Hemispherical resonator confined flow field force flow-revolved polishing-leveling apparatus and method

Abstract

The application discloses a hemispherical resonator constrained flow field force rheological polishing-leveling equipment and method. The polishing-leveling equipment comprises a linear moving platform, a cleaning and drying device, a force rheological constraint module, an in-situ detection device and a hydraulic power device. The linear moving platform is used for adjusting the position of the hemispherical resonator, and a workpiece spindle for clamping the hemispherical resonator is arranged on the linear moving platform. The cleaning and drying device is used for cleaning and drying the polished hemispherical resonator. The force rheological constraint module is used for polishing the hemispherical resonator, and two constraint flow channels connected with an A abrasive cylinder and a B abrasive cylinder are arranged in the force rheological constraint module. The in-situ detection device is used for detecting the unbalanced mass and the unbalanced position of the hemispherical resonator, so that the hemispherical resonator can be conveniently leveled and corrected. The hydraulic power device comprises an A hydraulic cylinder and a B hydraulic cylinder connected with a hydraulic station. The A hydraulic cylinder and the B hydraulic cylinder are connected with pistons of the A abrasive cylinder and the B abrasive cylinder respectively.

Description

Technical Field

[0001] This invention relates to the field of precision and ultra-precision machining technology, and in particular to a hemispherical harmonic oscillator constrained flow field force rheological polishing-leveling equipment and method. Background Technology

[0002] The hemispherical resonator is machined from a single piece of fused silica material. Its structural shape is a thin-walled hemispherical shell with a central support rod. The shell diameter ranges from 15 to 60 mm, and the wall thickness is less than 1 mm. A small radius of curvature transitions between the central support rod and the shell surface. As the core sensitive component of the hemispherical resonator gyroscope, the quality of its machining directly affects the gyroscope's performance and lifespan.

[0003] Currently, there are still some difficulties in the polishing technology of hemispherical resonators in China: (1) During processing, the central support rod interferes, and there are "dead angles" in the grinding and polishing at the arc transition between the central support rod and the shell; (2) The hemispherical resonator parts have thin walls and are made of hard and brittle materials. If the processing force is not appropriate, the parts are prone to breakage; (3) During processing, it is necessary to turn the parts around for clamping and alignment. It is difficult to guarantee the positional accuracy requirements such as coaxiality and concentricity above the micrometer level. At present, traditional grinding and polishing processes are difficult to meet the processing accuracy requirements of hemispherical resonators. Summary of the Invention

[0004] To address the aforementioned problems in the polishing of hemispherical resonators, this application provides a hemispherical resonator constrained flow field force-rheological polishing-leveling equipment for polishing and leveling the hemispherical resonator after polishing. This equipment includes a force-rheological constraint module, an in-situ detection device, and a hydraulic power unit. During use, the hydraulic power unit pushes the polishing fluid from the abrasive cylinder into the constraint channel of the force-rheological constraint module according to a specific working mode, forming a constrained flow field to achieve simultaneous polishing of the inner and outer spherical surfaces of the hemispherical resonator, resulting in high polishing precision and efficiency. After one polishing pass, the in-situ detection device detects the unbalanced mass and position on the surface of the hemispherical resonator for leveling correction, ensuring uniform material removal and improving polishing quality. Correspondingly, this application also provides a hemispherical resonator constrained flow field force-rheological polishing-leveling method.

[0005] For polishing-leveling equipment, the technical solution of this application is as follows:

[0006] A hemispherical resonator constrained flow field force-rheological polishing-leveling equipment includes a machine tool; the machine tool is equipped with a linear motion platform, a cleaning and drying device, a force-rheological constraint module, an in-situ detection device, and a hydraulic power device; the linear motion platform is used to adjust the position of the hemispherical resonator; the cleaning and drying device is used to clean and dry the polished hemispherical resonator; the in-situ detection device is used to detect the unbalanced mass and unbalanced position on the surface of the polished hemispherical resonator; the force-rheological constraint module is used to polish the hemispherical resonator, and includes a substrate and a fixed mold core disposed on the substrate; the end of the fixed mold core matches the inner spherical structure of the hemispherical resonator; a fixed mold sleeve is sleeved on the outside of the fixed mold core, one end of the fixed mold sleeve is fixed to the substrate, and the other end is connected to a moving mold sleeve; the outer surface of the fixed mold core... The mold has symmetrical grooves A on both sides of the wall, and correspondingly, groove B, which matches groove A, is formed on the inner wall of the fixed mold sleeve, thus creating two constrained flow channels between the fixed mold core and the fixed mold sleeve. The inner wall of the moving mold sleeve has an arc-shaped groove for connecting the two constrained flow channels, which matches the outer spherical structure of the hemispherical resonator. The base plate has two through holes, each connected to one of the two constrained flow channels. These two through holes are connected to abrasive cylinders A and B via pipes. The hydraulic power unit includes a hydraulic station and hydraulic cylinders A and B connected to the hydraulic station. Hydraulic cylinders A and B are connected to the pistons of abrasive cylinders A and B, respectively. The linear motion platform has a workpiece spindle. The workpiece spindle is used to clamp the hemispherical resonator and drive its rotation.

[0007] Compared with existing technologies, the hemispherical harmonic oscillator constrained flow field force-rheological polishing-leveling equipment of this application includes a force-rheological constraint module, an in-situ detection device, and a hydraulic power device. The force-rheological constraint module is used to polish the hemispherical harmonic oscillator. It has a constraint flow channel inside, which can guide the polishing fluid to the inner and outer spherical surfaces of the hemispherical harmonic oscillator. In use, the hydraulic power device pushes the polishing fluid in the abrasive cylinder into the constraint flow channel of the force-rheological constraint module according to a specific working mode, forming a constrained flow field to achieve synchronous polishing of the inner and outer spherical surfaces of the hemispherical harmonic oscillator, resulting in high polishing efficiency. After one polishing, the unbalanced mass and unbalanced position on the surface of the hemispherical harmonic oscillator are detected by the in-situ detection device to level and correct the hemispherical harmonic oscillator (the leveling time can be obtained from the solution formula), ensuring the uniformity of surface material removal and improving polishing quality. In addition, the force-rheological constraint module has a specific structure that matches the inner and outer spherical surface structure of the hemispherical harmonic oscillator. Only one clamping is required to achieve polishing of the hemispherical harmonic oscillator without dead angles, ensuring the concentricity of the hemispherical harmonic oscillator during polishing and achieving high polishing precision.

[0008] As an optimization, in the aforementioned hemispherical harmonic oscillator constrained flow field force rheological polishing-leveling equipment, the cleaning and drying device includes a water gun and an air gun; the water gun is used to rinse off the polishing liquid adhering to the surface of the hemispherical harmonic oscillator, and the air gun is used to blow away the water stains remaining on the surface of the cleaned hemispherical harmonic oscillator.

[0009] As an optimization, in the aforementioned hemispherical harmonic oscillator constrained flow field force-rheological polishing-leveling equipment, the in-situ detection device includes a streak camera for acquiring the circumferential multi-point vibration frequencies of the hemispherical harmonic oscillator. During operation, the streak camera is used to detect the circumferential multi-point vibration frequencies of the hemispherical harmonic oscillator, thereby determining the unbalanced mass and unbalanced position on the surface of the hemispherical harmonic oscillator. This method offers high accuracy and is easy to implement.

[0010] As an optimization, in the aforementioned hemispherical resonator constrained flow field force-rheological polishing-leveling equipment, the moving mold sleeve includes a detachably connected first moving mold sleeve and a second moving mold sleeve; the first moving mold sleeve is fitted onto the end of the fixed mold sleeve; the arc-shaped groove is provided on the second moving mold sleeve. This facilitates processing. Furthermore, the first moving mold sleeve is assembled from two identical first half-shells; the second moving mold sleeve is assembled from two identical second half-shells. This facilitates the assembly of the hemispherical resonator.

[0011] As an optimization, in the aforementioned hemispherical harmonic oscillator-constrained flow field force-rheological polishing-leveling equipment, hydraulic cylinders A and B are alternately connected to the hydraulic station. In this case, only one control valve is needed for the hydraulic station, making it easy to implement and highly reliable.

[0012] As an optimization, in the aforementioned hemispherical harmonic oscillator-constrained flow field force rheological polishing-leveling equipment, the linear motion platform is a lead screw cross slide, including an X-screw slide and a Y-screw slide that are slidably connected; the Y-screw slide is fixed to the machine tool; and the workpiece spindle is fixed to the X-screw slide. The linear motion platform adopts the above structure, which is convenient to assemble, easy to implement, and very convenient to operate.

[0013] Regarding the polishing-leveling method, the technical solution of this application is as follows:

[0014] A hemispherical harmonic oscillator-constrained flow field force-rheological polishing-leveling method, which is implemented using the aforementioned hemispherical harmonic oscillator-constrained flow field force-rheological polishing-leveling equipment, includes the following steps:

[0015] Step 1: Prepare a non-Newtonian fluid polishing slurry with shear rheological effect and store it in abrasive cylinders A and B; install the hemispherical resonator on the workpiece spindle, then move the hemispherical resonator to the force rheological constraint module and install it into the force rheological constraint module;

[0016] Step 2: The workpiece spindle is started, driving the hemispherical harmonic oscillator to rotate; at the same time, the hydraulic power unit is started, and hydraulic cylinders A and B reciprocate to push the polishing liquid in the abrasive cylinder into the constrained flow channel and form a constrained flow field to polish the hemispherical harmonic oscillator. The polishing time is T1.

[0017] Step 3: After polishing, remove the hemispherical harmonic oscillator from the force-rheology constraint module and move it to the cleaning and drying device for cleaning and drying for time T2.

[0018] Step 4: After cleaning and drying, move the hemispherical harmonic oscillator to the in-situ detection device; detect the unbalanced mass and unbalanced position on the surface of the hemispherical harmonic oscillator using the in-situ detection device, and solve the problem using the formula: Calculate the leveling time t; where, For unbalanced mass, This is the Preston coefficient, under certain processing conditions. Where p is a constant, p is the polishing pressure, and v is the polishing speed;

[0019] Step 5: Move the hemispherical harmonic oscillator again and install it into the force-rheological constraint module, aligning its unbalanced position with the constraint flow channel; start the hydraulic power unit to polish and level the hemispherical harmonic oscillator for a time t.

[0020] Step 6: Repeat steps 3 to 5 until the surface quality of the hemispherical harmonic oscillator meets the set requirements.

[0021] Compared with existing technologies, the hemispherical harmonic oscillator-confined flow field force rheological polishing-leveling method of this application has the following advantages:

[0022] (1) Using a force rheological constraint module with a specific structure and a non-Newtonian fluid polishing slurry with shear rheological properties, the inner and outer spherical surfaces of the hemispherical harmonic oscillator are polished simultaneously based on the non-contact flexible polishing characteristics of force rheological polishing. The polishing efficiency is high, and the surface material can be removed uniformly with almost no damage.

[0023] (2) During polishing, the workpiece spindle drives the hemispherical harmonic oscillator to rotate. At the same time, the hydraulic power device pushes the polishing liquid into the constraint flow channel of the force rheology constraint module according to a specific working mode to form a constraint flow field. Under the guidance of the constraint flow channel, the polishing liquid flows through the inner and outer spherical surfaces of the hemispherical harmonic oscillator, realizing the polishing of the surface of the hemispherical harmonic oscillator without dead angles. Moreover, the force on the surface of the hemispherical harmonic oscillator is uniform, which can ensure the uniform removal of surface material and improve the polishing accuracy.

[0024] (3) After polishing is completed, the unbalanced mass and unbalanced position of the surface of the hemispherical harmonic oscillator can be detected by the in-situ detection device, and the leveling time can be calculated by the calculation formula to level and correct the unbalanced position of the surface of the hemispherical harmonic oscillator, so that the surface mass distribution is uniform and the surface quality of the hemispherical harmonic oscillator after polishing is improved.

[0025] As an optimization, in the aforementioned hemispherical harmonic oscillator confined flow field force-rheological polishing-leveling method, the non-Newtonian fluid polishing slurry includes a base fluid, abrasive particles, and chemical additives; wherein the abrasive particles are one or more mixtures of cerium oxide, diamond, alumina, and silicon oxide, in a proportion of 10-20 wt%; and the chemical additives are dispersants, pH adjusters, oxidants, or chemical activators, in a proportion of 3-5 wt%. During the relative shear motion between the non-Newtonian fluid polishing slurry and the surface of the hemispherical harmonic oscillator, a shear rheological effect occurs, thereby achieving force-rheological polishing. Force-rheological polishing has the characteristics of non-contact flexible polishing. During polishing, the surface of the hemispherical harmonic oscillator is polished by holding the free abrasive particles, which can effectively avoid large particles scratching the surface of the hemispherical harmonic oscillator.

[0026] As an optimization, in step one of the aforementioned hemispherical resonator constrained flow field force rheological polishing-leveling method, when assembling the hemispherical resonator, first remove the moving mold sleeve, then fit the hemispherical resonator into the end of the fixed mold core, leaving a small gap between the two, and then reinstall the moving mold sleeve to close the force rheological constraint module, thus completing the assembly.

[0027] Furthermore, in step three, the flow rate of the polishing slurry can be 4.5–20 L / min. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the hemispherical harmonic oscillator-constrained flow field force rheological polishing-leveling equipment of this application;

[0029] Figure 2 This is a schematic diagram of the linear motion platform in this application;

[0030] Figure 3 This is a structural schematic diagram of the cleaning and drying device in this application (one of the cuboid half-shells has been removed).

[0031] Figure 4 This is a side view of the cleaning and drying apparatus in this application;

[0032] Figure 5 This is a cross-sectional schematic diagram of the force-rheological constraint module in this application;

[0033] Figure 6 This is a schematic diagram of the structure of the fixed mold core in this application;

[0034] Figure 7This is a schematic diagram of the structure of the fixed mold sleeve in this application;

[0035] Figure 8 This is a schematic diagram of the structure of the first moving mold sleeve in this application;

[0036] Figure 9 This is a schematic diagram of the structure of the second moving mold sleeve in this application;

[0037] Figure 10 This is a schematic diagram of the assembly of the force-rheology constraint module and the hemispherical harmonic oscillator in this application;

[0038] Figure 11 yes Figure 10 A schematic diagram of the force rheological constraint module after the second moving mold sleeve has been removed;

[0039] Figure 12 This is a schematic diagram of the hydraulic power unit in this application;

[0040] Figure 13 This is a schematic diagram of the detection principle of the in-situ detection device in this application.

[0041] The labels in the attached diagram are as follows: 1-Machine tool, 101-Mounting bracket; 2-Linear moving platform, 21-X-Screw slide, 22-Y-Screw slide; 3-Cleaning and drying device, 31-Water gun, 32-Air gun, 33-Rectangular half-shell, 34-Bidirectional screw mechanism, 35-Pipe joint; 4-Force rheological constraint module, 41-Base plate, 4101-Through hole, 42-Fixed mold core, 4201-A groove, 43-Fixed mold sleeve, 4301-B groove, 44-Moving mold sleeve, 44 1-First moving mold sleeve, 442-Second moving mold sleeve, 4401-Arc groove; 5-In-situ detection device, 51-Stripe camera, 52-Continuous laser, 53-Cylindrical mirror, 54-Beam splitter, 55-Plane mirror, 56-First convex lens, 57-Second convex lens; 6-Hydraulic power unit, 61-Hydraulic station, 62-Hydraulic cylinder A, 63-Hydraulic cylinder B; 7-Abrasive cylinder A; 8-Abrasive cylinder B; 9-Pipeline; 10-Workpiece spindle; 11-Hemispherical resonator. Detailed Implementation

[0042] The present application will be further described below with reference to the accompanying drawings and specific embodiments, but this should not be construed as limiting the present application.

[0043] To address the interference from the central support rod and the existence of "dead angles" in grinding and polishing during the processing of hemispherical harmonic oscillators in existing technologies, this application provides a hemispherical harmonic oscillator constrained flow field force rheological polishing-leveling method to meet the processing accuracy requirements of hemispherical harmonic oscillators; this method is implemented using hemispherical harmonic oscillator constrained flow field force rheological polishing-leveling equipment.

[0044] See Figures 1 to 12The present invention relates to a hemispherical harmonic oscillator constrained flow field force rheological polishing-leveling equipment, comprising a machine tool 1; the machine tool 1 is equipped with a linear moving platform 2, a cleaning and drying device 3, a force rheological constraint module 4, an in-situ detection device 5, and a hydraulic power device 6; the cleaning and drying device 3, the force rheological constraint module 4, and the in-situ detection device 5 are sequentially arranged and fixed on the mounting frame 101 of the machine tool 1, and are opposite to the linear moving platform 2; the linear moving platform 2 is used to adjust the position of the hemispherical harmonic oscillator 11; the cleaning and drying device 3 is used to clean the polished hemispherical harmonic oscillator 11. Cleaning and drying; the in-situ detection device 5 is used to detect the unbalanced mass and unbalanced position on the surface of the polished hemispherical resonator 11; the force-rheological constraint module 4 is used to polish the hemispherical resonator 11, which includes a substrate 41 and a fixed mold core 42 disposed on the substrate 41 (the fixed mold core 42 can be integrally formed with the substrate 41); the substrate 41 is fixed on the mounting bracket 102, and the end of the fixed mold core 42 matches the inner spherical structure of the hemispherical resonator 11; a fixed mold sleeve 43 is sleeved on the outside of the fixed mold core 42, and one end of the fixed mold sleeve 43 is fixed to the substrate. On plate 41 (which can be fixed with bolts, and a sealing gasket is provided between the fixed mold sleeve 43 and the base plate 41), the other end is connected to the movable mold sleeve 44; the outer wall of the fixed mold core 42 is symmetrically provided with groove A 4201 on both sides, and correspondingly, the inner wall of the fixed mold sleeve 43 is provided with groove B 4301 that cooperates with groove A 4201, thereby forming two constrained flow channels between the fixed mold core 42 and the fixed mold sleeve 43 (the cross-section of the constrained flow channel can be rectangular, arc, triangular or trapezoidal, and its cross-sectional width, depth, shape, etc. can vary along the direction of the generatrix of the hemispherical harmonic oscillator); The inner wall of the moving mold sleeve 44 is provided with an arc-shaped groove 4401 for connecting the two constraint flow channels, and the arc-shaped groove 4401 matches the outer spherical structure of the hemispherical resonator 11; the base plate 41 is provided with two through holes 4101, which are respectively connected to the two constraint flow channels; the two through holes 4101 are respectively connected to the A abrasive cylinder 7 and the B abrasive cylinder 8 through pipes 9 (pipes 9 and through holes 4101 can be connected by threads); the hydraulic power device 6 includes a hydraulic station 61, and A hydraulic cylinder 62 and B hydraulic cylinder 63 (e.g., connected to the hydraulic station 61 in an alternating manner) Figure 12 As shown, the oil inlet of hydraulic cylinder A 62 and the oil outlet of hydraulic cylinder B 63 are connected, and then connected to the oil inlet of hydraulic station 61; the oil outlet of hydraulic cylinder A 62 and the oil inlet of hydraulic cylinder B 63 are connected, and then connected to the oil outlet of hydraulic station 61. Hydraulic cylinder A 62 and hydraulic cylinder B 63 are respectively connected to the pistons of abrasive cylinder A 7 and abrasive cylinder B 8 (the cylinder bodies of the hydraulic cylinders and the cylinder bodies of the abrasive cylinders are connected by flanges). Hydraulic cylinder A 62 and hydraulic cylinder B 63 are symmetrical about the axis of the force rheological constraint module 4. The linear motion platform 2 is provided with a workpiece spindle 10, which is used to clamp the hemispherical resonator 11 and drive it to rotate.

[0045] See Figure 3 and Figure 4 In one specific embodiment, the cleaning and drying device 3 is equipped with a water gun 31 and an air gun 32. The water gun 31 is used to rinse off the polishing liquid adhering to the surface of the hemispherical resonator 11, and the air gun 32 is used to blow away any remaining water stains on the surface of the hemispherical resonator 11 after cleaning. The water gun 31 and the air gun 32 are housed inside the housing; the housing is assembled from two cuboid half-shells 33; the two cuboid half-shells 33 are slidably connected to the mounting bracket 101 and are driven to move in opposite directions or in opposite directions by a bidirectional screw mechanism 34; one of the cuboid half-shells 33 has a fluid outlet at its bottom, and a pipe joint 35 is provided at the fluid outlet. When the hemispherical resonator 11 needs to be cleaned and dried, the pipe joint 35 is connected to the sewage recovery device through the drain pipe. The bidirectional screw mechanism 34 drives the two cuboid half-shells 33 to move in opposite directions, opening the shell and moving the hemispherical resonator 11 into the shell. Then, the two cuboid half-shells 33 move towards each other, closing the shell. Next, the water gun 31 is activated to clean the hemispherical resonator 11. After cleaning, the water gun 31 is turned off and the air gun 32 is activated to dry the hemispherical resonator 11. The outer surface of the pipe joint 35 may be provided with barbs to make the connection between the pipe joint 35 and the drain pipe more secure.

[0046] See Figure 13 In one specific embodiment, the in-situ detection device 5 includes a streak camera 51, a continuous laser 52, a cylindrical mirror 53, a beam splitter 54, a plane mirror 55, a first convex lens 56, and a second convex lens 57. During detection, the hemispherical resonator 11 is struck, and simultaneously, the continuous laser 52 emits a laser beam. The cylindrical mirror 53, beam splitter 54, and plane mirror 55 are sequentially positioned along the laser beam path of the continuous laser 52. The hemispherical resonator 11, the first convex lens 56, the second convex lens 57, and the streak camera 51 are sequentially positioned along the reflected beam path of the beam splitter 54, with the beam splitter 54 located between the first convex lens 56 and the second convex lens 57. The circumferential multi-point vibration frequency of the hemispherical resonator 11 is obtained through the streak camera 51, and multi-point measurement based on the streak camera is performed. The technology, through data fitting to reconstruct the working mode shape of the four antinodes, yields the frequency difference (frequency difference is the difference in frequency between points detected by a striated camera; a low difference indicates a uniform circumferential mass distribution of the workpiece, resulting in a relatively higher Q value and thus a higher workpiece mass; the Q value is the quality factor, a key indicator of the hemispherical harmonic oscillator, directly affecting the accuracy of the hemispherical resonant gyroscope), unbalanced mass, and unbalanced position (different vibration frequencies can reflect the mass magnitude at that point; the position with the larger mass is the unbalanced position).

[0047] See Figures 5 to 9In one specific embodiment, the movable mold sleeve 44 includes a first movable mold sleeve 441 and a second movable mold sleeve 442 that are detachably connected; the first movable mold sleeve 441 is sleeved on the end of the fixed mold sleeve 43; the arc-shaped groove 4401 is provided on the second movable mold sleeve 442; the inner wall of the first movable mold sleeve 441 is provided with an annular protrusion, and correspondingly, the outer wall of the fixed mold sleeve 43 is provided with an annular groove; the annular protrusion is located in the annular groove. Further, the first movable mold sleeve 441 is assembled from two identical first half-shells, and the second movable mold sleeve 442 is assembled from two identical second half-shells, with a sealing gasket at the connection point. All parts are fixed by bolts, and a sealing gasket is provided at the connection point.

[0048] See Figure 2 In one specific embodiment, the linear motion platform 2 is a lead screw cross slide, including an X-screw slide 21 and a Y-screw slide 22 slidably connected; the X-screw slide 21 is slidably mounted on the Y-screw slide 22; the Y-screw slide 22 is fixed to the machine tool 1; and the workpiece spindle 10 is fixed to the X-screw slide 21. In this configuration, the structure is simple, easy to assemble, and convenient to adjust.

[0049] The hemispherical harmonic oscillator-constrained flow field force rheological polishing-leveling method of the present invention includes the following steps:

[0050] Step 1: Prepare a non-Newtonian fluid polishing slurry with shear rheological effect (the base liquid of the non-Newtonian fluid polishing slurry can be a mixture of polyhydroxy polymer and water; the abrasive particles can be one or more of cerium oxide, diamond, alumina, and silicon oxide, accounting for 10-20 wt% of the polishing slurry; the chemical additives can be dispersants, pH adjusters, oxidants, or chemical activators, accounting for 3-5 wt% of the polishing slurry), and store them in abrasive cylinders A 7 and B 8; install the hemispherical resonator 11 on the main body of the workpiece. On shaft 10 (where the spring collet nut on the workpiece spindle 1 clamps the outer anchor rod of the hemispherical resonator 11), start the Y-screw slide 22 to move the hemispherical resonator 11 to the force rheological constraint module 4; then remove the moving mold sleeve 44, start the X-screw slide 21 to drive the hemispherical resonator 11 into the end of the fixed mold core 42, leaving a small gap between them (0.2-0.5mm); then reinstall the moving mold sleeve 44 to close the force rheological constraint module 4. At this time, the outer anchor rod protrudes from the moving mold sleeve 44 (see...). Figure 9 and Figure 10 Two rubber rings can be installed on the outer anchor rod, distributed on the inner and outer sides of the moving mold sleeve 44, to achieve a seal.

[0051] Step 2: The workpiece spindle 10 is started, driving the hemispherical resonator 11 to rotate at a constant speed (the speed is set according to the different characteristics of the polishing fluid, which can be 5-20 rpm); at the same time, the hydraulic power unit 6 is started, and the hydraulic station 61 delivers hydraulic oil to hydraulic cylinders A 62 and B 63 through the oil pump. Hydraulic cylinders A 62 and B 63 reciprocate alternately, pushing the polishing fluid in the abrasive cylinder into the constrained flow channel and forming a constrained flow field (that is, hydraulic cylinder A 62 pushes the piston of abrasive cylinder A 7 forward, and hydraulic cylinder B 63 pulls the piston of abrasive cylinder B 8 backward). The polishing fluid in abrasive cylinder A 7 flows through the constraint channel of the force-rheology constraint module 4 and enters abrasive cylinder B 8. Then (at intervals of 10-20 seconds), hydraulic cylinder B 63 pushes the piston of abrasive cylinder B 8 forward, and hydraulic cylinder A 62 pulls the piston of abrasive cylinder A 7 backward, so that the polishing fluid in abrasive cylinder B 8 flows through the constraint channel of the force-rheology constraint module 4 and enters abrasive cylinder A 7. This process is repeated to polish the hemispherical resonator 11. The polishing time is T1 (set according to the initial surface quality of the hemispherical resonator, T1 can be 1-3h).

[0052] Step 3: After polishing, remove the moving mold sleeve 44, start the linear moving platform 2, so that the hemispherical harmonic oscillator 11 is separated from the force rheological constraint module 4 and moved to the cleaning and drying device 3 for cleaning and drying. The cleaning and drying time is T2 (to achieve the purpose of cleaning and drying the hemispherical harmonic oscillator, T2 can be 4-8 min, of which the cleaning time can be 3-5 min and the drying time can be 1-3 min).

[0053] Step 4: After cleaning and drying, move the hemispherical harmonic oscillator 11 to the in-situ detection device 5; acquire the circumferential multi-point vibration frequency of the hemispherical harmonic oscillator 11 using the streak camera 51, and based on the streak camera multi-point measurement technology, reconstruct the four-antinode working mode shape by fitting the data, thereby obtaining the unbalanced mass, unbalanced position, and frequency difference of the hemispherical harmonic oscillator 11, and then calculate using the following formula: Calculate the leveling time t; where, For unbalanced mass, This is the Preston coefficient, under certain processing conditions. Where p is a constant, p is the polishing pressure, and v is the polishing speed;

[0054] Step 5: Move the hemispherical resonator 11 again and assemble it into the force rheology constraint module 4, and align its unbalanced position with the constraint flow channel; start the hydraulic power unit 6 to polish and level the hemispherical resonator 11 (at this time, the workpiece spindle 10 does not rotate), and the leveling time is t.

[0055] Step 6: Repeat steps 3 to 5 until the surface quality of the hemispherical resonator 11 meets the requirements (i.e., the frequency difference in step 4 meets the set requirements, for example, less than 0.1 Hz).

[0056] The foregoing general description of the invention and its specific embodiments should not be construed as a limitation on the technical solution of the invention. Those skilled in the art, based on the disclosure of this application, can add, reduce, or combine the disclosed technical features in the foregoing general description and / or specific embodiments (including examples) without departing from the constituent elements of the invention, to form other technical solutions within the scope of protection of this application.

Claims

1. A hemispherical resonator confined flow field force rheo-polishing-levelling apparatus, characterized in that: The machine tool (1) is provided with a linear moving platform (2), a cleaning and drying device (3), a force flow variation constraint module (4), an in-situ detection device (5) and a hydraulic power device (6); the linear moving platform (2) is used for adjusting the position of the hemispherical resonator (11); the cleaning and drying device (3) is used for cleaning and drying the hemispherical resonator (11) after polishing; the in-situ detection device (5) is used for detecting the unbalanced mass and unbalanced position of the surface of the hemispherical resonator (11) after polishing; the force flow variation constraint module (4) is used for polishing the hemispherical resonator (11) and comprises a base plate (41) and a fixed mold core (42) arranged on the base plate (41), the end of the fixed mold core (42) is matched with the inner spherical surface structure of the hemispherical resonator (11); the outer part of the fixed mold core (42) is sleeved with a fixed mold sleeve (43), one end of the fixed mold sleeve (43) is fixed on the base plate (41), and the other end is connected with a movable mold sleeve (44); the outer wall of the fixed mold core (42) is symmetrically provided with an A groove (4201) on both sides, and correspondingly, the inner wall of the fixed mold sleeve (43) is provided with a B groove (4301) matched with the A groove (4201), so that two constraint flow channels are formed between the fixed mold core (42) and the fixed mold sleeve (43); the inner wall of the movable mold sleeve (44) is provided with an arc-shaped groove (4401) for communicating the two constraint flow channels, and the arc-shaped groove (4401) is matched with the outer spherical surface structure of the hemispherical resonator (11); the base plate (41) is provided with two through holes (4101) respectively communicating with the two constraint flow channels; the two through holes (4101) are connected with an A abrasive cylinder (7) and a B abrasive cylinder (8) through pipelines (9); the in-situ detection device (5) comprises a stripe camera (51) for acquiring the circumferential multi-point vibration frequency of the hemispherical resonator; the hydraulic power device (6) comprises a hydraulic station (61), an A hydraulic cylinder (62) and a B hydraulic cylinder (63) connected with the hydraulic station (61); the A hydraulic cylinder (62) and the B hydraulic cylinder (63) are connected with the pistons of the A abrasive cylinder (7) and the B abrasive cylinder (8) respectively; the linear moving platform (2) is provided with a workpiece spindle (10) for clamping and driving the hemispherical resonator (11) to rotate; the A hydraulic cylinder (62) and the B hydraulic cylinder (63) are connected with the hydraulic station (61) alternately; the oil inlet of the A hydraulic cylinder (62) and the oil outlet of the B hydraulic cylinder (63) are connected, and then connected to the oil inlet of the hydraulic station (61); the oil outlet of the A hydraulic cylinder (62) and the oil inlet of the B hydraulic cylinder (63) are connected, and then connected to the oil outlet of the hydraulic station (61).

2. The hemispherical resonator confined flow field force rheo-polishing-levelling apparatus of claim 1, wherein: The cleaning and drying device (3) comprises a water gun (31) and an air gun (32); the water gun (31) is used for flushing the polishing liquid adhered to the surface of the hemispherical resonator (11), and the air gun (32) is used for blowing the water stains remaining on the surface of the hemispherical resonator (11) after cleaning.

3. The hemispherical resonator confined streaming field force rheo-polishing-levelling apparatus of claim 1, wherein: The movable die sleeve (44) comprises a first movable die sleeve (441) and a second movable die sleeve (442) which are detachably connected; the first movable die sleeve (441) is sleeved on the end of the fixed die sleeve (43); and the arc-shaped groove (4401) is arranged on the second movable die sleeve (442).

4. The hemispherical resonator confined streaming field force rheo-polishing-levelling apparatus of claim 1, wherein: The linear moving platform (2) is a cross slide of a lead screw, comprising an X lead screw slide (21) and a Y lead screw slide (22); the Y lead screw slide (22) is fixed on the machine tool (1); and the workpiece spindle (10) is fixed on the X lead screw slide (21).

5. The method is characterized in that the method is implemented by using the hemispherical resonator confined flow field force rheological polishing and leveling device of claim 1, and comprises the following steps: Step one, prepare non-Newtonian fluid polishing liquid with shear rheological effect and store it in A abrasive cylinder (7) and B abrasive cylinder (8); install the hemispherical resonator (11) on the workpiece spindle (10), then move the hemispherical resonator (11) to the force rheological confinement module (4) and put it into the force rheological confinement module (4); Step two, start the workpiece spindle (10) to drive the hemispherical resonator (11) to rotate; at the same time, start the hydraulic power device (6), and the A hydraulic cylinder (62) and the B hydraulic cylinder (63) reciprocate to push the polishing liquid in the abrasive cylinder into the confined flow channel to form a confined flow field to polish the hemispherical resonator (11), and the polishing time is T1; Step three, after polishing, remove the hemispherical resonator (11) from the force rheological confinement module (4) and move it to the cleaning and drying device (3) for cleaning and drying, and the time is T2; Step four, after cleaning and drying, the hemispherical resonator (11) is moved to the in-place detection device (5); through the in-place detection device (5) detects the unbalanced mass and unbalanced position of the hemispherical resonator (11) surface, and calculates the leveling time t through the formula: , wherein, is the unbalanced mass, is the Preston coefficient, under certain processing conditions, is a constant, p is the polishing pressure, v is the polishing speed; Step five, move the hemispherical resonator (11) and put it into the force rheological confinement module (4) to align the unbalanced position of the hemispherical resonator (11) with the confined flow channel; start the hydraulic power device (6) to polish and level the hemispherical resonator (11), and the leveling time is t; Step six, repeat steps three to five until the surface quality of the hemispherical resonator (11) meets the set requirements.

6. The hemispherical resonator confined streaming field force rheo-polishing-levelling method according to claim 5, wherein: The non-Newtonian fluid polishing liquid comprises base liquid, abrasive particles and chemical additives; the abrasive particles are a mixture of one or more of cerium oxide, diamond, aluminum oxide and silicon oxide, and the proportion is 10-20wt%; the chemical additives are dispersants, PH adjusters, oxidizing agents or chemical active agents, and the proportion is 3-5wt%.

7. The hemispherical resonator confined streaming field force rheo-polishing-levelling method according to claim 5, wherein: In step one, when assembling the hemispherical resonator (11), first remove the movable die sleeve (44), then put the hemispherical resonator (11) into the end of the fixed die core (42) with a small gap between them, then reinstall the movable die sleeve (44) to close the force rheological confinement module (4) and complete the assembly.

8. The hemispherical resonator confined streaming field force rheo-polishing-levelling method according to claim 5, wherein: In step three, the flow rate of the polishing liquid is 4.5-20L / min.

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