A method for automatic positioning and calibration of conductive adhesive

Abstract

The present invention provides a method for automatically positioning and calibrating conductive adhesive, including using a conductive adhesive linkage positioning and calibration mechanism to position and calibrate the conductive adhesive. The specific positioning method is as follows: the conductive adhesive is fed to a vertical push plate, and a driving mechanism drives the vertical push plate on the base to move upward. At this time, the conductive adhesive is located in a first groove. During the process of the vertical push plate rising, the position of the conductive adhesive is adjusted under the action of the first linkage mechanism and the Y-direction positioning mechanism. When positioning the conductive adhesive, the conductive adhesive is driven along the X-direction under the action of the first linkage mechanism. At the same time, under the action of the Y-direction positioning mechanism, the conductive adhesive is moved in the Y-direction, so that the conductive adhesive can be accurately positioned within the first groove. The present invention can effectively solve the technical problems in the prior art of conductive adhesive installation, such as the difficulty in positioning the conductive adhesive, the large error in the conductive adhesive position, the misalignment of the conductive adhesive installation position, and the reduced yield rate.

Description

Technical Field

[0001] The present invention relates to the technical field of pre-installation positioning of conductive adhesive, and in particular to an automatic positioning and calibration method for conductive adhesive. Background Art

[0002] Backplane connectors contain plastic sheets with metal conductors, known in the industry as wafers. To reduce crosstalk during signal transmission, conductive plastic is added to the wafers. This allows the conductive plastic to connect some of the metal conductors in series, creating a shielding effect and reducing crosstalk.

[0003] In traditional solutions, conductive plastic must be added to the wafer through an injection molding process. However, due to the complex structure of the wafer, it is very difficult to create an injection mold, resulting in low production yield and high costs. Due to the small volume of conductive adhesive, the positional accuracy of the conductive adhesive must be very high when it is installed mechanically. If the positional error of the conductive adhesive is large, it is easy to cause the installation position of the conductive adhesive to be misaligned, resulting in a reduced yield. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for automatic positioning and calibration of conductive adhesive, which can effectively solve the technical problems in the prior art that when installing conductive adhesive, the conductive adhesive is difficult to position, the conductive adhesive position error is large, and the conductive adhesive installation position cannot be aligned, resulting in a reduced yield rate.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A conductive adhesive automatic positioning and calibration method, comprising positioning and calibrating the conductive adhesive using a conductive adhesive linkage positioning and calibration mechanism;

[0007] The conductive adhesive linkage positioning and calibration mechanism includes a base, a support frame fixedly arranged on the base, a lower push plate slidably arranged on the base, a vertical push plate slidably arranged on the support frame, the lower push plate is connected to a driving mechanism, and the driving mechanism is used to drive the lower push plate to move; a first inclined surface is provided on the lower push plate, and a tension spring is provided between the vertical push plate and the support frame under the action of the tension spring, the vertical push plate contacts the first inclined surface; a first groove and a second groove are provided on the top of the vertical push plate, the first groove is perpendicular to the second groove, the first groove is a conductive adhesive placement groove, and a first fixing member is slidably provided in the second groove, the first fixing member is connected to a first linkage mechanism, and under the action of the first linkage mechanism, when the vertical push plate moves upward, the first fixing member positions and fixes the conductive adhesive in the X direction; a mounting plate is provided on the support frame, and a Y-direction positioning mechanism is provided on the mounting plate, and the Y-direction positioning mechanism is used to realize Y-direction positioning of the conductive adhesive;

[0008] The specific positioning method is as follows:

[0009] The conductive glue is delivered to the vertical push plate, and the driving mechanism drives the vertical push plate on the base to move upward;

[0010] At this time, the conductive adhesive is located in the first groove. During the upward movement of the vertical push plate, the position of the conductive adhesive is adjusted under the action of the first linkage mechanism and the Y-direction positioning mechanism. When positioning the conductive adhesive, the first linkage mechanism drives the conductive adhesive along the X direction. At the same time, the Y-direction positioning mechanism moves the conductive adhesive in the Y direction, so that the conductive adhesive can be accurately positioned in the first groove.

[0011] Further optimization is carried out in that at least one first roller in contact with the first inclined surface is provided on the vertical push plate; after the lower push plate moves under the action of the driving mechanism, the first roller in contact with the first inclined surface rolls on the first inclined surface, driving the vertical push plate to move upward, and after the lower push plate is reset, the vertical push plate is reset under the action of the tension spring.

[0012] The first fixing member includes a straight portion, a U-shaped portion provided at one end of the straight portion, and a limiting portion provided at the other end of the straight portion. The lower end of the U-shaped portion forms a step with the straight portion, and the upper end surface of the U-shaped portion is flush with the straight portion. The U-shaped portion is used to position the conductive adhesive. The U-shaped groove on the U-shaped portion is aligned with the first groove to form a conductive adhesive trapping groove. The U-shaped portion is provided with a positioning portion extending into the U-shaped groove; the straight portion is slidably installed in the second groove; the limiting portion is connected to the first linkage mechanism, and a return spring is connected between the straight portion and the second groove; the first linkage mechanism includes a second roller and a driving block, the second roller is rotatably installed on the limiting portion, the driving block is fixedly provided on the support frame, and the driving block is provided with a second inclined surface that contacts the second roller;

[0013] When the vertical push plate moves upward, the first fixing member will move toward the conductive adhesive, and the positioning portion on the U-shaped portion will contact the side surface of the conductive adhesive. Under the action of the second inclined surface and the second roller, the straight portion of the first fixing member slides in the second groove, thereby enabling the positioning portion inside the U-shaped groove to position the conductive adhesive in the X direction; after the vertical push plate is reset, the first fixing member is reset under the action of the reset spring.

[0014] It is further defined that mounting holes are provided on the vertical push plate and the limiting portion, and the return spring is installed in the mounting hole.

[0015] Preferably, the Y-axis positioning mechanism includes a fixed block, an L-shaped connecting block and a second fixing member, the fixed block is fixedly arranged on the support frame, the horizontal section of the L-shaped connecting block is fixedly connected to the vertical push plate, the top surface of the fixed block is provided with a third groove, the fixed block is further provided with a guide groove connected to the third groove, the vertical section of the L-shaped connecting block is slidably connected to the guide groove, the second fixing member is L-shaped, the second fixing member is slidably installed in the third groove, the top of the vertical section of the L-shaped connecting block is provided with a third inclined surface, the second fixing member is provided with a third roller corresponding to the third inclined surface close to the side of the vertical section of the L-shaped connecting block, the second fixing member is provided with a pressing portion for pushing the conductive adhesive to move, and a reset spring is provided between the second fixing member and the fixed block;

[0016] When the vertical push plate moves upward, under the action of the third inclined surface and the third roller, the second fixing part will move toward the conductive glue, so that the conductive glue can move in the first groove to achieve Y-direction positioning. In this way, the conductive glue entering the first groove can be sent to the preset position to ensure the reference degree of the conductive glue position.

[0017] Among them, a give way groove is provided on the side opposite to the fixed block of the second fixing piece, a reset spring is located in the give way groove, and one end of the reset spring is connected to the second fixing piece, and the other end is connected to the fixed block; the reset spring can realize the reset of the second fixing piece.

[0018] Further optimized, the lower push plate is slidably set on the base through a first sliding component, and the vertical push plate is slidably set on the support frame through a second sliding component.

[0019] Wherein, the first and second sliding components both include a slider and a slide rail.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention is mainly used to achieve precise positioning of conductive adhesive. After the conductive adhesive is delivered to the vertical push plate, the vertical push plate on the base is driven upward by a drive mechanism. At this time, the conductive adhesive is located in the first groove. During the vertical push plate's ascent, the position of the conductive adhesive is adjusted under the action of the first linkage mechanism and the Y-direction positioning mechanism. When positioning the conductive adhesive, the conductive adhesive is driven along the X-direction under the action of the first linkage mechanism. At the same time, the conductive adhesive is moved in the Y-direction under the action of the Y-direction positioning mechanism, so that the conductive adhesive can be precisely positioned in the first groove. The conductive adhesive can be uniquely positioned in the first groove. When the negative pressure mechanism is used to adsorb the conductive adhesive, the unique position of the conductive adhesive in the first groove can be guaranteed. The present invention can solve the technical problem in the prior art of large errors in the position of the conductive adhesive during automated fixing of the conductive adhesive, resulting in misalignment of the conductive adhesive installation position and reduced yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 Schematic diagram of the overall structure of the present invention

[0024] Figure 2 For the present invention Figure 1 A partial enlarged schematic diagram of point A in the middle.

[0025] Figure 3 For the present invention Figure 1 A partial enlarged schematic diagram of point B in the middle.

[0026] FIG4 is a schematic diagram of the overall structure of the first fixing member of the present invention.

[0027] Figure 5 This is a schematic diagram of the conductive adhesive of the present invention after positioning.

[0028] Reference numerals:

[0029] 101-base, 102-support frame, 103-down push plate, 104-vertical push plate, 105-driving mechanism, 106-first inclined plane, 107-tension spring, 108-first groove, 109-second groove, 110-first fixing member, 111-first linkage mechanism, 112-mounting plate, 113-Y-axis positioning mechanism, 114-conductive adhesive, 115-first sliding assembly, 116-second sliding assembly, 11 7-slider, 118-slide rail, 119-first roller, 120-straight portion, 121-U-shaped portion, 122-limiting portion, 123-positioning portion, 124-second roller, 125-driving block, 126-second inclined surface, 127-fixing block, 128-L-shaped connecting block, 129-second fixing member, 130-third groove, 131-guide groove, 132-third inclined surface, 133-third roller, 134-pressing portion. DETAILED DESCRIPTION

[0030] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0031] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the embodiments of the present invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0033] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0034] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] The disclosure below provides many different embodiments or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. In addition, the embodiments of the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

[0036] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0037] Example 1

[0038] See Figure 1-Figure 5 This embodiment discloses a method for automatically positioning and calibrating conductive adhesive, including using a conductive adhesive linkage positioning and calibration mechanism to position and calibrate the conductive adhesive. The conductive adhesive linkage positioning and calibration mechanism includes a base 101, a support frame 102 fixedly disposed on the base 101, a lower push plate 103 slidably disposed on the base 101, and a vertical push plate 104 slidably and vertically disposed on the support frame 102. The lower push plate 103 is connected to a drive mechanism 105, which is used to drive the lower push plate 103 to move.

[0039] A first inclined surface 106 is provided on the lower push plate 103, and a tension spring 107 is provided between the vertical push plate 104 and the support frame 102. Under the action of the tension spring 107, the vertical push plate 104 contacts the first inclined surface 106;

[0040] A first groove 108 and a second groove 109 are provided on the top of the vertical push plate 104. The first groove 108 is perpendicular to the second groove 109 and is a groove for placing the conductive adhesive. A first fixing member 110 is slidably provided in the second groove 109. The first fixing member 110 is connected to a first linkage mechanism 111. Under the action of the first linkage mechanism 111, when the vertical push plate 104 moves upward, the first fixing member 110 positions and fixes the conductive adhesive 114 in the X direction.

[0041] A mounting plate 112 is provided on the support frame 102 , and a Y-direction positioning mechanism 113 is provided on the mounting plate 112 . The Y-direction positioning mechanism 113 is used to achieve Y-direction positioning of the conductive adhesive 114 .

[0042] The specific positioning method is as follows:

[0043] Step 1: After the conductive adhesive 114 is delivered to the vertical push plate 104:

[0044] Step 2: The vertical push plate 104 on the base 101 is driven upward by the provided driving mechanism 105. At this time, the conductive adhesive 114 is located in the first groove 108. During the upward movement of the vertical push plate 104, the position of the conductive adhesive 114 is adjusted under the action of the first linkage mechanism 111 and the Y-direction positioning mechanism 113. When positioning the conductive adhesive 114, the first linkage mechanism 111 drives the conductive adhesive 114 in the X direction. Simultaneously, the Y-direction positioning mechanism 113 moves the conductive adhesive 114 in the Y direction, allowing the conductive adhesive 114 to be accurately positioned within the first groove 108. When the negative pressure mechanism is used to absorb the conductive adhesive 114, the unique position of the conductive adhesive 114 within the first groove 108 can be guaranteed. The present invention can solve the technical problem in the prior art of large position errors of the conductive adhesive 114 during automated fixing, resulting in misalignment of the conductive adhesive 114 installation position and reduced yield.

[0045] The lower push plate 103 is slidably disposed on the base 101 via a first sliding assembly 115 , and the vertical push plate 104 is slidably disposed on the support frame 102 via a second sliding assembly 116 .

[0046] It is further defined that the first and second sliding assemblies each include a slider 117 and a slide rail 118 ; the provision of the slide rail 118 and the slider 117 can make the lower push plate 103 and the vertical push plate 104 more stable when moving.

[0047] For further optimization, at least one first roller 119 in contact with the first inclined surface 106 is provided on the vertical push plate 104; by providing the first roller 119, the sliding friction during contact can be changed to rolling friction, thereby reducing wear and improving accuracy during use.

[0048] Among them, the driving mechanism 105 includes a telescopic rod, the fixed end of the telescopic rod is fixedly set on the base 101, and the movable end of the telescopic rod is connected to the lower push plate 103. The telescopic rod is used to drive the lower push plate 103 to move on the base 101 to realize the driving of the vertical push plate 104.

[0049] In actual use, the telescopic rod is a pneumatic telescopic rod, a hydraulic telescopic rod or an electric telescopic rod.

[0050] In this embodiment, the first fixing member 110 includes a straight portion 120, a U-shaped portion 121 provided at one end of the straight portion 120, and a limiting portion 122 provided at the other end of the straight portion 120. The lower end of the U-shaped portion 121 forms a step with the straight portion 120, and the upper end surface of the U-shaped portion 121 is flush with the straight portion 120. The U-shaped portion 121 is used to position the conductive adhesive 114. The U-shaped groove on the U-shaped portion 121 is aligned with the first groove 108 to form a conductive adhesive trapping groove. The U-shaped portion 121 is provided with a positioning portion 123 extending into the U-shaped groove; the straight portion 120 is slidably mounted in the second groove 109; the limiting portion 122 is connected to the first linkage mechanism 111, and a return spring is connected between the straight portion 120 and the second groove 109;

[0051] The first linkage mechanism 111 includes a second roller 124 and a driving block 125 . The second roller 124 is rotatably mounted on the limiting portion 122 . The driving block 125 is fixedly mounted on the support frame 102 . The driving block 125 is provided with a second inclined surface 126 that contacts the second roller 124 .

[0052] When the vertical push plate 104 moves upward, the first fixing member 110 will move toward the conductive adhesive 114, and the positioning portion 123 on the U-shaped portion 121 will contact the side of the conductive adhesive 114. Under the action of the second inclined surface 126 and the second roller 124, the straight portion 120 of the first fixing member 110 slides in the second groove 109, so that the positioning portion 123 inside the U-shaped groove can achieve X-direction positioning of the conductive adhesive 114; after the vertical push plate 104 is reset, the first fixing member 110 is reset under the action of the reset spring.

[0053] Mounting holes are provided on the vertical push plate 104 and the limiting portion 122 , and the return spring is installed in the mounting holes.

[0054] Among them, the Y-axis positioning mechanism 113 includes a fixed block 127, an L-shaped connecting block 128 and a second fixing member 129. The fixed block 127 is fixedly set on the support frame 102. The horizontal section of the L-shaped connecting block 128 is fixedly connected to the vertical push plate 104. The top surface of the fixed block 127 is provided with a third groove 130. The fixed block 127 is also provided with a guide groove 131 connected to the third groove 130. The vertical section of the L-shaped connecting block 128 is slidably connected to the guide groove 131. The second fixing member 1 29 has an L-shaped structure, the second fixing member 129 is slidably installed in the third groove 130, a third inclined surface 132 is provided on the top of the vertical section of the L-shaped connecting block 128, and a third roller 133 corresponding to the third inclined surface 132 is installed on the side of the second fixing member 129 close to the vertical section of the L-shaped connecting block 128. The second fixing member 129 is provided with a pressing portion 134 for pushing the conductive adhesive 114 to move, and a reset spring 107 is provided between the second fixing member 129 and the fixing block 127.

[0055] When the vertical push plate 104 moves upward, the third inclined surface 132 and the third roller 133 cause the second fixing member 129 to move toward the conductive adhesive 114, allowing the conductive adhesive 114 to move within the first groove 108 and achieve positioning in the Y direction. This allows the conductive adhesive 114 within the first groove 108 to be delivered to a preset position, ensuring the reference accuracy of the position of the conductive adhesive 114. This ensures that the negative pressure mechanism adsorbs the conductive adhesive 114 while maintaining the unique position of the conductive adhesive 114 within the first groove 108. The present invention solves the technical problem in the prior art of large positional errors during automated fixing of the conductive adhesive 114, resulting in misalignment of the conductive adhesive 114 and reduced product yield.

[0056] Among them, the second fixing member 129 is provided with a clearance groove on the side opposite to the fixing block 127, and the reset spring 107 is located in the clearance groove, and one end of the reset spring is connected to the second fixing member 129 and the other end is connected to the fixing block 127. The reset spring 107 can realize the reset of the second fixing member 129.

[0057] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for automatic positioning and calibration of conductive adhesive, characterized by: Including adopting a conductive glue linkage positioning and calibration mechanism to position and calibrate the conductive glue; The conductive adhesive linkage positioning and calibration mechanism includes a base, a support frame fixedly arranged on the base, a lower push plate slidably arranged on the base, a vertical push plate slidably arranged on the support frame, and the lower push plate is connected to a driving mechanism for driving the lower push plate to move; The lower push plate is provided with a first inclined surface, and a tension spring is provided between the vertical push plate and the support frame. Under the action of the tension spring, the vertical push plate contacts the first inclined surface; a first groove and a second groove are provided on the top of the vertical push plate, the first groove is perpendicular to the second groove, the first groove is a conductive adhesive placement groove, and a first fixing member is slidingly provided in the second groove, and the first fixing member is connected to a first linkage mechanism. Under the action of the first linkage mechanism, when the vertical push plate moves upward, the first fixing member positions and fixes the conductive adhesive in the X direction; a mounting plate is provided on the support frame, and a Y-direction positioning mechanism is provided on the mounting plate. The Y-direction positioning mechanism is used to achieve Y-direction positioning of the conductive adhesive; The specific positioning method is as follows: The conductive glue is delivered to the vertical push plate, and the driving mechanism drives the vertical push plate on the base to move upward; At this time, the conductive adhesive is located in the first groove. During the upward movement of the vertical push plate, the position of the conductive adhesive is adjusted under the action of the first linkage mechanism and the Y-direction positioning mechanism. When positioning the conductive adhesive, the conductive adhesive is driven in the X direction under the action of the first linkage mechanism. At the same time, the conductive adhesive is moved in the Y direction under the action of the Y-direction positioning mechanism, so that the conductive adhesive can be accurately positioned in the first groove. The first fixing member includes a straight portion, a U-shaped portion provided at one end of the straight portion, and a limiting portion provided at the other end of the straight portion, wherein the lower end of the U-shaped portion forms a step with the straight portion, and the upper end surface of the U-shaped portion is flush with the straight portion, the U-shaped portion is used to realize the positioning of the conductive adhesive, and the U-shaped groove provided on the U-shaped portion is aligned with the first groove to form a conductive adhesive trapping groove, and the U-shaped portion is provided with a positioning portion extending into the U-shaped groove; the straight portion is slidably installed in the second groove; the limiting portion is connected to the first linkage mechanism, and a return spring is connected between the straight portion and the second groove; the first linkage mechanism includes a second roller and a driving block, the second roller is rotatably mounted on the limiting portion, the driving block is fixedly provided on the support frame, and the driving block is provided with a second inclined surface that contacts the second roller; When the vertical push plate moves upward, the first fixing member will move toward the conductive adhesive, and the positioning portion on the U-shaped portion will contact the side surface of the conductive adhesive. Under the action of the second inclined surface and the second roller, the straight portion of the first fixing member slides in the second groove, thereby enabling the positioning portion inside the U-shaped groove to position the conductive adhesive in the X direction; after the vertical push plate is reset, the first fixing member is reset under the action of the reset spring.

2. The method for automatic positioning and calibration of conductive adhesive according to claim 1, characterized in that: The vertical push plate is provided with at least one first roller in contact with the first inclined surface; After the lower push plate moves under the action of the driving mechanism, the first roller in contact with the first inclined surface rolls on the first inclined surface, driving the vertical push plate to move upward. After the lower push plate is reset, the vertical push plate is reset under the action of the tension spring.

3. The method for automatic positioning and calibration of conductive adhesive according to claim 1, characterized in that: The vertical push plate and the limiting portion are provided with mounting holes, and the return spring is installed in the mounting holes.

4. The method for automatic positioning and calibration of conductive adhesive according to claim 1, characterized in that: The Y-axis positioning mechanism includes a fixed block, an L-shaped connecting block and a second fixing member, the fixed block is fixedly arranged on the support frame, the horizontal section of the L-shaped connecting block is fixedly connected to the vertical push plate, a third groove is provided on the top surface of the fixed block, a guide groove connected to the third groove is further provided on the fixed block, the vertical section of the L-shaped connecting block is slidably connected to the guide groove, the second fixing member is L-shaped, the second fixing member is slidably installed in the third groove, a third inclined surface is provided on the top of the vertical section of the L-shaped connecting block, a third roller corresponding to the third inclined surface is installed on the side of the second fixing member close to the vertical section of the L-shaped connecting block, the second fixing member is provided with a pressing portion for pushing the conductive adhesive to move, and a reset spring is provided between the second fixing member and the fixed block; When the vertical push plate moves upward, under the action of the third inclined surface and the third roller, the second fixing part will move toward the conductive glue, so that the conductive glue can move in the first groove to achieve Y-direction positioning. In this way, the conductive glue entering the first groove can be sent to the preset position to ensure the reference degree of the conductive glue position.

5. The method for automatic positioning and calibration of conductive adhesive according to claim 4, characterized in that: A yield groove is provided on the side opposite to the fixing block of the second fixing piece, and a reset spring is located in the yield groove. One end of the reset spring is connected to the second fixing piece, and the other end is connected to the fixing block. The reset spring can realize the reset of the second fixing piece.

6. A method for automatic positioning and calibration of conductive adhesive according to any one of claims 1 to 5, characterized in that: The lower push plate is slidably arranged on the base through a first sliding assembly, and the vertical push plate is slidably arranged on the support frame through a second sliding assembly.

7. The method for automatic positioning and calibration of conductive adhesive according to claim 6, characterized in that: The first and second sliding components both include a sliding block and a sliding rail.

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