly mounted on the top of the connecting plate 3, the second connecting shaft 36 passes through the mounting seat 1, a bearing is provided at the connection between the second connecting shaft 36 and the mounting seat 1, a first friction plate 37 is fixedly connected to the top of the second connecting shaft 36, a second friction plate 38 is fixedly connected to the bottom of the rotating shaft 4, and the second friction plate 38 and the first friction plate 3 7 is in contact with each other, the stretching stopper includes a second stopper column 39 fixedly mounted on the bottom of the connecting plate 3, the bottom of the second stopper column 39 is in contact with the top of the rotating frame 2, the bottom of the connecting plate 3 is fixedly connected with a plurality of guide columns 40, the guide columns 40 penetrate the rotating frame 2, the outer sleeve of the guide columns 40 is provided with a second tension spring 41, the two ends of the second tension spring 41 are respectively fixedly connected to the connecting plate 3 and the rotating frame 2, the friction reciprocating moving assembly includes a third connecting shaft 42 arranged above the mounting seat 1, the outer sleeve of the third connecting shaft 42 is provided with a second support portion 45, a bearing is provided at the connection between the third connecting shaft 42 and the second supporting portion 45, the second supporting portion 45 is fixedly connected to the mounting seat 1, a first bevel gear 43 and a third friction plate 46 are fixedly connected to the third connecting shaft 42, an outer fixed sleeve of the rotating shaft 4 is provided with a second bevel gear 44 meshing with the first bevel gear 43, a fourth connecting shaft 48 is provided on one side of the third friction plate 46, a third supporting portion 49 is provided on the outer sleeve of the fourth connecting shaft 48, a bearing is provided at the connection between the fourth connecting shaft 48 and the third supporting portion 49, and the third supporting portion 49 and the mounting seat 1 is fixedly connected, a fourth friction disc 47 is fixedly connected to the fourth connecting shaft 48, the fourth friction disc 47 is in contact with the third friction disc 46, the fourth connecting shaft 48 is connected to the pressing ring 5 through a vertical reciprocating unit, the vertical reciprocating unit includes a movable frame 50 arranged above the mounting seat 1, the movable frame 50 and the pressing ring 5 are connected through a plurality of connecting columns 51, and the connecting columns 51 penetrate the mounting seat 1, a rectangular hole 52 is opened on the movable frame 50, a fixing column 53 is arranged in the rectangular hole 52, and the fixing column 53 and the fourth connecting shaft 48 are connected through a connecting block 54;

[0037] The motor 35 drives the rotating shaft 4 to rotate, and the rotating shaft 4 drives the second friction disk 38 to rotate. The second friction disk 38 drives the first friction disk 37 and the second connecting shaft 36 to rotate synchronously through friction force. The second connecting shaft 36 drives the connecting disk 3 to rotate. The connecting disk 3 can drive the rotating frame 2 to rotate through the guide column 40. The rotating frame 2 drives the limit block 6 to rotate at the bottom of the pressing ring 5. When the rotating shaft 4 rotates, the rotating shaft 4 drives the second bevel gear 44 to rotate. The second bevel gear 44 drives the third connecting shaft 42 and the third friction disk 46 to rotate through the first bevel gear 43. Since the bottom of the pressing ring 5 is in contact with the top of the limit block 6, the pressing ring 5 cannot move downward, and the fourth friction disk 47 and the fourth connecting shaft 48 remain stationary. The third friction disc 46 cannot drive the fourth friction disc 47 to rotate by friction. With the rotation of the rotating frame 2, when the stop frame 10 contacts one of the baffles 11, the rotating frame 2 and the connecting disc 3 stop rotating. The second friction disc 38 cannot drive the first friction disc 37 and the second connecting shaft 36 to rotate by friction. At this time, one of the avoidance grooves 7 is located above the limit block 6, and the pressing ring 5 can move downward relative to the limit block 6 and the rotating frame 2. With the continuous rotation of the rotating shaft 4, the third friction disc 46 can drive the fourth friction disc 47 and the fourth connecting shaft 48 to rotate by friction. The fourth connecting shaft 48 drives the fixing column 53 to slide in the rectangular hole 52 through the connecting block 54, so that the fixing column 53 The movable frame 50 and the connecting column 51 are driven to move downward, and the connecting column 51 drives the pressing ring 5 to move downward relative to the rotating frame 2. The top of the limit block 6 passes through the corresponding avoidance groove 7. When the pressing ring 5 and the rotating frame 2 are in contact, as the pressing ring 5 continues to move downward, the rotating frame 2 follows the pressing ring 5 to move downward, and the rotating frame 2 slides relative to the guide column 40. The second tension spring 41 is in a tensioned state, and the rotating frame 2 is no longer in contact with the bottom of the second stop column 39. Similarly, when the fixed column 53 drives the movable frame 50 and the pressing ring 5 to move upward, the second tension spring 41 drives the rotating frame 2 to move upward, so that the rotating frame 2 follows the pressing ring 5 to move upward. When the rotating frame 2 moves up to the initial height, the rotating frame 2 is connected to the second stop column 39. 1 and 10. When the pressing ring 5 moves up to the initial height, the limit block 6 is disengaged from the corresponding avoidance groove 7, and the baffle 11 is no longer located on the side of the stop frame 10, thereby releasing the limitation on the position of the rotating frame 2. With the continuous rotation of the rotating shaft 4, the second friction disk 38 can drive the first friction disk 37 and the second connecting shaft 36 to rotate synchronously through friction force, so that the rotating frame 2 can rotate relative to the mounting seat 1 and the pressing ring 5, and the limit block 6 rotates again at the bottom of the pressing ring 5. The third friction disk 46 cannot drive the fourth friction disk 47 to rotate through friction force, thereby ensuring that the rotating frame 2 can rotate and move downward intermittently, thereby completing the loading and unloading of wafers.

[0038] A method for loading and unloading wafers in this embodiment includes the loading and unloading device for wafer processing as described above, and includes the following steps:

[0039] Step 1: The rotating shaft 4 is driven to rotate by the driving member, and the rotating shaft 4 drives the connecting plate 3 to rotate through the friction transmission structure, so that the rotating frame 2 rotates synchronously. When the first wafer adsorption mechanism 8 rotates to the processing position, the limit block 6 moves to the right below the other avoidance groove 7, and the stop frame 10 contacts the baffle 11 located at the processing position;

[0040] Step 2: As the rotating shaft 4 continues to rotate, the first wafer adsorption mechanism 8 drives the wafer to descend synchronously. When the wafer descends to the lowest position, the control unit controls the first wafer adsorption mechanism 8 to release the fixation of the wafer, and the wafer is placed in the processing position;

[0041] Step 3: With the continuous rotation of the rotating shaft 4, the rotating frame 2 and the pressing ring 5 move up again and reset to the initial heights in sequence. After the rotating frame 2 and the pressing ring 5 reset to the initial heights, the rotating shaft 4 drives the rotating frame 2 to rotate again. When the wafer processing is completed, with the continuous rotation of the rotating frame 2, the second wafer adsorption mechanism 9 moves to the processing position, the first wafer adsorption mechanism 8 moves to the loading position, and the rotating frame 2 stops rotating;

[0042] Step 4: With the continuous rotation of the rotating shaft 4, the wafer at the loading position is again adsorbed and fixed by the first wafer adsorption mechanism 8, and the wafer that has been processed at the processing position is adsorbed and fixed by the second wafer adsorption mechanism 9. When the rotating frame 2 and the pressing ring 5 move up again and are reset to the initial heights in turn, with the continuous rotation of the rotating shaft 4, the rotating frame 2 drives the first wafer adsorption mechanism 8 to move to the loading position, and the second wafer adsorption mechanism 9 moves to the unloading position. At this time, the rotating frame 2 stops moving. With the continuous rotation of the rotating shaft 4, the second wafer adsorption mechanism 9 places the unprocessed wafer at the processing position again, and the first wafer adsorption mechanism 8 places the processed wafer at the unloading position. The above loading and unloading steps are repeated until the wafers no longer need to be loaded and unloaded.

[0043] Working principle: During operation, the staff installs the mounting seat 1 at the preset position, drives the rotating shaft 4 to rotate through the driving member, the rotating shaft 4 drives the connecting plate 3 to rotate through the friction transmission structure, and the connecting plate 3 drives the rotating frame 2 to rotate synchronously through the stretching stopper. When the first wafer adsorption mechanism 8 rotates to the loading position, the stop frame 10 and the baffle 11 located at the loading position contact each other, and the baffle 11 limits the position of the stop frame 10 and the rotating frame 2 to stop the rotation of the rotating frame 2. At the same time, one of the avoidance grooves 7 is located directly above the limit block 6, and the pressing column 12 is located above the movable plate 13. As the rotating shaft 4 continues to rotate, the rotating shaft 4 drives the pressing ring 5 to move downward through the friction reciprocating moving component, so that the limit block 6 passes through the avoidance groove 7. When the pressing ring 5 and the rotating frame 2 When in contact, as the pressing ring 5 continues to move downward, the pressing ring 5 drives the rotating frame 2, the stop frame 10 and the pressing column 12 to move downward synchronously, the pressing column 12 slides on the inclined surface of the movable plate 13, and the pressing column 12 pushes the movable plate 13 to move horizontally. When the rotating frame 2 drops to the lowest position, the first wafer adsorption mechanism 8 contacts the wafer at the loading position, and the control unit controls the first wafer adsorption mechanism 8 to adsorb and fix the wafer. At the same time, the pressing column 12 slides from one side of the movable plate 13, and the stop sliding avoidance structure drives the movable plate 13 to move above the pressing column 12. The bottom of the movable plate 13 contacts the pressing column 12. At the same time, the movable plate 13 is located above the stop frame 10. As the rotating shaft 4 continues to rotate, the movable plate 13 moves back and forth through friction. The moving assembly drives the pressing ring 5 to move upward, and the stretching stopper drives the rotating frame 2 to move upward with the pressing ring 5. The pressing column 12 pushes the movable plate 13 to move upward, and the movable plate 13 drives the baffle 11 to move through the stop sliding avoidance structure. When the rotating frame 2 moves up to the initial height, the baffle 11 is no longer in contact with the stop frame 10, and the position restriction of the stop frame 10 and the rotating frame 2 is released. With the continuous rotation of the rotating shaft 4, when the friction reciprocating moving assembly drives the pressing ring 5 to move up to the initial height, the limit block 6 disengages from the avoidance groove 7. With the continuous rotation of the rotating shaft 4, the rotating shaft 4 can drive the connecting disk 3 to rotate through the friction transmission structure to make the rotating frame 2 rotate synchronously. When the first wafer adsorption mechanism 8 rotates to the processing position, the limit block 6 moves to another avoidance groove 7. Directly below, the stop frame 10 contacts the baffle 11 at the processing position. Similarly, with the continuous rotation of the rotating shaft 4, the first wafer adsorption mechanism 8 drives the wafer to descend synchronously. When the wafer descends to the lowest position, similarly, the control unit controls the first wafer adsorption mechanism 8 to release the fixation of the wafer, and the wafer is placed at the processing position. With the continuous rotation of the rotating shaft 4, the rotating frame 2 and the pressing ring 5 move up again and reset to the initial height in turn. After the rotating frame 2 and the pressing ring 5 are reset to the initial height, the rotating shaft 4 drives the rotating frame 2 to rotate again. When the wafer processing is completed, with the continuous rotation of the rotating frame 2, the second wafer adsorption mechanism 9 moves to the processing position, the first wafer adsorption mechanism 8 moves to the loading position, and the rotating frame 2 stops rotating. With the continuous rotation of the rotating shaft 4,The first wafer adsorption mechanism 8 is used to adsorb and fix the wafer at the loading position again, and the second wafer adsorption mechanism 9 is used to adsorb and fix the wafer that has been processed at the processing position. When the rotating frame 2 and the pressing ring 5 move up again and reset to the initial height in sequence, as the rotating shaft 4 continues to rotate, the rotating frame 2 drives the first wafer adsorption mechanism 8 to move to the loading position, and the second wafer adsorption mechanism 9 moves to the unloading position. At this time, the rotating frame 2 stops moving. Similarly, as the rotating shaft 4 continues to rotate, the second wafer adsorption mechanism 9 places the unprocessed wafer at the processing position again, and the first wafer adsorption mechanism 8 places the processed wafer at the unloading position. Repeating the above loading and unloading steps, unloading can be carried out while loading, reducing the wafer loading and unloading cycle and increasing work efficiency.

[0044] When the rotating frame 2 and the stop frame 10 move downward so that the pressing column 12 pushes the movable plate 13 to move horizontally, the movable plate 13 drives the side plate 15 to move, and the first tension spring 17 is in a tensioned state. At this time, the bottom of the guide block 30 contacts the bottom inner wall of the second guide groove 29. When the pressing column 12 slides over one side of the movable plate 13 and the pressing column 12 moves to the lowest position, the first tension spring 17 drives the side plate 15 and the movable plate 13 to move in the opposite direction so that the movable plate 13 moves to the top of the pressing column 12. At the same time, the first stop column 18 contacts the side plate 15 to reset the movable plate 13 to its initial position. When the rotating frame 2 and the stop frame 10 move upward, the pressing column 12 pushes the movable plate 13 to move upward synchronously. The movable plate 13 drives the slide plate 14 and the first tooth plate 19 to move upward. The compression spring 28 is in a compressed state. The first tooth plate 19 passes through the gear 2 0 drives the second tooth plate 23 to move horizontally, and the second tooth plate 23 drives the baffle 11 to move relative to the stop frame 10, and the guide bar 25 slides in the first guide groove 24. Through the design of the first guide groove 24 and the guide bar 25, the second tooth plate 23 can move smoothly in the horizontal direction relative to the first fixed plate 22 and the mounting seat 1. When the rotating frame 2 moves up to the initial height, the baffle 11 is no longer in contact with the stop frame 10, and the position restriction of the stop frame 10 and the rotating frame 2 is released. When the rotating frame 2 rotates, the pressing column 12 and the stop frame 10 slide under the movable plate 13 to release the support for the movable plate 13, and the compression spring 28 drives the slide plate 14 and the first tooth plate 19 to move downward, and the first tooth plate 19 drives the gear 20 to rotate in the opposite direction, and the gear 20 drives the second tooth plate 23 and the baffle 11 to move in the opposite direction, so that the baffle 11 and the movable plate 13 are reset to the initial position;

[0045] When the rotating frame 2 moves downward so that the first wafer adsorption mechanism 8 contacts the wafer at the loading position, the first switch 31 on the rotating frame 2 contacts the control frame 33 located at the loading position, and the first switch 31 controls the first wafer adsorption mechanism 8 to adsorb and fix the wafer. When the rotating frame 2 drives the first wafer adsorption mechanism 8 to rotate to the processing position, as the rotating frame 2 moves downward, when the first wafer adsorption mechanism 8 drives the wafer to descend to the lowest position, the first switch 31 on the rotating frame 2 contacts the control frame 33 located at the processing position, and the first switch 31 controls the first wafer adsorption mechanism 8 to release the fixation of the wafer. Similarly, when the second wafer adsorption mechanism 9 is located at the processing position, As the rotating frame 2 moves downward, when the second wafer adsorption mechanism 9 drops to the lowest position and the second wafer adsorption mechanism 9 contacts the processed wafer, the second switch 32 on the rotating frame 2 contacts the control frame 33 located at the processing position, and the second switch 32 controls the second wafer adsorption mechanism 9 to adsorb and fix the wafer. When the second wafer adsorption mechanism 9 is located at the unloading position, as the rotating frame 2 moves downward, when the second wafer adsorption mechanism 9 drops to the lowest position, the second switch 32 contacts the control frame 33 located at the unloading position, and the second switch 32 controls the second wafer adsorption mechanism 9 to release the fixation of the wafer, so that the processed wafer can be placed at the unloading position;

[0046] The motor 35 drives the rotating shaft 4 to rotate, and the rotating shaft 4 drives the second friction disk 38 to rotate. The second friction disk 38 drives the first friction disk 37 and the second connecting shaft 36 to rotate synchronously through friction force. The second connecting shaft 36 drives the connecting disk 3 to rotate. The connecting disk 3 can drive the rotating frame 2 to rotate through the guide column 40. The rotating frame 2 drives the limit block 6 to rotate at the bottom of the pressing ring 5. When the rotating shaft 4 rotates, the rotating shaft 4 drives the second bevel gear 44 to rotate. The second bevel gear 44 drives the third connecting shaft 42 and the third friction disk 46 to rotate through the first bevel gear 43. Since the bottom of the pressing ring 5 is in contact with the top of the limit block 6, the pressing ring 5 cannot move downward, and the fourth friction disk 47 and the fourth connecting shaft 48 remain stationary. The third friction disc 46 cannot drive the fourth friction disc 47 to rotate by friction. With the rotation of the rotating frame 2, when the stop frame 10 contacts one of the baffles 11, the rotating frame 2 and the connecting disc 3 stop rotating. The second friction disc 38 cannot drive the first friction disc 37 and the second connecting shaft 36 to rotate by friction. At this time, one of the avoidance grooves 7 is located above the limit block 6, and the pressing ring 5 can move downward relative to the limit block 6 and the rotating frame 2. With the continuous rotation of the rotating shaft 4, the third friction disc 46 can drive the fourth friction disc 47 and the fourth connecting shaft 48 to rotate by friction. The fourth connecting shaft 48 drives the fixing column 53 to slide in the rectangular hole 52 through the connecting block 54, so that the fixing column 53 The movable frame 50 and the connecting column 51 are driven to move downward, and the connecting column 51 drives the pressing ring 5 to move downward relative to the rotating frame 2. The top of the limit block 6 passes through the corresponding avoidance groove 7. When the pressing ring 5 and the rotating frame 2 are in contact, as the pressing ring 5 continues to move downward, the rotating frame 2 follows the pressing ring 5 to move downward, and the rotating frame 2 slides relative to the guide column 40. The second tension spring 41 is in a tensioned state, and the rotating frame 2 is no longer in contact with the bottom of the second stop column 39. Similarly, when the fixed column 53 drives the movable frame 50 and the pressing ring 5 to move upward, the second tension spring 41 drives the rotating frame 2 to move upward, so that the rotating frame 2 follows the pressing ring 5 to move upward. When the rotating frame 2 moves up to the initial height, the rotating frame 2 is connected to the second stop column 39. 1 and 10. When the pressing ring 5 moves up to the initial height, the limit block 6 is disengaged from the corresponding avoidance groove 7, and the baffle 11 is no longer located on the side of the stop frame 10, thereby releasing the limitation on the position of the rotating frame 2. With the continuous rotation of the rotating shaft 4, the second friction disk 38 can drive the first friction disk 37 and the second connecting shaft 36 to rotate synchronously through friction force, so that the rotating frame 2 can rotate relative to the mounting seat 1 and the pressing ring 5, and the limit block 6 rotates again at the bottom of the pressing ring 5. The third friction disk 46 cannot drive the fourth friction disk 47 to rotate through friction force, thereby ensuring that the rotating frame 2 can rotate and move downward intermittently, thereby completing the loading and unloading of wafers.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A loading and unloading device for wafer processing, comprising a mounting seat (1), characterized in that: A rotating frame (2) is provided below the mounting seat (1), a connecting plate (3) is provided above the rotating frame (2), a rotating shaft (4) is provided above the mounting seat (1), a driving member for driving the rotating shaft (4) to rotate is provided on the mounting seat (1), the rotating shaft (4) and the connecting plate (3) are connected via a friction transmission structure, the connecting plate (3) and the rotating frame (2) are connected via a stretch stopper, a pressing ring (5) is provided above the rotating frame (2), and the rotating shaft (4) and the pressing ring (5) are connected via a friction reciprocating component. The top of the rotating frame (2) is fixedly connected to a limit block (6), the pressing ring (5) is provided with two avoidance grooves (7) that cooperate with the limit block (6), the bottom of the rotating frame (2) is fixedly connected to a first wafer adsorption mechanism (8) and a second wafer adsorption mechanism (9), the mounting seat (1) is provided with a control unit that cooperates with the first wafer adsorption mechanism (8) and the second wafer adsorption mechanism (9), respectively, the rotating frame (2) is fixedly connected to a stop frame (10), and the lower part of the mounting seat (1) is provided with two A baffle (11) is provided to match the stop frame (10); a pressing column (12) is fixedly connected to the stop frame (10); a movable plate (13) is provided on one side of the baffle (11); an inclined surface is provided on the movable plate (13) to match the pressing column (12); and a stop sliding avoidance structure is provided on the mounting seat (1) to match the baffle (11) and the movable plate (13) respectively; the stop sliding avoidance structure comprises a slide plate (14) sleeved on the outside of the movable plate (13); the slide plate (14) and the mounting seat (1) connected through an upward reset unit, the movable plate (13) is fixedly connected to a side plate (15), the slide plate (14) is fixedly connected to a first support portion (16), the first support portion (16) and the side plate (15) are connected through a first tension spring (17), the first support portion (16) is fixedly connected to a first stop column (18), and the first stop column (18) and the side plate (15) are in contact, and the mounting seat (1) is provided with meshing synchronization parts respectively matched with the slide plate (14) and the baffle plate (11).

2. The loading and unloading device for wafer processing according to claim 1, characterized in that: The meshing synchronization member comprises a first tooth plate (19) fixedly mounted on the slide plate (14); a first fixing plate (22) is provided on one side of the first tooth plate (19); a first connecting shaft (21) passes through the first fixing plate (22); a bearing is provided at the connection between the first connecting shaft (21) and the first fixing plate (22); the first fixing plate (22) and the bottom of the mounting seat (1) are fixedly connected; a gear (20) is fixedly connected to the first connecting shaft (21); a second tooth plate (23) is fixedly connected to the baffle plate (11); a first guide groove (24) is provided on the first fixing plate (22); a guide bar (25) is fixedly connected to the second tooth plate (23); and the guide bar (25) passes through the first guide groove (24); the first tooth plate (19) and the second tooth plate (23) are respectively meshed with the gear (20).

3. The loading and unloading device for wafer processing according to claim 2, characterized in that: The upward resetting unit comprises a second fixed plate (26) arranged above the slide plate (14); the second fixed plate (26) is fixedly connected to the bottom of the mounting seat (1); a slide groove (27) is provided at the bottom of the second fixed plate (26); the top of the slide plate (14) is located in the slide groove (27); the top of the slide plate (14) and the top inner wall of the slide groove (27) are connected via a compression spring (28); a second guide groove (29) is provided on the inner wall of the slide groove (27); a guide block (30) is provided in the second guide groove (29); and the guide block (30) and the slide plate (14) are fixedly connected.

4. The loading and unloading device for wafer processing according to claim 3, characterized in that: The control unit comprises a first switch (31) and a second switch (32) respectively fixedly mounted on the bottom of the rotating frame (2); the first switch (31) is connected to a first wafer adsorption mechanism (8) via an electrical signal, and the second switch (32) is connected to a second wafer adsorption mechanism (9) via an electrical signal; and three control frames (33) are fixedly connected to the bottom of the mounting seat (1); the control frames (33) respectively cooperate with the first switch (31) and the second switch (32).

5. The loading and unloading device for wafer processing according to claim 1, characterized in that: The driving member comprises a motor seat (34) fixedly mounted on the mounting seat (1), a motor (35) fixedly connected to the motor seat (34), an output end of the motor (35) fixedly connected to the top of the rotating shaft (4), the friction transmission structure comprises a second connecting shaft (36) fixedly mounted on the top of the connecting plate (3), the second connecting shaft (36) passes through the mounting seat (1), a bearing is provided at the connection between the second connecting shaft (36) and the mounting seat (1), a first friction plate (37) fixedly connected to the top of the second connecting shaft (36), a second friction plate (38) fixedly connected to the bottom of the rotating shaft (4), and the second friction plate (38) and the first friction plate (37) are in contact.

6. The loading and unloading device for wafer processing according to claim 1, characterized in that: The stretch stopper comprises a second stop column (39) fixedly mounted on the bottom of the connection plate (3), the bottom of the second stop column (39) contacts the top of the rotating frame (2), a plurality of guide columns (40) are fixedly connected to the bottom of the connection plate (3), the guide columns (40) penetrate the rotating frame (2), a second stretch spring (41) is sleeved on the outside of the guide columns (40), and two ends of the second stretch spring (41) are respectively fixedly connected to the connection plate (3) and the rotating frame (2).

7. The loading and unloading device for wafer processing according to claim 1, characterized in that: The friction reciprocating motion assembly comprises a third connecting shaft (42) arranged above the mounting seat (1); the outer sleeve of the third connecting shaft (42) is provided with a second support portion (45); a bearing is provided at the connection between the third connecting shaft (42) and the second support portion (45); the second support portion (45) and the mounting seat (1) are fixedly connected; the third connecting shaft (42) is fixedly connected with a first bevel gear (43) and a third friction disc (46); the outer fixed sleeve of the rotating shaft (4) is provided with a second bevel gear (43) meshing with the first bevel gear (43); 44), a fourth connecting shaft (48) is provided on one side of the third friction disc (46), a third supporting portion (49) is provided on the outer sleeve of the fourth connecting shaft (48), a bearing is provided at the connection between the fourth connecting shaft (48) and the third supporting portion (49), the third supporting portion (49) and the mounting seat (1) are fixedly connected, a fourth friction disc (47) is fixedly connected to the fourth connecting shaft (48), the fourth friction disc (47) and the third friction disc (46) are in contact, and the fourth connecting shaft (48) and the pressing ring (5) are connected via a vertical reciprocating unit.

8. The loading and unloading device for wafer processing according to claim 7, characterized in that: The vertical reciprocating unit comprises a movable frame (50) arranged above the mounting seat (1); the movable frame (50) and the pressing ring (5) are connected via a plurality of connecting columns (51), and the connecting columns (51) penetrate the mounting seat (1); a rectangular hole (52) is provided on the movable frame (50); a fixing column (53) is provided in the rectangular hole (52); and the fixing column (53) and the fourth connecting shaft (48) are connected via a connecting block (54).

9. A method for loading and unloading wafers, comprising the loading and unloading device for wafer processing as claimed in claim 1, characterized in that: The following steps are involved: Step 1: The rotating shaft (4) is driven to rotate by a driving member, and the rotating shaft (4) drives the connecting plate (3) to rotate through a friction transmission structure, so that the rotating frame (2) rotates synchronously, and when the first wafer adsorption mechanism (8) rotates to the processing position, the limit block (6) moves to the position directly below another avoidance groove (7), and the stop frame (10) contacts the baffle (11) located at the processing position; Step 2: As the rotating shaft (4) continues to rotate, the first wafer adsorption mechanism (8) drives the wafer to descend synchronously. When the wafer descends to the lowest position, the control unit controls the first wafer adsorption mechanism (8) to release the fixation of the wafer, and the wafer is placed in the processing position; Step 3: As the rotating shaft (4) continues to rotate, the rotating frame (2) and the pressing ring (5) move upward again and are reset to their initial heights in sequence. After the rotating frame (2) and the pressing ring (5) are reset to their initial heights, the rotating shaft (4) drives the rotating frame (2) to rotate again. When the wafer processing is completed, as the rotating frame (2) continues to rotate, the second wafer adsorption mechanism (9) moves to the processing position, the first wafer adsorption mechanism (8) moves to the loading position, and the rotating frame (2) stops rotating. Step 4: As the rotating shaft (4) continues to rotate, the first wafer adsorption mechanism (8) again adsorbs and fixes the wafer at the loading position, and the second wafer adsorption mechanism (9) adsorbs and fixes the wafer that has been processed at the processing position. When the rotating frame (2) and the pressing ring (5) move up again and reset to the initial height in turn, as the rotating shaft (4) continues to rotate, the rotating frame (2) drives the first wafer adsorption mechanism (8) to move to the loading position, and the second wafer adsorption mechanism (9) moves to the unloading position. At this time, the rotating frame (2) stops moving. As the rotating shaft (4) continues to rotate, the second wafer adsorption mechanism (9) again places the unprocessed wafer at the processing position, and the first wafer adsorption mechanism (8) places the processed wafer at the unloading position. The above loading and unloading steps are repeated until there is no need to load and unload the wafer.

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