Microfluidic chip and detection system, detection method and preparation method thereof

Abstract

A microfluidic chip and a detection system, a detection method and a preparation method thereof, wherein the crimping device of the microfluidic chip comprises a cover plate, a bottom plate and a probe assembly. The bottom plate is arranged in a box with the cover plate; the bottom plate is provided with a receiving groove, the slot opening of the receiving groove is arranged towards the cover plate, and the groove bottom of the receiving groove is provided with an opening. The probe assembly comprises a plurality of probes; the probe assembly is fixedly connected with the groove bottom of the receiving groove, one end of the plurality of probes close to the cover plate is configured to contact the microfluidic chip, and one end of the plurality of probes away from the cover plate penetrates through the opening.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a microfluidic chip and its detection system, detection method, and preparation method. Background Technology

[0002] Microfluidics refers to the technology of using microchannels (tens to hundreds of micrometers in size) to process or manipulate tiny fluids (volumes ranging from nanoliters (nL) to microliters (μL)). Microfluidic chips are the main platform for realizing microfluidic technology. Microfluidic chips are characterized by parallel sample acquisition and processing, high integration, high throughput, fast analysis speed, low power consumption, low material consumption, and low pollution. Microfluidic technology can be applied in fields such as bioengineering, disease diagnosis and drug research, cell analysis, environmental monitoring and protection, health quarantine, and forensic identification, mainly involving the mixing and transport of trace reagent samples, among which sample transport is one of the fundamental steps in biochemical detection.

[0003] In recent years, microfluidic technology has developed rapidly, and the requirements for the performance of microfluidic chips have become increasingly stringent. Among these requirements, the reliability and stability of sample transport are key performance indicators for microfluidic chips to achieve the target biochemical process. Optimizing this performance is of great significance for the development of fields such as biomedicine, drug diagnostics, food hygiene, environmental monitoring, and molecular biology. Summary of the Invention

[0004] On the one hand, a microfluidic chip pressing device is provided, including a cover plate, a base plate and a probe assembly.

[0005] The base plate and the cover plate are aligned; the base plate has a receiving groove with its opening facing the cover plate and an opening at the bottom. The probe assembly includes multiple probes; the probe assembly is fixedly connected to the bottom of the receiving groove, with one end of the multiple probes near the cover plate configured to contact the microfluidic chip, and the other end of the multiple probes away from the cover plate passing through the opening.

[0006] In some embodiments, the probe assembly further includes a needle mold. The needle mold is fixedly connected to the bottom of the receiving groove, and the needle mold has multiple mounting holes. A probe passes through one mounting hole and is fixed within the mounting hole.

[0007] In some embodiments, the bottom of the receiving groove includes a plurality of receiving portions, which are spaced apart along the groove wall, and at least one of the receiving portions protrudes relative to the groove wall. The probe assembly is disposed between two adjacent receiving portions, and both ends of the probe assembly are fixedly connected to the two adjacent receiving portions, respectively.

[0008] In some embodiments, the crimping device includes a plurality of the probe assemblies. At least one of the plurality of probe assemblies is a bonding probe assembly disposed near the wall of the receiving groove, and one end of one of the probes in the bonding probe assembly near the cover plate is configured to contact the bonding electrode of the microfluidic chip.

[0009] In some embodiments, at least one of the plurality of probe assemblies is a driving probe assembly, which is disposed away from the wall of the receiving groove relative to the bonding probe assembly, and the ends of the plurality of probes in the driving probe assembly near the cover plate are configured to contact the driving electrode of the microfluidic chip.

[0010] In some embodiments, the bottom of the receiving groove is further provided with a first through hole. The crimping device also includes a grounding probe. The grounding probe is fixedly connected to the bottom of the receiving groove, one end of the grounding probe near the cover plate is configured to contact the microfluidic chip, and the other end of the grounding probe away from the cover plate passes through the first through hole.

[0011] In some embodiments, the plurality of probes and the grounding probe are elastic in their own length extension direction. The elastic deformation range of the grounding probe is greater than the elastic deformation range of at least one of the plurality of probes.

[0012] In some embodiments, the crimping device further includes a pressing structure. The pressing structure is disposed on the side of the cover plate facing the base plate, and the pressing structure is elastic. When the cover plate and the base plate are engaged, the orthographic projection of the pressing structure onto a reference surface at least partially coincides with the orthographic projection of the probe assembly onto the reference surface. The reference surface is the plane containing the bottom surface of the receiving groove near the cover plate.

[0013] In some embodiments, the pressing structure includes a pressing plate and an elastic element. The elastic element is located between the pressing plate and the cover plate, with one end connected to the pressing plate and the other end connected to the cover plate. When the cover plate is engaged with the base plate, the orthographic projection of the pressing plate onto the reference surface at least partially coincides with the orthographic projection of the probe assembly onto the reference surface.

[0014] In some embodiments, the crimping device further includes a hinge structure. The hinge structure includes a first hinge and a second hinge that are movably connected, the first hinge being fixedly connected to the cover plate, and the second hinge being fixedly connected to the base plate.

[0015] In some embodiments, the crimping device further includes a snap-fit ​​structure. The snap-fit ​​structure includes a buckle and a slot; the buckle is fixedly connected to one of the cover plate and the base plate, and the slot is located on the other of the cover plate and the base plate, allowing the buckle to snap into the slot. The hinge structure and the snap-fit ​​structure are respectively located on opposite sides of the cover plate and the base plate.

[0016] On the other hand, a detection device for microfluidic chips is provided, including a circuit board, a processor, and a crimping device as described in any of the foregoing embodiments.

[0017] The circuit board is disposed on the side of the base plate of the crimping device away from the cover plate; the circuit board includes a substrate and a plurality of pads disposed on the substrate, one pad contacting a probe of the crimping device. The processor is disposed on the circuit board and electrically connected to the plurality of pads; the processor is configured to transmit detection signals through the pads to the probes in contact with the pads, and to receive feedback signals from the probes and process the feedback signals.

[0018] In some embodiments, the plurality of pads are disposed on the side of the substrate closer to the base plate, and the processor is disposed on the side of the substrate away from the base plate.

[0019] In some embodiments, the crimping device includes a grounding probe. The circuit board also includes a grounding pad that contacts the grounding probe.

[0020] In some embodiments, the circuit board further includes a resistor connected in parallel with the processor.

[0021] In some embodiments, the resistance value of the resistor is less than or equal to the resistance value of the processor.

[0022] In another aspect, a microfluidic chip detection system is provided, comprising an industrial computer and a detection device as described in any of the foregoing embodiments. The industrial computer is electrically connected to a circuit board in the detection device.

[0023] On the other hand, a method for detecting microfluidic chips is provided, which uses the detection device described in any of the foregoing embodiments for detection.

[0024] The detection method includes placing a microfluidic chip in a receiving groove on the base plate of the detection device; the microfluidic chip includes multiple electrodes, one of which is in contact with a probe of the detection device. The method detects whether there is a short circuit between two mutually insulated electrodes. And / or, the microfluidic chip includes multiple lines, each line connected in series with at least two of the electrodes; the method detects whether the lines are open-circuited.

[0025] In some embodiments, detecting whether there is a short circuit between two mutually insulated electrodes among the plurality of electrodes includes combining the plurality of electrodes in pairs to obtain a plurality of electrode pairs; wherein the two electrodes in each electrode pair are mutually insulated, and the two electrodes in any two electrode pairs are not identical. Detecting whether there is a short circuit between the two electrodes in each electrode pair. Recording the positions of the two electrodes based on the short circuit between the two electrodes in the electrode pair. Determining that there is no short circuit between any two electrodes in the plurality of electrode pairs, it is determined that the microfluidic chip has no short circuit fault.

[0026] In some embodiments, detecting whether there is a short circuit between the two electrodes in each electrode pair includes detecting the voltage between the two electrodes in the electrode pair. A short circuit is determined between the two electrodes in the electrode pair based on the voltage being greater than or equal to a threshold voltage. No short circuit is determined between the two electrodes in the electrode pair based on the voltage being less than the threshold voltage.

[0027] In some embodiments, the detection device includes a processor and a resistor connected in parallel with the processor. The threshold voltage is: ; Wherein, V1 is the threshold voltage, V is the power supply voltage of the detection device, R1 is the resistance between the two electrodes of the electrode pair after short circuit, R2 is the resistance of the processor, and R3 is the resistance of the resistor.

[0028] In some embodiments, detecting whether the circuit is open includes detecting the voltage between two electrodes at both ends of a plurality of electrodes connected in series in the circuit. If the voltage is less than a threshold voltage, the circuit is determined to be open, and the positions of the plurality of electrodes connected in series in the circuit are recorded. If the voltage is greater than or equal to the threshold voltage, the circuit is determined to be not open.

[0029] In some embodiments, the plurality of electrodes includes two foolproof electrodes electrically connected to each other, and the two foolproof electrodes are asymmetrically arranged relative to the set centerline of the microfluidic chip. The microfluidic chip includes opposing first and second sides, and the set centerline is a midline of the microfluidic chip parallel to the first and second sides.

[0030] The detection method further includes detecting whether there is a short circuit between the two electrodes at the target location; the target location is the position of the two foolproof electrodes when the microfluidic chip is correctly placed in the detection device. If there is no short circuit between the two electrodes at the target location, it is determined that the two electrodes at the target location are not the two foolproof electrodes, and the positions of the first and second sides of the microfluidic chip are swapped. If there is a short circuit between the two electrodes at the target location, it is determined that the two electrodes at the target location are the two foolproof electrodes, and the microfluidic chip is correctly placed.

[0031] In another aspect, a method for fabricating a microfluidic chip is provided, comprising fabricating a first substrate and a second substrate, the first substrate including a plurality of electrodes. The first substrate is placed in a detection device as described in any of the preceding embodiments, and the first substrate is detected using the detection method as described in any of the preceding embodiments. Based on a fault-free detection result, a dielectric layer is formed on the plurality of electrodes of the first substrate. The first substrate with the dielectric layer formed is detected. Based on a fault-free detection result, a first hydrophobic layer is formed on the dielectric layer. The first substrate with the first hydrophobic layer formed is detected. Based on a fault-free detection result, the first substrate with the first hydrophobic layer formed is aligned with the second substrate.

[0032] On the other hand, a microfluidic chip is provided, comprising a first substrate and a second substrate.

[0033] The first substrate includes two foolproof electrodes that are electrically connected and are asymmetrically arranged with respect to the center line of the microfluidic chip. The microfluidic chip includes opposing first and second sides. The center line passes through the midpoint of a line connecting any point on the first and second sides and is parallel to both sides. The second substrate is disposed opposite to the first substrate.

[0034] In some embodiments, the first substrate includes a plurality of driving electrodes and a plurality of bonding electrodes, the bonding electrodes being electrically connected to at least one of the driving electrodes. Two of the plurality of bonding electrodes serve as the two foolproof electrodes, both of which are located on the side of the set centerline near the first side.

[0035] In some embodiments, the first substrate includes a plurality of driving electrodes and a plurality of bonding electrodes, the bonding electrodes being electrically connected to at least one of the driving electrodes. The first substrate also includes a temperature sensor disposed adjacent to and insulated from the at least one driving electrode. The temperature sensor is electrically connected to the two foolproof electrodes.

[0036] In some embodiments, the temperature sensor is a wire-wound resistor, which is a zigzag-shaped trace, with both ends of the trace electrically connected to the two foolproof electrodes.

[0037] In some embodiments, one of the two foolproof electrodes is grounded.

[0038] In some embodiments, the second substrate is provided with a second through hole, the orthographic projection of the second through hole onto the first substrate overlapping at least a portion of the grounded anti-foolproof electrode.

[0039] In some embodiments, the first substrate further includes a plurality of driving electrodes, a plurality of bonding electrodes, and a plurality of detection electrodes, wherein at least one driving electrode is simultaneously electrically connected to one of the bonding electrodes and one of the detection electrodes. The bonding electrode and the detection electrode electrically connected to the at least one driving electrode are configured to be electrically connected to the detection device to achieve open circuit detection.

[0040] In some embodiments, the second substrate has at least one second opening, which is configured to expose the plurality of bonding electrodes and / or the plurality of detection electrodes on the first substrate. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0042] Figure 1 A cross-sectional view of a microfluidic chip provided according to some embodiments; Figure 2 This is a structural diagram of a detection system for a microfluidic chip according to some embodiments; Figure 3 This is a structural diagram of a detection device for a microfluidic chip according to some embodiments; Figure 4 An exploded view of a detection device for a microfluidic chip according to some embodiments; Figure 5 This is a structural diagram of a substrate for a microfluidic chip according to some embodiments; Figure 6 This is a structural diagram of a cover plate for a microfluidic chip according to some embodiments; Figure 7 This is a structural diagram of a probe assembly for a microfluidic chip according to some embodiments; Figure 8 This is a structural diagram of a probe provided according to some embodiments; Figure 9 This is a structural diagram of a probe assembly assembled on a base plate according to some embodiments; Figure 10 This is another structural diagram of the probe assembly assembled on the base plate according to some embodiments; Figure 11 This is another structural diagram of the substrate of a microfluidic chip according to some embodiments; Figure 12 An exploded view of a microfluidic chip crimping device provided according to some embodiments; Figure 13 This is a structural diagram of the probe assembly and pressing structure assembled on the base plate according to some embodiments; Figure 14 This is a structural diagram of a hinge structure provided according to some embodiments; Figure 15 A front view of a circuit board provided according to some embodiments; Figure 16 A rear view of a circuit board provided according to some embodiments; Figure 17 This is a flowchart of a detection method for a microfluidic chip according to some embodiments; Figure 18 This is another flowchart of a detection method for a microfluidic chip according to some embodiments; Figure 19 This is another flowchart of a detection method for a microfluidic chip according to some embodiments; Figure 20 This is another flowchart of a detection method for a microfluidic chip according to some embodiments; Figure 21 This is another flowchart of a detection method for a microfluidic chip according to some embodiments; Figure 22 This is a flowchart illustrating a method for fabricating a microfluidic chip according to some embodiments; Figure 23 This is a process diagram illustrating the fabrication method of a microfluidic chip according to some embodiments; Figure 24 This is a structural diagram of a first substrate for a microfluidic chip provided according to some embodiments; Figure 25 This is another structural diagram of the first substrate of a microfluidic chip provided according to some embodiments; Figure 26 for Figure 25 Enlarged view of the structure of region B in the image; Figure 27 This is another structural diagram of the first substrate of a microfluidic chip provided according to some embodiments; Figure 28 This is a structural diagram of the second substrate of a microfluidic chip provided according to some embodiments. Detailed Implementation

[0043] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0044] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0045] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0046] In describing some embodiments, the terms "electrical connection" and "connection" and their derivatives may be used. For example, the term "electrical connection" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0047] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0048] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0049] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0050] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0051] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0052] In the description of this disclosure, it should be understood that the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “vertical,” “horizontal,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0053] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0054] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0055] Microfluidic systems integrate complex laboratory functions onto a single analytical device or chip by constructing microdevices, thereby achieving the miniaturization and integration of analytical systems.

[0056] In some embodiments, basic operational units such as sample preparation, reaction, separation, and detection are integrated onto a centimeter-scale chip to create a microfluidic chip. The microfluidic chip contains microchannels, and the microfluidic system achieves precise control and operation of the sample within the channels by applying a driving force to the microfluidic chip.

[0057] It should be noted that the sample to be tested can be a liquid substance, such as a blood sample, in which the analyte molecules include hemoglobin, platelets, and pathogenic cells. In microfluidic processes, the liquid sample to be tested is placed in the microfluidic chip in the form of droplets. The following examples all use droplets as the sample to be tested.

[0058] Figure 1 A cross-sectional structure of a microfluidic chip 100 is shown. For example... Figure 1 As shown, in some embodiments, the microfluidic chip 100 includes a first substrate 1 and a second substrate 2 disposed in a cascade.

[0059] The first substrate 1 and the second substrate 2 are arranged opposite to each other and spaced apart. The droplet 3 is placed in the gap between the first substrate 1 and the second substrate 2. By changing the voltage between the first substrate 1 and the second substrate 2, the contact angle of the droplet 3 placed between the first substrate 1 and the second substrate 2 can be changed, causing the droplet 3 to deform and displace, thereby realizing the manipulation of the droplet 3.

[0060] In some embodiments, see Figure 1 The second substrate 2 includes a second substrate 21 and a common electrode layer 22 and a second hydrophobic layer 23 sequentially disposed on the second substrate 21. The second substrate 21 is farther away from the first substrate 1 than the second hydrophobic layer 23.

[0061] In some embodiments, the common electrode layer 22 is formed of a continuous transparent conductive indium tin oxide (ITO) layer.

[0062] For example, as a common electrode of the microfluidic chip 100, the common electrode layer 22 is grounded in order to provide a stable low-level voltage for the microfluidic chip 100.

[0063] It should be noted that the common electrode layer 22 can also be disposed on the first substrate 1. This disclosure is only illustrated by taking the common electrode layer 22 disposed on the second substrate 2 as an example, and does not limit the specific structure of the microfluidic chip 100.

[0064] In some embodiments, see Figure 1 The first substrate 1 includes a first substrate 11 and a first conductive layer 12, an insulating layer 13, a second conductive layer 14 and a first hydrophobic layer 15 sequentially disposed on the first substrate 11. The first substrate 11 is farther away from the second substrate 2 than the first hydrophobic layer 15. A channel for the droplet 3 is formed between the first hydrophobic layer 15 and the second hydrophobic layer 23 to allow the droplet 3 to flow smoothly.

[0065] In some embodiments, the second conductive layer 14 is provided with an electrode pattern according to a preset electrode pattern (see [reference]). Figure 26 Multiple driving electrodes Q are distributed in an array (as shown in the rectangular flow channel). The driving electrodes Q are electrically connected to the driving power supply to provide driving voltage for the microfluidic chip 100.

[0066] In some embodiments, see Figure 1 The orthographic projections of the multiple driving electrodes Q onto the first substrate 11 are located within the orthographic projection area of ​​the common electrode layer 22 onto the first substrate 11. That is, the multiple driving electrodes Q and the common electrode layer 22 have a directly opposite area.

[0067] When one driving electrode Q is turned on, the wettability of the droplet 3 changes under the influence of the electric field between the common electrode layer 22 and the turned-on driving electrode Q. This results in different contact angles of the droplet 3 on the driving electrodes Q with and without applied voltage, thereby generating a pressure difference inside the droplet 3. Under the action of this pressure difference, the droplet 3 is driven to move along the direction of the driving electrode Q with applied voltage. By applying driving voltages to different driving electrodes Q in a sequential manner, the droplet 3 can be driven to move along a preset path, thus achieving the manipulation of the droplet 3.

[0068] For example, the driving electrode Q is generally made of metal or other conductive materials. For instance, the driving electrode Q may be made of materials such as Mo or ITO.

[0069] In some embodiments, see Figure 1 The first conductive layer 12 includes multiple signal lines L made of metal.

[0070] Optionally, the signal line L is made of Mo metal. The signal line L is configured to be electrically connected to the drive electrode Q to transmit a drive voltage to the drive electrode Q.

[0071] In some embodiments, see Figure 1 Multiple signal lines L are electrically connected one-to-one with multiple driving electrodes Q, thereby enabling independent control of the multiple driving electrodes Q. Optionally, in some embodiments, a signal line L can be electrically connected simultaneously to at least two non-adjacent driving electrodes Q in the same flow channel (see [reference]). Figure 24 and Figure 26 This allows for independent control of adjacent drive electrodes Q while reducing the number of signal lines L and saving wiring space for signal lines L.

[0072] In some embodiments, see Figure 1 An insulating layer 13 is disposed between the first conductive layer 12 and the second conductive layer 14. A via h is disposed in the insulating layer 13, and the signal line L in the first conductive layer 12 is electrically connected to the driving electrode Q in the second conductive layer 14 through the via h. Optionally, the first conductive layer 12 may be located between the second conductive layer 14 and the first substrate 11, or the second conductive layer 14 may be located between the first conductive layer 12 and the first substrate 11.

[0073] In some embodiments, see Figure 1 The first substrate 1 also includes a dielectric layer 16 disposed between the second conductive layer 14 and the first hydrophobic layer 15. The dielectric layer 16 is used to promote the accumulation of charge and increase the electric field strength, so as to ensure that the microfluidic chip 100 can easily drive the droplet 3 without causing breakdown.

[0074] Depending on the material, different methods such as vapor deposition (Pyrelin, silicon nitride, amorphous fluoropolymer, thermal growth (silicon dioxide), spin coating (polydimethylsiloxane, photoresist) can be selected to form the dielectric layer 16.

[0075] Optionally, the dielectric layer 16 may be a PI film with a dielectric constant of 3.2.

[0076] In some embodiments, see Figure 1 The first hydrophobic layer 15 and the second hydrophobic layer 23 are in direct contact with the droplet 3. The first hydrophobic layer 15 and the second hydrophobic layer 23 are generally fluoropolymers (polytetrafluoroethylene) used to reduce the surface energy when the droplet 3 is driven.

[0077] In some embodiments, the first substrate 11 and the second substrate 21 may be made of chemically inert glass or printed circuit boards.

[0078] In some embodiments, see Figure 1 The first substrate 1 also includes a ground electrode 10.

[0079] The grounding electrode 10 is grounded so that static electricity in the first substrate 1 can be conducted away to avoid electrostatic breakdown and affect the service life of the first substrate 1.

[0080] Optionally, the grounding electrode 10 consists of a 1mm × 1mm square electrode, the size and number of which can be adjusted as needed.

[0081] In some embodiments, the first substrate 1 further includes a plurality of bonding electrodes P (see...) Figure 24 At least one drive electrode Q can be electrically connected to a bonding electrode P via a signal line L.

[0082] The bonding electrode P is configured to be bonded to the driving power supply, so that the voltage in the driving power supply can be transmitted through the bonding electrode P to at least one driving electrode Q electrically connected to the bonding electrode P, thereby realizing the control of the droplet located between the driving electrode Q and the common electrode layer 22.

[0083] For example, multiple bonding electrodes P can be disposed on the second conductive layer 14, and the first hydrophobic layer 15 and dielectric layer 16 corresponding to the locations of the multiple bonding electrodes P are hollowed out to expose the bonding electrodes P so that the bonding electrodes P can be bonded to the driving power supply.

[0084] Due to their significant cost advantages, passive digital microfluidic chips are currently the mainstream chip solution among commercially available microfluidic chip products. In high-throughput digital microfluidic chips, the reliability and stability of sample transport are crucial to the chip's ability to achieve the target biochemical process. This is especially true in highly integrated, high-performance, and complex biological or chemical micro-total analysis systems, where precise control of droplets is required, thus demanding even higher standards for the reliability and stability of droplet transport.

[0085] However, as can be seen from the foregoing embodiments, the first substrate 1 of the microfluidic chip 100 is formed by stacking multiple layers such as metal layers (e.g., the first conductive layer 12 and the second conductive layer 14) and insulating layer 13, which has a relatively fine structure. Afterwards, it is necessary to complete the bonding of the dielectric layer 16 at different work stations and complete the cell assembly of the first substrate 1 and the second substrate 2. There are many processes. During this process, short circuits or open circuit failures can easily occur between the driving electrodes Q of the microfluidic chip 100 due to static electricity or pressure. This will not only reduce the product yield of the microfluidic chip 100 at the customer end, but also significantly reduce the reliability of the microfluidic chip 100 at the application end, thereby limiting the further development of the microfluidic chip 100.

[0086] To address the aforementioned technical problems, this disclosure provides a detection system 1000 for a microfluidic chip 100, which can screen out microfluidic chips 100 that have experienced short circuits or open circuit failures, thereby improving product yield.

[0087] like Figure 2 As shown, the detection system 1000 includes a detection device 200 and an industrial control computer 300.

[0088] The industrial computer 300 is electrically connected to the circuit board 202 in the detection device 200.

[0089] For example, the circuit board 202 is provided with an industrial computer interface, and the industrial computer 300 is electrically connected to the circuit board 202 through the industrial computer interface.

[0090] For example, the industrial computer 300 is electrically connected to the circuit board 202 via DuPont wires, thereby enabling the industrial computer 300 to receive power and transmit data.

[0091] For example, the industrial computer 300 is configured to start or stop the entire testing program. For instance, after power-on, a testing button is displayed on the industrial computer 300. After clicking the testing button, the testing device 200 begins to test the microfluidic chip 100.

[0092] For example, the industrial computer 300 is also configured to record the detection results of the detection device 200 (e.g., short circuit, open circuit, or no fault), and display the location corresponding to the faulty electrode in the microfluidic chip 100 based on the detection results.

[0093] For example, after clicking the detection button, the detection device 200 sequentially numbers the electrodes to be detected in the microfluidic chip 100. For example, when there are n electrodes to be detected, the numbers are 1, 2, 3...n-1 and n.

[0094] After the detection device 200 completes the detection, the industrial control computer 300 displays the detection results and the corresponding number of the tested electrode that has a fault (short circuit or open circuit), thereby determining the location of the faulty tested electrode. For example, when the industrial control computer 300 displays the detection result as "short circuit exists", it also displays the corresponding short-circuited electrode number, such as "2 to 5 short circuit, 10 to 111 short circuit"; when there is no short circuit or open circuit fault, the industrial control computer 300 displays "no fault" or "all channels OK".

[0095] It should be noted that the aforementioned "electrode to be tested" may include at least one of the driving electrode Q, the bonding electrode P, or the ground electrode 10. For example, to detect whether there is a short circuit between the circuit where one bonding electrode P is located and the circuit where another bonding electrode P is located, the two bonding electrodes P can be used as electrodes to be tested for short circuit detection.

[0096] For example, the industrial computer 300 can be a box-type industrial control computer, a rack-mounted industrial control computer, or a panel-type industrial control computer, etc.

[0097] For example, the industrial computer 300 has a display screen that can display information such as test results. For example, the display screen can be a touch screen.

[0098] In some embodiments, such as Figure 2 As shown, the detection system 1000 also includes a power supply 400. The power supply 400 is configured to provide power signals to the detection device 200 and the industrial control computer 300, thereby driving the operation of the detection system 1000.

[0099] For example, the power supply 400 is electrically connected to the circuit board 202 in the detection device 200.

[0100] For example, a power socket is provided on the circuit board 202, and the power supply 400 is electrically connected to the circuit board 202 through the power socket.

[0101] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, the aforementioned detection device 200 includes a crimping device 201, a circuit board 202, and a processor 203.

[0102] The crimping device 201 is configured to fix the microfluidic chip 100 during the detection process, so as to prevent the microfluidic chip 100 from becoming loose in the detection device 200 and causing large errors in the detection results.

[0103] In order to fix the microfluidic chip 100 during the detection process, this disclosure provides a crimping device 201 for the microfluidic chip 100.

[0104] like Figure 4 As shown, the crimping device 201 includes a cover plate 211, a base plate 212, and a probe assembly 213.

[0105] The base plate 212 and the cover plate 211 are arranged in a box. During the testing process, the microfluidic chip 100 is fixed between the base plate 212 and the cover plate 211.

[0106] For example, only the first substrate 1 of the microfluidic chip 100 can be placed in the crimping device 201 for testing. For instance, only the first substrate 1 having a first substrate 11, a first conductive layer 12, an insulating layer 13, and a second conductive layer 14 can be placed in the crimping device 201 for testing; or, only the first substrate 1 having a first substrate 11, a first conductive layer 12, an insulating layer 13, a second conductive layer 14, a first hydrophobic layer 15, and a dielectric layer 16 can be placed in the crimping device 201 for testing. This allows for screening to determine whether the first substrate 1 experiences short circuits or open circuits after each fabrication process, thereby improving product yield.

[0107] Alternatively, the microfluidic chip 100 after the first substrate 1 and the second substrate 2 are assembled can be placed in the crimping device 201 for testing, thereby screening the finished microfluidic chip 100 and preventing inferior products with short circuit or open circuit failures from entering the customer's market.

[0108] For example, after the microfluidic chip 100 is fixed to the crimping device 201, the second conductive layer 14 of the first substrate 1 is closer to the base plate 212 of the crimping device 201 relative to the first substrate 11, so as to achieve the connection between the electrode to be detected on the second conductive layer 14 and the probe assembly 213 in the base plate 212 (see Figure 7 The connection of ).

[0109] See Figure 5 The base plate 212 is provided with a receiving groove U. The opening U1 of the receiving groove U faces the cover plate 211, and the bottom U2 of the receiving groove U is provided with an opening K.

[0110] The receiving groove U is configured to provide a placement space for the microfluidic chip 100. That is, during the detection process, the microfluidic chip 100 is placed within the receiving groove U.

[0111] For example, the dimensions of the receiving groove U, such as its length and width, are matched with the length and width of the microfluidic chip 100, so that the microfluidic chip 100 can be embedded in the receiving groove U. This allows the receiving groove U to restrict the movement of the microfluidic chip 100, preventing the microfluidic chip 100 from being displaced in a direction parallel to the surface of the groove bottom U2 during subsequent detection, which would lead to larger errors in the detection results.

[0112] For example, the bottom U2 of the tank can have multiple openings K, which are sequentially arranged along the tank wall U3. Alternatively, for example, see [reference needed]. Figure 5 The opening K at the bottom of the groove U2 can be one.

[0113] It should be noted that the aforementioned opening K is configured to allow the probe in the probe assembly 213 to penetrate the base plate 212. This embodiment does not limit the specific structure of the opening K.

[0114] For example, see Figure 6 The aforementioned cover plate 211 includes a first window C1. The first window C1 is configured to expose the microfluidic chip 100 disposed in the receiving groove U of the base plate 212 after the cover plate 211 and the base plate 212 are assembled, so as to observe the pressing state of the microfluidic chip 100, avoid the pressing position of the microfluidic chip 100 from shifting, and improve the accuracy of the detection results of the microfluidic chip 100.

[0115] See Figure 7 The aforementioned probe assembly 213 includes multiple probes J1.

[0116] Multiple probes J1 are configured to contact the microfluidic chip 100 at one end near the cover plate 211, and the other end of the multiple probes J1 away from the cover plate 211 passes through the opening K.

[0117] For example, one end of the plurality of probes J1 near the cover plate 211 is configured to contact the electrode to be detected in the microfluidic chip 100. For example, the plurality of probes J1 make one-to-one electrical contact with the plurality of bonded electrodes P of the microfluidic chip 100.

[0118] For example, one end of each probe J1, away from the cover plate 211, passes through the opening K and contacts the circuit board 202. During the detection process, the microfluidic chip 100 is placed at the bottom U2 of the receiving groove U and contacts the probes J1, and is finally electrically connected to the circuit board 202 through the probes J1, thereby enabling the circuit board 202 to detect the microfluidic chip 100, for example, to detect short circuits or open circuits between the electrodes to be tested in the microfluidic chip 100.

[0119] For example, the probe J1 is elastic along its length. After the microfluidic chip 100 is placed in the receiving groove U and comes into contact with the probe J1, the elasticity of the probe J1 and the pressing action of the cover plate 211 ensure that the microfluidic chip 100 is firmly fixed in the pressing device 201. This ensures sufficient contact between the electrode to be detected in the microfluidic chip 100 and the probe J1, avoiding the problem of reduced accuracy of the detection results due to loosening of the microfluidic chip 100.

[0120] For example, the length of probe J1 can be 6mm to 10mm. For example, it can be 6mm, 6.5mm, 7mm, 8.425mm or 10mm.

[0121] For example, the elastic deformation range of probe J1 can be 1mm to 2mm. For instance, the compressive or tensile deformation of probe J1 can be 1mm to 2mm. For example, it can be 1mm, 1.25mm, 1.5mm, 1.725mm, or 2mm.

[0122] For example, such as Figure 8 As shown, probe J1 includes a conductive shaft J11, an elastic structure J12, and a sleeve J13.

[0123] In this embodiment, at least a portion of the conductive shaft J11 and the elastic structure J12 are both disposed inside the sleeve J13. One end of the elastic structure J12 is fixedly connected to the sleeve J13, and the other end is fixedly connected to the conductive shaft J11. With the extension and retraction of the elastic structure J12, the conductive shaft J11 can be moved within the sleeve J13 along the axial direction of the sleeve J13.

[0124] The end of the conductive shaft J11 furthest from the sleeve J13 is configured to contact the microfluidic chip 100, and the end of the sleeve J13 furthest from the conductive shaft J11 is configured to pass through the opening K and contact the circuit board 202. The elastic structure J12 is configured to provide elasticity to the probe J1, thereby enhancing the firmness of the contact between the probe J1 and the microfluidic chip 100.

[0125] For example, the conductive shaft J11, the elastic structure J12, and the sleeve J13 are all made of conductive materials, such as metals or alloys.

[0126] For example, the elastic structure J12 can be a spring.

[0127] For example, the elastic deformation range of the aforementioned elastic structure J12 can be 1mm to 2mm. For instance, the compressive or tensile deformation of the elastic structure J12 can be 1mm to 2mm. For example, it can be 1mm, 1.25mm, 1.5mm, 1.725mm, or 2mm.

[0128] See Figure 9 The probe assembly 213 is fixedly connected to the bottom U2 of the receiving groove U.

[0129] For example, such as Figure 9 As shown, the probe assembly 213 is positioned corresponding to the opening K so that the probe J1 in the probe assembly 213 can pass through the opening K.

[0130] For example, such as Figure 5 As shown, the bottom U2 of the receiving groove U includes a plurality of receiving parts U21, which are spaced apart along the groove wall U3 of the receiving groove U, and at least one of the receiving parts U21 protrudes relative to the groove wall U3.

[0131] like Figure 9 As shown, the probe assembly 213 is disposed between two adjacent receiving parts U21, and both ends of the probe assembly 213 are fixedly connected to the two adjacent receiving parts U21 respectively. For example, both ends of the probe assembly 213 are fixedly connected to the two adjacent receiving parts U21 respectively by a bolt structure.

[0132] By providing the receiving part U21, the probe assembly 213 can be fixed on the base plate 212 while providing a placement space for the microfluidic chip 100.

[0133] For example, such as Figure 7 As shown, the probe assembly 213 also includes a needle mold J2, which is fixedly connected to the bottom U2 of the receiving groove U. For example, the two ends of the needle mold J2 are fixedly connected to two adjacent receiving parts U21 respectively.

[0134] See Figure 7 The needle mold J2 is provided with multiple mounting holes J3. A probe J1 passes through a mounting hole J3 and is fixed inside the mounting hole J3.

[0135] For example, the axial direction of the mounting hole J3 is approximately the same as the opening direction of the opening K, so that the probe J1 can be fixed in the mounting hole J3 while passing through the opening K to contact the circuit board 202.

[0136] For example, when the probe J1 includes a sleeve J13, the sleeve J13 is fixed to the needle mold J2.

[0137] For example, the outer wall of the sleeve J13 is provided with a snap-fit ​​part, and the wall of the mounting hole J3 is provided with an annular groove that matches the snap-fit ​​part. The sleeve J13 can be rotated into the mounting hole J3 and snapped in place by the snap-fit ​​part and the annular groove, thereby fixing the probe J1 onto the needle mold J2.

[0138] For example, one end of the sleeve J13 away from the conductive shaft J11 is mounted in the mounting hole J3, and at least a portion of the sleeve J13 protrudes through the mounting hole J3, so that the sleeve J13 can make electrical contact with the circuit board 202 to achieve signal transmission.

[0139] In the crimping device 201 provided in some embodiments of this disclosure, a cover plate 211 and a bottom plate 212 of the box structure are provided to provide a placement space for the microfluidic chip 100, and the microfluidic chip 100 is fixed by the box structure to avoid displacement of the microfluidic chip 100 during the detection process, which would lead to a decrease in the accuracy of the detection results.

[0140] Furthermore, by setting an opening K at the bottom U2 of the receiving groove U in the base plate 212 and setting a probe assembly 213, and fixing the probe assembly 213 in the opening K, the probe J1 can make electrical contact with the circuit driving element (e.g., circuit board 202) outside the crimping device 201 through the opening K. Thus, after the microfluidic chip 100 is placed in the receiving groove U of the crimping device 201 and makes contact with the probe J1, the microfluidic chip 100 can be connected to the circuit driving element outside the crimping device 201, thereby realizing the fault detection of the microfluidic chip 100.

[0141] The crimping device 201 provided in this embodiment has a simple structure and is easy to operate. It can effectively improve the efficiency of detection and screening of microfluidic chips 100 and improve the yield of microfluidic chip 100 products.

[0142] In the aforementioned embodiment, when the microfluidic chip 100 is placed in the pressing device 201, the second substrate 2 in the microfluidic chip 100 is positioned closer to the base plate 212 than the first substrate 1, thereby making the bonding electrode P in the first substrate 1 closer to the probe assembly 213 in the pressing device 201 than the first substrate 11, which facilitates the contact between the probe assembly 213 and the electrode to be detected in the microfluidic chip 100.

[0143] Optionally, the first substrate 1 of the microfluidic chip 100 can be placed in the crimping device 201 for testing. In this case, the second conductive layer 14 with the bonding electrode P in the first substrate 1 is disposed closer to the base plate 212 than the first substrate 11, so that the bonding electrode P in the first substrate 1 contacts the probe J1 in the probe assembly 213, thereby realizing the detection of the electrode to be tested in the first substrate 1.

[0144] In some embodiments, such as Figure 9 As shown, the aforementioned crimping device 201 includes a plurality of probe assemblies 213.

[0145] At least one of the plurality of probe assemblies 213 is a bonding probe assembly 213A. The ends of the plurality of probes J1 in the bonding probe assembly 213A near the cover plate 211 are configured to contact the bonding electrode P of the microfluidic chip 100 in order to enable fault detection of the circuit corresponding to the bonding electrode P in the microfluidic chip 100.

[0146] The bonding probe assembly 213A is positioned close to the wall U3 of the receiving groove U. The bonding electrode P in the microfluidic chip 100 is usually located in the peripheral area of ​​the microfluidic chip 100. By positioning the bonding probe assembly 213A close to the wall U3 of the receiving groove U, it is easier to achieve electrical contact between the bonding probe assembly 213A and the bonding electrode P.

[0147] For example, after the first substrate 1 is fabricated, for example after the first hydrophobic layer 15 is covered, or after the first substrate 1 and the second substrate 2 are assembled, the driving electrode Q is covered by the first hydrophobic layer 15 and other film layers, and only the bonding electrode P is exposed. By setting the bonding probe assembly 213A, the probe J1 in the bonding probe assembly 213A is brought into contact with the exposed bonding electrode P, and the short circuit detection between different lines where different bonding electrodes P are located is realized by detecting the conduction status between different bonding electrodes P.

[0148] For example, the first substrate 1 includes two bonding electrodes P, which respectively form two lines (see...). Figure 24 As shown in the circuit L', the two bonding electrodes P are electrically connected to different driving electrodes Q to enable independent control of the different driving electrodes Q. By detecting the two bonding electrodes P, for example, by detecting whether there is a short circuit between the two bonding electrodes P, it is possible to detect whether there is a short circuit between the two circuits corresponding to the two bonding electrodes P. If there is a short circuit, the different driving electrodes Q electrically connected to the two bonding electrodes P cannot be independently controlled, and the microfluidic chip 100 malfunctions.

[0149] The crimping device 201 provided in this embodiment of the present disclosure can detect faults in multiple lines (the lines formed by the electrical connection between the driving electrode Q and the binding electrode P) in the microfluidic chip 100 by reusing the binding electrode P of the microfluidic chip 100 as a detection electrode without changing the structure of the microfluidic chip 100.

[0150] In some embodiments, such as Figure 10 As shown, at least one of the plurality of probe assemblies 213 is a drive probe assembly 213B. The ends of the plurality of probes J1 in the drive probe assembly 213B near the cover plate 211 are configured to contact the drive electrode Q of the microfluidic chip 100 in order to realize fault detection of the circuit corresponding to the drive electrode Q in the microfluidic chip 100.

[0151] Relative to the bonding probe assembly 213A, the driving probe assembly 213B is positioned away from the groove wall U3 of the receiving groove U. The driving electrode Q in the microfluidic chip 100 is typically located in the middle portion of the microfluidic chip 100, and the bonding electrode P is at least partially positioned around the driving electrode Q. By positioning the driving probe assembly 213B away from the groove wall U3 of the receiving groove U, electrical contact between the driving probe assembly 213B and the driving electrode Q is facilitated.

[0152] For example, before the first substrate 1 is covered with the first hydrophobic layer 15, for instance, when the first substrate 1 only includes the first substrate 11, the first conductive layer 12, the insulating layer 13, and the second conductive layer 14, both the driving electrode Q and the bonding electrode P located in the second conductive layer 14 are exposed. By providing the bonding probe assembly 213A and the driving probe assembly 213B, the bonding probe assembly 213A can contact the bonding electrode P, and the driving probe assembly 213B can contact the driving electrode Q, thereby enabling the detection of the continuity between any two electrodes (including the bonding electrode P and the driving electrode Q).

[0153] For example, the first substrate 1 includes a bonding electrode P, which is electrically connected to four driving electrodes Q to form a circuit (see [reference]). Figure 24 and Figure 25 The circuit L' shown can be tested for continuity between the bonding electrode P and the driving electrode Q located at the end of the circuit. If the test result shows an open circuit, it indicates that the circuit is open, and the bonding electrode P cannot successfully drive the driving electrode Q it is electrically connected to. Alternatively, the continuity between two electrically connected driving electrodes Q can be tested to determine the specific location of the open circuit or short circuit fault, which is helpful for subsequent fault troubleshooting.

[0154] The crimping device 201 provided in this embodiment of the present disclosure, by setting a binding probe assembly 213A and a driving probe assembly 213B, can not only detect short circuits between lines corresponding to different binding electrodes P by detecting different binding electrodes P, but also detect open circuits between the binding electrode P and the driving electrode Q electrically connected to the binding electrode P by detecting the binding electrode P and the driving electrode Q electrically connected to the binding electrode P.

[0155] In some embodiments, such as Figure 10 As shown, at least one of the plurality of probe components 213 is a detection probe component 213C.

[0156] For example, some microfluidic chips 100 also include a plurality of detection electrodes Z disposed in the first substrate 1 (see...). Figure 27 The end of the line containing a binding electrode P, away from the binding electrode P, is electrically connected to the detection electrode Z. That is, in a line, a binding electrode P, at least one driving electrode Q, and a detection electrode Z are electrically connected in sequence.

[0157] The detection electrode Z is also located on the second conductive layer 14, and at the location of the detection electrode Z, the first hydrophobic layer 15 and the dielectric layer 16 are hollowed out to expose the detection electrode Z.

[0158] In embodiments where the microfluidic chip 100 does not have a detection electrode Z, after the first substrate 1 is fabricated, for example after covering it with the first hydrophobic layer 15, or after the first substrate 1 and the second substrate 2 are aligned, the driving electrode Q is covered by a film layer such as the first hydrophobic layer 15, and only the bonding electrode P is exposed, i.e., one line (see...). Figure 25 In the circuit L', only one electrode can be detected. In this case, only short circuit detection between different circuits can be achieved.

[0159] In the embodiment where the microfluidic chip 100 has a detection electrode Z, both the binding electrode P and the detection electrode Z are exposed, i.e., a single line (see...). Figure 27 In the line L', two electrodes (a binding electrode P and a detection electrode Z) located at both ends of the line can be detected. In this case, not only short circuit detection between different lines can be realized, but also open circuit detection of the same line can be realized.

[0160] The probes J1 in the detection probe assembly 213C are configured to contact the detection electrode Z of the microfluidic chip 100 at one end near the cover plate 211, so as to realize fault detection of the circuit corresponding to the detection electrode Z in the microfluidic chip 100.

[0161] Relative to the drive probe assembly 213B, the detection probe assembly 213C is positioned close to the groove wall U3 of the receiving groove U. The drive electrode Q in the microfluidic chip 100 is typically located in the middle portion of the microfluidic chip 100, and the bonding electrode P and the detection electrode Z are positioned at least partially around the drive electrode Q. By positioning the detection probe assembly 213C close to the groove wall U3 of the receiving groove U, electrical contact between the detection probe assembly 213C and the detection electrode Z is facilitated.

[0162] It should be noted that the shape and size of the bonding electrode P and the detection electrode Z can be roughly the same, and the positions of the bonding electrode P and the detection electrode Z can be interchanged. Correspondingly, the positions of the bonding probe assembly 213A and the detection probe assembly 213C can also be interchanged.

[0163] The crimping device 201 provided in this embodiment of the present disclosure, by setting a bonding probe assembly 213A and a detection probe assembly 213C, after the first substrate 1 is prepared, for example after covering it with the first hydrophobic layer 15, or after the first substrate 1 and the second substrate 2 are assembled, can not only detect short circuits between lines corresponding to different bonding electrodes P by detecting different bonding electrodes P, but also detect open circuits between the bonding electrode P and the detection electrode Z electrically connected to the bonding electrode P and the detection electrode Z.

[0164] In some embodiments, such as Figure 11 As shown, the bottom U2 of the receiving groove U is also provided with a first through hole Ho1. The crimping device 201 also includes a grounding probe J5.

[0165] See Figure 11 The aforementioned grounding probe J5 is fixedly connected to the bottom U2 of the receiving groove U. For example, when the grounding probe J5 includes a sleeve J13, it is fixedly connected to the bottom U2 of the receiving groove U through the sleeve J13.

[0166] See Figure 11 The end of the grounding probe J5 near the cover plate 211 is configured to contact the microfluidic chip 100, for example, to make electrical contact with the grounding electrode 10 in the microfluidic chip 100, so as to realize fault detection of the circuit corresponding to the grounding electrode 10 in the microfluidic chip 100.

[0167] See Figure 11The end of the grounding probe J5 away from the cover plate 211 passes through the first through hole Ho1. Exemplarily, the end of the grounding probe J5 away from the cover plate 211 makes electrical contact with the circuit board 202 after passing through the first through hole Ho1.

[0168] By setting a grounding probe J5, with one end of the grounding probe J5 in contact with the microfluidic chip 100 and the other end in contact with an electronic component (such as a circuit board 202) outside the crimping device 201, the circuit corresponding to the grounding electrode 10 in the microfluidic chip 100 can be detected.

[0169] In some embodiments, the plurality of probes J1 and ground probe J5 are telescopic in their length extension direction. That is, both probes J1 and ground probe J5 are elastic, and the elastic force can enhance the contact between probes J1 and ground probe J5 and their respective corresponding electrodes to be tested, thereby ensuring the detection effect.

[0170] The elastic deformation range of the grounding probe J5 is greater than the elastic deformation range of at least one of the multiple probes J1.

[0171] For example, the elastic deformation range of the grounding probe J5 differs from that of at least one of the plurality of probes J1 by 1 mm to 3 mm. For instance, the elastic deformation range of probe J1 may be 1 mm to 2 mm, and the elastic deformation range of grounding probe J5 may be 2 mm to 5 mm.

[0172] For example, the minimum compressed length of the grounding probe J5 is less than the minimum compressed length of at least one of the plurality of probes J1. For instance, if the minimum compressed length of probe J1 is 6 mm, the minimum compressed length of grounding probe J5 can be 3 mm.

[0173] For example, the grounding probe J5 and probe J1 are approximately the same length when no force is applied.

[0174] For example, the microfluidic chip 100 also includes conductive foam disposed between the first substrate 1 and the second substrate 2, and the ground electrode 10 located in the first substrate 1 is electrically connected to the common electrode layer 22 in the second substrate 2 through the conductive foam.

[0175] When the microfluidic chip 100 is completely placed in the crimping device 201 for testing, the end of the grounding probe J5 near the cover plate 211 contacts the conductive foam in the microfluidic chip 100, and electrical conduction between the grounding probe J5 and the grounding electrode 10 is achieved through the conductive foam. In this case, compared with the contact between probe J1 and the driving electrode Q, there is a thickness of conductive foam between the grounding probe J5 and the grounding electrode 10, that is, the grounding probe J5 has a greater degree of compression than probe J1. By setting the elastic deformation range of the grounding probe J5 to be greater than the elastic deformation range of at least one of the multiple probes J1, the grounding probe J5 can be effectively made suitable for both the case where the microfluidic chip 100 is completely placed in the crimping device 201 and the case where only the first substrate 1 of the microfluidic chip 100 is placed in the crimping device 201.

[0176] In some embodiments, such as Figure 3 and Figure 4 As shown, the aforementioned crimping device 201 also includes a pressing structure 214. The pressing structure 214 is configured to enhance the pressing force of the cover plate 211 on the microfluidic chip 100 placed in the receiving groove U, thereby ensuring that the microfluidic chip 100 is firmly placed and preventing it from becoming loose, which would reduce the accuracy of the detection results.

[0177] See Figure 4 and Figure 12 The pressing structure 214 is disposed on the side of the cover plate 211 facing the bottom plate 212, and the pressing structure 214 is elastic. Exemplarily, the pressing structure 214 can extend and retract along the thickness direction of the cover plate 211.

[0178] For example, the pressing structure 214 can be a resilient gasket.

[0179] For example, such as Figure 12 As shown, the pressing structure 214 includes a pressing plate 214A and an elastic element 214B. The elastic element 214B is located between the pressing plate 214A and the cover plate 211, with one end connected to the pressing plate 214A and the other end connected to the cover plate 211. The elastic element 214B can be, for example, a spring.

[0180] By making the pressing structure 214 elastic, the dimension of the space formed between the base plate 212 and the cover plate 211 for placing the microfluidic chip 100 in the thickness direction can be changed according to the elastic deformation of the pressing structure 214, thereby making the pressing device 201 suitable for microfluidic chips 100 of different thicknesses. On the other hand, the elasticity of the pressing structure 214 allows it to provide pressure on the microfluidic chip 100 towards the base plate 212 after the microfluidic chip 100 is placed on the base plate 212, thereby further strengthening the contact between the microfluidic chip 100 and the probe J1 in the probe assembly 213, preventing the microfluidic chip 100 from loosening during the detection process, and improving the detection accuracy of the detection device 200.

[0181] See Figure 13 When the cover plate 211 and the base plate 212 are engaged, the orthographic projection of the pressing structure 214 on the reference plane N at least partially coincides with the orthographic projection of the probe assembly 213 on the reference plane N. The reference plane N is the plane containing the surface of the bottom U2 of the receiving groove U near the cover plate 211.

[0182] For example, such as Figure 12 As shown, in an embodiment where the pressing structure 214 includes a pressing plate 214A and an elastic member 214B, when the cover plate 211 and the base plate 212 are fastened together, the orthographic projection of the pressing plate 214A on the reference plane N at least partially coincides with the orthographic projection of the probe assembly 213 on the reference plane N.

[0183] The pressure structure 214 and the probe assembly 213 are configured to have at least partial overlap on the reference plane N. That is, the pressure structure 214 provides pressure at the position of the corresponding probe assembly 213 in the microfluidic chip 100, which can ensure that the electrode to be detected in the microfluidic chip 100 is in firm contact with the probe J1 in the probe assembly 213, avoid the microfluidic chip 100 from loosening during the detection process, and improve the detection accuracy of the detection device 200.

[0184] For example, the press plate 214A may be parallel to the reference plane N.

[0185] For example, the elastic extension direction of the elastic element 214B can be perpendicular to the reference surface N, thereby providing pressure perpendicular to the reference surface N to the microfluidic chip 100, ensuring that the electrode to be detected in the microfluidic chip 100 is in firm contact with the probe J1 in the probe assembly 213, and improving the detection accuracy of the detection device 200.

[0186] In some embodiments, such as Figure 14 As shown, the crimping device 201 also includes a hinge structure M.

[0187] See Figure 14The hinge structure M includes a first hinge M1 and a second hinge M2 that are movably connected. The first hinge M1 is fixedly connected to the cover plate 211, and the second hinge M2 is fixedly connected to the base plate 212. The cover plate 211 and the base plate 212 of the pressing device 201 can be used to set the box together via the hinge structure M.

[0188] For example, the cover plate 211 and the base plate 212 of the crimping device 201 can also be configured to fit the box via a hinge structure.

[0189] For example, the first hinge M1 is set as follows Figure 6 The hinge mounting point M1' of the cover plate 211 shown is provided, and the second hinge M2 is located at, as shown in the figure. Figure 5 The hinge mounting point M2' of the base plate 212 shown.

[0190] In some embodiments, the crimping device 201 further includes a snap-fit ​​structure H.

[0191] The snap-fit ​​structure H includes a snap-fit ​​H1 and a snap-fit ​​groove H2. The snap-fit ​​H1 is fixedly connected to one of the cover plate 211 and the base plate 212, and the snap-fit ​​groove H2 is located on the other of the cover plate 211 and the base plate 212. The snap-fit ​​H1 can snap into the snap-fit ​​groove H2. The cover plate 211 and the base plate 212 of the crimping device 201 can be aligned with the box through the snap-fit ​​structure H.

[0192] For example, the latch H1 is set as follows Figure 5 The cover plate 211 shown has a snap-fit ​​mounting point H1', ​​and the slot H2 is set as shown in the figure. Figure 6 In the base plate 212 shown.

[0193] In some embodiments, the crimping device 201 includes a hinge structure M and a snap-fit ​​structure H. See also Figure 5 and Figure 6 It can be seen that the hinge structure M and the snap-fit ​​structure H are respectively located on opposite sides of the cover plate 211 and the bottom plate 212.

[0194] By setting the hinge structure M and the snap-fit ​​structure H, and setting the hinge structure M and the snap-fit ​​structure H to be respectively located on opposite sides of the cover plate 211 and the bottom plate 212, the cover plate 211 and the bottom plate 212 of the pressing device 201 can be firmly attached to the box, thereby ensuring that the microfluidic chip 100 is firmly fixed in the receiving groove U, further preventing the microfluidic chip 100 from loosening during the detection process, and improving the detection accuracy of the detection device 200.

[0195] The circuit board 202 in the aforementioned detection device 200 is configured to cooperate with the aforementioned crimping device 201 to realize voltage detection of the microfluidic chip 100 fixed by the crimping device 201.

[0196] In order to enable the detection of the microfluidic chip 100, this disclosure also provides a circuit board 202.

[0197] See Figure 4 The circuit board 202 is located on the side of the base plate 212 of the crimping device 201 away from the cover plate 211.

[0198] See Figure 15 The circuit board 202 includes a substrate 202A and a plurality of pads T disposed on the substrate 202A. One pad T contacts a probe J1 of the crimping device 201. Through the pads T, the detection signal in the circuit board 202 is transmitted to the microfluidic chip 100 fixed in the crimping device 201 to realize the detection of the microfluidic chip 100.

[0199] For example, such as Figure 15 As shown, the plurality of pads T include a pin pad T1. The pin pad T1 is configured to contact the probe J1 of the bonding probe assembly 213A in the crimping device 201, thereby electrically connecting the circuit board 202 to the bonding electrode P in the microfluidic chip 100, enabling fault detection (e.g., short circuit detection or open circuit detection) of the circuit corresponding to the bonding electrode P in the microfluidic chip 100.

[0200] For example, such as Figure 15 As shown, the plurality of pads T may also include a drive pad T2. The drive pad T2 is configured to contact the probe J1 of the drive probe assembly 213B in the crimping device 201, thereby electrically connecting the circuit board 202 to the drive electrode Q in the microfluidic chip 100, realizing fault detection (e.g., open circuit detection) of the circuit corresponding to the drive electrode Q in the microfluidic chip 100.

[0201] For example, such as Figure 15 As shown, the plurality of pads T may also include a detection pad T4. The detection pad T4 is configured to contact the probe J1 of the detection probe assembly 213C in the crimping device 201, thereby making the circuit board 202 electrically connected to the detection electrode Z in the microfluidic chip 100, realizing fault detection (e.g., open circuit detection) of the circuit corresponding to the detection electrode Z in the microfluidic chip 100.

[0202] For example, corresponding to the electrodes in the microfluidic chip 100, among the plurality of pads T in the circuit board 202, the drive pad T2 is located in the middle region of the circuit board 202, and the pin pad T1 and / or the detection pad T4 are at least partially arranged around the drive pad T2. For example, see Figure 15 Multiple pin pads T1 and / or multiple detection pads T4 are located on both sides of multiple drive pads T2.

[0203] It should be noted that the multiple pads T in the circuit board 202 may include only the pin pad T1, or may include both the detection pad T4 and the pin pad T1. The positions of the detection pad T4 and the pin pad T1 correspond to the positions of the detection electrode Z and the bonding electrode P in the microfluidic chip 100, respectively. The positions of the detection pad T4 and the pin pad T1 can be interchanged. Figure 15 This is for illustrative purposes only and does not constitute a limitation.

[0204] In some embodiments, such as Figure 15 As shown, when the crimping device 201 includes a ground probe J5, the circuit board 202 also includes a ground pad T3, which contacts the ground probe J5. This allows the circuit board 202 to be electrically connected to the ground electrode 10 in the microfluidic chip 100, enabling fault detection of the circuit corresponding to the ground electrode 10 in the microfluidic chip 100.

[0205] In some embodiments, such as Figure 16 As shown, the circuit board 202 also includes a resistor R, which is connected in parallel with the aforementioned processor 203. The resistor R is configured to adjust the overall resistance of the detection device 200, thereby enabling the detection device 200 to be used for the detection of microfluidic chips 100 with different resistance values.

[0206] For example, the resistance value of resistor R is less than or equal to the resistance value of processor 203. By setting resistor R in parallel with the aforementioned processor 203, and the resistance value of resistor R is less than or equal to the resistance value of processor 203, the voltage division of detection device 200 depends on resistor R with smaller resistance value, thereby realizing the adjustment effect of resistor R on the overall resistance value and voltage division of detection device 200.

[0207] For example, the resistance value of resistor R can be greater than or equal to 33.3 kΩ, and the resistance value of processor can be 40 kΩ.

[0208] In some embodiments, such as Figure 16 As shown, circuit board 202 also includes an industrial computer interface V1. The industrial computer interface V1 is configured to be electrically connected to the industrial computer 300 in the detection system 1000.

[0209] In some embodiments, such as Figure 16 As shown, circuit board 202 also includes a power interface V2. The power interface V2 is configured to be electrically connected to the power supply 400 in the detection system 1000, thereby providing power to the detection device 200 and the industrial computer 300.

[0210] In some embodiments, the circuit board 202 further includes a detection circuit, which has multiple detection signal lines. The aforementioned components such as the pad T, processor 203, and resistor R are electrically connected through the multiple detection signal lines to enable the operation of the detection system 1000.

[0211] The processor 203 in the aforementioned detection device 200 is configured to cooperate with the aforementioned crimping device 201 and circuit board 202 to detect the microfluidic chip 100 fixed by the crimping device 201.

[0212] In order to enable the detection of the microfluidic chip 100, this disclosure also provides a processor 203.

[0213] In some embodiments, such as Figure 16 As shown, the processor 203 is mounted on the circuit board 202 and is electrically connected to multiple pads T.

[0214] For example, multiple pads T are provided on the side of the substrate 202A near the base plate 212, and the processor 203 is provided on the side of the substrate 202A away from the base plate 212. This facilitates contact between the pads of the circuit board 202 and the probe J1 in the crimping device 201.

[0215] The processor 203 is configured to transmit a detection signal to a probe J1 that is in contact with the pad T via the pad T, and to receive a feedback signal from the probe J1 and process the feedback signal.

[0216] Based on the detection system 1000 described above, some embodiments of this disclosure also provide a detection method for a microfluidic chip 100, which uses a detection device 200 as described in any of the foregoing embodiments to detect the microfluidic chip 100.

[0217] like Figure 17 As shown, the detection method includes: S1: Place the microfluidic chip 100 in the receiving groove U of the base plate 212 of the detection device 200.

[0218] See Figure 26 The microfluidic chip 100 includes multiple electrodes O, one of which is in contact with a probe J1 of the detection device 200.

[0219] For example, see Figure 26The plurality of electrodes O may include a plurality of driving electrodes Q and a plurality of bonding electrodes P. When performing short-circuit detection between different lines L' corresponding to different bonding electrodes P, different bonding electrodes P contact different probes J1 of the detection device 200; when performing open-circuit detection within a line L' corresponding to a bonding electrode P, the bonding electrode P, and a driving electrode Q electrically connected to the bonding electrode P, respectively contact two probes J1 of the detection device 200.

[0220] For example, see Figure 27 The plurality of electrodes O may also include a plurality of detection electrodes Z. When performing open circuit detection in a line L' corresponding to a binding electrode P, the binding electrode P and a detection electrode Z electrically connected to the binding electrode P respectively contact the two probes J1 of the detection device 200.

[0221] For example, the first substrate 1 of the microfluidic chip 100 may be placed in the receiving groove U; or the microfluidic chip 100 may be placed completely in the receiving groove U after assembly.

[0222] For example, the film layer (e.g., the second conductive layer 14) where the electrode O of the microfluidic chip 100 is located is disposed closer to the base plate 212 relative to the first substrate 11, so that the electrode O is in contact with the probe J1.

[0223] S2: Detect whether there is a short circuit between two mutually insulated electrodes O among multiple electrodes O.

[0224] For example, see Figure 26 Different bonding electrodes P are connected to different driving electrodes Q, forming two different mutually insulated lines L'. During the fabrication of the microfluidic chip 100, short circuit faults can easily occur between the two different mutually insulated lines L'. By detecting whether there is a short circuit between two mutually insulated electrodes O among the multiple electrodes O, for example, detecting whether there is a short circuit between two mutually insulated bonding electrodes P among the multiple bonding electrodes P, the line L' with short circuit faults can be effectively screened out, thereby improving the product yield of the microfluidic chip 100.

[0225] S3: Detect whether line L' is open.

[0226] Among them, see Figure 26 The microfluidic chip 100 includes multiple lines L', each line L' being connected in series with at least two of the multiple electrodes O.

[0227] During the fabrication of the microfluidic chip 100, open circuits can easily occur between different electrodes O that are originally located in the same circuit L'. For example, the bonding electrode P may be disconnected from the driving electrode Q that is originally electrically connected to it, causing some driving electrodes Q to fail to transmit during the driving process of the microfluidic chip 100. By detecting whether the circuit L' is open, for example, detecting whether there is an open circuit between the bonding electrode P and the driving electrode Q in the same circuit L', or detecting whether there is an open circuit between the bonding electrode P and the detection electrode Z in the same circuit L', the circuit L' with open circuit faults can be effectively screened out, thereby improving the product yield of the microfluidic chip 100.

[0228] It should be noted that the order of steps S2 and S3 can be interchanged, and the corresponding embodiments of this disclosure are as follows. Figure 17 The example only illustrates step S2 before step S3, and does not impose any restrictions on the order of steps S2 and S3.

[0229] It should also be noted that steps S2 and S3 can be performed selectively, or both can be performed. That is, only short-circuit detection can be performed, only open-circuit detection can be performed, or both short-circuit detection and open-circuit detection can be performed.

[0230] In some embodiments, such as Figure 18 As shown, detecting whether there is a short circuit between two mutually insulated electrodes O among multiple electrodes O includes: S21: Combine multiple electrodes O in pairs to obtain multiple electrode pairs O'.

[0231] It should be noted that during short-circuit detection, multiple electrodes O can all be bonded electrodes P. That is, multiple bonded electrodes P are combined in pairs.

[0232] In each electrode pair O', the two electrodes O are mutually insulated, and the two electrodes O in any two electrode pairs O' are not identical. For example, see [link to relevant documentation]. Figure 25 Each bonding electrode P corresponds to a line L', and the bonding electrodes P corresponding to different lines L' are theoretically in an insulated state.

[0233] S22: Detect whether there is a short circuit between the two electrodes O in each electrode pair O'.

[0234] For example, detecting whether there is a short circuit between the two bonded electrodes P in each electrode pair O' is equivalent to detecting whether there is a short circuit between the two different lines ' corresponding to the two bonded electrodes P in each electrode pair O'.

[0235] S23: Based on the short circuit between the two electrodes O in electrode pair O', record the positions of the two electrodes O.

[0236] If there is a short circuit between the two electrodes O in electrode pair O', it means that there is a short circuit between the two bonded electrodes P in electrode pair O', that is, there is a short circuit between the two different lines ' corresponding to the two bonded electrodes P in electrode pair O'.

[0237] Record the positions of the two electrodes O, that is, record the positions of the two bonded electrodes P corresponding to the short circuit fault, so as to troubleshoot the line L' corresponding to the bonded electrode P that has the short circuit fault.

[0238] S24: Based on the fact that there is no short circuit between the two electrodes O in the multiple electrode pairs O', it is determined that the microfluidic chip 100 has no short circuit fault.

[0239] After all electrode pairs O' are tested, if there is no short circuit between the two electrodes O in all electrode pairs', it means that there is no short circuit between any two lines L'.

[0240] In some embodiments, such as Figure 19 As shown, detecting whether there is a short circuit between the two electrodes O in each electrode pair O' includes: S221: Detects the voltage between the two electrodes O in electrode pair O'.

[0241] S222: Determine a short circuit between the two electrodes O in electrode pair O' based on a voltage greater than or equal to a threshold voltage.

[0242] S223: Based on the voltage being less than the threshold voltage, it is determined that there is no short circuit between the two electrodes O in electrode pair O'.

[0243] In some embodiments, such as Figure 20 As shown, detecting whether line L' is open-circuited includes: S31: Detect the voltage between two electrodes O located at both ends of the multiple electrodes O connected in series in the detection circuit L'.

[0244] S32: Based on the voltage being less than the threshold voltage, determine that line L' is open-circuited and record the positions of the multiple electrodes O connected in series with line L'.

[0245] S33: Based on the voltage being greater than or equal to the threshold voltage, determine that line L' is not open-circuited.

[0246] In some embodiments, the detection device 200 includes a processor 203 and a resistor R connected in parallel with the processor 203.

[0247] The aforementioned threshold voltage is: ; Wherein, V1 is the threshold voltage, V is the power supply voltage of the detection device 200, R1 is the resistance between the two electrodes O in the electrode pair O' after short circuit, R2 is the resistance of the processor 203, and R3 is the resistance of the resistor R.

[0248] In some embodiments, see Figure 26 The plurality of electrodes O includes two foolproof electrodes W, which are electrically connected and are asymmetrically arranged with respect to the set centerline Li of the microfluidic chip 100. The microfluidic chip 100 includes opposing first sides L1 and second sides L2, and the set centerline Li is the centerline of the microfluidic chip 100 parallel to the first side L1 and the second side L2.

[0249] like Figure 21 As shown, the aforementioned detection method also includes: S01: Detect whether there is a short circuit between the two electrodes O at the target location.

[0250] The target position is the location of the two foolproof electrodes W when the microfluidic chip 100 is correctly placed in the detection device 200.

[0251] S02: Based on the fact that there is no short circuit between the two electrodes O at the target position, it is determined that the two electrodes O at the target position are not two foolproof electrodes W, and the positions of the first side L1 and the second side L2 of the microfluidic chip 100 are swapped.

[0252] S03: Based on the short circuit between the two electrodes O at the target location, it is determined that the two electrodes O at the target location are two foolproof electrodes W, and the placement of the microfluidic chip 100 is correct.

[0253] It should be noted that steps S01, S02 and S03 are performed before the aforementioned step S1. That is, before performing fault detection on the microfluidic chip 100, a foolproof test is performed to prevent the microfluidic chip 100 from being placed in the wrong position on the base plate 212, which could lead to incorrect test results or cause the electrode O and probe J1 to fail to make contact.

[0254] like Figure 22 As shown, other embodiments of this disclosure provide a method for fabricating a microfluidic chip 100, including: K1: Prepare the first substrate 1 and the second substrate 2.

[0255] The first substrate 1 includes a plurality of electrodes O. For example, see [reference needed]. Figure 23 The first substrate 1 includes multiple driving electrodes Q.

[0256] For example, see Figure 23 The preparation of the first substrate 1 includes sequentially disposing a first conductive layer 12, an insulating layer 13, and a second conductive layer 14 on the first substrate 11.

[0257] For example, see Figure 23The preparation of the second substrate 2 includes sequentially depositing a common electrode layer 22 and a second hydrophobic layer 23 on the second substrate 21.

[0258] K2: Place the first substrate 1 in the detection device 200 as described in any of the preceding embodiments, and perform detection on the first substrate 1 using the detection method as described in any of the preceding embodiments.

[0259] K3: Based on the test result that there is no fault, a dielectric layer 16 is formed on the multiple electrodes O of the first substrate 1.

[0260] For example, see Figure 23 The dielectric layer 16 is disposed on the side of the second conductive layer 14 away from the first substrate 11.

[0261] K4: Inspect the first substrate 1 on which the dielectric layer 16 is formed.

[0262] K5: Based on the test result that there is no fault, a first hydrophobic layer 15 is formed on the dielectric layer 16.

[0263] For example, see Figure 23 The first hydrophobic layer 15 is disposed on the side of the dielectric layer 16 away from the first substrate 11.

[0264] K6: Inspect the first substrate 1 on which the first hydrophobic layer 15 is formed.

[0265] K7: Based on the test result being fault-free, the first substrate 1 with the first hydrophobic layer 15 and the second substrate 2 are assembled.

[0266] For example, see Figure 23 After the box is assembled, there is a gap between the first substrate 1 and the second substrate 2, and the first hydrophobic layer 15 and the second hydrophobic layer 23 are opposite to each other, forming a channel through which droplets can pass.

[0267] For example, during each test of the first substrate 1, the second substrate 2 can be temporarily aligned with the first substrate 1, thereby providing support for the first substrate 1 and preventing the first substrate 1 from becoming loose in the test device 200, thus improving the accuracy of the test results.

[0268] By combining the detection device 200 and detection method in the foregoing embodiments, short circuit and open circuit detection of the microfluidic chip 100 can be performed during the fabrication process of the microfluidic chip 100. This allows for the screening of faulty electrodes O during the fabrication process of the microfluidic chip 100, especially during the fabrication process of the first substrate 1. Only when there are no faults can the next fabrication process be carried out, which can reduce the number of reworks during the fabrication process of the microfluidic chip 100 and effectively improve the product yield of the microfluidic chip 100.

[0269] Another aspect of this disclosure provides a microfluidic chip 100 that can be applied to the aforementioned detection device 200.

[0270] See Figure 1 The microfluidic chip 100 includes a first substrate 1 and a second substrate 2. The first substrate 1 and the second substrate 2 are disposed opposite each other.

[0271] like Figure 24 , Figure 25 and Figure 27 As shown, the first substrate 1 includes two anti-mistake electrodes W, which are electrically connected and are asymmetrically arranged relative to the set centerline Li of the microfluidic chip 100.

[0272] The centerline Li is defined as passing through the midpoint of the line connecting any point on the first side L1 and the second side L2, and is parallel to both the first side L1 and the second side L2. That is, the first side L1 and the second side L2 are symmetrically arranged with respect to the centerline Li.

[0273] For example, the case where "the two anti-mistake electrodes W are asymmetrically arranged relative to the setting center line Li of the microfluidic chip 100" includes the following situations: the two anti-mistake electrodes W are respectively located on both sides of the setting center line Li that are close to and far from the first side L1, but the two anti-mistake electrodes W are not symmetrically arranged along the setting center line Li; or, the two anti-mistake electrodes W are simultaneously located on the same side of the setting center line Li that are close to or far from the first side L1, and the two anti-mistake electrodes W cannot be symmetrically arranged along the setting center line Li.

[0274] By setting the anti-mistake electrodes W and setting the two anti-mistake electrodes W asymmetrically relative to the set center line Li of the microfluidic chip 100, it is possible to determine whether the positions of the first side L1 and the second side L2 of the microfluidic chip 100 are reversed based on the anti-mistake detection results of the two anti-mistake electrodes W by the detection device 200, thereby avoiding inaccurate short circuit or open circuit detection results caused by the microfluidic chip 100 being placed in the wrong position.

[0275] In some embodiments, such as Figure 24 , Figure 25 and Figure 27 As shown, the first substrate 1 includes multiple driving electrodes Q and multiple bonding electrodes P.

[0276] In this configuration, the bonding electrode P is electrically connected to at least one driving electrode Q. For example, see [link to relevant documentation]. Figure 24 A binding electrode P is connected in series with four driving electrodes Q to form a circuit L'. Or, for example, see [reference needed]. Figure 25 The four driving electrodes Q are connected in series in pairs and connected to the same bonding electrode P through two signal lines L. In this case, the four driving electrodes Q and the bonding electrode P also form a line L'.

[0277] By detecting the continuity between different bonding electrodes P, it can be determined whether there is a short circuit between the lines L' corresponding to those different bonding electrodes P.

[0278] In some embodiments, such as Figure 27 As shown, the first substrate 1 also includes a plurality of detection electrodes Z.

[0279] In this case, a line L' includes a bonding electrode P, at least one driving electrode Q, and a detection electrode Z that are electrically connected in sequence.

[0280] During open circuit detection, it is possible to determine whether there is an open circuit in the line L' corresponding to the binding electrode P and the detection electrode Z simply by detecting the continuity between the binding electrode P and the detection electrode Z, without needing to detect the driving electrode Q, thus reducing the detection difficulty. Furthermore, even when the first substrate 1 and the second substrate 2 are paired, open circuit detection can still be achieved, thus realizing compatibility between short circuit detection and open circuit detection.

[0281] In some embodiments, see Figure 24 The first substrate 1 includes a plurality of driving electrodes Q and a plurality of bonding electrodes P, wherein the bonding electrodes P are electrically connected to at least one driving electrode Q.

[0282] Among the multiple binding electrodes P, two binding electrodes P serve as two foolproof electrodes W. Both foolproof electrodes W are located on the side of the set centerline Li near the first side L1, and the two foolproof electrodes W are electrically connected.

[0283] By reusing any two bonded electrodes P as the foolproof electrode W, foolproof detection can be achieved, saving the design space required to fabricate the foolproof electrode W separately.

[0284] In some embodiments, such as Figure 24 As shown, the first substrate 1 also includes a foolproof pattern Mr. The foolproof pattern Mr is an identifier set at a position away from the set centerline Li, which is configured to prevent the first side L1 and the second side L2 of the microfluidic chip 100 from being placed in reverse.

[0285] During the fabrication of the microfluidic chip 100, the electrode pattern formed by the driving electrode Q in the second conductive layer 14 of the first substrate 1 and the performance of the first substrate 1 determine the type of process and the process precision that the microfluidic chip 100 can achieve.

[0286] like Figure 24 , Figure 25 and Figure 27 As shown, the first substrate 1 has a storage area 20 and a transport area 30.

[0287] Storage area 20 is provided with storage electrodes. The storage electrodes have a large area and are used to store the test sample. The test sample in storage area 20 is drawn into droplets 3 by the stepwise traction of different storage electrode voltages, and the droplets 3 are drawn to the driving electrode Q for operation. For example, storage area 20 is provided with three 3mm×1mm rectangular storage electrodes.

[0288] The transport region 30 is provided with multiple driving electrodes Q arranged in an array according to the required electrode pattern. Depending on the function of the required microfluidic chip 100, the electrode pattern composed of the multiple driving electrodes Q in the transport region 30 is different, and the number and size of the driving electrodes Q are also different.

[0289] For example, such as Figure 24 , Figure 25 and Figure 27 As shown, the microfluidic chip 100 may include at least one flow channel LP. For example, the microfluidic chip 100 may include four flow channels LP.

[0290] For example, see Figure 24 In a plurality of flow channels LP, each flow channel LP extends in the same direction. Alternatively, by way of example, a flow channel LP may be curved or irregular in shape, and this application does not limit this.

[0291] In some embodiments, such as Figure 24 , Figure 25 and Figure 27 As shown, the first substrate 1 also has a reaction region 40.

[0292] The reaction zone 40 is configured to allow chemical or physical reactions to occur when different types of droplets 3 are transported to the reaction zone 40.

[0293] In some embodiments, see Figure 25 and Figure 26 The first substrate 1 also includes a temperature sensor F, which is disposed adjacent to at least one driving electrode Q and is insulated from at least one driving electrode Q.

[0294] For example, a temperature sensor F is disposed in the reaction zone 40, adjacent to at least one driving electrode Q in the reaction zone 40. The temperature sensor F enables monitoring of the ambient temperature of the reaction zone 40, facilitating the analysis of the droplets 3 in the reaction zone 40.

[0295] See Figure 25 and Figure 26 The temperature sensor F is electrically connected to two foolproof electrodes W. That is, the connection electrodes of the temperature sensor F are reused as foolproof electrodes W to achieve foolproof detection, which can save the design space for separately fabricating foolproof electrodes W.

[0296] In some embodiments, such as Figure 26 As shown, the temperature sensor F is a wire-wound resistor. The wire-wound resistor is a zigzag-shaped trace, with its two ends connected to two foolproof electrodes W (see...). Figure 25 Electrical connection. The winding design increases the sensing area of ​​the temperature sensor F, thereby improving its temperature sensing accuracy.

[0297] In some embodiments, such as Figure 27 As shown, one of the two foolproof electrodes W is grounded. That is, by reusing the grounding electrode 10 as the foolproof electrode W, the design space for separately fabricating the foolproof electrode W can be saved.

[0298] In some embodiments, such as Figure 28 As shown, the second substrate 2 is provided with a second through hole Ho2, and the orthographic projection of the second through hole Ho2 on the first substrate 1 overlaps at least partially with the grounded anti-foolproof electrode W.

[0299] When the first substrate 1 and the second substrate 2 are paired, the second substrate 2 will block the connection path between the grounded anti-foolproof electrode W and the circuit board 202. By setting the second through hole Ho2 and setting the orthographic projection of the second through hole Ho2 on the first substrate 1 to at least partially overlap with the grounded anti-foolproof electrode W, one end of the grounding probe J5 contacts the grounding pad T3 in the circuit board 202, and the other end can sequentially pass through the first through hole Ho1 of the bottom of the slot U2 and the second through hole Ho2 of the second substrate 2 to contact the grounded anti-foolproof electrode W.

[0300] It should be noted that the embodiments provided in this disclosure... Figure 24 , Figure 25 and Figure 27 The diagram only shows one or two lines L' as an example. In actual products, the microfluidic chip 100 includes multiple lines L', in which the driving electrode Q is electrically connected to the bonding electrode P.

[0301] In some embodiments, such as Figure 28 As shown, the second substrate 2 is provided with at least one second window C2. The second window C2 is configured to expose a plurality of bonding electrodes P and / or a plurality of detection electrodes Z on the first substrate 1.

[0302] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A microfluidic chip, comprising: A first substrate includes two foolproof electrodes, multiple driving electrodes, and a temperature sensor. The two foolproof electrodes are electrically connected and asymmetrically arranged with respect to a predetermined centerline of the microfluidic chip. The microfluidic chip includes opposing first and second sides, and the predetermined centerline passes through the midpoint of a line connecting any point on the first and second sides, and is parallel to both the first and second sides. The temperature sensor is disposed adjacent to at least one driving electrode and is insulated from it. The temperature sensor is electrically connected to the two foolproof electrodes. The second substrate is disposed opposite to the first substrate.

2. The microfluidic chip according to claim 1, wherein, The first substrate further includes a plurality of bonding electrodes, which are electrically connected to at least one of the driving electrodes; Among them, two of the multiple binding electrodes serve as the two foolproof electrodes, and both of the foolproof electrodes are located on the side of the set centerline close to the first side.

3. The microfluidic chip according to claim 1, wherein, The first substrate further includes a plurality of bonding electrodes, which are electrically connected to at least one of the driving electrodes.

4. The microfluidic chip according to claim 1, wherein, The temperature sensor is a wire-wound resistor, which is a zigzag-shaped trace, with both ends of the trace electrically connected to the two foolproof electrodes.

5. The microfluidic chip according to claim 1, wherein, One of the two foolproof electrodes is grounded.

6. The microfluidic chip according to claim 5, wherein, The second substrate is provided with a second through hole, and the orthographic projection of the second through hole on the first substrate overlaps at least partially with the grounded anti-foolproof electrode.

7. The microfluidic chip according to claim 1, wherein, The first substrate further includes a plurality of bonding electrodes and a plurality of detection electrodes, wherein at least one driving electrode is simultaneously electrically connected to one of the bonding electrodes and one of the detection electrodes; The bonding electrode and the detection electrode, which are electrically connected to the at least one driving electrode, are configured to be electrically connected to the detection device to achieve open circuit detection.

8. The microfluidic chip according to claim 7, wherein, The second substrate has at least one second opening, which is configured to expose the plurality of bonding electrodes and / or the plurality of detection electrodes on the first substrate.

9. A microfluidic chip crimping device, applicable to the microfluidic chip according to any one of claims 1-8; The crimping device includes: Cover plate; The base plate is aligned with the cover plate. The base plate is provided with a receiving groove, the opening of the receiving groove faces the cover plate, and the bottom of the receiving groove has an opening; The probe assembly includes multiple probes; the probe assembly is fixedly connected to the bottom of the receiving groove, the ends of the multiple probes near the cover plate are configured to contact the microfluidic chip, and the ends of the multiple probes away from the cover plate pass through the opening.

10. The crimping device according to claim 9, wherein, The probe assembly also includes: The needle mold is fixedly connected to the bottom of the receiving groove. The needle mold has multiple mounting holes, and a probe passes through one mounting hole and is fixed inside the mounting hole.

11. The crimping device according to claim 9, wherein, The bottom of the receiving groove includes a plurality of receiving parts, which are spaced apart along the groove wall of the receiving groove, and at least one of the plurality of receiving parts protrudes relative to the groove wall. The probe assembly is disposed between two adjacent receiving parts, and both ends of the probe assembly are fixedly connected to the two adjacent receiving parts respectively.

12. The crimping device according to claim 9, wherein, The crimping device includes a plurality of the probe assemblies; At least one of the plurality of probe assemblies is a bonding probe assembly, the bonding probe assembly being disposed near the wall of the receiving groove, and the ends of the plurality of probes in the bonding probe assembly near the cover plate being configured to contact the bonding electrode of the microfluidic chip.

13. The crimping device according to claim 12, wherein, At least one of the plurality of probe assemblies is a driving probe assembly, which is disposed away from the wall of the receiving groove relative to the bonding probe assembly, and the ends of the plurality of probes in the driving probe assembly near the cover plate are configured to contact the driving electrode of the microfluidic chip.

14. The crimping device according to claim 9, wherein, The bottom of the receiving groove is also provided with a first through hole; The crimping device further includes: A grounding probe is fixedly connected to the bottom of the receiving groove. One end of the grounding probe near the cover plate is configured to contact the microfluidic chip, and the other end of the grounding probe away from the cover plate passes through the first through hole.

15. The crimping device according to claim 14, wherein, The plurality of probes and the grounding probe are elastic in their own length extension direction; The elastic deformation range of the grounding probe is greater than the elastic deformation range of at least one of the plurality of probes.

16. The crimping device according to claim 9, further comprising: A pressing structure is provided on the side of the cover plate facing the bottom plate, and the pressing structure is elastic; When the cover plate and the base plate are fastened together, the orthographic projection of the pressing structure on the reference surface at least partially coincides with the orthographic projection of the probe assembly on the reference surface. The reference surface is the plane where the bottom of the receiving groove is located near the surface of the cover plate.

17. The crimping device according to claim 16, wherein, The pressing structure includes a pressing plate and an elastic element; the elastic element is located between the pressing plate and the cover plate, with one end of the elastic element connected to the pressing plate and the other end connected to the cover plate; When the cover plate and the base plate are engaged, the orthographic projection of the pressing plate on the reference surface at least partially overlaps with the orthographic projection of the probe assembly on the reference surface.

18. The crimping device according to any one of claims 9 to 17, further comprising: The hinge structure includes a first hinge and a second hinge that are movably connected. The first hinge is fixedly connected to the cover plate, and the second hinge is fixedly connected to the base plate.

19. The crimping device according to claim 18, further comprising: The snap-fit ​​structure includes a snap fastener and a slot, wherein the snap fastener is fixedly connected to one of the cover plate and the base plate, and the slot is provided in the other of the cover plate and the base plate, and the snap fastener can snap into the slot; The hinge structure and the snap-fit ​​structure are respectively located on opposite sides of the cover plate and the bottom plate.

20. A detection device for a microfluidic chip, comprising: The crimping device as described in any one of claims 9 to 19; The circuit board is located on the side of the base plate of the pressing device away from the cover plate; The circuit board includes a substrate and a plurality of pads disposed on the substrate, wherein one pad contacts a probe of the crimping device; A processor is disposed on the circuit board and electrically connected to the plurality of pads; the processor is configured to transmit detection signals to probes in contact with the pads via the pads, and to receive feedback signals from the probes and process the feedback signals.

21. The detection device according to claim 20, wherein, The plurality of pads are located on the side of the substrate closer to the base plate, and the processor is located on the side of the substrate away from the base plate.

22. The detection device according to claim 20, wherein, The crimping device includes a grounding probe; The circuit board also includes a grounding pad, which is in contact with the grounding probe.

23. The detection apparatus according to any one of claims 20 to 22, wherein, The circuit board also includes a resistor connected in parallel with the processor.

24. The detection device according to claim 23, wherein, The resistance value of the resistor is less than or equal to the resistance value of the processor.

25. A detection system for a microfluidic chip, comprising: The detection device as described in any one of claims 20 to 24; An industrial control computer is electrically connected to the circuit board in the detection device.

26. A method for detecting microfluidic chips, comprising using the detection device as described in any one of claims 20 to 24; The detection method includes: The microfluidic chip is placed in the receiving groove of the base plate of the detection device; The microfluidic chip includes multiple electrodes, one of which is in contact with a probe of the detection device; Detect whether there is a short circuit between two mutually insulated electrodes among the plurality of electrodes; and / or, The microfluidic chip includes multiple lines, each line connecting at least two of the multiple electrodes in series; it detects whether the lines are open-circuited.

27. The detection method according to claim 26, wherein, The detection of whether there is a short circuit between two mutually insulated electrodes among the plurality of electrodes includes: The multiple electrodes are combined in pairs to obtain multiple electrode pairs; wherein the two electrodes in each electrode pair are insulated from each other, and the two electrodes in any two electrode pairs are not exactly the same. Detect whether there is a short circuit between the two electrodes in each electrode pair; Based on the short circuit between the two electrodes in the electrode pair, the positions of the two electrodes are recorded; Based on the fact that there is no short circuit between any two electrodes in the plurality of electrode pairs, it is determined that the microfluidic chip has no short circuit fault.

28. The detection method according to claim 27, wherein, The detection of whether there is a short circuit between the two electrodes in each electrode pair includes: Detect the voltage between the two electrodes in the electrode pair; Based on the voltage being greater than or equal to the threshold voltage, a short circuit is determined between the two electrodes in the electrode pair; Based on the fact that the voltage is less than the threshold voltage, it is determined that there is no short circuit between the two electrodes in the electrode pair.

29. The detection method according to claim 28, wherein, The detection device includes a processor and a resistor connected in parallel with the processor; The threshold voltage is: ; Wherein, V1 is the threshold voltage, V is the power supply voltage of the detection device, R1 is the resistance between the two electrodes of the electrode pair after short circuit, R2 is the resistance of the processor, and R3 is the resistance of the resistor.

30. The detection method according to claim 26, wherein, The detection of whether the line is open includes: Detect the voltage between two electrodes located at both ends of the multiple electrodes connected in series in the circuit; Based on the fact that the voltage is less than the threshold voltage, the circuit is determined to be open, and the positions of the multiple electrodes connected in series with the circuit are recorded; Based on the voltage being greater than or equal to the threshold voltage, it is determined that the line is not open.

31. The detection method according to any one of claims 26 to 30, wherein, The plurality of electrodes includes two foolproof electrodes, which are electrically connected and are asymmetrically arranged with respect to the set centerline of the microfluidic chip; wherein, the microfluidic chip includes a first side and a second side opposite to each other, and the set centerline is the centerline of the microfluidic chip that is parallel to the first side and the second side; The detection method further includes: The system detects whether there is a short circuit between the two electrodes at the target location; the target location is the position of the two foolproof electrodes when the microfluidic chip is correctly placed in the detection device. Based on the fact that there is no short circuit between the two electrodes at the target location, it is determined that the two electrodes at the target location are not the two foolproof electrodes, and the positions of the first side and the second side of the microfluidic chip are swapped. Based on the short circuit between the two electrodes at the target location, it is determined that the two electrodes at the target location are the two foolproof electrodes, and the placement of the microfluidic chip is correct.

32. A method for fabricating a microfluidic chip, comprising: A first substrate and a second substrate are prepared, wherein the first substrate includes a plurality of electrodes; The first substrate is placed in the detection device as described in any one of claims 20 to 24, and the first substrate is detected by the detection method as described in any one of claims 26 to 31; Based on the test result being fault-free, a dielectric layer is formed on multiple electrodes of the first substrate; The first substrate on which the dielectric layer is formed is inspected; Based on the test result indicating no fault, a first hydrophobic layer is formed on the medium layer; The first substrate on which the first hydrophobic layer is formed is inspected; Based on the test results showing no faults, the first substrate with the first hydrophobic layer formed thereon and the second substrate are assembled.

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