Electronic device

Abstract

Embodiments of the present application disclose an electronic device, comprising a conductive frame and a first antenna unit, the conductive frame is arranged around the periphery of the electronic device, characterized in that the first antenna unit comprises: a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are arranged in the thickness direction of the electronic device; a conductive connecting part for connecting the first conductive layer and the second conductive layer; and a first conductive frame, which is part of the conductive frame, wherein the first conductive layer and the first conductive frame have a first gap therebetween, and the conductive connecting part, the first conductive frame, the first conductive layer and the second conductive layer form a first cavity. Thus, the electromagnetic wave can be radiated or received through the first gap between the first conductive layer and the first conductive frame, thereby avoiding the need to open a slot on the surface of the metal plate, and improving the integrity of the metal plate.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of antennas, and in particular to an electronic device. BACKGROUND

[0002] With the development of communication technology, the application of multi-input multi-output (MIMO) antenna technology in electronic devices is increasingly widespread, the number of antennas is multiplied, and the covered frequency bands are more and more. Electronic device products, especially electronic devices with metal industry design (ID), still require high structural compactness. However, the recent design trend of electronic devices is higher screen ratio, more multimedia devices, and larger battery capacity, which makes the antenna space be sharply compressed.

[0003] A slot antenna is an antenna formed by opening a slot in a conductor surface, and electromagnetic waves are radiated to the external space through the slot. The slot antenna has the characteristics of low profile and integrability, and has attracted widespread attention and research.

[0004] The slot antenna can be used in a terminal device to realize miniaturization of the terminal device. SUMMARY

[0005] Embodiments of the present application provide an electronic device, which solves the problem of too large space occupied by an antenna unit.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0007] The present application provides an electronic device, comprising a conductive frame and a first antenna unit, the conductive frame is arranged around the periphery of the electronic device, characterized in that the first antenna unit comprises: a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are arranged in the thickness direction of the electronic device; a conductive connecting part for connecting the first conductive layer and the second conductive layer; and a first conductive frame, which is part of the conductive frame, wherein the first conductive layer and the first conductive frame have a first slot therebetween, and the conductive connecting part, the first conductive frame, the first conductive layer and the second conductive layer form a first cavity. Thus, the conductive connecting part, the first conductive frame, the first conductive layer and the second conductive layer form a first cavity, and the first conductive layer and the first conductive frame are arranged in the first slot of the first cavity, so that the first antenna unit can radiate or receive electromagnetic waves through the first slot, thereby eliminating the need to open a slot on the surface of the metal plate and improving the integrity of the metal plate.

[0008] In an optional implementation, the electronic device further includes a first feeding unit, which feeds the first antenna unit through the first conductive layer, where the first feeding unit is electrically connected or coupled to the first conductive layer. In this way, the feeding manner is more flexible.

[0009] In an optional implementation, the electronic device further includes a grounding plate, and the second conductive layer is electrically connected or coupled to the grounding plate, and the first antenna unit is grounded through the second conductive layer. In this way, the first antenna unit has a simple structure and is easy to assemble.

[0010] In an optional implementation, the electronic device further includes a grounding plate, and the grounding plate forms the second conductive layer. In this way, the grounding plate of the electronic device can be reused for the first antenna unit, without the need to additionally arrange other metal components, thereby reducing the manufacturing cost of the antenna and saving space. The electronic device further includes a middle frame, and the grounding plate is arranged on a side of the middle frame facing the first conductive layer. The conductive frame can be a part of the middle frame.

[0011] In an optional implementation, the electronic device further includes a metal back cover, and the metal back cover forms the first conductive layer. In this way, the metal back cover can be reused as a part of the first antenna unit, without the need to additionally arrange other metal components, thereby reducing the manufacturing cost of the antenna and saving space.

[0012] In an optional implementation, the electronic device further includes a display module, and a side of the display module facing the grounding plate is provided with the first conductive layer. In this way, a metal layer can be arranged on the side of the display module facing the grounding plate as the first conductive layer of the first antenna unit, thereby simplifying the structure and reducing the manufacturing cost of the antenna and saving space. The first conductive layer can also be coated on at least a part of the surface of the display module facing the grounding plate, for example, a metal is coated on the backboard of the display module.

[0013] In an optional implementation, the conductive connection part adopts a conductive wall structure, and two sides of the conductive wall are connected to the first conductive layer and the second conductive layer respectively. In this way, the conductive wall structure has a more stable connection and better sealing performance, thereby avoiding energy leakage.

[0014] In an optional implementation, the conductive connection part includes a plurality of point connection structures, and the distance between adjacent point connection structures is less than or equal to one half of the wavelength corresponding to the center frequency of the first antenna operating frequency band. In this way, the point connection structure saves more internal space of the electronic device.

[0015] In an optional implementation, the point connection structure is a metal spring piece, and two ends of the metal spring piece are connected to the first conductive layer and the second conductive layer respectively.

[0016] In an optional implementation, a projection of the conductive connecting part on the second conductive layer is located within a projection range of the first conductive layer on the second conductive layer.

[0017] In an optional implementation, a projection of the conductive connecting part on the carrier plate is one or a combination of a curve, a polyline, or a straight line. In this way, the shape of the conductive connecting part is more flexible, facilitating installation.

[0018] In an optional implementation, the first gap is filled with an insulating material. The insulating material is polycarbonate and acrylonitrile-butadiene-styrene copolymer and PC / ABS material. In this way, the integrity of the appearance of the electronic device is further improved.

[0019] In an optional implementation, the first antenna unit radiates or receives electromagnetic waves through the first gap.

[0020] In an optional implementation, the electronic device further includes: the electronic device further includes: a second antenna unit and a second feeding unit, the second feeding unit feeds the second antenna unit, wherein the second antenna unit includes: a first grounding point, the first grounding point is arranged on the conductive frame; a first radiator, wherein the conductive frame is provided with a second gap, the conductive frame between the first grounding point and the second gap forms the first radiator, and the first grounding point is used for grounding the second antenna unit. In this way, multiple antennas can be arranged on the electronic device, the first antenna unit and the second antenna unit can work simultaneously, the reliability of signal processing, the signal transmission range and the throughput are enhanced, and the communication quality is improved.

[0021] In an optional implementation, at least part of the first radiator is formed by the first conductive frame. In this way, the second antenna unit can be reused for the first antenna unit, and the bandwidth of the first antenna unit can be expanded.

[0022] In an optional implementation, the first filter device, the second feeding unit is electrically connected or coupled to the first radiator through the first filter device. In this way, the first filter device can filter out the signal of the first antenna unit, improving the isolation between the first antenna unit and the second antenna unit.

[0023] In an optional implementation, the second antenna unit further includes: a second radiator, the conductive frame is provided with a second gap, and the conductive frame between the second gap and the first gap forms the second radiator; a second grounding point, the second grounding point is arranged on the second radiator and is used for grounding the second antenna unit. In this way, the second radiator is arranged, and the communication quality can be further improved.

[0024] In an alternative implementation, the second feeding unit is electrically connected with the second radiator. In this way, the first radiator and the second radiator are fed in a distributed manner, and the structure is simpler.

[0025] In an alternative implementation, the second radiator is coupled with the first radiator through a first gap. In this way, the second radiator can be used as a parasitic radiator of the first radiator, and the manufacturing cost of the antenna can be reduced.

[0026] In an alternative implementation, the electronic device further includes a second filter device, and the second feeding unit is electrically connected or coupled with the second radiator through the second filter device. In this way, the second filter device can filter the signal of the first antenna unit, avoid the first antenna unit and the second antenna unit operating at the same frequency, and improve the isolation between the first antenna unit and the second antenna unit. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A disassembled structural schematic diagram of an electronic device is provided for an embodiment of the present application;

[0028] Figure 2 A structural schematic diagram of a first antenna unit is provided for an embodiment of the present application;

[0029] Figure 3 A back view of an electronic device is provided for an embodiment of the present application;

[0030] Figure 4 A structural schematic diagram of a conductive layer of an electronic device is provided for an embodiment of the present application;

[0031] Figure 4a A Figure 4 A bottom view of a first antenna unit in the electronic device is provided for an embodiment of the present application;

[0032] Figure 4b A structural schematic diagram of an electronic device is provided for an embodiment of the present application;

[0033] Figure 4c A Figure 4b A partial enlarged view of an electronic device is provided for an embodiment of the present application;

[0034] Figure 4d A Figure 4b A top view of an electronic device is provided for an embodiment of the present application;

[0035] Figure 4e A structural schematic diagram of another electronic device is provided for an embodiment of the present application;

[0036] Figure 4f A projection view of a conductive connection part is provided for an embodiment of the present application;

[0037] Figure 4gAnother projection view of the conductive connection part provided by the embodiment of the present application;

[0038] Figure 5 A structural schematic diagram of an electronic device provided by the embodiment of the present application;

[0039] Figure 6 For Figure 5 S11 parameter distribution diagram of the first antenna unit in the embodiment of the present application;

[0040] Figure 7 For Figure 5 Antenna radiation efficiency schematic diagram of the first antenna unit in the embodiment of the present application;

[0041] Figure 8 For Figure 5 Current and electric field distribution schematic diagram of the first antenna unit in the embodiment of the present application;

[0042] Figure 9 For Figure 5 Radiation direction simulation diagram of the first antenna unit in the embodiment of the present application;

[0043] Figure 10 A structural schematic diagram of another electronic device provided by the embodiment of the present application;

[0044] Figure 11 S11 parameter distribution diagram of another first antenna unit provided by the embodiment of the present application;

[0045] Figure 12 Antenna radiation efficiency schematic diagram of another first antenna unit provided by the embodiment of the present application;

[0046] Figure 13 A structural schematic diagram of another electronic device provided by the embodiment of the present application;

[0047] Figure 14 For Figure 13 S11 parameter distribution diagram of the first antenna unit in the embodiment of the present application;

[0048] Figure 15 For Figure 13 Antenna radiation efficiency schematic diagram of the first antenna unit in the embodiment of the present application;

[0049] Figure 16 A structural schematic diagram of another electronic device provided by the embodiment of the present application;

[0050] Figure 17 For Figure 16 S11 parameter distribution diagram of the first antenna unit in the embodiment of the present application;

[0051] Figure 18 For Figure 16 Antenna radiation efficiency schematic diagram of the first antenna unit in the embodiment of the present application;

[0052] Figure 19 For Figure 16 The current and electric field distribution of the first antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0053] Figure 20 For Figure 16 The radiation direction simulation diagram of the first antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0054] Figure 21 The structure schematic diagram of another electronic device provided by the embodiment of the present application is shown in the schematic diagram.

[0055] Figure 21a For Figure 21 The circuit diagram of the second antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0056] Figure 21b The structure schematic diagram of another electronic device provided by the embodiment of the present application is shown in the schematic diagram.

[0057] Figure 21c For Figure 21b The circuit diagram of the second antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0058] Figure 21d The structure schematic diagram of another electronic device provided by the embodiment of the present application is shown in the schematic diagram.

[0059] Figure 22 For Figure 21d The S11, S22 and S12 parameter distribution diagram of the antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0060] Figure 23 For Figure 21d The radiation efficiency schematic diagram of the antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0061] Figure 24 The structure schematic diagram of another electronic device provided by the embodiment of the present application is shown in the schematic diagram.

[0062] Figure 25 For Figure 24 The S11, S22 and S12 parameter distribution diagram of the antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0063] Figure 26 For Figure 24 The antenna radiation efficiency schematic diagram of the antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0064] Figure 27 For Figure 24 The current and electric field distribution of the antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0065] Figure 28 For Figure 24 The radiation direction simulation diagram of the antenna unit in the embodiment of the present application is shown in the schematic diagram.

[0066] Figure 29 The framework diagram of the electronic device provided by the embodiment of the present application is shown in the schematic diagram. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0068] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0069] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0070] The following explains the terminology that may appear in the embodiments of this application.

[0071] Electrical connection: This can be understood as the physical contact and electrical conduction between components, or as the connection between different components in a circuit structure via physical lines that can transmit electrical signals, such as PCB copper foil or wires. Here, "connection" refers to both mechanical and physical structural connections.

[0072] Coupling: refers to the phenomenon where there is a close coordination and mutual influence between the inputs and outputs of two or more circuit elements or electrical networks, and energy is transferred from one side to the other through interaction.

[0073] Connection: The process of making two or more components conduct or connect through the above-mentioned "electrical connection" or "coupling connection" to transmit signals / energy can be called connection.

[0074] Antenna radiation pattern: also known as radiation pattern. It refers to the graph showing how the relative field strength (normalized modulus) of the antenna's radiated field changes with direction at a certain distance from the antenna. It is usually represented by two mutually perpendicular planar radiation patterns passing through the direction of maximum radiation of the antenna.

[0075] Antenna radiation patterns typically have multiple radiating beams. The beam with the highest radiating intensity is called the main lobe, and the remaining beams are called side lobes. Among the side lobes, the side lobe in the opposite direction to the main lobe is also called the back lobe.

[0076] Antenna return loss: can be understood as the ratio of the signal power reflected back to the antenna port through the antenna circuit to the antenna port transmitting power. The smaller the signal reflected back, the greater the signal radiated through the antenna to the space, and the greater the radiation efficiency of the antenna. The greater the signal reflected back, the smaller the signal radiated through the antenna to the space, and the smaller the radiation efficiency of the antenna.

[0077] The antenna return loss can be represented by the S11 parameter, and the S11 parameter is usually negative. The smaller the S11 parameter, the smaller the antenna return loss, and the greater the radiation efficiency of the antenna; the greater the S11 parameter, the greater the antenna return loss, and the smaller the radiation efficiency of the antenna.

[0078] Antenna isolation: refers to the ratio of the signal transmitted by one antenna to the signal power received by another antenna.

[0079] Antenna system efficiency: refers to the ratio of the power radiated by the antenna to the space (i.e. the power of the part effectively converted into electromagnetic waves) to the input power of the antenna.

[0080] Antenna radiation efficiency: refers to the ratio of the power radiated by the antenna to the space (i.e. the power of the part effectively converted into electromagnetic waves) to the active power input to the antenna. Among them, the active power input to the antenna = the input power of the antenna - antenna loss; the antenna loss mainly includes ohmic loss and / or dielectric loss of metal.

[0081] Embodiments of the present application provide an electronic device, which includes, for example, a mobile phone, a tablet computer, a vehicle-mounted computer, a smart wearable product, an Internet of Things (IOT), etc. The specific form of the electronic device is not specially limited in the embodiments of the present application. For the convenience of explanation, the electronic device is taken as a mobile phone for example. As shown in the figure, Figure 1 The electronic device 01 mainly includes a display module 10, a middle frame 11 and a metal back cover 12. The middle frame 11 is located between the display module 10 and the metal back cover 12.

[0082] The display module 10 is used for displaying images. In some embodiments of the present application, the display module 10 includes a liquid crystal display (LCD) module and a back light unit (BLU). Alternatively, in some other embodiments of the present application, the display module 10 can be an organic light emitting diode (OLED) display screen.

[0083] The middle frame 11 includes a bearing plate 110 and a conductive frame 112 surrounding the bearing plate 110. In some embodiments, the conductive frame 112 can be integrally formed on the bearing plate 110. It should be understood that in other embodiments, the conductive frame 112 and the middle frame 11 can also be independent, for example, the conductive frame 112 and the middle frame 11 can be formed by different materials respectively, for example, the middle frame 11 is formed by a conductive material, and the conductive frame 112 is formed by a non-conductive material.

[0084] The surface of the bearing plate 110 facing the metal back cover 12 can be provided with electronic devices such as a printed circuit board (PCB), a camera, a battery, etc. Among them, the camera and the battery are not shown in the figure. The metal back cover 12 is connected with the middle frame 11 to form a containing cavity for containing the above-mentioned electronic devices such as PCB, camera and battery. Thus, the invasion of water vapor and dust from the outside into the containing cavity can be prevented, and the performance of the above-mentioned electronic devices can be affected.

[0085] The display module 10 can be electrically connected with the PCB provided on the bearing plate 110 through a flexible printed circuit (FPC) as shown in Figure 1 Thus, the PCB can transmit display data to the display module 10 to control the display module 10 to display images.

[0086] The display module 10, the middle frame 11 and the metal back cover 12 can be respectively arranged in different layers in the thickness direction of the electronic device. These layers can be parallel to each other, and the plane where each layer is located can be referred to as the X-Y plane, and the direction perpendicular to the X-Y plane can be referred to as the Z direction. That is to say, the display module 10, the middle frame 11 and the metal back cover 12 can be distributed in layers in the Z direction.

[0087] The above-mentioned electronic device further includes a first feeding system 14 and a first antenna unit 001 for communication as shown in Figure 2 The first feeding system 14 feeds the first antenna unit 001, and the first antenna unit 001 is used for transmitting and receiving electromagnetic waves.

[0088] As shown in Figure 2 The first antenna unit 001 includes a first conductive layer 101 and a second conductive layer 102 arranged in the thickness direction of the electronic device.

[0089] The first conductive layer 101 and the second conductive layer 102 are arranged in parallel in the thickness direction of the electronic device, for example.

[0090] In some embodiments, the first conductive layer 101 can be formed by Figure 1The conductive back cover (e.g. metal back cover) of the electronic device or the conductive layer on the display module is formed, and the second conductive layer 102 is formed by the ground plate of the electronic device. For example, the first conductive layer is arranged on the side of the display module facing the ground plate, or a metal is coated on at least a part of the surface of the display module facing the ground plate as the first conductive layer (e.g. a metal is coated on the back plate of the display module).

[0091] The conductive layer of the display module can be a metal layer formed on the side of the display module 10 facing the carrier plate.

[0092] The first antenna unit 001 further comprises a conductive connection part 113 for connecting the first conductive layer 101 and the second conductive layer 102.

[0093] The conductive connection part 113 is formed by a metal wall or a metal spring or a metal via.

[0094] In some embodiments, the first antenna unit 001 further comprises a first conductive frame 111, which can be formed by at least a part of the conductive frame 112 of the electronic device, for example, the conductive frame 112 can be a conductive frame arranged around the periphery of the electronic device. In some embodiments, the first conductive frame 111 can be, for example, a straight bar-shaped frame on the side frame, or an L-shaped frame at the connection between the top frame and the side frame. Figure 1 The conductive frame 112 of the electronic device shown can be formed by at least a part of the conductive frame 112 of the electronic device, for example, the conductive frame 112 can be a conductive frame arranged around the periphery of the electronic device. In some embodiments, the first conductive frame 111 can be, for example, a straight bar-shaped frame on the side frame, or an L-shaped frame at the connection between the top frame and the side frame.

[0095] The first antenna unit 001 can be arranged in the electronic device 01 shown, wherein the first conductive layer 101, the second conductive layer 102 and the conductive connection part 113 of the first antenna unit 001 are located in the area surrounded by the conductive frame, for example, the first conductive layer 101, the second conductive layer 102 and the conductive connection part 113 are arranged relative to the first conductive frame 111. Figure 1 The conductive frame (e.g. the first conductive frame 111) can be a conductive frame formed by a conductive material such as metal, or a conductive frame formed by a non-conductive material such as plastic or resin, and a conductive radiator arranged inside the non-conductive material, or a conductive radiator embedded in the non-conductive material.

[0096] It should be noted that the conductive frame (e.g. the first conductive frame 111) can be a conductive frame formed by a conductive material such as metal, or a conductive frame formed by a non-conductive material such as plastic or resin, and a conductive radiator arranged inside the non-conductive material, or a conductive radiator embedded in the non-conductive material.

[0097] In addition, the antenna in the electronic device 01 can use the frame formed by a conductive material to realize the transmission or reception of signals. It can also use a conductive radiator arranged inside a frame formed by a non-conductive material or a conductive radiator embedded in a non-conductive material frame to realize the transmission or reception of signals.

[0098] The first conductive layer 101, the second conductive layer 102 and the conductive connecting part 113 are located in an area surrounded by the conductive frame 112, and the first conductive layer 101, the second conductive layer 102, the conductive connecting part 113 and a first part (i.e., the first conductive frame 111) of the conductive frame 112 surround to form a first cavity 100, wherein the first conductive layer 101 and the first conductive frame 111 are spaced apart to form a first gap 104 of the first cavity 100.

[0099] It should be noted that the first conductive layer 101 and the second conductive layer 102 can be any spaced metal layers inside the electronic device, the first conductive layer 101 is not limited to the conductive back cover (such as a metal back cover) or the display module (such as a metal layer of the display module), and the second conductive layer 102 is not limited to the ground plate of the electronic device.

[0100] The first gap 104 can be a gap formed between the first conductive layer 101 and the first conductive frame 111, or a gap formed by opening a gap on the first conductive layer 101 or the first conductive frame 111, thereby forming a first cavity with the gap 104, which all belong to the protection scope of the present application.

[0101] The present application does not limit the structure of the first cavity, wherein at least one opposite part of the first conductive layer 101 and the second conductive layer 102 surrounding the first cavity is connected by the conductive connecting part 113.

[0102] In some embodiments of the present application, the first cavity can be a hollow structure.

[0103] In some other embodiments of the present application, the first cavity is also filled with a medium, which is an insulating material, such as resin, polychlorinated biphenyls (PCBs).

[0104] The first antenna unit 001 further includes, for example, a radiator, a feed point or a feed branch, a ground point or a ground branch, etc., or can further include a matching circuit, the feed point or the feed branch or the matching circuit is connected to the first feed system 14 to feed the radiator.

[0105] The above-mentioned first antenna unit 001 is arranged in the electronic device 01 and can be combined with the electronic device 01.

[0106] In some embodiments, as shown in (a) and (b) of FIG. 1, the metal back cover 12 can be used as the first conductive layer 101 of the first antenna unit 001, and the metal back cover 12 and the first conductive frame 111 are provided with the first gap 104, for example, on the surface thereof, which can obtain a better antenna space and excite rich antenna modes. Figure 3 In some embodiments, as shown in (a) and (b) of FIG. 1, the metal back cover 12 can be used as the first conductive layer 101 of the first antenna unit 001, and the metal back cover 12 and the first conductive frame 111 are provided with the first gap 104, for example, on the surface thereof, which can obtain a better antenna space and excite rich antenna modes.

[0107] However, this slotting method divides the conductive frame and metal back cover 12 of the electronic device 01, affecting the integrity of the metal back cover 12 and the conductive frame.

[0108] In other embodiments of this application, such as Figure 4 , Figure 4b As shown, where, Figure 4 The conductive layer structure inside the electronic device is shown. Figure 4b A schematic diagram showing the integration of the first antenna element 001 with an electronic device is shown, wherein, Figure 4b The metal back cover 12 of the electronic device shown is made of metal. At least a portion of the metal back cover 12 can be used as... Figure 4 The first conductive layer 101 shown, or the first conductive layer 101 including at least a portion of the metal back cover 12, should be understood to include other metal layers.

[0109] Therefore, the metal back cover can be reused in the first antenna unit 001 without the need for additional metal parts, which can reduce the manufacturing cost of the antenna and save space.

[0110] In other embodiments of this application, such as Figure 4e As shown, the display module 10 has a metal layer on the side facing the support plate, which can... Figure 4e At least a portion of the metal layer on the display module 10 shown serves as Figure 4 The first conductive layer 101 shown, or the first conductive layer 101 including at least a portion of the metal layer on the display module 10, should be understood to include other metal layers.

[0111] Therefore, the conductive layer of the display module can be reused in the first antenna unit 001 without the need for additional metal components, which can reduce the manufacturing cost of the antenna and save space.

[0112] The electronic device 01 further includes a ground plane 13. In some embodiments, the second conductive layer 102 is electrically connected or coupled to the ground plane 13, and the first antenna unit 001 is grounded through the second conductive layer 102.

[0113] In other embodiments, the ground plane 13 forms the second conductive layer 102. At least a portion of the ground plane 13 may serve as the second conductive layer 102 of the first antenna element 001. In some embodiments of this application, the ground plane 13 may be disposed as... Figure 1 In other embodiments of this application, the ground plane 13 of the metal structure on the carrier plate 110 of the electronic device 01 shown may be disposed as follows: Figure 1The PCB on the carrier plate 110 shown is, for example, a PCB ground plate. The PCB ground plate can specifically be a copper layer on the PCB.

[0114] The copper layer on the PCB forms the second conductive layer 102, or in other words, the second conductive layer 102 includes a portion of the copper layer of the PCB. It should be understood that the second conductive layer 102 can also include other metal layers or ground layers.

[0115] As shown in the perspective view, Figure 4b The ground plate 13 is located directly below the metal back cover 12, and in the thickness direction of the electronic device, the ground plate 13 is spaced apart from the metal back cover 12, for example, the ground plate 13 is arranged in parallel to the metal back cover 12 in the XY plane.

[0116] As shown in the perspective view, Figure 4e The ground plate 13 is located directly above the display module 10, and in the thickness direction of the electronic device, the ground plate 13 is spaced apart from the display module 10, for example, the ground plate 13 is arranged in parallel to the display module 10 in the XY plane.

[0117] In this way, the ground plate 13 can be reused for the first antenna unit 001, without the need to additionally arrange other metal components, which can reduce the manufacturing cost of the antenna and save space.

[0118] As shown in the perspective view, Figure 4 The first feeding system 14 includes a first feeding unit 141 and a first grounding unit 142. In some embodiments of the present application, the first feeding unit 141 is electrically connected to the first conductive layer 101, and the first grounding unit 142 is electrically connected to the ground plate 13, and the first feeding unit 141 feeds the first conductive layer 101.

[0119] In other embodiments of the present application, the first feeding unit 141 is coupled to the first conductive layer 101, and the first feeding unit 141 couples to feed the first conductive layer 101.

[0120] As shown in the perspective view, Figure 4b , Figure 4e The electronic device 01 further includes a conductive frame 112 (for example, including the first conductive frame 111).

[0121] As shown in the perspective view, Figure 1 The conductive frame 112 is arranged around the carrier plate 110, and the projection of the conductive frame 112 on the carrier plate 110 is located at the edge of the carrier plate 110.

[0122] The conductive connection part 113 is located in the area surrounded by the conductive frame 112, for example, the conductive connection part 113 is arranged relative to the first conductive frame 111, and for example, the conductive connection part 113 is located inside the first conductive frame 111. AsFigure 4b As shown, the conductive connection part 113 is used to connect the metal back cover 12 and the ground plate 13, and the conductive connection part 113, the first conductive frame 111, the metal back cover 12 and the ground plate 13 enclose the first cavity. Among them, the metal back cover 12 and the first conductive frame 111 are arranged in a spaced manner and enclose the first gap 104. Or as Figure 4e As shown, the conductive connection part 113 is used to connect the display module 10 (for example, a conductive layer arranged on the display module 10) and the ground plate 13, and the conductive connection part 113, the first conductive frame 111, the display module 10 and the ground plate 13 enclose the first cavity. Among them, the display module 10 and the first conductive frame 111 are arranged in a spaced manner and enclose the first gap 104.

[0123] Therefore, part of the conductive frame 112 can be reused for the first antenna unit 001, without the need to additionally arrange other metal components, which can reduce the manufacturing cost of the antenna and save space.

[0124] In Figure 4b In the embodiment shown, the projection of the conductive connection part 113 on the XY plane is located within the projection range of the metal back cover 12 on the XY plane. In some embodiments, the projection of the conductive connection part 113 on the ground plate 13 is located within the projection range of the metal back cover 12 on the ground plate 13. In some specific embodiments, the conductive connection part 113 is flush with the edge of the metal back cover 12.

[0125] In Figure 4e In the embodiment shown, the projection of the conductive connection part 113 on the XY plane is located within the projection range of the display module 10 on the XY plane. In some embodiments, the projection of the conductive connection part 113 on the ground plate 13 is located within the projection range of the display module 10 on the ground plate 13. In some specific embodiments, the conductive connection part 113 is flush with the edge of the display module 10.

[0126] The conductive connection part 113 is located within the area enclosed by the conductive frame 112, and at least one side of the conductive connection part 113 has an opening, and part of the conductive frame 112, for example, the first conductive frame 111, is located at the opening of the conductive connection part 113. For example, Figure 4f The thick solid line shown is the projection of the conductive connection part 113 on the XY plane, and the opening of the conductive connection part 113 is the thick solid line, which is the projection of the first conductive frame 111 on the XY plane located at the opening.

[0127] It should be noted that in some embodiments, the conductive connection portion 113 is flush with the edge of the metal back cover 12 or the display module 10, and when the projection of the metal back cover 12 or the display module 10 on the XY plane and the first conductive frame 111 have no gap, the projection of the first conductive frame 111 and the conductive connection portion 113 on the XY plane intersects, and at this time, the thin solid line intersects the thick solid line.

[0128] In other embodiments, when the projection of the metal back cover 12 or the display module 10 on the XY plane and the first conductive frame 111 have a gap, or the conductive connection portion 113 is not flush with the edge of the metal back cover 12 or the display module 10, for example, the conductive connection portion 113 is arranged inside the edge of the metal back cover 12 or the display module 10, the projection of the first conductive frame 111 and the conductive connection portion 113 on the XY plane has a gap, and at this time, the thin solid line does not intersect the thick solid line. These all belong to the protection scope of the present application.

[0129] wherein, Figure 4b The ground plate 13, the first conductive frame 111, the metal back cover 12, and the conductive connection portion 113 in the first cavity are collectively arranged. And the first gap 104 is arranged between the first conductive frame 111 and the metal back cover 12, for example, the first conductive frame 111 and the metal back cover 12 are arranged oppositely with a certain interval to form the first gap 104, and the first conductive frame 111 and the metal back cover 12 are connected by filling insulating material in the first gap 104.

[0130] Similarly, Figure 4e The ground plate 13, the first conductive frame 111, the display module 10, and the conductive connection portion 113 in the first cavity are collectively arranged. And the first gap 104 is arranged between the first conductive frame 111 and the display module 10, for example, the first conductive frame 111 and the display module 10 are arranged oppositely with a certain interval to form the first gap 104, and the first conductive frame 111 and the display module 10 are connected by filling insulating material in the first gap 104.

[0131] In some embodiments, the first gap 104 can extend in the length direction of the electronic device, for example, in the Y-axis direction shown in Figure 4b and Figure 4e .

[0132] The electronic device provided by the embodiments of the present application has the ground plate 13 and the metal plate (for example, the metal back cover 12 or the display module 10) arranged in a stacked manner, and the ground plate and the metal plate are connected through the conductive connecting part 113, the metal plate and the conductive frame form the first gap, so that the ground plate, the metal plate, the conductive connecting part 113 and the conductive frame together form a first cavity with the first gap. The first cavity can be a closed cavity or a non-closed cavity except for the first gap 104, which will be described in more detail below. By arranging the first gap between the conductive frame and the metal back cover or the display module, the first antenna unit can radiate or receive electromagnetic waves through the first gap, so that the surface of the electronic device is not required to be slotted on the surface of the metal back cover 12, and the integrity of the surface of the electronic device is improved.

[0133] It should be noted that the length of the first gap 104 is not limited in the present application, and the length of the gap can be adjusted according to the industrial design (ID) of the electronic device.

[0134] In some embodiments, the first gap 104 is filled with an insulating material; in other embodiments, the first gap 104 is partially filled with an insulating material and partially connected by a metal part, wherein the part of the first gap 104 filled with the insulating material can be used for radiating or receiving signals.

[0135] The embodiments of the present application do not limit the conductive connecting part, and in some embodiments of the present application, as shown in Figure 4b , Figure 4e , Figure 4f , the conductive connecting part 113 adopts a conductive wall structure.

[0136] The conductive wall structure can be a continuous metal sheet, for example, a bent metal sheet, or a non-continuous metal sheet, for example, several metal sheets combined at an angle. As shown in Figure 4b , the sheet-shaped conductive wall structure is arranged between the metal back cover 12 and the ground plate 13, and one end is connected with the metal back cover 12 and the other end is connected with the ground plate 13. Or as shown in Figure 4e , the sheet-shaped conductive wall structure is arranged between the ground plate 13 and the display module 10, and one end is connected with the display module 10 and the other end is connected with the ground plate 13.

[0137] In other embodiments of the present application, as shown in Figure 4g , Figure 10 , the conductive connecting part 113 includes a plurality of conductive connecting parts 203 or a plurality of point connecting structures 203. The plurality of connecting structures 203 or the plurality of point connecting structures 203 can be metal sheets or metal springs arranged at different positions, for example, separate metal sheets or separate metal springs.

[0138] Each of the conductive connection sections 203 or each of the point connection structures is used to connect the ground plate 13 and a metal plate (not shown). One of the plurality of connection sections 203 or one of the plurality of point connection structures 203 can be a metal sheet or a metal spring.

[0139] In the present application Figure 10 In the provided embodiments, the ground plate 13 is stacked with the first conductive layer (for example, the metal back cover 12 or the display module 10), and the ground plate and the first conductive layer are connected through the plurality of connection sections, and then the conductive frame is used to form a first cavity with the first gap 104 together. The first cavity can be a non-closed cavity except for the first gap 104. By setting the first gap between the conductive frame and the metal back cover, the first antenna unit can radiate or receive electromagnetic waves through the first gap, so that the surface of the electronic device is not required to be slotted on the surface of the metal back cover 12, thereby improving the integrity of the surface of the electronic device.

[0140] The shape of the conductive connection section is not limited in the embodiments of the present application. As shown in Figure 4f The conductive connection section 113 and the first conductive frame 111 project a regular or irregular pattern on the ground plate, wherein the thick solid line part is the projection of the first conductive frame 111, and the thin solid line part is the projection of the conductive connection section 113. It should be understood that the thin solid line part representing the conductive connection section 113 and the thick solid line part representing the first conductive frame 111 can intersect or have a gap as described above, which will not be described here. The thin solid line part representing the conductive connection section 113 can also be replaced by a thin dashed line, as shown in Figure 4g The conductive connection section 113 has a plurality of non-continuous connection structures 113.

[0141] As shown in (a), (b), (c), (d), (e), (f), and (g) in Figure 4f The conductive connection section 113 can be substantially perpendicular to the ground plate, and the projection of the conductive connection section 113 on the bearing plate can be one of a curve, a straight line, or a broken line, or a combination of any of them. Of course, in other embodiments, the included angle between the conductive connection section 113 and the bearing plate can be greater than or less than 90°, and the projection of the conductive connection section 113 on the bearing plate can have a certain width.

[0142] It should be noted that the curve, straight line, or broken line and other lines herein represent the projection extension direction of the three-dimensional structure with a certain thickness, and should not be understood as the thickness of the line.

[0143] The position relationship between the plurality of connection sections 203 and the plurality of point connection structures 203 is not limited in the embodiments of the present application, wherein, as shown in Figure 4g(a), (b), (c), (d), (e), (f), (g) in FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, FIG. 1E, FIG. 1F, FIG. 1G, and FIG. 1H, respectively, the projection of the multi-segment connection structure 203 on the carrier plate can be a dashed line. The multi-segment connection structure can be arranged in a regular or irregular pattern. Figure 10 , Figure 24 As shown in FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, FIG. 1E, FIG. 1F, FIG. 1G, and FIG. 1H, the projection of the multi-segment connection structure 203 on the carrier plate can be a dashed line. The multi-segment connection structure can be arranged in a regular or irregular pattern.

[0144] The distance between adjacent multi-segment connection structures or adjacent point connection structures is less than or equal to one-half of the wavelength corresponding to the center frequency of the first antenna 001. The distance between adjacent multi-segment connection structures or the distance between adjacent point connection structures can be the minimum straight-line distance or the minimum path distance between the connection points of the first conductive layer or the second conductive layer (e.g., the ground plate 13, the metal back cover 12, or the display module 10).

[0145] In some embodiments of the present application, as shown in FIG. 1A, the first antenna unit 001 formed by the metal back cover 12, the ground plate 13, the first conductive frame 111, and the C-shaped conductive connection portion 113 is arranged at the middle of the right side of the electronic device (back view). For example, the first conductive frame 111 of the first antenna unit 001 does not include the upper and lower frames, the C-shaped conductive connection portion 113 connects the metal back cover 12 and the ground plate 13, and the straight conductive frame and the metal back cover 12 have a first gap therebetween. Figure 5 In some embodiments of the present application, as shown in FIG. 1A, the first antenna unit 001 formed by the metal back cover 12, the ground plate 13, the first conductive frame 111, and the C-shaped conductive connection portion 113 is arranged at the middle of the right side of the electronic device (back view). For example, the first conductive frame 111 of the first antenna unit 001 does not include the upper and lower frames, the C-shaped conductive connection portion 113 connects the metal back cover 12 and the ground plate 13, and the straight conductive frame and the metal back cover 12 have a first gap therebetween.

[0146] Figure 16 In some embodiments of the present application, as shown in FIG. 1A, the first antenna unit 001 formed by the metal back cover 12, the ground plate 13, the first conductive frame 111, and the C-shaped conductive connection portion 113 is arranged at the middle of the right side of the electronic device (back view). For example, the first conductive frame 111 of the first antenna unit 001 does not include the upper and lower frames, the C-shaped conductive connection portion 113 connects the metal back cover 12 and the ground plate 13, and the straight conductive frame and the metal back cover 12 have a first gap therebetween.

[0147] The present application does not limit the first gap structure between the first conductive layer (e.g., the metal back cover 12 or the display module 10) and the conductive frame.

[0148] In some embodiments of the present application, the height of the metal frame (in the thickness direction of the electronic device) is less than the height difference between the first conductive layer and the ground plate. The first gap between the first conductive layer and the conductive frame includes:

[0149] The first gap between the first conductive layer and the ground plate in the plane of the metal frame is the first gap. For example, the first gap is located in the X-Z plane as shown in FIG. 1A. Figure 4a

[0150] ​​Or, the second gap between the first conductive layer and the conductive frame in the plane of the ground plate is the first gap. For example, the first gap is located Figure 4a The X-Y plane is shown.

[0151] Or, the first gap and the second gap together form the first gap.

[0152] In order to ensure the integrity of the appearance design (Industrial Design, ID) of the electronic device, the first gap between the metal plate and the conductive frame is filled with an insulating material, for example.

[0153] The specific material of the insulating material is not limited in the embodiments of the present application. In some embodiments of the present application, the insulating material is, for example, polycarbonate and acrylonitrile-butadiene-styrene copolymer and PC / ABS material.

[0154] In some embodiments of the present application, the size and related parameters of the first antenna unit are set as follows:

[0155] As shown in Figure 4a The size of the ground plate 13 is L1*L2, where L1 is 78mm and L2 is 158mm.

[0156] As shown in Figure 4b , Figure 4c , Figure 4d The thickness of the metal back cover 12 is L3, which is 1mm. The gap width between the metal back cover 12 and the first conductive frame 111 (the gap width between the projection of the metal back cover 12 and the first conductive frame 111 on the XY plane) is L4, which is 2mm. The gap is filled with an insulating material, for example. The height difference L5 between the inner surface of the metal back cover 12 and the first conductive frame 111 in the thickness direction of the electronic device 01 is 1.3mm. The height L6 of the first conductive frame 111 is 2mm, and the width L7 is 1mm. The projection of the first conductive frame 111 on the XY plane is located within the projection range of the display module 10 on the XY plane, for example. The height difference L8 between the lower edge of the first conductive frame 111 and the display module 10 is 2.5mm, and the thickness L9 of the display module 10 is 1mm.

[0157] Example one:

[0158] The first antenna unit 001 is arranged at the middle position of the right side of the electronic device 01 (back view), and the upper side, left side and lower side of the first antenna unit 001 are connected by the conductive connection part 113 to realize the connection between the metal plate (not shown) and the ground plate 13, and to have a first gap between the first conductive frame 111 on the right side of the electronic device and the metal plate.

[0159] The conductive connection part 113 adopts a conductive wall structure.

[0160] like Figure 5 As shown, the feed point and ground point of the first antenna element can be located in the middle of the first antenna element (e.g., the feed point is located in the middle of the first conductive layer; the ground point is located in the middle of the second conductive layer) or any other location. A first feeding system 14 is connected between the feed point and ground point of the first antenna element. The first feeding system 14 includes, for example, a first feeding unit and a first ground unit. In some embodiments of this application, the first feeding unit is electrically connected to the feed point of the first conductive layer (e.g., the metal back cover 12 or the display module 10), and the first ground unit is electrically connected to the ground point of the second conductive layer (e.g., the ground plane 13). Power can be fed to the first conductive layer through the first feeding unit.

[0161] The first feeding unit can use coupled feeding. In this case, the conductive frame 112 around the electronic device is completely grounded and does not participate in radiation.

[0162] Figure 6 for Figure 5 The S11 parameter distribution diagram of the first antenna element. Figure 7 for Figure 5 A schematic diagram of the antenna radiation efficiency of the first antenna element. Figure 8 for Figure 5 A schematic diagram showing the current and electric field distribution of the first antenna element. Figure 9 for Figure 5 Simulation diagram of the radiation direction of the first antenna element.

[0163] like Figure 6 As shown by curve a in the figure, the first antenna element resonates at two frequency points, ① and ②.

[0164] Among them, resonance ① can be generated by half-wavelength mode of the first antenna element, and resonance ② can be generated by double-wavelength mode of the first antenna element.

[0165] It should be noted that a half-wavelength resonant mode means that the first antenna element resonates at half the wavelength, while a one-wavelength resonant mode means that the first antenna element resonates at one wavelength.

[0166] The S11 parameter distribution diagram of the first antenna element is as follows: Figure 6 As shown by curve a in the figure. Figure 6 As shown by curve a in the figure, the S11 parameter of the first antenna element is relatively small when resonance occurs, resulting in low antenna return loss. The antenna radiation efficiency of the first antenna element can be referenced... Figure 7 Curve 2 in the image. (Example) Figure 7 As shown in curve 2, the first antenna element has a higher radiation efficiency when it resonates.

[0167] Additionally, antenna system efficiency can be referenced.Figure 7 Curve 1 in the diagram.

[0168] Figure 8 Figure (a) shows the current distribution of the first antenna element when it resonates at 3.87 GHz. Figure 8 (c) shows the electric field distribution of the first antenna element when it resonates at 3.87 GHz.

[0169] like Figure 8 As shown in (a) and (c), the current in the first antenna element flows from the middle of the first slot to both ends of the first slot, with the strongest current at both ends and the strongest electric field at the middle of the first slot. The signal resonating ① can be radiated by the half-wavelength mode of the first antenna element.

[0170] Figure 8 Figure (b) shows the current distribution of the first antenna element when it resonates at 7 GHz. Figure 8 (d) in the figure shows the electric field distribution of the first antenna element when it resonates at 7 GHz.

[0171] like Figure 8 As shown in (b) and (d), there are two strong current points on the first slot of the first antenna element, and the two ends and the middle position of the first slot are strong electric field points. The signal of resonance ② can be radiated by the one-wavelength mode of the first antenna element.

[0172] Therefore, the resonance ① that occurs at 3.87 GHz of the first antenna element is half the wavelength mode of the first antenna element, and the resonance ② that occurs at 7 GHz of the first antenna element is one wavelength mode of the first antenna element.

[0173] The simulation diagram of the radiation direction of the first antenna element is as follows: Figure 9 (a) and Figure 9 As shown in (b) in the diagram. Figure 9 As shown in (a) and Figure 9 As shown in (b) of the diagram, where, Figure 9 In the diagram, D represents the directivity coefficient in the direction indicated by the arrow. The direction indicated by the arrow has the largest directivity coefficient and serves as the main radiation direction of the first antenna element. When the first antenna element resonates, its main radiation direction points to the left.

[0174] Example 2:

[0175] In other embodiments of this application, the conductive wall structure is often not fully implemented, and multiple point connection structures are generally used instead. To ensure the excitation of the first antenna element mode, the distance between adjacent point connection structures cannot exceed half the wavelength corresponding to the center frequency of the first antenna 001. The distance between adjacent point connection structures can be the minimum straight-line distance or the minimum path between their respective connections to the first conductive layer or the second conductive layer (e.g., ground plane 13, metal back cover 12, or display module 10). The conductive connection part includes multiple point connection structures, one end of which is connected to the ground plane 13 and the other end is connected to the metal back cover 12. The point connection structure is, for example, a metal spring.

[0176] like Figure 10 As shown in (a), the first antenna element is the same as the first antenna element in Example 1, and the conductive connection part adopts a conductive wall structure; as Figure 10 As shown in (b), the conductive connection part adopts a 5-point connection structure; as Figure 10 As shown in (c), the conductive connection part adopts a 3-point connection structure.

[0177] Figure 11 and Figure 12 The performance comparison of the first antenna element using a conductive wall structure, a 5-point connection structure, and a 3-point connection structure is shown.

[0178] in, Figure 11 S11 parameter distribution diagram of another first antenna element provided in the embodiments of this application. Figure 12 This is a schematic diagram of the antenna radiation efficiency of another first antenna element provided in an embodiment of this application.

[0179] Figure 10 The S11 parameter distribution diagram of the first antenna element shown in (a) is as follows: Figure 11 As shown by curve a in the figure. Figure 10 The S11 parameter distribution diagram of the first antenna element shown in (b) is as follows: Figure 11 As shown by curve b in the figure. Figure 10 The S11 parameter distribution diagram of the first antenna element shown in (c) is as follows: Figure 11 As shown by curve c in the figure.

[0180] contrast Figure 11 As can be seen from curves a, b, and c, after changing the conductive connection part from a conductive wall to a point connection structure, some ripples appear on the S11 curve due to leakage of the cavity, but the resonant frequency remains basically unchanged, and the antenna radiation mode is basically maintained. In addition, compared with the conductive wall structure, the resonant frequency of the point connection structure is reduced.

[0181] Figure 10 The radiation efficiency of the first antenna element shown in (a) is as follows:Figure 11 The radiation efficiency of the first antenna unit shown in (a) of FIG. 10 is shown by curve 1 in FIG. 11. Figure 10 The radiation efficiency of the first antenna unit shown in (b) of FIG. 10 is shown by curve 2 in FIG. 11. Figure 11 The radiation efficiency of the first antenna unit shown in (c) of FIG. 10 is shown by curve 3 in FIG. 11. Figure 10 The radiation efficiency of the first antenna unit shown in (a) of FIG. 10 is shown by curve 1 in FIG. 11. Figure 11 The radiation efficiency of the first antenna unit shown in (b) of FIG. 10 is shown by curve 2 in FIG. 11.

[0182] In addition, the system efficiency of the first antenna unit shown in (a) of FIG. 10 is shown by curve 1 in FIG. 12. Figure 10 The system efficiency of the first antenna unit shown in (a) of FIG. 10 is shown by curve 1 in FIG. 12. Figure 11 The system efficiency of the first antenna unit shown in (b) of FIG. 10 is shown by curve 2 in FIG. 12. Figure 10 The system efficiency of the first antenna unit shown in (c) of FIG. 10 is shown by curve 3 in FIG. 12. Figure 11 The system efficiency of the first antenna unit shown in (a) of FIG. 10 is shown by curve 1 in FIG. 12. Figure 11 The system efficiency of the first antenna unit shown in (b) of FIG. 10 is shown by curve 2 in FIG. 12. Figure 13 The system efficiency of the first antenna unit shown in (c) of FIG. 10 is shown by curve 3 in FIG. 12.

[0183] By comparing curve 1, curve 2 and curve 3 in FIG. 11, and comparing curve 1-1, curve 2-1 and curve 3-1 in FIG. 12, it can be seen that, after the point connection, due to the leakage of the cavity, some ripples appear on the radiation efficiency and system efficiency curves of the first antenna unit, but the antenna radiation mode is basically maintained. Figure 13 Figure 14 Example Three:

[0184] When the size of the cavity of the first antenna unit is adjusted, the antenna resonance frequency can be changed.

[0185] As shown in (a) of FIG. 13, the size of the first antenna unit in the X direction is d1, as shown in (b) of FIG. 13, the size of the first antenna unit in the X direction is d2. Wherein, d1 is for example 16mm, d2 is for example 10mm.

[0186] As shown in (a) of FIG. 13, the size of the first antenna unit in the X direction is d1, as shown in (b) of FIG. 13, the size of the first antenna unit in the X direction is d2. Wherein, d1 is for example 16mm, d2 is for example 10mm. Figure 15 Figure 14 As shown in (a) of FIG. 13, the size of the first antenna unit in the X direction is d1, as shown in (b) of FIG. 13, the size of the first antenna unit in the X direction is d2. Wherein, d1 is for example 16mm, d2 is for example 10mm.

[0187] Figure 13 and Figure 15 The performance comparison of the first antenna unit when the size of the first antenna unit in the X direction is d1 and d2 is shown.

[0188] Wherein, Figure 13 is the S11 parameter distribution diagram of the first antenna unit in FIG. 14. Figure 13 is the antenna radiation efficiency diagram of the first antenna unit in FIG. 14. Figure 14 Figure 13 The S11 parameter distribution diagram of the first antenna unit shown in (a) of FIG. 14 is shown by curve a in FIG. 15.

[0189] The antenna radiation efficiency diagram of the first antenna unit shown in (a) of FIG. 14 is shown by curve a in FIG. 15. Figure 14 The S11 parameter distribution diagram of the first antenna unit shown in (a) of FIG. 14 is shown by curve a in FIG. 15. Figure 13 The antenna radiation efficiency diagram of the first antenna unit shown in (a) of FIG. 14 is shown by curve a in FIG. 15. Figure 13 ​​The S11 parameter distribution diagram of the first antenna element shown in (b) is as follows: Figure 15 As shown by curve b in the figure.

[0190] contrast Figure 10 As can be seen from curves a and b, when the width of the conductive wall in the X direction decreases, the resonant frequency of the first antenna element increases.

[0191] Figure 15 The radiation efficiency of the first antenna element shown in (a) is as follows: Figure 13 The curve in Figure 1-1 is shown. Figure 15 The radiation efficiency of the first antenna element shown in (b) is as follows: Figure 13 The curve in Figure 2-1 is shown.

[0192] in addition Figure 15 The system efficiency of the first antenna element shown in (a) is as follows: Figure 15 As shown in curve 1. Figure 15 The system efficiency of the first antenna element shown in (b) is as follows: Figure 16 As shown in curve 2.

[0193] contrast Figure 17 As can be seen from curves 1 and 2, and by comparison Figure 16 As can be seen from curves 1-1 and 2-15, the efficiency of the first antenna element does not change much when the width of the conductive wall in the X direction is reduced.

[0194] Example 4:

[0195] Building upon Example 1, the conductive wall structure of the first antenna element, which was previously connected by three sides (top, left, and bottom), can be changed to be connected by only two sides, for example, by connecting the left and bottom sides, while leaving the top and right sides open. Figure 18 As shown.

[0196] in, Figure 16 for Figure 19 The S11 parameter distribution diagram of the first antenna element. Figure 16 for Figure 20 A schematic diagram of the antenna radiation efficiency of the first antenna element. Figure 16 for Figure 17 A schematic diagram showing the current and electric field distribution of the first antenna element. Figure 17 for Figure 17 Simulation diagram of the radiation direction of the first antenna element.

[0197] like Figure 18 As shown by curve a in the figure, the first antenna element resonates at two frequency points ① and ②. According to the frequency points from small to large, the resonant modes are the half-wavelength mode and the three-quarter wavelength mode, respectively.

[0198] It should be noted that a half-wavelength resonant mode means that the first antenna element resonates at half the wavelength, while a three-quarter wavelength resonant mode means that the first antenna element resonates at three-quarters the wavelength.

[0199] The S11 parameter distribution diagram of the first antenna element is as follows: Figure 18 As shown by curve a in the figure. (Reference) Figure 18 In curve a, the S11 parameter of the first antenna element is smaller when resonance occurs, the antenna return loss is smaller, and the antenna radiation efficiency is larger.

[0200] The antenna radiation efficiency of the first antenna element can be referenced. Figure 19 Curve 2 in the image. (Example) Figure 19 As shown in curve 2, the first antenna element has a higher radiation efficiency when it resonates.

[0201] Additionally, antenna system efficiency can be referenced. Figure 19 Curve 1 in the diagram.

[0202] Figure 19 Figure (a) shows the current distribution of the first antenna element when it resonates at 3.87 GHz. Figure 19 (c) shows the electric field distribution of the first antenna element when it resonates at 3.87 GHz.

[0203] like Figure 19 As shown in (a) and (c), the current in the first antenna element flows from the middle of the first slot to both ends of the first slot, with the electric field being strongest at the middle position of the first slot. The signal resonating ① can be radiated by the half-wavelength mode of the first antenna element.

[0204] Figure 20 Figure (b) shows the current distribution of the first antenna element when it resonates at 4.89 GHz. Figure 20 (d) in the figure shows the electric field distribution of the first antenna element when it resonates at 4.89 GHz.

[0205] like Figure 20 As shown in (b) and (d), the current in the first antenna element flows from the middle of the first slit to both ends of the first slit, with one end of the first slit being a point of high electric field strength. The signal of resonance ② can be radiated by the three-quarter wavelength mode of the first antenna element.

[0206] Therefore, the resonance ① occurring at 3.87 GHz of the first antenna element is the half-wavelength mode of the first antenna element, and the resonance ② occurring at 4.89 GHz of the first antenna element is the three-quarter wavelength mode of the first antenna element.

[0207] Figure 21(a) in FIG. 1 shows the radiation pattern of the first antenna unit when resonating at 3.87 GHz, Figure 21a (b) in FIG. 1 shows the radiation pattern of the first antenna unit when resonating at 4.89 GHz, Figure 21 As shown in FIG. 1, the main radiation direction of the first antenna unit at 3.87 GHz is to the left, and the main radiation direction of the first antenna unit at 4.89 GHz is downward.

[0208] In some embodiments of the present application, the electronic device 01 further comprises a second antenna unit 002. The second antenna unit 002 can be composed of a part of the conductive frame 112.

[0209] The second antenna unit 002 can use the conductive conductive frame 112 to realize signal transmission or reception. It can also use a conductive radiator arranged inside the non-conductive conductive frame 112 or a conductive radiator embedded inside the non-conductive conductive frame 112 to realize signal transmission or reception.

[0210] In some embodiments, the first antenna unit 001 and the second antenna unit 002 can work in different frequency bands and be used as dual antennas.

[0211] At this time, filter devices can be respectively arranged at the feed ends of the first antenna unit 001 and the second antenna unit 002 to filter out signals of non-working frequency bands, avoid the first antenna unit 001 and the second antenna unit 002 working at the same frequency, and improve the isolation between the first antenna unit 001 and the second antenna unit 002.

[0212] In some embodiments of the present application, the first antenna unit 001 and the second antenna unit 002 can work in the same frequency band, the first antenna unit 001 can be coupled with the second antenna unit 002, and the second antenna unit 002 can act as a parasitic radiator of the first antenna unit. At this time, the first antenna unit 001 and the second antenna unit 002 can be used as one antenna.

[0213] The present example takes the case where the first antenna unit 001 and the second antenna unit 002 work in different frequency bands as an example for illustration.

[0214] In some embodiments of the present application, as shown in FIG. 1, Figure 4c , Figure 21b The second antenna unit comprises a second ground unit 152, a first radiator 21 and a second feed unit 151.

[0215] The second ground unit 152 is electrically connected with the conductive frame 112.

[0216] The conductive frame 112 is further provided with a second gap 121. The conductive frame between the second ground unit 152 and the second gap 121 forms the first radiator 21. The second feeding unit 151 is electrically connected to the feeding end 1511 of the first radiator 21.

[0217] Thus, multiple antennas can be arranged on the electronic device. The first antenna unit and the second antenna unit can work simultaneously, enhancing the reliability of signal processing, signal transmission range and throughput, and improving communication quality.

[0218] Reference is made to Figure 21c The first radiator 21 is located at the opening of the conductive connection part 113, for example, the first radiator 21 is located at the thick solid line shown in Figure 21d .

[0219] Thus, the second antenna unit can be reused for the first antenna unit, and the bandwidth of the first antenna unit can be expanded.

[0220] Example Five:

[0221] As shown in Figure 21b , Figure 21b , Figure 21c , the electronic device 01 includes: a first antenna unit 001 as shown in Example One, and a second antenna unit 002. Figure 21d The first antenna unit 001 is the first antenna unit in Example One. The feeding and grounding modes are not repeated here.

[0222] As shown in Figure 4f , Figure 4g , Figure 21 , the second antenna unit 002 includes: a first radiator 21, and a second radiator 22. The first radiator 21 and the second radiator 22 employ distributed feeding. At least one of the first radiator 21 and the second radiator 22 is partially reused as a parasitic radiator of the first antenna unit 001 or as a part thereof, for example, at least one of the first radiator 21 and the second radiator 22 is located at the thick solid line shown in Figure 21a or Figure 4f .

[0223] In one embodiment, the second antenna unit 002 is arranged at the first gap on the right side of the first antenna unit 001. The two antennas can share the radiator, for example, the first radiator 21 and the second radiator 22 of the second antenna unit 002 can reuse the conductive frame part of the first antenna unit 001.

[0224] The electronic device further includes a second feeding system 15. The second feeding system 15 is used to feed the first radiator 21 and the second radiator 22.

[0225] The second feeding system 15 comprises, for example, a second feeding unit 151, a second grounding unit 152, and a third grounding unit 153.

[0226] Referring to Figure 4g and Figure 22 , the conductive frame 112 is provided with a second slit 121, and the conductive frame 112 between the second grounding unit 152 and the second slit 121 forms a first radiator 21.

[0227] The conductive frame 112 is further provided with a third slit 122, and the conductive frame 112 between the second slit 121 and the third slit 122 forms a second radiator 22.

[0228] The second feeding unit 151 is coupled to a feeding end 1512 of the second radiator 22 to feed the second radiator 22, and the third grounding unit 153 is electrically connected to the second radiator 22.

[0229] In another embodiment of the present application, the second radiator is coupled to the first radiator. Thus, the second radiator can serve as a parasitic radiator of the first radiator, and the manufacturing cost of the antenna can be reduced.

[0230] At least one of the first radiator 21 and the second radiator 22 is located Figure 21d or Figure 23 at the thick solid line shown. Thus, the first antenna unit can be coupled to the second antenna unit, and the bandwidth of the first antenna unit can be widened.

[0231] The second antenna unit further comprises a first capacitive element C and a first inductive element L, and the second feeding unit 151 is electrically connected to the first radiator 21 through the first capacitive element C and is electrically connected to the second radiator 22 through the first inductive element L. The first capacitive element C and the first inductive element L are used for impedance matching of the first antenna unit 001.

[0232] In addition, the second antenna unit further comprises a first filter element and a second filter element (not shown in the figure), and the second feeding unit 151 is electrically connected to the first radiator 21 through the first filter element and is electrically connected to the second radiator 22 through the second filter element. The first filter element and the second filter element are used for filtering out signals of the working frequency band of the first antenna unit.

[0233] Thus, the first filter element and the second filter element can filter out signals of non-working frequency bands, and the isolation of the first antenna unit 001 and the second antenna unit 002 can be improved.

[0234] The second ground units 152 and 153 of the second feeding system 15 are connected on a PCB, and the feeding unit 151 is a transmission line connecting the first radiator 21 (which can be an IFA antenna) and the second radiator 22 (which can be a CRLH antenna) above, and is a distributed feeding structure.

[0235] Figure 21d For Figure 21d S11, S22 and S12 parameter distribution diagrams of the antenna units in Figure 22 For Figure 21d Radiation efficiency diagrams of the antenna units in

[0236] Figure 22 The reflection coefficient of the second antenna unit in Figure 21d is shown in the S11 curve in Figure 22 The reflection coefficient of the first antenna unit in Figure 21d is shown in the S22 curve in Figure 23 The isolation of the first antenna unit and the second antenna unit in Figure 21d is shown in the S21 curve in

[0237] Figure 23 The radiation efficiency of the second antenna unit in Figure 21d is shown in curve 1-1 in Figure 23 The radiation efficiency of the first antenna unit in Figure 21 is shown in curve 2-1 in

[0238] In addition, Figure 23 The system efficiency of the second antenna unit in Figure 24 is shown in curve 1 in Figure 25 The system efficiency of the first antenna unit in Figure 24 is shown in curve 2 in

[0239] The resonance of the first antenna unit occurs in the B3 frequency band (uplink 1710-1785MHz, downlink 1805-1880MHz), and the resonance of the second antenna unit occurs in the N79 frequency band.

[0240] Example six:

[0241] As shown in Figure 26 , compared with example four, the conductive wall conductive connection part of the first antenna unit is replaced with a plurality of point connection structures, and other structures remain unchanged.

[0242] In which, Figure 24 For Figure 27 S11, S22 and S12 parameter distribution diagrams of the antenna units in Figure 24 For Figure 28 Antenna radiation efficiency diagrams of the antenna units inFigure 24 As Figure 24 The current and electric field distribution of the second antenna unit in Figure 25 As Figure 24 The radiation direction simulation of the second antenna unit in

[0243] Figure 25 The reflection coefficient of the second antenna unit in Figure 24 is shown in the S11 curve in Figure 25 The reflection coefficient of the first antenna unit in Figure 24 is shown in the S22 curve in Figure 26 The isolation of the first antenna unit and the second antenna unit in Figure 24 is shown in the S21 curve in

[0244] Figure 26 The radiation efficiency of the second antenna unit in Figure 24 is shown in curve 1-1 in Figure 26 The radiation efficiency of the first antenna unit in Figure 24 is shown in curve 2-1 in

[0245] In addition, Figure 26 The system efficiency of the second antenna unit in Figure 25 is shown in curve 1 in Figure 27 The system efficiency of the first antenna unit in Figure 27 is shown in curve 2 in

[0246] As Figure 27 shown, the first antenna unit resonates within the bandwidth corresponding to the four frequency points ①, ②, ③, and ④. Among them, the resonance frequency of resonance ① is 3.85GHz, the resonance frequency of resonance ② is 4.35GHz, the resonance frequency of resonance ③ is 4.8GHz, and the resonance frequency of resonance ④ is 5.5Ghz. Among them, compared with example one and example two, the first antenna unit 001 increases multiple modes in the high frequency band, and the bandwidth coverage increases.

[0247] Figure 27 The current and electric field distribution under the four resonance frequencies ①, ②, ③, and ④ are shown. Among them, Figure 27 The positions circled in (b), (c), and (d) in Figure 27 The positions circled in (e), (f), (g), and (h) in

[0248] Figure 27 (a) in Figure 27 (e) in

[0249] As Figure 27As shown in (a) and (e), the current of the first antenna element flows from the middle of the first slot to both ends of the first slot, and the electric field is strongest at the middle position of the first slot.

[0250] Figure 27 (b) shows the current distribution when resonance ② occurs at 4.35 GHz. Figure 27 (f) in the figure shows the electric field distribution when resonance ② occurs at 4.35 GHz.

[0251] like Figure 27 As shown in (b) and (f), the electric field strength point is on the second antenna element 002.

[0252] Figure 27 (c) shows the current distribution when resonance ③ occurs at 4.8 GHz. Figure 27 (g) in the figure shows the electric field distribution when resonance ② occurs at 4.8 GHz.

[0253] like Figure 27 As shown in (c) and (g), there are electric field strength points at both the first antenna element and the second antenna element.

[0254] Figure 28 (d) shows the current distribution at resonance ④ at 5.5 GHz. Figure 27 (h) in the figure shows the electric field distribution when resonance occurs at 5.5 GHz.

[0255] like Figure 28 As shown in (d) and (h), there are electric field strength points at both the first antenna element and the second antenna element.

[0256] like Figure 28 (a) and (e) in Figure 29 As shown in (a), it can be seen from the current distribution and electric field distribution of resonance ① that the first gap of the first antenna element is the point of strong electric field, and the low resonance is mainly radiated by the first antenna element.

[0257] like ​ (b) and (f), (c) and (g), (d) and (h), and ​ As shown in (b), (c), and (d), the current and electric field distributions at resonances ②, ③, and ④ reveal that there are also strong electric field points at the second antenna element. This indicates that the higher resonances are all coupled to the frame radiator, and the second antenna element participates in the radiation. Furthermore, the radiation pattern is relatively... ​ The variation in (a) is significant. Since the first and second antenna elements do not have the same frequency, it is feasible to reuse the second antenna element in two antenna designs.

[0258] It should be noted that the antenna unit provided by the embodiments of the present application is not limited to the combination of the second antenna unit 002 arranged on the bezel 11 and the first antenna unit 001 arranged on the metal plate. The first antenna unit 001 can also be arranged at the position of the middle frame and formed on the bracket ground structure by using the laser direct structuring (LDS) technology. Therefore, the antenna unit provided by the present application can also be the combination of the bracket antenna and the first antenna unit 001 arranged on the metal plate, and can also be the combination of the bracket antenna and the second antenna unit 002 arranged on the bezel 11.

[0259] As shown in FIG. 1, the electronic device 01 can further include a communication module 010. ​

[0260] For example, the communication module 010 includes the first antenna unit 001 and the second antenna unit 002 in the above embodiments, a mobile communication module, a wireless communication module, a modem processor, a baseband processor, and the like.

[0261] The first antenna unit 001 and the second antenna unit 002 can be used for transmitting and receiving electromagnetic wave signals. Each antenna in the smart appliance can be used to cover a single or multiple communication frequency bands.

[0262] The mobile communication module can provide a wireless communication solution applied to the smart appliance, including a second-generation mobile communication technology (2-Generation wireless telephone technology, 2G), a third-generation mobile communication technology (3rd-Generation, 3G), a fourth-generation mobile communication technology (4th generation mobile communication technology, 4G), a fifth-generation mobile communication technology (5th generation wireless systems, 5G), and the like. The mobile communication module can include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), and the like. The mobile communication module can receive electromagnetic waves by the antenna, and perform filtering, amplification, and the like on the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module can also amplify the signals modulated by the modem processor, and radiate the amplified signals to electromagnetic waves by the antenna. In some embodiments, at least part of the functional modules of the mobile communication module can be arranged in the processor 001. In some embodiments, at least part of the functional modules of the mobile communication module and at least part of the modules of the processor 001 can be arranged in the same device.

[0263] ​The modem processor can include a modulator and a demodulator. The modulator is configured to modulate a low frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is configured to demodulate a received electromagnetic wave signal into a low frequency baseband signal. The demodulator then transmits the demodulated low frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transmitted to the application processor. The application processor outputs sound signals through audio devices (not limited to speakers, microphones, etc.) or displays images or videos on the display screen 009. In some embodiments, the modem processor can be a separate device. In other embodiments, the modem processor can be independent of the processor 001 and be arranged in the same device as the mobile communication module or other functional modules.

[0264] The wireless communication module can provide wireless communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR) technology, etc. The wireless communication module can integrate at least one communication processing module 014. The wireless communication module receives electromagnetic waves via an antenna, performs frequency modulation and filtering processing on the electromagnetic wave signal, and transmits the processed signal to the processor 001. The wireless communication module can also receive signals to be transmitted from the processor 001, perform frequency modulation and amplification, and convert the signals into electromagnetic wave radiation via an antenna.

[0265] In some embodiments, one antenna of the smart appliance is coupled with the mobile communication module, and the other antenna is coupled with the wireless communication module, so that the smart appliance can communicate with the network and other devices through wireless communication technology. The wireless communication technology can include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology, etc. The GNSS can include global positioning system (GPS), global navigation satellite system (GLONASS), beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS), and / or satellite based augmentation systems (SBAS).

[0266] The above description is merely that of the specific embodiments of the present application, but the scope of the protection of the present application is not limited thereto. It is intended to cover any variation or alteration within the scope of the present application. Therefore, the scope of the protection of the present application should be defined by the appended claims rather than by the description.

Claims

1. An electronic device comprising a conductive frame, a ground plane, and a first antenna element, the conductive frame being disposed around the periphery of the electronic device, characterized in that, The first antenna unit comprises: a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are arranged in a thickness direction of the electronic device, wherein the second conductive layer is part of the ground plate, or the second conductive layer is electrically connected or coupled to the ground plate; a conductive connecting part for connecting the first conductive layer and the second conductive layer; and a first conductive frame, the first conductive frame is part of the conductive frame, wherein the conductive connecting part, the first conductive frame, the first conductive layer and the second conductive layer form a first cavity, the first conductive layer and the first conductive frame are arranged in a first gap of the first cavity, and the first antenna unit radiates or receives electromagnetic waves through the first gap.

2. The electronic device of claim 1, wherein, The electronic device further comprises a first feeding unit for feeding the first antenna unit through the first conductive layer, wherein the first feeding unit is electrically connected or coupled to the first conductive layer.

3. The electronic device of claim 2, wherein, The electronic device further comprises a first grounding unit electrically connected to the second conductive layer, wherein the first grounding unit and the first feeding unit form a first feeding system for the first antenna unit.

4. The electronic device of any of claims 1-3, wherein, The electronic device further comprises a metal back cover forming the first conductive layer.

5. The electronic device of claim 4, wherein, The surface of the metal back cover is not provided with a slot.

6. The electronic device of claim 4, wherein, The electronic device further comprises a display module, and the display module is provided with the first conductive layer on a side facing the ground plate.

7. The electronic device of any of claims 1-6, wherein, The conductive connecting part adopts a conductive wall structure, and the two sides of the conductive wall are connected to the first conductive layer and the second conductive layer, respectively.

8. The electronic device of any of claims 1-6, wherein, The conductive connecting part comprises a plurality of point connection structures, and the distance between adjacent point connection structures is less than or equal to one half of the wavelength corresponding to the center frequency of the first antenna operating frequency band.

9. The electronic device of any of claims 1-8, wherein, The height of the first conductive frame is less than the height difference between the first conductive layer and the second conductive layer.

10. The electronic device of any of claims 1-9, wherein, The projection of the conductive connecting part on the second conductive layer is located within the projection range of the first conductive layer on the second conductive layer.

11. The electronic device of any of claims 1-10, wherein, The conductive connecting part is flush with the edge of the first conductive layer.

12. The electronic device of any of claims 1-11, wherein, The projection of the first conductive layer and the first conductive frame on a first plane has no gap, wherein the first plane is a plane perpendicular to the thickness direction of the electronic device.

13. The electronic device of any of claims 1-12, wherein, The first antenna unit is used to generate a first resonance and a second resonance, wherein the first resonance is generated by a half-wavelength mode of the first antenna unit, and the second resonance is generated by a one-wavelength mode or a three-quarter wavelength mode of the first antenna unit.

14. The electronic device of any of claims 1-13, wherein, The electronic device further comprises a second antenna unit and a second feeding unit for feeding the second antenna unit, wherein the second antenna unit comprises: a first grounding point provided on the conductive frame; a first radiator, wherein a second gap is provided on the conductive frame, and the conductive frame between the first grounding point and the second gap forms the first radiator, and the first grounding point is used for grounding the second antenna unit.

15. The electronic device of claim 14, wherein, At least a part of the first radiator is formed by the first conductive frame.

16. The electronic device of claim 14 or 15, wherein, The electronic device further includes a first filter device, and the second feeding unit is electrically connected or coupled to the first radiator through the first filter device.

17. The electronic device of any of claims 14-16, wherein, The second antenna unit further includes: A second radiator, the conductive frame is provided with a second gap, and the conductive frame between the first gap and the second gap forms the second radiator; A second grounding point, the second grounding point is arranged on the second radiator and used for grounding the second antenna unit.

18. The electronic device of claim 17, wherein, The first radiator is coupled to the second radiator through the second gap.

19. The electronic device of claim 17, wherein, The electronic device further includes a second filter device, and the second feeding unit is electrically connected or coupled to the second radiator through the second filter device.

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