Sputtering method for SIP packaging products

Abstract

This invention provides a sputtering method for SIP packaged products, comprising the following steps: determining a mounting portion on a substrate for mounting or placing electronic components, the outer contour of the mounting portion including a sputtering area and a non-sputtering area, one end of the electronic component being disposed in the non-sputtering area; cutting the sputtering area along the outer periphery of the mounting portion to expose a portion of the outer periphery of the mounting portion; sputtering the substrate to form a sputtering layer on the outer periphery of the sputtering area; continuing to cut the substrate along the outer periphery of the mounting portion to detach the mounting portion from the substrate, wherein one end of the electronic component is exposed in the non-sputtering area. The sputtering method according to embodiments of this invention not only effectively improves the efficiency of selective sputtering but also ensures that electronic components in the non-sputtering area are not covered by metal atoms, effectively preventing electronic components that need to be exposed on the product surface from failing due to short circuits or shielding, thereby effectively guaranteeing product performance.

Description

Technical Field

[0001] This invention belongs to the field of SIP packaging technology. Specifically, this invention relates to a sputtering method for SIP packaged products. Background Technology

[0002] For some SIP packaged products, selective sputtering is required due to their shape design. For example, some SIP packaged products have numerous screw holes designed to make full use of limited space, and the surface of these screw holes must not be coated with a layer by sputtering, otherwise it will cause the product to short-circuit and fail. At the same time, since the antenna is usually designed on the side wall of the product, the antenna area on the side wall must not be sputtered with a large area of ​​coating, otherwise it will cause the antenna signal to be shielded and affect the product performance.

[0003] Currently, selective sputtering on the front of a product is achieved by attaching a metal shell. However, the metal shell covers the sidewalls of the SIP packaged product. After sputtering, the sidewall metal shell is still retained, and selective sputtering cannot be achieved on the sidewalls of the SIP packaged product.

[0004] If additional physical covering layers such as tape or casing are used to sputter the non-sputtered areas on the sidewalls of SIP packaged products, the tape cannot perfectly cover these areas. During the sputtering process, metal atoms can penetrate into the non-sputtered areas through the gaps between the tape and the sidewall. This can cause electronic components (such as antennas) exposed on the surface to fail due to short circuits or shielding, thus affecting product performance. Summary of the Invention

[0005] One objective of this invention is to provide a sputtering method for SIP packaged products, which can at least solve the problems of low efficiency and difficulty in guaranteeing product performance in existing preparation methods.

[0006] A sputtering method for a SIP packaged product according to an embodiment of the present invention includes the following steps: determining a mounting portion on a substrate for mounting or placing an electronic component, the outer contour of the mounting portion including a sputtering region and a non-sputtering region, one end of the electronic component being disposed in the non-sputtering region; cutting the sputtering region along the outer periphery of the mounting portion to expose a portion of the outer periphery of the mounting portion; sputtering the substrate to form a sputtering layer on the outer periphery of the sputtering region; and continuing to cut the substrate along the outer periphery of the mounting portion to detach the mounting portion from the substrate, wherein one end of the electronic component is exposed in the non-sputtering region.

[0007] Optionally, the substrate is provided with a plurality of mounting portions, and the electronic components are respectively mounted or disposed on each mounting portion.

[0008] Optionally, the mounting portion includes a main body and multiple connecting portions, the electronic component is mounted or disposed on the main body, the connecting portions are provided with mounting holes, and one end of the electronic component is disposed at the edge of the main body.

[0009] Optionally, the main body is formed into a rectangle, and the connecting portion is provided at each of the three apex corners of the main body.

[0010] Optionally, the step of cutting the sputtering area along the outer periphery of the mounting portion includes: providing a covering layer on the main body portion, the outer contour of the covering layer overlapping the outer contour of the main body portion; and cutting the sputtering area along the outer contour of the covering layer to form a cutting groove.

[0011] Optionally, the step of cutting the sputtering area along the outer periphery of the mounting portion includes: covering the substrate with a cladding layer; and cutting the sputtering area along the outer contour of the mounting portion to form a cutting groove.

[0012] Optionally, the cutting groove is located between two adjacent connecting parts, and the multiple cutting grooves formed between the multiple connecting parts are disconnected from each other.

[0013] Optionally, the length of the edge of the main body where the electronic component is located is greater than the length of the cutting groove on the corresponding side, and the length of the remaining edges of the main body is equal to the length of the cutting groove on the corresponding side.

[0014] Optionally, the electronic component is disposed on one side edge of the main body near one end of one of the connecting portions, and the cutting groove is provided between the electronic component and another connecting portion on the same side edge.

[0015] Optionally, the step of sputtering the substrate includes: covering one side surface of the plurality of connecting portions with an adhesive film, the cutting groove being exposed in the adhesive film; covering the other side surface of the substrate with an adhesive film; and sputtering the cutting groove to form the sputtered layer on the exposed outer peripheral surface of the main body portion.

[0016] Optionally, the step of continuing to cut the substrate along the outer periphery of the mounting portion includes: removing the adhesive film on the substrate; and continuing to cut the substrate along the extension direction of the cutting groove and the outer contour of the connecting portion, so that the mounting portion is detached from the substrate.

[0017] According to the sputtering method for SIP packaged products of the present invention, the area of ​​the mounting portion on the substrate to be sputtered is cut open to expose the area, while the non-sputtered area on the edge where the electronic components are mounted remains connected to the substrate without any gaps. After sputtering the entire substrate, the cut-out portion is covered with a sputtering layer, while the non-sputtered area, being connected to the substrate, is not exposed and therefore not covered with a plating layer. A second cutting of the mounting portion is then performed to obtain a product with selectively sputtered sidewalls. This method not only effectively improves the efficiency of selective sputtering but also ensures that the electronic components in the non-sputtered areas are not covered by metal atoms. This effectively prevents the electronic components that need to be exposed on the product surface from failing due to short circuits or shielding, thereby effectively guaranteeing product performance.

[0018] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention.

[0020] Figure 1 This is a schematic diagram of the fabrication process of a sputtering method for a SIP packaged product according to an embodiment of the present invention;

[0021] Figure 2 yes Figure 1 A magnified view of a portion of region A in the middle;

[0022] Figure 3 yes Figure 2 Side view.

[0023] Figure label:

[0024] substrate 10;

[0025] Mounting part 20; Sputtering area 21; Non-sputtering area 22; Main body 23; Connecting part 24; Mounting hole 25; Coating layer 26; Adhesive film 27;

[0026] Electronic components 30. Detailed Implementation

[0027] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0028] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0029] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0030] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0032] The sputtering method for SIP packaged products according to embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0033] like Figure 1 As shown, the sputtering method for a SIP packaged product according to an embodiment of the present invention includes the following steps:

[0034] A mounting portion 20 for mounting or setting electronic components 30 is defined on the substrate 10. The outer contour of the mounting portion 20 includes a sputtering region 21 and a non-sputtering region 22. One end of the electronic component 30 is located in the non-sputtering region 22.

[0035] Cut the sputtering area 21 along the outer periphery of the mounting part 20 to expose a portion of the outer periphery of the mounting part 20;

[0036] The substrate 10 is sputtered to form a sputtered layer on the outer peripheral surface of the sputtering region 21;

[0037] The substrate 10 is cut along the outer periphery of the mounting portion 20 so that the mounting portion 20 is detached from the substrate 10, wherein one end of the electronic component 30 is exposed in the non-sputtering area 22.

[0038] In other words, the sputtering method for SIP packaged products according to embodiments of the present invention can mainly include the following steps: First, determining the position of the mounting portion 20 on the substrate 10; second, cutting the substrate 10 along the outer periphery of the mounting portion 20; third, sputtering the substrate 10; and fourth, continuing to cut the substrate 10 so that the mounting portion 20 is detached from the substrate 10, forming a semi-finished product of the SIP packaged product.

[0039] Specifically, the sputtering method for SIP packaged products according to embodiments of the present invention is a selective sputtering process during the manufacturing of SIP packaged products. In implementation, this method first determines the area and shape of the mounting portion 20 on the substrate 10 according to product manufacturing requirements, for example... Figure 1The shape shown in figure a is such that the outer contour of the mounting portion 20 includes a sputtering area 21 that needs to be sputtered and a non-sputtering area 22 that does not need to be sputtered. Then, suitable electronic components 30 are mounted on each mounting portion 20. The electronic components 30 may include various components required for the SIP packaged product, wherein a portion of the electronic component 30, such as an antenna, has one end located in the non-sputtering area 22.

[0040] It should be noted that the electronic component 30 can be mounted on the mounting portion 20 by the above-described mounting method, or it can be directly disposed in the substrate 10. That is, during the molding of the substrate 10, the electronic component 30, such as an antenna structure, can be formed inside the substrate 10. In this case, it is not necessary to separately mount the antenna on the mounting portion 20.

[0041] Next, as Figure 1 As shown in Figure c, the sputtering area 21 of the outer contour of the mounting part 20 is cut along the outer periphery of the mounting part 20, thereby exposing the sputtering part of the outer periphery of the mounting part 20. The non-sputtering area 22, which does not need to be sputtered, remains connected to the substrate, and the end of the corresponding electronic component 30 is not exposed. The method for cutting the sputtering area 21 can be a conventional cutting method in the art, such as laser cutting.

[0042] After exposing the sputtering area 21 of the mounting portion 20, sputtering can be performed on the substrate 10 to form a sputtering layer on the outer peripheral surface of the sputtering area 21. This sputtering method can be a commonly used sputtering method in the art, thereby forming a metal sputtering layer on the outer peripheral surface of the sputtering area 21. After sputtering is completed, the substrate 10 can be cut along the outer peripheral edge of the mounting portion 20, so that the mounting portion 20 can be completely detached from the substrate 10. At this time, the end of the antenna can expose the non-sputtered area 22, and it can be ensured that the outer surface of the non-sputtered area 22 is not covered by the metal plating layer.

[0043] Therefore, the sputtering method for SIP packaged products according to embodiments of the present invention involves cutting open and exposing the area of ​​the mounting portion 20 on the substrate 10 that needs to be sputtered, while the non-sputtered area 22 on the side edge where the electronic component 30 is mounted remains connected to the substrate 10 without any gaps. After sputtering the entire substrate 10, the cut-out portion can be covered with a sputtering layer, while the non-sputtered area, being connected to the substrate 10, is not exposed and therefore not covered with a plating layer. After this, the mounting portion 20 is cut a second time to obtain a product with selectively sputtered sidewalls. This method not only effectively improves the efficiency of selective sputtering but also ensures that the electronic component 30 in the non-sputtered area 22 is not covered by metal atoms, effectively preventing the electronic component 30 that needs to be exposed on the product surface from failing due to short circuits or shielding, thereby effectively guaranteeing product performance.

[0044] According to one embodiment of the present invention, a plurality of mounting portions 20 are provided on the substrate 10, and an electronic component 30 is respectively mounted or disposed on each mounting portion 20.

[0045] In other words, a substrate 10 can have only one mounting portion 20 or multiple mounting portions 20, and each mounting portion 20 can have a corresponding electronic component 30 mounted on it. When a substrate 10 has multiple mounting portions 20, the outer periphery of the multiple mounting portions 20 can be cut simultaneously to expose the corresponding sputtering areas 21. Then, sputtering can be performed on the sputtering areas 21 of the multiple mounting portions 20 simultaneously. This can effectively improve the sputtering efficiency of the SIP packaged product while ensuring the performance of the non-sputtering areas 22.

[0046] In some specific embodiments of the present invention, the mounting part 20 includes a main body 23 and a plurality of connecting parts 24. The electronic component 30 is mounted or disposed on the main body 23. The connecting parts 24 are provided with mounting holes 25. One end of the electronic component 30 is disposed at the edge of the main body 23.

[0047] Optionally, the main body 23 is formed into a rectangle, and a connecting part 24 is provided at each of the three apex corners of the main body 23.

[0048] Specifically, such as Figure 1 As shown in Figure a, in this embodiment, the mounting part 20 is generally formed into a rectangular structure, wherein the main body part 23 constitutes the main structure of the mounting part 20, and electronic components 30 are mounted on the main body part 23. The outer contour of the main body part 23 includes a sputtered area 21 and a non-sputtered area 22. A connecting part 24 can be provided at each of the three apex corners of the main body part 23, and the connecting part 24 is provided with mounting holes 25 for fixing the mounting part 20.

[0049] Based on the mounting portion 20 described above, in the sputtering method for a SIP packaged product according to an embodiment of the present invention, the step of cutting the sputtering region 21 along the outer periphery of the mounting portion 20 includes:

[0050] A covering layer 26 is provided on the main body 23 to cover the main body 23, and the outer contour of the covering layer 26 overlaps with the outer contour of the main body 23; along the outer contour of the covering layer 26, the sputtering area 21 is cut to form a cutting groove.

[0051] like Figure 1 As shown in b, after the electronic component 30 is mounted on the mounting portion 20, a covering layer 26 is applied to the main body portion 23 where the electronic component 30 is located. The covering layer 26 effectively protects the electronic component 30, for example, by sealing areas that require plastic sealing, while exposing the connecting portion 24. After applying the covering layer 26, as... Figure 1As shown in c, the sputtering area 21 can be cut along the outer contour of the main body 23. After the sputtering area 21 is cut, a cutting groove is formed that runs through the thickness direction of the substrate 10.

[0052] like Figure 2 and Figure 3 As shown, after cutting the sputtering area 21, a portion of the outer peripheral surface of the mounting portion 20 can be exposed, while the non-sputtered area 22 remains connected to the substrate 10, and the outer peripheral surface of the non-sputtered area 22 is not exposed. This method is not only simple to operate, but also effectively avoids the exposure of the non-sputtered area 22, thereby preventing the electronic components 30 that do not need to be sputtered from being sputtered and affecting product performance.

[0053] Optionally, according to an embodiment of the present invention, the step of cutting the sputtering region 21 along the outer periphery of the mounting portion 20 may further include:

[0054] A covering layer 26 covering the substrate 10 is applied to the substrate 10;

[0055] A cutting groove is formed by cutting the sputtering area 21 along the outer contour of the mounting part 20.

[0056] In other words, the method of covering the substrate 10 with the covering layer 26 before cutting can be to encapsulate only a single mounting part 20 or to encapsulate the entire substrate 10. This method can effectively improve the encapsulation efficiency while ensuring that the mounting part 20 can be cut normally.

[0057] In some specific embodiments of the present invention, the cutting groove is located between two adjacent connecting parts 24, and the multiple cutting grooves formed between the multiple connecting parts 24 are disconnected from each other.

[0058] In other words, such as Figure 1 As shown in c, each mounting part 20 has a sputtering area 21 between two adjacent connecting parts 24. After the sputtering area 21 is cut, the multiple cutting grooves formed are not connected to each other, but are disconnected at the non-sputtering area 22 and the connecting part 24. The non-sputtering area 22 and the connecting part 24 of the mounting part 20 remain connected to the substrate 10, thereby preventing the mounting part 20 from detaching from the substrate 10 and ensuring the normal sputtering of the mounting part 20.

[0059] According to one embodiment of the present invention, the length of the edge of the main body 23 on which the electronic component 30 is provided is greater than the length of the cutting groove on the corresponding side, and the length of the remaining edges of the main body 23 is equal to the length of the cutting groove on the corresponding side.

[0060] In other words, the outer contour of the main body 23 includes four edges, one of which has a non-sputtered area 22, while the other three edges only have sputtered areas 21. The length of the sputtered areas 21 on these three edges, which is also the length of the corresponding cutting groove, is equal to the length of the edge of the main body 23. That is, the three edges with sputtered areas 21 are completely cut off, while on the edge with non-sputtered areas 22, the length of the cutting groove is less than the length of the corresponding edge. The remaining area serves as the non-sputtered area 22 for mounting electronic components 30. Thus, by cutting the main body 23 in this way, the sputtered area of ​​the sputtered areas 21 can be guaranteed while avoiding the cutting off of the non-sputtered areas 22, thereby ensuring the overall quality of the product.

[0061] In some specific embodiments of the present invention, an electronic component 30 is disposed on one side edge of the main body 23 near one end of a connecting portion 24, and a cutting groove is provided between the electronic component 30 and another connecting portion 24 on one side edge.

[0062] In other words, such as Figure 2 and Figure 3 As shown, a non-sputtering region 22 is provided on one side edge of the main body 23. The non-sputtering region 22 is located at one end of the side edge near the connecting part 24. The electronic component 30 is disposed in the corresponding non-sputtering region 22. This structure not only facilitates the cutting of the sputtering region 21, but also facilitates the assembly of the electronic component 30.

[0063] Optionally, according to one embodiment of the present invention, the step of sputtering the substrate 10 includes:

[0064] A film 27 is covered on one side surface of each of the multiple connecting parts 24, and the cutting groove is exposed on the film 27.

[0065] A film 27 is applied to the other side surface of the substrate 10;

[0066] The cutting groove is sputtered to form a sputtered layer on the exposed outer peripheral surface of the main body 23.

[0067] Specifically, such as Figure 1 As shown in Figure d, after cutting grooves on the substrate 10, a film-coating process can be performed on the area where the connecting portion 24 is located. That is, an adhesive film 27 is covered on the connecting portion 24. For example, a shaped film can be covered on the connecting portion 24 using a PnP method. After covering the adhesive film 27, sputtering can be performed on the substrate 10. For example, the entire bottom of the substrate 10 can be coated with film and placed on a sputtering fixture. This can effectively prevent sputtering of the area where the connecting portion 24 is located, thereby ensuring the performance requirements of the product. The sputtering method for the substrate 10 can adopt a conventional sputtering method. The sputtered metal coating can be sputtered onto the sidewall of the exposed part of the mounting portion 20 through the gap of the laser-cut groove.

[0068] In some specific embodiments of the present invention, the step of continuing to cut the substrate 10 along the outer peripheral edge of the mounting portion 20 includes:

[0069] Remove the adhesive film 27 from the substrate 10;

[0070] The substrate 10 is cut along the extension direction of the cutting groove and the outer contour of the connecting portion 24 so that the mounting portion 20 is detached from the substrate 10.

[0071] like Figure 1 As shown in Figure e, after sputtering the substrate 10, the mounting portion 20 can be completely removed from the substrate 10. This removal can be achieved by first removing the adhesive films 27 on both sides of the substrate 10, and then cutting the mounting portion 20 along the extension direction of the cutting groove and the shape of the outer contour of the connecting portion 24. The mounting portion 20 can then be removed from the substrate 10, and the end of the electronic component 30 on the mounting portion 20, detached from the substrate 10, can be exposed from the non-sputtered area 22. After the mounting portion 20 is completely removed, it can be sent to subsequent processes for further processing to obtain a complete SIP packaged product.

[0072] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A sputtering method for a SIP packaged product, characterized in that, Includes the following steps: A mounting portion for mounting or setting electronic components is defined on a substrate. The outer contour of the mounting portion includes a sputtered area and a non-sputtered area. One end of the electronic component is located in the non-sputtered area. The sputtered area is cut along the outer periphery of the mounting portion to expose a portion of the outer periphery of the mounting portion, while the non-sputtered area remains connected to the substrate, and the ends of the electronic components are not exposed. The substrate is sputtered to form a sputtered layer on the outer peripheral surface of the sputtering area; The substrate is cut along the outer periphery of the mounting portion to detach the mounting portion from the substrate, wherein one end of the electronic component is exposed in the non-sputtered area.

2. The sputtering method for SIP packaged products according to claim 1, characterized in that, The substrate is provided with a plurality of mounting portions, and the electronic components are respectively mounted or disposed on each mounting portion.

3. The sputtering method for SIP packaged products according to claim 1, characterized in that, The mounting part includes a main body and multiple connecting parts. The electronic component is mounted or disposed on the main body. The connecting parts are provided with mounting holes. One end of the electronic component is located at the edge of the main body.

4. The sputtering method for SIP packaged products according to claim 3, characterized in that, The main body is rectangular, and the connecting part is provided at each of the three apex corners of the main body.

5. The sputtering method for SIP packaged products according to claim 3, characterized in that, The step of cutting the sputtering area along the outer periphery of the mounting portion includes: A covering layer is provided on the main body to cover the main body, and the outer contour of the covering layer overlaps with the outer contour of the main body; A cutting groove is formed by cutting the sputtering area along the outer contour of the coating layer.

6. The sputtering method for SIP packaged products according to claim 3, characterized in that, The step of cutting the sputtering area along the outer periphery of the mounting portion includes: A covering layer is applied to the substrate; A cutting groove is formed by cutting the sputtering area along the outer contour of the mounting part.

7. The sputtering method for SIP packaged products according to claim 5 or 6, characterized in that, The cutting groove is located between two adjacent connecting parts, and the multiple cutting grooves formed between the multiple connecting parts are disconnected from each other.

8. The sputtering method for SIP packaged products according to claim 5 or 6, characterized in that, The length of the edge of the main body where the electronic component is located is greater than the length of the cutting groove on the corresponding side, and the length of the remaining edges of the main body is equal to the length of the cutting groove on the corresponding side.

9. The sputtering method for SIP packaged products according to claim 5 or 6, characterized in that, The electronic component is located on one side edge of the main body near one end of one of the connecting portions, and the cutting groove is provided between the electronic component and another connecting portion on the same side edge.

10. The sputtering method for SIP packaged products according to claim 5 or 6, characterized in that, The steps of sputtering the substrate include: An adhesive film is respectively covered on one side surface of the plurality of connecting parts, and the cutting groove is exposed on the adhesive film; A film is applied to the other side surface of the substrate. The cutting groove is sputtered to form the sputtered layer on the exposed outer peripheral surface of the main body.

11. The sputtering method for SIP packaged products according to claim 10, characterized in that, The step of continuing to cut the substrate along the outer periphery of the mounting portion includes: Remove the adhesive film from the substrate; The substrate is cut further along the extension direction of the cutting groove and the outer contour of the connecting portion to disengage the mounting portion from the substrate.

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