Multi-temperature-zone winding type magnetron sputtering coating machine

Abstract

This invention relates to a multi-temperature zone roll-to-roll magnetron sputtering coating machine, comprising a linear magnetron sputtering target (4), a roll-to-roll cassette (7), and a multi-temperature zone substrate temperature control device (8). The substrate material is transferred within the magnetron sputtering coating machine via the roll-to-roll cassette (7). The magnetron sputtering coating machine cavity is equipped with several substrate temperature control devices (8). By setting the temperature of the multi-temperature zone substrate temperature control device (8), temperature control of the substrate in different regions can be achieved, thereby realizing effective control of multi-temperature zone thin film growth. This invention enables multi-temperature zone control in a roll-to-roll magnetron sputtering coating machine, thereby achieving continuous growth of multilayer electronic materials with individually and precisely controllable temperatures for each layer, improving the diversity and controllability of sputtering coating, and effectively improving the performance and production efficiency of electronic materials and devices.

Description

Technical Field

[0001] This invention relates to a coating machine, specifically a multi-temperature zone roll-to-roll magnetron sputtering coating machine, belonging to the technical field of high-vacuum magnetron sputtering equipment. Background Technology

[0002] Traditional discrete magnetron sputtering coating technology struggles to achieve continuous deposition on flexible substrates and requires numerous sealing components to maintain extremely high vacuum levels, limiting its application in microelectronic device manufacturing. Roll-to-roll magnetron sputtering coating technology not only possesses the advantages of traditional magnetron sputtering but also enables continuous deposition on large-size flexible substrates, improving the production efficiency of microelectronic devices and enabling mass production. Despite these advantages, existing roll-to-roll magnetron sputtering machines struggle to ensure the flexible substrate remains completely flat during sputtering, meaning the uniformity of roll-to-roll magnetron sputtering coatings still lags behind that of traditional discrete magnetron sputtering machines. Furthermore, many applications of sputtered thin films, such as embedded resistors, magnetic storage devices, and sensors, require the growth of multilayer film structures, and the growth temperature of each layer often varies. Therefore, continuous growth of multilayer electronic materials with individually and precisely controllable temperatures for each layer is necessary. However, existing roll-to-roll magnetron sputtering coating machines struggle to maintain different temperatures in different sputtering zones, hindering the control of various sputtering temperature ranges. These limitations restrict the industrial development and application of roll-to-roll magnetron sputtering coating machines. Therefore, a new solution is urgently needed to address these technical issues. Summary of the Invention

[0003] This invention addresses the problems existing in the prior art by providing a multi-temperature zone roll-to-roll magnetron sputtering coating machine. This technical solution designs a magnetron sputtering coating machine with high vacuum, high sputtering coating uniformity, and the ability to control different growth temperature zones. It can improve the diversity and controllability of sputtering coating, and effectively improve the performance and production efficiency of electronic materials and devices.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows: a multi-temperature zone roll-to-roll magnetron sputtering coating machine, the coating machine comprising a lower vacuum chamber 1, an upper vacuum chamber 2, a linear magnetron sputtering target 4, an opening and closing chamber motor 6, a roll-to-roll cassette 7, and a substrate temperature control device 8. The upper vacuum chamber 2 is provided with the linear magnetron sputtering target 4, and the lower vacuum chamber 1 is provided with the roll-to-roll cassette 7 and the substrate temperature control device 8. The linear magnetron sputtering target 4 is respectively positioned opposite the multi-temperature zone substrate temperature control device 8 to form coating areas.

[0005] As an improvement of the present invention, the upper vacuum cavity (2) includes a left instrument chamber (3), a linear magnetron sputtering target (4), and a right instrument chamber (5), wherein the linear magnetron sputtering target (4) is disposed between the left instrument chamber (3) and the right instrument chamber (5).

[0006] As an improvement of the present invention, the lower vacuum chamber (1) is provided with a roll cassette (7), a multi-temperature zone substrate temperature control device (8), and a vacuum pump interface (13). The substrate temperature control device (8) is located in the center of the lower vacuum chamber (1), and its upper surface is slightly higher than the initial winding and unwinding position of the roll cassette (7). The roll cassette (7) is located at both ends inside the lower vacuum chamber (2). The vacuum pump interface (13) is located at the center of the back side of the outer surface of the lower vacuum chamber (1). After the chamber is closed, the vacuum pump pumps the vacuum chamber to a high vacuum environment through the vacuum pump interface (13). The lower vacuum chamber (1) and the upper vacuum chamber (2) are driven and controlled to open and close the chamber by the opening and closing chamber motor (6). When sputtering the substrate, the lower vacuum chamber (1) and the upper vacuum chamber (2) are combined together by the opening and closing chamber motor (6), and the vacuum pump is connected through the vacuum pump interface (13) to pump the vacuum chamber to a high vacuum environment before sputtering begins. The flexible substrate is unwound through the roll box (7) and then transported through the multi-temperature zone substrate temperature control device (8), and finally collected by the roll box (7).

[0007] As an improvement of the present invention, the roll cassette (7) includes a roll cover (7a), a roll shaft (7b), a spindle-shaped self-aligning roller (7c), and a roll cassette support (7d). The two ends of the roll shaft (7b) are fixed to the roll cassette support (7d) by the roll cover (7a). After opening the roll cover (7a), the roll shaft (7b) can be taken out for sample loading. At the same time, the position of the spindle-shaped self-aligning roller (7c) can be adjusted to select the coating surface of the flexible base. After the sample loading is completed, the roll cassette (7) is placed in the lower vacuum chamber (1). The connection and separation between the roll cassette (7b) and the roll shaft (7b) are controlled by the screwing in and out of the shaft coupling sleeve (9), thereby realizing the installation and disassembly of the roll cassette (7) in the lower vacuum chamber (1).

[0008] As an improvement of the present invention, the multi-temperature zone substrate temperature control device (8) includes a substrate temperature control support (8a), a substrate temperature controller (8b-8d), and a wiring groove (8e). The upper surfaces of the substrate temperature controllers (8b-8d) are kept horizontal and coplanar, and are respectively facing the linear magnetron sputtering target (4), thereby forming multiple sputtering coating areas. The substrate temperature control support (8a) is provided with a wiring groove (8e). The substrate temperature controllers (8b-8d) are in close contact with the substrate to ensure precise temperature control. By adjusting the temperature of the substrate temperature controllers (8b-8d) in different sputtering coating areas, the substrate temperature can be adjusted in different sputtering coating areas, thereby realizing multi-temperature zone growth of the substrate.

[0009] As an improvement of the present invention, the distance between the substrate temperature control device (8) and the linear magnetron sputtering target (4) is adjustable, thereby realizing the control of the target-substrate distance.

[0010] As an improvement of the present invention, the roll box (7) is connected to the lower vacuum chamber (1) by a motor control shaft coupling sleeve (9) connected to the sealing shaft coupling (11), thereby controlling the splitting of the roll box (7) in the lower vacuum chamber (1).

[0011] As an improvement of the present invention, the initial position of the roll cassette (7) for winding and unwinding should be lower than the upper surface of the substrate temperature control device (8), so that the multi-temperature zone substrate temperature control device (8) has a certain supporting effect on the flexible substrate; the roll cassette (7) can control the winding and unwinding speed of the flexible substrate, and by controlling the winding and unwinding speed and the auxiliary supporting effect of the multi-temperature zone substrate temperature control device (8), the flexible substrate and the multi-temperature zone substrate temperature control device (8) are in complete and tight contact, thereby achieving high-precision control of the substrate temperature.

[0012] Compared with the prior art, the present invention has the following advantages: by setting a substrate temperature controller in the sputtering coating area, the substrate can maintain different growth temperatures in different sputtering coating areas, and can also achieve simultaneous coating in multiple coating areas and at different growth temperatures, thereby realizing the continuous growth of multilayer electronic materials with individually and precisely controllable temperature for each layer, improving the diversity and controllability of sputtering coating, and effectively improving the performance and production efficiency of electronic materials and devices. Attached Figure Description

[0013] Figure 1-1 , Figure 1-2 This is a schematic diagram of the overall structure of a multi-temperature zone roll-to-roll magnetron sputtering coating machine provided in an embodiment of the present invention;

[0014] Figure 2-1 , Figure 2-2 , Figure 2-3 This is a schematic diagram of the structure of a multi-temperature zone roll-to-roll magnetron sputtering coating machine used for coating on a flexible substrate, as provided in an embodiment of the present invention.

[0015] Figure 3 A schematic diagram of the structure of a substrate temperature control device for a multi-temperature zone roll-to-roll magnetron sputtering coating machine provided in an embodiment of the present invention;

[0016] Figure 4-1 , Figure 4-2 , Figure 4-3 A schematic diagram of the structure of a multi-temperature zone roll-to-roll magnetron sputtering coating machine roll box provided in an embodiment of the present invention;

[0017] In the diagram: 1. Lower vacuum chamber; 2. Upper vacuum chamber; 3. Left instrument compartment; 4. Linear magnetron sputtering target; 5. Right instrument compartment; 6. Opening / closing chamber motor; 7. Roll-on / roll-off box; 8. Multi-zone substrate temperature control device; 9. Shaft-connected sliding sleeve; 10. Flexible substrate; 11. High-vacuum sealed shaft coupling; 12. Three-zone temperature controller high-vacuum sealed joint; 13. Vacuum pump interface; 7a. Roll-on / roll-off cover; 7b. Roll-on / roll-off shaft; 7c. Spindle-shaped self-aligning roller; 7d. Roll-on / roll-off box bracket; 8a. Substrate temperature control bracket; 8b. Substrate temperature controller; 8c. Substrate temperature controller; 8d. Substrate temperature controller; 8e. Cable tray. Detailed Implementation

[0018] To enhance understanding of the present invention, the embodiments will be described in detail below with reference to the accompanying drawings.

[0019] Example 1: Referring to Figure 1, this embodiment of the invention provides a multi-temperature zone roll-to-roll magnetron sputtering coating machine. The coating machine includes a lower vacuum chamber 1, an upper vacuum chamber 2, a linear magnetron sputtering target 4, an opening / closing chamber motor 6, a roll-to-roll cassette 7, and a substrate temperature control device 8. During substrate sputtering, the lower vacuum chamber 1 and the upper vacuum chamber 2 are combined by the opening / closing chamber motor 6, and a vacuum pump is connected via vacuum pump interface 13 to evacuate the vacuum chamber to a high vacuum environment before sputtering begins. The upper vacuum chamber 2 contains the linear magnetron sputtering target 4, and the lower vacuum chamber 2 contains the roll-to-roll cassette 7 and the substrate temperature control device 8. The linear magnetron sputtering target 4 and the multi-temperature zone substrate temperature control device 8 are respectively positioned opposite each other to form coating areas.

[0020] As shown in Figure 2, during sputtering deposition of a flexible substrate, the flexible substrate is placed on a roll-to-roll cassette 7 and transported within the lower vacuum chamber 1 through the cassette 7, passing through the sputtering deposition area. The substrate temperature control device 8 within the sputtering deposition area controls the temperature of the flexible substrate and provides support. Several sputtering deposition areas are formed. Therefore, compared to traditional roll-to-roll magnetron sputtering machines, this embodiment ensures continuous and uniform sputtering deposition while allowing for temperature control in different sputtering areas, resulting in diverse coating types within the same batch. Optionally, copper foil is used as the flexible substrate. The copper foil is placed on the roll-to-roll cassette 7 and transported within the lower vacuum chamber. First, a NiCrSi thin film is sputtered in the first sputtering deposition area at 25°C. Then, the copper foil containing the NiCrSi layer is transported to the second sputtering deposition area, where a NiCr thin film is sputtered at 100°C. Simultaneously, the undeposited copper foil can still be deposited with a NiCrSi thin film in the first sputtering area before being transported to the second sputtering deposition area. Meanwhile, copper foil containing NiCrSi and NiCr thin films is transferred to a third sputtering deposition area, where an Al film is sputtered at 25°C as a protective layer. This process is repeated, allowing for different film growth temperatures in different sputtering areas, and also enabling simultaneous sputtering deposition in multiple areas, thus improving sputtering efficiency.

[0021] In one embodiment, as shown in Figures 2-3, the substrate temperature control device includes a substrate temperature control support 8a, substrate temperature controllers 8b-8d, and a wiring groove 8e. In this embodiment, the upper surface of the substrate temperature control device 8 is horizontal and coplanar, facing the linear magnetron sputtering target 4. Furthermore, in the lower vacuum chamber 1, the upper surface of the substrate temperature control device 8 is positioned higher than the spindle-shaped self-aligning rollers 7c on both sides. This allows the substrate temperature control device 8 to provide upward support to the flexible substrate as it passes through the sputtering coating area, generating stress within the flexible substrate and thus keeping it flat and wrinkle-free during sputtering. Furthermore, the distance between the substrate temperature control device 8 and the linear magnetron sputtering target 4 is adjustable, thereby controlling the target-substrate distance. Furthermore, the wires led out from the substrate temperature controllers 8b-8d can be placed in the wiring groove 8e.

[0022] In one embodiment, as shown in FIG. 4, the roll cassette 7 includes a roll cover 7a, a roll shaft 7b, a spindle-shaped self-aligning roller 7c, and a roll cassette support 7d. In this embodiment, as shown in FIG. 4, the roll cassette 7 is connected to the lower vacuum chamber 1 by a motor-controlled shaft coupling sleeve 9 connected to the sealing shaft coupling 11, which rotates outward on the roll shaft 7b. Conversely, the roll cassette 7 is separated from the lower vacuum chamber 1 by a motor-controlled shaft coupling sleeve 9 connected to the sealing shaft coupling 11, which rotates inward on the roll shaft 7b. Further, a flexible substrate is disposed on the roll cassette 7 and transported within the lower vacuum chamber 1 through the roll cassette 7, forming multiple sputtered coating areas.

[0023] In one embodiment, as shown in FIG1, the upper vacuum cavity 1 includes a left instrument chamber 3, a linear magnetron sputtering target 4, and a right instrument chamber 5. In this embodiment, the linear magnetron sputtering target 4 is arranged between the left instrument chamber 3 and the right instrument chamber 5. Optionally, the left instrument chamber 3 and the right instrument chamber 5 may be configured with other equipment, such as an ion beam etching device or a film thickness measurement device.

[0024] In one embodiment, as shown in FIG1, the lower vacuum chamber 1 includes a roll cassette 7 and a substrate temperature control device 8. The substrate temperature control device 8 is located in the center of the lower vacuum chamber 1, and its upper surface is slightly higher than the initial winding / unwinding position of the roll cassette 7. Further, the roll cassette 7 is disposed at both ends inside the lower vacuum chamber 1.

[0025] It should be noted that the above embodiments are not intended to limit the scope of protection of the present invention. Equivalent transformations or substitutions made based on the above technical solutions all fall within the scope of protection of the claims of the present invention.

Claims

1. A multi-temperature zone roll-to-roll magnetron sputtering coating machine, characterized in that, The coating machine comprises a lower vacuum cavity, an upper vacuum cavity, a linear magnetron sputtering target, an opening and closing cavity motor, a roll material box and a substrate temperature control device, the linear magnetron sputtering target is arranged in the upper vacuum cavity, the roll material box and the substrate temperature control device are arranged in the lower vacuum cavity, and the linear magnetron sputtering target and the multi-temperature-zone substrate temperature control device are opposite to each other to form a coating area; The upper vacuum cavity (2) comprises a left instrument cabin (3), a linear magnetron sputtering target (4) and a right instrument cabin (5), wherein the linear magnetron sputtering target (4) is arranged between the left instrument cabin (3) and the right instrument cabin (5); The lower vacuum cavity (1) is provided with a roll material box (7), a multi-temperature-zone substrate temperature control device (8) and a vacuum pump interface (13), the substrate temperature control device (8) is located at the center of the lower vacuum cavity (1) and has an upper surface slightly higher than an initial winding and unwinding position of the roll material box (7), the roll material box (7) is arranged at both ends of the lower vacuum cavity (1), and the vacuum pump interface (13) is located at the center of the back surface of the outer surface of the lower vacuum cavity (1), and a vacuum pump draws the vacuum cavity to a high vacuum environment through the vacuum pump interface (13) after closing the cavity; The roll material box (7) comprises a roll material cover (7a), a roll material shaft (7b), a spindle-shaped centering roller (7c) and a roll material box support (7d), the roll material shaft (7b) is fixed on the roll material box support (7d) through the roll material cover (7a) at both ends, the roll material box support (7d) is connected and separated with both ends of the roll material shaft (7b) through the shaft joint sliding sleeve (9) to realize installation and dismounting in the lower vacuum cavity (1), and the selection of the flexible substrate coating surface can be realized by adjusting the position of the spindle-shaped centering roller (7c); The multi-temperature-zone substrate temperature control device (8) comprises a substrate temperature control support (8a), substrate temperature controllers (8b-8d) and a wiring groove (8e), the upper surfaces of the substrate temperature controllers (8b-8d) are kept horizontal and coplanar, and are opposite to the linear magnetron sputtering target (4) respectively, so that a plurality of sputtering coating areas are formed; the wiring groove (8e) is arranged on the substrate temperature control support (8a), the substrate temperature controllers (8b-8d) are in close contact with the substrate to ensure accurate temperature control, the temperature of the substrate in different sputtering coating areas can be adjusted by adjusting the temperature of the substrate temperature controllers (8b-8d) in different sputtering coating areas, and multi-temperature-zone growth of the substrate is realized; The distance between the substrate temperature control device (8) and the linear magnetron sputtering target (4) is adjustable, so that the target base distance is regulated; The roll material box (7) is connected between the motor control shaft joint sliding sleeve (9) connected with a sealing shaft joint (11) and the lower vacuum cavity (1), so as to control the dismounting of the roll material box (7) in the lower vacuum cavity (1). The initial position of the roll box (7) should be lower than the upper surface of the substrate temperature control device (8), so that the multi-temperature zone substrate temperature control device (8) has a certain supporting effect on the flexible substrate; the roll box (7) can control the winding and unwinding speed of the flexible substrate, and through the control of the winding and unwinding speed and the auxiliary supporting effect of the multi-temperature zone substrate temperature control device (8), the flexible substrate can be completely and closely contacted with the multi-temperature zone substrate temperature control device (8), so as to realize the high-precision control of the substrate temperature.

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