Circuit board and electronic device

Abstract

The embodiment of the application provides a circuit board and electronic equipment, and relates to the technical field of electronics, wherein the circuit board comprises a substrate, a cable and a driving element; the two ends of the cable are arranged at intervals, and the two ends of the cable are connected with the substrate respectively; the driving element is connected with the cable, and the driving element is used for pulling the cable to make the cable tensioned. The circuit board has the characteristics that the deformation amount of the substrate is small under the impact force.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to a circuit board and an electronic device. Background Technology

[0002] When electronic devices are used, the circuit board can deform if the device is dropped or impacted. If the deformation is significant, the solder joints between the components soldered onto the board substrate are prone to cracking, which can cause the electronic device to malfunction. Summary of the Invention

[0003] This application provides a circuit board and an electronic device to reduce the deformation of the circuit board in the event of a drop or impact to the electronic device. Furthermore, this application also provides a circuit board protection method and a circuit board protection device.

[0004] In a first aspect, embodiments of this application provide a circuit board.

[0005] The circuit board provided in this application embodiment includes: a substrate, a cable, and a driving element; the two ends of the cable are spaced apart and are respectively connected to the substrate; the driving element is connected to the cable and is used to pull the cable to make the cable taut.

[0006] Optionally, the circuit board further includes a pull wire; one end of the pull wire is connected to the cable, and the other end is connected to the driving element, the driving element being used to pull the pull wire to pull the cable.

[0007] Optionally, the drive element includes a rotor and a shaft, the shaft being connected to the rotor, and the end of the pull wire away from the cable being wound around the shaft.

[0008] Optionally, the cable is disposed on the side of the substrate used for mounting components.

[0009] Optionally, the substrate has a component soldering area, and at least a portion of the cables are laid in the component soldering area.

[0010] Optionally, a mechanical stress-sensitive device is welded to the component welding area, and the cable is wound around the periphery of the mechanical stress-sensitive device.

[0011] Optionally, the substrate is provided with a plurality of wiring clips along the extension direction of the cable, and the cable is respectively engaged with each of the wiring clips.

[0012] Optionally, the substrate is provided with a first electrical connector and a second electrical connector, and the two ends of the cable are respectively provided with a first electrical connector and a second electrical connector, the first electrical connector being connected to the first electrical connector and the second electrical connector being connected to the second electrical connector.

[0013] Optionally, the cable is an RF coaxial cable.

[0014] Optionally, the driving element is a vibration motor.

[0015] Secondly, embodiments of this application provide an electronic device.

[0016] The electronic devices provided in this application include any type of circuit board provided in this application.

[0017] Optionally, the electronic device is equipped with a state detection device, which is used to detect whether the impact force on the electronic device exceeds a threshold.

[0018] Thirdly, embodiments of this application provide a circuit board protection method.

[0019] The circuit board protection method provided in this application embodiment can be applied to any electronic device provided in this application embodiment. The circuit board protection method includes: determining whether the impact force received by the electronic device is greater than a threshold; and when the impact force received by the electronic device is greater than the threshold, controlling the driving element to work to tension the cable.

[0020] Optionally, the electronic device is equipped with an acceleration sensor; determining whether the impact force on the electronic device is greater than a threshold includes: determining whether the impact force on the electronic device is greater than a threshold based on data acquired by the acceleration sensor.

[0021] Fourthly, embodiments of this application provide a circuit board protection device.

[0022] The circuit board protection device provided in this application embodiment is applied to any electronic device provided in this application embodiment. The circuit board protection device includes: a status detection module, used to determine whether the impact force received by the electronic device is greater than a threshold; and a control module, used to control the driving element to work to tension the cable when the impact force received by the electronic device is greater than the threshold.

[0023] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects:

[0024] In the embodiments of this application, in the event of a drop or impact to the electronic device, the driving element can tension the cable by pulling it. This tensioned cable can then apply a buffering force to the substrate in the opposite direction of substrate deformation, thereby reducing the amount of substrate deformation. Because the amount of substrate deformation is small, the solder joints between the components and the substrate are unlikely to crack. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of a circuit board provided in an embodiment of this application;

[0027] Figure 2 A schematic diagram illustrating a circuit board in a drop state, as provided in an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of a circuit board in a drop state in related technologies;

[0029] Figure 4 A schematic diagram of another circuit board provided in an embodiment of this application;

[0030] Figure 5 A schematic diagram of a cable and a pull wire provided in an embodiment of this application;

[0031] Figure 6 A schematic diagram of a cable and a pull wire provided in an embodiment of this application;

[0032] Figure 7 A flowchart illustrating a circuit board protection method provided in this application embodiment;

[0033] Figure 8 This is a schematic diagram of a circuit board protection device provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100 - Circuit board; 110 - Substrate; 111 - Component soldering area; 112 - First electrical connector; 113 - Second electrical connector; 114 - Component; 120 - Cable; 121 - Outer layer; 122 - Wire; 123 - Dielectric insulation layer; 124 - Metal shielding layer; 125 - First electrical connector; 126 - Second electrical connector; 130 - Pull wire; 140 - Drive element; 141 - Shaft; 150 - Wiring clip;

[0036] 300 - Circuit board protection device; 310 - Status detection module; 320 - Control module;

[0037] 410 - Substrate; 414 - Components. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] Furthermore, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application specification may have been selected by the applicant at his or her own discretion, and their detailed meanings are explained in the relevant sections of this description.

[0041] Furthermore, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0042] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0043] This application provides a circuit board in an embodiment. (See reference...) Figure 1 and Figure 4The circuit board 100 provided in this embodiment includes a substrate 110, a cable 120, and a driving element 140. The two ends of the cable 120 are spaced apart, and the two ends of the cable 120 are respectively connected to the substrate 110. The driving element 140 is connected to the cable 120 and is used to pull the cable 120 to make the cable 120 taut.

[0044] refer to Figure 2 In the event of a drop or impact to the electronic device, the drive element 140 can tension the cable 120 by pulling it. This tensioned cable 120 can then apply a buffering force to the substrate 110 in the opposite direction of deformation, thereby reducing the amount of deformation of the substrate 110. Because the deformation of the substrate 110 is small, the solder joints between the component 114 and the substrate 110 are unlikely to crack.

[0045] To facilitate a more intuitive understanding by those skilled in the art of the technical effects of the solutions provided in the embodiments of this application, reference is made to... Figure 3 Without the cable 120, the substrate 410 deforms when the electronic device is dropped or impacted. Due to the lack of a solution to limit the deformation of the substrate 410, the deformation of the substrate 410 of the circuit board is relatively large. Since the components 414 soldered to the substrate 410 do not deform much, the solder joints between the components 414 and the substrate 410 are prone to cracking.

[0046] Therefore, the solution provided in this application can reduce the deformation of the circuit board when the electronic device is dropped or impacted, and can improve the problem that the solder joints between the component 114 and the substrate 110 may crack when the electronic device is dropped or impacted.

[0047] Furthermore, it should be noted that in related technologies, i.e., when no cables are installed on the circuit board, to prevent solder joint cracking due to impact on electronic devices, simulation experiments are generally used to determine the high mechanical stress areas on the circuit board under impact conditions. Then, by rationally arranging components, mechanical stress-sensitive devices are staggered from these high mechanical stress areas. Since mechanical stress-sensitive devices need to avoid high mechanical stress areas during circuit board routing, this increases the difficulty of circuit board layout and routing.

[0048] However, by using the solution provided in this application embodiment, a buffering force opposite to the deformation direction of the substrate 110 can be applied to the substrate 110 using the tensioned cable 120, thereby reducing the deformation of the circuit board 100. Thus, the solution in this application embodiment can reduce the difficulty of circuit board layout and routing.

[0049] refer to Figure 4 In some embodiments, the circuit board 100 further includes a pull wire 130. One end of the pull wire 130 is connected to the cable 120, and the other end is connected to a drive element 140. The drive element 140 is used to pull the pull wire 130 to pull the cable 120. In other words, the drive element 140 is indirectly connected to the cable 120 through the pull wire 130. Thus, the drive element 140 can transmit force to the cable 120 by pulling the pull wire 130, thereby tensioning the cable 120.

[0050] It should be noted that the number of cables 120 can be flexibly set according to actual needs. For example, the driving element 140 can be a telescopic actuator. In this way, the telescopic actuator can be used to move the end of the pull wire 130 away from the cable 120, thereby tensioning the cable 120. The driving element 140 can also be a rotary actuator. In this way, the rotary actuator can be used to wind the pull wire 130 around the shaft of the rotary actuator, thus tensioning the cable 120. It should also be noted that the tension of the cable 120 can be greater than or equal to a preset threshold. The range of the preset threshold value can be determined experimentally based on the shape of the substrate 110 and the arrangement of the components.

[0051] refer to Figure 4 In some embodiments, the drive element 140 may be mounted on the substrate 110. In some embodiments, the drive element 140 includes a rotor and a shaft 141. The shaft 141 is connected to the rotor, and the end of the pull wire 130 away from the cable 120 is wound around the shaft 141. Thus, when the shaft 141 of the drive element 140 rotates, the pull wire 130 can be wound around the shaft 141, thereby allowing the pull wire 130 to pull the cable 120, thereby generating tension in the cable 120.

[0052] It should be noted that in other embodiments, the driving element 140 is a telescopic actuator, and the telescopic shaft of the telescopic actuator is directly connected to one end of the cable 120. Therefore, when the telescopic shaft moves, the cable segment between the end of the cable 120 facing away from the telescopic shaft and the telescopic shaft can be kept taut. In this way, in the event of a drop or impact to the electronic device, a buffering force opposite to the deformation direction of the substrate 110 can be applied to the substrate 110 by tautening the cable 120, thereby reducing the deformation of the substrate 110. Furthermore, when the driving element 140 is a rotary actuator, the rotating shaft of the rotary actuator can also be directly connected to one end of the cable 120, thereby allowing the rotary actuator to directly pull the cable 120. Therefore, in the embodiments of this application, the pull wire 130 may not be provided, and the cable 120 can be directly pulled by the driving element 140 to tighten the cable 120.

[0053] In some embodiments, cable 120 is an RF coaxial cable. (See reference) Figure 5 and Figure 6 When cable 120 is an RF coaxial cable, pull wire 130 can be connected to the outer layer 121 of the RF coaxial cable. It should be noted that the RF coaxial cable generally includes a conductor 122, a dielectric insulating layer 123, a metal shielding layer 124, and an outer layer 121. The conductor 122 serves to conduct electrical signals. The dielectric insulating layer 123 covers the conductor 122, the metal shielding layer 124 covers the dielectric insulating layer 123, and the outer layer 121 covers the metal shielding layer 124. For example, the outer layer 121 can be an insulating plastic layer, and the pull wire 130 can be an insulating plastic wire, which can be connected to the insulating plastic layer.

[0054] For example, the radio frequency coaxial cable can be used to transmit signals such as Wi-Fi (Wireless Fidelity), 4G (4th Generation Mobile Communication Technology), and 5G (5th Generation Mobile Communication Technology). This allows the use of the radio frequency coaxial cable already integrated into the electronic device, eliminating the need for additional cabling on the circuit board 100. Therefore, the technical problem addressed by this application can be solved with minimal additional components.

[0055] It should also be noted that in other embodiments, if the electronic device does not include an RF coaxial cable, other wires connected to the substrate 110 can be used as cables. Alternatively, other wires can be added to serve as cables.

[0056] refer to Figure 2 In some embodiments, the cable 120 is disposed on the side of the substrate 110 where the components 114 are arranged. It should be noted that the substrate 110 of the circuit board 100 has two sides. Generally speaking, the side of the substrate 110 where the components are arranged can be referred to as the front side, and the other side of the substrate 110 can be referred to as the back side.

[0057] It should be noted that, generally, the side of the substrate 110 facing away from the component 114 is typically supported by a circuit board mounting base. Therefore, the substrate 110 generally does not deform in the direction facing away from the component 114. For example, when the electronic device with the circuit board 100 configured is a mobile phone and the circuit board 100 is a motherboard, the electronic device includes a frame with a motherboard mounting portion. The motherboard is supported on and connected to the motherboard mounting portion. Thus, in the event of a drop, the motherboard mounting portion can apply a supporting force to the substrate 110 of the circuit board 100 to prevent the substrate 110 from deforming in the direction facing away from the component 114. If the substrate 110 deforms in the direction facing the component 114, the tensioned cable 120 can apply a buffering force to the substrate 110 in the opposite direction of deformation to reduce the amount of deformation of the substrate 110.

[0058] refer to Figure 4 In some embodiments, the substrate 110 is provided with a component soldering area 111, and at least a portion of the cables 120 are laid in the component soldering area 111. In this way, by laying the cables 120 in the component soldering area 111, the possibility of cracking of the solder joints located in the component soldering area 111 is further reduced when the electronic device is subjected to impact.

[0059] It is understandable that when electronic devices are subjected to impact, the deformation is greater closer to the center of the substrate 110. Therefore, to mitigate the problem of excessive deformation near the center of the substrate 110, the cable 120 can be positioned as close to the center of the substrate 110 as possible. Furthermore, exemplarily, a mechanical stress-sensitive device is soldered to the component soldering area 111, and the cable 120 can be wrapped around the periphery of the mechanical stress-sensitive device to reduce the deformation of the substrate 110 in the area where the mechanical stress-sensitive device is located. It should be noted that a mechanical stress-sensitive device refers to a device that is prone to solder joint cracking with the substrate 110 under external impact. Exemplarily, the type of device that is a mechanical stress-sensitive device can be determined experimentally. For example, various devices are soldered to the substrate; an impact force is applied to the substrate, and the solder joint cracking of each device is statistically analyzed; devices with a solder joint cracking rate greater than a preset value are identified as mechanical stress-sensitive devices.

[0060] In some embodiments, the substrate 110 is provided with a plurality of wiring clips 150 along the extension direction of the cable 120. The cable 120 is respectively engaged with each wiring clip 150. In this way, the wiring flexibility of the cable 120 can be improved by limiting the cable 120 by the wiring clips 150.

[0061] refer to Figure 1In some embodiments, the substrate 110 is provided with a first electrical connector 112 and a second electrical connector 113. The two ends of the cable 120 are respectively provided with a first electrical connector 125 and a second electrical connector 126. The first electrical connector 125 is connected to the first electrical connector 112, and the second electrical connector 126 is connected to the second electrical connector 113. Exemplarily, the first electrical connector 125 is snapped into the first electrical connector 112, and the second electrical connector 126 is snapped into the second electrical connector 113. This snap-fit ​​connection between the electrical connectors and the electrical connectors reduces the difficulty of connecting the cable 120 to the substrate 110 and improves the convenience of replacing the cable 120. Furthermore, in other embodiments, both ends of the cable 120 may also be soldered to the substrate 110.

[0062] In some embodiments, the driving element 140 is a vibration motor. Where the circuit board 100 includes a pull wire 130, the power output shaft of the vibration motor can be connected to the pull wire 130, and the pull wire 130 can be connected to the cable 120. It should be noted that the vibration motor is used to generate vibration feedback during the use of the electronic device. Thus, the vibration motor built into the electronic device can be used to pull the cable 120, thereby tensioning the cable 120. Therefore, there is no need to separately provide a driving element for pulling the cable 120, and the technical problem to be solved in this application can be solved with minimal addition of components. It should also be noted that in other embodiments, if the electronic device does not include a vibration motor, other driving elements built into the electronic device can be used to pull the cable 120. Alternatively, other driving elements can be added independently.

[0063] This application provides an electronic device. The electronic device provided in this application includes any of the circuit boards 100 provided in this application.

[0064] In some embodiments, the electronic device is provided with a state detection device, which can be used to detect whether the impact force on the electronic device exceeds a threshold. Therefore, if the impact force on the electronic device exceeds the threshold, the drive element 140 can be controlled to operate to tension the cable 120. Exemplarily, the state detection device can be an acceleration sensor. For example, if the rate of change of acceleration of the electronic device exceeds a preset value, the impact force on the electronic device can be considered to exceed the threshold.

[0065] For example, the electronic device is a mobile phone, tablet computer, laptop computer, etc. The circuit board 100 can be the motherboard of the electronic device. The electronic device may also include a central processing unit (CPU), which is electrically connected to the electronic device's status detection device, driving element 140, etc. Thus, the CPU can receive signals from the status detection device and control the operating state of the driving element 140. For example, in the event of an impact or drop on the electronic device, the impact force received exceeds a threshold. In other words, the threshold can be determined by conducting an impact test or drop test on the electronic device.

[0066] In this way, in the event of a drop or impact to the electronic device, the drive element 140 can tension the cable 120 by pulling it. Thus, the tensioned cable 120 can apply a buffering force to the substrate 110 in the opposite direction of deformation, thereby reducing the amount of deformation of the substrate 110. Because the deformation of the substrate 110 is small, the solder joints between the component 114 and the substrate 110 will essentially not crack.

[0067] This application provides a circuit board protection method, applicable to any of the electronic devices described in this application. (Reference) Figure 7 The circuit board protection method provided in this application includes:

[0068] Step 210: Determine whether the impact force on the electronic device is greater than the threshold.

[0069] For example, when an electronic device is equipped with an acceleration sensor, determining whether the impact force experienced by the electronic device exceeds a threshold includes: determining whether the impact force experienced by the electronic device exceeds a threshold based on data acquired by the acceleration sensor. For instance, if the rate of change of acceleration of the electronic device exceeds a preset value, the impact force experienced by the electronic device can be considered to exceed the threshold.

[0070] Step 220: When the impact force on the electronic device is greater than the threshold, the control drive element 140 is activated to tension the cable 120.

[0071] In this way, in the event of a drop or impact to the electronic device, the drive element 140 can tension the cable 120 by pulling it. Thus, the tensioned cable 120 can apply a buffering force to the substrate 110 in the opposite direction of deformation, thereby reducing the amount of deformation of the substrate 110. Because the deformation of the substrate 110 is small, the solder joints between the component 114 and the substrate 110 will essentially not crack.

[0072] This application provides a circuit board protection device, applicable to any of the electronic devices described in this application. (Reference) Figure 8 The circuit board protection device 300 provided in this application embodiment includes a status detection module 310 and a control module 320. The status detection module 310 is used to determine whether the impact force received by the electronic device exceeds a threshold. The control module 320 is used to control the drive element 140 to operate to tension the cable 120 when the impact force received by the electronic device exceeds the threshold.

[0073] In this way, in the event of a drop or impact to the electronic device, the drive element 140 can tension the cable 120 by pulling it. Thus, the tensioned cable 120 can apply a buffering force to the substrate 110 in the opposite direction of deformation, thereby reducing the amount of deformation of the substrate 110. Because the deformation of the substrate 110 is small, the solder joints between the component 114 and the substrate 110 will essentially not crack.

[0074] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0075] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board (100), characterized in that, include: Substrate (110), cable (120) and drive element (140); The two ends of the cable (120) are spaced apart, and the two ends of the cable (120) are respectively connected to the substrate (110). The driving element (140) is connected to the cable (120) and is used to pull the cable (120) to make the cable (120) taut. The cable (120) is an RF coaxial cable. The driving element (140) is a vibration motor.

2. The circuit board (100) according to claim 1, characterized in that, The circuit board (100) also includes a pull wire (130); one end of the pull wire (130) is connected to the cable (120), and the other end is connected to the driving element (140). The driving element (140) is used to pull the pull wire (130) to pull the cable (120).

3. The circuit board (100) according to claim 2, characterized in that, The drive element (140) includes a rotor and a shaft (141) connected to the rotor, and the end of the pull wire (130) away from the cable (120) is wound around the shaft (141).

4. The circuit board (100) according to claim 1, characterized in that, The cable (120) is disposed on the side of the substrate (110) where components are arranged.

5. The circuit board (100) according to claim 4, characterized in that, The substrate (110) is provided with a component soldering area (111), and at least a portion of the cable (120) is arranged in the component soldering area (111).

6. The circuit board (100) according to claim 5, characterized in that, The component welding area (111) is welded with a mechanical stress sensitive device, and the cable (120) is wound around the periphery of the mechanical stress sensitive device.

7. The circuit board (100) according to claim 1, characterized in that, The substrate (110) is provided with a plurality of wiring clips (150) along the extension direction of the cable (120), and the cable (120) is respectively engaged with each of the wiring clips (150).

8. The circuit board (100) according to claim 1, characterized in that, The substrate (110) is provided with a first electrical connector (112) and a second electrical connector (113). The two ends of the cable (120) are respectively provided with a first electrical connector (125) and a second electrical connector (126). The first electrical connector (125) is connected to the first electrical connector (112), and the second electrical connector (126) is connected to the second electrical connector (113).

9. An electronic device, characterized in that, Includes the circuit board (100) as described in any one of claims 1 to 8.

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