An automatic cleaning system and method for plate surfaces after development

Abstract

The application discloses a kind of automatic cleaning system and method after developing board surface, and the automatic cleaning system after developing board surface includes conveying line and plasma device.The conveying line is connected with the unloading place of developing equipment, and the conveying line is equipped with moving platform and first manipulator, the moving platform can move along the length direction of conveying line, and the first manipulator is used to take and place the PCB board after development to moving platform.The plasma device is connected with the output end of conveying line, and the plasma device is equipped with second manipulator, and the second manipulator is used to take and place the PCB board in plasma device when moving platform moves to preset position.The application of the above embodiment connects the unloading place of developing equipment and plasma device through conveying line, uses automatic transmission mode, greatly improves transmission efficiency, and develops equipment and plasma device connection operation, reduces manual operation handling, reduces defect rate, improves production capacity, and reduces labor cost.

Description

Technical Field

[0001] This invention relates to a cleaning device, and more particularly to an automatic cleaning system and method for the plate surface after development. Background Technology

[0002] MSAP is short for Fine Line Forming Process, which includes lamination, laser drilling, and circuit exposure. Because its line width and spacing can reach below 50µm, it is widely used in high-precision circuit boards. After exposure and development, MSAP products are traditionally sent directly for copper plating. However, MSAP products have high circuit quality and require a high level of environmental cleanliness; otherwise, foreign matter residues can remain between the lines, causing gaps and short circuits after plating. Therefore, plasma cleaning is generally required after development to improve board cleanliness and reduce the defect rate.

[0003] However, in existing technologies, the PCB board to be cleaned is usually placed manually into the plasma cleaning position for cleaning, and then the PCB board is removed manually. As you can imagine, there are many drawbacks to manual handling of PCB boards, such as low production capacity, high labor costs, and high labor intensity. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an automatic cleaning system for the board surface after development, which greatly shortens the transfer time of a single PCB board from development to cleaning, improves the efficiency of PCB board plasma cleaning, reduces costs, and increases production capacity.

[0005] The present invention also proposes an automatic cleaning method for the plate surface after development.

[0006] An automatic PCB surface cleaning system after development, according to an embodiment of the present invention, includes a conveyor line and a plasma device. The conveyor line is connected to the unloading point of the developing equipment. The conveyor line is equipped with a moving platform and a first robotic arm. The moving platform is movable along the length of the conveyor line, and the first robotic arm is used to pick up and place the developed PCB board onto the moving platform. The plasma device is connected to the output end of the conveyor line, and the plasma device is equipped with a second robotic arm. The second robotic arm is used to pick up and place the PCB board into the plasma device when the moving platform moves to a preset position.

[0007] An automatic cleaning system for the plate surface after development according to an embodiment of the present invention has at least the following beneficial effects:

[0008] By applying the invention described in the above embodiments, the unloading point of the developing equipment and the plasma device are connected by a conveyor line, and an automatic transfer method is adopted, which greatly shortens the transfer time of a single PCB board from developing to cleaning, greatly improves the transfer efficiency, and the line operation of the developing equipment and the plasma device can reduce manual handling, reduce the defect rate, increase production capacity, and reduce labor costs.

[0009] According to some embodiments of the present invention, the plasma device includes a plasma generator, and the plasma generator includes a placement rack for supporting a PCB board from the second robotic arm. The placement rack is slidably disposed in the plasma generator, and the PCB board can be pushed into / out of the plasma generator during the sliding process of the placement rack.

[0010] According to some embodiments of the present invention, the conveyor line extends into the plasma device, the plasma generator is located on one side of the length direction of the conveyor line, and the sliding direction of the placement rack is perpendicular to the length direction of the conveyor line.

[0011] According to some embodiments of the present invention, a telescopic gripper is provided inside the plasma device and on the conveyor line. The telescopic gripper extends in a direction parallel to the moving direction of the placement rack. The gripping end of the telescopic gripper is used to grip the placement rack and can push / pull the placement rack into / out of the plasma machine during the extension and retraction process.

[0012] According to some embodiments of the present invention, the placement rack is provided with a first clamping mechanism and a first metal sensor, wherein the first clamping mechanism is used to clamp the PCB board when the first metal sensor senses the PCB board.

[0013] According to some embodiments of the present invention, the plasma device further includes a tray placement area and a discharge area, the tray placement area and the discharge area being located on the opposite side of the length direction of the conveyor line, and the second robot arm is also used to transport the tray in the tray placement area to the discharge area and place the PCB board cleaned by the plasma machine onto the tray in the discharge area.

[0014] According to some embodiments of the present invention, the plasma device is provided with two plasma generators; the two plasma generators are arranged along the length direction of the conveyor line, and the telescopic gripper is slidably disposed on the conveyor line.

[0015] According to some embodiments of the present invention, the mobile platform is provided with a second clamping mechanism and a second metal sensor, wherein the second clamping mechanism is used to clamp the PCB board when the second metal sensor senses the PCB board.

[0016] According to some embodiments of the present invention, acrylic plates are provided around both the conveyor line and the plasma device.

[0017] An automatic cleaning method for the plate surface after development, according to an embodiment of the invention, is applied to the automatic cleaning system for the plate surface after development described in the above embodiment. The automatic cleaning method for the plate surface after development includes the following steps:

[0018] The first robotic arm obtains the unloading information of the developing equipment, removes the PCB board unloaded from the developing equipment, and places it on the moving platform. When the moving platform moves along the conveyor line to the preset position, the second robotic arm grabs the PCB board on the moving platform, and at the same time, the moving platform returns to the initial position. Then, the second robotic arm places the PCB board on the placement rack, and the placement rack carries the PCB board into the plasma machine for cleaning. At the same time, the second robotic arm grabs a tray from the tray placement area and places it in the discharge area. Finally, the cleaned PCB board is placed on the tray in the discharge area.

[0019] An automatic cleaning method for the plate surface after development according to an embodiment of the present invention has at least the following beneficial effects:

[0020] The feeding point of the developing equipment is connected to the plasma unit via a conveyor line, which adopts an automatic transmission method, greatly improving the transmission efficiency. The connected operation of the developing equipment and the plasma unit reduces manual handling, lowers the defect rate, increases production capacity, and lowers labor costs.

[0021] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0023] Figure 1 This is a schematic diagram of the structure of an automatic cleaning system for the plate surface after development according to an embodiment of the present invention;

[0024] Figure 2 This is a flowchart of an automatic cleaning method for the plate surface after development according to an embodiment of the present invention;

[0025] Icon labels:

[0026] 100. Conveyor line; 101. Mobile platform; 102. First robotic arm; 200. Plasma unit; 201. Second robotic arm; 202. Plasma machine; 203. Placement rack; 204. Telescopic gripper; 205. Placement area; 206. Discharge area; 207. Tray; 300. Developing equipment. Detailed Implementation

[0027] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0028] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0029] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0030] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0031] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0032] Reference Figure 1 As shown, an embodiment of the present invention discloses an automatic PCB surface cleaning system after development. The automatic PCB surface cleaning system after development includes a conveyor line 100 and a plasma device 200. The conveyor line 100 is connected to the unloading point of the developing equipment 300. The conveyor line 100 is equipped with a moving platform 101 and a first robotic arm 102. The moving platform 101 can move along the length direction of the conveyor line 100. The first robotic arm 102 is used to pick up and place the developed PCB board onto the moving platform 101. The plasma device 200 is connected to the output end of the conveyor line 100. The plasma device 200 is equipped with a second robotic arm 201. The second robotic arm 201 is used to pick up and place the PCB board into the plasma device 200 when the moving platform 101 moves to a preset position.

[0033] By applying the invention of the above embodiments, the unloading point of the developing equipment 300 and the plasma device 200 are connected by the conveyor line 100, and an automatic transmission method is adopted, which greatly shortens the transfer time of a single PCB board from developing to cleaning, greatly improves the transmission efficiency, and the line operation of the developing equipment 300 and the plasma device 200 reduces manual handling, lowers the defect rate, increases production capacity, and lowers labor costs.

[0034] Reference Figure 1 As shown, in some embodiments of the present invention, the plasma device 200 is provided with a plasma generator 202, and the plasma generator 202 is provided with a placement rack 203. The placement rack 203 is used to support the PCB board from the second robotic arm 201. The placement rack 203 is slidably disposed in the plasma generator 202. During the sliding process, the placement rack 203 can push the PCB board into / out of the plasma generator 202.

[0035] Reference Figure 1 As shown, in some embodiments of the present invention, the conveyor line 100 extends into the plasma device 200, the plasma machine 202 is located on one side of the length direction of the conveyor line 100, and the sliding direction of the placement rack 203 is perpendicular to the length direction of the conveyor line 100. This embodiment can improve the overall structure to a certain extent. Specifically, since the conveyor line 100 extends into the plasma device 200, the second robot arm 201 can be set inside the plasma device 200 to directly unload the PCB board from the conveyor line 100 located in the plasma device 200 and then place it on the placement rack 203. The PCB board enters the plasma machine 202 along with the placement rack 203.

[0036] Reference Figure 1 As shown, in some embodiments of the present invention, a telescopic gripper 204 is provided inside the plasma device 200 and on the conveyor line 100. The telescopic gripper 204 extends in a direction parallel to the moving direction of the placement rack 203. The gripping end of the telescopic gripper 204 is used to grip the placement rack 203 and can push / pull the placement rack 203 into / out of the plasma machine 202 during the extension and retraction process. The telescopic gripper 204 provides driving force for the movement of the placement rack 203. It can be understood that the telescopic gripper 204 grips the placement rack 203, then pushes the placement rack 203 into the plasma machine 202, releases the grip on the placement rack 203, and returns to the initial position. After cleaning is completed, the telescopic gripper 204 extends again and grips the placement rack 203, pulling the cleaned PCB board out of the plasma machine 202 together, and then proceeds with the unloading process. Specifically, the extension and retraction of the telescopic gripper 204 can be achieved by an actuator such as a cylinder, hydraulic cylinder, or oil cylinder.

[0037] In some embodiments of the present invention, the placement rack 203 is provided with a first clamping mechanism and a first metal sensor. The first clamping mechanism is used to clamp the PCB board when the first metal sensor detects it. It is understood that this embodiment includes a control module electrically connected to the first clamping mechanism and the first metal sensor. When the first metal sensor detects the PCB board, the control module controls the first clamping mechanism to clamp the PCB board.

[0038] Reference Figure 1 As shown, in some embodiments of the present invention, the plasma device 200 further includes a tray 207 placement area 205 and a discharge area 206. The tray 207 placement area 205 and the discharge area 206 are located on the other side of the length direction of the conveyor line 100. The second robot arm 201 is also used to transport the tray 207 in the tray 207 placement area 205 to the discharge area 206 and place the PCB board cleaned by the plasma machine 202 onto the tray 207 in the discharge area 206. The tray 207 placement area 205 is used to store empty trays 207. While cleaning the PCB board, the second robot arm 201 takes an empty tray 207 from the tray 207 placement area 205 and places it into the discharge area 206. While processing the next PCB board, the second robot arm 201 takes another empty tray 207 from the tray 207 placement area 205 and stacks it onto the previous tray 207 containing the PCB board, and so on in a cyclical manner. It is understandable that the tray 207 has a groove with a depth equal to or greater than the thickness of the PCB board, so stacking the trays 207 will not cause scratches to the PCB board.

[0039] Reference Figure 1 As shown, in some embodiments of the present invention, the plasma device 200 is provided with two plasma generators 202; the two plasma generators 202 are arranged along the length of the conveyor line 100, and the telescopic gripper 204 is slidably disposed on the conveyor line 100. It can be understood that the telescopic gripper 204 can switch between the positions of the two plasma generators 202 during the sliding process. When the first plasma generator 202 is cleaning, the conveyor line 100 can simultaneously transport the next PCB board, and then the telescopic gripper 204 transports the second PCB board to the second plasma generator 202, and then the placement rack 203 is sent into the second plasma generator 202 for cleaning; when the second plasma generator 202 is cleaning, the telescopic gripper 204 moves to the corresponding position of the first plasma generator 202, and then the placement rack 203 and the PCB board in the first plasma generator 202 are pulled out together for unloading.

[0040] In some embodiments of the present invention, the mobile platform 101 is provided with a second clamping mechanism and a second metal sensor. The second clamping mechanism is used to clamp the PCB board when the second metal sensor detects the PCB board. Similarly, the control module is electrically connected to the second clamping mechanism and the second metal sensor. When the second metal sensor detects the PCB board, the control module controls the second clamping mechanism to clamp the PCB board.

[0041] Specifically, the mobile platform 101 has a square structure, and a second clamping mechanism is provided at each of the four corners of the mobile platform 101.

[0042] In some embodiments of the present invention, acrylic plates are provided around both the conveyor line 100 and the plasma device 200. The acrylic plates seal the conveyor line 100 and the plasma device 200, reducing the falling of foreign objects from the air and improving the cleanliness of the PCB board surface.

[0043] Reference Figure 1 and Figure 2 As shown, this embodiment of the invention proposes an automatic cleaning method for the plate surface after development, applied to the automatic cleaning system for the plate surface after development described in the above embodiment. The automatic cleaning method for the plate surface after development includes the following steps:

[0044] Upon receiving the unloading information from the developing equipment 300, the first robotic arm 102 removes the PCB board unloaded from the developing equipment 300 and places it onto the moving platform 101. As the moving platform 101 moves along the conveyor line 100 to a preset position, the second robotic arm 201 grabs the PCB board from the moving platform 101, while simultaneously returning the moving platform 101 to its initial position. Then, the second robotic arm 201 places the PCB board onto the placement rack 203, which carries the PCB board into the plasma machine 202 for cleaning. Simultaneously, the second robotic arm 201 grabs the tray 207 from the placement area 205 and places it into the discharge area 206. Finally, the cleaned PCB board is placed onto the tray 207 in the discharge area 206. The unloading point of the developing equipment 300 is connected to the plasma unit 200 via the conveyor line 100, employing an automated transfer method, which greatly improves transfer efficiency. The integrated operation of the developing equipment 300 and the plasma unit 200 reduces manual handling, lowers the defect rate, increases production capacity, and reduces labor costs.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0046] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A post-developing plate surface automatic cleaning system, characterized by, The application relates to a post-development PCB plate automatic cleaning system and a post-development PCB plate automatic cleaning method. The post-development PCB plate automatic cleaning system comprises a conveying line, a plasma device and a conveying line and a plasma device. The conveying line is connected with a discharging end of a developing device, and a moving platform and a first mechanical arm are arranged on the conveying line. The moving platform can move along the length direction of the conveying line, and the first mechanical arm is used for taking and placing a developed PCB plate on the moving platform. The plasma device is connected with an output end of the conveying line, and the plasma device is provided with a second mechanical arm. The second mechanical arm is used for taking and placing a PCB plate into the plasma device when the moving platform moves to a preset position.

2. The post-visualization panel automatic cleaning system of claim 1, wherein: The plasma device is provided with a plasma machine, and the plasma machine is provided with a placing rack.

3. The post-visualization panel automatic cleaning system of claim 1, wherein: The placing rack is used for supporting the PCB plate from the second mechanical arm.

4. The post-visualization panel automatic cleaning system of claim 2, wherein: The placing rack is slidably arranged in the plasma machine, and the placing rack can push the PCB plate into and out of the plasma machine during the sliding process.

5. The post-visualization panel automatic cleaning system of claim 1, wherein: The conveying line extends into the plasma device, the plasma machine is located on one side of the length direction of the conveying line, and the sliding direction of the placing rack is perpendicular to the length direction of the conveying line.

6. The post-visualization panel automatic cleaning system of claim 1, wherein: The plasma device further comprises a tray placing area and a discharging area.

7. A method of automatic post-develop plate cleaning, characterized by, The tray placing area and the discharging area are located on the other side of the length direction of the conveying line. The second mechanical arm is further used for carrying a tray of the tray placing area to the discharging area and placing the cleaned PCB plate of the plasma machine on the tray of the discharging area. The plasma device is provided with a telescopic clamp inside and on the conveying line. The telescopic clamp is parallel to the moving direction of the placing rack. The clamping end of the telescopic clamp is used for clamping the placing rack and can push and pull the placing rack into and out of the plasma machine during the telescopic process. The placing rack is provided with a first clamping mechanism and a first metal sensor. The first clamping mechanism is used for clamping the PCB plate when the first metal sensor senses the PCB plate. The plasma device is provided with two plasma machines. The two plasma machines are arranged along the length direction of the conveying line, and the telescopic clamp is slidably arranged on the conveying line. The moving platform is provided with a second clamping mechanism and a second metal sensor. The second clamping mechanism is used for clamping the PCB plate when the second metal sensor senses the PCB plate. The conveying line and the plasma device are provided with acrylic plates on the circumferential sides. The post-development PCB plate automatic cleaning method comprises the following steps. Obtaining the unloading information of the developing device, the first mechanical hand takes out the PCB board unloaded from the developing device and places it on the moving platform; when the moving platform moves to the preset position along the conveying line, the second mechanical hand grabs the PCB board on the moving platform, at the same time, the moving platform retreats to the initial position; then the second mechanical hand places the PCB board on the placing rack, and the placing rack carries the PCB board into the plasma machine for cleaning, at the same time, the second mechanical hand grabs the tray from the tray placing area and places it on the discharge area; finally, the cleaned PCB board is placed on the tray in the discharge area.

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