Radiator with projecting pin and method of manufacture

Abstract

A heat sink (1), a light emitting diode (LED) module (200) and a corresponding method of manufacturing are described. The heat sink (1) comprises an electrically conductive heat sink core (101) and an electrically insulating layer (2) covering at least a first surface of the electrically conductive heat sink core (101). The electrically conductive heat sink core (101) has a first pin (3) which is integral with the electrically conductive heat sink core (101) and which protrudes from the first surface of the heat sink core (101). At least the first surface of the heat sink core (101) is covered by the electrically insulating layer (2) which leaves at least part of a side surface (5) of the first pin (5) exposed from the electrically insulating layer (2).

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. nonprovisional patent application number 63 / 190,536, filed May 19, 2021, the contents of which are incorporated herein by reference. Background Technology

[0003] Due to their superior technical characteristics, such as energy efficiency and lifespan, light-emitting diodes (LEDs) are increasingly replacing older light sources. This is also true for applications with demanding requirements, such as brightness, luminous intensity, and / or beam shaping (e.g., vehicle headlights). However, despite their high energy efficiency, LEDs, especially high-power LEDs, can still generate a significant amount of heat, which may require cooling (typically achieved by connecting the LED to a heatsink) to keep the LED's junction temperature low. Such heatsinks are frequently used in many other high-power semiconductor components. Summary of the Invention

[0004] A heat sink, a light-emitting diode (LED) module, and a corresponding manufacturing method are described. The heat sink includes a conductive heat sink core and an electrically insulating layer covering at least a first surface of the conductive heat sink core. The conductive heat sink core has a first pin integral with the conductive heat sink core and protruding from the first surface of the heat sink core. The first surface covering at least the heat sink core is covered by the electrically insulating layer, such that at least a portion of the side surface of the first pin is exposed from the electrically insulating layer. Attached Figure Description

[0005] A more detailed understanding can be obtained from the following description, which is given with reference to the accompanying drawings and examples, in which:

[0006] Figure 1 This is a schematic perspective view of an LED module with a heat sink;

[0007] Figure 2 yes Figure 1 A schematic perspective view of an LED module with a reflector added;

[0008] Figure 3 It is a schematic cross-sectional view of the heat sink at various stages of the manufacturing process;

[0009] Figure 4 yes Figure 3 A flowchart of an exemplary method;

[0010] Figure 5 A diagram of an exemplary vehicle headlight system; and

[0011] Figure 6 This is a diagram of another exemplary vehicle headlight system. Detailed Implementation

[0012] Examples of different light illumination systems and / or light-emitting diodes (“LEDs”) implementations will be described more fully below with reference to the accompanying drawings. These examples are not mutually exclusive, and features found in one example may be combined with features found in one or more other examples to achieve additional implementations. Therefore, it should be understood that the examples shown in the drawings are provided for illustrative purposes only and are not intended to limit this disclosure in any way. Similar figures refer to similar elements throughout the text.

[0013] It should be understood that although the terms first, second, third, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. For example, without departing from the scope of the invention, a first element may be referred to as a second element and a second element may be referred to as a first element. As used herein, the term "and / or" may include any and all combinations of one or more of the associated listed items.

[0014] It should be understood that when an element such as a layer, region, or substrate is referred to as being "on" or extending "on" another element, it may be directly on or directly extending to the other element, or there may be intermediate elements present. Conversely, when an element is referred to as "directly on" or "directly extending to" another element, there may be no intermediate elements present. It should also be understood that when an element is referred to as "connected" or "coupled" to another element, it may be directly connected or coupled to the other element and / or connected or coupled to the other element via one or more intermediate elements. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intermediate elements between that element and the other element. It should be understood that these terms are intended to cover different orientations of elements, in addition to any orientations depicted in the figures.

[0015] Relative terms such as “below,” “above,” “upper,” “lower,” “horizontal,” or “vertical” may be used herein to describe the relationship between one element, layer, or region and another element, layer, or region as shown in the figure. It should be understood that these terms are intended to cover different orientations of the device other than those depicted in the figure.

[0016] Halogen lamps have been the default light source for car headlights for many years. However, recent advancements in LED technology, along with the resulting new design possibilities and energy efficiency, have sparked interest in finding legal LED-based alternatives to halogen lamps—the so-called LED retrofit. These LED retrofits have been available for several years and are a popular aftermarket replacement for halogen headlights. However, almost all of these retrofits do not meet legal requirements and are therefore not permitted on the road.

[0017] Generally speaking, LEDs or semiconductor components are vulnerable devices that need protection not only from mechanical damage, but also from strong electric fields, and more specifically, from electrostatic discharge (“ESD”) that occurs through or near them. Therefore, such ESD events should be avoided or at least mitigated, for example, by anticipating grounding elements near the LED.

[0018] Static charge can accumulate near an LED for various reasons. For example, there may be non-conductive materials nearby. However, if static charge can accumulate on conductive elements, for example because the conductive elements are insulated from a defined potential (particularly from ground potential), then the conductive elements may also be problematic. In the case of LEDs, the latter can be applied, for example, to optical components that process the light emitted by the LED during operation. For example, there may be LED modules that need to be connected to a reflector near the LED. The reflector may have a reflective surface facing the LED, which is typically made of a conductive metal layer applied to a non-conductive plastic body, thereby insulating the metal layer from a defined potential (particularly from ground potential).

[0019] ESD incidents can also be caused by heat sinks connected to LEDs for thermal management. This can happen even when metal heat sinks are used for reasons of good thermal conductivity, and metals are, of course, good electrical conductors. Aluminum heat sinks can be anodized, meaning their surfaces are oxidized to increase their surface emissivity, thereby increasing radiative heat transfer from the heat sink to the environment. However, the anodized layer, such as oxides, can be an electrical insulator and therefore prevent electrical contact between the aluminum core of the heat sink and components mounted to it, such as optical components (e.g., reflectors) or electronic components (e.g., printed circuit boards (PCBs) that power the LEDs). More harmfully, such insulating layers themselves can accumulate electrostatic charges.

[0020] One approach to mitigating ESD problems, such as those described above, is to ground the metal heatsink core and expose this grounding potential at the insulating surface layer of the heatsink by using a metal screw as a fastener and making the screw electrically contact the metal core. Such a scheme is described, for example, in U.S. Patent No. 7,837,354, which is incorporated herein by reference. The grounded screw head can then dissipate nearby electrostatic charges. However, this approach requires a special screw with teeth on the back of the screw head that scrape through the insulating surface layer into the metal core, or it may require removing the insulating layer at the screw head location.

[0021] Furthermore, many applications do not use screws as fasteners, or they use non-conductive screws, such as plastic screws. In applications using metal screws, for standard screws, the electrical contact achieved by such screws as intermediaries can typically occur only point-by-point to avoid stress during tightening, and the screw diameter can be slightly smaller than the screw hole diameter due to manufacturing tolerances. However, point-by-point contact may have limited conductivity and therefore may not reliably dissipate large electrostatic potentials. Moreover, reliably grounding the metal core of the heat sink itself can be problematic without removing the insulating surface layer in additional manufacturing steps. The embodiments described herein address heat sink-related ESD issues, particularly for LED modules, and generally also for other semiconductor modules, by using elements typically present in heat sinks, such as alignment pins or other pins.

[0022] Figure 1 This is a schematic perspective view of an LED module 200, which includes a heat sink 1, three LEDs 11 electrically coupled to a PCB 20 via a strip joint 12, and a connector 30 mounted to the heat sink 1 via the PCB 20. The heat sink 1 may include protruding pins 3 and 4 that protrude from the top surface (not marked) of the heat sink. Pin 3 can be used to secure the PCB 20 to the heat sink 1, and pin 4 can be used as an alignment element for a reflector 40 to be mounted to the heat sink 1 (see [reference needed]). Figure 2 The surface of the heat sink 1 may be covered by an electrical insulating layer 2, which may also cover the top surfaces of the pins 3 and 4. However, the lateral surfaces (or side surfaces) 5 of the pins 3 and 4 may be at least partially uncovered by the insulating layer 2 to expose the material of the heat sink core to the environment.

[0023] The radiator core can be made of a conductive material, such as aluminum (Al), due to its good thermal properties, light weight, and relatively low cost. The insulating layer 2 with the Al core can be produced by anodizing (oxidizing) the Al surface, which can be used to improve radiative heat transfer to the environment of the radiator. In some embodiments, the radiator can be manufactured from a sheet of metal, which serves as the original shape for manufacturing the radiator 1. In such embodiments, the pins 3 and 4 can be formed from the original shape of the radiator by stamping or deep drawing, as described below. Figure 3 and Figure 4 To describe in more detail. According to one embodiment, while holding the insulating layer 2 at the top surface of the pin, this stamping / deep drawing process can be performed such that, during stamping / drawing, the insulating layer 2 does not follow the increase in the lateral surface area of ​​the pin. Therefore, in a sense, the insulating layer 2 may crack during stamping / deep drawing. This may result in the side surfaces 5 of the pins 3 and 4 not being at least partially covered by the insulating layer 2.

[0024] However, this disclosure does not necessarily involve manufacturing the heat sink from the original shape of a sheet metal, nor does it necessarily involve manufacturing the pin by stamping or deep drawing, and the embodiments described herein can also cover all other manufacturing methods, including, for example, manufacturing a heat sink with protruding pins by die casting. With respect to such other manufacturing methods, where the side surfaces of the pins are covered by the insulating layer of the heat sink, the insulating layer at the side surfaces of the pins may need to be at least partially removed by subsequent machining, such as by grinding, milling, or laser ablation (to name just a few options). Alternatively, exposure of the side pin surfaces can be achieved using masking and layer removal processes such as etching, which at least partially exposes the heat sink core material to the environment.

[0025] Even with such additional manufacturing steps, the embodiments described herein can provide the following advantages: for ESD protection, it relies solely on pins already present in the heat sink (e.g., for fastening and / or alignment reasons), and therefore, additional or special components, such as conductive screws, may not be required.

[0026] Pin 3 can be used to fasten PCB 20 to heat sink 1, for example, by means similar to riveting. For this purpose, pin 3 can have the shape of an upright cylinder, and PCB 20 can have a through hole (not shown) corresponding to pin 3. To mount PCB 20 to heat sink 1, PCB 20 can be placed on heat sink 1 with pin 3 passing through the through hole. The head of pin 3 can deform to contact the upper surface of PCB 20, thereby securing PCB 20 to heat sink 1. When the head deforms, conductive material from the uncovered portion of the side surface 5 of pin 3 can contact the upper surface of PCB 20. Therefore, conductive trace 21 (shown schematically only) on the upper surface of the PCB located below the deformed head of pin 3 can form electrical contact with the conductive core material of the heat sink, connecting the heat sink core to contact 30 in a connector that can be connected to an external ground potential. In this way, the heat sink core can be grounded without additional or special construction elements (e.g., conductive screws).

[0027] The grounding of the heat sink core via connector 30, conductive track 21, and the deformed head of pin 3 can also expose this grounding potential at the uncoated side surfaces 5 of pins 3 and 4, whereby nearby electrostatic charges can discharge via the side surfaces 5 of pins 3 and 4. Therefore, by modifying the existing pins 3 and 4 in this way, the heat sink core can be easily grounded, with such grounding potential carried to the surface of the heat sink by the side surfaces 5 of pins 3 and 4, without any additional or even special components.

[0028] Figure 2 yes Figure 1Another perspective view of the LED module (rotated approximately 90° around an axis perpendicular to the heat sink plane and centered on the heat sink plane), showing reflector 40 mounted to heat sink 1. Reflector 40 can be mounted through PCB 20 and heat sink 1 (see...). Figure 1 The reflector 40 is mounted using fasteners (not shown) through holes 6 in the PCB 20, and the cutout 41 of the reflector 40 is form-fitted to contact the side surface 5 of the pin 4, thereby aligning the reflector 40 with respect to the three LEDs 11. Two strip joints 12 can electrically couple the LEDs 11 to conductive traces (not shown) on the PCB 20 (which are further connected to contacts within the connector 30).

[0029] The reflective surface 42 of the reflector 40 is made of a conductive material (e.g., metal), and this reflective surface 42 extends to and covers the cutout 41, creating conductive contact with the side surface 5 of the pin 4 over the entire contact area of ​​the cutout 41. Thus, the reflective surface 41 can be coupled to the heat sink core with high conductivity. (This is in contrast to the above-mentioned...) Figure 1 Together with the described components, the reflective surface 41 can be grounded via coupling to an external ground lead through the following elements: cutout 41, side surface 5 of pin 4, heat sink core, underside of the deformed head of pin 3, conductive track 21 of PCB 20, and connector 30. This can mitigate the accumulation of electrostatic charge on the reflective surface 41, for example, by polishing reflector 40, and can reduce the jump of such electrostatic charge to LED 11, which could otherwise damage the LED.

[0030] Figure 3 These are schematic cross-sectional views of the radiator at various stages of the manufacturing process. Figure 4 yes Figure 3 A flowchart of an exemplary method.

[0031] A metal plate (402) can be provided. In some embodiments, the metal plate may be an AL plate. The metal plate in this stage of the method... Figure 3 (a) shows metal plate 100. Figure 3 In the middle, a point can represent the continuous extension of the plate in two directions of length (left and right) and thickness (vertical).

[0032] An electrical insulating layer can be formed on a metal plate (404). Figure 3 (b) shows the metal plate after the insulating layer 2 has been formed on it, which may also be referred to as the heat sink core 101. In some embodiments, as described above, this can be accomplished by anodizing the surface of the metal plate 100. However, it can be formed in a variety of ways as described above.

[0033] The first pin can be formed such that at least a portion of the side surface of the first pin is exposed from the electrical insulation layer (406). This can be done, for example, by deep drawing and / or stamping the first pin. Figure 3 (c) shows the first stage of applying a die (not shown) that moves along direction 120 to eventually form the protruding pin 3 by stamping or deep drawing. Figure 3 (c) shows the initial shape 103 of the pin 3. It can be seen that the insulating layer 2 on the head and bottom of the pin can follow a stamping / deep drawing process. However, according to the embodiments described herein, by selecting appropriate process parameters, the insulating layer 2 may become increasingly less conforming to stamping / deep drawing over time on the side surface (the vertical surface in the figure) of the initial protruding pin 103, and therefore may begin to thin. This is in Figure 3 (c) schematically shows the insulating layer 2 forming triangle 102. Continued stamping / deep drawing along direction 120 can eventually leave most of the side surface 5 without the insulating layer 2. This can be achieved... Figure 3 As can be seen in (d), the vertical dashed line indicates that the uncovered portion of the side surface 5 marked by the curly braces has a much larger extension than the remaining portion covered by the remaining portion 102 of the insulating layer 2.

[0034] Since anodizing, especially deep drawing, is often the preferred process step for forming heat sinks from Al metal plates, this manufacturing method can mitigate ESD problems without requiring any additional process steps or using any additional or specialized parts.

[0035] To improve LED 11 and heat sink 1 (see...) Figure 2 Due to the thermal contact of the insulating layer 2, which can have a lower thermal conductivity than the heat sink core, the insulating layer 2 can be removed from beneath the LED 11 (e.g., in the portion of the heat sink 1 that serves as the mounting area for the LED 11). This removal of the insulating layer 2 in the LED mounting area can be performed by any suitable method, such as grinding, milling, or laser ablation.

[0036] This method can also be used with a second pin and / or one or more additional first or second pins. These pins can be used, for example, to attach the circuit board and reflector to and align with the heat sink (e.g., a first pin can be used for one of the circuit board or reflector, while another pin can be used to align and attach the other of the circuit board or reflector to the heat sink). The method can also include mounting the reflector and / or circuit board to the heat sink.

[0037] Figure 5 The figure may include one or more of the exemplary vehicle headlight systems 500 described herein. Figure 5The exemplary vehicle headlight system 500 shown includes a power line 502, a data bus 504, an input filtering and protection module 506, a bus transceiver 508, a sensor module 510, an LED DC-DC (DC / DC) module 512, a logic low dropout (LDO) module 514, a microcontroller 516, and an active headlight 518.

[0038] Power line 502 may have an input for receiving power from the vehicle, and data bus 504 may have inputs / outputs through which data can be exchanged between the vehicle and the vehicle headlight system 500. For example, the vehicle headlight system 500 may receive commands from other locations within the vehicle, such as commands to turn on turn signals or turn on headlights, and, if necessary, the vehicle headlight system 500 may send feedback to other locations within the vehicle. Sensor module 510 may be communicatively coupled to data bus 504 and may provide additional data to the vehicle headlight system 500 or other locations within the vehicle related to, for example, environmental conditions (e.g., time of day, rain, fog, or ambient light levels), vehicle status (e.g., parked, moving, speed, or direction of movement), and the presence / location of other objects (e.g., vehicles or pedestrians). A headlight controller separate from any vehicle controller communicatively coupled to the vehicle data bus may also be included in the vehicle headlight system 500. Figure 5 In this configuration, the headlight controller can be a microcontroller, such as a microcontroller (μc) 516. The microcontroller 516 can be communicatively coupled to the data bus 504.

[0039] The input filtering and protection module 506 can be electrically coupled to the power line 502 and can, for example, support various filters to reduce conducted emissions and provide power immunity. Additionally, the input filtering and protection module 506 can provide electrostatic discharge (ESD) protection, load drop protection, AC field attenuation protection, and / or reverse polarity protection.

[0040] LED DC / DC module 512 can be coupled between input filtering and protection module 506 and active headlight 518 to receive filtered power and provide drive current to power the LEDs in the LED array of active headlight 518. LED DC / DC module 512 may have: an input voltage between 7 volts and 18 volts, with a nominal voltage of approximately 13.2 volts; and an output voltage that may be slightly higher than the maximum voltage of the LED array (e.g., 0.3 volts higher) (this is determined, for example, by operating condition adjustments due to load, temperature, or other factors, as well as factors or local calibration).

[0041] The logic LDO module 514 can be coupled to the input filtering and protection module 506 to receive filtered power. The logic LDO module 514 can also be coupled to the microcontroller 516 and the active headlight 518 to provide power to the electronics (e.g., CMOS logic) in the microcontroller 516 and / or the active headlight 518.

[0042] Bus transceiver 508 may have, for example, a Universal Asynchronous Receiver / Transmitter (UART) or Serial Peripheral Interface (SPI) interface and may be coupled to microcontroller 516. Microcontroller 516 may translate vehicle input based on data from sensor module 510, or may translate vehicle input including data from sensor module 510. The translated vehicle input may include a video signal that can be transmitted to an image buffer in active headlight 518. Furthermore, microcontroller 516 may load a default image frame and test open / short-circuit pixels during startup. In an embodiment, the SPI interface may load the image buffer in CMOS. The image frame may be a full frame, a differential frame, or a partial frame. Other features of microcontroller 516 may include control interface monitoring of CMOS status (including die temperature) and logic LDO outputs. In an embodiment, LED DC / DC outputs may be dynamically controlled to minimize overhead space. In addition to providing image frame data, other headlight functions may be controlled, such as complementary use in conjunction with side indicator lights or turn signals, and / or activation of daytime running lights.

[0043] Figure 6 This is a diagram of another exemplary vehicle headlight system 600. Figure 6 The exemplary vehicle headlight system 600 shown includes: an application platform 602, two LED lighting systems 606 and 608, and auxiliary optics 610 and 612.

[0044] LED lighting system 608 can emit beam 614 (in) Figure 6 (Indicated between arrows 614a and 614b). The LED lighting system 606 can emit a beam 616 (in... Figure 6 (Indicated between arrows 616a and 616b). Figure 6 In the illustrated embodiment, auxiliary optics 610 are adjacent to LED lighting system 608, and light emitted from LED lighting system 608 passes through auxiliary optics 610. Similarly, auxiliary optics 612 are adjacent to LED lighting system 606, and light emitted from LED lighting system 606 passes through auxiliary optics 612. In an alternative embodiment, auxiliary optics 610 / 612 are not provided in the vehicle headlight system.

[0045] When the second optics 610 / 612 are included, the second optics 610 / 612 may be or include one or more light guides. The one or more light guides may be edge-illuminating light guides, or may have internal openings defining internal edges of the light guides. LED lighting systems 608 and 606 may be inserted into the internal openings of one or more light guides, thereby injecting light into the internal edges (internal opening type light guides) or external edges (edge-illuminating type light guides) of the one or more light guides. In embodiments, the one or more light guides may shape the light emitted by LED lighting systems 608 and 606 in a desired manner, such as by giving it a gradient distribution, a sloped distribution, a narrow distribution, a wide distribution, or an angular distribution.

[0046] Application platform 602 can provide power and / or data to LED lighting systems 606 and / or 608 via line 604, which may include Figure 5 One or more of the power lines 502 and data bus 504. One or more sensors (which may be sensors in the vehicle headlight system 600 or other additional sensors) may be inside or outside the housing of the application platform 602. Alternatively or additionally, as in Figure 5 As shown in the exemplary vehicle headlight system 500, each LED lighting system 608 and 606 may include its own sensor module, connectivity and control module, power supply module and / or LED array.

[0047] In an embodiment, the vehicle headlight system 600 may represent a car with a maneuverable beam of light, wherein LEDs can be selectively activated to provide maneuverable light. For example, an array of LEDs or emitters may be used to define or project a shape or pattern, or to illuminate only selected portions of a road. In an exemplary embodiment, infrared camera or detector pixels within the LED lighting systems 606 and 608 may be sensors (e.g., similar to...) that identify portions of a scene that require illumination (e.g., a road or pedestrian crossing). Figure 5 (The sensor in sensor module 510).

[0048] The embodiments have been described in detail, and those skilled in the art will understand that modifications can be made to the embodiments described herein without departing from the spirit of the inventive concept. Therefore, it is not intended to limit the scope of the invention to the specific embodiments shown and described.

Claims

1. A heat sink for an LED module, comprising: a conductive heat sink core comprising a first pin integral with the conductive heat sink core and protruding from a first surface of the heat sink core; and an electrically insulating layer covering at least the first surface of the conductive heat sink core and a top surface of the first pin, and leaving at least part of a side surface of the first pin exposed from the electrically insulating layer, wherein the first pin is configured for mechanical coupling with one of a circuit board or a reflector, wherein the heat sink further comprises a second pin configured for mechanical coupling with the other of the circuit board or the reflector. the second pin is integral with the conductive heat sink core and protrudes from a surface of the heat sink core, and at least part of a side surface of the second pin is exposed from the electrically insulating layer.

2. The heat sink for an LED module according to claim 1, wherein, 3. The heat sink for an LED module of claim 1, further comprising a light emitting diode (LED) mounting area also exposed from the electrically insulating layer.

4. An LED module, comprising: a heat sink comprising: a conductive heat sink core comprising a first pin integral with the conductive heat sink core and protruding from a first surface of the heat sink core, an electrically insulating layer covering at least the first surface of the conductive heat sink core and a top surface of the first pin, and leaving at least part of a side surface of the first pin exposed from the electrically insulating layer, and a light emitting diode (LED) mounting area also exposed from the electrically insulating layer; and an LED mounted on the LED mounting area of the heat sink, a printed circuit board (PCB) having at least a first surface and a second surface opposite the first surface, the PCB comprising conductive traces on at least the first surface of the PCB, wherein the LED module further comprises a second pin integral with the conductive heat sink core and protruding from a surface of the heat sink core, and at least part of a side surface of the second pin is exposed from the electrically insulating layer, wherein a head of the first pin is deformed, and the deformed head of the first pin electrically couples the heat sink core to ground via the at least part of the side surface of the first pin exposed from the electrically insulating layer and one of the conductive traces on at least the first surface of the PCB.

5. The LED module of claim 4, wherein the PCB further comprises: an electrical connector on the first surface of the PCB and electrically coupled to the conductive traces, and a through hole, wherein the PCB is mounted on the first surface of the heat sink such that the first pin of the heat sink passes through the through hole in the PCB.

6. The LED module of claim 4, further comprising: a reflector mounted on the first surface of the heat sink.

7. The LED module of claim 6, wherein the reflector comprises a cutout that contacts at least part of the at least part of the side surface of the second pin exposed from the electrically insulating layer. ​ 8. The LED module of claim 7, wherein the reflector comprises an electrically conductive reflective surface that extends to and covers the cutout of the reflector and is electrically coupled to the heat sink core via the at least one of the at least portions of the side surface of the second pin that are exposed from the electrically insulating layer.

9. The LED module of claim 5, further comprising: a reflector mounted on the first surface of the heat sink, the reflector comprising a cutout and an electrically conductive reflective surface that extends to and covers the cutout, the cutout of the reflector contacting the at least portions of the side surface of the second pin that are exposed from the electrically insulating layer, thereby electrically coupling the reflective surface of the reflector to one of the electrically conductive traces of the PCB via the at least portions of the side surface of the second pin that are exposed from the electrically insulating layer, the heat sink core, the deformed head of the first pin, and the PCB.

10. A method of manufacturing a device, the method comprising: providing a metal plate, anodizing a surface of the metal plate, thereby forming an electrically insulating layer covering the surface; forming a first pin protruding from the anodized surface of the metal plate such that forming the protrusion results in at least portions of a side surface of the pin being exposed from the electrically insulating layer and such that a top surface of the first pin is covered by the electrically insulating layer, forming a second pin protruding from the anodized surface of the metal plate such that forming the protrusion results in at least portions of a side surface of the second pin being exposed from the electrically insulating layer, and mounting a circuit board to the anodized surface of the metal plate by at least partially inserting one of the first pin or the second pin into a through-hole in the circuit board.

11. The method of claim 10, wherein forming the first pin comprises one of: stamping the first pin from the anodized surface of the metal plate; or deep drawing the first pin from the anodized surface of the metal plate.

12. The method of claim 10, further comprising: mounting a reflector to the anodized surface of the metal plate.

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