A composition, its preparation and use

Abstract

The application discloses a kind of composition and its preparation method and application, the composition includes the following volume fraction components: pure water 45%-60%, tetramethylammonium hydroxide 10%-40%, aqueous polyimide 2%-5%, terephthalic acid 1%-2%, ethylene glycol 1%-3%, aqueous glycol resin 0.5%-2%, aqueous functional additive 0.5%-2%, nano directional dispersant 0.1%-1.0%.The application implants spinal column (composition) on the surface of PET or PI material, changes the valence bond of raw material, reduces the molecular surface repulsive force, and the load weight is increased by 2-3 times compared with the original. In addition, the spinal column has the characteristics of conjugate double-track high temperature resistance, effectively and quickly provides electron migration; the higher the temperature, the lower the resistance, the longer the temperature time, and the lower the resistance.

Description

Technical Field

[0001] This invention relates to the field of composite copper foil technology, and more particularly to a composition, its preparation method, and its application. Background Technology

[0002] Currently, the mainstream fluid-saving composite copper foil for new energy applications is made of PET or PI material, processed using either a one-step method (vacuum sputtering) or a two-step method (vacuum sputtering + copper electroplating). As the requirements for increased range, fast charging and discharging, and longer lifespan of lithium batteries continue to rise, the thickness of PET or PI materials used is becoming increasingly thinner, from 12 micrometers to 6-8 micrometers, and further down to 4.5 micrometers, with a future target of 3 micrometers. However, using very thin PET or PI materials presents challenges in mainstream processes, including physical breakdown and high electrical resistance. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of the prior art by providing a composition, its preparation method, and its application.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] A first aspect of the present invention is to provide a composition comprising the following components in volume fractions:

[0006] The composition includes: 45%-60% pure water, 10%-40% tetramethylammonium hydroxide, 2%-5% waterborne polyimide, 1%-2% terephthalic acid, 1%-3% ethylene glycol, 0.5%-2% waterborne urea resin, 0.5%-2% waterborne functional additives, and 0.1%-1.0% nano-directional dispersant.

[0007] A second aspect of the present invention is to provide a method for preparing the above composition, comprising the following steps: adding pure water to a reaction vessel until the pure water accounts for 30% of the total volume of the reaction system, then sequentially adding tetramethylammonium hydroxide with a final volume fraction of 10%-40%, aqueous polyimide with a final volume fraction of 2%-5%, terephthalic acid with a final volume fraction of 1%-2%, ethylene glycol with a final volume fraction of 1%-3%, aqueous urea resin with a final volume fraction of 0.5%-2%, aqueous functional additive with a final volume fraction of 0.5%-2%, and nano-directional dispersant with a final volume fraction of 0.1%-1.0%, then adding pure water to 100%, stirring for 4 hours, allowing to stand for 1 hour, and filtering to obtain the above composition.

[0008] A third aspect of the present invention is to provide the use of the above composition in the preparation of composite copper foil.

[0009] The composite copper foil comprises: a spinal layer including the composition implanted on both sides of a PET or PI material, a chemical nickel layer on the spinal layer, and an electroplated copper layer on the chemical nickel layer.

[0010] Furthermore, the thickness of the spinal layer is 1-2 nm.

[0011] Furthermore, the thickness of the PET or PI material is 4.5 μm.

[0012] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0013] The thinner the PET or PI material, the greater the molecular repulsion on the material surface, and the smaller the load-bearing weight. This invention implants a spinal layer (SPAIN) onto the surface of PET or PI material (4.5µm thick), altering the valence bonds of the raw materials and reducing molecular surface repulsion. This increases the load-bearing weight by 2-3 times compared to the original method, enabling the electroplating of a thicker copper layer, exceeding 12 micrometers. Furthermore, the spinal layer (SPAIN) possesses conjugated double-track high-temperature resistance, effectively and rapidly facilitating electron migration; it exhibits the characteristic of lower resistance with higher temperatures and longer heating times. Detailed Implementation

[0014] The present invention will be further described below with reference to specific embodiments, but this is not intended to limit the invention. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present invention can be combined with each other.

[0015] Example 1

[0016] The process for preparing a composition for the spine layer of composite copper foil includes: adding pure water to a reaction vessel until the pure water accounts for 30% of the total volume of the reaction system, then sequentially adding tetramethylammonium hydroxide (15% by volume), waterborne polyimide (3% by volume), terephthalic acid (2% by volume), ethylene glycol (2% by volume), waterborne urea resin (1% by volume), waterborne functional additive (1.5% by volume), and nano-directional dispersant (0.5% by volume), then adding pure water to 100%, stirring for 4 hours, allowing it to stand for 1 hour, and filtering to obtain the composition.

[0017] The water-based functional additives and nano-directional dispersants used in this invention are disclosed in patent 202210827748.3, and will not be described in detail here.

[0018] Example 2

[0019] Table 1

[0020]

[0021]

[0022]

[0023] in,

[0024] Pro AD-250 is a mixture of alkali and surfactant; Pro AD-3316 is palladium; Pro-AD-3800 is a mixture of sulfuric acid and surfactant; Pro EN-1820M is malic acid and / or succinic acid; Pro EN-1820A is nickel sulfate; Pro EN-1820B is sodium borohydride; Pro EN-1820C is an amino acid; Pro-KK is potassium permanganate; Pro-SO is hydrogen peroxide; Pro-311 is oxalic acid; Pro-TC is a benzimidazole derivative; SPAIN is the composition prepared in Example 1, named for its microscopic resemblance to a spine.

[0025] As shown in Table 1 above, the PET composite copper foil preparation process includes the following steps: cleaning and ring-opening with a surface treatment agent, overflow rinsing twice with deionized water, removing surface heterocyclic organic matter, overflow rinsing twice with deionized water, activating the surface energy of the PET material (4.5 μm thick), overflow rinsing twice with deionized water, surface treatment with the composition obtained in Example 1, overflow rinsing twice with deionized water, catalytic treatment with a catalyst, overflow rinsing twice with deionized water, accelerated treatment, overflow rinsing twice with deionized water, addition of nickel, deionized water rinsing, hot deionized water rinsing, deionized water rinsing, baking and crosslinking, cleaning and activating the nickel surface, deionized water rinsing, pre-plating copper (to reduce the cost of chemical nickel plating and reduce the thickness of chemical nickel plating, overflow rinsing twice with deionized water), electroplating copper thickening, overflow rinsing twice, anti-copper oxidation agent, overflow rinsing twice.

[0026] Example 3: Performance Testing

[0027] ① Peel force test

[0028] Equipment Name: Electronic Universal Testing Machine; Equipment Model: AG.X plus; Test Environment Temperature: 22-28℃; Relative Humidity: 45-70%RH; Test Method: A 90° tensile test was performed on copper foil using a universal tensile testing machine. The copper foil was prepared in Example 2 above—with a spine layer of approximately 1 nm, a chemical nickel plating thickness of 1.4 μm, and an electroplated copper thickness of 7.5 μm (single-sided). The pulling speed was 50 mm / min, and the pulling distance was >70 mm. The measured peel force was 0.352 Ibs / in.

[0029] Peel strength test of PET samples after 7 days of aging at 120℃ showed a peel strength of 0.510 Ibs / in, indicating that the bonding strength is enhanced after aging, which improves aging resistance, reduces battery bubbling problems, and extends battery life.

[0030] ② Resistance test

[0031] Using the preparation method of Example 2, after electroless nickel plating on 4.5-micron thick PET (1.4-micron electroless nickel thickness), its resistance was tested and found to be 600 mΩ.

[0032] Using the preparation method of Example 2, after electroless nickel plating on a 4.5-micron thick PET layer (1.4 microns thick electroless nickel plating), a copper layer with a thickness of 1 micron (single-sided) was electroplated, and its resistance was tested to be 2.7 mΩ.

[0033] Using the preparation method of Example 2, after electroless nickel plating on a 4.5-micron thick PET layer (1.4 microns thick electroless nickel plating), a copper layer with a thickness of 2 microns (single-sided) was electroplated, and its resistance was tested to be 820 uΩ.

[0034] ③ Compared with mainstream market suppliers (Shenzhen Baoming New Material Technology Co., Ltd., product model: CE60 series lithium battery composite copper foil), see Table 2 below.

[0035] Table 2

[0036]

[0037]

[0038] The above description is merely a preferred embodiment of the present invention and does not limit the implementation and protection scope of the present invention. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the content of the present invention specification should be included within the protection scope of the present invention.

Claims

1. A composite copper foil, characterized in that, The composite copper foil includes: a spinal layer comprising a composition implanted on both sides of a PET or PI material, the thickness of the spinal layer being 1-2 nm; the composite copper foil further includes: a chemical nickel layer on the spinal layer, and an electroplated copper layer on the chemical nickel layer; the thickness of the PET or PI material is 4.5 μm; The process for preparing a composition for the spine layer of composite copper foil includes: adding pure water to a reaction vessel until the pure water accounts for 30% of the total volume of the reaction system, then sequentially adding tetramethylammonium hydroxide (15% by volume), waterborne polyimide (3% by volume), terephthalic acid (2% by volume), ethylene glycol (2% by volume), waterborne urea resin (1% by volume), waterborne functional additive (1.5% by volume), and nano-directional dispersant (0.5% by volume), then adding pure water to 100%, stirring for 4 hours, allowing it to stand for 1 hour, and filtering to obtain the composition; The aqueous functional additive includes compounds as shown in formula (I): R1 is selected from -H or -CH3; R2 is selected from -C n H 2n+1 , n∈[0,50]; R3 is selected from -C n'+3Y H 2n'+4Y n'∈[3,500], Y∈[1,20], Z∈[1,20], Y=Z; R4 is selected from -C n” H 2n” (EO) n”' (PO) n”” H, n”∈[0,50], EO represents ethylene oxide, n”'∈[1,50], PO represents propylene oxide, n””∈[1,50]; m∈[0,10000]; m1∈[0,10000]; m2∈[1,1000]; m3∈[0,10000]; Where m, m1, and m3 are all non-zero; The nano-directional dispersant includes compounds as shown in formula (II): R is selected from -C n””' H 2n "", n""'∈[1,50]; R1 is selected from -H or -CH3; M1 and M2 are each independently selected from H + [NH4] + Or metal ions; x∈[1,100]; x1∈[1,100]; x2∈[0,50]; x3∈[1,100].

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