Anti-interference high-frequency high-speed missing layer reference superstructure

Abstract

The application discloses an anti-interference high-frequency high-speed missing layer reference superposition structure and relates to the field of high-frequency high-speed signal line missing layer reference design. The application comprises the following steps: hollowing treatment is performed between a high-frequency high-speed line and a GND layer to form a hollowing area; the hollowing area structure is a reflow path of the high-frequency high-speed line and a signal reference layer; a radiation shielding line is arranged on a radiation signal layer close to the hollowing area, and the radiation shielding line is provided with a radiation shielding hole; the application can effectively shield a power supply layer and a sensitive signal layer to form edge radiation effect, avoids the interference of edge radiation on the high-frequency high-speed line, and greatly reduces signal noise and signal burrs of the high-frequency high-speed signal line.

Description

Technical Field

[0001] This invention relates to the field of high-frequency and high-speed signal line missing layer reference design, and specifically to an interference-resistant high-frequency and high-speed missing layer reference stack. Background Technology

[0002] The statements in this section are provided only as background information in connection with this disclosure and may not constitute prior art.

[0003] Currently, in high-frequency and high-speed designs, a layer-gap reference design, also known as a missing-layer reference design, is typically required to ensure impedance consistency across the entire link. A missing-layer reference involves hollowing out the signal transmission path at the impedance abrupt change point created by the transition from the transmission line to a three-dimensional structure. This involves removing the portion of the reference plane directly below the pads in the three-dimensional structure, thus ensuring a sufficiently large distance between the signal layer and the reference layer. This missing-layer design satisfies impedance control requirements. However, the power layer and sensitive signal layer in a missing-layer design are prone to edge radiation effects, which can easily cause interference to high-frequency and high-speed signal lines. Simultaneously, high-frequency and high-speed signal lines can also interfere with other signals within the missing-layer design structure.

[0004] In current designs, to ensure impedance consistency at locations where high-frequency, high-speed signal lines experience impedance abrupt changes, only the first layer directly below the high-frequency, high-speed signal line is hollowed out. Some scholars have proposed adding high-frequency, high-speed signal lines to reduce losses and hollowing out the layers directly below. However, both of these design approaches only consider impedance consistency and do not take into account the electromagnetic interference issues caused by the resulting three-dimensional structure. This is mainly manifested in the high-frequency, high-speed signal line generating strong electromagnetic radiation into the three-dimensional structure, severely affecting sensitive signals within the hollowed-out three-dimensional structure. Furthermore, the exposed power and radiation layers of the hollowed-out three-dimensional structure also radiate electromagnetic signals, thus causing electromagnetic interference to the high-frequency, high-speed signal line.

[0005] In summary, under the current missing-layer reference design approach, high-frequency and high-speed signal lines can cause electromagnetic interference to other signals in the missing-layer design structure. Furthermore, the corresponding power layer and sensitive signal layer are prone to edge radiation effects, radiating through the exposed space in this three-dimensional structure and thus interfering with high-frequency and high-speed signal lines. This not only significantly increases signal noise and glitches generated during high-frequency and high-speed signal transmission but also exacerbates electromagnetic compatibility issues in the product system.

[0006] The current design method for missing layers in high-frequency and high-speed signal lines presents the following problems in existing printed circuit board designs:

[0007] 1. In the high-frequency and high-speed signal line missing layer reference design, when the line width is increased, the corresponding multiple layers directly below will be hollowed out. This will cause the high-frequency and high-speed signal lines to cause electromagnetic interference to other signals in the missing layer design structure, which greatly increases the electromagnetic compatibility problem of the product system.

[0008] 2. The three-dimensional structure formed by the hollowing out is prone to edge radiation effect on the corresponding power layer and sensitive signal layer. The spatial radiation exposed through this three-dimensional structure will interfere with high-frequency and high-speed signal lines, greatly increasing the signal noise and signal glitches of high-frequency and high-speed signal lines.

[0009] 3. At the same time, the superimposed electromagnetic fields formed by high-frequency and high-speed signal lines and power supply layers create greater electromagnetic radiation hazards and increase product instability. Summary of the Invention

[0010] The purpose of this invention is to address the problems existing in the prior art by providing an anti-interference high-frequency and high-speed missing layer reference stack, which allows the electromagnetic signals generated by high-frequency and high-speed signal lines to be coupled to the GND radiation shielding aperture. This avoids the high-frequency and high-speed signal lines from causing electromagnetic interference to other signals in the missing layer design structure, greatly increasing the electromagnetic compatibility issues of the product system and significantly improving the reliability of electronic products.

[0011] The technical solution of the present invention is as follows:

[0012] An interference-resistant high-frequency and high-speed missing-layer reference stack includes: a hollowing-out process is performed between the high-frequency and high-speed line and the GND layer to form a hollowed-out region; the hollowed-out region structure is the return path between the high-frequency and high-speed line and the signal reference layer; a radiation shielding line is set on the radiation signal layer near the hollowed-out region, and a radiation shielding hole is set on the radiation shielding line.

[0013] Furthermore, the width of the high-frequency high-speed line is W, the height of the hollowed-out area is h, the width of the radiation shielding line is W1, the spacing between the radiation shielding line and the radiation signal layer is W2, and the diameter of the radiation shielding hole is D1.

[0014] Furthermore, W and W1 satisfy the following dimensional requirement: W1≥W.

[0015] Furthermore, W and W2 satisfy the following dimensional requirement: W2≥3W.

[0016] Furthermore, D1 and W1 satisfy the following dimensional requirement: D1≤W1.

[0017] Furthermore, the high-frequency high-speed line is a microstrip line or a stripline.

[0018] Furthermore, the high-frequency, high-speed line is a microstrip line, and its width W is determined by the following formula:

[0019]

[0020] Where: Z0 is the single-ended impedance, ε rh is the dielectric constant, and h1 is the line thickness.

[0021] Furthermore, the high-frequency, high-speed line is a stripline, and its width W is determined by the following formula:

[0022]

[0023] Where: Z0 is the single-ended impedance, ε r h is the dielectric constant, and h1 is the line thickness.

[0024] Furthermore, D1 is between 0.2mm and 1mm, and the spacing between each radiation shielding hole is between 1mm and 5mm.

[0025] Compared with existing technologies, the advantages of this invention are:

[0026] 1. An anti-interference high-frequency and high-speed missing-layer reference stack, comprising: hollowing out a region between the high-frequency and high-speed line and the GND layer; the hollowed-out region structure serves as the return path between the high-frequency and high-speed line and the signal reference layer; a radiation shielding line is provided on the radiation signal layer near the hollowed-out region, and a radiation shielding hole is provided on the radiation shielding line; it can effectively shield the edge radiation effect formed by the power layer and the sensitive signal layer, avoid the interference of edge radiation on the high-frequency and high-speed line, and greatly reduce the signal noise and signal glitches of the high-frequency and high-speed signal line.

[0027] 2. An anti-interference high-frequency and high-speed missing layer reference stack, wherein the proposed design of radiation shielding holes on the radiation shielding line allows the electromagnetic signals generated by the high-frequency and high-speed signal lines to be coupled to the radiation shielding holes, which can prevent the high-frequency and high-speed signal lines from causing electromagnetic interference to other signals in the missing layer design structure, greatly increasing the electromagnetic compatibility of the product system and also greatly improving the reliability of electronic products. Attached Figure Description

[0028] Figure 1 A top view of a high-frequency, high-speed, non-interference-resistant, multilayer reference stacked printed circuit board;

[0029] Figure 2 This is a cross-sectional view of a high-frequency, high-speed, non-layered reference stack structure that is resistant to interference.

[0030] Figure 3 This is a reference path diagram for a high-frequency, high-speed, non-interference-resistant, layer-deficient reference stack.

[0031] Figure 4 A plan view of a high-frequency, high-speed, non-layered reference stacked radiation shielding structure for interference resistance;

[0032] Figure 5 A cross-sectional view of a high-frequency, high-speed, non-layered reference stacked radiation shielding structure for interference resistance;

[0033] Figure 6 This is a plan view of a high-frequency, high-speed, non-interference-resistant, multilayer reference stacked printed circuit board application. Detailed Implementation

[0034] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0036] Example 1

[0037] Please see Figure 1-6 An interference-resistant high-frequency, high-speed, missing-layer reference stack, comprising:

[0038] A hollowing process is performed between the high-frequency high-speed line and the GND layer to form a hollowed-out region (i.e., the corresponding ground layer and radiation signal layer are hollowed out directly below the high-frequency high-speed line until the GND layer is encountered, and this hollowing process is generally multi-layered); the structure of the hollowed-out region is the return path between the high-frequency high-speed line and the signal reference layer; a radiation shielding line is set near the hollowed-out region on the radiation signal layer, and a radiation shielding hole is set on the radiation shielding line.

[0039] The radiation shielding wires and radiation shielding holes mentioned above can effectively shield the interference of high-frequency and high-speed lines to the signal layer, avoid the edge radiation effect between the power layer and the sensitive signal layer, and greatly reduce the signal noise and signal glitches of high-frequency and high-speed signal lines.

[0040] The above structure also allows electromagnetic signals generated by high-frequency and high-speed signal lines to be coupled to the radiation shielding holes, which can prevent high-frequency and high-speed signal lines from causing electromagnetic interference to other signals in the missing layer design structure, greatly increasing the electromagnetic compatibility issues of the product system and also greatly improving the reliability of electronic products.

[0041] In this embodiment, specifically, the width of the high-frequency high-speed line is W, the height of the hollowed-out area is h, the width of the radiation shielding line is W1, the spacing between the radiation shielding line and the radiation signal layer is W2, the diameter of the radiation shielding hole is D1, the diameter D1 of the radiation shielding hole is between 0.2mm and 1mm, and the spacing between each radiation shielding hole is between 1mm and 5mm.

[0042] In this embodiment, specifically, W and W1 satisfy the following size requirements: W1≥W; W and W2 satisfy the following size requirements: W2≥3W; D1 and W1 satisfy the following size requirements: D1≤W1.

[0043] In this embodiment, specifically, the high-frequency high-speed line is a microstrip line or a stripline;

[0044] When it is a microstrip line, the width W of the high-frequency, high-speed line is determined by the following formula:

[0045] Microstrip line impedance calculation method:

[0046]

[0047] When it is a stripline, the width W of the high-frequency, high-speed line is determined by the following formula:

[0048] Methods for calculating stripline impedance:

[0049]

[0050] Where: Z0 is the single-ended impedance, ε r h is the dielectric constant, and h1 is the line thickness.

[0051] The embodiments described above merely illustrate specific implementation methods of this application, and while the descriptions are detailed and specific, they should not be construed as limiting the scope of protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the technical solution of this application, and these modifications and improvements all fall within the scope of protection of this application.

[0052] This background section is provided to generally present the context of the invention. The work of the currently named inventors, the work to the extent described in this background section, and aspects of this section that did not constitute prior art at the time of application are neither expressly nor impliedly acknowledged as prior art to the invention.

Claims

1. A high-frequency, high-speed, non-interference-resistant, layer-deficient reference stack, characterized in that, include: A hollowing process is performed between the high-frequency, high-speed line and the GND layer to create a hollowed-out area. The hollowed-out region structure is the return path between the high-frequency high-speed line and the signal reference layer. A radiation shielding line is set near the hollowed-out area of ​​the radiation signal layer, and a radiation shielding hole is set on the radiation shielding line.

2. The interference-resistant high-frequency high-speed missing-layer reference stack according to claim 1, characterized in that, The width of the high-frequency high-speed line is W, the height of the hollowed-out area is h, the width of the radiation shielding line is W1, the spacing between the radiation shielding line and the radiation signal layer is W2, and the diameter of the radiation shielding hole is D1.

3. The anti-interference high-frequency high-speed missing-layer reference stack according to claim 2, characterized in that, W and W1 satisfy the following dimensional requirement: W1≥W.

4. The anti-interference high-frequency high-speed missing-layer reference stack according to claim 2, characterized in that, W and W2 must meet the following dimensional requirements: W2≥3W.

5. The interference-resistant high-frequency high-speed missing-layer reference stack according to claim 2, characterized in that, D1 and W1 satisfy the following dimensional requirement: D1≤W1.

6. The interference-resistant high-frequency high-speed missing-layer reference stack according to claim 2, characterized in that, The high-frequency, high-speed line is a microstrip line or a stripline.

7. The interference-resistant high-frequency high-speed missing-layer reference stack according to claim 6, characterized in that, The high-frequency, high-speed line is a microstrip line, and its width W is determined by the following formula: Where: Z0 is the single-ended impedance, ε r h is the dielectric constant, and h1 is the line thickness.

8. The interference-resistant high-frequency high-speed missing-layer reference stack according to claim 6, characterized in that, The high-frequency, high-speed line is a stripline, and its width W is determined by the following formula: Where: Z0 is the single-ended impedance, ε r h is the dielectric constant, and h1 is the line thickness.

9. The interference-resistant high-frequency high-speed missing-layer reference stack according to claim 2, characterized in that, The D1 is between 0.2mm and 1mm, and the spacing between each radiation shielding hole is between 1mm and 5mm.

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