Conductive foam and its manufacturing method, electronic equipment

Abstract

The present application provides a conductive foam and a method for making it, and an electronic device, and relates to the field of electronic communication technology. The conductive foam is applied to electronic devices, and the conductive foam includes: a foam substrate; a conductive layer, covering at least the first surface of the foam substrate, the first surface is used to be electrically connected to a first structure in the electronic device through the conductive layer; the conductive layer includes at least a conductive paste layer, and the conductive paste layer is used to deform under external pressure. Thus, a conductive foam with conductivity, a low working height in the first direction, a low PIM, and low stress can be provided. When the conductive foam is applied to electronic devices, the thickness of the electronic device can be reduced, and the PIM of the contact interface between the conductive foam and the structure in the electronic device can be reduced. In addition, it can also reduce or eliminate radiation stray interference, etc.

Description

Technical Field

[0001] The present application relates to the field of electronic communication technology, and in particular to a conductive foam and a manufacturing method thereof, and an electronic device. Background Art

[0002] With the continuous development of mobile communication technology, the internal structure of electronic devices is becoming more and more complex, and the integration is becoming higher and higher. For example, taking a mobile phone as an example, the high integration of the components makes the thickness of the mobile phone thinner and thinner; thus, the spacing between adjacent components along the thickness direction of the mobile phone is getting smaller and smaller. In this case, it is particularly important to reduce radiated spurious emission (RSE) and avoid signal interference between adjacent components.

[0003] In the related art, foam is often used in electronic devices to reduce radiation stray, conduct electricity, prevent static electricity, etc. However, the current foam cannot achieve low working height and low passive intermodulation (PIM), which results in the electronic devices being unable to achieve ultra-thinness and unable to have better performance when used in electronic devices.

[0004] Therefore, a new solution is urgently needed to solve the above problems. Summary of the invention

[0005] The embodiments of the present application provide a conductive foam and a method for making the same, as well as an electronic device. By providing a conductive layer on at least the first surface of a foam substrate, the conductive foam can be both conductive and well compressed or stretched, thereby achieving a lower working height in a first direction, having a smaller PIM, and a smaller stress. In addition, the contact area with the structure in the electronic device can be larger.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] In a first aspect, a conductive foam is provided for use in electronic equipment, wherein the conductive foam comprises:

[0008] Foam matrix;

[0009] A conductive layer covers at least a first surface of the foam substrate, wherein the first surface is used to be electrically connected to a first structure in the electronic device through the conductive layer; the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.

[0010] The embodiment of the present application provides a conductive foam, which is provided with a conductive paste layer covering at least the first surface of the foam substrate, so that the conductive paste in the conductive paste layer has certain ductility, good conductivity, large resistivity and other properties, and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure. Combined with the elasticity of the foam substrate, the working height of the conductive foam in the first direction can be relatively low; at the same time, the conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; and when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0011] Therefore, the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction. When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.

[0012] In a possible implementation manner of the first aspect, the conductive paste layer includes a paste body and a plurality of connected conductive particles, and the conductive particles are doped into the paste body.

[0013] In this implementation, multiple connected conductive particles in the conductive paste layer can generate multiple current paths, thereby making the conductive paste layer conductive; at the same time, the paste body in the conductive paste layer is soft, so that the conductive paste layer can be deformed under external pressure.

[0014] Optionally, the conductive layer is a first conductive paste layer, and the first conductive paste layer is used to deform under external pressure.

[0015] In this implementation, a first conductive paste layer is provided to cover at least the first surface of the foam matrix. Since the first conductive paste has certain ductility, good conductivity, large resistivity and other properties, and the first conductive paste is in liquid before film formation, its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure. Combined with the elasticity of the foam matrix, the conductive foam can work at a lower height in the first direction; at the same time, the first conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the first conductive paste is very small; and when the first conductive paste is cured into a conductive paste layer, the first conductive particles in the first conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0016] Optionally, the conductive layer is a second conductive paste layer, and the second conductive paste layer is used to deform under external pressure.

[0017] In this implementation, a second conductive paste layer is provided to cover at least the first surface of the foam matrix. Since the second conductive paste has certain ductility, good conductivity, large resistivity and other properties, and the second conductive paste is in liquid before film formation, its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure. Combined with the elasticity of the foam matrix, the conductive foam can work at a lower height in the first direction; at the same time, the second conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the second conductive paste is very small; and when the second conductive paste is cured into a conductive paste layer, the second conductive particles in the second conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0018] In a possible implementation manner of the first aspect, the conductive layer further includes a first substrate layer, and the first substrate layer is configured to deform under the external pressure;

[0019] The orthographic projection of the conductive paste layer on the foam substrate at least partially overlaps with the orthographic projection of the first substrate layer on the foam substrate.

[0020] In this implementation, by setting a first substrate layer and a conductive paste layer, on the one hand, the first substrate layer is elastic and can be well compressed or stretched; on the other hand, the conductive paste in the conductive paste layer has certain ductility, good conductivity, large resistivity and other properties, and the volume of the conductive paste will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure. Combined with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low; at the same time, the conductive paste is sintered into layers and the volume is reduced, which can make the PIM inside the conductive paste very small; and, when the conductive paste is cured into a conductive paste layer, it is spread out, which can make the contact area between the conductive foam and the structure in the electronic device larger.

[0021] In a possible implementation of the first aspect, the conductive paste layer is a first conductive paste layer, and the first conductive paste layer is disposed on a side of the first substrate layer away from the foam matrix;

[0022] The conductive layer further includes a first adhesive layer, which is disposed between the first substrate layer and the foam matrix. The first adhesive layer is used to bond the first substrate layer and the foam matrix, and is deformed under the external pressure.

[0023] In this implementation, the first adhesive layer can achieve better bonding between the first substrate layer and the foam matrix; at the same time, the first adhesive layer can be compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam matrix is ​​relatively small, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix can be relatively small, and then the working height of the conductive foam in the first direction can be relatively low. Thus, a conductive foam with a low working height in the first direction, small PIM and low stress can be obtained.

[0024] When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced. In addition, the conductive foam can be used to achieve electrical connection of the structures in the electronic devices, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic devices.

[0025] In a possible implementation of the first aspect, the conductive paste layer is a first conductive paste layer, and the first conductive paste layer at least wraps a surface of the first substrate layer close to the foam substrate and a surface of the first substrate layer away from the foam substrate;

[0026] The conductive layer further includes a first bonding layer, which is disposed between the first conductive paste layer and the foam matrix. The first bonding layer is used to bond the first conductive paste layer and the foam matrix, and deforms under the external pressure.

[0027] In this implementation, the first adhesive layer can achieve better bonding between the first conductive paste layer and the foam matrix; at the same time, the first adhesive layer can be compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam matrix is ​​relatively small, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix is ​​relatively small, and thus the working height of the conductive foam in the first direction can be relatively low; moreover, the first adhesive layer will not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, thereby obtaining a conductive foam with a low working height, small PIM and low stress in the first direction.

[0028] When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced while the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced. In addition, the conductive foam can be used to achieve directional electrical connection of the structures in the electronic devices and reduce or eliminate radiation stray interference, thereby effectively improving the performance of the electronic devices.

[0029] In a possible implementation manner of the first aspect, the first bonding layer is a glue layer.

[0030] In this implementation, the adhesive layer can achieve better bonding between the first substrate layer / first conductive paste layer and the foam matrix; at the same time, the adhesive layer can be compressed or stretched, and the thickness of the adhesive layer in the direction perpendicular to the foam matrix is ​​small, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix is ​​small, and thus the working height of the conductive foam in the first direction can be lower, thereby obtaining a conductive foam with a lower working height in the first direction, a small PIM, and a low stress; and the adhesive layer is simple and easy to implement, and the cost is low.

[0031] In a possible implementation manner of the first aspect, the first bonding layer is a second conductive paste layer.

[0032] In this implementation, the second conductive paste layer can achieve better bonding between the first substrate layer / first conductive paste layer and the foam matrix; at the same time, the second conductive paste layer can be compressed or stretched, and the thickness of the second conductive paste layer in a direction perpendicular to the foam matrix can be smaller, so that the thickness of the conductive layer in a direction perpendicular to the foam matrix can be smaller, and thus the working height of the conductive foam in the first direction can be lower. Thus, a conductive foam with a lower working height in the first direction, small PIM and low stress can be obtained.

[0033] In a possible implementation of the first aspect, the first surface of the foam matrix is ​​divided into at least a first area and a second area, and along a direction perpendicular to the foam matrix, a height of a portion of the conductive layer located in the first area is less than a height of a portion of the conductive layer located in the second area.

[0034] In this implementation, by setting the height of the conductive foam in the first area and the height of the conductive foam in the second area to be different along a direction perpendicular to the foam matrix, when used in electronic devices, the conductive foam can be electrically connected to at least two structures of different heights, thereby enriching the application of conductive foam in electronic devices.

[0035] In a possible implementation manner of the first aspect, a structure of a portion of the conductive layer located in the first region is the same as a structure of a portion of the conductive layer located in the second region;

[0036] Along a direction perpendicular to the foam matrix, a height of a portion of at least one of the conductive layers located in the first region is smaller than a height of a portion of the at least one conductive layer located in the second region.

[0037] In this implementation, the height of the conductive layer in the first area can be made smaller than the height in the second area, and the height difference is as small as possible, which is simple and easy to implement.

[0038] In a possible implementation manner of the first aspect, the conductive layer further includes a second substrate layer, and the second substrate layer is disposed in the second region and located on a side of the conductive paste layer away from the foam matrix.

[0039] In this implementation, by setting the second substrate layer in the second area, the height of the conductive layer in the first area can be smaller than that in the second area along the direction perpendicular to the foam matrix, and the height difference can be large, which is simple and easy to implement.

[0040] In a possible implementation of the first aspect, the foam matrix is ​​in the shape of a polyhedron, and the polyhedron includes at least the first surface, the second surface, and the third surface connected to each other;

[0041] The conductive layer covers at least the first surface, the second surface and the third surface.

[0042] In this implementation, the foam matrix includes at least a first surface, a second surface and a third surface that are connected, and the conductive layer covers at least the first surface, the second surface and the third surface of the foam matrix, thereby providing a variety of conductive foams with low working height, small PIM and low stress in the first direction, thereby enriching the application of conductive foams in electronic devices.

[0043] In a possible implementation of the first aspect, when the polyhedron includes the first surface, the second surface and the third surface, the first surface is arranged opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the polyhedron.

[0044] In this implementation, the first surface of the foam matrix is ​​arranged opposite to the second surface, and the first surface is connected to the second surface through the third surface. A conductive layer is arranged to cover at least part of the first surface, all of the third surface and at least part of the second surface of the polyhedron, so that a "C"-shaped conductive layer can be formed. When the conductive foam is used in electronic equipment, the directionality of the conductive foam can be guaranteed, thereby performing identification and anti-mistakes.

[0045] In a possible implementation of the first aspect, when the polyhedron includes the first surface, the second surface, the third surface and the fourth surface, the first surface is arranged opposite to the second surface, and the third surface is arranged opposite to the fourth surface, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface and the entire fourth surface.

[0046] In this implementation, the first surface is arranged opposite to the second surface, the third surface is arranged opposite to the fourth surface, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer is arranged to cover the entire first surface, at least part of the second surface, the entire third surface and the entire fourth surface of the foam substrate, so as to form a similar The conductive layer of the conductive foam can ensure the directionality of the conductive foam when used in electronic equipment, thereby performing identification and anti-mistake.

[0047] Optionally, when the polyhedron includes a first surface, a second surface and a third surface, the first surface is arranged opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the polyhedron;

[0048] The conductive foam further includes a second adhesive layer, and the second adhesive layer is arranged on a portion of the second surface.

[0049] In this implementation, by providing a second adhesive layer on a portion of the second surface, the conductive foam can be well electrically connected to the structure in the electronic device, thereby realizing the application of the conductive foam.

[0050] Optionally, when the polyhedron includes a first surface, a second surface, a third surface and a fourth surface, the first surface is arranged opposite to the second surface, and the third surface is arranged opposite to the fourth surface, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer covers the entire first surface, at least a portion of the second surface, the entire third surface and the entire fourth surface;

[0051] The conductive foam further includes a second adhesive layer, and the second adhesive layer is arranged on a portion of the second surface.

[0052] In this implementation, by providing a second adhesive layer on a portion of the second surface, the conductive foam can be well electrically connected to the structure in the electronic device, thereby realizing the application of the conductive foam.

[0053] In a possible implementation manner of the first aspect, the second surface of the polyhedron is used to be electrically connected to a second structure in the electronic device through the conductive layer.

[0054] In this implementation, the first surface of the conductive foam can be electrically connected to the first structure in the electronic device through the conductive layer, and the second surface can be electrically connected to the second structure in the electronic device through the conductive layer, thereby at least achieving electrical connection between the first structure and the second structure in the electronic device.

[0055] In a possible implementation of the first aspect, the first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative component.

[0056] In this implementation, the conductive foam can achieve electrical connection with at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc. in the electronic device through the conductive layer.

[0057] In a possible implementation of the first aspect, the second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative component.

[0058] In this implementation, the conductive foam can achieve electrical connection with at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc. in the electronic device through the conductive layer.

[0059] In a second aspect, an electronic device is provided, comprising the conductive foam as in the first aspect or any possible implementation of the first aspect.

[0060] The electronic device provided in the embodiment of the present application uses the conductive foam as in the first aspect or any possible implementation of the first aspect, so that the thickness of the electronic device can be reduced while the PIM between the structure in the electronic device and the contact interface of the conductive foam can be smaller; and the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0061] In a possible implementation manner of the second aspect, the first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

[0062] In this implementation, the first surface of the conductive foam can be electrically connected to the display screen through the conductive layer, and the second surface of the conductive foam can be electrically connected to the metal middle frame through the conductive layer; at the same time, because the conductive foam can be well compressed or stretched, it can not only meet the requirements of achieving a lower working height in the first direction, but also avoid damaging the display screen, thereby ensuring the excellent performance of the electronic device.

[0063] In a possible implementation manner of the second aspect, the first structure includes at least a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam during rotation.

[0064] In this implementation, a camera assembly such as a camera is electrically connected to a conductive foam. Since the working height of the conductive foam in the first direction is relatively low, it can be placed between the camera and other structures. When the camera rotates in any direction, since the conductive foam can be well compressed or stretched, the camera can always maintain an electrical connection with the conductive foam, thereby ensuring the performance of the electronic device. At the same time, since the conductive foam is an independent structure and can be separated, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic device, causing the entire electronic device to be scrapped. Moreover, the conductive foam can effectively absorb the tolerance existing when electrically connecting to the structure of the electronic device, thereby avoiding poor contact. In addition, the conductive foam can make the grounding (GND) path shorter. At the same time, if problems such as overflowing glue occur, the conductive foam can also be improved by strain. As a result, the performance of the electronic device in the embodiment of the present application is greatly improved.

[0065] In a third aspect, a method for making a conductive foam is provided, the method comprising:

[0066] A conductive layer is formed on at least the first surface of the foam substrate; wherein the first surface is used to electrically connect to a first structure in the electronic device through the conductive layer, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.

[0067] The method for making the conductive foam provided in the embodiment of the present application forms a conductive paste by spraying, printing, spraying, vacuum plating, dipping, etc., and bakes / heats to solidify to form a conductive paste layer, which is simple and easy to implement; at the same time, the conductive paste in the conductive paste layer has certain ductility, good conductivity, large resistivity and other properties, and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure. Combined with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low; and the conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; in addition, when the conductive paste is solidified into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0068] The embodiments of the present application provide a conductive foam and a method for making the same, and an electronic device. Since the conductive paste layer in the conductive layer covering at least the first surface of the foam substrate has certain ductility, good conductivity, and a large resistivity, and since the foam substrate is elastic, the conductive foam has a lower working height in the first direction, a smaller PIM, and a smaller stress. The conductive foam is applied to electronic devices, can have a larger contact surface with the structure in the electronic device, and the PIM of the contact surface is smaller. At the same time, the thickness of the electronic device can be made thinner, and radiation stray interference can be reduced or eliminated, thereby effectively improving the performance of the electronic device and providing a good user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Figure 1 A schematic diagram of the structure of a first electronic device provided in an embodiment of the present application;

[0070] Figure 2 It is a structural schematic diagram of an all-round drawing foam in the related art;

[0071] Figure 3 A schematic diagram of a three-dimensional structure with a cross section of the first conductive foam provided in an embodiment of the present application;

[0072] Figure 4 for Figure 3 A schematic cross-sectional view of the conductive foam shown;

[0073] Figure 5 A schematic diagram of a three-dimensional structure with a cross section of the second conductive foam provided in an embodiment of the present application;

[0074] Figure 6 for Figure 5 A schematic cross-sectional view of the conductive foam shown;

[0075] Figure 7A schematic diagram of the structure of the conductive paste layer of the conductive foam provided in an embodiment of the present application before curing;

[0076] Figure 8 A schematic diagram of the structure of the conductive paste layer of the conductive foam provided in an embodiment of the present application after curing;

[0077] Fig. 9 A schematic diagram of a three-dimensional structure with a cross section of a third conductive foam provided in an embodiment of the present application;

[0078] Fig.10 for Fig. 9 A schematic cross-sectional view of the conductive foam shown;

[0079] Fig.11 A schematic diagram of the structure of the fourth conductive foam provided in the embodiment of the present application;

[0080] Fig.12 A schematic diagram of the microstructure of the nonwoven fabric provided in the embodiment of the present application;

[0081] Fig.13 A schematic diagram of the structure of the fifth conductive foam provided in the embodiment of the present application;

[0082] Fig.14 A schematic diagram of the structure of the sixth conductive foam provided in the embodiment of the present application;

[0083] Fig.15 A schematic diagram of the structure of the seventh conductive foam provided in the embodiment of the present application;

[0084] Fig.16 A schematic diagram of the structure of an eighth conductive foam provided in an embodiment of the present application;

[0085] Fig.17 A schematic diagram of the structure of a ninth conductive foam provided in an embodiment of the present application;

[0086] Fig.18 A schematic diagram of the structure of the tenth conductive foam provided in an embodiment of the present application;

[0087] Fig.19 A schematic diagram of the structure of the eleventh conductive foam provided in an embodiment of the present application;

[0088] Fig. 20 A schematic diagram of the structure of a second electronic device provided in an embodiment of the present application;

[0089] Fig.21 A schematic diagram of the structure of a third electronic device provided in an embodiment of the present application;

[0090] Fig. 22 It is a structural schematic diagram of a first electronic device in the related art;

[0091] Fig.23 is a schematic structural diagram of a second electronic device in the related art;

[0092] Fig.24 A schematic diagram of the structure of a fourth electronic device provided in an embodiment of the present application;

[0093] Fig.25 A schematic diagram of the structure of a fifth electronic device provided in an embodiment of the present application;

[0094] Fig.26 A schematic diagram of the structure of a sixth electronic device provided in an embodiment of the present application;

[0095] Fig. 27 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0096] Fig.28 A schematic diagram of the structure of a seventh electronic device provided in an embodiment of the present application;

[0097] Fig.29 A schematic diagram of the structure of an eighth electronic device provided in an embodiment of the present application;

[0098] Fig.30 A flow chart of a first method for making conductive foam provided in an embodiment of the present application;

[0099] Fig.31 A flow chart of a second method for making the conductive foam provided in an embodiment of the present application;

[0100] Fig.32 A flow chart of a third method for making conductive foam provided in an embodiment of the present application;

[0101] Fig.33 A flow chart of a first method for making conductive foam for practical application provided in an embodiment of the present application.

[0102] Reference numerals:

[0103] 01-electronic device; 101-display module; 1011-display screen; 1012-touch panel; 1013-metal frame; 102-middle frame; 1021-frame; 1022-carrying board; 103-back shell; 501-front camera; 502-shielding cover; 503-conductive cloth; 504-PCB; 505-bracket steel sheet; 506-screw; 507-substrate of front camera; 508-rear camera; 509-substrate of rear camera; 102-middle frame; 105-antenna; 106-insulating material layer; 107-plastic; 108-reed; 109-laser engraved surface; 110-anti-oxidation layer; OZ-first direction (thickness direction of mobile phone); OX-second direction (width direction of mobile phone); OY-third direction (length direction of mobile phone); 111-display screen;

[0104] 03-all-around brushed foam; 121-adhesive backing of all-around brushed foam; 122-metal wire;

[0105] 05-conductive foam; 1-foam matrix; 10-first foam matrix; 11-first surface of the foam matrix; 12-second surface of the foam matrix; 13-third surface of the foam matrix; 14-fourth surface of the foam matrix; 2-conductive layer; 21-first conductive paste layer; 211-first paste body; 212-first conductive particles; 22-second conductive paste layer; 221-second paste body; 222-second conductive particles; D1-conductive path; Q1-first region; Q12-second region; 5-glue layer; 6-first substrate layer; 7-second adhesive layer; 8-heterochromatic PET layer; 9-second substrate layer. DETAILED DESCRIPTION

[0106] The technical solutions in the embodiments of the present application will be described clearly and in detail below in conjunction with the accompanying drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0107] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more. "At least one" means one or more.

[0108] First, some terms in the embodiments of the present application are explained to facilitate understanding by those skilled in the art.

[0109] 1. Foam

[0110] Foam refers to foamed materials such as polyurethane and plastic particles, referred to as foam. Foam has the characteristics of light weight, elasticity, fast pressure-sensitive fixation, easy use, easy bending, ultra-thin volume, and reliable performance.

[0111] 2. Conductive foam

[0112] Conductive foam refers to wrapping conductive cloth on the foam core. After processing, it has good surface conductivity and can be easily fixed to the structure that needs to be shielded with adhesive tape.

[0113] 3. Passive intermodulation

[0114] Passive intermodulation occurs when two or more frequencies mix together in a nonlinear device, thereby generating spurious signals.

[0115] 4. Spurious radiation

[0116] Radiated spurious signals refer to the radiation at discrete frequencies other than the carrier frequency and the sidebands and adjacent channels caused by normal modulation and switching transients when modulated with a standard signal; radiated spurious signals may be harmonic components, intermodulation signals, etc. generated by some nonlinear structures.

[0117] 5. Percolation theory of conductive paste

[0118] When the content of conductive particles in the conductive paste is high, the conductive network is mainly formed by direct overlapping of the conductive particles.

[0119] 6. Tunneling effect theory or field emission theory of conductive paste

[0120] When the content of conductive particles in the conductive paste is low, the conductive particles are insufficient for direct contact. At this time, an external electric field is imposed from the outside, and electrons penetrate the organic matter through the tunnel effect and jump to the nearby conductive particles, so that the conductive network is unobstructed. When the tunnel effect theory or field emission theory is dominant in the conductive paste, the PIM performance of the conductive paste is poor.

[0121] 7. Non-woven fabrics

[0122] Non-woven fabrics are also called non-woven fabrics, needle-punched cotton, needle-punched non-woven fabrics, etc. They are made of polyester fibers, polyester fibers and other materials, and are made through a needle-punching process. Non-woven fabrics have no warp and weft. They are a kind of fabric that does not require spinning and weaving. They are made by directional or random arrangement of textile short fibers or filaments to form a fiber mesh structure, and then reinforced by mechanical, thermal bonding or chemical methods. Non-woven fabrics are moisture-proof, breathable, flexible, thin, flame-retardant, non-toxic and tasteless, low-priced, and recyclable.

[0123] The above is a brief introduction to the nouns involved in the embodiments of the present application, which will not be repeated below.

[0124] For example, Figure 1 An electronic device 01 to which the embodiment of the present application is applicable is shown.

[0125] like Figure 1 As shown, taking the electronic device 01 as a mobile phone as an example, the mobile phone may include a display module 101, a middle frame 102, and a rear shell 103, etc. The middle frame 102 is arranged between the display module 101 and the rear shell 103, and the middle frame 102 includes a frame 1021 and a carrier plate 1022 surrounded by the frame, and an internal structure, such as components, is installed on one side of the carrier plate 1022. The internal structure of the mobile phone can realize its function through electrical connection, which is usually a weak force contact, resulting in the contact interface of the internal structure to easily generate nonlinear products such as harmonics and passive intermodulation. Nonlinear products are the main source of mobile phone radiation spurious, and radiation spurious interference is an important indicator for mobile phone acceptance.

[0126] In order to reduce or eliminate radiated stray interference, the internal structure of the mobile phone can be electrically connected through foam. There are many types of foam provided by the relevant technology, such as omnidirectional drawing foam, etc. These foams are widely used due to their low PIM and other characteristics.

[0127] For example, Figure 2 FIG. 2 shows an all-round drawing foam 03 in the related art. Figure 2 As shown, the omnidirectional drawing foam 03 includes a backing glue 121 and a metal wire 122. The backing glue 121 may include any one of conductive glue, insulating glue, etc., and the metal wire 122 may include copper wire, etc. However, when the omnidirectional drawing foam 03 is compressed, the metal wire 122 may break, or the metal wire 122 may not rebound and may be permanently deformed, which makes it difficult to compress the working height in the first direction. It should be noted that the first direction is Figure 2 The OZ direction shown in the figure corresponds to the thickness direction of the mobile phone.

[0128] Then, based on the above examples, it can be seen that the foams provided in the related art cannot achieve a lower working height in the first direction, nor can they further reduce PIM.

[0129] In view of this, the present application provides a conductive foam, which is provided with a conductive layer covering at least the first surface of the foam matrix, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer has the advantages of good ductility, good conductivity, and very small internal PIM; at the same time, the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure and rebound after the pressure disappears, thereby effectively reducing the working height of the conductive foam in the first direction and achieving a very small PIM, and the conductive foam itself will not produce problems such as breakage and permanent deformation.

[0130] When the conductive foam of the present application is applied to electronic devices, the contact area between the conductive foam and the structure in the electronic device is large, and the thickness of the electronic device can be effectively reduced to achieve ultra-thinness; at the same time, the interface PIM between the structure in the electronic device and the contact surface of the conductive foam can also be reduced, reducing or eliminating radiation stray interference, etc.

[0131] The embodiments of the present application do not impose any restrictions on the specific types of electronic devices. In some embodiments, the electronic devices of the present application may include mobile phones, wearable devices (such as smart bracelets, smart watches, headphones, etc.), tablet computers, laptop computers, handheld computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computers, UMPCs), cellular phones, personal digital assistants (personal digital assistants, PDAs), augmented reality (AR) and virtual reality (VR) devices, and other Internet of Things (IOT) devices, vehicle-mounted electronic devices, and may also be televisions, large screens, printers, projectors and other devices.

[0132] In the application, taking the electronic device as a mobile phone as an example, Figure 1As shown, the mobile phone may include a display module 101, a middle frame 102, and a rear shell 103. The display module 101 includes a display screen 1011 and a touch panel 1012 arranged on the light-emitting side of the display screen 1011; the display module 101 is installed on one side of a carrier board 1022, and internal structures such as a camera assembly, an antenna, a circuit board, and a battery are installed on the other side. The frame 1021 and the carrier board 1022 used to form the middle frame 102 may be an integrated structure; the rear shell 103 is installed on the middle frame 102, and the rear shell 103 is used to protect the above internal structures. Figure 1 As shown, the mobile phone can also include a metal frame 1013 installed on the non-light-emitting side of the display screen 1011. The side of the metal frame 1013 facing away from the display screen 1011 can be adhered to the side of the middle frame 102 through an adhesive layer, thereby achieving the purpose of installing the display module 101 on one side of the middle frame 102.

[0133] In some embodiments, in the electronic device of the present application, the first structure may be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.; the second structure may be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc. The first structure and the second structure may be the same, or of course different, depending on the actual application. For example, the camera assembly may include a camera; the circuit board may include a printed circuit board (PCB), a flexible printed circuit board (FPC), etc.

[0134] It should be noted that the above-mentioned display screen may include a liquid crystal display (LCD), an organic light emitting diode (OLED) display screen, etc.

[0135] The touch panel may include a cover plate made of glass or transparent resin material, and a touch electrode pattern located on a side of the cover plate close to the display screen.

[0136] Only the contents related to the invention are introduced here. The rest of the structure can be obtained by referring to the relevant technology and will not be described in detail here.

[0137] Based on the above structure, when the conductive foam provided by the present application is applied to an electronic device, it can be electrically connected to any first structure and / or other structures except the first structure in the electronic device, so that the electrical connection of the structure in the electronic device can be achieved through the conductive foam, while the thickness of the electronic device can be reduced, and the contact surface PIM between the structure in the electronic device and the conductive foam can be reduced. In addition, it can also reduce or eliminate radiation stray interference, etc., and the user experience is good.

[0138] In an application, at least one surface of the conductive foam provided in the embodiment of the present application is used to be electrically connected to at least one structure in an electronic device through a conductive paste layer. At this time, the structure in the electronic device may include at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.

[0139] As an example, when the conductive foam includes a first surface, the first surface may be used to electrically connect to one first structure through the conductive paste layer, or the first surface may be used to electrically connect to multiple first structures through the conductive paste layer, which is not specifically limited here.

[0140] As an example, when the conductive foam includes a first surface and other surfaces, for example, the conductive foam includes a first surface and a second surface, the first surface may be electrically connected to the first structure through a conductive paste layer, and the second surface may be electrically connected to the second structure through a conductive paste layer. The second structure may refer to the first structure, which will not be described in detail here. The number of the first structure and the second structure may also be determined according to actual needs.

[0141] Combine the following Figures 3 to 19 , the conductive foam 05 provided in the embodiment of the present application is introduced in detail.

[0142] like Figures 3 to 6 , Figures 9 to 11 , Figures 13 to 19 As shown, the conductive foam 05 provided in this application includes:

[0143] Foam substrate 1.

[0144] The conductive layer 2 covers at least the first surface 11 of the foam substrate 1, and the first surface 11 is used to be electrically connected to the first structure in the electronic device through the conductive layer 2; the conductive layer 2 at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.

[0145] The conductive paste layer includes a paste body and a plurality of connected conductive particles, and the conductive particles are doped into the paste body.

[0146] The present application does not specifically limit the material and manufacturing process of the foam matrix. For example, the material of the foam matrix may include polyurethane, silicon dioxide-based resin, etc. For example, the foam matrix may be formed by a foaming process to serve as the foam core of the conductive foam. The foamed foam matrix has a plurality of micropores on its surface, and the foam matrix is ​​elastic and can be well deformed by compression, stretching, etc.

[0147] The present application does not specifically limit the shape of the foam matrix. For example, the shape of the foam matrix may include a polyhedron, a sphere, a cylinder, etc. In the case where the shape of the foam matrix is ​​a polyhedron, the polyhedron may include a regular polyhedron or an irregular polyhedron. In the case where the shape of the foam matrix is ​​a regular polyhedron, the regular polyhedron may include a cube, a hexahedron, an octahedron, etc. Figures 3 to 6 , Figures 9 to 11 , Figures 12 to 19 In the figure, the foam matrix 1 is in the shape of a hexahedron.

[0148] The polyhedron has multiple surfaces, and the multiple surfaces include at least a first surface, which is a surface that needs to be electrically connected to a first structure in an electronic device; of course, at least one other surface of the polyhedron except the first surface can also be electrically connected to other structures in the electronic device except the first structure. Exemplarily, the polyhedron can also be provided with a second surface electrically connected to the second structure in the electronic device. Among all the surfaces of the polyhedron, the number of surfaces that need to be electrically connected to the structure of the electronic device can be determined according to the actual application of the conductive foam. At this time, the electrical connection can be an indirect electrical connection, that is, the surface of the polyhedron is electrically connected to the structure in the electronic device through a conductive layer; of course, the surface of the polyhedron can also be electrically connected to the structure in the electronic device through a first adhesive layer, a conductive layer, etc., which is not specifically limited here.

[0149] The volume of the foam matrix mentioned above in the present application can be determined according to actual needs.

[0150] It should be understood that the above-mentioned conductive layer covers at least the first surface of the foam substrate, which means that the conductive layer can only cover the first surface of the foam substrate; or, in addition to covering the first surface of the foam substrate, the conductive layer can also cover other surfaces of the foam substrate, wherein the other surface refers to any surface except the first surface, and no specific limitation is made here. Taking the shape of the foam substrate as a hexahedron as an example, the conductive layer can cover one surface (the first surface) of the foam substrate; or, the conductive layer can cover two surfaces (the first surface and the second surface) of the foam substrate; or, the conductive layer can cover more than three surfaces of the foam substrate, which shall be subject to actual application.

[0151] The following is a specific example of a case where the conductive layer covers the foam substrate, assuming that the shape of the foam substrate is a hexahedron:

[0152] As an example, Figures 3 to 6 , Figure 9-11 In the embodiment, the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface) of the foam substrate 1.

[0153] As another example, Figure 13 to Figure 14 In the embodiment, the conductive layer covers a portion of the first surface 11 (upper surface), a portion of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the foam substrate 1.

[0154] As another example, Figures 15 to 18 In the embodiment, the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the foam substrate 1.

[0155] As another example, Fig.19 In the embodiment, the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface) of the foam substrate 1.

[0156] It should be noted that at least one of the first surface, the second surface, the third surface and the fourth surface is used for electrical connection with the structure in the electronic device based on the conductive layer. For example, the first surface, the second surface, the third surface and the fourth surface can all be electrically connected with the structure in the electronic device based on the conductive layer, specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, the second surface is used for electrical connection with the second structure in the electronic device based on the conductive layer, the third surface is used for electrical connection with the third structure in the electronic device based on the conductive layer, and the fourth surface is used for electrical connection with the fourth structure in the electronic device based on the conductive layer; or, only one surface can be used for electrical connection with the structure in the electronic device based on the conductive layer, specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, and the second surface, the third surface and the fourth surface are not used for electrical connection with the structure in the electronic device based on the conductive layer; of course, other situations can also be possible, which are not specifically limited here. Among them, the first structure, the second structure, the third structure and the fourth structure can all be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc., which is determined according to actual needs.

[0157] It should be understood that the above-mentioned conductive layer at least includes a conductive paste layer, which means that the conductive layer may only include a conductive paste layer, for example, the conductive layer is a first conductive paste layer / a second conductive paste layer; or, in addition to the conductive paste layer, the conductive layer may also include other film layers, for example, it may also include a first bonding layer, a first substrate layer, etc., which is not specifically limited here.

[0158] The present application does not specifically limit the conductive paste of the conductive paste layer. For example, the conductive paste may include a polymer conductive paste (baked or heated to form a film, with an organic polymer as a bonding phase), a sintered conductive paste (sintered to form a film, with a sintering temperature of >500°C, and glass powder or oxide as a bonding phase), etc. The following embodiments of the present application are all described by taking the conductive paste as a polymer conductive paste as an example.

[0159] In applications, the conductive paste may include a paste body and a plurality of conductive particles, wherein the plurality of conductive particles are doped into the paste body, wherein the plurality of conductive particles are not connected before curing but are connected after curing, thereby generating a plurality of current paths in the conductive paste layer formed after curing, thereby conducting electricity, and after curing, the conductive particles reduce their volume to ensure contact between adjacent particles, thereby effectively reducing the PIM inside the conductive paste; at the same time, after curing, the conductive particles spread out, thereby increasing the contact area between the conductive paste layer and the structure in the electronic device.

[0160] The present application does not specifically limit the slurry body. For example, the slurry body may include a resin, specifically, the resin may be any one of a silicone resin, a silane-modified resin, an epoxy resin, a silicon dioxide resin, etc. Among them, silicone resin and silane-modified resin have the characteristics of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing (for example, less than 10%), high temperature resistance, and no internal stress. Epoxy resin and silicon dioxide resin have the characteristics of low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation.

[0161] The present application does not specifically limit the type, shape, particle size, etc. of the conductive particles. Exemplarily, the conductive particles may include metal conductive particles. Specifically, the metal conductive particles may be any one or more combinations of silver (Ag) particles, copper (Gu) particles, gold (Au) particles, aluminum (Al) particles, nickel (Ni) particles, etc.; the shape of the metal conductive particles may include any one of spherical, thorny, flake, rod, wire, etc.; the particle size of the metal conductive particles may be micron-level, nanometer-level, etc., specifically, the particle size range of the metal conductive particles may include 5-20μm, that is, the particle size of the metal conductive particles may be 5μm, 8μm, 10μm, 13μm, 17μm or 20μm, etc.

[0162] It should be noted that the elastic modulus of the above-mentioned conductive particles is different. When the main body of the slurry is the same resin, when conductive particles with a smaller elastic modulus are selected and doped into the resin, the conductive slurry can be slightly deformed under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

[0163] Table 1 below shows the elastic modulus, Poisson's ratio, pressure and intensity corresponding to silver particles, copper particles, gold particles, aluminum particles, nickel particles, iron particles and platinum particles of the same size.

[0164] Table 1

[0165] particle Elastic modulus(GPa) Poisson's ratio Ag 83 0.37 Cu 130 0.34 Au 78 0.44 Al 70 0.35 Ni 207 0.31 Fe 211 0.29 Pt 168 0.38

[0166] As can be seen from Table 1, the elastic modulus of silver, gold, and aluminum are all relatively small. When mixed in resin to form a paste layer, silver, gold, and aluminum are good conductors and soft, so they can be compressed or stretched very well. In addition, the silver particles, gold particles, and aluminum particles in the conductive paste layer can be spread out after compression, so that the contact area between the conductive paste layer and the structure in the electronic device is larger.

[0167] In addition, the required conductive particles can also be selected according to other conditions:

[0168] As an example, conductive particles can be selected according to the pressure. For example, when the pressure is high, nickel particles can be selected. The properties of nickel particles are more stable than those of silver particles. For another example, when the pressure is moderate, copper particles can be selected. The cost of copper particles is lower than that of silver particles.

[0169] As another example, conductive particles can be selected according to the current of the conductive path in the conductive foam. For example, when the current is low or in the low current area, copper particles can be selected to reduce costs. For another example, when the current is high or in the high current area, silver particles, gold particles, or other low PIM particles can be selected to ensure the performance of the conductive foam.

[0170] The present application does not specifically limit the doping concentration of the conductive particles in the conductive paste in the main body of the paste. For example, the mass fraction of the conductive particles in the main body of the paste may range from 75% to 85%. Specifically, the mass fraction of the conductive particles in the main body of the paste may be 75%, 78%, 80%, 81%, 83% or 85%, etc. The higher the mass fraction of the conductive particles in the main body of the paste, the lower the resistivity and the worse the elongation at break. Thus, the mass fraction of the conductive particles in the main body of the paste may be set to be higher to meet the compression or stretching of the conductive paste layer.

[0171] As an example, the conductive paste is a conductive silver paste, the conductive silver paste includes resin and silver particles, and the silver particles are doped in the resin. The mass fraction of the silver particles can be 80%, the mass fraction of the resin can be 20%, and the resin can be compressed or stretched; the density of the silver particles can be 10, and the density of the resin can be 1; when the mass fraction is converted into a volume fraction, the ratio of the volume fraction of the silver particles to the volume fraction of the resin can be 2:5. After the conductive silver paste is cured, the volume can shrink by about 50%, effectively reducing the PIM between the silver particles, which can even be ignored. In addition, the ratio of the volume fraction of the silver particles in the conductive silver paste layer to the volume fraction of the resin can be 1:1.25. When in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after being activated at low pressure, further increasing the contact area; the tensile adhesion value range of the conductive silver paste can include 8-9Mpa, specifically, the tensile adhesion of the conductive silver paste can be 8Mpa or 9Mpa, etc.

[0172] It should be noted that the silver particles can be micron-sized spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-sized silver wires, silver rods, etc., depending on the actual application.

[0173] When the thickness of the conductive paste layer in the direction perpendicular to the foam substrate is in the range of 10-13 μm, the resistivity of the conductive paste layer can reach 200 mΩ. Therefore, if you want the resistivity of the conductive paste layer to be lower, you can set the thickness of the conductive paste layer in the direction perpendicular to the foam substrate to be smaller. The present application does not specifically limit the thickness of the above-mentioned conductive paste layer in the direction perpendicular to the foam substrate. For example, the thickness of the conductive paste layer in the direction perpendicular to the foam substrate can range from 5 to 10 μm. Specifically, the thickness of the conductive paste layer in the direction perpendicular to the foam substrate can be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

[0174] The present application does not make any specific limitation on the manufacturing process of the above-mentioned conductive paste layer. For example, when the conductive layer only includes a conductive paste layer, a conductive paste can be first formed on the surface of the foam substrate by spraying, printing, etc., and then the conductive paste is cured by baking / heating, etc. to form the conductive paste layer; or, when the conductive layer includes a conductive paste layer and a first substrate layer, a conductive paste can be first formed on the surface of the first substrate layer by spraying, printing, etc., and then the conductive paste is cured by baking / heating, etc. to form the conductive paste layer; or, when the conductive layer includes a conductive paste layer and a first substrate layer, the first substrate can be first immersed in the conductive paste, and then the first substrate layer, the conductive paste and the foam substrate are combined.

[0175] As an example, when the paste body in the conductive paste is silicone resin or silane modified resin, the silicone resin or silane modified resin can be first coated by spraying, and then the conductive paste is baked / heated to cure; or, the first substrate can be immersed in the silicone resin or silane modified resin, and then the conductive paste is baked / heated to cure. Of course, other manufacturing processes can also be used, which are not specifically limited here.

[0176] As another example, when the main body of the conductive paste is epoxy resin or silicon dioxide resin, the epoxy resin or silicon dioxide resin can be printed first, and then the conductive paste is baked / heated to cure; or the first substrate can be immersed in the epoxy resin or silicon dioxide resin, and then the conductive paste is baked / heated to cure. Of course, other manufacturing processes can also be used, which are not specifically limited here.

[0177] It should be noted that the slurry body can also be selected according to the material of the foam matrix. For example, a substrate with a material similar to that of the foam matrix can be selected as the slurry body. For example, a silicone rubber conductive foam can use a resin with a silica matrix, thereby improving the bonding between the foam matrix and the conductive slurry.

[0178] For example, Figure 8 and Fig. 9 The conductive mechanism is described by taking the example that the conductive layer includes the first conductive paste layer 21, and the first conductive paste in the first conductive paste layer 21 is the first polymer conductive paste. Figure 8 A schematic diagram of a first polymer conductive paste before film formation is shown; Fig. 9 A schematic diagram of the first polymer conductive paste after film formation is shown.

[0179] like Figure 8 As shown, before the first polymer conductive paste is formed into a film, that is, before being cured, since the first conductive particles 212 are not in direct contact, the first conductive paste layer is not conductive and no conductive path is generated. Fig. 9 As shown, during the curing process, as the solvent continues to evaporate, the distance between the first conductive particles 212 becomes smaller and smaller until they directly contact each other to form a conductive path D1. This is the percolation theory of the first conductive paste. Fig. 9 The example of generating two conductive paths D1 by the first conductive paste layer is used for illustration.

[0180] It should be noted that the mass fraction of the first conductive particles in the first conductive paste should satisfy the requirement that the conductive mechanism of the first conductive paste is at least based on the percolation theory, which includes: the conductive mechanism of the first conductive paste is only based on the percolation theory; or the conductive mechanism of the first conductive paste is based on the percolation theory, and can also be supplemented by the tunnel effect theory or the field emission theory. When the mass fraction of the first conductive particles in the first conductive paste is in the range of 75-85%, the conductive mechanism of the first conductive paste can be at least based on the percolation theory.

[0181] The present application does not specifically limit the source of the above-mentioned external pressure. For example, it can be the pressure directly applied to the conductive foam by the outside world; or it can be the pressure applied to the conductive foam by the outside world from other structures in the electronic device, which in turn apply the pressure to the conductive foam; or it can be the pressure generated by other structures in the electronic device itself and applied to the conductive foam.

[0182] Select any two conductive foams of the present application, namely conductive foam 1 and conductive foam 2, and make the first surface of conductive foam 1 electrically connected to the laser engraved surface in the electronic device, and the second surface electrically connected to the copper foil in the electronic device, and the first surface of conductive foam 2 electrically connected to the laser engraved surface in the electronic device, and the second surface electrically connected to the copper foil in the electronic device, and then test the PIM values ​​and the worst knocking values ​​of conductive foam 1 and conductive foam 2 respectively, as shown in Table 2 below.

[0183] Table 2

[0184]

[0185] Provided below is a conductive foam 3 of the related technology, wherein the conductive foam 3 is a surface of a foam substrate coated with a gold-plated layer, so that the first surface of the conductive foam 3 is electrically connected to the laser-engraved surface in the electronic device to form a first contact surface, and the second surface is electrically connected to the copper foil in the electronic device. The PIM value, the worst value of tapping the workbench, and the worst value of tapping the first contact surface of the conductive foam 3 are then tested and obtained, as shown in Table 3 below.

[0186] Table 3

[0187]

[0188] It can be seen from Table 2 and Table 3 that as the external force increases, the worst values ​​of tapping at various locations of the conductive foam 1 and conductive foam 2 of the present application are very stable, and the PIM value does not change much, and the effect is good. However, when the external force is small, the worst value of tapping the first contact surface of the conductive foam 3 in the related art is unstable; and as the external force increases, the PIM value tends to be stable. However, if the pressure is too high, it may cause problems in the contact interface on the non-pressure-resistant side of the multiple contact interfaces between the conductive foam and the structure in the electronic device, such as screen film prints, battery cover film prints, etc., so excessive pressure is not recommended.

[0189] It should be noted that, in actual application, the conductive foam may also include a second adhesive layer, a release layer, and other structures. The present application does not specifically limit the type and position of the second adhesive layer. For example, the second adhesive layer may include any one of conductive glue and insulating glue. Specifically, the second adhesive layer may be any one of full conductive glue and partial insulating glue. The second adhesive layer may be provided on any surface of the foam substrate.

[0190] The present application does not specifically limit the type and position of the release layer. For example, the release layer may include release paper; the release layer may be disposed on a side of the second adhesive layer away from the conductive layer to protect the second adhesive layer. When conductive foam is used, the release layer may be removed to electrically connect the conductive layer to the structure in the electronic device through the second adhesive layer.

[0191] Only the contents related to the invention are introduced here. The rest of the structure can be obtained by referring to the relevant technology and will not be described in detail here.

[0192] The conductive foam provided in the embodiment of the present application is provided with a conductive paste layer covering at least the first surface of the foam substrate. On the one hand, the conductive paste in the conductive paste layer has certain ductility, good conductivity, and a large resistivity (10 -5 -10 -4Ω×cm), and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure. Combined with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low. For example, the working height of the conductive foam in the first direction can range from 0.1 to 0.15 mm. Specifically, the working height of the conductive foam in the first direction can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm or 0.15 mm, etc. On the other hand, the conductive paste is sintered into layers, and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; on the other hand, when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger, for example, the contact area can reach more than 43.46%.

[0193] Therefore, the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction. When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.

[0194] Combine the following Figure 3 and Figure 4 , specifically describing the case where the conductive layer is the first conductive paste layer 21 .

[0195] exist Figure 3 and Figure 4 In the present invention, the conductive layer is a first conductive paste layer 21, and a plurality of first conductive particles 212 in the first conductive paste layer 21 are doped in the first paste body 211. The plurality of first conductive particles 212 are not connected before curing, but are connected after curing, thereby generating a plurality of current paths in the first conductive paste layer 21 formed after curing, thereby conducting electricity, and after curing, the first conductive particles 212 are reduced in volume to ensure contact between adjacent particles, so that the PIM inside the first conductive paste is effectively reduced; at the same time, after curing, the first conductive particles 212 are spread out, which can increase the contact area between the first conductive paste layer 21 and the structure in the electronic device.

[0196] The present application does not specifically limit the conductive paste in the first conductive paste layer. For example, the conductive paste may include polymer conductive paste, sintered conductive paste, etc. The following embodiments of the present application are described by taking the conductive paste in the first conductive paste layer as polymer conductive paste.

[0197] The present application does not specifically limit the first slurry body. For example, the first slurry body may include a first resin. Specifically, the first resin may be an epoxy resin, a silicon dioxide resin, etc. Among them, epoxy resin and silicon dioxide resin both have the characteristics of low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation.

[0198] The present application does not specifically limit the type, shape, size, etc. of the first conductive particles. Exemplarily, the first conductive particles may include first metal conductive particles. Specifically, the first metal conductive particles may be any one or more combinations of silver particles, copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the first metal conductive particles may include any one of spherical, thorny, flake, rod, wire, etc.; the size of the first metal conductive particles may be micron-level, nanometer-level, etc., specifically, the particle size range of the first metal conductive particles may include 5-20μm, that is, the particle size of the first metal conductive particles may be 5μm, 8μm, 10μm, 13μm, 17μm or 20μm, etc.

[0199] It should be noted that the elastic modulus of the above-mentioned first conductive particles is different. When the first slurry body is the same first resin, when the first conductive particles with a smaller elastic modulus are selected and doped into the first resin, the first conductive slurry can be slightly deformed under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

[0200] The present application does not specifically limit the doping concentration of the first conductive particles in the first conductive paste in the first paste body. For example, the mass fraction of the first conductive particles in the first paste body may range from 75% to 85%.

[0201] Specifically, the mass fraction of the first conductive particles in the first slurry body may be 75%, 78%, 80%, 81%, 83% or 85%, etc.

[0202] As an example, the first conductive paste is a first conductive silver paste, the first conductive silver paste includes a first resin and first silver particles, and the first silver particles are doped in the first resin. Among them, the mass fraction of the first silver particles can be 80%, the mass fraction of the first resin can be 20%, and the first resin can be compressed or stretched; the density of the first silver particles can be 10, and the density of the first resin can be 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the first silver particles to the volume fraction of the first resin can be 2:5, and after the first conductive silver paste is cured, the volume can shrink by about 50%, effectively reducing the PIM between the first silver particles, which can even be negligible, and the ratio of the volume fraction of the first silver particles in the first conductive silver paste layer to the volume fraction of the first resin can be 1:1.25, and when in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after being activated at low pressure, further increasing the contact area; the tensile adhesion value range of the first conductive silver paste can include 8-9Mpa, specifically, the tensile adhesion of the first conductive silver paste can be 8Mpa or 9Mpa, etc.

[0203] It should be noted that the silver particles can be micron-sized spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-sized silver wires, silver rods, etc., depending on the actual application.

[0204] The present application does not specifically limit the thickness of the above-mentioned first conductive paste layer along the direction perpendicular to the foam substrate. Exemplarily, the thickness range of the first conductive paste layer along the direction perpendicular to the foam substrate may include 5-10μm. Specifically, the thickness of the first conductive paste layer along the direction perpendicular to the foam substrate may be 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, etc.

[0205] The present application does not specifically limit the manufacturing process of the above-mentioned first conductive paste layer. For example, the first conductive paste can be formed on the surface of the foam substrate by printing or other methods, and then the first conductive paste is cured by baking / heating or other curing methods to form the first conductive paste layer.

[0206] The conductive foam provided in the embodiment of the present application is provided with a first conductive paste layer covering at least the first surface of the foam substrate. On the one hand, the first conductive paste in the first conductive paste layer has the properties of low viscosity, easy leveling, large volume change rate after curing, easy curing, large internal stress, good heat dissipation, etc., and the first conductive paste is in liquid state before film formation, and its volume will shrink during curing, so that the conductive foam exhibits good conductivity and can also be deformed under pressure. Combined with the elasticity of the foam substrate, the conductive foam can have a lower working height in the first direction; on the other hand, the first conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple first conductive particles, so that the PIM inside the first conductive paste is very small; on the other hand, when the first conductive paste is cured into the first conductive paste layer, the conductive particles in the first conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0207] Therefore, the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction. When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.

[0208] Combine the following Figure 5 and Figure 6 , specifically describing the case where the conductive layer is the second conductive paste layer 22 .

[0209] exist Figures 5 and 6 , Fig.19 In the present invention, the conductive layer is a second conductive paste layer 22, and a plurality of second conductive particles 222 in the second conductive paste layer 22 are doped in a second paste body 221. The plurality of second conductive particles 222 are not connected before curing, but are connected after curing, thereby generating a plurality of current paths in the second conductive paste layer 22 formed after curing, thereby conducting electricity. After curing, the second conductive particles 222 are reduced in volume to ensure contact between adjacent particles, thereby effectively reducing the PIM inside the second conductive paste. At the same time, after curing, the second conductive particles 222 are spread out, which can increase the contact area between the second conductive paste layer 22 and the structure in the electronic device.

[0210] The present application does not specifically limit the conductive paste in the second conductive paste layer. For example, the conductive paste may include polymer conductive paste, sintered conductive paste, etc. The following embodiments of the present application are described by taking the conductive paste in the second conductive paste layer as polymer conductive paste.

[0211] The present application does not specifically limit the second slurry body. For example, the second slurry body may include a second resin. Specifically, the second resin may be any one of a silicone resin, a silane-modified resin, etc. Among them, silicone resins and silane-modified resins have the characteristics of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing (for example, less than 10%), high temperature resistance, and no internal stress.

[0212] The present application does not specifically limit the type, shape, size, etc. of the second conductive particles. Exemplarily, the second conductive particles may include second metal conductive particles. Specifically, the second metal conductive particles may be any one or more combinations of silver particles, copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the second metal conductive particles may include any one of spherical, thorny, flake, rod, wire, etc.; the size of the second metal conductive particles may be micron-level, nanometer-level, etc., specifically, the particle size range of the second metal conductive particles may include 5-20μm, that is, the particle size of the second metal conductive particles may be 5μm, 8μm, 10μm, 13μm, 17μm or 20μm, etc.

[0213] It should be noted that the elastic modulus of the above-mentioned second conductive particles is different. When the second paste body is the same second resin, when the second conductive particles with a smaller elastic modulus are selected and doped into the second resin, the second conductive paste can be slightly deformed under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.

[0214] The present application does not specifically limit the doping concentration of the second conductive particles in the second conductive paste. For example, the mass fraction of the second conductive particles in the second conductive paste may range from 75% to 85%.

[0215] Specifically, the mass fraction of the second conductive particles in the second slurry body may be 75%, 78%, 80%, 81%, 83% or 85%, etc.

[0216] As an example, the second conductive paste is a second conductive silver paste, the second conductive silver paste includes a second resin and second silver particles, and the second silver particles are doped in the second resin. Among them, the mass fraction of the second silver particles can be 80%, the mass fraction of the second resin can be 20%, and the second resin can be compressed or stretched; the density of the second silver particles can be 10, and the density of the second resin can be 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the second silver particles to the volume fraction of the second resin can be 2:5, and the volume of the second conductive silver paste can shrink by about 50% after curing, which effectively reduces the PIM between the second silver particles and can even be ignored. In addition, the ratio of the volume fraction of the second silver particles in the second conductive silver paste layer to the volume fraction of the second resin can be 1:1.25, and when in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after being activated at low pressure, further increasing the contact area; the tensile adhesion value range of the second conductive silver paste can include 8-9Mpa, specifically, the tensile adhesion of the second conductive silver paste can be 8Mpa or 9Mpa, etc.

[0217] It should be noted that the silver particles can be micron-sized spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-sized silver wires, silver rods, etc., depending on the actual application.

[0218] The present application does not specifically limit the thickness of the second conductive paste layer along the direction perpendicular to the foam substrate. Exemplarily, the thickness range of the second conductive paste layer along the direction perpendicular to the foam substrate may include 5-10μm. Specifically, the thickness of the second conductive paste layer along the direction perpendicular to the foam substrate may be 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, etc.

[0219] The present application does not specifically limit the manufacturing process of the second conductive paste layer. For example, the second conductive paste can be first formed on the surface of the foam substrate by spraying or other methods, and then the second conductive paste is cured by baking / heating or other curing methods to form the second conductive paste layer.

[0220] The conductive foam provided in the embodiment of the present application is provided with a second conductive paste layer covering at least the first surface of the foam substrate. On the one hand, the second conductive paste in the second conductive paste layer has the properties of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing, high temperature resistance, and no internal stress. The second conductive paste is in liquid state before film formation, and its volume will shrink during curing, so that the conductive foam exhibits good conductivity while being able to deform under pressure. Combined with the elasticity of the foam substrate, the conductive foam can have a lower working height in the first direction; on the other hand, the second conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple second conductive particles, so that the PIM inside the second conductive paste is very small; on the other hand, when the second conductive paste is cured into the second conductive paste layer, the conductive particles in the second conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0221] Therefore, the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction. When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.

[0222] Optionally, as an implementable approach, refer to Figures 9 to 11 , Figures 13 to 18 As shown, the conductive layer further includes a first substrate layer 6, which is used to deform under external pressure; the orthographic projection of the conductive paste layer on the foam substrate 1 at least partially overlaps with the orthographic projection of the first substrate layer 6 on the foam substrate.

[0223] The present application does not specifically limit the type of the first substrate layer. For example, the first substrate layer may include a polyimide (PI) layer, a non-woven fabric, and the like.

[0224] It should be noted that the first substrate layer should be able to be well compressed or stretched, have a moderate surface roughness, have no scratches or only very few scratches on the surface, and be suitable for spraying and printing of conductive paste.

[0225] The present application does not specifically limit the thickness of the above-mentioned first substrate layer along the direction perpendicular to the foam substrate. Exemplarily, the thickness range of the first substrate layer along the direction perpendicular to the foam substrate may include 1-2μm. Specifically, the thickness of the first substrate layer along the direction perpendicular to the foam substrate may be 1μm, 1.2μm, 1.5μm, 1.7μm, 1.8μm or 2μm, etc.

[0226] It should be understood that the at least partial overlap between the orthographic projection of the conductive paste layer on the foam substrate and the orthographic projection of the first substrate layer on the foam substrate means that: the orthographic projection of the conductive paste layer on the foam substrate and the orthographic projection of the first substrate layer on the foam substrate partially overlap; or, the orthographic projection of the conductive paste layer on the foam substrate and the orthographic projection of the first substrate layer on the foam substrate completely overlap, which is not specifically limited here.

[0227] When the orthographic projection of the conductive paste layer on the foam substrate partially overlaps with the orthographic projection of the first substrate layer on the foam substrate, the orthographic projection of the conductive paste layer on the foam substrate may be located within the orthographic projection of the first substrate layer on the foam substrate; or, the orthographic projection of the first substrate layer on the foam substrate may be located within the orthographic projection of the conductive paste layer on the foam substrate.

[0228] The structure of the conductive paste layer is not specifically limited here. For example, the conductive paste layer may be a single layer, for example, the conductive paste layer may be a first conductive paste layer / a second conductive paste layer; or, the conductive paste layer may be a multilayer, for example, the conductive paste layer may include a first conductive paste layer and a second conductive paste layer.

[0229] The present application does not specifically limit the thickness of a single-layer conductive paste layer along a direction perpendicular to the foam substrate. By way of example, the thickness of a single-layer conductive paste layer along a direction perpendicular to the foam substrate may range from 5 to 10 μm. Specifically, the thickness of a single-layer conductive paste layer along a direction perpendicular to the foam substrate may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, etc.

[0230] The present application does not specifically limit the relationship between the conductive paste layer and the first substrate layer. For example, the conductive paste layer and the first substrate layer can be independent film layers. As an example, the conductive paste layer can be disposed on any side of the first substrate layer; as another example, the conductive paste layer can at least wrap the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate.

[0231] Alternatively, illustratively, the conductive paste layer and the first substrate layer are not independent film layers. As an example, the conductive paste layer can penetrate into the first substrate layer in addition to at least wrapping the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate. Fig.13 As shown, when the first substrate layer is a non-woven fabric, since the non-woven fabric has no warp and weft, but only directs or randomly arranges textile staple fibers or filaments to form a fiber mesh structure, the non-woven fabric is immersed in a conductive slurry. The conductive slurry can at least wrap the two surfaces of the non-woven fabric and penetrate into the pores of the non-woven fabric to form a conductive layer.

[0232] The conductive foam provided in the embodiment of the present application is provided with a first substrate layer and a conductive paste layer. On the one hand, the first substrate layer is elastic and can be well compressed or stretched; on the other hand, the conductive paste has certain ductility, good conductivity, large resistivity and other properties, and the volume of the conductive paste will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure. Combined with the elasticity of the foam matrix, the working height of the conductive foam in the first direction can be relatively low; at the same time, the conductive paste is sintered into layers and the volume is reduced, which can make the PIM inside the conductive paste very small; and when the conductive paste is cured into a conductive paste layer, it is spread out, which can make the contact area between the conductive foam and the structure in the electronic device larger.

[0233] Therefore, the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction. When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.

[0234] Alternatively, as an implementable approach, Figures 9 to 11 As shown, the conductive paste layer is a first conductive paste layer 21, and the first conductive paste layer 21 is arranged on the side of the first substrate layer 6 away from the foam matrix 1; the conductive layer also includes a first bonding layer, and the first bonding layer is arranged between the first substrate layer 6 and the foam matrix 1, and the first bonding layer is used to bond the first substrate layer 6 and the foam matrix 1, and deforms under the action of external pressure.

[0235] The present application does not specifically limit the type of the first bonding layer. For example, the first bonding layer may be a glue layer, a conductive paste layer, or the like.

[0236] like Fig. 9 and Fig.10 As shown, when the first bonding layer is a glue layer 5, the material of the glue layer 5 can be a thermosetting glue.

[0237] like Fig.11 As shown, when the first bonding layer is a conductive paste layer, the conductive paste layer may be the second conductive paste layer 22 .

[0238] The present application does not specifically limit the thickness of the first adhesive layer along the direction perpendicular to the foam substrate. By way of example, the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may range from 1 to 2 μm. Specifically, the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm or 2 μm, etc.

[0239] It should be noted that when the first bonding layer is the second conductive paste layer, along the direction perpendicular to the foam matrix, the present application does not specifically limit the thickness range of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer. Exemplarily, the thickness range may include 10-20μm. Specifically, the thickness of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer may be 10μm, 13μm, 15μm, 16μm, 18μm or 20μm, etc.

[0240] It should be noted that when the conductive layer covers multiple surfaces of the foam substrate, Figures 9 to 11 For any type of conductive foam, the thickness of the conductive layer covering different surfaces of the foam substrate may be partially the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be all the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be different, and no specific limitation is made here.

[0241] The conductive foam provided in the embodiment of the present application can bond the first conductive paste layer to the foam substrate well through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, and the thickness of the first adhesive layer along the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer along the direction perpendicular to the foam substrate can be small, so that the working height of the conductive foam in the first direction can be low; and the first adhesive layer will not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, so that a conductive foam with low working height, small PIM and low stress in the first direction can be obtained. When the conductive foam is applied to electronic equipment, the thickness of the electronic equipment can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic equipment can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structure in the electronic equipment, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic equipment.

[0242] Alternatively, as an implementable approach, Figures 13 to 18 As shown, the conductive paste layer is a first conductive paste layer 21, and the first conductive paste layer 21 at least wraps the surface of the first substrate layer 6 close to the foam matrix 1, and wraps the surface of the first substrate layer 6 away from the foam matrix 1; the conductive layer also includes a first bonding layer, and the first bonding layer is arranged between the first conductive paste layer 21 and the foam matrix 1. The first bonding layer is used to bond the first conductive paste layer 21 and the foam matrix 1, and deforms under the action of external pressure.

[0243] It should be understood that the above-mentioned first conductive paste layer at least wraps the surface of the first substrate layer close to the foam substrate side and wraps the surface of the first substrate layer away from the foam substrate side, which means: the first conductive paste layer can only wrap the surface of the first substrate layer close to the foam substrate side and wrap the surface of the first substrate layer away from the foam substrate side; or, in addition to wrapping the surface of the first substrate layer close to the foam substrate side and wrapping the surface of the first substrate layer away from the foam substrate, the first conductive paste layer can also include other surfaces of the first substrate layer; or, in addition to wrapping the surface of the first substrate layer close to the foam substrate side and wrapping the surface of the first substrate layer away from the foam substrate side, the first conductive paste layer can also penetrate into the interior of the first substrate layer, which is not specifically limited here.

[0244] As an example, when the first substrate layer is a PI layer, the first conductive paste layer may wrap a surface of the PI layer close to the foam substrate, and a surface of the first substrate layer away from the foam substrate.

[0245] As another example, when the first substrate layer is a PI layer, the first conductive paste layer may wrap the entire surface of the PI layer.

[0246] As another example, when the first substrate layer is a non-woven fabric, the first conductive paste layer may wrap a surface of the non-woven fabric close to the foam matrix and a surface of the first substrate layer away from the foam matrix.

[0247] As another example, when the first substrate layer is a non-woven fabric, the first conductive paste layer may wrap the entire surface of the non-woven fabric.

[0248] As another example, when the first substrate layer is a non-woven fabric, the first conductive paste layer can wrap all surfaces of the non-woven fabric and penetrate into the pores inside the non-woven fabric. At this time, since the non-woven fabric is filled with the first conductive paste, the non-woven fabric is not easily torn when compressed or stretched.

[0249] It should be noted that the orthographic projection of the above-mentioned first substrate layer on the foam substrate may partially overlap with the orthographic projection of the first conductive paste layer on the foam substrate; or, the orthographic projection of the first substrate layer on the foam substrate may completely overlap with the orthographic projection of the first conductive paste layer on the foam substrate, which is not specifically limited here.

[0250] The present application does not specifically limit the type of the first bonding layer. For example, the first bonding layer may be a glue layer, a conductive paste layer, or the like.

[0251] like Fig.13 and Fig.14 , Fig.17 and Fig.18 As shown, when the first bonding layer is a glue layer 5, the material of the glue layer 5 can be a thermosetting glue.

[0252] like Fig.15 and Fig.16 As shown, when the first bonding layer is a conductive paste layer, the conductive paste layer may be the second conductive paste layer 22 .

[0253] The present application does not specifically limit the thickness of the first adhesive layer along the direction perpendicular to the foam substrate. By way of example, the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may range from 1 to 2 μm. Specifically, the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm or 2 μm, etc.

[0254] It should be noted that when the first bonding layer is the second conductive paste layer, along the direction perpendicular to the foam matrix, the present application does not specifically limit the thickness range of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer. Exemplarily, the thickness range may include 10-20μm. Specifically, the thickness of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer may be 10μm, 13μm, 15μm, 16μm, 18μm or 20μm, etc.

[0255] As an example, Fig.13 and Fig.14 In the embodiment, the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and forms a conductive layer with the adhesive layer 5 . The conductive layer is arranged on part of the first surface 11 , part of the second surface 12 and the entire third surface 13 of the foam substrate 1 .

[0256] As another example, Fig.15 As shown, the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and forms a conductive layer with the second conductive paste layer 22 . The conductive layer is arranged on the entire first surface 11 , part of the second surface 12 and the entire third surface 13 of the foam matrix 1 .

[0257] As another example, Fig.16 As shown, the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and is arranged on the entire first surface 11, part of the second surface 12 and the entire third surface 13 of the foam matrix 1. At the same time, the second conductive paste layer 22 is arranged on the entire first surface 11 and part of the second surface 12 of the foam matrix 1 to form a conductive layer.

[0258] It should be noted that, first, the conductive paste layer can also include a first conductive paste layer and a second conductive paste layer, wherein the first conductive paste layer at least wraps the surface of the first substrate layer close to the foam matrix side, and wraps the surface of the first substrate layer away from the foam matrix side, and the second conductive paste layer at least wraps the surface of the first conductive paste layer close to the foam matrix side, and wraps the surface of the first conductive paste layer away from the foam matrix side, and is used to bond the first conductive paste layer and the foam matrix.

[0259] As an example, the first conductive paste layer wraps the surface of the first substrate layer close to the foam matrix and the surface of the first substrate layer away from the foam matrix, and the second conductive paste layer wraps the surface of the first conductive paste layer close to the foam matrix and the surface of the first conductive paste layer away from the foam matrix.

[0260] As another example, the first conductive paste layer wraps the surface of the first substrate layer close to the foam matrix and the surface of the first substrate layer away from the foam matrix, and the second conductive paste layer wraps all surfaces of the first conductive paste layer.

[0261] As another example, the first conductive paste layer wraps all surfaces of the first base material layer, and the second conductive paste layer wraps the surface of the first conductive paste layer close to the foam matrix and the surface of the first conductive paste layer away from the foam matrix.

[0262] As another example, the first conductive paste layer covers all surfaces of the first substrate layer, and the second conductive paste layer covers all surfaces of the first conductive paste layer, which is not specifically limited here.

[0263] Second, the conductive paste layer can also be a second conductive paste layer, wherein the second conductive paste layer at least wraps the surface of the first substrate layer close to the foam matrix and the surface of the first substrate layer away from the foam matrix, and the second conductive paste layer is used to bond with the foam matrix.

[0264] As an example, the second conductive paste layer wraps the surface of the first substrate layer close to the foam matrix, and wraps the surface of the first substrate layer away from the foam matrix.

[0265] As another example, the second conductive paste layer covers all surfaces of the first substrate layer, which is not specifically limited here.

[0266] Third, when the conductive layer covers multiple surfaces of the foam substrate, Figures 13 to 18 For any type of conductive foam, the thickness of the conductive layer covering different surfaces of the foam substrate may be partially the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be all the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be different, and no specific limitation is made here.

[0267] The conductive foam provided in the embodiment of the present application wraps at least the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate with the first conductive paste layer, and the first conductive paste layer can be well bonded to the foam substrate through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, and the thickness of the first adhesive layer along the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer along the direction perpendicular to the foam substrate can be small, so that the working height of the conductive foam in the first direction can be low; and the first adhesive layer will not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, so that a conductive foam with a low working height, small PIM and low stress in the first direction can be obtained. When the conductive foam is applied to electronic equipment, the thickness of the electronic equipment can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic equipment can be small; in addition, the conductive foam can be used to realize the electrical connection of the structure in the electronic equipment, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic equipment.

[0268] Alternatively, as an implementable approach, Fig.17 and Fig.18 As shown, the first surface 11 of the foam matrix 1 is divided into at least a first area Q1 and a second area Q2. Along the direction perpendicular to the foam matrix 1, the height of the conductive layer located in the first area Q1 is less than the height of the conductive layer located in the second area Q2.

[0269] It should be understood that the first surface of the above-mentioned foam matrix is ​​divided into at least a first area and a second area, which means that: the first surface of the foam matrix can be divided into only the first area and the second area; or, in addition to being divided into the first area and the second area, the first surface of the foam matrix can also be divided into other areas, for example, a third area, a fourth area, etc., which is not specifically limited here.

[0270] The present application does not make any specific limitation on the position, area relationship, etc. of the first area and the second area. For example, the first area and the second area can be located at any position, wherein the area of ​​the first area can be larger than the area of ​​the second area; or, the area of ​​the first area can be smaller than the area of ​​the second area; or, the area of ​​the first area can be equal to the area of ​​the second area.

[0271] The following specifically describes how to achieve that the height of the portion of the conductive layer located in the first region is smaller than the height of the portion of the conductive layer located in the second region.

[0272] The first one may be that the structure of the portion of the conductive layer located in the first region is the same as that of the portion located in the second region, but the heights are different.

[0273] It should be understood that when the conductive layer is a single layer, exemplarily, when the conductive layer is a conductive paste layer, for example, when the conductive layer is a first conductive paste layer, along the direction perpendicular to the foam matrix, the height of the portion of the first conductive paste layer located in the first area is less than the height of the portion of the first conductive paste layer located in the second area; for another example, when the conductive layer is a second conductive paste layer, along the direction perpendicular to the foam matrix, the height of the portion of the second conductive paste layer located in the first area is less than the height of the portion of the second conductive paste layer located in the second area.

[0274] It should be understood that when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, at least one layer of the conductive layer may have different heights in the first area and in the second area.

[0275] Exemplarily, in the case where the conductive layer includes a first bonding layer, a first substrate layer and a first conductive paste layer, along a direction perpendicular to the foam substrate, at least one of the first bonding layer, the first substrate layer and the first conductive paste layer may have different heights in the first region and in the second region. Specifically, along a direction perpendicular to the foam substrate, the first bonding layer may have different heights in the first region and in the second region, and the first substrate layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first conductive paste layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; or, the first bonding layer and the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; or The height of the first region may be different from that of the second region, and the height of the first conductive paste layer may be the same as that of the second region; or, the height of the first bonding layer and the first conductive paste layer may be different from that of the second region, and the height of the first substrate layer may be the same as that of the first region; or, the height of the first substrate layer and the first conductive paste layer may be different from that of the first region, and the height of the first bonding layer may be the same as that of the second region; or, the height of the first bonding layer, the first substrate layer, and the first conductive paste layer may be different from that of the first region.

[0276] Of course, the conductive layer may also include other film layers, so there may be other various configurations, which are not specifically limited here.

[0277] As an example, in Fig.17In the embodiment, the conductive layer located in the first region Q1 and the second region Q2 includes a glue layer 5, a first substrate layer 6 and a first conductive paste layer 21. Fig.17 As shown, along the direction perpendicular to the foam matrix 1, the height of the adhesive layer 5 and the first base material layer 6 in the first region Q1 is the same as that in the second region Q2, and the height of the first conductive paste layer 21 in the first region Q1 is less than that in the second region Q2.

[0278] The second type may be that the structure of the portion of the conductive layer located in the first region is different from the structure of the portion of the conductive layer located in the second region, and the heights are different.

[0279] It should be understood that when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, the same layer structure in the conductive layer may have different heights in the first area and in the second area.

[0280] Exemplarily, when the conductive layer in the first region includes a first bonding layer, a first substrate layer and a first conductive paste layer, and the conductive layer in the second region includes a first bonding layer, a first substrate layer, a first conductive paste layer and a second substrate layer, along a direction perpendicular to the foam substrate, at least one of the first bonding layer, the first substrate layer and the first conductive paste layer may have different heights in the first region and in the second region. Specifically, along a direction perpendicular to the foam substrate, the first bonding layer may have different heights in the first region and in the second region, and the first substrate layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first conductive paste layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; or, the first bonding layer and the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; or The height of the first region may be different from that of the second region, and the height of the first conductive paste layer may be the same as that of the second region; or, the height of the first bonding layer and the first conductive paste layer may be different from that of the second region, and the height of the first substrate layer may be the same as that of the first region; or, the height of the first substrate layer and the first conductive paste layer may be different from that of the first region, and the height of the first bonding layer may be the same as that of the second region; or, the height of the first bonding layer, the first substrate layer, and the first conductive paste layer may be different from that of the first region.

[0281] Of course, the conductive layer may also include other film layers, so there may be other various configurations, which are not specifically limited here.

[0282] It should be understood that when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, the same layer structure in the conductive layer may have the same height in the first area and in the second area.

[0283] Exemplarily, when the conductive layer in the first region includes a first bonding layer, a first substrate layer and a first conductive paste layer, and the conductive layer in the second region includes a first bonding layer, a first substrate layer, a first conductive paste layer and a second substrate layer, along a direction perpendicular to the foam matrix, the height of the first bonding layer, the first substrate layer and the first conductive paste layer in the first region may be the same as that in the second region.

[0284] Of course, the conductive layer may also include other film layers, so there may be other various configurations, which are not specifically limited here.

[0285] As an example, in Fig.18 In the embodiment, the conductive layer located in the first region Q1 includes the adhesive layer 5, the first substrate layer 6 and the first conductive paste layer 21, and the conductive layer located in the second region Q2 includes the adhesive layer 5, the first substrate layer 6, the first conductive paste layer 21 and the second substrate layer 9. Fig.18 As shown, along the direction perpendicular to the foam matrix 1, the heights of the adhesive layer 5, the first substrate layer 6, and the first conductive paste layer 21 located in the first area Q1 and the second area Q2 are the same. Thus, the second substrate layer 9 makes the height of the portion of the conductive layer located in the first area Q1 smaller than the height of the portion of the conductive layer located in the second area Q2.

[0286] The present application does not specifically limit the type of the second substrate layer. For example, the second substrate layer may include a polyimide layer, a non-woven fabric, and the like.

[0287] It should be noted that the second substrate layer should be able to be well compressed or stretched, the surface roughness of the second substrate layer should be moderate, and there should be no scratches or only very few scratches on the surface.

[0288] The present application does not specifically limit the thickness of the second substrate layer along the direction perpendicular to the foam substrate. By way of example, the thickness of the second substrate layer along the direction perpendicular to the foam substrate may range from 1 to 2 μm. Specifically, the thickness of the second substrate layer along the direction perpendicular to the foam substrate may be 1 μm, 1.2 μm, 1.5 μm, 1.7 μm, 1.8 μm or 2 μm, etc.

[0289] It should be noted that, first, the above-mentioned second substrate layer can also be replaced by any other structure, for example, a second substrate layer and at least a surface wrapping the second substrate layer close to the foam substrate side, and a first conductive paste layer wrapping the surface of the second substrate layer away from the foam substrate side, etc., which is not specifically limited here.

[0290] Second, along the direction perpendicular to the foam matrix, if the height of the conductive paste layer in the first area is set to be smaller than the height of the conductive paste layer in the second area to achieve that the height of the conductive layer in the first area is smaller than the height of the conductive layer in the second area, since the conductive paste layer can only be sprayed / printed at a relatively thin height, it is suitable for achieving a situation where the height difference between the height of the conductive layer in the first area and the height of the conductive layer in the second area is small. Exemplarily, the range of the value of the height difference between the height of the conductive layer in the first area and the height of the conductive layer in the second area may include 28-32μm, specifically, the height difference between the height of the conductive layer in the first area and the height of the conductive layer in the second area may be 28μm, 29μm, 30μm, 31μm or 32μm, etc.

[0291] If a large step difference is to be achieved between the height of the conductive layer in the first area and the height of the conductive layer in the second area, the height of any layer in the conductive layer in the first area can be set to be different from the height in the second area; or, other film layer structures can be set in the second area, etc., which is not specifically limited here.

[0292] The conductive foam provided in the embodiment of the present application is arranged in a direction perpendicular to the foam substrate, by setting the height of the conductive layer in the first area to be different from the height of the conductive layer in the second area. When used in electronic devices, the conductive foam can be electrically connected to at least two structures with different heights, thereby enriching the application of the conductive foam in electronic devices.

[0293] Alternatively, as an implementable approach, Figures 3 to 6 ,like Figures 9 to 11 , Figures 12 to 19 As shown, the foam substrate 1 is in the shape of a polyhedron, which at least includes a first surface 11 , a second surface 12 and a third surface 13 connected to each other; the conductive layer at least covers the first surface 11 , the second surface 12 and the third surface 13 .

[0294] It should be understood that among all the surfaces of the above-mentioned polyhedron, at least one surface is used to be electrically connected to a structure in an electronic device through a conductive layer.

[0295] Exemplarily, the first surface of the polyhedron may be used to electrically connect to a first structure in the electronic device through a conductive layer, while other surfaces are not used to electrically connect to the structure in the electronic device through the conductive layer; or, the first surface of the polyhedron may be used to electrically connect to the first structure in the electronic device through a conductive layer, and the second surface may be used to electrically connect to the second structure in the electronic device through a conductive layer, while other surfaces are not used to electrically connect to the structure in the electronic device through a conductive layer. Of course, other methods are also possible and are not specifically limited here.

[0296] The present application does not specifically limit the above-mentioned polyhedron. For example, the polyhedron may include a regular polyhedron or an irregular polyhedron. When the shape of the foam matrix is ​​a regular polyhedron, the regular polyhedron may include a cube, a hexahedron, an octahedron, and the like.

[0297] It should be understood that the above-mentioned polyhedron includes at least a connected first surface, a second surface and a third surface, which means that the polyhedron may only include a connected first surface, a second surface and a third surface; or, in addition to the connected first surface, the second surface and the third surface, the polyhedron may also include a fourth surface, a fifth surface, a sixth surface, etc., which is not specifically limited here.

[0298] It should be understood that the above-mentioned conductive layer at least covers the first surface, the second surface and the third surface, which means that the conductive layer can only cover the first surface, the second surface and the third surface; or, in addition to covering the first surface, the second surface and the third surface, the conductive layer can also cover the fourth surface, the fifth surface, the sixth surface, etc., and no specific limitation is made here.

[0299] The following is a specific example of a case where the conductive layer covers the foam substrate, assuming that the shape of the foam substrate is a hexahedron:

[0300] As an example, in Figures 3 to 6 ,like Figures 9 to 11 In the figure, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not marked in the figure, front surface) and a sixth surface (not marked in the figure, rear surface). Figures 3 to 6 ,like Figures 9 to 11 As shown, the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface).

[0301] As another example, in Figures 13 to 18In the figure, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not marked in the figure, front surface) and a sixth surface (not marked in the figure, rear surface). Figures 13 to 18 As shown, the conductive layer covers at least a portion of the first surface 11 (upper surface), a portion of the second surface 12 (lower surface) and the entire third surface 13 (left surface).

[0302] As another example, in Fig.19 In the figure, the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not marked in the figure, front surface) and a sixth surface (not marked in the figure, rear surface). Fig.19 As shown, the conductive layer covers the entire first surface 11 (upper surface), a portion of the second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface).

[0303] It should be noted that, when the shape of the foam substrate is a hexahedron, the positions of the first surface, the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface are not specifically limited. For example, they can be as follows: Figures 3 to 6 ,like Figures 9 to 11 , Figures 13 to 19 As shown, the first surface 11 is the upper surface, the second surface 12 is the lower surface, the third surface 13 is the left surface, the fourth surface 14 is the right surface, the fifth surface is the front surface, and the sixth surface is the rear surface; or, the first surface may be the upper surface, the second surface may be the left surface, the third surface may be the right surface, the fourth surface may be the lower surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. Of course, other situations are also possible, which shall be subject to actual application.

[0304] The conductive foam provided in the embodiment of the present application comprises a foam matrix comprising at least a first surface, a second surface and a third surface which are connected to each other, and a conductive layer at least covers the first surface, the second surface and the third surface of the foam matrix. In this way, in practical applications, it can be ensured that when the conductive foam is electrically connected to a structure in an electronic device, the conductive layer in the conductive foam is conductive, and a variety of conductive foams with low working height, small PIM and low stress in the first direction can be provided, thereby enriching the application of conductive foam in electronic devices.

[0305] Alternatively, as an implementable approach, Figures 13 to 18As shown, the polyhedron includes a first surface 11, a second surface 12 and a third surface 13. The first surface 11 is arranged opposite to the second surface 12, and the first surface 11 is connected to the second surface 12 through the third surface 13; the conductive layer covers at least part of the first surface 11, at least part of the second surface 12 and the entire third surface 13 of the polyhedron.

[0306] It should be understood that the above-mentioned conductive layer covers at least the first surface, at least part of the second surface and the entire third surface of the polyhedron means: the conductive layer can cover part of the first surface, part of the second surface and the entire third surface of the polyhedron; or, the conductive layer can cover part of the first surface, all of the second surface and all of the third surface of the polyhedron; or, the conductive layer can cover the entire first surface, part of the second surface and part of the third surface of the polyhedron; or, the conductive layer can cover the entire first surface, all of the second surface and all of the third surface of the polyhedron, and no specific limitation is made here.

[0307] As an example, Fig.13 As shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 covers part of the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-type conductive layer.

[0308] It should be noted that in Fig.13 In the embodiment, the conductive foam 05 further includes a second adhesive layer 7 , which can be disposed on at least a portion of the second surface 12 of the foam matrix 1 and connected to both the adhesive layer 5 and the first conductive paste layer 21 .

[0309] Of course, the second adhesive layer can also be arranged on at least part of the second surface of the foam substrate, and spaced apart from the first adhesive layer and the first conductive paste layer, which is not specifically limited here. The second adhesive layer can make the conductive foam bonded to the structure in the electronic device, and the type of the second adhesive layer is not specifically limited here. For example, the second adhesive layer can include a backing adhesive, which can include any one of a conductive adhesive and an insulating adhesive.

[0310] As another example, Fig.14 As shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 covers part of the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-type conductive layer.

[0311] It should be noted that in Fig.14 In the embodiment, the conductive foam 05 may further include a second adhesive layer 7 and a different-color polyethylene terephthalate (PET) layer 8.

[0312] like Fig.14 As shown, the second bonding layer 7 can be disposed on at least part of the second surface 12 of the foam substrate 11, and connected to the adhesive layer 5 and the first conductive paste layer 21. Of course, the second bonding layer can also be disposed on at least part of the second surface of the foam substrate, and spaced from the first bonding layer and the first conductive paste layer, which is not specifically limited here.

[0313] like Fig.14 As shown, the different-color PET layer 8 is disposed on part of the first surface 11 (upper surface) of the foam substrate 1, and is connected to the adhesive layer 5 and the first conductive paste layer 21. Of course, the different-color PET layer can also be disposed on at least part of the first surface of the foam substrate, and is spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.

[0314] It should be noted that the above-mentioned different-color PET layer can have color. In this way, on the one hand, it can be clearly marked that the side of the conductive foam with the different-color PET layer is electrically connected to the structure in the electronic device, which is more conducive to fool-proofing; on the other hand, if there is a step difference between the structure in the electronic device and the conductive foam, the step difference can also be filled by the different-color PET layer.

[0315] As another example, Fig.15 As shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the second conductive paste layer 22 covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-type conductive layer.

[0316] It should be noted that, first, Fig.15 In the embodiment, the conductive foam 05 may further include a second adhesive layer 7, which is disposed on at least a portion of the second surface 12 of the foam substrate 1 and is connected to both the second conductive paste layer 22 and the first conductive paste layer 21. Of course, the second adhesive layer may also be disposed on at least a portion of the second surface of the foam substrate and spaced from both the second conductive paste layer and the first conductive paste layer, which is not specifically limited here.

[0317] Second, the conductive layer composed of the first conductive paste layer, the first base material layer and the second conductive paste layer can also only cover part of the first surface of the foam matrix. At this time, the part of the first surface of the foam matrix not provided with the conductive layer may not be provided with any structure, or may be provided with structures such as a different-color PET layer, etc., which is not specifically limited here.

[0318] As another example, Fig.16As shown, the first conductive paste layer 21 and the first substrate layer 6 cover the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, and the second conductive paste layer 22 only covers the entire first surface 11 (upper surface) and part of the second surface 12 (lower surface) of the hexahedron, thereby forming a "C"-type conductive layer.

[0319] It should be noted that, first, Fig.16 In the embodiment, the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to both the second conductive paste layer 22 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and spaced from both the second conductive paste layer and the first conductive paste layer, which is not specifically limited here.

[0320] Second, the conductive layer composed of the first conductive paste layer, the first base material layer and the second conductive paste layer can also only cover part of the first surface of the foam matrix. At this time, the part of the first surface of the foam matrix not provided with the conductive layer may not be provided with any structure, or may be provided with structures such as a different-color PET layer, etc., which is not specifically limited here.

[0321] As another example, Fig.17 As shown, the conductive layer composed of the first conductive paste layer 21, the first base material layer 6 and the adhesive layer 5 covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-shaped conductive layer; at the same time, along the direction perpendicular to the foam matrix 1, the height of the first conductive paste layer 21 in the first area Q1 is less than the height of the first conductive paste layer 21 in the second area Q2.

[0322] It should be noted that in Fig.17 In the embodiment, the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to the adhesive layer 5 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.

[0323] As another example, Fig.18As shown, the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, and the second substrate layer 9 is located on part of the first surface 11 (upper surface) of the hexahedron, thereby forming a "C"-shaped conductive layer; at the same time, along the direction perpendicular to the foam matrix 1, the height of the first conductive paste layer 21, the first substrate layer 6 and the first bonding layer 5 in the first area Q1 is equal to the height of the first conductive paste layer 21, the first substrate layer 6 and the first bonding layer 5 in the second area Q2.

[0324] It should be noted that in Fig.18 In the embodiment, the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to the adhesive layer 5 and the first conductive paste layer 21. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.

[0325] It should be understood that the first surface, second surface, third surface, fourth surface, fifth surface and sixth surface of the above-mentioned hexahedron can also be located at other positions of the hexahedron. For example, the first surface can be the upper surface, the second surface can be the left surface, the third surface can be the right surface, the fourth surface can be the lower surface, the fifth surface can be the front surface and the sixth surface can be the rear surface. At this time, when the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the hexahedron, the conductive layer constitutes an inverted "U"-shaped conductive layer.

[0326] For another example, the first surface may be the lower surface, the second surface may be the left surface, the third surface may be the right surface, the fourth surface may be the upper surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, when the conductive layer covers at least part of the first surface, at least part of the second surface, and all of the third surface of the hexahedron, the conductive layer constitutes a "U"-shaped conductive layer.

[0327] For another example, the first surface may be the upper surface, the second surface may be the lower surface, the third surface may be the right surface, the fourth surface may be the left surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, when the conductive layer covers at least part of the first surface, at least part of the second surface, and all of the third surface of the hexahedron, the conductive layer constitutes a Type of conductive layer.

[0328] Of course, corresponding to the positions of the other first surface, the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface, the conductive layer can also form other structures, which are not specifically limited here.

[0329] The conductive foam provided in the embodiment of the present application, on the one hand, has the first surface and the second surface of the foam matrix arranged opposite to each other, and the first surface is connected to the second surface through the third surface, and a conductive layer is arranged to cover at least part of the first surface, all of the third surface and at least part of the second surface of the polyhedron, so that a "C"-shaped conductive layer can be formed; on the other hand, when the conductive foam is used in electronic devices, the directionality of the conductive foam can be ensured, so that identification and fool-proofing can be performed, and the thickness of the electronic device can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic device can be reduced; in addition, the conductive foam can be used to achieve directional electrical connection of the structure in the electronic device, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0330] Alternatively, as an implementable approach, Figures 3 to 6 , Figures 9 to 11 , Fig.19 As shown, the polyhedron includes a first surface 11, a second surface 12, a third surface 13 and a fourth surface 14. The first surface 11 is arranged opposite to the second surface 12, and the third surface 13 is arranged opposite to the fourth surface 14. The first surface 11 is connected to the second surface 12 through the third surface 13 and the fourth surface 14 respectively, and the conductive layer covers the entire first surface 11, at least a portion of the second surface 12, the entire third surface 13 and the entire fourth surface 14.

[0331] It should be understood that the above-mentioned conductive layer covers the entire first surface, the entire third surface, the entire fourth surface and at least a portion of the second surface, which means: the conductive layer covers the entire first surface, the entire third surface, the entire fourth surface and a portion of the second surface; or, the conductive layer covers the entire first surface, the entire third surface, the entire fourth surface and the entire second surface, and no specific limitation is made here.

[0332] As an example, Figures 3 to 6 , Figures 9 to 11 As shown, the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface) of the hexahedron.

[0333] As another example, Fig.19 As shown, the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface), the entire third surface 13 (left surface), and the entire fourth surface 14 (right surface) of the hexahedron, thereby forming a similar Type of conductive layer.

[0334] It should be noted that, first, Fig.19In the embodiment, the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least part of the second surface 12 of the foam matrix 1 and is spaced apart from the second conductive paste layer 22. Of course, the second adhesive layer can also be disposed on at least part of the second surface of the foam matrix and connected to the second conductive paste layer, which is not specifically limited here.

[0335] Second, the conductive layer of the embodiment of the present application is not limited to the second conductive layer, but can also be any other structure. For example, the conductive layer can be a first bonding layer, a first substrate layer, a first conductive paste layer, etc. The specific setting method can refer to the above embodiment, and the setting of the second bonding layer can also refer to the above and the second conductive paste layer, which will not be repeated here.

[0336] It should be understood that the first surface, second surface, third surface, fourth surface, fifth surface and sixth surface of the above-mentioned hexahedron can also be located at other positions of the hexahedron. For example, the first surface can be the lower surface, the second surface can be the left surface, the third surface can be the upper surface, the fourth surface can be the right surface, the fifth surface can be the front surface and the sixth surface can be the back surface. At this time, when the conductive layer covers the entire first surface, at least part of the second surface, all the third surfaces and all the fourth surfaces of the hexahedron, the conductive layer constitutes a "D"-type conductive layer.

[0337] For another example, the first surface may be the left surface, the second surface may be the upper surface, the third surface may be the right surface, the fourth surface may be the lower surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, when the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface of the hexahedron, the conductive layer constitutes a Type of conductive layer.

[0338] For another example, the first surface may be the upper surface, the second surface may be the right surface, the third surface may be the lower surface, the fourth surface may be the left surface, the fifth surface may be the front surface, and the sixth surface may be the rear surface. In this case, when the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface of the hexahedron, the conductive layer constitutes a Type of conductive layer.

[0339] Of course, corresponding to the positions of the other first surface, the second surface, the third surface, the fourth surface, the fifth surface and the sixth surface, the conductive layer can also form other structures, which are not specifically limited here.

[0340] On the one hand, the first surface and the second surface of the foam substrate are arranged opposite to each other, and the first surface is connected to the second surface through the third surface, and a conductive layer is arranged to cover at least part of the first surface, the entire third surface and at least part of the second surface of the polyhedron, so that a similar type of conductive layer; on the other hand, when the conductive foam is used in electronic equipment, the directionality of the conductive foam can be ensured, so that while identification and anti-mistake are performed, the thickness of the electronic equipment can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic equipment can be smaller; in addition, the conductive foam can be used to achieve directional electrical connection of the structure in the electronic equipment, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic equipment.

[0341] The above only introduces the contents related to the invention point. The remaining structures can be obtained by referring to the relevant technology and will not be described in detail here.

[0342] An embodiment of the present application further provides an electronic device, which includes the above-mentioned conductive foam.

[0343] The electronic device provided in the embodiment of the present application includes a conductive foam with a low working height, a small PIM, and a low stress in the first direction, so the thickness of the electronic device can be effectively reduced. At the same time, the PIM between the structure in the electronic device and the contact interface of the conductive foam can be small; and the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.

[0344] The following uses the conductive foam as a hexahedron to specifically explain various applications of conductive foam in electronic devices.

[0345] Alternatively, if Fig. 20 and Fig.21 As shown, the first structure in the electronic device includes at least a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam when rotating.

[0346] The present application does not specifically limit the above-mentioned camera component. By way of example, the camera component may include a camera, etc.

[0347] When the camera assembly is a camera, the camera may include a front camera and a rear camera. The front camera may be arranged on a side of the display module away from the middle frame; the rear camera may be arranged on a side of the rear housing away from the middle frame, which is determined by actual application.

[0348] It should be understood that the first structure in the above-mentioned electronic device at least includes a camera component, which means that the first structure in the electronic device may only include a camera component; or, in addition to the camera component, the first structure in the electronic device may also include other structures, which is not specifically limited here.

[0349] Fig. 22 and Fig.23 The schematic diagrams of the structures of the electrical connection between the front camera 501 and the shielding cover 502 in the related art are shown respectively.

[0350] like Fig. 22 As shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503, and the shielding cover 502 is electrically connected to the PCB 504, resulting in a longer ground (GND) path back to the PCB 504, which cannot effectively improve the electromagnetic shielding of the electronic device and other problems.

[0351] like Fig.23 As shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503 and the bracket steel sheet 505, which may result in that there is no space on the substrate 507 of the front camera 501 to place the screws 506 to ensure the spacing between the bracket steel sheet 505 and the substrate 507.

[0352] At this time, if single-sided conductive adhesive is used to ensure the spacing between the bracket steel sheet 505 and the substrate 507, there may be a problem of inability to contact; if double-sided conductive adhesive is used to ensure the spacing between the bracket steel sheet 505 and the substrate 507, the front camera 501 may be damaged while removing the bracket steel sheet 505. In addition, if the bracket steel sheet 505 is an insert injection-molded bracket steel sheet, although there are screws 506 near the bracket steel sheet 505, the insert injection-molded bracket steel sheet may cause glue overflow at the edge of the sealing glue. If an insulating layer is formed between the bracket steel sheet 505 and the conductive adhesive, it may cause problems such as insufficient contact or inability to contact.

[0353] In order to solve the above problem, it can be considered to realize electrical connection between camera components such as a camera and a shielding cover by providing conductive foam.

[0354] However, the conductive foam in the related art often cannot be placed near the camera due to problems such as high working height.

[0355] Therefore, the conductive foam with a low working height in the first direction and small stress and PIM provided in the embodiment of the present application can well realize the electrical connection between the camera and other structures, and can improve the electromagnetic shielding and other problems in electronic equipment.

[0356] Fig. 20 A schematic diagram showing the conductive foam 05 of an embodiment of the present application being used to electrically connect the front camera 501 and the shielding cover 502 is shown. Fig. 22 A schematic diagram showing the conductive foam 05 of an embodiment of the present application being used to electrically connect the rear camera 508 to the shielding cover 502 is shown.

[0357] like Fig. 20 As shown, the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive foam 05, and the shielding cover 502 is fixedly connected to the PCB 504 through screws 506.

[0358] like Fig.21As shown, the middle frame 102 and the substrate 509 of the rear camera 508 are electrically connected through the conductive foam 05, the shielding cover 502 and the bracket steel sheet 505 are electrically connected through the conductive foam 05, and the substrate 509 of the rear camera 508 is also fixedly connected to the PCB504 through screws 506.

[0359] The electronic device provided by the embodiment of the present application, on the one hand, electrically connects the camera assembly such as the camera to the conductive foam. Since the working height of the conductive foam in the first direction is relatively low, it can be placed between the camera and other structures; when the camera rotates in any direction, since the conductive foam can be well compressed or stretched, the camera can always maintain electrical connection with the conductive foam, thereby ensuring the performance of the electronic device; on the other hand, since the conductive foam is an independent structure and can be separated, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic device, causing the entire electronic device to be scrapped; on the other hand, the conductive foam can effectively absorb the tolerance existing when electrically connecting to the structure of the electronic device, thereby avoiding poor contact; on the other hand, the conductive foam can make the grounding (GND) path shorter; at the same time, if problems such as overflowing glue occur, the conductive foam can also be improved by strain. As a result, the performance of the electronic device of the embodiment of the present application has been greatly improved.

[0360] Optionally, in Fig.24 In electronic devices such as Fig.24 As shown, the first surface 11 of the foam substrate 1 is electrically connected to the display screen 111 through the conductive layer, and the second surface 12 of the foam substrate 1 is connected to the middle frame 102 through the conductive layer.

[0361] Thus, the first surface and the second surface in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can be conducted along the second direction and the third direction respectively, wherein the second direction can be set perpendicular to the third direction.

[0362] The electronic device provided in the embodiment of the present application realizes electrical connection with the display screen and the middle frame respectively through conductive foam, which can effectively reduce the stress between the contact interface of the conductive foam and the antenna, and the stress between the contact interface of the conductive foam and the middle frame, thereby effectively improving the performance of the electronic device.

[0363] Optionally, in Fig.25 In electronic devices such as Fig.25 As shown, the first surface 11 of the foam matrix 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam matrix 1 is electrically connected to the PCB 504 through the conductive layer.

[0364] Thus, the two surfaces in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can be conducted along the second direction and the third direction respectively, wherein the second direction can be set perpendicular to the third direction.

[0365] It should be noted that Fig.25 The PCB 504 in the embodiment can be replaced by a display screen, a battery cover, a decorative part, etc.

[0366] Fig.25 The middle frame 102 may be a metal middle frame, and an anti-oxidation layer 110 is wrapped around the outer periphery of the metal middle frame.

[0367] like Fig.25 As shown, the surface of the middle frame 102 that contacts the reed 108 can be laser engraved to form a laser engraved surface 109 .

[0368] The electronic device provided in the embodiment of the present application, on the one hand, realizes the electrical connection between the reed and the PCB through the conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the reed, and the PIM between the contact interface between the conductive foam and the PCB, and effectively improves the performance of the electronic device; on the other hand, when one side of the conductive foam is a display screen, the conductive foam will not rebound and cause interface damage, such as screen film printing, etc., further improving the performance of the electronic device.

[0369] Optionally, in Fig.26 In electronic devices such as Fig.26 As shown, the first surface 11 of the foam matrix 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam matrix 1 is electrically connected to the PCB 504 through the conductive layer.

[0370] Thus, the two surfaces in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can be conducted along the second direction and the third direction respectively.

[0371] It should be noted that if Fig.26 As shown, the electronic device may further include an antenna 105 , a middle frame 102 and plastic 107 , wherein the antenna 105 and the middle frame 102 are supported on one side of the plastic 107 .

[0372] The surface of the antenna 105 on one side close to the reed 108 may be laser engraved to form a laser engraved surface 109 .

[0373] The antenna 105 may be wrapped with an anti-oxidation layer 110 .

[0374] The electronic device provided in the embodiment of the present application realizes the electrical connection between the reed and the PCB through the conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the reed, and the PIM between the contact interface between the conductive foam and the PCB, and effectively improve the performance of the electronic device.

[0375] Optionally, in Fig. 27 In electronic devices such as Fig. 27 As shown, the first surface 11 and the second surface 12 of the foam substrate 1 are electrically connected to the antenna 105 through the conductive layer, the first surface 11 of the foam substrate 1 is also electrically connected to the middle frame 102 through the conductive layer, and one surface of the foam substrate is connected to the insulating material layer 106.

[0376] Thus, the first surface and the second surface of the foam matrix are electrically connected to multiple structures in the electronic device respectively, so that the conductive foam can be conductive in multiple directions.

[0377] It should be noted that if Fig. 27 As shown, the electronic device may further include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .

[0378] The surface of the foam substrate connected to the insulating material layer may or may not be provided with the first sub-conductive layer, which is not specifically limited here.

[0379] The electronic device provided in the embodiment of the present application realizes electrical connection between the antenna and the middle frame through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, and the PIM between the contact interface between the conductive foam and the middle frame, thereby effectively improving the performance of the electronic device.

[0380] Optionally, in Fig.28 In electronic devices such as Fig.28 As shown, the first surface 11 and the third surface 13 of the foam matrix 1 are electrically connected to the antenna 105 through the conductive layer, the first surface 11 and the fourth surface 14 of the foam matrix 1 are electrically connected to the middle frame 102 through the conductive layer, and the second surface 12 of the foam matrix 1 is electrically connected to the PCB504 through the conductive layer.

[0381] Thus, the first surface, the second surface, the third surface and the fourth surface of the foam substrate are electrically connected to multiple structures in the electronic device respectively, so that the conductive foam can be conductive in multiple directions.

[0382] It should be noted that if Fig.28 As shown, the electronic device may further include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .

[0383] The electronic device provided in the embodiment of the present application realizes electrical connection between the antenna, the middle frame, and the PCB through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, the PIM between the contact interface between the conductive foam and the middle frame, and the PIM between the contact interface between the conductive foam and the PCB, thereby effectively improving the performance of the electronic device.

[0384] Optionally, in Fig.29 In electronic devices such as Fig.29 As shown, the first surface 11 of the foam substrate 1 is electrically connected to the antenna 105 and the middle frame 102 respectively through the conductive layer, and one surface of the foam substrate 1 is also connected to the insulating material layer 106 .

[0385] Thus, only the first surface of the foam matrix is ​​electrically connected to the structure in the electronic device, so that the conductive foam can be conductive along the second direction.

[0386] Fig.29 The antenna 105 in the electronic device shown has different heights from the middle frame 102 along a direction perpendicular to the foam matrix.

[0387] like Fig.29 As shown, the electronic device may further include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .

[0388] The surface of the foam substrate connected to the insulating material layer may or may not be provided with the first sub-conductive layer, which is not specifically limited here.

[0389] The electronic device provided in the embodiment of the present application, on the one hand, realizes the electrical connection between the antenna and the middle frame through the conductive foam, which can effectively reduce the PIM between the contact interface of the conductive foam and the antenna, and the PIM between the contact interface of the conductive foam and the middle frame, and effectively improves the performance of the electronic device; on the other hand, since the heights of the antenna and the middle frame along the direction perpendicular to the foam matrix are different, a conductive foam can realize electrical connection with structures of different heights in the electronic device, enriching the application of the conductive foam.

[0390] The embodiment of the present application provides a method for manufacturing a conductive foam.

[0391] like Fig.30 As shown, the production method includes:

[0392] S1. Provide a foam matrix.

[0393] S2. Forming a conductive layer on at least the first surface of the foam substrate.

[0394] The first surface is used to be electrically connected to a first structure in the electronic device through a conductive layer, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.

[0395] The present application does not specifically limit the manufacturing process of the above-mentioned conductive layer. As an example, when the conductive layer only includes a conductive paste layer, a conductive paste can be first formed on the surface of the foam substrate by spraying, printing, spraying, vacuum plating, etc., and then the conductive paste is baked / heated to form a conductive paste layer.

[0396] As another example, when the conductive layer includes a conductive paste layer and a first substrate layer, a conductive paste can be first formed on at least one surface of the first substrate layer by spraying, printing, or the like, and then the conductive paste is baked / heated to cure to form the first substrate layer and the conductive paste layer.

[0397] As another example, when the conductive layer includes a conductive paste layer and a first substrate layer, the first substrate may be immersed in the conductive paste, and then the conductive paste may be baked / heated to cure to form the first substrate layer and the conductive paste layer.

[0398] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, forms a conductive paste by spraying, printing, spraying, vacuum plating, dipping, etc., and bakes / heats to solidify to form a conductive paste layer, which is simple and easy to implement; on the other hand, the conductive paste in the conductive paste layer has certain ductility, good conductivity, and a large resistivity (10 -5 -10 -4 Ω×cm), and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure. Combined with the elasticity of the foam matrix, the conductive foam can have a lower working height in the first direction; on the other hand, the conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; on the other hand, when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.

[0399] The following is a detailed description of the methods for making the conductive foams of various structures in this application.

[0400] As an example, Figure 3 and Figure 4 The method for making the conductive foam shown includes:

[0401] S11 , printing a first conductive paste on the entire first surface 11 , the entire second surface 12 , the entire third surface 13 , and the entire fourth surface 14 of the foam substrate 1 .

[0402] S12 , baking and curing to form a first conductive paste layer 21 .

[0403] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, prints the first conductive paste and bakes / heats to cure it to form a first conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0404] As an example, Figure 5 and Figure 6 The method for making the conductive foam shown includes:

[0405] S21 , spraying a second conductive paste on the entire first surface 11 , the entire second surface 12 , the entire third surface 13 , and the entire fourth surface 14 of the foam substrate 1 .

[0406] S22 , baking and curing to form a second conductive paste layer 22 .

[0407] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, involves spraying a second conductive paste and baking / heating to cure the second conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0408] As an example, Fig. 9 and Fig.10 The method for making the conductive foam shown includes:

[0409] S31 , forming an adhesive layer 5 on the entire first surface 11 , the entire second surface 12 , the entire third surface 13 , and the entire fourth surface 14 of the foam substrate 1 .

[0410] S32 , forming a first substrate layer 6 on the surface of the adhesive layer 5 close to the first surface 11 , the second surface 12 , the third surface 13 and the fourth surface 14 .

[0411] S33 , printing a first conductive paste on the surface of the first substrate layer 6 close to the first surface 11 , the second surface 12 , the third surface 13 and the fourth surface 14 .

[0412] S34 , baking and curing to form a first conductive paste layer 21 .

[0413] It should be noted that, instead of forming the adhesive layer on the entire first surface, the entire second surface, the entire third surface and the entire fourth surface of the foam substrate, the first substrate layer is directly formed on the entire first surface, the entire second surface, the entire third surface and the entire fourth surface of the foam substrate; and then the first conductive paste is printed on the surface of the first substrate layer close to the first surface, the second surface, the third surface and the fourth surface; and the first conductive paste layer is baked and cured.

[0414] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, prints the first conductive paste and bakes / heats to cure it to form a first conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0415] As an example, Fig.11 The method for making the conductive foam shown includes:

[0416] S41 , spraying a second conductive paste on the entire first surface 11 , the entire second surface 12 , the entire third surface 13 , and the entire fourth surface 14 of the foam substrate 1 .

[0417] S42 , forming a first base material layer 6 on the surface of the second conductive paste.

[0418] S43 , printing a first conductive paste on the surface of the first substrate layer 6 .

[0419] S44 , baking and curing to form the second conductive paste layer 22 and the first conductive paste layer 21 .

[0420] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, comprises spraying the second conductive paste, printing the first conductive paste, and baking / heating to cure to form the first conductive paste layer and the second conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0421] As an example, Fig.13 The method for making the conductive foam shown includes:

[0422] S51 , forming an adhesive layer 5 on a portion of the first surface 11 , a portion of the second surface 12 , and the entire third surface 13 of the foam substrate 1 .

[0423] S52 , immersing the first substrate layer 6 in the first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer 6 .

[0424] S53 , forming a first intermediate layer on the surface of the adhesive layer 5 close to the first surface 11 , the second surface 12 and the third surface 13 .

[0425] S54 , baking and curing to form a first conductive paste layer 21 covering all surfaces of the first substrate layer 6 .

[0426] S55 , forming a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0427] The second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .

[0428] The present application does not specifically limit the order of the above-mentioned step S51 and step S52. For example, step S51 may be performed first, and then step S52; or, step S52 may be performed first, and then step S51; or, step S51 and step S52 may be performed at the same time.

[0429] It should be noted that the preparation method may also include:

[0430] S051. Soak the first substrate layer in a second conductive paste to form a second intermediate layer having the second conductive paste covering all surfaces of the first substrate layer.

[0431] S052. Form a second intermediate layer on part of the first surface, part of the second surface, and the entire third surface of the foam substrate.

[0432] S053, baking and curing to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0433] S054. Form a second adhesive layer on a portion of the second surface of the foam substrate.

[0434] Wherein, the second bonding layer is connected to the second conductive paste layer.

[0435] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, immerses the first substrate layer in a conductive paste, and bakes / heats to cure it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0436] As an example, Fig.14 The method for making the conductive foam shown includes:

[0437] S61 , forming an adhesive layer 5 on a portion of the first surface 11 , a portion of the second surface 12 , and the entire third surface 13 of the foam substrate 1 .

[0438] S62 , immersing the first substrate layer 6 in the first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer 6 .

[0439] S63 , forming a first intermediate layer on the surface of the adhesive layer 5 close to the first surface 11 , the second surface 12 and the third surface 13 .

[0440] S64 , baking and curing to form a first conductive paste layer 21 covering all surfaces of the first substrate layer 6 .

[0441] S65 , forming a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0442] The second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .

[0443] S66 , forming a different-color PET layer 8 on a portion of the first surface 11 of the foam substrate 1 .

[0444] The different-color PET layer 8 is connected to both the adhesive layer 5 and the first conductive paste layer 21 .

[0445] The present application does not specifically limit the order of the above-mentioned step S61 and step S62. For example, step S61 may be performed first, and then step S62; or, step S62 may be performed first, and then step S61; or, step S61 and step S62 may be performed at the same time.

[0446] It should be noted that the preparation method may also include:

[0447] S061, immersing the first substrate layer in a second conductive paste to form a second intermediate layer having the second conductive paste covering all surfaces of the first substrate layer.

[0448] S062. Form a second intermediate layer on part of the first surface, part of the second surface, and the entire third surface of the foam substrate.

[0449] S063, baking and curing to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0450] S064. Form a second adhesive layer on a portion of the second surface of the foam substrate.

[0451] Wherein, the second bonding layer is connected to the second conductive paste layer.

[0452] S065. Form a different-color PET layer on a portion of the first surface of the foam substrate.

[0453] The different-color PET layer is connected to the second conductive paste layer.

[0454] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, immerses the first substrate layer in a conductive paste, and bakes / heats to cure it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0455] As an example, Fig.15 The method for making the conductive foam shown includes:

[0456] S71 , spraying a second conductive paste on the entire first surface 11 , a portion of the second surface 12 , and the entire third surface 13 of the foam substrate 1 .

[0457] S72 , immersing the first substrate layer 6 in the first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer 6 .

[0458] S73 , forming a first intermediate layer on the surface of the second conductive paste close to the first surface 11 , the second surface 12 , and the third surface 13 .

[0459] S74 , baking and curing to form the second conductive paste layer 22 and the first conductive paste layer 21 covering all surfaces of the first substrate layer 6 .

[0460] S75 , forming a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0461] The second adhesive layer 7 is connected to both the second conductive paste layer 22 and the first conductive paste layer 21 .

[0462] The present application does not specifically limit the order of the above-mentioned step S71 and step S72. For example, step S71 may be performed first, and then step S72; or, step S72 may be performed first, and then step S71; or, step S71 and step S72 may be performed at the same time.

[0463] It should be noted that the preparation method may also include:

[0464] S071. Soak the first substrate layer in a second conductive paste to form a second intermediate layer having the second conductive paste covering all surfaces of the first substrate layer.

[0465] S072. Form a second intermediate layer on the entire first surface, part of the second surface, and the entire third surface of the foam substrate.

[0466] S073, baking and curing to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0467] S074. Form a second adhesive layer on a portion of the second surface of the foam substrate.

[0468] Wherein, the second bonding layer is connected to the second conductive paste layer.

[0469] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, immerses the first substrate layer in a conductive paste, and bakes / heats to cure it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.

[0470] As an example, Fig.16 The method for making the conductive foam shown includes:

[0471] S81 , spraying a second conductive slurry on the entire first surface 11 and a portion of the second surface 12 of the foam substrate 1 .

[0472] S82 , immersing the first substrate layer 6 in the first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer 6 .

[0473] S83, forming a first intermediate layer on the surface of the second conductive paste close to the first surface 11 and the second surface 12, and the third surface 13 of the foam substrate.

[0474] S84 , baking and curing to form the second conductive paste layer 22 and the first conductive paste layer 21 covering all surfaces of the first substrate layer 6 .

[0475] S85 , forming a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0476] The second adhesive layer 7 is connected to both the second conductive paste layer 22 and the first conductive paste layer 21 .

[0477] The present application does not specifically limit the order of the above-mentioned step S81 and step S82. For example, step S81 may be performed first, and then step S82; or, step S82 may be performed first, and then step S81; or, step S81 and step S82 may be performed at the same time.

[0478] The method for making the conductive foam provided in the embodiment of the present application, on the one hand, comprises coating the second conductive paste, immersing the first substrate layer in the first conductive paste, and baking / heating and curing to form the second conductive paste layer and the first conductive paste layer wrapping all surfaces of the first substrate layer. This method is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and a low stress.

[0479] As an example, Fig.17 The method for making the conductive foam shown includes:

[0480] S91 , forming an adhesive layer 5 on the entire first surface 11 , a portion of the second surface 12 , and the entire third surface 13 of the foam substrate 1 .

[0481] S92 , immersing the first substrate layer 6 in the first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer 6 .

[0482] S93 , forming a first intermediate layer on the surface of the adhesive layer 5 close to the first surface 11 , the second surface 12 and the third surface 13 .

[0483] S94 , baking and curing to form a first conductive paste layer 21 covering all surfaces of the first substrate layer 6 .

[0484] S95 , printing the first conductive paste on the first conductive paste layer 21 in the second region Q2 .

[0485] S96 , baking and curing to form a first conductive paste layer 21 .

[0486] S97 . Form a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0487] The second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .

[0488] The present application does not specifically limit the order of the above-mentioned step S91 and step S92. For example, step S91 may be performed first, and then step S92; or, step S92 may be performed first, and then step S91; or, step S91 and step S92 may be performed at the same time.

[0489] It should be noted that the preparation method may also include:

[0490] S091, immersing the first substrate layer in a second conductive paste to form a second intermediate layer having the second conductive paste covering all surfaces of the first substrate layer.

[0491] S092. Form a second intermediate layer on the entire first surface, part of the second surface, and the entire third surface of the foam substrate.

[0492] S093, baking and curing to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0493] S094, spraying a second conductive paste on the second conductive paste layer in the second area.

[0494] S095, baking and curing to form a second conductive paste layer.

[0495] S096. Forming a second adhesive layer on a portion of the second surface of the foam substrate.

[0496] Wherein, the second bonding layer is connected to the second conductive paste layer.

[0497] Of course, when the first substrate layer and the conductive paste layer are independent structures, when forming the conductive paste layer, the height of the conductive paste printed / sprayed in the first area can be smaller than the height of the conductive paste printed / sprayed in the second area along the direction perpendicular to the foam substrate.

[0498] The method for making a conductive foam provided in an embodiment of the present application, on the one hand, forms an additional conductive paste layer in the second area than in the first area, so that the structure of the conductive layer in the first area is the same as that in the second area, and at the same time, along the direction perpendicular to the foam matrix, the height of the conductive layer in the first area is smaller than the height of the conductive layer in the second area; on the other hand, it can form a conductive foam with a low working height, small PIM and low stress in the first direction.

[0499] As an example, Fig.18 The method for making the conductive foam shown includes:

[0500] S101 , forming an adhesive layer 5 on the entire first surface 11 , a portion of the second surface 12 , and the entire third surface 13 of the foam substrate 1 .

[0501] S102 , immersing the first substrate layer 6 in a first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer 6 .

[0502] S103 , forming a first intermediate layer on the surface of the adhesive layer 5 close to the first surface 11 , the second surface 12 and the third surface 13 .

[0503] S104 , baking and curing to form a first conductive paste layer 21 covering all surfaces of the first substrate layer 6 .

[0504] S105 , forming a second base material layer 9 on the first conductive paste layer 21 in the second region Q2 .

[0505] S106 , forming a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0506] The second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .

[0507] The present application does not specifically limit the order of the above-mentioned step S101 and step S102. For example, step S101 may be performed first, and then step S102; or, step S102 may be performed first, and then step S101; or, step S101 and step S102 may be performed simultaneously.

[0508] It should be noted that the preparation method may also include:

[0509] S0101. Soak the first substrate layer in a second conductive paste to form a second intermediate layer having the second conductive paste covering all surfaces of the first substrate layer.

[0510] S0102. Form a second intermediate layer on the entire first surface, part of the second surface, and the entire third surface of the foam substrate.

[0511] S0103, baking and curing to form a second conductive paste layer covering all surfaces of the first substrate layer.

[0512] S0104. Form a second substrate layer on the second conductive paste layer in the second region.

[0513] S0105. Form a second adhesive layer on a portion of the second surface of the foam substrate.

[0514] Wherein, the second bonding layer is connected to the second conductive paste layer.

[0515] The method for making a conductive foam provided in an embodiment of the present application, on the one hand, by additionally forming a second substrate layer in the second area, so that the structure of the conductive layer in the first area is different from that in the second area, and along the direction perpendicular to the foam substrate, the height of the conductive layer in the first area is smaller than the height of the conductive layer in the second area; on the other hand, it is possible to form a conductive foam with a low working height, small PIM and low stress in the first direction.

[0516] As an example, Fig.19 The method for making the conductive foam shown includes:

[0517] S111 , spraying a second conductive paste on the entire first surface 11 , a portion of the second surface 12 , the entire third surface 13 , and the entire fourth surface 14 of the foam substrate 1 .

[0518] S112 , baking and curing to form a second conductive paste layer 22 .

[0519] S113 , forming a second adhesive layer 7 on a portion of the second surface 12 of the foam substrate 1 .

[0520] The second bonding layer 7 and the second conductive paste layer 22 are spaced apart from each other.

[0521] It should be noted that the preparation method may also include:

[0522] S0111. Forming a glue layer on the entire first surface, part of the second surface, the entire third surface and the entire fourth surface of the foam substrate.

[0523] S0112, immersing the first substrate layer in a first conductive paste to form a first intermediate layer having the first conductive paste covering all surfaces of the first substrate layer.

[0524] S0113. Form a first intermediate layer on the surface of the adhesive layer close to the first surface, the second surface, the third surface and the fourth surface.

[0525] S0114, baking and curing to form a first conductive paste layer covering all surfaces of the first substrate layer.

[0526] S0115. Form a second adhesive layer on a portion of the second surface of the foam substrate.

[0527] Wherein, the second bonding layer, the glue layer and the first conductive paste layer are all arranged at intervals.

[0528] The present application does not specifically limit the order of the above-mentioned step S0111 and step S0112. For example, step S0111 may be performed first, and then step S0112; or, step S0112 may be performed first, and then step S0111; or, step S0111 and step S0112 may be performed at the same time.

[0529] Of course, other methods of manufacturing conductive layers may also be used, which will not be described in detail here.

[0530] The method for making a conductive foam provided in the embodiment of the present application comprises, on one hand, forming a conductive foam substrate On the other hand, it can form a conductive foam with low working height, small PIM and low stress in the first direction.

[0531] In application, a first foam substrate with a larger volume is generally selected, and a conductive layer, an adhesive layer, etc. are formed, and then punched into multiple smaller conductive foams, and a release layer is compounded for standby use. When in use, the release layer is torn off, and the conductive foam is electrically connected to at least one structure in the electronic device.

[0532] Here are some specific production methods:

[0533] As an example, Fig.31 As shown, the production method includes:

[0534] S011. Cleaning the surface of the first foam substrate.

[0535] S012. Select a first conductive silver paste.

[0536] After selecting the first conductive silver paste in step S012 and before spraying the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam substrate in step S013, the manufacturing method may further include: S019, adding a diluent. At this time, the selected first conductive silver paste may be diluted to obtain the required first conductive silver paste.

[0537] S013. Spray a first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam substrate.

[0538] S014, baking and curing.

[0539] S015. Detect resistivity and height.

[0540] If the resistivity and height meet the requirements, proceed to the next step; if the resistivity and height do not meet the requirements, discard the material. At this time, the resistivity of the conductive foam needs to meet 10 -5 -10 -4 Ω×cm, specifically, the resistivity of the conductive foam can be 10 -5 Ω×cm, 10 -4 Ω×cm, etc.; the working height of the conductive foam in the first direction needs to meet 0.1-0.15mm. Specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.

[0541] S016, fully coated with conductive adhesive.

[0542] S017, punching.

[0543] S018, laminating release paper.

[0544] It should be noted that, first, the order of the above-mentioned step S011, step S012 and step S019 is not specifically limited. For example, step S011 can be performed first, and then step S012 and step S019; or, step S012 and step S019 can be performed first, and then step S011; or, step S011, step S012 and step S019 can be performed at the same time.

[0545] Second, after step S011, cleaning the surface of the first foam substrate, and before step S013, spraying the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam substrate, the manufacturing method may further include: S020, forming a first foam substrate mold.

[0546] The present application does not specifically limit the process of the above-mentioned first foam matrix mold forming. For example, the first foam matrix can be manufactured by an extrusion molding method. Specifically, the mechanically foamed first foam matrix is ​​selected for cleaning, and the cleaned first foam matrix is ​​placed at the discharge port of the mold, and the first foam matrix is ​​squeezed to force the foamed foam matrix to produce directional plastic deformation and be extruded from the mold hole in a specific shape, for example, Fig.33 The hexahedral first foam matrix 10 is shown. The reason for using mechanical foaming is that after spraying / printing the conductive paste and curing, the conductive foam will not undergo a large size change.

[0547] Of course, the first foam substrate mold can also be directly formed into a foam substrate, and then the conductive layer and the like can be manufactured without punching.

[0548] As another example, Fig.32 As shown, the production method includes:

[0549] S021. Clean the surface of the first foam substrate.

[0550] S022. Select a first conductive silver paste.

[0551] S023. Place the first conductive silver paste in the groove of the steel plate.

[0552] After step S022, selecting the first conductive silver paste, and before step S023, placing the first conductive silver paste in the groove of the steel plate, the manufacturing method may further include: S031, adding a diluent. At this time, the selected first conductive silver paste may be diluted to obtain the required first conductive silver paste.

[0553] S024, the pad printing head dips the first conductive silver paste and shapes the first conductive silver paste.

[0554] S025. A pad printing head pad prints a first conductive silver paste on a first surface, a second surface, a third surface, and a fourth surface of the first foam substrate.

[0555] The pad printing head of the present application can print the first conductive silver paste multiple times on the first surface, second surface, third surface and fourth surface of the first foam substrate at the same time, and dry the surface, and solidify after repeated multiple times; or, the pad printing head can print the first conductive silver paste multiple times on the surface of a first foam substrate in sequence, and dry the surface, and solidify after repeated multiple times, which is not specifically limited here.

[0556] S026. Bake and solidify.

[0557] S027, detect resistivity and height.

[0558] If the resistivity and height meet the requirements, proceed to the next step; if the resistivity and height do not meet the requirements, discard the material. At this time, the resistivity of the conductive foam needs to meet 10 -5 -10 -4 Ω×cm, specifically, the resistivity of the conductive foam can be 10 -5 Ω×cm, 10 -4 Ω×cm, etc.; the working height of the conductive foam in the first direction needs to meet 0.1-0.15mm. Specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.

[0559] S028, fully coated with conductive adhesive.

[0560] S029, punching.

[0561] S030, laminating release paper.

[0562] It should be noted that the order of the above-mentioned steps S021 to S032 and steps S022 to S024 is not specifically limited. For example, steps S021 to S032 may be performed first, and then steps S022 to S024 may be performed; or, steps S022 to S024 may be performed first, and then steps S021 to S032 may be performed; or, steps S021 to S032 and steps S022 to S024 may be performed simultaneously.

[0563] After step S021, cleaning the surface of the first foam substrate, and before step S025, pad printing the first conductive silver paste on the first surface, the second surface, the third surface and the fourth surface of the first foam substrate, the manufacturing method may further include: S032, forming a first foam substrate mold.

[0564] The present application does not specifically limit the process of the above-mentioned first foam matrix mold forming. For example, the first foam matrix can be manufactured by an extrusion molding method. Specifically, the mechanically foamed first foam matrix is ​​selected for cleaning, and the cleaned first foam matrix is ​​placed at the discharge port of the mold, and the first foam matrix is ​​squeezed to force the foamed foam matrix to produce directional plastic deformation and be extruded from the mold hole in a specific shape, for example, Fig.33 The hexahedral first foam matrix 10 is shown. The reason for using mechanical foaming is that after spraying / printing the conductive paste and curing, the conductive foam will not undergo a large size change.

[0565] Of course, the first foam substrate mold can also be directly formed into a foam substrate, and then the conductive layer and the like can be manufactured without punching.

[0566] Fig.33for Fig.32 Process flow chart combining conductive foam structure. Fig.33 As shown in (a), a first foam substrate 10 is provided; Fig.33 As shown in (b), the first conductive silver paste is printed on the first surface and the second surface of the first foam substrate 10; Fig.33 As shown in (c), the first conductive silver paste is printed on the third surface and the fourth surface of the first foam substrate 10, and solidified to form a first conductive paste layer 21; Fig.33 As shown in (d), punching is performed to obtain a plurality of conductive foams, each of which includes a foam matrix 1, and a first conductive paste layer 21 formed on the first surface, second surface, third surface and fourth surface of the foam matrix 1, and the first conductive paste in the first conductive paste layer 21 is conductive.

[0567] The structural description of the conductive foam in the embodiments of the present application can be referred to the above embodiments and will not be repeated here.

[0568] Only the contents related to the invention are introduced here. The rest of the production methods can be obtained by referring to the relevant technologies and will not be described in detail here.

[0569] It should be understood that the above is only to help those skilled in the art to better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. According to the above examples given, those skilled in the art can obviously make various equivalent modifications or changes. For example, some steps in each embodiment of the above detection method may be unnecessary, or some steps may be newly added. Or a combination of any two or any multiple embodiments of the above. Such modifications, changes or combined schemes also fall within the scope of the embodiments of the present application.

[0570] It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the various embodiments. The same or similar points that are not mentioned can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0571] It should also be understood that the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0572] It should also be understood that in the embodiments of the present application, "pre-setting" and "pre-definition" can be achieved by pre-saving corresponding codes, tables or other methods that can be used to indicate relevant information in a device (for example, including an electronic device), and the present application does not limit its specific implementation method.

[0573] It should also be understood that the division of the methods, situations, categories and embodiments in the embodiments of the present application is only for the convenience of description and should not constitute a special limitation. The features of various methods, categories, situations and embodiments can be combined without contradiction.

[0574] It should also be understood that in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0575] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A conductive foam, characterized in that: Applied to electronic equipment, the conductive foam comprises: Foam matrix; A conductive paste layer, covering at least a first surface of the foam substrate and contacting at least a first surface of the foam substrate, the conductive paste layer being electrically connected to a first structure in the electronic device, and the conductive paste layer being configured to deform under external pressure; The conductive paste layer includes a paste body and a plurality of connected metal conductive particles. The metal conductive particles are doped into the paste body. The mass fraction of the metal conductive particles in the paste body ranges from 75% to 85%.

2. The conductive foam according to claim 1, characterized in that: The conductive paste layer is a first conductive paste layer or a second conductive paste layer; The first conductive paste layer includes a first paste body and a plurality of first metal conductive particles, the first metal conductive particles are doped in the first paste body, and the first paste body includes epoxy resin or silicon dioxide resin; The second conductive paste layer includes a second paste body and a plurality of second metal conductive particles, the second metal conductive particles are doped in the second paste body, and the second paste body includes a silicone resin or a silane-modified resin.

3. The conductive foam according to claim 1 or 2, characterized in that: The first surface of the foam substrate is divided into at least a first area and a second area. Along a direction perpendicular to the foam substrate, a height of a portion of the conductive paste layer located in the first area is smaller than a height of a portion of the conductive paste layer located in the second area.

4. The conductive foam according to claim 1 or 2, characterized in that: The foam matrix is ​​in the shape of a polyhedron, and the polyhedron at least includes the first surface, the second surface and the third surface connected to each other; The conductive paste layer covers at least the first surface, the second surface and the third surface.

5. The conductive foam according to claim 4, characterized in that: When the polyhedron includes the first surface, the second surface and the third surface, the first surface is arranged opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive paste layer covers at least part of the first surface, at least part of the second surface and the entire third surface of the polyhedron.

6. The conductive foam according to claim 4, characterized in that: When the polyhedron includes the first surface, the second surface, the third surface and the fourth surface, the first surface is arranged opposite to the second surface, and the third surface is arranged opposite to the fourth surface, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive paste layer covers the entire first surface, at least a part of the second surface, the entire third surface and the entire fourth surface.

7. The conductive foam according to claim 4, characterized in that: The second surface of the polyhedron is used to be electrically connected to a second structure in the electronic device through the conductive paste layer.

8. The conductive foam according to claim 1 or 2, characterized in that: The first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative component.

9. The conductive foam according to claim 7, characterized in that: The second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative piece.

10. An electronic device, characterized in that: It comprises the conductive foam as claimed in any one of claims 1 to 9.

11. The electronic device according to claim 10, characterized in that: The first structure in the electronic device is a display screen, and the second structure in the electronic device is a metal middle frame.

12. The electronic device according to claim 10, characterized in that: The first structure at least includes a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam when rotating.

13. A method for making a conductive foam, characterized in that: The production method comprises: A conductive paste layer is formed on at least the first surface of a foam substrate; wherein the conductive paste layer is electrically connected to a first structure in an electronic device, the conductive paste layer is in contact with at least the first surface of the foam substrate, and the conductive paste layer is used to deform under external pressure; the conductive paste layer includes a paste body and a plurality of connected metal conductive particles, the metal conductive particles are doped in the paste body, and the mass fraction of the metal conductive particles in the paste body ranges from 75% to 85%.

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