A laser cutting automation device

Abstract

The application provides a laser cutting automation device, characterized in that the device comprises a first laser cutting module, a second laser cutting module and an X-axis module, the first laser cutting module and the second laser cutting module are movably arranged on the X-axis module and can move along the X-axis, a first cutting platform, a buffer pulling material module and a second cutting platform are sequentially arranged on one side space of the X-axis module in the Y-axis direction, the buffer pulling material module comprises a left pulling material mechanism, a buffer mechanism and a right pulling material mechanism, the buffer mechanism comprises a Z-axis linear guide rail, a floatable roller assembly movably arranged on the Z-axis linear guide rail and / or a fixed roller fixedly arranged on the side of the Z-axis linear guide rail and inclined to the top position, the device can support double cutting of more than three kinds of products with different sizes / lengths, can satisfy the production process of more than three kinds of products, and can also realize double cutting of two different processes.

Description

Technical Field

[0001] This invention relates to the field of automated equipment, and in particular to an automated laser cutting device. Background Technology

[0002] In the production process of electronic products, it is often necessary to cut the material strip roll into shapes that match / require the electronic products, and to arrange the circuits related to photolithography. Compared with traditional kerosene cutting / die cutting, laser cutting has advantages such as high efficiency and low cost.

[0003] However, current automated laser cutting equipment generally uses a single cutting platform. The same equipment cannot support duplex cutting of more than three different sizes / lengths of products, cannot meet the production processes of more than three different products, and cannot achieve duplex cutting of two different processes. As a result, the production efficiency is still relatively low, and further innovation and improvement are urgently needed. Summary of the Invention

[0004] One object of the present invention is to provide an automated laser cutting device that can support duplex cutting of three or more products of different sizes / lengths, thereby significantly improving the laser cutting efficiency of the device.

[0005] Another objective of this invention is to provide an automated laser cutting device that can meet the production processes of three or more different products, and can also achieve duplex cutting of two different processes, significantly improving the laser cutting efficiency of the device.

[0006] Another objective of this invention is to provide an automated laser cutting device, which has a first cutting platform and a second cutting platform, as well as a buffer material pulling module located on the first cutting platform and the second cutting platform. This device can support independent processing of two laser cutting modules without interfering with each other or slowing down the progress of the other, while also working together to complete the cutting of different products or even different combinations of cutting processes, thereby improving the overall efficiency.

[0007] Another objective of this invention is to provide an automated laser cutting device, in which a first laser cutting module and a second laser cutting module can process and cut product strips of different lengths separately, and products of different lengths can be spliced ​​together to complete the cutting, while ensuring uniform processing time. Furthermore, it can support dividing areas according to the reverse processing time, and the first laser cutting module and the second laser cutting module can complete the processing simultaneously.

[0008] Another object of the present invention is to provide an automated laser cutting device that can adjust the length of the feed strip buffered between the first cutting platform and the second cutting platform in a floating manner.

[0009] Another objective of this invention is to provide an automated laser cutting device that, through the coordinated assistance of multiple material pulling structures located at both ends of a first cutting platform and a second cutting platform, enables the material strip to be evenly laid out and uniformly vacuum-adsorbed as it passes through the first cutting platform and the second cutting platform, thereby improving the accuracy of laser cutting / lithography and enhancing the precision of laser cutting / lithography.

[0010] Another object of the present invention is to provide an automated laser cutting device, and based on the automated laser cutting device, to provide four or more laser cutting processes for different products.

[0011] According to one aspect of the present invention, an automated laser cutting apparatus is provided, characterized in that it comprises: The system comprises a first laser cutting module, a second laser cutting module, and an X-axis module. The first and second laser cutting modules are movably mounted on the X-axis module and can move left and right along the X-axis. The first cutting platform, the buffer material pulling module, and the second cutting platform are sequentially arranged along the X-axis in a lateral space along the Y-axis direction of the X-axis module. The first cutting platform and the second cutting platform are spaced apart along the X-axis, and the buffer material pulling module is disposed between the first cutting platform and the second cutting platform; The buffer material pulling module includes a left material pulling mechanism, a buffer mechanism, and a right material pulling mechanism. The left material pulling mechanism can pull the material strip passing through the first cutting platform from the output end, and the right material pulling mechanism can pull the material strip passing through the second cutting platform from the input end. The buffer mechanism includes a Z-axis linear guide, a floating roller assembly slidably disposed on the Z-axis linear guide, and / or a fixed roller fixedly disposed on the side of the Z-axis linear guide towards the top. The buffer mechanism can buffer the material strip between the left and right pulling mechanisms. Thus, the first and second cutting platforms, and the buffer pulling modules located on the first and second cutting platforms, can support duplex cutting of products of different sizes / lengths, meet the production processes of three or more different products, and also achieve duplex cutting of two different processes. The independent processing of the two laser cutting modules significantly improves the processing efficiency of the device. The first and second laser cutting modules can process and cut product strips of different lengths separately, and products of different lengths can be spliced ​​together to complete the cutting, ensuring uniform processing time. Furthermore, because the floating roller assembly of the buffer pulling module can adjust the floating of the buffered material strip, the arrangement of the left and right pulling mechanisms allows the material strip to be evenly laid on the first and second cutting platforms, improving the accuracy of laser cutting / lithography and enhancing laser cutting / lithography precision.

[0012] In one embodiment, both the left and right feeding mechanisms of the buffer feeding module include a servo motor, a power roller driven by the servo motor, a pressure roller located on the power roller, and a cylinder for driving the pressure roller closer to or away from the power roller. This allows the first and second cutting platforms to feed materials independently or synchronously, adapting to different processing techniques. It also improves feeding efficiency.

[0013] In one embodiment, both the first and second cutting platforms include a vacuum suction plate and a driven wheel. The driven wheel is positioned below the vacuum suction plate in the positive X-axis side space of the first cutting platform, or the driven wheel is positioned below the vacuum suction plate in the negative X-axis side space of the second cutting platform. This allows the material strip to be evenly spread and uniformly vacuum-adsorbed as it passes through the first and second cutting platforms, improving the accuracy and precision of laser cutting / lithography.

[0014] In one embodiment, the system further includes a feeding module comprising an initial feeding mechanism disposed on the negative X-axis side space of the first cutting platform to feed the strip from the beginning of the first cutting platform. The initial feeding mechanism includes a servo motor, a power roller driven by the servo motor, a pressure roller located on the power roller, and a cylinder for driving the pressure roller closer to or away from the power roller. Thus, the initial feeding mechanism is linked with the left feeding mechanism of the buffer feeding module, which can further improve the feeding effect, ensuring that the strip is evenly spread and uniformly vacuum-adsorbed as it passes over the first cutting platform.

[0015] In one embodiment, the system further includes an end-feeding module. This end-feeding module includes an end-feeding mechanism, which is positioned in the lateral space along the positive X-axis of the second cutting platform to pull the strip from the end of the platform. The end-feeding mechanism includes a servo motor, a power roller driven by the servo motor, a pressure roller located on the power roller, and a cylinder for driving the pressure roller closer to or away from the power roller. This linkage between the end-feeding mechanism and the right-hand feeding mechanism of the buffer feeding module further improves the feeding effect, ensuring the strip is evenly spread and uniformly vacuum-adsorbed as it passes over the second cutting platform.

[0016] In one embodiment, the device further includes a laser module and a reflection adjustment module. The laser module has two laser beam outputs, and the reflection adjustment module can reflect the two laser beams from the laser module several times to form a beam emitted along the X-axis, which can then be incident on the first laser cutting module and the second laser cutting module, respectively. This allows for a more compact internal structure, reducing the overall size of the device and facilitating the layout of various mechanisms. Furthermore, during the cutting process, both the first and second laser cutting modules can accurately receive the incident beam emitted along the X-axis at all times as they move along the X-axis, improving the efficiency and effectiveness of laser cutting.

[0017] In one embodiment, the reflection adjustment module further includes a plurality of first reflector assemblies and an adjustment slide disposed below the first reflector assemblies. The adjustment slide is capable of adjusting the orientation and / or three-dimensional coordinates of the first reflector assemblies. This allows for precise adjustment of the beam transmission path, improving the efficiency of light transmission.

[0018] In one embodiment, the laser module comprises two different lasers, and the two lasers respectively output two different laser beams, so that the first laser cutting module and the second laser cutting module can perform cutting with different processes. In this way, the two laser cutting modules use different processes for cutting corresponding to different lasers. After the first cutting platform completes processing, the workpiece is moved to the second cutting platform for laser cutting by the second laser cutting module, so as to complete different processing processes and meet product requirements. This can also improve production efficiency, and at the same time satisfy the combination of two different processes, which are linked to achieve different product requirements.

[0019] In one embodiment, each of the first laser cutting module and the second laser cutting module comprises a Y-axis module, a second mirror assembly, a Z-axis module and a laser cutting head. The Y-axis module is used for moving the laser cutting head along the Y axis. The second mirror assembly, the Z-axis module and the laser cutting head are arranged on the Y-axis module. The Z-axis module can drive the laser cutting head to move along the Z axis, and the second mirror assembly can reflect the light beam emitted from the reflection adjustment module several times and then emit the light beam from the laser cutting head along the Z axis. In this way, the movement flexibility of the laser cutting head can be guaranteed, and the processing efficiency can be improved.

[0020] In one embodiment, each of the first laser cutting module and the second laser cutting module further comprises a CCD and a dust removal cover. The CCD is used for product recognition / positioning, and the dust removal cover is used for collecting dust generated during the cutting process. In this way, the processing accuracy can be improved, and pollution can be reduced at the same time.

[0021] Through the understanding of the subsequent description and the accompanying drawings, further objects and advantages of the present invention will be fully embodied. Brief Description of the Drawings

[0022] Figure 1 is a schematic diagram of the overall structure of a preferred embodiment according to the present invention.

[0023] Figure 2 is Figure 1 a schematic diagram of the partial structure.

[0024] Figure 3 is Figure 2 a schematic diagram of the structure in the front view direction.

[0025] Figure 4 is Figure 1 a schematic diagram of the partial structure.

[0026] Figure 5 shows a production process of the laser cutting automation device based on the present invention.

[0027] Figure 6This is a second production process based on the laser cutting automation device of the present invention.

[0028] Figure 7 This is a third production process based on the laser cutting automation device of the present invention.

[0029] Figure 8 This is the fourth production process based on the laser cutting automation device of the present invention. Detailed Implementation

[0030] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0031] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," X-axis, Y-axis, Z-axis, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention.

[0032] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0033] Referring to the accompanying drawings of this invention Figures 1 to 4 The illustrations shown are some preferred embodiments of the present invention.

[0034] As shown in the figure: If the negative side of the X-axis is defined as the starting point / input end, and the positive side of the second cutting platform 2 along the X-axis is defined as the ending point / output end, then in a preferred embodiment, the automated laser cutting device includes: The first cutting platform 1 is used to fix the passing strip for laser cutting. The first cutting platform 1 includes a vacuum suction plate 11, on which a plurality of vacuum suction holes are evenly arranged to vacuum-adsorb and fix the passing strip from the bottom. The input end of the first cutting platform 1 is the starting material pulling mechanism 711 of the feeding module 71. The output end is provided with a driven wheel 12. The driven wheel 12 is positioned in the side space along the positive X-axis of the first cutting platform 1 at a state lower than the vacuum suction plate 11, so that the input and output ends of the strip are pulled in, and the strip passing through the first cutting platform 1 can be evenly laid on the first cutting platform 1 to ensure the correctness of laser cutting / lithography and improve the accuracy of laser cutting / lithography.

[0035] The second cutting platform 2 is used to fix the passing strip for laser cutting. The second cutting platform 2 also includes a vacuum suction plate 11, which has several vacuum suction holes evenly distributed on it to vacuum-adsorb and fix the passing strip from the bottom. The input end of the second cutting platform 2 is equipped with a driven wheel 12. The driven wheel 12 is positioned lower than the vacuum suction plate 11 on the negative X-axis side of the second cutting platform 2, so that the input and output ends of the strip are pulled in, allowing the strip to be evenly laid on the second cutting platform 2, ensuring correct laser cutting / lithography and improving laser cutting / lithography accuracy. The output end of the second cutting platform 2 is an end-pull module 7272.

[0036] The first cutting platform 1 and the second cutting platform 2 are spaced apart along the X-axis.

[0037] A buffer material pulling module 3 is provided in the space between the first cutting platform 1 and the second cutting platform 2, which are spaced along the X-axis. That is, the buffer material pulling module 3 is located between the output end of the first cutting platform 1 and the input end of the second cutting platform 2. It is used to buffer the material strip between the first cutting platform 1 and the second cutting platform 2. At the same time, during the cutting process, it pulls the material strip output from the output end of the first cutting platform 1 so that the material strip passing through the first cutting platform 1 can be evenly spread on the first cutting platform 1. Simultaneously, it pulls the material strip input from the second cutting platform 2 so that the material strip passing through the second cutting platform 2 can be evenly spread on the second cutting platform 2.

[0038] The buffer feeding module 3 includes a left feeding mechanism 32, a buffer mechanism 31, and a right feeding mechanism 33. Both the left and right feeding mechanisms 32 and 33 include a servo motor 321, a power roller 322 driven by the servo motor 321, a pressure roller 323 located on the power roller 322, and a cylinder 324 for driving the pressure roller 323 closer to or further away from the power roller 322. During feeding, the cylinder 324 drives the pressure roller 323 closer to the power roller 322 for pressing. The power roller 322, driven by the servo motor 321, rotates to tighten the material strip and feed it forward. The buffer mechanism 31 includes a Z-axis linear guide rail 311 and a floating roller assembly 312 slidably mounted on the Z-axis linear guide rail 311. The floating roller assembly 312 can move up and down on the Z-axis linear guide rail 311 to achieve vertical floating. The buffer mechanism 31 also includes a fixed roller 313 fixedly mounted on the side of the Z-axis linear guide rail 311 near the top. The material strip can be routed around the fixed roller 313 via the left pulling mechanism 32 and then output to the second cutting platform 2 via the right pulling mechanism 33, thus achieving a fixed material strip length buffer. Alternatively, the material strip can be routed around the floating roller assembly 312 via the left pulling mechanism 32 and then output to the second cutting platform 2 via the right pulling mechanism 33. This mode allows for dynamic adjustment of the buffered material strip length to meet different production processes. In addition, the buffer mechanism 31 of the buffer pulling module 3 allows the product material strip to be stored between the first cutting platform 1 and the second cutting platform 2 for a certain length. When the right pulling mechanism 33 pulls the material, the left pulling mechanism 32 remains stationary (and vice versa), causing the floating roller assembly 312 of the buffer mechanism 31 to rise and provide a longer material strip to the second cutting platform 2 and the second laser cutting module 6 without affecting the processing of the first cutting platform 1 and the first laser cutting module 5 (and vice versa), enabling the first laser cutting module 5 and the second laser cutting module 6 to process independently.

[0039] Furthermore, due to the buffer feeding module 3 between the first cutting platform 1 and the second cutting platform 2, the material strip between the first laser cutting module 5 and the second laser cutting module 6 can be buffered in length, enabling independent feeding of the left and right material strips. The floating roller assembly 312 further allows for buffering within a certain length range, increasing the processing material strip length. The first laser cutting module 5 and the second laser cutting module 6 can process and cut product strips of different lengths separately, and products of different lengths can be spliced ​​together for cutting, ensuring uniform processing time. Furthermore, it can support dividing areas according to processing time, with the first laser cutting module 5 and the second laser cutting module 6 completing processing simultaneously. When both cutting modules complete their assigned areas within the planned time, they then feed the material strips together to a planned length, and so on. This supports multiple production methods and processes, as well as more complex processing techniques.

[0040] As described above, from the negative X-axis to the positive X-axis, the following components are sequentially arranged: a feeding module 71 with an initial feeding mechanism 711, a first cutting platform 1, a buffer feeding module 3 with a left feeding mechanism 32, a buffer mechanism 31, and a right feeding mechanism 33, a second cutting platform 2, and an end feeding module 7272. This allows the material strips on the first cutting platform 1 and the second cutting platform 2 to be simultaneously or sequentially tightened to be evenly laid on the two cutting platforms, and then fixed by vacuum adsorption. This facilitates material feeding and unloading, ensures flat incoming materials, and is more stable and safer. Different laser cutting modules can operate simultaneously on the first cutting platform 1 and the second cutting platform 2 to improve efficiency and meet different production processes. In addition, since the buffer feeding module 3 with a left feeding mechanism 32, a buffer mechanism 31, and a right feeding mechanism 33 is arranged between the first cutting platform 1 and the second cutting platform 2, the length of the material strip in the middle section can be adjusted according to different production processes or modes. Preferably, on the buffer feeding module 3, the pulling force of the floating roller assembly 312 / fixed roller 313 of the buffer mechanism 31 is less than the frictional force between the pressure roller 323 and the power roller 322 of the left feeding mechanism 32 and the right feeding mechanism 33, so as to ensure the buffering of the material strip segment in the buffer feeding module 3, thereby increasing the length of the material strip to be processed between the first cutting platform 1 and the second cutting platform 2. For small-sized products, the first laser cutting module 5 and the second laser cutting module 6 can be used together to process small products, thereby increasing efficiency. In order to meet the processing needs of different products, the first laser cutting module 5 and the second laser cutting module 6 can also process the same product independently.

[0041] Preferably, the automated laser cutting device further includes an X-axis module 4, a first laser cutting module 5, and a second laser cutting module 6. The first and second laser cutting modules 5 and 6 are movably mounted on the X-axis module 4 and can move left and right along the X-axis linear track of the X-axis module 4. The first cutting platform 1, the buffer feeding module 3, and the second cutting platform 2 are positioned on one side of the X-axis module 4 in the Y-axis direction. The first laser cutting module 5 and the second laser cutting module 6 can perform independent cutting operations on the first cutting platform 1 and the second cutting platform 2 respectively, without interfering with each other, thereby improving production efficiency. Furthermore, the first laser cutting module 5 and the second laser cutting module 6 can simultaneously perform collaborative and linked cutting on the first cutting platform 1 or the second cutting platform 2 to meet the production needs of cutting different products or different cutting processes.

[0042] The first laser cutting module 5 and the second laser cutting module 6 include a Y-axis module 53, a second reflector assembly 51, a Z-axis module 52, a laser cutting head 54, a CCD 55, and a dust collector 56. The Z-axis module 52 is used to move the laser cutting head 54 and / or the CCD 55 vertically. The Y-axis module 53 is used to move the laser cutting head 54, CCD 55, etc., along the Y-axis. The dust collector 56 is used to collect dust generated during the cutting process. The second reflector assembly 51 is used to reflect the laser beam output from the first reflector assembly 81 along the X-axis several times before it exits from the laser cutting head 54 along the Z-axis.

[0043] The feeding module 71 includes an initial feeding mechanism 711, which is disposed in the side space along the negative X-axis of the first cutting platform 1 to feed the material strip of the first cutting platform 1 from the beginning. The initial feeding mechanism 711 includes a servo motor 321, a power roller 322 driven by the servo motor 321, a pressure roller 323 located on the power roller 322, and a cylinder 324 for driving the pressure roller 323 to move closer to or away from the power roller 322. The end-pull module 7272, the unloading module 71 includes an end-pull mechanism 721, the end-pull module 7272 is disposed in the side space along the positive X-axis of the second cutting platform 2 to pull the material strip of the second cutting platform 2 from the end, the end-pull mechanism 721 includes a servo motor 321, a power roller 322 driven by the servo motor 321, a pressure roller 323 located on the power roller 322, and a cylinder 324 for driving the pressure roller 323 to approach or move away from the power roller 322.

[0044] Preferably, the automated laser cutting device further includes a laser module 9 and a reflection adjustment module 8, wherein the laser module 9 provides two laser outputs. The laser module 9 can consist of two lasers to generate two laser outputs, or a single laser with two laser beam outputs; there is no limitation. The reflection adjustment module 8 is used to reflect the two laser beams from the laser module 9 several times, ultimately forming a beam emitted along the X-axis. These two beams emitted along the X-axis can then be incident on the first laser cutting module 5 and the second laser cutting module 6, respectively. Furthermore, because the reflection adjustment module 8 can reflect the two laser beams from the laser module 9 several times to form a beam emitted at a fixed position along the X-axis, during the cutting process, the first laser cutting module 5 and the second laser cutting module 6 can accurately receive the incident beam emitted along the X-axis at all times while moving along the X-axis module 4, improving the efficiency and effectiveness of laser cutting. Preferably, the reflection adjustment module 8 includes a plurality of first reflector assemblies 81 and an adjustment slide 82 disposed below the first reflector assemblies 81. The adjustment slide 82 can be moved to a certain extent in the Y and Z directions to accommodate different lasers; that is, the direction and position between the first reflector assemblies 81 can be precisely adjusted by the adjustment slide 82 to improve the accuracy / efficiency of laser beam reflection and reception by the first reflector assemblies 81. Alternatively, the first laser cutting module 5 and the second laser cutting module 6 can use different types of lasers to meet the needs of products with multiple processing technologies combined, processing the same product in separate processes on the overlapping areas of the processed material strips.

[0045] refer to Figures 5 to 8 The laser cutting automation device of this invention supports cutting products of various sizes or types and can meet at least three different processing techniques, such as: refer to Figure 5 For products with small dimensions, the first laser cutting module 5 and the second laser cutting module 6 can be processed together, increasing efficiency. like Figure 5 As shown Firstly, for smaller products, the first laser cutting module 5 and the second laser cutting module 6 can process them simultaneously. The first laser cutting module 5 and the second laser cutting module 6 respectively cut a portion of the products flowing through the material strip on the first cutting platform 1 and the second cutting platform 2, and finally complete the processing of all products on the material strip. Because the first laser cutting module 5 and the second laser cutting module 6 can process simultaneously without interference, they jointly complete the processing of all products on the material strip. Secondly, the buffer feeding module 3 area can buffer finished products or products to be processed. The type of products buffered in the buffer feeding module 3 area can be selected based on the processing efficiency of the first laser cutting module 5 and the second laser cutting module 6 and the number of products allocated.

[0046] The buffer products in the buffer material feeding module 3 area can also be used as a buffer to adjust the processing of the products by one of the first laser cutting module 5 and the second laser cutting module 6, so as to match the efficiency of the two laser cutting modules or the efficiency of two different processes, thereby maximizing the processing efficiency.

[0047] refer to Figure 6 For products whose length does not exceed the length of the strip in the areas of the first cutting platform 1, the second cutting platform 2, and the buffer feeding module 3, the first laser cutting module 5 and the second laser cutting module 6 can independently cut the same product. Firstly, for larger products, but not exceeding the length of the strip in the areas of the first cutting platform 1, the second cutting platform 2, and the buffer feeding module 3, the first laser cutting module 5 and the second laser cutting module 6 can independently process the products on the strip in these areas, cutting identical products independently. Finally, all products on the strip are processed. Because the first laser cutting module 5 and the second laser cutting module 6 can process simultaneously without interference, they collectively complete the processing of all products on the strip. Secondly, for products in the buffer feeding module 3 area, the already processed / carried segments can be buffered, ensuring that both the first laser cutting module 5 and the second laser cutting module 6 have products being processed simultaneously, improving processing efficiency and simultaneously meeting the processing needs of larger products, but not exceeding the length of the strip in the areas of the first cutting platform 1, the second cutting platform 2, and the buffer feeding module 3.

[0048] refer to Figure 7 For products that are too long (exceeding the length of the material strip of the first cutting platform 1, the second cutting platform 2 and the buffer material pulling module 3), the first laser cutting module 5 and the second laser cutting module 6 each process a portion of the area within a specified time, and these areas are then assembled into a complete product.

[0049] like Figure 7 Because the product size is too long (exceeding the length of the material strip of the first cutting platform 1, the second cutting platform 2, and the buffer material pulling module 3), the first laser cutting module 5 and the second laser cutting module 6 process it separately, dividing the product into cuts of different lengths. Through the buffer material pulling module 3, the length of the material strip that can be processed on both the left and right sides can be increased. Within a uniform time, the first laser cutting module 5 and the second laser cutting module 6 complete their respective processing areas. The material pulling mechanism / module transports the material strip to the next processing area and performs photo-positioning processing to complete the splicing, thereby improving processing efficiency and meeting the processing needs of products that are too long and exceed the length of the material strip of the first cutting platform 1, the second cutting platform 2, and the buffer material pulling module 3.

[0050] refer to Figure 8 For products where different lasers can be used on the left and right sides, multiple processing techniques can be combined. like Figure 8 Two laser cutting modules, each using a different laser and employing different processes, perform cutting. After processing on the first cutting platform 1, the laser moves to the second cutting platform 2 for laser cutting by the second laser cutting module 6, completing different processing techniques and fulfilling product requirements. This approach also improves production efficiency and allows for the combined and coordinated use of two different processes to meet various product needs.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0052] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. An automated laser cutting device, characterized in that, include: The system comprises a first laser cutting module, a second laser cutting module, and an X-axis module. The first and second laser cutting modules are movably mounted on the X-axis module and can move left and right along the X-axis. The first cutting platform, the buffer material pulling module, and the second cutting platform are sequentially arranged along the X-axis in a lateral space along the Y-axis direction of the X-axis module. The first cutting platform and the second cutting platform are spaced apart along the X-axis, and the buffer material pulling module is disposed between the first cutting platform and the second cutting platform; The buffer material pulling module includes a left material pulling mechanism, a buffer mechanism, and a right material pulling mechanism. The left material pulling mechanism can pull the material strip passing through the first cutting platform from the output end, and the right material pulling mechanism can pull the material strip passing through the second cutting platform from the input end. The left and right pulling mechanisms of the buffer pulling module each include a first servo motor, a first power roller driven by the first servo motor, a first pressing roller located on the first power roller, and a first cylinder for driving the first pressing roller to move closer to or away from the first power roller. The buffer mechanism includes a Z-axis linear guide, a floating roller assembly slidably disposed on the Z-axis linear guide, and / or a fixed roller fixedly disposed on the side of the Z-axis linear guide towards the top position. The buffer mechanism is capable of buffering the material strip between the left pulling mechanism and the right pulling mechanism.

2. The automated laser cutting device according to claim 1, characterized in that, Both the first cutting platform and the second cutting platform include a vacuum suction plate and a driven wheel. The driven wheel is positioned in the side space of the first cutting platform along the positive X-axis at a position lower than the vacuum suction plate, or the driven wheel is positioned in the side space of the second cutting platform along the negative X-axis at a position lower than the vacuum suction plate.

3. The automated laser cutting device according to claim 2, characterized in that, It also includes a feeding module, which includes an initial feeding mechanism. The initial feeding mechanism is disposed in the side space along the negative X-axis of the first cutting platform to feed the material strip of the first cutting platform from the beginning. The initial feeding mechanism includes a second servo motor, a second power roller driven by the second servo motor, a second pressing roller located on the second power roller, and a second cylinder for driving the second pressing roller to move closer to or away from the second power roller.

4. The automated laser cutting device according to claim 3, characterized in that, It also includes an end-pull module, which includes an end-pull mechanism. The end-pull module is disposed in the side space along the positive X-axis of the second cutting platform to pull the material strip of the second cutting platform from the end. The end-pull mechanism includes a third servo motor, a third power roller driven by the third servo motor, a third pressure roller located on the third power roller, and a third cylinder for driving the third pressure roller to move closer to or away from the third power roller.

5. The automated laser cutting device according to any one of claims 1 to 4, characterized in that, It also includes a laser module and a reflection adjustment module. The laser module has two laser beam outputs. The reflection adjustment module can reflect the two laser beam outputs of the laser module several times to finally form a beam emitted along the X-axis, which can then be incident on the first laser cutting module and the second laser cutting module respectively.

6. The automated laser cutting device according to claim 5, characterized in that, The reflection adjustment module includes a plurality of first reflector assemblies and an adjustment slide disposed below the first reflector assemblies. The adjustment slide is capable of adjusting the orientation and / or three-dimensional coordinates of the first reflector assemblies.

7. The automated laser cutting device according to claim 5, characterized in that, The laser module includes two different lasers, each outputting two different laser beams to enable the first laser cutting module and the second laser cutting module to cut using different processes.

8. The automated laser cutting device according to claim 5, characterized in that, Both the first laser cutting module and the second laser cutting module include a Y-axis module, a second reflector assembly, a Z-axis module, and a laser cutting head. The Y-axis module is used for the movement of the laser cutting head along the Y-axis. The second reflector assembly, the Z-axis module, and the laser cutting head are mounted on the Y-axis module. The Z-axis module can drive the laser cutting head to move along the Z-axis. The second reflector assembly can reflect the light beam emitted from the reflection adjustment module several times before it is emitted from the laser cutting head along the Z-axis.

9. The automated laser cutting device according to claim 8, characterized in that, Both the first laser cutting module and the second laser cutting module further include a CCD and a dust collection hood. The CCD is used for product identification / positioning, and the dust collection hood is used for collecting dust generated during the cutting process.

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