A laser etching apparatus and etching method

Abstract

The application provides a kind of laser etching equipment and etching method, comprising: first workstation;The first workstation is connected with first support and second support;The first support one end is equipped with conveying feed device;The second support one end is equipped with conveying discharge device;Support frame is fixedly connected with the first workstation;The support frame is provided with laser device;The first workstation is connected with second workstation;The second workstation is connected with third workstation;Visual camera is arranged on the side of the third workstation;The substrate guide device is arranged on the side of the third workstation;The first drive device is arranged on the side of the first workstation;The guide rail is arranged on the side of the first workstation;Arc-shaped guide rail is arranged on the side of the second workstation;The application improves the automation degree of laser etching equipment, production efficiency, through multilayer workstation support and action adjustment, can improve the positioning accuracy of substrate on platform, thereby improving the etching precision of substrate.

Description

Technical Field

[0001] This invention relates to the field of laser etching technology, and in particular to a laser etching device and etching method. Background Technology

[0002] A laser etching machine is a device that uses a high-energy laser beam to etch, cut, engrave, and mark the surface of materials. It mainly consists of a laser, a beam control system, a worktable, and other auxiliary systems. Laser etching machines are high-precision processing equipment capable of precisely processing various materials.

[0003] Currently, laser processing equipment plays an important role in many fields. As an important piece of equipment in various industries, laser etching equipment is increasingly widely used. With the continuous increase in market demand and the continuous increase in substrate size, the requirements for the automation level and processing accuracy of laser etching equipment are getting higher and higher. The automation level of existing laser etching platforms is relatively low, and the production cost is relatively high. At the same time, the support, movement and positioning accuracy of laser equipment is relatively low, which affects the accuracy of substrate etching. Summary of the Invention

[0004] This invention provides a laser etching device and etching method to solve the problems of low automation, low production efficiency, insufficient positioning accuracy, insufficient support accuracy and insufficient motion accuracy of laser etching devices.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows:

[0006] A laser etching apparatus, comprising:

[0007] First workbench;

[0008] The first workbench is connected to the first support and the second support;

[0009] A feeding device is installed at one end of the first support;

[0010] The second support is equipped with a conveying and discharging device at one end;

[0011] The support frame is fixedly connected to the first workbench;

[0012] The support frame is equipped with a laser device;

[0013] The first workbench is connected to the second workbench;

[0014] The second workbench is connected to the third workbench;

[0015] A vision camera is installed on the side of the third workbench;

[0016] A substrate straightening device is provided on the side of the third workbench;

[0017] A first drive device is provided on one side of the first workbench;

[0018] A guide rail is provided on one side of the first worktable, and the second worktable is driven to move on the guide rail by the first driving device.

[0019] Optionally, an arc-shaped guide rail is installed at one end of the second worktable;

[0020] The second workbench is connected to the third workbench via the arc-shaped guide rail.

[0021] Optionally, a second driving device is provided, which drives the third worktable to rotate via the arc-shaped guide rail.

[0022] Optionally, the first bracket is connected to a first lifting mechanism;

[0023] The first lifting mechanism is used to adjust the height of the conveying and feeding device.

[0024] Optionally, the second bracket is connected to a second lifting mechanism;

[0025] The second lifting mechanism is used to adjust the height of the conveying and discharging device.

[0026] Optionally, the conveying and feeding device includes a first conveyor wheel and a first conveyor belt disposed on the first conveyor wheel;

[0027] A transverse groove is provided on one side of the third workbench. When the conveying and feeding device is in operation, the substrate falls into the transverse groove through the first conveyor belt, which in turn drives the substrate to fall onto the third workbench.

[0028] Optionally, the conveying and discharging device includes a second conveyor wheel and a second conveyor belt disposed on the second conveyor wheel;

[0029] The substrate, after laser etching on the third workbench, is moved to the conveying and unloading device area by the second workbench. The second conveyor belt falls into the transverse groove, carrying the substrate to the downstream process.

[0030] The present invention also provides a laser etching method, the method comprising:

[0031] Provide pre-processed substrates;

[0032] The substrate is conveyed to the surface of the third worktable by a conveying and feeding device, and the substrate is guided by a substrate guiding device. At this time, the reference point on the substrate enters the field of view of the vision camera. The first driving device and the second driving device of the second worktable and the third worktable accurately guide the substrate according to the position identified by the vision camera.

[0033] The first driving device drives the second worktable to move on the guide rail, and drives the substrate on the third worktable to be etched through the laser etching area;

[0034] After etching, the substrate is transported to the downstream process via a conveying and unloading device.

[0035] Optionally, during the laser etching stage, the vision camera feeds back the reference point on the substrate to the laser device to adjust the starting position of the substrate etching.

[0036] The above-described solution of the present invention has at least the following beneficial effects:

[0037] The above-described solution of the present invention includes: a first worktable; the first worktable being connected to a first support and a second support; a feeding device being installed at one end of the first support; a discharging device being installed at one end of the second support; a support frame being fixedly connected to the first worktable; a laser device being provided on the support frame; the first worktable being connected to the second worktable; the second worktable being connected to a third worktable; a vision camera being provided on the side of the third worktable; a substrate guiding device being provided on the side of the third worktable; a first driving device being provided on one side of the first worktable; and a guide rail being provided on one side of the first worktable, wherein the second worktable is driven to move on the guide rail by the first driving device. The technical solution of the present invention improves the automation level and production efficiency of laser etching equipment. By using a multi-layered worktable for support, the deformation of the laser etching platform is minimized during the laser etching process. Furthermore, by employing multiple precise positioning adjustments on the substrate, the etching accuracy of the substrate is improved. Attached Figure Description

[0038] Figure 1 This is a combined diagram of a laser etching apparatus according to an embodiment of the present invention;

[0039] Figure 2 This is a triaxial view of the laser etching apparatus according to an embodiment of the present invention;

[0040] Figure 3 This is a schematic diagram of the lifting structure of a laser etching apparatus according to an embodiment of the present invention;

[0041] Figure 4 This is a schematic diagram of the guide rail of a laser etching device according to an embodiment of the present invention;

[0042] Figure 5 This is a top view of a laser etching apparatus according to an embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of the arc-shaped guide rail of the laser etching equipment according to an embodiment of the present invention;

[0044] Explanation of reference numerals in the attached figures

[0045] 1. First worktable; 2. First support; 3. Second support; 4. Conveying feeding device; 5. Conveying discharging device; 6. Support frame; 7. Laser device; 8. Second worktable; 9. Third worktable; 10. Vision camera; 11. Substrate guiding device; 12. First driving device; 13. Guide rail; 14. Arc-shaped guide rail; 15. Second driving device; 16. First lifting mechanism; 17. Second lifting mechanism; 18. First conveyor wheel; 19. First conveyor belt; 20. Transverse groove; 21. Substrate; 22. Second conveyor wheel; 23. Second conveyor belt. Detailed Implementation

[0046] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0047] like Figures 1 to 6 As shown, an embodiment of the present invention provides a laser etching apparatus, comprising:

[0048] First workbench 1;

[0049] The first workbench 1 is connected to the first support 2 and the second support 3;

[0050] The first support 2 is equipped with a feeding device 4 at one end;

[0051] The second support 3 is equipped with a conveying and discharging device 5 at one end;

[0052] The support frame 6 is fixedly connected to the first workbench 1;

[0053] The support frame 6 is equipped with a laser device 7;

[0054] The first workbench 1 is connected to the second workbench 8;

[0055] The second workbench 8 is connected to the third workbench 9;

[0056] The third workbench 9 is equipped with a vision camera 10;

[0057] The third workbench 9 is equipped with a substrate alignment device 11;

[0058] A first drive device 12 is provided on one side of the first workbench 1;

[0059] The first workbench 1 is provided with a guide rail 13 on one side, and the second workbench 8 is driven to move on the guide rail 13 by the first drive device 12.

[0060] In this embodiment, a first workbench 1 is provided. The first workbench 1 can be a marble platform. Marble platforms have a dense structure, smooth and wear-resistant surface, low roughness value, stable material, will not deform, are acid-resistant, alkali-resistant, corrosion-resistant, antimagnetic, will not get damp and rust, are easy to use and maintain, have a small coefficient of linear expansion, are less affected by temperature, and when the working surface is hit or scratched, only pits will be produced, without protrusions or burrs, which will not affect the measurement accuracy. The first workbench 1 is connected to a first support 2 and a second support 3. The first support 2 includes two sets of oppositely arranged supports, and the second support 3 includes two sets of oppositely arranged supports. The first support 2 and the second support 3 can be bolted to the first workbench 1.

[0061] The first support 2 is equipped with a feeding device 4 at one end; the second support 3 is equipped with a discharging device 5 at one end.

[0062] The platform's feeding and discharging are automated. The feeding device 4 includes the first support 2, the first conveyor belt 19, and the first conveyor wheel 18. The discharging device 5 consists of the second conveyor belt 23 and the second conveyor wheel 22. During feeding, the first lifting mechanism 16 lifts the feeding device 4, and the first conveyor belt 19 transports the substrate 21 to the position of the third worktable 9. The first lifting mechanism 16 then descends, causing the feeding device to descend. The first conveyor belt 19 descends into the transverse groove 20 of the third worktable 9, and the substrate 21 falls onto the third worktable 9. The discharging device 5 then transports the substrate 21 to the next process after laser etching.

[0063] The support frame 6 is fixedly connected to the first workbench 1; the support frame 6 is equipped with a laser device 7; there are multiple laser devices 7, and in practice, multiple rows of laser devices 7 can be arranged as needed.

[0064] The first workbench 1 is slidably connected to the second workbench 8; the second workbench 8 is rotatably connected to the third workbench 9; a first driving device 12 is provided on one side of the first workbench 1; a guide rail 13 is provided on one side of the first workbench 1, and the second workbench 8 is driven to move on the guide rail 13 by the first driving device 12.

[0065] The third workbench 9 is equipped with a vision camera 10 and a substrate guiding device 11. The substrate 21 is positioned more accurately after multiple positioning processes. When the substrate 21 is conveyed to the third workbench 9 by the conveying and feeding device 4, the substrate guiding device 11 on the side wall of the third workbench 9 guides the substrate to be aligned, completing the initial positioning. At this time, the substrate 21 is provided with multiple reference points (mark points). The reference points of the substrate 21 after the initial positioning are placed into the field of view of the vision camera 10 distributed on the platform. Based on the position information fed back by the vision camera 10, the first driving device 12 controls the second workbench 8 to move on the guide rail 13, and the second driving device 15 controls the third workbench 9 to rotate through the arc-shaped guide rail 14, thus completing the precise positioning of the substrate 21.

[0066] The technical solution of this invention improves the automation level and production efficiency of laser etching equipment. By using a multi-layer worktable for support, the deformation of the laser etching platform is small during the laser etching process. By using multiple precise positioning adjustments on the substrate, the etching quality of the substrate is improved.

[0067] In an optional embodiment of the present invention, an arc-shaped guide rail 14 is installed on one end of the second worktable 8;

[0068] The second workbench 8 is connected to the third workbench 9 via the arc-shaped guide rail 14.

[0069] In this embodiment, an arc-shaped guide rail 14 is installed on one end of the second workbench 8; the other end of the arc-shaped guide rail 14 is connected to the third workbench 9.

[0070] In an optional embodiment of the present invention, a second driving device 15 is provided, which can drive the third worktable 9 to rotate along the arc-shaped guide rail.

[0071] In this embodiment, the second driving device 15 is disposed at one end of the second worktable 8. The second driving device 15 can drive the third worktable 9 to rotate along the arc-shaped guide rail, so that the third worktable 9 can be adjusted left and right, thereby driving the substrate 21 to be adjusted to a suitable laser etching position.

[0072] In an optional embodiment of the present invention, the first support 2 is connected to a first lifting mechanism 16;

[0073] The first lifting mechanism 16 is used to adjust the height of the conveying and feeding device 4.

[0074] In this embodiment, the first support 2 is connected to a first lifting mechanism 16. The first lifting mechanism 16 can be a pneumatic device, or other devices can be selected as needed. The first lifting mechanism 16 is used to adjust the height of the conveying and feeding device 4.

[0075] During feeding, the first lifting mechanism 16 lifts the conveying feeding device 4, and the first conveyor belt 19 transports the substrate 21 to the position of the third worktable 9. The first lifting mechanism 16 then descends, causing the conveying device to descend, and the first conveyor belt 19 descends into the transverse groove 20 of the third worktable 9. The substrate 21 falls onto the third worktable 9. After this process is completed, the first lifting mechanism 16 returns to its original position and continues the cycle operation.

[0076] In an optional embodiment of the present invention, the second support 3 is connected to a second lifting mechanism 17;

[0077] The second lifting mechanism 17 is used to adjust the height of the conveying and discharging device 5.

[0078] In this embodiment, the second support 3 is connected to a second lifting mechanism 17. The second lifting mechanism 17 can be a pneumatic device, or other devices can be selected as needed. The second lifting mechanism 17 is used to adjust the height of the conveying and discharging device 5.

[0079] During material discharge, the second lifting mechanism 17 lowers the conveying and discharging device 5 into the transverse groove 20 of the third worktable 9. After the laser-etched substrate 21 is conveyed to the conveying and discharging device 5, the second lifting mechanism 17 lifts the conveying and discharging device 5 and then transports it to the downstream process.

[0080] In an optional embodiment of the present invention, the conveying and feeding device 4 includes a first conveying wheel 18 and a first conveyor belt 19 disposed on the first conveying wheel 18;

[0081] A transverse groove 20 is provided on one side of the third workbench 9. When the conveying and feeding device 4 is in operation, the material falls into the transverse groove 20 through the first conveyor belt 19, which in turn drives the substrate 21 to fall onto the third workbench 9.

[0082] In this embodiment, the conveying and feeding device 4 includes a first conveying wheel 18 and a first conveyor belt 19 disposed on the first conveying wheel 18; a transverse groove 20 is uniformly disposed on one side of the third worktable 9. When the conveying and feeding device 4 passes to the top of the third worktable 9, the conveying and feeding device 4 descends and falls into the transverse groove 20 through the first conveyor belt 19, thereby driving the substrate 21 to fall onto the third worktable 9.

[0083] In an optional embodiment of the present invention, the conveying and discharging device 5 includes a second conveying wheel 22 and a second conveyor belt 23 disposed on the second conveying wheel 22;

[0084] The substrate 21, after laser etching on the third workbench 9, is moved to the area of ​​the conveying and unloading device 5 by the second workbench 8. The second conveyor belt 23 enters the transverse groove 20, and the substrate 21 is transported to the downstream process.

[0085] In this embodiment, the conveying and unloading device 5 includes a second conveyor wheel 22 and a second conveyor belt 23 disposed on the second conveyor wheel 22; the substrate 21, which has been laser-etched on the third worktable 9, is moved to the area of ​​the conveying and unloading device 5 by the second worktable 8, the second conveyor belt 23 enters the transverse groove 20, and the second lifting mechanism 17 installed on the conveying and unloading device 5 rises, driving the substrate 21 away from the third worktable 9, and the substrate 21 is transported to the downstream process by the conveying and unloading device 5.

[0086] The present invention also provides a laser etching method, the method comprising:

[0087] Provide the pre-processed substrate 21;

[0088] The substrate 21 is conveyed to the surface of the third workbench 9 by the conveying and feeding device 4. The substrate 21 is guided by the substrate guiding device 11. At this time, the reference point on the substrate 21 enters the field of view of the vision camera 10. The first driving device 12 and the second driving device 15 of the second workbench 8 and the third workbench 9 accurately guide the substrate 21 according to the position identified by the vision camera 10.

[0089] The first driving device 12 drives the second worktable 8 to move on the guide rail 13, thereby driving the substrate 21 on the third worktable 9 to be etched through the laser etching area;

[0090] After etching, the substrate 21 is transported to the downstream process via the conveying and unloading device 5.

[0091] In this embodiment, the platform conveying feeding device 4 and the conveying discharging device 5 adopt automated conveying. The substrate 21 is conveyed from the previous process to the conveying feeding device 4. The conveying feeding device 4 conveys the substrate 21 to the position above the third workbench 9. The first lifting mechanism 16 descends and the first conveyor belt 19 descends into the transverse groove 20 of the third workbench 9, so that the substrate 21 falls on the third workbench 9.

[0092] When the substrate 21 is conveyed to the third worktable 9 by the conveying and feeding device 4, the substrate guiding device 11 of the third worktable 9 guides the substrate 21 to be aligned and completes the initial positioning. At this time, the reference point of the substrate 21 that has completed the initial positioning enters the field of view of the vision camera 10 distributed on the platform. The position parameters are identified and fed back by the vision camera 10. The first driving device 12 drives the second worktable 8 to move on the guide rail 13. The second driving device 15 drives the third worktable 9 to rotate through the arc-shaped guide rail 14 to complete the precise alignment and positioning of the substrate 21.

[0093] The laser device 7 etches the precisely adjusted and positioned substrate 21. During the laser etching stage, the vision camera 10 installed at the end of the third worktable 9 feeds back the substrate reference point position information to the laser etching component. The laser etching component adjusts the starting etching position according to the initial position information.

[0094] The first driving device 12 controls the second worktable 8 to move on the guide rail 13, driving the third worktable 9 to move forward together, so that the substrate 21 is etched through the laser etching area;

[0095] After etching, the substrate 21 is adjusted by the second lifting mechanism 17 to move the substrate away from the third worktable 9 and is then transported to the back-end process by the conveying and discharging device 5.

[0096] In an optional embodiment of the present invention, during the laser etching stage, the vision camera 10 feeds back the reference point on the substrate 21 to the laser device 7 to adjust the etching start position of the substrate 21.

[0097] In this embodiment, during the laser etching stage, multiple vision cameras 10 feed back the reference points on the substrate 21 to the laser device 7, adjusting the etching start position of the substrate 21 to make the etching of the substrate 21 more precise.

[0098] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A laser engraving apparatus, characterized by, include: First workbench (1); the first workbench (1) is a marble platform; The first workbench (1) is connected to the first support (2) and the second support (3); the first support (2) includes two sets of supports arranged opposite each other, and the second support (3) includes two sets of supports arranged opposite each other; The first support (2) is equipped with a conveying and feeding device (4) at one end; The second support (3) is equipped with a conveying and discharging device (5) at one end; The support frame (6) is fixedly connected to the first workbench (1); The support frame (6) is equipped with a laser device (7); there are multiple laser devices (7); The first workbench (1) is connected to the second workbench (8); The second workbench (8) is connected to the third workbench (9); A vision camera (10) is provided on the side of the third workbench (9). The third workbench (9) is provided with a substrate guiding device (11) on its side. A first drive device (12) is provided on one side of the first workbench (1); The first workbench (1) is provided with a guide rail (13) on one side, and the second workbench (8) is driven to move on the guide rail (13) by the first drive device (12); Arc-shaped guide rail (14) is installed on one end of the second workbench (8); The second workbench (8) is connected to the third workbench (9) via the arc-shaped guide rail (14); The second drive device (15) drives the third worktable (9) to rotate via the arc-shaped guide rail (14); the second drive device (15) is located at one end of the second worktable (8); The conveying and feeding device (4) includes a first conveyor wheel (18) and a first conveyor belt (19) disposed on the first conveyor wheel (18). A transverse groove (20) is provided on one side of the third workbench (9). When the conveying and feeding device (4) is in operation, it falls into the transverse groove (20) through the first conveyor belt (19), which drives the substrate (21) to fall onto the third workbench (9). The transverse groove (20) is evenly provided on one side of the third workbench (9). The conveying and discharging device (5) includes a second conveyor wheel (22) and a second conveyor belt (23) disposed on the second conveyor wheel (22). The substrate (21) laser-etched on the third workbench (9) is moved to the area of ​​the conveying and unloading device (5) by the second workbench (8), and the second conveyor belt (23) falls into the transverse groove (20), which carries the substrate (21) to the back-end process. The first worktable (1) is slidably connected to the second worktable (8); the second worktable (8) is rotatably connected to the third worktable (9); When the substrate (21) is conveyed to the third worktable (9) by the conveying and feeding device (4), the substrate guiding device (11) on the side wall of the third worktable (9) guides the substrate (21) to complete the initial positioning. At this time, the substrate (21) is provided with multiple reference points. The reference points of the substrate (21) after the initial positioning are entered into the field of view of the vision camera (10) distributed on the platform. Based on the position information fed back by the vision camera (10), the first driving device (12) controls the second worktable (8) to move on the guide rail (13). The second driving device (15) controls the third worktable (9) to rotate through the arc guide rail (14) to complete the positioning of the substrate (21). The first driving device (12) drives the second worktable (8) to move on the guide rail (13), and drives the substrate (21) on the third worktable (9) to be etched through the laser etching area. The first bracket (2) and the second bracket (3) are bolted to the first workbench (1); The first support (2) is connected to the first lifting mechanism (16). The first lifting mechanism (16) is used to adjust the height of the conveying and feeding device (4); During feeding, the first lifting mechanism (16) lifts the conveying feeding device (4), the first conveyor belt (19) transports the substrate (21) to the position of the third worktable (9), the first lifting mechanism (16) descends, causing the conveying feeding device (4) to descend, and the first conveyor belt (19) descends into the transverse groove (20) of the third worktable (9), causing the substrate (21) to fall onto the third worktable (9); The second support (3) is connected to the second lifting mechanism (17). The second lifting mechanism (17) is used to adjust the height of the conveying and discharging device (5); During material discharge, the second lifting mechanism (17) lowers the conveying discharge device (5) into the transverse groove (20) of the third worktable (9); the laser-etched substrate (21) is conveyed to the conveying discharge device (5), and the second lifting mechanism (17) lifts the conveying discharge device (5) and transports it to the downstream process. The first lifting mechanism (16) and the second lifting mechanism (17) are pneumatic devices.

2. A laser engraving method, characterized by, The method, applied to the laser etching apparatus as described in claim 1, comprises: Provide a pre-processed substrate (21); The substrate (21) is conveyed to the surface of the third worktable (9) by the conveying and feeding device (4), and the substrate is guided by the substrate guiding device (11). At this time, the reference point on the substrate (21) enters the field of view of the vision camera (10). The first driving device (12) and the second driving device (15) of the second worktable (8) and the third worktable (9) accurately guide the substrate (21) according to the position identified by the vision camera. The first driving device (12) drives the second worktable (8) to move on the guide rail (13), and drives the substrate (21) on the third worktable (9) to be etched through the laser etching area; After etching, the substrate (21) is conveyed to the downstream process via the conveying and unloading device (5); During the laser etching stage, the vision camera (10) feeds back the reference point on the substrate (21) to the laser device (7) to adjust the etching start position of the substrate (21); In this process, the substrate (21) is transferred from the previous process to the conveying and feeding device (4). The conveying and feeding device (4) transfers the substrate (21) to the position above the third worktable (9). The first lifting mechanism (16) descends and the first conveyor belt (19) descends into the transverse groove (20) of the third worktable (9), so that the substrate (21) falls on the third worktable (9). When the substrate (21) is conveyed to the third worktable (9) by the conveying and feeding device (4), the substrate guiding device (11) on the third worktable (9) guides the substrate (21) to complete the initial positioning. At this time, the reference point of the substrate (21) after initial positioning enters the field of view of the vision camera (10) distributed on the platform. The position parameters are identified and fed back by the vision camera (10). The first driving device (12) drives the second worktable (8) to move on the guide rail (13). The second driving device (15) drives the third worktable (9) to rotate through the arc guide rail (14) to complete the guiding and positioning of the substrate (21). The laser device (7) etches the adjusted and positioned substrate (21). During the laser etching stage, the vision camera (10) installed at the end of the third worktable (9) feeds back the reference point position information of the substrate (21) to the laser etching component. The laser etching component adjusts the starting etching position according to the initial position information. The first driving device (12) controls the second worktable (8) to move on the guide rail (13), driving the third worktable (9) to move forward together, so that the substrate (21) is etched through the laser etching area; After etching, the substrate (21) is adjusted by the second lifting mechanism (17) to move the substrate (21) away from the third worktable (9) and transported to the back-end process by the conveying and discharging device (5).

Images