Microwave plasma magnetic rotating support

Abstract

The application discloses a microwave plasma magnetic rotating support, which comprises an upper material placing platform for placing a chip to be cleaned; a lower material placing platform which is arranged in parallel with the surface of the upper material placing platform and is provided with a magnet block between the two; and an air suction assembly, wherein the air suction port of the air suction assembly is located above the chip to be cleaned on the upper material placing platform and is used for attracting the chip to be cleaned and separating the chip to be cleaned from the surface of the upper material placing platform. The air suction assembly is arranged, the air suction port of the air suction assembly is located above the chip to be cleaned on the upper material placing platform, the chip to be cleaned can be attracted and lifted and separated from the surface of the upper material placing platform through air suction, so that the other surface of the chip to be cleaned is completely exposed, when the upper surface of the chip to be cleaned is cleaned, the chip to be cleaned is lifted through the air suction assembly, and the chip to be cleaned can be fully contacted with the plasma covered on the upper material placing platform, so that the cleaning quality of the chip to be cleaned is ensured.

Description

Technical Field

[0001] This invention belongs to the field of chip cleaning technology, specifically, it relates to a microwave plasma magnetic rotating support. Background Technology

[0002] Microwave plasma cleaning technology can be applied to material surface modification, etching, and cleaning; plasma chemical vapor deposition; sputtering, and other fields. Microwave plasma cleaning equipment mainly consists of a vacuum system, a water cooling system, a control system, a microwave source, and a waveguide coupling system. It can easily generate stable, high-density plasma above the critical density, and the excited plasma has a high number of activated groups. There is no electrode discharge, so there is no electrode contamination.

[0003] In existing cleaning devices, the chip to be cleaned is placed flat on a placement platform during the cleaning process. The upper surface of the chip is exposed, while the lower surface comes into contact with the platform surface. This contact surface can affect plasma contact or result in a relatively low plasma concentration, leading to insufficient cleaning of the chip and poor cleaning performance.

[0004] This has become a technical problem that urgently needs to be solved by those skilled in the art.

[0005] In view of this, the present invention is proposed. Summary of the Invention

[0006] This invention provides a microwave plasma magnetic rotating support. By setting up an air suction component with its air suction port located above the chip to be cleaned on the upper material placement platform, the chip to be cleaned can be attracted, lifted, and detached from the surface of the upper material placement platform through the air suction. This allows the other surface of the chip to be cleaned to be completely exposed. After the upper surface of the chip to be cleaned is cleaned, the chip to be cleaned is attracted and lifted again by the air suction component, so that it can fully contact the plasma covering the upper material placement platform, thereby ensuring the cleaning quality of the chip to be cleaned.

[0007] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by the present invention is: a microwave plasma magnetic rotating support, comprising,

[0008] The upper material placement platform is used to place the chips to be cleaned;

[0009] The lower material placement platform is set parallel to the surface of the upper material placement platform, and a magnetic block is set between the two.

[0010] The suction component has its suction port located above the chip to be cleaned on the upper material platform, and is used to attract and remove the chip to be cleaned from the surface of the upper material platform.

[0011] Furthermore, there are multiple upper and lower material placement platforms, with each upper and lower material placement platform corresponding to the other and set up in pairs.

[0012] The upper and lower material placement platforms are arranged in pairs, spaced apart from top to bottom.

[0013] Furthermore, multiple through holes are provided at intervals on the upper and lower material placement platforms.

[0014] Furthermore, it also includes,

[0015] Multiple material placement columns are vertically and sequentially installed from top to bottom on the upper and lower material placement platforms;

[0016] Multiple limiting rings are fixedly sleeved on each material placement column, with two adjacent limiting rings respectively set on the upper surface of the paired upper material placement platform and the lower surface of the paired lower material placement platform.

[0017] Furthermore, one of the material placement columns is the main material placement column, which is installed in the center side wall of the upper and lower material placement platforms, and the inside of the material placement column is a hollow structure.

[0018] One side of the main material feeding column is connected to the air intake of the air suction component, and the other side of the main material feeding column is connected to an air pump.

[0019] Furthermore, the suction assembly includes at least an upper suction cup tube, wherein the upper suction cup tube includes,

[0020] The upper connecting pipe is vertically connected at one end to the main material placement column;

[0021] The upper suction cup is connected to the other end of the upper connecting tube. The upper suction cup is located above the chip to be cleaned, and the suction port is set perpendicular to the upper material placement platform.

[0022] Furthermore, the suction assembly also includes a lower suction cup tube, which includes,

[0023] The lower connecting pipe is vertically connected at one end to the main material placement column;

[0024] The lower suction cup is connected to the other end of the lower connecting tube. The lower suction cup is located below the chip to be cleaned, and the suction port is set perpendicular to the upper material placement platform.

[0025] An electromagnetic switching valve is installed between the upper connecting pipe and the lower connecting pipe.

[0026] Furthermore, an upper elastic corrugated tube is provided between the upper connecting tube and the upper suction cup;

[0027] A lower elastic bellows is installed between the lower connecting pipe and the lower suction cup.

[0028] Furthermore, the upper surface of the upper material placement platform is provided with multiple downwardly recessed positioning grooves at intervals, which are used to place the chip to be cleaned in them for positioning.

[0029] The opening of the lower suction cup is positioned to contact the chip to be cleaned.

[0030] Furthermore, the walls of each positioning groove are inclined from top to bottom and close together towards the center of the bottom of the groove, with each groove wall in contact with the bottom line of the chip to be cleaned.

[0031] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0032] 1. This invention incorporates a suction component with its suction port positioned above the chip to be cleaned on the upper material placement platform. Through suction, the chip is drawn in, lifted, and detached from the surface of the platform, thus exposing the other surface of the chip completely. After the upper surface of the chip is cleaned, the suction component further lifts the chip, ensuring sufficient contact with the plasma covering the platform and guaranteeing the cleaning quality.

[0033] 2. By setting up multiple pairs of upper and lower material placement platforms, with each pair arranged alternately from top to bottom, the present invention allows for the placement of chips to be cleaned on each pair of upper material placement platforms, thereby forming multiple cleaning stations. This enables the cleaning of multiple chips at once, effectively improving cleaning efficiency.

[0034] 3. The present invention has a hollow structure with multiple through holes spaced apart on the upper and lower material placement platforms, which allows the chip to be cleaned to come into contact with the plasma as much as possible, thereby ensuring the cleaning efficiency and quality of the chip.

[0035] 4. The suction assembly of this invention includes an upper suction cup tube and a lower suction cup tube. By controlling the operation sequence of the upper and lower suction cups through the electromagnetic switching valve, it can be ensured that when the upper suction cup is used for suction, the facing arrangement allows the upper suction cup to attract the chip to be cleaned with maximum airflow. When the electromagnetic switching valve is connected to the lower suction cup, the lower suction cup contacts the bottom of the chip to be cleaned, which can adsorb and fix the chip to be cleaned on the upper material support, preventing the chip to be cleaned from sliding or colliding during the rotation of the entire magnetic support in the plasma cleaning process.

[0036] 5. This invention provides an upper elastic bellows between the upper connecting tube and the upper suction cup, and a lower elastic bellows between the lower connecting tube and the lower suction cup. When the upper suction cup is performing suction, the upper elastic bellows acts as a buffer to protect both the upper suction cup and the chip from damage. When the chip is placed on the upper placement platform, it contacts the lower suction cup and presses it down, effectively protecting the chip during placement.

[0037] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0038] The accompanying drawings, as part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention, but do not constitute an undue limitation of the invention. Obviously, the drawings described below are merely some embodiments, and those skilled in the art can obtain other drawings based on these drawings without creative effort. In the drawings:

[0039] Figure 1 This is a schematic diagram of the overall assembly structure in an embodiment of the present invention;

[0040] Figure 2 This is a front view in an embodiment of the present invention;

[0041] Figure 3 This is a top view in an embodiment of the present invention;

[0042] Figure 4 for Figure 3 Enlarged structural diagram at point A;

[0043] Figure 5 This is a schematic diagram of the structure of the components between the upper and lower material placement platforms in an embodiment of the present invention;

[0044] Figure 6 for Figure 5 Enlarged structural diagram at point B;

[0045] Figure 7 This is a schematic diagram of the structure of the magnet assembly in an embodiment of the present invention.

[0046] Description of main components in the diagram:

[0047] 1. Upper material placement platform; 11. Through hole; 2. Lower material placement platform; 3. Magnet block; 4. Material placement column; 41. Main material placement column; 42. Auxiliary material placement column; 43. Limiting ring; 5. Suction assembly; 51. Upper suction cup fitting; 52. Lower suction cup fitting; 511. Upper connecting pipe; 512. Upper elastic corrugated pipe; 513. Upper suction cup; 521. Lower connecting pipe; 522. Lower elastic corrugated pipe; 523. Lower suction cup; 5111. Connecting pipe head; 6. Base; 7. Air pump; 8. Positioning groove; 81. Groove wall; 9. Fixing plate; 10. Connecting ring.

[0048] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the invention in any way, but rather to illustrate the concept of the invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0050] In the description of this invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0051] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0052] like Figures 1 to 7 As shown, the microwave plasma magnetic rotating support of the present invention includes an upper material placement platform 1 for placing the chip to be cleaned.

[0053] The lower material placement platform 2 is arranged parallel to the surface of the upper material placement platform 1, and a magnet block 3 is arranged between the two.

[0054] In this invention, the magnetic rotating support includes at least an upper loading platform 1 and a lower loading platform 2, both of which are circular plates and are parallel to each other and spaced apart. The chip to be cleaned can be placed on the upper loading platform 1, and a magnet assembly 3 is provided in the space between the upper loading platform 1 and the lower loading platform 2, or on the upper surface of the lower loading platform 2.

[0055] The magnet assembly 3 includes multiple parallel magnetic strips, each of which passes through two parallel fixing plates 9, with the fixing plates 9 and the magnetic strips being perpendicular to each other. The upper and lower sidewalls of the two fixing plates 9 contact the sidewalls of the upper material placement platform 1 and the lower material placement platform 2, respectively, to complete the clamping and limiting operation.

[0056] More specifically, the length of each magnetic strip is set according to the secant length corresponding to each position on the upper placement platform 1 or the lower placement platform 2, thereby ensuring that the magnetic block assembly can be precisely clamped between the two placement platforms. Because the magnetic strips are evenly distributed on the placement platforms, the upper placement platform 1 is in a regular magnetic field distribution. Furthermore, the matrix-like installation and connection improves the overall magnetic field density. As is well known, plasma entering a regular magnetic field is subject to the Lorentz force. Under the influence of the Lorentz force, the plasma will perform circular motion in the magnetic field region of the placement platform. The circular motion of a batch of plasma causes resonance, thereby ionizing incompletely ionized gas molecules. The plasma gathers on the placement platform, ensuring the cleaning effect on the chip to be cleaned.

[0057] However, on existing material placement platforms, one side of the chip to be cleaned is exposed, while the other side comes into contact with the surface of the material placement platform, which affects the contact between the plasma and the chip to be cleaned, resulting in insufficient cleaning.

[0058] In order to overcome the aforementioned technical defects, the present invention makes the following corresponding technical improvements:

[0059] Furthermore, the suction component 5, with its suction port located above the chip to be cleaned on the upper material platform 1, is used to attract and remove the chip to be cleaned from the surface of the upper material platform 1.

[0060] In this invention, an air suction component 5 is installed on a magnetic support, with its suction port directly facing the chip to be cleaned on the upper loading platform 1. Through suction, the chip to be cleaned is attracted, lifted, and detached from the surface of the upper loading platform 1, thus completely exposing the other surface of the chip. After the upper surface of the chip is cleaned, the chip is then attracted and lifted again by the air suction component 5, allowing it to fully contact the plasma covering the upper loading platform 1, thereby ensuring the cleaning quality of the chip.

[0061] Furthermore, there are multiple upper material placement platforms 1 and lower material placement platforms 2, with each upper material placement platform 1 and lower material placement platform 2 corresponding to one another and set up in pairs;

[0062] The upper material placement platform 1 and the lower material placement platform 2 are arranged in pairs, spaced apart from top to bottom.

[0063] In this invention, the magnetic support includes multiple upper placement platforms 1 and lower placement platforms 2. Each upper placement platform 1 and lower placement platform 2 is arranged in a one-to-one correspondence. The paired placement platforms are arranged alternately from top to bottom, and each pair of placement platforms can hold chips to be cleaned, thereby forming multiple cleaning stations. This allows multiple chips to be cleaned at once, effectively improving cleaning efficiency.

[0064] Furthermore, multiple through holes 11 are provided at intervals on the upper material placement platform 1 and the lower material placement platform 2.

[0065] In this invention, the upper material placement platform 1 and the lower material placement platform 2 are hollow structures, meaning that multiple through holes 11 are provided through them, and the through holes 11 are arranged in a dotted pattern and distributed radially along the respective material placement platforms. By setting the upper material placement platform 1 and the lower material placement platform 2 as hollow structures, the chip to be cleaned can be made to contact the plasma as fully as possible, thereby ensuring the cleaning efficiency and quality of the chip to be cleaned.

[0066] Furthermore, it also includes,

[0067] Multiple material placement columns 4 are vertically and sequentially installed from top to bottom on the upper material placement platform 1 and the lower material placement platform 2;

[0068] Multiple limiting rings 43 are fixedly sleeved on each material placement column 4, and two adjacent limiting rings 43 are respectively set on the upper surface of the paired upper material placement platform 1 and the lower surface of the lower material placement platform 2.

[0069] In this invention, the magnetic support also includes an installation structure consisting of multiple material placement columns 4 and multiple limiting rings 43. Specifically, through holes are provided on the upper material placement platform 1 and the lower material placement platform 2, through which the corresponding material placement columns 4 are sequentially passed. Simultaneously, limiting rings 43 are provided on the upper and lower surfaces of each pair of upper material placement platforms 1 and lower material placement platforms 2. These limiting rings 43 are double-hole fixed limiting rings 43, clamping the magnet assembly 3 between the upper material placement platform 1 and the lower material placement platform 2, and then locking it in place with screws. Each pair of material placement platforms is assembled in the same way, thus completing the main assembly of the magnetic support. This allows for flexible assembly and disassembly of the magnetic support, facilitating cleaning, maintenance, and other operations by the personnel.

[0070] Furthermore, one of the material placement columns 4 is the main material placement column 41, which is installed in the center side wall of the upper material placement platform 1 and the lower material placement platform 2, and the inside of the material placement column 4 is a hollow structure.

[0071] One side of the main material feeding column 41 is connected to the air intake of the air suction component 5, and the other side of the main material feeding column 41 is connected to the air pump 7.

[0072] In this invention, the preferred distribution of the material placement columns 4 is as follows: one main material placement column 41 and three auxiliary material placement columns 42. The main material placement column 41 is located at the center of the upper material placement platform 1 and the lower material placement platform 2, extending downwards. The three auxiliary material placement columns 42 are located at the edges of the upper material placement platform 1 and the lower material placement platform 2, and are evenly spaced with an included angle of 120° between adjacent columns. Through the cooperation of the main material placement column 41 and the three auxiliary material placement columns 42, each pair of material placement platforms can be stably assembled.

[0073] More preferably, the main feeding column 41 has an internal intermediate structure, in which the air intake of the suction component 5 is connected to the main feeding column 41, and a vacuum pump 7 is connected to the side of the main feeding column 41 near the bottom. Thus, through the action of the vacuum pump 7, air can be drawn through the main feeding column 41 and the suction component 5, thereby attracting and lifting the chip to be cleaned off the upper feeding platform 1. This expands the plasma's operating range, allowing for thorough cleaning of the lower surface of the chip and preventing any missed areas or incomplete cleaning.

[0074] Furthermore, the suction assembly 5 includes at least an upper suction cup tube 51, wherein the upper suction cup tube 51 includes,

[0075] The upper connecting pipe 511 is vertically connected at one end to the main material placement column 41;

[0076] The upper suction cup 513 is connected to the other end of the upper connecting tube 511. The upper suction cup 513 is located above the chip to be cleaned, and the suction port is set perpendicular to the upper material placement platform 1.

[0077] In this invention, the upper suction cup fitting 51 on the suction assembly 5 includes at least an upper connecting pipe 511 and an upper suction cup 513. The upper connecting pipe 511 is positioned above and parallel to the upper material placement platform 1. One end of the upper connecting pipe 511 is connected to the main material placement column 41, and the other end is connected to the upper suction cup 513. Specifically, the suction port of the upper suction cup 513 is perpendicular to the upper material placement platform 1, i.e., directly facing the upper surface of the chip to be cleaned. This ensures that during suction operations, the upper suction cup 513 can attract the chip to be cleaned with maximum airflow; simultaneously, during suction, the suction cup opening can completely adhere to the chip to be cleaned, preventing air leakage and thus preventing the chip from falling off.

[0078] Furthermore, the suction assembly 5 also includes a lower suction cup tube 52, which includes,

[0079] The lower connecting pipe 521 is vertically connected at one end to the main material placement column 41;

[0080] The lower suction cup 523 is connected to the other end of the lower connecting tube 521. The lower suction cup 523 is located below the chip to be cleaned, and the suction port is set perpendicular to the upper material placement platform 1.

[0081] An electromagnetic switching valve is installed between the upper connecting pipe 511 and the lower connecting pipe 521.

[0082] In this invention, the lower cleaning disc fitting on the suction assembly 5 includes at least a lower connecting pipe 521 and a lower suction cup 523. Similarly, the lower suction cup 523 is located between the upper material placement platform 1 and the lower material placement platform 2, and its suction port is set perpendicular to the upper material placement platform 1, that is, directly facing the bottom of the chip to be cleaned.

[0083] In addition, to ensure that only the upper suction cup 513 and the lower suction cup 523 can operate, an electromagnetic switching valve is installed between the upper connecting pipe 511 and the lower connecting pipe 521. By controlling the electromagnetic switching valve to be connected to the upper suction cup 513, it is possible to ensure that the suction operation is performed through the upper suction cup 513. The facing arrangement allows the upper suction cup 513 to attract the chip to be cleaned with maximum airflow. When the electromagnetic switching valve is connected to the lower suction cup 523, the lower suction cup 523 contacts the bottom of the chip to be cleaned, which can adsorb and fix the chip to be cleaned on the upper material support, preventing the chip to be cleaned from sliding or colliding during the rotation of the entire magnetic support in the plasma cleaning process.

[0084] More specifically, since the magnetic support has multiple pairs of material placement platforms, a partition is provided inside the main material placement column 41 along the axial direction, dividing the main material placement column 41 into two ventilation chambers. A base 6 is also provided at the bottom of the magnetic support, and the main body of the aforementioned magnetic support is assembled within it; that is, the lower end of each material placement column passes through the base 6. There is a gap between the base 6 and the adjacent lower material placement platform 2. The main body of the vacuum pump 7 is mounted on the base 6. The two ventilation chambers on the main material placement column 41 extend out through pipes and are connected to the branch valve ports of the electromagnetic switching valve. The main valve port of the electromagnetic switching valve is connected to the vacuum pump 7, thus allowing the simultaneous control of the working sequence of multiple pairs of upper suction cup 513 components and lower suction cup 523 components through a single electromagnetic switching valve.

[0085] Furthermore, an upper elastic corrugated tube 512 is provided between the upper connecting tube 511 and the upper suction cup 513;

[0086] A lower elastic bellows 522 is provided between the lower connecting pipe 521 and the lower suction cup 523.

[0087] In this invention, an upper elastic corrugated pipe 512 is provided between the upper connecting pipe 511 and the upper suction cup 513, and a lower elastic corrugated pipe 522 is provided between the lower connecting pipe 521 and the lower suction cup 523, so that the upper suction cup 513 and the lower suction cup 523 have a certain amount of free displacement for vertical movement.

[0088] When the upper suction cup 513 is performing suction, a certain impact force will occur when the chip to be cleaned is attracted by the suction force. The upper elastic bellows 512 can buffer the upper suction cup 513 and the chip to be cleaned to a certain extent, so as to ensure that they are not damaged.

[0089] As for the lower suction cup 523, when the chip to be cleaned is placed on the upper material placement platform 1, it will press down on the lower suction cup 523 after contacting it, thus effectively buffering and protecting the chip to be cleaned during the placement action.

[0090] Furthermore, the upper surface of the upper material placement platform 1 is provided with multiple downwardly recessed positioning grooves 8 at intervals, which are used to place the chip to be cleaned in them for positioning.

[0091] The opening of the lower suction cup 523 is set to contact the chip to be cleaned.

[0092] In this invention, each upper loading platform 1 is provided with multiple downwardly recessed positioning slots 8, the size of which matches the dimensions of the chips to be cleaned. On the one hand, the multiple positioning slots 8 make it convenient for workers to position each chip to be cleaned on an effective work position; on the other hand, the limiting effect of the slot wall 81 of the positioning slot 8 can also restrict the lateral displacement of the chips to be cleaned. Combined with the suction operation of the lower suction cup 523, the vertical displacement of the chips to be cleaned is restricted, thus ensuring that the chips to be cleaned can be stably placed on the upper loading platform 1.

[0093] More specifically, the upper feeding platform 1 is provided with multiple positioning slots 8, which allows for the simultaneous cleaning of multiple chips to be cleaned. It also includes a connecting ring 10, which is hollow inside, with each upper connecting tube 511 connected to the connecting ring 10 at intervals. One of the upper connecting tubes 511 is connected to the main feeding column 41, thus enabling communication between all the upper connecting tubes 511. The upper connecting tube 511 connected to the main feeding column 41 is provided with a connecting tube head 5111 that rotates relative to its axis, and the connecting tube head 5111 is axially movable. Preferably, the connecting tube head 5111 is threadedly connected to the main feeding column 41, facilitating the disassembly and installation of the entire upper suction cup 513 assembly. Similarly, the connection method of the lower suction cup 523 assembly can also use the above-disclosed technical solution, which will not be elaborated further here.

[0094] Furthermore, each wall 81 of the positioning groove 8 is inclined from top to bottom and closes towards the center of the bottom of the groove, and each wall 81 is in contact with the bottom line of the chip to be cleaned.

[0095] In this invention, the walls 81 of the positioning grooves 8 are inclined, and the groove openings narrow from top to bottom towards the center of the bottom. This design facilitates the placement of the chip to be cleaned in the positioning grooves 8. After placement, the walls 81 of the positioning grooves 8 contact the bottom side edge of the chip to be cleaned, thereby forming an angle between the walls 81 and the sidewalls of the chip to be cleaned, rather than adhering to each other, thus ensuring effective cleaning of the sidewalls of the chip by plasma.

[0096] The specific cleaning process works as follows: The magnetic support is placed in the cleaning chamber and rotatably connected to the chamber via the base 6. The cleaning chamber is closed, and a vacuum pump is used to evacuate it before filling it with inert gas. A microwave generator is then activated to produce plasma within the chamber. Once the plasma enters the upper loading platform 1, it undergoes electron cyclotron resonance under the influence of the Lorentz force in the magnetic field, increasing the plasma concentration and thus cleaning the chip to be cleaned on the platform 1. This, combined with the overall rotational motion, ensures a more thorough cleaning process.

[0097] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present invention. The implementation schemes in the above embodiments can be further combined or replaced. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A microwave plasma magnetic spin stand, characterized by: The utility model relates to a kind of microwave plasma magnetic rotary support, including, Upper material placement platform, for placing chip to be cleaned; Lower material placement platform is parallelly arranged relative to the surface of upper material placement platform, and magnet block is arranged between the two; Suction component, with suction port located above the chip to be cleaned of upper material placement platform, for attracting chip to be cleaned, and separating from the surface of upper material placement platform; Multiple material placement columns are vertically and sequentially arranged in upper material placement platform and lower material placement platform from top to bottom; One of the material placement columns is a main material placement column, which is arranged in the central sidewall of upper material placement platform and lower material placement platform, and the inside of the material placement column is hollow structure; One side of the main material placement column is in communication with the suction port of the suction component, and the other side of the main material placement column is connected with a suction pump; The suction component at least includes an upper suction disc pipe, which includes an upper connecting pipe vertically connected with the main material placement column at one end;An upper suction disc is connected with the other end of the upper connecting pipe, and the upper suction disc is located above the chip to be cleaned, and the suction port direction is perpendicular to the upper material placement platform; The suction component also includes a lower suction disc pipe, which includes a lower connecting pipe vertically connected with the main material placement column at one end;A lower suction disc is connected with the other end of the lower connecting pipe, and the lower suction disc is located below the chip to be cleaned, and the suction port direction is perpendicular to the upper material placement platform; An electromagnetic switch valve is arranged between the upper connecting pipe and the lower connecting pipe; The number of upper material placement platforms and lower material placement platforms is multiple, and the upper material placement platforms and the lower material placement platforms are one-to-one corresponding and arranged in pairs;The pairs of upper material placement platforms and lower material placement platforms are arranged at intervals from top to bottom. The upper surface of the upper material placement platform is provided with multiple downward recessed positioning grooves for placing the chip to be cleaned. The disc opening of the lower suction disc is in contact with the chip to be cleaned.

2. A microwave plasma magnetic spin stand as claimed in claim 1, wherein: Multiple through holes are arranged at intervals on the upper material placement platform and the lower material placement platform.

3. A microwave plasma magnetic spin stand as claimed in claim 2, wherein: The utility model also includes multiple limiting rings, which are fixedly sleeved on each material placement column, and the adjacent two limiting rings are arranged on the upper surface of the pair of upper material placement platforms and the lower surface of the lower material placement platform, respectively.

4. The microwave plasma magnetic rotary support according to claim 3, characterized in that: An upper elastic bellows is arranged between the upper connecting pipe and the upper suction disc; A lower elastic bellows is arranged between the lower connecting pipe and the lower suction disc.

5. A microwave plasma magnetic spin stand as claimed in claim 4, wherein: Each groove wall of the positioning groove is arranged from top to bottom to converge to the center of the groove bottom, and each groove wall is in line contact with the bottom of the chip to be cleaned.

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