System and method for boundary scan testing using test points of the pin under test

Abstract

A system and method for boundary scan testing of the test points of the pin under test is disclosed. When it is determined that the pin under test of the target connector cannot be subjected to boundary scan testing, the system finds the test point that is connected to and closest to the pin under test, sends a test signal to the target connector, receives the result signal generated by the test signal through the target connector, and compares the test signal and the result signal to generate a test result. This technology can use the boundary scan function to test the connectors of computer products and achieves the technical effect of improving the test range and test coverage of traditional boundary scan testing, thereby improving test efficiency and reducing test costs.

Description

Technical Field

[0001] A testing system and method thereof, particularly a system and method for performing boundary scan testing using test points of the pin under test. Background Technology

[0002] Industry 4.0, also known as the Fourth Industrial Revolution, is not simply about creating new industrial technologies. Instead, it focuses on integrating existing industrial technologies, sales processes, and product experiences. Through artificial intelligence, it aims to build smart factories that are adaptive, resource-efficient, and ergonomic. It also integrates customers and business partners into business and value processes to provide comprehensive after-sales service, thereby constructing a new, intelligent industrial world with awareness and consciousness.

[0003] As the wave of Industry 4.0 sweeps the globe, manufacturers are all optimizing their production transformation and enhancing their competitiveness through intelligent manufacturing. Intelligent manufacturing is built on sensing technology, network technology, automation technology, and artificial intelligence. It achieves intelligent product design and manufacturing, as well as enterprise management and services through processes of perception, human-machine interaction, decision-making, execution, and feedback.

[0004] The electronics assembly industry's characteristics of low profit margins and high sales volume, coupled with fierce price competition, drive businesses to pursue more effective control and optimization of raw materials and production tools, thereby maximizing the efficiency of factory production resources. For example, boundary scan testing solutions are used for testing computer products.

[0005] Traditional boundary scan testing solutions can only function properly when the connector is connected to a boundary scan component (such as a CPU) on the motherboard, and the boundary scan component can support the boundary scan function.

[0006] However, for some computer products such as laptops, the boundary scan components on these products do not fully support boundary scan functionality. Furthermore, the connectors to be tested on these computer products may pass through non-boundary scan components. As a result, traditional boundary scan testing solutions cannot effectively use boundary scan functionality to test connectors.

[0007] In summary, it is clear that the existing technology has long suffered from the problem that computer products cannot use the boundary scan function to test connectors. Therefore, it is necessary to propose improved technical means to solve this problem. Summary of the Invention

[0008] In view of the problem that existing technologies cannot use boundary scan functionality to test connectors in computer products, this invention discloses a system and method for performing boundary scan testing using test points of the pins under test, wherein:

[0009] The system for boundary scan testing of a pin under test disclosed in this invention includes at least: a testing device; and a control device, which further includes: an information acquisition module for acquiring component information of an electronic component connected to a target connector, wherein the target connector and the electronic component are disposed on a circuit board; a mode determination module for determining whether the pin under test of the target connector can be tested using the component information; a test point selection module for finding the test point connected to and closest to the pin under test when the mode determination module determines that the pin under test cannot be tested using the boundary scan; a test point connection module for connecting the test point and the testing device; a test control module for controlling the testing device to send a test signal to the target connector, so that the testing device receives the result signal generated by the test signal passing through the target connector; and a result determination module for comparing the test signal and the result signal and generating a test result.

[0010] Another system for boundary scan testing of a pin under test disclosed in this invention includes at least: a control device, which further includes: an information acquisition module for acquiring component information of an electronic component connected to a target connector, wherein the target connector and the electronic component are disposed on a circuit board; a mode determination module for determining whether the pin under test of the target connector can be subjected to boundary scan testing based on the component information; a test point selection module for finding the test point connected to and closest to the pin under test when the mode determination module determines that the pin under test cannot be subjected to boundary scan testing; and a testing device, which further includes: a test point connection module for connecting the test point and the testing device; a test control module for sending a test signal to the target connector and receiving the result signal generated by the test signal passing through the target connector; and a result determination module for comparing the test signal and the result signal and generating a test result.

[0011] The method for boundary scan testing using test points of the pin under test disclosed in this invention includes at least the following steps: obtaining component information of electronic components connected to a target connector; when it is determined from the component information that the pin under test of the target connector cannot be boundary scan tested, finding a test point connected to and closest to the pin under test; connecting the test point and the testing device; controlling the testing device to send a test signal to the target connector, so that the testing device receives the result signal generated by the test signal passing through the target connector; comparing the test signal and the result signal and generating a test result.

[0012] The system and method disclosed in this invention are as described above. The difference between this invention and the prior art is that, when it is determined that the pin under test of the target connector cannot be subjected to boundary scan testing, this invention finds the test point that is connected to and closest to the pin under test, sends a test signal to the target connector, receives the result signal generated by the test signal through the target connector, and compares the test signal and the result signal to generate a test result. This solves the problems existing in the prior art and can achieve the technical effect of improving the test range and test coverage of traditional boundary scan testing, thereby improving test efficiency and reducing test costs. Attached Figure Description

[0013] Figure 1A This is a system architecture diagram for boundary scan testing of the pin under test proposed in this invention.

[0014] Figure 1B This is a system architecture diagram for another boundary scan test based on the test points of the pin under test proposed in this invention.

[0015] Figure 2 This is a schematic diagram showing the connection between the target connector and electronic components according to an embodiment of the present invention.

[0016] Figure 3A This is a flowchart of the method for boundary scan testing using test points of the pin under test proposed in this invention.

[0017] Figure 3B This is a flowchart of an additional method for boundary scan testing using test points of the pin under test, as proposed in this invention.

[0018] Figure 3C This is a flowchart of the method for retesting the pin under test proposed in this invention.

[0019] Explanation of reference numerals in the attached figures:

[0020] 100: Control device

[0021] 101: Testing Equipment

[0022] 110: Information Acquisition Module

[0023] 120: Pattern Judgment Module

[0024] 130: Measurement Point Selection Module

[0025] 140: Measurement point connection module

[0026] 150: Test Control Module

[0027] 160: Result Judgment Module

[0028] 200: Circuit board

[0029] 210: Electronic components

[0030] 211a~211d: Boundary scanning element

[0031] 212a~212d: Connecting pins

[0032] 220: Target Connector

[0033] 222a~222d: Pins to be tested

[0034] 250: Short circuit

[0035] 260: Electronic Components

[0036] Step 310: Obtain component information of the electronic components connected to the target connector

[0037] Step 320: Determine whether the pins under test of the target connector can be subjected to boundary scan testing based on the component information.

[0038] Step 325: Does the test result of the pin under test match the expectation?

[0039] Step 330: Locate the test point that is connected to and closest to the pin under test.

[0040] Step 341: Select the input / output point on the electronic component that corresponds to the pin under test based on the component information.

[0041] Step 345: Connect the test device and input / output points

[0042] Step 350: Connect the test points and test device

[0043] Step 360: The testing device sends a test signal to the target connector and receives the result signal generated by the test signal passing through the target connector.

[0044] Step 370: Compare the test signal with the result signal and generate the test result. Detailed Implementation

[0045] The features and implementation methods of the present invention will be described in detail below with reference to the accompanying drawings and embodiments. The content is sufficient to enable any person skilled in the art to easily and fully understand the technical means used by the present invention to solve the technical problem and to implement it accordingly, thereby achieving the effects that the present invention can achieve.

[0046] This invention can test the connector by using boundary scan when one or more pins of a connector cannot be directly tested using boundary scan. This is achieved by using test points between the connector and connected electronic components that correspond to the test points of the pins that cannot be directly tested using boundary scan, allowing the test pins that can be tested using boundary scan to continue testing the connector using boundary scan.

[0047] The following is a preliminary step. Figure 1A The system architecture diagram for boundary scan testing using test points of the pin under test, as proposed in this invention, illustrates the system operation of this invention. For example... Figure 1A As shown, the system of the present invention includes a control device 100 and a testing device 101. The control device 100 may be a computing device, and the control device 100 and the testing device 101 may be connected via a physical connection cable, a wired network, or a wireless network to transmit data or signals to each other.

[0048] The control device 100 can determine whether each pin of the target connector 220 on the circuit board 200 can be subjected to boundary scan testing, and can select the connection position of each pin of the target connector 220 based on the determination result. In some embodiments, the control device 100 may also include an information acquisition module 110, a mode determination module 120, and a test point selection module 130.

[0049] The information acquisition module 110 is responsible for acquiring the component information of the electronic component 210, which is disposed on the circuit board 200 and connected to the target connector 220. The component information acquired by the information acquisition module 110 may include internal information of the electronic component 210, such as whether the electronic component 210 contains a boundary scan cell (BC) and the corresponding connection pins; the component information may also include external connection information of the electronic component 210, such as other electronic components that are directly or indirectly connected to the various connection pins of the electronic component 210, but the content of the component information is not limited to the above.

[0050] Generally, the information acquisition module 110 can read the component information of the electronic component 210 from a pre-established file or database based on the component identification data of the electronic component 210, but the present invention is not limited thereto. The aforementioned component identification data includes, but is not limited to, data sufficient to identify the electronic component 210, such as model number, serial number, and / or serial number. In some embodiments, the information acquisition module 110 can also acquire an image containing the electronic component 210 and perform image recognition on the acquired image to obtain the component identification data of the electronic component 210, or can provide relevant personnel to input the component identification data of the electronic component 210, but the method by which the information acquisition module 110 obtains the component identification data is not limited to the above. Similarly, the information acquisition module 110 can also obtain the component identification data of the target connector 220.

[0051] The pattern determination module 120 is responsible for determining, based on the component information obtained by the information acquisition module 110, whether each pin under test of the target connector 220 located on the circuit board 200 can undergo boundary scan testing. More specifically, the pattern determination module 120 can determine, based on the component information, whether each pin under test of the target connector 220 is directly connected to the electronic component 210, and whether the connection pin on the electronic component 210 connected to the pin under test of the target connector 220 has a corresponding boundary scan unit. When a specific pin under test on the target connector 220 is directly connected to the electronic component 210, and the connection pin on the electronic component 210 connected to that specific pin under test has a corresponding boundary scan unit, the pattern determination module 120 can determine that the specific pin under test directly connected to the electronic component 210 on the target connector 220 can undergo boundary scan testing; otherwise, the pattern determination module 120 can determine that the specific pin under test cannot undergo boundary scan. Figure 2 As shown, the connection pins 212a-d of the electronic component 210 have corresponding boundary scan units 211a-d, and the connection pins 212a-c are directly connected to the pins 222a-c of the target connector 220 under test, while the connection pin 212d is indirectly connected to the pin 222d of the target connector 220 under test through an electronic component 260 that does not support the boundary scan function. In this way, the mode judgment module 120 can determine that the pins 222a-c under test can be tested under boundary scan, and can determine that the pin 222d under test cannot be tested under boundary scan.

[0052] In some embodiments, the mode determination module 120 may also determine that a specific pin under test cannot be subjected to boundary scan test when it determines that a specific pin under test on the target connector 220 can be subjected to boundary scan test and the test result of the specific pin under test is inconsistent with expectations, that is, when the specific pin under test fails the boundary scan test.

[0053] The test point selection module 130 is responsible for finding a test point that is connected to and closest to the pin that cannot be tested when the mode judgment module 120 determines that one or more pins of the target connector 220 cannot be tested by boundary scan.

[0054] More specifically, the test point selection module 130 can obtain the position information of one or more test points on the connection line between the pin under test and the electronic component 210 that cannot be subjected to boundary scan testing (in this invention, the position information of the test points is also represented by test point position information), and select the test point that is connected to and closest to the pin under test based on the obtained test point position information. For example, the test point selection module 130 can read the test point position information of the test points on the connection line between the electronic component 210 and the pin under test that cannot be subjected to boundary scan testing from a pre-established file or database, or it can obtain the test point position information of the test points on the connection line between the pin under test and the pins on the electronic component 210 that do not correspond to the boundary scan unit, and select one of the test point position information based on the obtained test point position information, thereby selecting the test point corresponding to the selected test point position information.

[0055] The measurement point location information obtained by the measurement point selection module 130 can represent the corresponding test point. For example, it can record the position of the corresponding test point on the circuit board 200, and the measurement point location information can represent the distance between the corresponding test point and the connected pin to be tested. In some embodiments, the measurement point selection module 130 can also obtain an image containing the test point and the target connector 220 based on the position of the test point and the target circuit board 220 on the circuit board 200, and perform image recognition on the obtained image to obtain the connection pin of the electronic component 210 and the target connector 220. The test point selection module 130 can also obtain the connection line between the connection pin of the electronic component 210 and the test pin of the target connector 220 after image recognition, and calculate the line length of the connection line between the connection pin of the electronic component 210 and the test pin of the target connector 220 based on the ratio of the acquired image. However, the method by which the test point selection module 130 obtains the distance between the test point and the connected test pin is not limited to the above.

[0056] In some embodiments, if the test point selection module 130 cannot obtain the test point location information on the connection line between the pin under test and the electronic component, the test point selection module 130 can also read the pad information (not shown in the figure) corresponding to the target connector 220 from a pre-established file or database, and obtain the test point on the pad corresponding to the target connector 220 that is connected to the pin under test. The pad information represents the corresponding pad, and the pad information can record the connection relationship between each connection point in the corresponding pad and each pin under test of the target connector 220, that is, record the pin under test connected to each connection point.

[0057] The test point selection module 130 can also select the input / output point on the electronic component 210 corresponding to the pin under test based on the component information obtained by the information acquisition module 110 when the mode judgment module 120 determines that the pin under test of the target connector 220 can be subjected to boundary scan testing, and use the selected input / output point as the test point of the pin under test.

[0058] The testing device 101 can be connected to the circuit board 200 and can test the connected circuit board 200. In some embodiments, the testing device 101 may also include a test control module 150, a result judgment module 160, and an additional test point connection module 140.

[0059] The test point connection module 140 can connect the test points selected by the test point selection module 130 to the test device 101. For example, the test point connection module 140 may include a robotic arm and a clamping part (neither shown in the figure), and control the clamping part to clamp the connecting element of the test device 101, and control the robotic arm to contact the connecting element clamped by the clamping part with the corresponding test point, thereby connecting the test device 101 and the test point; the test point connection module 140 can also control the robotic arm to insert or be inserted into the corresponding test point of the connecting element clamped by the clamping part, thereby connecting the test device 101 and the input / output point on the circuit board 200 as the test point. However, the way the test connection module 140 connects the test point and the test device 101 is not limited to the above.

[0060] The test control module 150 is responsible for generating test signals. The test control module 150 can execute a corresponding program to generate a test signal corresponding to the target connector 220 based on the preset or the component identification data of the target connector 220 obtained by the information acquisition module 110, or it can execute a preset program to generate a test signal, but the test control module 150 can generate test signals in a manner not limited to the above.

[0061] The test control module 150 is also responsible for sending the generated test signals after the test device 101 is connected to all the test points selected by the test point selection module 130, so that the test signals reach the target connector 220 through each test point, and then generate a result signal through the target connector 220. The test control module 150 is also responsible for receiving the result signal.

[0062] The result judgment module 160 is responsible for comparing the test signal generated by the test control module 150 with the result signal received by the test control module 150, and generating a test result based on the comparison result. For example, the result judgment module 160 can treat the test signal and the result signal as two sets of binary data respectively, and compare the two sets of data. When the two sets of data are exactly the same, it means that all the pins under test of the target connector 220 have passed the test. If the two sets of data are different, it means that the pins under test corresponding to the different bits in the two sets of data have failed the test, and the pins under test corresponding to the same bits in the two sets of data have passed the test.

[0063] This invention can also be used as follows Figure 1B As shown in the architecture, all modules are located in the control device 100. The test device 101 is only responsible for transmitting test signals. At this time, the test device 101 can send the received test signal to the target connector 220 after receiving the test signal generated by the test control module 150, and can also transmit the received result signal back to the test control module 150.

[0064] The operating system and method of the present invention will then be explained using an embodiment, and please refer to [reference needed]. Figure 3A The flowchart of the method for boundary scan testing using test points of the pin under test proposed in this invention is shown. In this embodiment, it is assumed that the circuit board 200 is a motherboard and the target connector 220 can be a USB or HDMI connection interface, but this invention is not limited to the above.

[0065] When the production line manager of circuit board 200 wants to use the present invention to test the target connector 220 disposed on circuit board 200, the information acquisition module 110 of the control device 100 can acquire the component information of the electronic components 210 disposed on circuit board 200 connected to the target connector 220 (step 310). In this embodiment, it is assumed that the information acquisition module 110 can acquire the component information of all electronic components 210 on circuit board 200 that support boundary scan, such as the component information of the central processing unit.

[0066] After the information acquisition module 110 of the control device 100 acquires the component information of the electronic component 210, the mode determination module 120 of the control device 100 can determine whether each pin under test of the target connector 220 can be subjected to boundary scan test based on the component information acquired by the information acquisition module 110 (step 320). In this embodiment, if the mode determination module 120 can determine whether each electronic component 210 is directly connected to one or more pins under test of the target connector 220 based on the information recorded in the component information of each electronic component 210, and if none of the pins under test of the target connector 220 are directly connected to the electronic component 210 supporting boundary scanning on the circuit board 200, then the mode determination module 120 can determine that the pin under test of the target connector 220 cannot be subjected to boundary scan testing; and if one or more pins under test of the target connector 220 are directly connected to any electronic component 210 supporting boundary scan, then the mode determination module 120 can further determine whether the connection pin connected to the pin under test corresponds to a boundary scan unit. If not, then the mode determination module 120 can determine that the pin under test cannot be subjected to boundary scan testing; if so, then the mode determination module 1210 can determine that the pin under test can be subjected to boundary scan testing.

[0067] After the mode determination module 120 of the control device 100 determines whether each pin to be tested of the target connector 220 can be subjected to boundary scan testing, the test point selection module 130 of the control device 100 can respectively find or select the test points corresponding to each pin to be tested of the target connector 220. In this embodiment, it is assumed that the test point selection module 130 can perform the following... Figure 3B As shown in the flowchart, based on the component information obtained by the information acquisition module 110 of the control device 100, the input / output points on the electronic component 210 corresponding to the test pins 222a-c of the target connector 220 that are eligible for boundary scan testing are selected (step 341), such as the connection pins 212a-c of the electronic component 210; the test point selection module 130 can also find the test point that is connected to and closest to the test pin 222d of the target connector 220 that is not eligible for boundary scan testing (step 330), for example, the test point The selection module 130 can obtain the test point location information of each test point on the connection line between the pin under test 222d and the electronic component 210, and select the test point closest to the pin under test 222d based on the test point location information. If the test point selection module 130 cannot obtain the test point location information between the pin under test 222d and the electronic component 210, the test point selection module 130 can obtain the pad information of the pad corresponding to the target connector 220, and can obtain the test point on the pad connected to the pin under test 222d based on the obtained pad information.

[0068] After the test point selection module 130 of the control device 100 finds or selects the test points corresponding to each pin under test of the target connector 220, the relevant personnel on the production line of the circuit board 200 can connect the test device 101 to the test points found or selected by the test point selection module 130 (steps 345, 350). In this embodiment, it is assumed that the relevant personnel can connect the connection element on the test device 101 that supports the boundary scan function to the input / output point selected by the test point selection module 130 that corresponds to the pins 222a to c that can be tested by boundary scan, such as the connection pins 212a to c on the electronic component 210. The relevant personnel can also contact the probe on the test device 101 with the test point found by the test point selection module 130 that corresponds to the pins 222d that cannot be tested by boundary scan, thereby connecting the test device 101 to each pin under test of the target connector 220.

[0069] After the test point found or selected by the test point selection module 130 is connected to the test device 101, the test device 101 can send a test signal to the target connector 220 and can receive the result signal generated by the test signal through the target connector 220 (step 360). In this embodiment, assuming that the test device 101 is only an intermediary device for signal transmission, the test control module 150 of the control device 100 can generate a control signal and transmit it to the test device 101, so that the test device 101 can generate a corresponding test signal and transmit the generated test signal to each pin under test of the target connector 220 through the test points (or the test control module 150 can generate a test signal and transmit it to the test device 101, and the test device 101 can transmit the received test signal to each pin under test of the target connector 220), so that the test signal generates a result signal through the target connector 220; however, if the test device 101 is not only an intermediary device for signal transmission, the test control module 150 of the test device 101 can directly generate a test signal and transmit the generated test signal to each pin under test of the target connector 220 through the test points, so that the test signal generates a result signal through the target connector.

[0070] After the test device 101 receives the result signal, the control device 100 or the result judgment module 160 of the test device 101 can compare the test signal generated by the test device 101 with the received result signal, and generate a test result based on the comparison result (step 370). In this embodiment, assuming that a short circuit 250 occurs between the connection line between the pin under test 222b and the connection pin 212b and the connection line between the pin under test 222c and the connection pin 212c, the result signal corresponding to the pins under test 222b and 222c may be different from the expectation. In this case, the result judgment module 160 can determine that the pins under test 222a and 222d have passed the test, while the pins under test 222b to 222c have not passed the test.

[0071] Thus, through this invention, when the pins to be tested of the target connector 220 on the circuit board 200 cannot be tested using boundary scan, the target connector can still be tested using boundary scan at the test points corresponding to the pins to be tested that cannot be tested using boundary scan between the target connector 220 and the connected electronic components 210.

[0072] In the above embodiments, it is also possible to... Figure 3C As shown in the process, after the result judgment module 160 of the control device 100 or the test device 101 compares the test signal and the result signal and generates the test result (step 370), the mode judgment module 120 of the control device 100 can further determine whether the test result of each pin under test is consistent with the expectation (step 325). If yes, the present invention can be terminated. If no, the mode judgment module 120 can determine that the pin under test whose test result is not consistent with the expectation cannot be subjected to boundary scan test, and then repeat the above steps 330 to 370 to test the pin under test whose test result is not consistent with the expectation again. In this embodiment, the pins 222b to 222c to be tested are tested again. If the test results of the pins 222b / 222c to be tested are consistent with the expectations, the result judgment module 160 can determine that the pins 222b / 222c to be tested have a connection line problem with the electronic component 210. If the test results of the pins 222b / 222c to be tested are still inconsistent with the expectations, the result judgment module 160 can determine that the pins 222b / 222c to be tested have a pin soldering problem.

[0073] In summary, the difference between this invention and the prior art lies in its technical means of finding the test point closest to the pin under test when boundary scan testing is not possible on the target connector, sending a test signal to the target connector, receiving the result signal generated by the test signal through the target connector, and comparing the test signal and the result signal to generate a test result. This technical means can solve the problem in the prior art that computer products cannot use the boundary scan function to test connectors, thereby achieving the technical effect of improving the test range and test coverage of traditional boundary scan testing, improving test efficiency, and reducing test costs.

[0074] Furthermore, the method of boundary scan testing with test points of the pin under test according to the present invention can be implemented in hardware, software or a combination of hardware and software, and can also be implemented in a centralized manner in a computer system or in a distributed manner with different components distributed in several interconnected computer systems.

[0075] While the embodiments disclosed in this invention are as described above, the content is not intended to directly limit the scope of patent protection for this invention. Any modifications or refinements made by those skilled in the art to which this invention pertains, in terms of form and detail, without departing from the spirit and scope disclosed herein, shall fall within the scope of patent protection for this invention. The scope of patent protection for this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A method for performing boundary scan testing using test points of the pin under test, the method comprising at least the following steps: Obtain component information of the electronic components connected to the target connector; If the component information indicates that the pin under test of the target connector cannot be subjected to boundary scan testing, find the test point that is connected to and closest to the pin under test. Connect the test point and the test device; The test device is controlled to send a test signal to the target connector, so that the test device receives the result signal generated by the test signal passing through the target connector. as well as The test signal is compared with the result signal to generate the test result.

2. The method for boundary scan testing using test points of the pin under test according to claim 1, wherein, The method also includes the steps of selecting the input / output point on the electronic component corresponding to the other pin under test based on the component information when it is determined that the other pin under test of the target connector can be subjected to boundary scan testing, and connecting the test device and the input / output point.

3. The method for boundary scan testing using test points of the pin under test according to claim 1, wherein, The step of determining whether the pin under test of the target connector can be boundary scanned based on the component information is as follows: if the electronic component is directly connected to the pin under test and the connection pin connected to the pin under test has a corresponding boundary scan unit, then the pin under test can be boundary scanned; otherwise, the pin under test cannot be boundary scanned; or if the pin under test can be boundary scanned but the test result of the pin under test does not match the expectation, then the pin under test cannot be boundary scanned.

4. The method for boundary scan testing using test points of the pin under test according to claim 1, wherein, The step of finding the test point that is connected to and closest to the pin under test is to obtain the test point location information of each test point on the connection line between the pin under test and the electronic component, and select the test point that is connected to and closest to the pin under test based on the test point location information, or when the test point location information between the pin under test and the electronic component cannot be obtained, obtain the pad information of the pad corresponding to the target connector, and obtain the test point on the pad that is connected to the pin under test based on the pad information.

5. A system for boundary scan testing of test points on pins under test, used to test circuit boards, the system comprising at least: Test equipment; as well as The control device further includes: The information acquisition module is used to acquire component information of the electronic component connected to the target connector, and the target connector and the electronic component are disposed on the circuit board; The pattern determination module is used to determine whether the pin under test of the target connector can be subjected to boundary scan test based on the component information. The test point selection module is used to find the test point that is connected to and closest to the pin under test when the mode judgment module determines that the pin under test cannot be subjected to boundary scan test. The test point connection module is used to connect the test point and the test device; The test control module controls the test apparatus to send test signals to the target connector, and enables the test apparatus to receive the result signal generated by the test signal passing through the target connector; and The result judgment module is used to compare the test signal with the result signal and generate the test result.

6. The system for boundary scan testing using test points of the pin under test according to claim 5, wherein, The test point selection module is also used to select the input / output point on the electronic component corresponding to the other pin under test when the mode judgment module determines that the other pin under test of the target connector can be subjected to boundary scan testing, based on the component information. The test point connection module is also used to connect the test device and the input / output point.

7. The system for boundary scan testing using test points of the pin under test according to claim 5, wherein, The mode determination module determines that the electronic component can be subjected to boundary scan testing if the connection pin connected to the pin under test is directly connected to the pin under test and has a corresponding boundary scan unit. Otherwise, it determines that the pin under test cannot be subjected to boundary scan testing. Or, if it determines that the pin under test can be subjected to boundary scan testing but the test result of the pin under test does not match the expectation, it determines that the pin under test cannot be subjected to boundary scan testing.

8. A system for boundary scan testing of test points on pins under test, used to test circuit boards, the system comprising at least: Control device, wherein, Also includes: The information acquisition module is used to acquire component information of the electronic component connected to the target connector, and the target connector and the electronic component are disposed on the circuit board; The pattern determination module is used to determine whether the pin under test of the target connector can be subjected to boundary scan test based on the component information. and The test point selection module is used to find the test point that is connected to and closest to the pin under test when the mode judgment module determines that the pin under test cannot be subjected to boundary scan test. as well as The testing apparatus further includes: The test point connection module is used to connect the test point and the test device; A test control module is used to send test signals to the target connector and receive the result signals generated by the test signals passing through the target connector; and The result judgment module is used to compare the test signal with the result signal and generate the test result.

9. The system for boundary scan testing using test points of the pin under test according to claim 8, wherein, The test point selection module is also used to select the input / output point on the electronic component corresponding to the other pin under test when the mode judgment module determines that the other pin under test of the target connector can be subjected to boundary scan testing, based on the component information. The test point connection module is also used to connect the test device and the input / output point.

10. The system for boundary scan testing using test points of the pin under test according to claim 8, wherein, The mode determination module determines that the electronic component can be subjected to boundary scan testing if the connection pin connected to the pin under test is directly connected to the pin under test and has a corresponding boundary scan unit. Otherwise, it determines that the pin under test cannot be subjected to boundary scan testing. Or, if it determines that the pin under test can be subjected to boundary scan testing but the test result of the pin under test does not match the expectation, it determines that the pin under test cannot be subjected to boundary scan testing.

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