Manipulator control method based on production plan scheduling

By using a robotic arm control method based on production planning and scheduling algorithms, the problem of idle robotic arm operation was solved, and the efficient completion of wafer transfer and equipment efficiency were improved.

CN117754565BActive Publication Date: 2026-07-24BEIJING JINGYI AUTOMATION EQUIP CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING JINGYI AUTOMATION EQUIP CO LTD
Filing Date
2023-12-06
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing robotic arm processes result in one arm of a dual-arm robotic arm running idle, increasing the time required for wafer transfer and affecting wafer yield and equipment production efficiency.

Method used

A robotic arm control method based on production planning and scheduling algorithms is adopted. By acquiring wafer information of the wafer carrier layer and classifying it, the first and second types of carrier layers are determined. The robotic arm operation is controlled according to the shortest wafer transfer process to ensure that the robotic arm operates at full capacity.

Benefits of technology

It effectively reduces the time required for wafer transfer, ensuring that the wafer transfer process is completed in the shortest possible time, thereby improving the wafer output rate and production efficiency of wafer manufacturing equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN117754565B_ABST
    Figure CN117754565B_ABST
Patent Text Reader

Abstract

The application relates to the technical field of semiconductor production, and provides a manipulator control method based on production plan scheduling. The manipulator control method based on the production plan scheduling algorithm comprises the following steps: obtaining wafer information of a wafer carrier layer, classifying the wafer carrier layer according to the wafer information, obtaining a first type of carrier layer and a second type of carrier layer; based on a wafer transferring process of the wafer carrier layer, scheduling production of the wafer carrier layer, and determining a shortest-time wafer transferring process; and according to the wafer information and the shortest-time wafer transferring process, controlling the operation of a manipulator to complete wafer transferring. The manipulator control method based on the production plan scheduling can effectively reduce the process time of wafer transferring, ensure that the wafer transferring process can be completed in the shortest process time, effectively ensure the wafer delivery rate of wafer manufacturing equipment, and improve the production efficiency of the equipment.
Need to check novelty before this filing date? Find Prior Art