UV adhesive curing method and bonding method for glass back panel assembly

Abstract

This application provides a UV adhesive curing method for curing UV adhesives with uneven thickness, comprising: controlling the temperature of the UV adhesive to T1; irradiating the UV adhesive with a UV light source with an illuminance of E1, keeping the UV adhesive completely liquid, for an irradiation time of t1; raising the temperature of the irradiated UV adhesive and controlling the temperature to T2; irradiating the UV adhesive with a UV light source with an illuminance of E2, ensuring that the UV adhesive is completely cured, for an irradiation time of t2, where t2 is greater than t1 and E2 is less than E1. This application also provides a method for bonding a glass backsheet assembly. The above-mentioned UV adhesive curing method and glass backsheet assembly bonding method, by irradiating the UV adhesive with low-temperature strong light and high-temperature weak light sequentially, can delay the curing of the UV adhesive surface layer, which is beneficial for the uniformity of UV adhesive curing, thereby improving the quality of the cured UV adhesive.

Description

Technical Field

[0001] This application relates to the field of adhesive curing technology, specifically to a UV adhesive curing method and a bonding method for glass backsheet assemblies. Background Technology

[0002] During the curing process, UV (Ultraviolet Rays) adhesives generally need to go through the following stages in sequence: bond energy breaking of the photoinitiator (chain initiation), monomer polymerization (chain growth), and monomer crosslinking (chain transfer). Among these, chain initiation is mainly affected by ultraviolet irradiance, while chain growth and chain transfer are mainly affected by the temperature.

[0003] Currently, liquid UV adhesive is typically placed in a constant-temperature environment and irradiated with a UV light source at a fixed illuminance to achieve curing. However, when using this constant-temperature, constant-illuminance method to cure glass and backsheet to form a glass backsheet assembly, the thickness of the liquid UV adhesive injected between the glass and backsheet is uneven. The UV adhesive closer to the UV light source, due to prolonged irradiation, accumulates excessive energy on its surface, easily turning yellow and creating a yellow area between the glass and backsheet, thus reducing the quality of the glass backsheet assembly. Conversely, the UV adhesive further away from the light source has weak UV penetration and slower chain initiation, resulting in weaker curing and a higher likelihood of delamination, leading to easy separation of the glass and backsheet in the glass backsheet assembly. Summary of the Invention

[0004] In view of the above, it is necessary to provide a UV adhesive curing method and a glass backing assembly bonding method to improve the quality of the UV adhesive after curing.

[0005] This application provides a UV adhesive curing method for curing UV adhesives with uneven thickness, including:

[0006] The UV adhesive is heated to T1;

[0007] The UV adhesive is irradiated with a UV light source with an illuminance of E1, and the UV adhesive is kept completely in a liquid state for an irradiation time of t1.

[0008] The UV adhesive after irradiation is heated and the temperature is controlled to T2;

[0009] The UV adhesive is irradiated with a UV light source with an illuminance of E2 until it is completely cured. The irradiation time is t2, where t2 is greater than t1 and E2 is less than E1.

[0010] In some embodiments, the UV adhesive includes a resin, an active monomer, a cationic initiator, and a crosslinking agent.

[0011] In some embodiments, T1 ranges from 5°C to 10°C, and T2 ranges from 40°C to 50°C.

[0012] In some embodiments, E1 ranges from 450 mW / cm². 2 ~550mW / cm 2 The range of E2 is 150mW / cm. 2 ~250mW / cm 2 .

[0013] In some embodiments, t1 ranges from 0.5 min to 1 min, and t2 ranges from 2 min to 3 min.

[0014] In some embodiments, the UV adhesive curing method further includes:

[0015] Turn off the UV light source and the temperature control mechanism used for temperature control, and let the cured UV adhesive stand for a predetermined time;

[0016] The temperature control mechanism reduces the temperature of the UV adhesive to room temperature by circulating cold water or cold air.

[0017] This application embodiment also provides a method for bonding a glass backplate assembly, including:

[0018] Adhere the glass and the back panel, and create an adhesive injection space between the glass and the back panel;

[0019] UV adhesive is injected into the injection space, and the thickness of the UV adhesive in the injection space is uneven;

[0020] The UV adhesive is heated to T1;

[0021] The UV adhesive is irradiated with a UV light source with an illuminance of E1, and the UV adhesive is kept completely in a liquid state for an irradiation time of t1.

[0022] The UV adhesive after irradiation is heated and the temperature is controlled to T2;

[0023] The UV adhesive is irradiated with a UV light source with an illuminance of E2 and completely cured for a duration of t2, wherein t2 is greater than t1 and E2 is less than E1. The glass and the back panel are fixedly connected by the cured UV adhesive to form a glass back panel assembly.

[0024] In some embodiments, the UV adhesive includes a resin, an active monomer, a cationic initiator, and a crosslinking agent.

[0025] In some embodiments, T1 ranges from 5°C to 10°C, T2 ranges from 40°C to 50°C, and E1 ranges from 450 mW / cm². 2 ~550mW / cm2 The range of E2 is 150mW / cm. 2 ~250mW / cm 2 The range of t1 is 0.5 min to 1 min, and the range of t2 is 2 min to 3 min.

[0026] In some embodiments, the bonding method of the glass backplane assembly further includes:

[0027] Turn off the UV light source and the temperature control mechanism used for temperature control, and let the glass back panel assembly stand still for a predetermined time;

[0028] The temperature control mechanism reduces the temperature of the glass back panel assembly to room temperature by circulating cold water or cold air.

[0029] In the aforementioned UV adhesive curing method and glass backsheet assembly bonding method, the UV adhesive, which has an uneven thickness, is cured by irradiating it twice. Specifically, compared to the second irradiation, the first irradiation uses a combination of low temperature and strong light. Low temperature helps to limit chain growth and chain transfer in the UV adhesive, reducing the curing rate of the UV adhesive. Strong light helps to sequentially activate the photoinitiators in the shallow and deep layers of the UV adhesive before the UV adhesive cures. Compared to the first irradiation, the second irradiation uses a combination of high temperature and weak light. Weak light helps to prevent the UV adhesive surface from accumulating too much energy and turning yellow. High temperature helps to accelerate chain growth and chain transfer in the UV adhesive, thereby causing the UV adhesive to change from a liquid state to a solid state and achieve UV adhesive curing.

[0030] Therefore, the above-mentioned UV adhesive curing method and glass back panel assembly bonding method use low-temperature strong light and high-temperature weak light to irradiate the UV adhesive with uneven thickness in sequence. This can delay the curing of the UV adhesive surface layer, which helps to reduce yellowing caused by excessive accumulated energy on the UV adhesive surface layer. It also allows the photoinitiator in the UV adhesive with different thicknesses to be activated before the UV adhesive surface layer cures, which helps the curing of the UV adhesive with uneven thickness to become more uniform, thereby improving the quality of the UV adhesive after curing. Attached Figure Description

[0031] Figure 1 This is a schematic flowchart of the UV adhesive curing method in an embodiment of this application.

[0032] Figure 2 This is a schematic diagram of the UV adhesive curing device according to an embodiment of this application.

[0033] Figure 3 This is a schematic flowchart of the bonding method for the glass backplate assembly according to an embodiment of this application.

[0034] Figure 4 This is a cross-sectional schematic diagram of the glass backplate assembly according to an embodiment of this application.

[0035] Explanation of main component symbols

[0036] UV adhesive curing device 100

[0037] Box 110

[0038] Curing space 110a

[0039] Jig 120

[0040] Fan 130

[0041] Cold water circulation system 140

[0042] UV light source 150

[0043] Heating system 160

[0044] Hot melt adhesive 200

[0045] Glass 300

[0046] Back panel 400

[0047] 400a injection space

[0048] Mid-frame 410

[0049] 420mm border

[0050] UV adhesive 500 Detailed Implementation

[0051] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0052] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0053] The embodiments of this case will be described in detail below with reference to the accompanying drawings.

[0054] Please see Figure 1 This application provides a UV adhesive curing method for curing UV adhesives with uneven thickness. The UV adhesive curing method includes:

[0055] S110, control the temperature of the UV adhesive to T1.

[0056] Specifically, controlling the temperature of the UV adhesive to T1 means maintaining the temperature of the space where the UV adhesive is located at T1.

[0057] In this embodiment, T1 ranges from 5℃ to 10℃, and T1 can be any one of 5℃, 6℃, 7℃, 8℃, 9℃, and 10℃. Preferably, T1 is 8℃.

[0058] Therefore, by properly configuring the temperature T1, the UV adhesive can be placed in a relatively low-temperature environment, facilitating the initial irradiation of the UV adhesive by the UV light source. Furthermore, the lower temperature reduces the flow of the UV adhesive, which is beneficial to its stability before irradiation by the UV light source.

[0059] In this embodiment, the UV adhesive includes resin, active monomer, cationic initiator, and crosslinking agent, enabling the UV adhesive to undergo cationic polymerization upon exposure to ultraviolet light. Specifically, the resin accounts for 30% to 50% of the composition and can be cyclic aliphatic oxides, cyclic ethers, cyclic sulfides, etc.; the active monomer accounts for 40% to 60% of the composition and can be monofunctional, difunctional, or polyfunctional; the cationic initiator accounts for 1% to 6% of the composition and can be a protic acid, carbocation, etc.; and the crosslinking agent accounts for 0.2% to 1% of the composition and can be a surfactant.

[0060] S120, the UV adhesive is irradiated with a UV light source with an illuminance of E1, and the UV adhesive is kept in a liquid state for a duration of t1.

[0061] Specifically, the UV light source can have its illuminance, irradiation duration, and other parameters set and adjusted based on irradiation requirements. The thickness of the UV adhesive refers to its length along the direction parallel to the UV light source irradiation. Uneven UV adhesive thickness means that the thickness varies along the direction perpendicular to the UV light source irradiation.

[0062] In this embodiment, E1 ranges from 450mW / cm. 2 ~550mW / cm 2 E1 can reach 450mW / cm 2 450mW / cm 2 450mW / cm 2 Any one of them. Preferably, E1 is 450mW / cm. 2 .

[0063] Therefore, by properly configuring the E1 value, yellowing of the UV adhesive surface can be avoided, and photoinitiators deep within the UV adhesive can be prevented from activating. Specifically, if E1 is greater than 550mW / cm²,2 Excessive UV light intensity can cause excessive energy accumulation on the surface of the UV adhesive, leading to yellowing of the adhesive surface. If E1 is less than 450mW / cm², this can cause the adhesive to yellow. 2 If the UV light source is weak, the ultraviolet rays emitted by the UV light source will penetrate only a shallow layer of the UV adhesive and will not be able to activate the photoinitiator located deep within the UV adhesive.

[0064] In this embodiment, t1 ranges from 0.5 min to 1 min, and t1 can be any one of 0.5 min, 0.6 min, 0.7 min, 0.8 min, 0.9 min, and 1 min. Preferably, t1 is 1 min.

[0065] Therefore, by properly configuring the value of t1, yellowing of the UV adhesive surface can be avoided and the photoinitiator in the UV adhesive can be fully activated by the UV light source. Specifically, if t1 is less than 0.5 min, the UV light source will irradiate the UV adhesive for a short time, which will not be enough to fully activate the photoinitiator in the UV adhesive. If t1 is greater than 1 min, the accumulated energy on the surface of the UV adhesive will be too large, making it prone to yellowing.

[0066] S130, heat the irradiated UV adhesive and control the temperature to T2.

[0067] In this embodiment, T2 ranges from 40°C to 50°C, and T2 can be any one of 40°C, 45°C, and 50°C. Preferably, T2 is 45°C.

[0068] Therefore, by properly configuring the T2 temperature, yellowing of the UV adhesive after curing can be avoided, and the curing rate of the UV adhesive can be improved. Specifically, if T2 is greater than 50°C, the photoreactive groups in the UV adhesive are prone to aging, causing the UV adhesive to yellow after curing. If T1 is less than 40°C, it is not conducive to chain growth and chain transfer in the UV adhesive, resulting in a decrease in the curing rate of the UV adhesive.

[0069] S140, UV adhesive is irradiated with a UV light source with an illuminance of E2 and all UV adhesive is cured. The irradiation time is t2, where t2 is greater than t1 and E2 is less than E1.

[0070] In this embodiment, E2 ranges from 250mW / cm². 2 ~350mW / cm 2 E2 can reach 250mW / cm 2 300mW / cm 2 350mW / cm 2 Any one of them. Preferably, E2 is 300mW / cm. 2 .

[0071] Therefore, by properly configuring the E2 value, yellowing of the UV adhesive surface can be avoided and the photoinitiator in the UV adhesive can be prevented from continuously activating. Specifically, if E2 is greater than 350mW / cm², 2 This can easily cause the UV adhesive surface to turn yellow. If E2 is less than 250mW / cm 2 If the ultraviolet light emitted by the UV light source has weak penetrating power, it is not conducive to the initiation of photoinitiators in the UV adhesive.

[0072] In this embodiment, t2 is greater than t1, which is beneficial for using strong light to initiate the photoinitiator in the UV adhesive in a short time, and allows the chain growth and chain transfer of the UV adhesive to be completed in a relatively long time.

[0073] In this embodiment, t2 ranges from 2 min to 3 min, and t2 can be any one of 2 min, 2.2 min, 2.4 min, 2.6 min, 2.8 min, and 3 min. Preferably, t2 is 3 min.

[0074] Therefore, by properly configuring the value of t2, yellowing of the UV adhesive surface can be avoided and the chain growth and transfer within the UV adhesive can be facilitated. Specifically, if t2 is greater than 3 minutes, the UV light source irradiates the UV adhesive for too long, resulting in excessive energy accumulation on the UV adhesive surface and making it prone to yellowing. If t2 is less than 2 minutes, the favorable temperature and time required for chain growth and transfer in the UV process are too short, reducing the degree of chain growth and transfer and leading to low quality of the cured UV adhesive.

[0075] S150, turn off the UV light source and the temperature control mechanism used for temperature control, and allow the cured UV adhesive to stand for a predetermined time.

[0076] Step S150 can maintain the consistency of the UV adhesive temperature before and after curing, and make the cured UV adhesive tend to stabilize its performance within a predetermined time, which is beneficial to improving the curing quality of the cured UV adhesive.

[0077] S160, the temperature control mechanism reduces the temperature of the UV adhesive to room temperature through cold water circulation or cold air circulation.

[0078] Specifically, the aforementioned ambient temperature refers to the temperature of the storage unit after the cured UV adhesive is removed from the curing device.

[0079] Step S160 allows for non-contact cooling of the cured UV adhesive, thus preventing damage to the cured UV adhesive.

[0080] The aforementioned UV adhesive curing method involves irradiating the liquid UV adhesive twice, through S120 and S140, to cure UV adhesives with uneven thickness. Specifically, compared to the second irradiation through S140, the first irradiation through S120 uses a combination of low temperature and strong light. Low temperature helps limit chain growth and chain transfer in the UV adhesive, reducing the curing rate, while strong light helps to sequentially activate the photoinitiators in the shallow and deep layers of the UV adhesive before curing. Compared to the first irradiation through S120, the second irradiation through S140 uses a combination of high temperature and weak light. Weak light helps prevent excessive energy accumulation on the surface of the UV adhesive, which could cause yellowing, while high temperature accelerates chain growth and chain transfer in the UV adhesive, thereby causing the UV adhesive to transform from a liquid to a solid state and achieve curing.

[0081] Therefore, the above-mentioned UV adhesive curing method, which uses low-temperature strong light and high-temperature weak light to irradiate UV adhesives with uneven thickness, can delay the curing of the UV adhesive surface layer. This helps to reduce yellowing caused by excessive accumulated energy on the UV adhesive surface layer. It also activates photoinitiators at different depths in the UV adhesive before the UV adhesive surface layer cures, which helps the curing of UV adhesives with uneven thickness to become more uniform, thereby improving the quality of the UV adhesive after curing.

[0082] Please see Figure 2 This application also provides a UV adhesive curing apparatus 100 for implementing the above-mentioned UV adhesive curing method to cure UV adhesive with uneven thickness. The UV adhesive curing apparatus 100 includes a housing 110, a fixture 120, a fan 130, a cold water circulation system 140, and a UV light source 150. The chamber 110 has a curing space 110a. A fixture 120 is disposed within the curing space 110a and is used to hold the UV adhesive. A fan 130 is connected to the chamber 110 and is used to exchange gases inside and outside the curing space 110a. A cooling water circulation system 140 is arranged around the periphery of the chamber 110 and is used to guide the circulation of cooling water to maintain the temperature inside the curing space 110a in conjunction with the fan 130. A UV light source 150 is connected to the chamber 110 and located within the curing space 110a. It is used to irradiate the liquid UV adhesive for the first time at a temperature of T1 with an illuminance of E1 and an irradiation duration of t1. It is also used to irradiate the liquid UV adhesive a second time at a temperature of T2 with an illuminance of E2 and an irradiation duration of t2, so that the UV adhesive changes from a liquid to a solid state. Here, E2 is less than E1, T2 is greater than T1, and t2 is greater than t1.

[0083] In the UV adhesive curing apparatus 100, the fixture 120 can be a dispensing mold for introducing UV adhesive. Furthermore, the UV light source can be an ultraviolet lamp, used to emit ultraviolet light to irradiate the UV adhesive located on the fixture 120, thereby curing the UV adhesive. The thickness of the UV adhesive refers to its length along the direction parallel to the irradiation direction of the UV light source 150. Uneven UV adhesive thickness means that the thickness of the UV adhesive varies along the direction perpendicular to the irradiation direction of the UV light source 150.

[0084] In the UV adhesive curing device 100, the curing space 110a is a closed structure.

[0085] Please see Figure 2 In this embodiment, the UV adhesive curing device 100 further includes a heating system 160. The heating system 160 is disposed in the curing space 110a and is used to dissipate heat into the curing space 110a. The fixture 120 is disposed in the heating system 160, and the heating system 160, the fixture 120 and the UV light source 150 are arranged sequentially along the irradiation direction of the UV light source.

[0086] Specifically, the heating system 160 can be an electric heating mechanism and is controlled by a control system (e.g., a thermostat) located outside the housing 110. Furthermore, a temperature sensor located within the curing space 110a can detect the temperature in real time, and the heating system 160 can be controlled in real time by the control system based on the temperature detected by the temperature sensor.

[0087] Please see Figure 3 and Figure 4 This application also provides a method for bonding a glass backplate assembly, which uses UV adhesive 500 to cure glass 300 and backplate 400 to form a glass backplate assembly. Specifically, the backplate 400 includes a middle frame 410 and a side frame 420, and the glass 300 has a curved structure. The method for bonding the glass backplate assembly includes:

[0088] S210, bond the glass 300 and the back plate 400, and form an adhesive injection space 400a between the glass 300 and the back plate 400.

[0089] Specifically, the glass 300 and the frame 420 of the back plate 400 can be bonded together with hot melt adhesive 200 so that the glass 300, the middle frame 410 of the back plate 400 and the frame 420 enclose the glue injection space 400a for injecting UV glue 500.

[0090] S220, UV adhesive 500 is injected into the injection space 400a, and the thickness of the UV adhesive 500 in the injection space 400a is uneven.

[0091] In this embodiment, the bonded glass 300 and back plate 400 can be placed on the aforementioned fixture 120, and step S210 is completed on the fixture 120. Specifically, the fixture 120 and the bonded glass 300 and back plate 400 can be moved to the glue dispensing machine by a transfer mechanism (e.g., a robotic arm) to inject UV glue 500 into the glue dispensing space 400a. Then, the fixture 120 and the glass 300 and back plate 400 after injecting UV glue 500 can be reset by the transfer mechanism. Alternatively, the glue dispensing machine can be moved to inject UV glue 500 into the glue dispensing space 400a. Meanwhile, because the thickness varies in different parts of the glue dispensing space 400a (some places differ by several times), the thickness of the UV glue 500 injected into the glue dispensing space 400a is uneven.

[0092] In this embodiment, the UV adhesive includes resin, active monomer, cationic initiator, and crosslinking agent, enabling the UV adhesive to undergo cationic polymerization upon exposure to ultraviolet light. Specifically, the resin accounts for 30% to 50% of the composition and can be cyclic aliphatic oxides, cyclic ethers, cyclic sulfides, etc.; the active monomer accounts for 40% to 60% of the composition and can be monofunctional, difunctional, or polyfunctional; the cationic initiator accounts for 1% to 6% of the composition and can be a protic acid, carbocation, etc.; and the crosslinking agent accounts for 0.2% to 1% of the composition and can be a surfactant.

[0093] S230, control the temperature of UV adhesive 500 to T1.

[0094] Specifically, controlling the temperature of the UV adhesive to T1 means maintaining the temperature within the space containing the UV adhesive at T1. In this embodiment, the temperature within the curing space 110a of the fixture 120 used to support the glass 300 and the backplate 400 can be maintained at T1.

[0095] In this embodiment, T1 ranges from 5℃ to 10℃, and T1 can be any one of 5℃, 6℃, 7℃, 8℃, 9℃, and 10℃. Preferably, T1 is 8℃.

[0096] Therefore, by properly configuring the temperature T1, the UV adhesive can be placed in a relatively low-temperature environment, facilitating the initial irradiation of the UV adhesive by the UV light source. Furthermore, the lower temperature reduces the flow of the UV adhesive, which is beneficial to its stability before irradiation by the UV light source.

[0097] S240, irradiate the UV adhesive with a UV light source with an illuminance of E1, and keep the UV adhesive completely liquid for an irradiation time of t1.

[0098] Specifically, the UV light source can have its illuminance, irradiation duration, and other parameters set and adjusted based on irradiation requirements. The thickness of the UV adhesive refers to its length along the direction parallel to the UV light source irradiation. Uneven UV adhesive thickness means that the thickness varies along the direction perpendicular to the UV light source irradiation.

[0099] In this embodiment, E1 ranges from 450mW / cm. 2 ~550mW / cm 2 E1 can reach 450mW / cm 2 450mW / cm 2 450mW / cm 2 Any one of them. Preferably, E1 is 450mW / cm. 2 .

[0100] Therefore, by properly configuring the E1 value, yellowing of the UV adhesive surface can be avoided, and photoinitiators deep within the UV adhesive can be prevented from activating. Specifically, if E1 is greater than 550mW / cm², 2 Excessive UV light intensity can cause excessive energy accumulation on the surface of the UV adhesive, leading to yellowing of the adhesive surface. If E1 is less than 450mW / cm², this can cause the adhesive to yellow. 2 If the UV light source is weak, the ultraviolet rays emitted by the UV light source will penetrate only a shallow layer of the UV adhesive and will not be able to activate the photoinitiator located deep within the UV adhesive.

[0101] In this embodiment, t1 ranges from 0.5 min to 1 min, and t1 can be any one of 0.5 min, 0.6 min, 0.7 min, 0.8 min, 0.9 min, and 1 min. Preferably, t1 is 1 min.

[0102] Therefore, by properly configuring the value of t1, yellowing of the UV adhesive surface can be avoided and the photoinitiator in the UV adhesive can be fully activated by the UV light source. Specifically, if t1 is less than 0.5 min, the UV light source will irradiate the UV adhesive for a short time, which will not be enough to fully activate the photoinitiator in the UV adhesive. If t1 is greater than 1 min, the accumulated energy on the surface of the UV adhesive will be too large, making it prone to yellowing.

[0103] S250 heats up the irradiated UV adhesive and controls the temperature to T2.

[0104] In this embodiment, the fixture 120 can be heated by the heating system 160 in the UV adhesive curing device 100, thereby raising the temperature of the UV adhesive to T2.

[0105] In this embodiment, T2 ranges from 40°C to 50°C, and T2 can be any one of 40°C, 45°C, and 50°C. Preferably, T2 is 45°C.

[0106] Therefore, by properly configuring the T2 temperature, yellowing of the UV adhesive after curing can be avoided, and the curing rate of the UV adhesive can be improved. Specifically, if T2 is greater than 50°C, the photoreactive groups in the UV adhesive are prone to aging, causing the UV adhesive to yellow after curing. If T1 is less than 40°C, it is not conducive to chain growth and chain transfer in the UV adhesive, resulting in a decrease in the curing rate of the UV adhesive.

[0107] S260, UV adhesive is irradiated with a UV light source with an illuminance of E2 and all UV adhesive is cured. The irradiation time is t2, where t2 is greater than t1 and E2 is less than E1.

[0108] In this embodiment, E2 ranges from 250mW / cm². 2 ~350mW / cm 2 E2 can reach 250mW / cm 2 300mW / cm 2 350mW / cm 2 Any one of them. Preferably, E2 is 300mW / cm. 2 .

[0109] Therefore, by properly configuring the E2 value, yellowing of the UV adhesive surface can be avoided and the photoinitiator in the UV adhesive can be prevented from continuously activating. Specifically, if E2 is greater than 350mW / cm², 2 This can easily cause the UV adhesive surface to turn yellow. If E2 is less than 250mW / cm 2 If the ultraviolet light emitted by the UV light source has weak penetrating power, it is not conducive to the initiation of photoinitiators in the UV adhesive.

[0110] In this embodiment, t2 is greater than t1, which is beneficial for using strong light to initiate the photoinitiator in the UV adhesive in a short time, and allows the chain growth and chain transfer of the UV adhesive to be completed in a relatively long time.

[0111] In this embodiment, t2 ranges from 2 min to 3 min, and t2 can be any one of 2 min, 2.2 min, 2.4 min, 2.6 min, 2.8 min, and 3 min. Preferably, t2 is 3 min.

[0112] Therefore, by properly configuring the value of t2, yellowing of the UV adhesive surface can be avoided and the chain growth and transfer within the UV adhesive can be facilitated. Specifically, if t2 is greater than 3 minutes, the UV light source irradiates the UV adhesive for too long, resulting in excessive energy accumulation on the UV adhesive surface and making it prone to yellowing. If t2 is less than 2 minutes, the favorable temperature and time required for chain growth and transfer in the UV process are too short, reducing the degree of chain growth and transfer and leading to low quality of the cured UV adhesive.

[0113] S270, turn off the UV light source and the temperature control mechanism used for temperature control, and allow the cured UV adhesive to stand for a predetermined time.

[0114] In this embodiment, the temperature control mechanism may include the heating system 160, the fan 130, and the cold water circulation system 140 in the UV adhesive curing device described above.

[0115] Step S260 can maintain the consistency of the UV adhesive temperature before and after curing, and make the cured UV adhesive tend to stabilize its performance within a predetermined time, which is beneficial to improving the curing quality of the cured UV adhesive.

[0116] S280, the temperature control mechanism reduces the temperature of the UV adhesive to room temperature through cold water circulation or cold air circulation.

[0117] Step S270 allows for non-contact cooling of the cured UV adhesive, thus preventing damage to the cured UV adhesive.

[0118] In the above-mentioned bonding method for the glass backsheet assembly, the liquid UV adhesive is irradiated twice, in steps S240 and S260, to cure the UV adhesive with uneven thickness. Specifically, compared to the second irradiation in S260, the first irradiation in S240 uses a combination of low temperature and strong light. Low temperature helps to limit chain growth and chain transfer in the UV adhesive, reducing the curing rate of the UV adhesive. Strong light helps to sequentially activate the photoinitiators in the shallow and deep layers of the UV adhesive before the UV adhesive cures. Compared to the first irradiation in S240, the second irradiation in S260 uses a combination of high temperature and weak light. Weak light helps to prevent the UV adhesive surface from accumulating too much energy and turning yellow. High temperature helps to accelerate chain growth and chain transfer in the UV adhesive, thereby causing the UV adhesive to change from a liquid state to a solid state and achieve the curing of the UV adhesive.

[0119] Therefore, in the above-mentioned bonding method for glass backsheet components, the UV adhesive with uneven thickness is irradiated with low-temperature strong light and high-temperature weak light in sequence, which can delay the curing of the UV adhesive surface layer. This helps to reduce yellowing caused by excessive accumulated energy on the UV adhesive surface layer. Initiating photoinitiators at different depths in the UV adhesive before the UV adhesive surface layer cures helps to make the curing of the uneven UV adhesive more uniform, thereby improving the quality of the formed glass backsheet component.

[0120] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A UV glue curing method, characterized in that, A method for curing UV glue with uneven thickness, comprising: controlling temperature of the UV glue to T1; irradiating the UV glue with a UV light source with illuminance E1, and keeping the UV glue in liquid state, and the irradiation time is t1; warming and controlling temperature of the irradiated UV glue to T2; irradiating the UV glue with a UV light source with illuminance E2, and curing the UV glue, and the irradiation time is t2, wherein t2 is greater than t1, and E2 is less than E1; The UV glue comprises resin, active monomer, cationic initiator and crosslinking agent, T1 is in the range of 5-10℃, T2 is in the range of 40-50℃, E1 is in the range of 450-550 mW / cm 2 , E2 is in the range of 150-250 mW / cm 2 . 2 2 .​ 2. The method of claim 1, wherein t1 is in the range of 0.5 min to 1 min, and t2 is in the range of 2 min to 3 min. Further comprising:

3. The UV glue curing method of claim 1, wherein, turning off the UV light source and the temperature control mechanism, and keeping the cured UV glue for a predetermined time; the temperature control mechanism reduces the temperature of the UV glue to room temperature by cold water circulation or cold air circulation. comprising:

4. A method of laminating a glass backplane assembly, characterized by, bonding glass and back plate, and forming a glue injection space between the glass and the back plate; injecting UV glue into the glue injection space, and the thickness of the UV glue in the glue injection space is uneven; controlling temperature of the UV glue to T1; irradiating the UV glue with a UV light source with illuminance E1, and keeping the UV glue in liquid state, and the irradiation time is t1; warming and controlling temperature of the irradiated UV glue to T2; irradiating the UV glue with a UV light source with illuminance E2, and curing the UV glue, and the irradiation time is t2, wherein t2 is greater than t1, and E2 is less than E1, and the glass and the back plate are fixedly connected by the cured UV glue to form a glass back plate assembly; 5. The method of claim 4, wherein t1 is in the range of 0.5 min to 1 min, and t2 is in the range of 2 min to 3 min. The UV glue comprises resin, active monomer, cationic initiator and crosslinking agent, T1 is in the range of 5-10 DEG C, T2 is in the range of 40-50 DEG C, E1 is in the range of 450 mW / cm 2 ~550 mW / cm 2 , E2 is in the range of 150 mW / cm 2 ~250 mW / cm 2 . Further comprising: turning off the UV light source and the temperature control mechanism, and keeping the glass back plate assembly for a predetermined time; 6. The lamination method of a glass backsheet assembly according to claim 4, wherein the temperature control mechanism reduces the temperature of the glass back plate assembly to room temperature by cold water circulation or cold air circulation. ​ ​

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