Electromagnetic device with multi-thickness elements and method of manufacturing an electromagnetic device with multi-thickness elements

Abstract

An electromagnetic device is provided, which has conductive elements and pins of multiple thicknesses. A template for manufacturing the electromagnetic device is provided, which is formed by an extrusion process, a thinning process, a forging process, 3D printing, or a machining process. The multi-thickness electromagnetic device may include a conductive element having a thickness-increasing region and one or more pins having at least one thickness-decreasing region, the thickness of the thickness-decreasing region being less than the thickness of the thickness-increasing region. An electromagnetic device may be provided, which includes: a conductive element with an increased thickness, the conductive element being wrapped in a body formed of a core material; and a pin or pin portion with a decreased thickness and connected to the conductive element.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the benefit of U.S. Patent Application No. 17 / 351,782, filed on June 18, 2021, which is incorporated herein by reference in its entirety as if fully set forth herein. Technical Field

[0003] This application relates to the field of electronic components, and more particularly, to electromagnetic devices having multi - thickness elements (e.g., conductive elements and pins for devices such as inductors), methods of manufacturing multi - thickness electromagnetic devices, and electromagnetic devices formed using the multi - thickness templates described herein. Background Art

[0004] Electromagnetic devices (such as inductors) are generally passive two - terminal electronic components. An inductor typically includes a conductor (such as a wire) wound into a coil. When current flows through the coil, energy is temporarily stored in the magnetic field of the coil. When the current flowing through the inductor changes, according to Faraday's law of electromagnetic induction, a time - varying magnetic field induces a voltage in the conductor.

[0005] Some known inductors generally have a core of magnetic material with a conductor (such as a wound coil) disposed therein, and sometimes the conductor is formed as a wound coil. Examples of known inductors include U.S. Patent No. 6,198,375 ("Inductor Coil Structure") and U.S. Patent No. 6,204,744 ("High - Current, Low - Profile Inductor"), the entire contents of which are incorporated herein by reference.

[0006] Typically, it is necessary to form, set, or adjust the performance characteristics of an electromagnetic device by changing the characteristics or parameters of certain elements (such as wires or coils). Many electromagnetic devices use wound coils formed of conductive material. The characteristics of such devices can be adjusted by increasing the number of turns of the coil, thereby increasing the number of coil windings. Thus, this arrangement requires special and careful mechanical adjustment.

[0007] Designs of electromagnetic devices that require the coil to be formed as a laminated layer or a folded layer require additional processing and adjustment. Designs that require different components to be welded together may require additional processing and adjustment and have weaknesses.

[0008] Designs of electromagnetic devices with relatively thick pin portions have the potential to cause the core around the pin to crack when the pin is bent around the core.

[0009] There is a need for a simple and cost - effective method to produce consistent electromagnetic devices (such as inductors) with a low DC resistance (DCR).

[0010] There is also a need to fabricate an electromagnetic device (e.g., an inductor) in which the electromagnetic device is formed in a manner that improves its performance.

[0011] There is also a need to fabricate an electromagnetic device (e.g., an inductor) in which a conductive element (e.g., a coil or a wire) can have varying dimensions but is not wound or formed from a wound wire. SUMMARY OF THE INVENTION

[0012] Disclosed herein are electromagnetic devices having multi - thickness conductive elements and leads, and methods of making, forming, or otherwise fabricating multi - thickness electromagnetic devices.

[0013] As used herein, the term "multi - thickness" can refer to having more than one thickness, at least two different thicknesses, multiple thicknesses, varying thicknesses, or multiple different thicknesses. In some aspects, the thickness can be measured along the length, width, or height depending on the orientation of the electromagnetic device or lead frame. As used herein, the term "multi - thickness electromagnetic device" refers to an electromagnetic device having a coil, conductor, or conductive element and one or more leads, wherein the coil, conductor, or conductive element and one or more leads have varying or different thicknesses, as described in more detail herein. For example, the coil, conductor, or conductive element can have a first thickness, one of the leads can have a second thickness, another of the leads can have a third thickness, and the first thickness is different from the second thickness, and / or the first thickness is different from the third thickness.

[0014] According to one aspect of the present invention, an electromagnetic device includes a conductive element formed of a conductive material, the conductive element being connected to a first lead and a second lead. The conductive element has a first thickness, the first lead has a second thickness, and the second lead has a third thickness. The first thickness can be different from the second thickness. The first thickness can be different from the third thickness. The first thickness can be greater than the second thickness. The first thickness can be greater than the third thickness. The conductive element can be of various shapes.

[0015] A method of fabricating an electromagnetic device according to one aspect of the present invention includes the steps of: providing a conductive material; and forming the conductive material into a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion having a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness. The method can also optionally include pressing a body around the conductive element, at least a portion of the first lead, and at least a portion of the second lead.

[0016] A method of fabricating a template for forming a multi - thickness electromagnetic device according to one aspect of the present invention includes the steps of: providing a conductive material; and forming the conductive material into a multi - thickness template, the multi - thickness template including a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion including a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the second thickness. The template can take the form of a lead frame.

[0017] According to one aspect of the present invention, a method for fabricating a template for a multi - thickness electromagnetic device is provided. The method can include extruding a conductive material into a multi - thickness metal extrusion or sheet having regions of varying thickness or height. The extruded conductive material is a single, continuous, joined, or integral piece of conductive material (e.g., conductive metal). Preferably, the thickness of the region where the thickness increases (e.g., the generally central region of the extruded conductive material) is greater than the thickness of the outer or side regions or portions and / or leads of the extruded conductive material. The multi - thickness extruded conductive material can be electroplated, for example, nickel - plated as a first layer and tin - plated as a second or outer layer. The multi - thickness extruded conductive material is stamped into a multi - thickness template of a desired shape, the multi - thickness template having a conductive element connected to a first lead and a second lead. Thus, the stamped multi - thickness template includes a formed region, which can be regarded as a coil, a coil region, or a wire region, and is generally referred to as a "conductive element". The conductive element is generally formed in the region where the template thickness increases, at the center or inner region of the template. The conductive element, the first lead, and the second lead are all formed from a single, continuous, joined, or integral piece of conductive material.

[0018] In another aspect of the present invention, a method of fabricating a multi - thickness template for an electromagnetic device is provided. The method includes providing a metal plate or sheet or strip of conductive material having a uniform initial thickness or height. The conductive material is a single, continuous, joined, or integral piece of conductive material. A metal thinning or cutting process is performed on the conductive material using a cutting tool having different - sized surfaces (e.g., a blade having a cutting surface of a first height and at least one non - cutting surface of a smaller second height) to produce a multi - thickness metal sheet. The conductive material can be electroplated, for example, nickel - plated as a first layer and tin - plated as a second or outer layer. The conductive material is stamped into a template of a desired shape, the template having a conductive element connected to a first lead and a second lead. The thickness of the conductive element (associated with the region where the thickness of the multi - thickness template increases) is greater than the thickness of the outer or side regions and / or leads of the multi - thickness template.

[0019] In another aspect of the present invention, a method of making a multi-thickness template for an electromagnetic device is provided. The method includes providing a sheet or strip of metal or conductive material having a uniform starting thickness or height. The conductive material is a single, continuous, connected or integral piece of conductive material, e.g., a metal sheet. The conductive material can be electroplated, e.g., nickel plated as a first layer and tin plated as a second or outer layer. The conductive material is stamped into a template that includes conductive elements of a desired shape and leads extending from the conductive elements. To produce a multi-thickness template in which the thickness of the conductive elements is greater than the thickness of the outer or side regions of the conductive material and / or the leads, selected outer regions of the template (which can include the leads) can be flattened by methods such as forging or pressing. In this way, the selected outer regions have a reduced thickness or height compared to the thickness or height of the conductive elements.

[0020] In one aspect of the present invention, the conductive elements have a reduced thickness compared to the thickness of a first lead and / or compared to the thickness of a second lead. In such an aspect of the present invention, a method similar to the method described above can be performed such that the conductive elements have a reduced thickness and the first lead or the second lead has an increased thickness compared to the thickness of the conductive elements.

[0021] In one aspect of the present invention, an electromagnetic device can be formed using the template disclosed herein.

[0022] In one aspect of the present invention, an electromagnetic device can be formed having only conductive elements and lead portions of different thicknesses without any additional core body (magnetic core body) or core material (magnetic core material) formed around the conductive elements or lead portions.

[0023] An electromagnetic device according to one aspect of the present invention can include a compressed and / or molded powder core or body or core formed from magnetic powder, e.g., compressed and / or molded around the conductive elements and portions of the conductive elements (e.g., lead portions adjacent to the conductive elements). The leads can then be positioned and bent around an outer surface of the body to form contact points at one outer surface of the body. Preferably, portions of the leads are positioned along a bottom surface of the body to form surface mount leads. In other aspects, the leads are not bent in this manner.

[0024] The conductive material can be formed into conductive elements having a specific shape (e.g., serpentine or meandering), or can be formed into an "S" shape, or other shapes having curved or curvilinear regions, such as circular, oval or omega (Ω) shaped. The conductive elements can be formed into a selected shape, such as generally rectangular or beam rectangular, "I" shaped or "H" shaped, "barbell" shaped or other selected shapes. The body of the electromagnetic device surrounds the conductive elements and can be pressed around the conductive elements, leaving leads extending from one or more surfaces of the body.

[0025] It should be noted that the conductive element of the present invention can be formed without winding or providing multiple layers of wires or coils. Aspects of the present invention provide a non-wound conductive element, the shape of which has a region with an increased thickness or height, and is formed as an integral part with the attached pins by extruding, stamping, pressing, and / or cutting a metal sheet. Preferably, there is no interruption or break in the conductive element along the path from one pin to the other pin. The conductive element is not wound, and no part passes above or below another part of the conductive element, or crosses above or below another part of the conductive element.

[0026] It is understood that other conductive materials known in the art can also be used without departing from the teachings of the present invention, such as other materials for coils or conductive elements in electromagnetic devices. If required for a specific application, insulating materials can also be used around or between some of the conductive elements and / or pins.

[0027] The pin portions can be arranged along a substantially straight path or be substantially in the same plane, and can have a selected height and width.

[0028] The pins and the conductive element can be formed simultaneously during the manufacturing process. The conductive element does not have to be joined to the pins by welding, for example.

[0029] By applying the teachings described herein, an electromagnetic device with multiple thicknesses of conductive material can be formed, and the conductive material is provided in a single, continuous, or integral part.

[0030] The function of the coil region or part of the conductive element with an increased thickness is to reduce the direct current resistance (DCR) of the inductor.

[0031] The reduction in the thickness of the outer portion (such as the pin portion) makes it easier to form the pins. In addition, the pin portions formed according to aspects of the present invention increase the solderable surface area of the pin portions, and also improve the shock and vibration performance by enhancing the mounting stability of the component. In addition, the formed pin portions also improve the heat conduction between the electromagnetic device and the circuit board (such as a printed circuit board (PCB)) on which the device is mounted. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above aspects and many attendant advantages of the present invention will be more readily understood with reference to the following detailed description in conjunction with the accompanying drawings:

[0033] Figure 1A An isometric view of a partially transparent electromagnetic device according to one aspect of the present invention is shown;

[0034] Figure 1B Shown as Figure 1ATop view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0035] Figure 1C Shows as Figure 1A Side view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0036] Figure 2A Isometric view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0037] Figure 2B Shows as Figure 2A Top view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0038] Figure 2C Shows as Figure 2A Side view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0039] Figure 3 Shows a flowchart that illustrates a method for fabricating a multi - thickness template and an electromagnetic device according to one aspect of the present invention;

[0040] Figure 4 Shows a metal sheet formed of a conductive material according to various aspects of the present invention;

[0041] Figure 5A Shows a multi - thickness metal sheet according to one aspect of the present invention;

[0042] Figure 5B Shows Figure 5A Side view of the multi - thickness metal sheet;

[0043] Figure 6 Shows a multi - thickness template according to one aspect of the present invention;

[0044] Figure 7 Shows a multi - thickness template according to one aspect of the present invention, with a body formed around multiple regions of the template;

[0045] Figure 8 Shows a multi - thickness template according to one aspect of the present invention;

[0046] Figure 9 Shows a flowchart that illustrates a method for fabricating a multi - thickness template and an electromagnetic device according to one aspect of the present invention;

[0047] Figure 10 Shows a blade for performing a thinning process on a metal sheet to form a multi - thickness metal sheet;

[0048] Figure 11 A flowchart is shown which illustrates a method for fabricating a multi - thickness template and an electromagnetic device according to one aspect of the present invention;

[0049] Figure 12 A template according to one aspect of the present invention is shown;

[0050] Figure 13 A detailed view of a multi - thickness template according to one aspect of the present invention is shown, which template has flattened (crushed) pin portions;

[0051] Figure 14 An isometric view of an electromagnetic device according to one aspect of the present invention is shown;

[0052] Figure 15 An isometric view of an electromagnetic device or a template according to one aspect of the present invention is shown; and

[0053] Figure 16 A template according to one aspect of the present invention is shown. DETAILED DESCRIPTION

[0054] Certain terms used in the following description are for convenience only and are not limiting. The words "right", "left", "top" and "bottom" denote directions in the indicated drawings. The words "a" and "an" as used in the claims and corresponding portions of the specification refer to one or more of the indicated items unless otherwise specifically stated. The term includes the specifically mentioned words, their derivatives and words of similar import. The phrase "at least one" followed by two or more listed items, such as "A, B or C", refers to any one of A, B or C, and any combination thereof. It should be noted that the partial transparency shown in some of the figures is for explanatory, illustrative and demonstrative purposes only and does not imply that the element itself is transparent in its final manufactured form.

[0055] Figure 1A - 1C An example of an electromagnetic device 100 that can be formed according to one aspect of the present invention is shown. The electromagnetic device 100 includes a conductive element 150 having a selected shape. The conductive element may also be referred to as a "coil" or a "coil region". In Figure 1A - 1C one illustrated embodiment, the conductive element 150 includes a serpentine or meandering conductive element, starting from Figure 1A and Figure 1BViewed in the direction of [[ID=]], or from above or below, the conductive element is an "S-style" conductive element, an "S-shaped" conductive element, or an "S-style conductive element". The first bent portion C1 has a first end 152 (also referred to as a "pin portion") extending from adjacent one of the pins 140a and a second end 153, and the first bent portion C1 bends around the center of the conductive element 150. The second bent portion C2 has a first end 155 (also referred to as a "pin portion") extending from the other pin 140b and a second end 154, and the second bent portion bends around the center of the conductive element 150 in a direction opposite to that of the first bent portion C1. Each bent portion forms an arc surrounding the central portion of the conductive element 150. Each bent portion can travel along a circumferential path around the central region of the device. A similar shape configuration of an electromagnetic device is shown and described in U.S. Patent No. 10,854,367, the entire content of which is incorporated herein by reference as if fully set forth herein. The conductive element 150 has a central portion 151 that extends substantially diagonally (across) and between the second end 153 and the second end 154 and connects the second end 153 to the second end 154, and preferably can pass through the central region of the conductive element. The central portion 151 is generally straight.

[0056] The S-style conductive element or "S" shape is a display of one aspect of the present invention. The present invention also contemplates other configurations, including arc-shaped, Z-shaped conductive element configurations, or N-shaped conductive element configurations. Bent or straight conductive elements are also contemplated by the present invention and are within the scope of the present invention. A conductive element configuration that extends along a meandering path between the pins and in which a portion of the conductive element passes through the midline or central portion of the conductive element or the electromagnetic body will be considered a "snake-shaped" conductive element. For example, but not limited to, S-shaped conductive elements, Z-shaped conductive elements, N-shaped conductive elements, and conductive elements of other shapes having a meandering path from one pin to another are all considered "snake-shaped" conductive elements. The shape of the conductive element 150 can be designed to optimize the path length to fit the available space within the electromagnetic device while minimizing resistance and maximizing inductance. The shape of the conductive element 150 can be designed to increase the ratio of the space used to the available space within the electromagnetic body. In one embodiment of the present invention, the conductive element 150 has a top surface or upper surface that is preferably flat and is oriented substantially in a plane. A snake-shaped conductive element can be considered a coil or a coil region, but is distinct from a "wound" conductive element formed by a wire or piece of conductive material that is wound around and surrounds the central portion or axis of an electromagnetic core.

[0057] As Figure 1A - 1CAs shown, the illustrated electromagnetic device 100 has a length L1 that travels along the X1-X2 axis or direction, where X1 points in a first direction and X2 is a second direction opposite to the first direction; a length L2 that travels along the Y1-Y2 axis or direction, where Y1 points in a third direction and Y2 points in a fourth direction opposite to the third direction; and a first thickness H1 (or height when viewed from the side as shown) that travels along the Z1-Z2 axis or direction, where Z1 points in a fifth direction and Z2 points in a sixth direction opposite to the fifth direction. For ease of reference, the Z1-Z2 axis is referred to as the "thickness". For ease of reference, one or more regions of the conductive element having an increased thickness or height may be referred to as "thickness-increase regions". Figure 1C As shown, when viewed from the side as shown.

[0058] According to one aspect of the present invention, as Figure 1C shown, the conductive element 150 has a thickness-increase region 159, as Figure 1C shown, the thickness-increase region 159 has a first thickness T1 that is increased compared to a second thickness T2 and a third thickness T3 of a portion of the conductive material (e.g., pins 140a, 140b) along the Z1-Z2 axis, and includes pin portions 156, 157 that are adjacent to the outer ends 174, 175 of the conductive element 150. In this configuration, the conductive element 150 having an "S" shape substantially entirely includes the thickness-increase region 159. It can be understood that the portion of the conductive element having a thickness-increase region may also be less than the entire conductive element having an "S" shape. For example, the conductive element may be formed to have a thicker portion and a thinner portion, where each thicker portion includes a thickness-increase region. In this configuration, the pin 140a has a thickness T2 along substantially the entire length of the pin 140a, while the pin 140b has a thickness T3 along substantially the entire length of the pin.

[0059] As Figure 1A - 1CAs shown, in one aspect of the present invention, a finished electromagnetic device such as inductor 100 may include a body 133 (also referred to as a core) shown in a partially transparent form, which is formed to surround, press on, or otherwise accommodate or enclose a conductive element and at least a portion of the pins. The body may be formed into a first body portion 110 and a second body portion 120. The first body portion 110 and the second body portion 120 clamp the conductive element 150 and portions of the pins 140a, 140b, are pressed (compressed) around the conductive element 150 and portions of the pins 140a, 140b, or otherwise accommodate or enclose the conductive element 150 and portions of the pins 140a, 140b to form the finished inductor 100. When compressed (pressed tightly) around the conductive element and portions of the pins, the first body portion 110 and the second body portion 120 may be combined and regarded as a single integral compressed body, and may be simply referred to as the "body" or "core".

[0060] The body 133 can be formed of a magnetic material including a ferromagnetic material and can be formed to have an upper or top surface 134 and an opposite lower or bottom surface 135, a first side surface 136 and an opposite second side surface 137, and a first lateral side 170 adjacent to the first lead 140a and an opposite second lateral side 172 adjacent to the second lead 140b. The body can include, for example, iron, metal alloys, and / or ferrites, combinations of these materials, or other materials known in the field of electromagnetic devices for forming such bodies. The first body portion 110 and the second body portion 120 can be made of iron powder or similar materials. Other acceptable materials known in the field of electromagnetic devices (such as known magnetic materials) can also be used to form the body or body portions. For example, the body can use a magnetic molding material as described in U.S. Patent No. 6,198,375 ("Electromagnetic Conductive Element Structure") and U.S. Patent No. 6,204,744 ("High Current, Low Profile Inductor"), which magnetic molding material includes iron powder, filler, resin, and lubricant, the entire contents of the above-mentioned U.S. patents being incorporated herein by reference as if fully set forth herein. The body 133 can be formed of a magnetic material powder including one or more of the following materials: iron, iron alloys, and / or ferrites and / or combinations of these materials. For example, the body 133 can be made of iron, metal alloy, or ferrite, combinations of these materials, or other materials known in the field of inductors for forming such bodies. Each material listed or referenced in U.S. Patent No. 6,198,375 and U.S. Patent No. 6,204,744 (including any combination of these materials) and any equivalents known in the relevant field are generally referred to as "a core material (magnetic core material)" or "core materials". Although it is conceivable that the first body portion 110 and the second body portion 120 are formed of the same core material in a similar manner, the first body portion 110 and the second body portion 120 can be formed using different processes and of different core materials, which is known in the art.

[0061] The conductive material regions located between the thickness-increasing region T1 and the outer lateral sides 170, 172 of the body 133 can be regarded as the starting portions of the leads 140a and 140b, or the transition portions of the conductive elements 150, which starting or transition portions have a smaller thickness or height and extend between the thickness-increasing region and each lateral side 170, 172. For ease of reference, these regions are referred to as the first inner lead portion 156 and the second inner lead portion 157, which portions will be included within or otherwise surrounded by the body 133 as further described.

[0062] The first body portion 110 and the second body portion 120 surround the conductive element and a portion of the leads and can be compression molded or overmolded around the conductive element 150, and initially leave exposed portions of the leads 140a, 140b until these exposed portions are folded under the first body portion 110, and the final state of these exposed portions is shown in the partially transparent examples of FIGS. 1 and 2. As Figure 1A - 1C shown, in the finished electromagnetic device or "component", each of the leads 140a, 140b can have a portion that travels along or otherwise extends along the side or side surface of the first body portion 110. As Figure 1A - 1C shown, the first lead 140a can terminate at a surface mount contact portion 130a, and the second lead 140b can terminate at a surface mount contact portion 130b, with each of the leads 140a and 140b bent under the lower surface 135 of the body 133 (which can be the first body portion 110).

[0063] It is contemplated that the electromagnetic device according to aspects of the present invention can be formed as a coreless body, for example, with its leads bent to form surface mount terminals. Figure 14 An example is shown. Figure 15 A similar coreless body device is shown, with its leads being straight or unbent and extending straight outwards from the conductive element or at an angle. Thus, Figure 14 and Figure 15 show examples of finished electromagnetic devices that can include the multi-thickness conductive element and lead portions described, but without any core material or core body surrounding these elements. The electromagnetic device 100' can include a conductive element 150' having a serpentine shape. The first bent portion C1' has a first end 152' (also referred to as a "lead portion") extending adjacent to one of the leads 140a' and a second end 153', and the first bent portion C1' bends around the center of the conductive element 150'. The second bent portion C2' has a first end 155' (also referred to as a "lead portion") extending from the other lead 140b' and a second end 154', and the second bent portion bends around the center of the conductive element 150' in a direction opposite to that of the first bent portion C1'. Each bent portion forms an arc surrounding the central portion of the conductive element 150'. Each bent portion can travel along a circumferential path around the central region of the device. The central portion 151' of the conductive element 150' extends generally diagonally across and between the second end 153' and the second end 154', and connects the second end 153' to the second end 154', and preferably can pass through the central region of the conductive element. The central portion 151' is generally straight. The first inner lead portion 156' is adjacent to the first end 152'. The second inner lead portion 157' is adjacent to the second end 155'. The conductive element 150' has a thickness increasing region 159'. In Figure 15In [description], pins 140a' and 140b' are shown as extending straight outwards from the conductive element 150'. In Figure 14 In [description], pins 140a' and 140b' are bent to form surface mount pin portions 130a' and 130b'. In Figure 15 In [description], the thickness increasing region of the conductive element 150' has a first thickness TH1B that is increased compared to a second thickness TH2B near the outer end 174' and a third thickness TH3B near the outer end 175'.

[0064] Pins 140a and 140b may have the same uniform thickness or substantially the same uniform thickness along their entire lengths.

[0065] In another aspect of the present invention, Figure 2A - 2C An example of an electromagnetic device 200 that can be formed according to one aspect of the present invention is shown. The electromagnetic device 200 includes a shaped conductive element 250. In Figure 2A - 2C In the exemplary device shown, the conductive element 250 includes a substantially straight conductive element that, when viewed from the top as Figure 2B shown, is arranged as an "I" or "H" shaped conductive element, or a conductive element having a "barbell" shape. Such a conductive element can further be regarded as or referred to as a coil. In this arrangement, the central portion 252 of the conductive element 250 has a width W1 along the Y1 - Y2 axis or direction (as Figure 2A - 2C shown), the first side portion 253 has an outer width W2 along the Y1 - Y2 axis or direction (as Figure 2A - 2C shown), the outer width W2 is greater than the width W1, and the second side portion 254 located on the side of the device 200 opposite to the first side portion 253 has an outer width W3 along the Y1 - Y2 axis or direction (as Figure 3 shown), the outer width W3 is greater than the width W1, and may be the same as the width W2. The conductive element 250 may have a generally rectangular shape between the first side portion 253 and the second side portion 254.

[0066] As Figure 2A - 2C shown, according to one aspect of the present invention, the conductive element 250 has a thickness increasing region 259, as Figure 2CAs shown, this thickness-increased region 259 has a first thickness T1' that is increased compared to a second thickness T2' and a third thickness T3' of other portions of the conductive material, such as the lead portions (including the first inner lead portion 255 and the second inner lead portion 257) adjacent to the outer ends 274, 275 of the conductive element 250, along the Z1-Z2 axis or direction. In this configuration, substantially all of the conductive element having a "barbell" shape can have the increased first thickness T1'. It can be understood that the portion of the conductive element having the thickness-increased region can also be less than all of the conductive element having a "barbell" shape. It should be noted that the conductive element 250 is not wound around an axis.

[0067] Although the finished electromagnetic device according to the present invention can be formed without a core, as Figure 2A - 2C shown, in one aspect of the present invention, a finished electromagnetic device 200 such as an inductor can include a body 233 or a core, which is shown in a partially transparent manner and formed around, pressed on, or otherwise houses or surrounds the conductive element 250 and at least a portion of the leads 240a, 240b. The body 233 can be formed to have an upper surface or top surface 234 and an opposite lower surface or bottom surface 235, a first side surface 236 and an opposite second side surface 237, and a first lateral side surface 270 adjacent to the first lead 240a (or "lead portion") and an opposite second lateral side surface 272 adjacent to the second lead 240b (or "lead portion"). The body can be formed as a first body portion 210 and a second body portion 220. The first body portion 210 and the second body portion 220 clamp the conductive element 150 and portions of the leads 240a and 240b, press around the conductive element 150 and portions of the leads 240a and 240b, or otherwise house the conductive element 150 and portions of the leads 240a and 240b to form the finished inductor 200. When compressed around the conductive element and portions of the leads, the first body portion 210 and the second body portion 220 can be regarded as a single integral compressed body formed of one or more core materials.

[0068] The first body portion 210 and the second body portion 220 surround the conductive element and portions of the leads and can be pressed or overmolded around the conductive element 250, initially leaving exposed portions of the leads 240a and 240b until these exposed portions are folded under the first body portion 210, Figure 2A - 2C and the final state of these exposed portions is shown in the partially transparent example of Figure 2A - 2C shown. As Figure 2A - 2CAs shown, the first pin 240a may terminate at a first contact portion 230a, and the second pin 240b may terminate at a second contact portion 230b, with each contact portion being bent below the lower surface 235 of the body 233 (such as the first body portion 210).

[0069] A method for fabricating Figure 1A - 2C or Figure 14 - 16 the electromagnetic device exemplarily shown in Figure 1A - 2C or Figure 14 - 16 a similar electromagnetic device having multi - thickness elements or a multi - thickness template for forming the electromagnetic device shown in

[0070] In one aspect of the present invention, the flowchart provided in Figure 3 shows a method for fabricating an electromagnetic device.

[0071] In step 1010, a conductive material is provided. The conductive material can be heated to form a molten conductive material, which will be shaped as described herein. Examples of conductive materials that can be used include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys of these materials. Further examples of conductive materials that can be used include conductive materials provided in the form of wires such as copper wires, aluminum wires, and platinum wires.

[0072] In step 1012, the conductive material (e.g., the heated or molten conductive material) is extruded through a metal extrusion process (e.g., by extruding the heated or molten conductive material through an opening of a selected shape) to form a multi - thickness sheet. The extrusion process can include forcing the molten or heated conductive material (such as a metal) through a die having a desired profile or shape. Figure 5A and Figure 5B shows a multi - thickness sheet 310 having a central region 312, a first outer portion 316, and a second outer portion 320. The central region 312 has a thickness - increasing region 314 having an increased first thickness TH1. The first outer portion 316 is adjacent to a first side 318 of the thickness - increasing region 314 and has a second thickness TH2 less than the thickness TH1. The second outer portion 320 is adjacent to a second side 329 of the thickness - increasing region 314 and has a third thickness TH3 less than the thickness TH1. As shown, the first outer portion 316 and the second outer portion 320 can be located on opposite sides of the thickness - increasing region 314. As further described, the multi - thickness sheet 310 is used to form a template.

[0073] In step 1014, the multi-thickness sheet 310 can be electroplated using electroplating or a similar process, where nickel plating is the first layer and tin is applied on top of the nickel as the second layer. Known electroplating methods can be used to apply the nickel layer and the tin layer. These layers can improve solderability.

[0074] In step 1016, the multi-thickness sheet 310 is stamped or otherwise processed or formed to form a multi-thickness template 322 for an electromagnetic device as shown in Figure 1A - 1C . Figure 6 A multi-thickness template 322 with a conductive element 150 is shown, where the conductive element 150 has an arrangement as shown in Figure 1A - 1C , but it is understood that conductive elements of various shapes can be formed without departing from the teachings herein. When stamped or otherwise processed, the template 322 includes a thickness-increased region that is associated with the thickness-increased region 314 of the increased thickness TH1 of the multi-thickness sheet 310 used to form the template 322. The conductive element 150 can be located at the center or inner region of the template.

[0075] Although Figure 6 shows more than one conductive element by way of example, a template with only a single conductive element can also be provided. In addition, the template can also be provided with more than two or any number of conductive elements.

[0076] It should be noted that steps 1014 and 1016 can be performed in any order. For example, the multi-thickness sheet 310 can be formed into the multi-thickness template 322 according to step 1016 and then electroplated according to step 1014.

[0077] As shown in Figure 6 , the template 322 includes pins 140a, 140b connected to the conductive element 150, where the regions forming the pins 140a, 140b are associated with a first outer portion 316 having a thickness TH2 and a second outer portion 320a having a third thickness TH3. Therefore, the thickness of both pins 140a and 140b is less than the increased thickness TH1 of the conductive element 150. The first inner pin portion 156 and the second inner pin portion 157 adjacent to the conductive element 150 can facilitate (e.g., by bending) the formation of the pins. Due to the reduced thickness of the pins, these regions are more easily bent and formed into surface-mount pins without cracking or breaking. As shown in Figure 1B and Figure 6 , the width of the pins 140a, 140b along the Y1 - Y2 axis or direction can be less than the width of the conductive element 150.

[0078] For example, as shown in Figure 1A - 1C and Figure 6As shown, the widths (along the Y1 - Y2 axis or direction) of the first inner pin portion 156 of the first pin 140a and the second inner portion 157 of the second pin 140b can be narrower or smaller than the widths of other portions of the pins 140a, 140b (e.g., the first surface - mount contact portion 130a and the second surface - mount contact portion 130b).

[0079] The upper surface of the conductive element 150 can be formed to be substantially in a plane or along a plane. The lower surface of the conductive element 150 can be formed to be substantially in a plane or along a plane. The upper or lower surface of the conductive element can be generally flat.

[0080] The pins 140a, 140a can be formed to have an upper or lower surface that is substantially in a plane or along a plane. The upper or lower surface of the pins 140a, 140b can be generally flat.

[0081] As Figure 6 shown, the template 322 can be formed as a lead frame and can include at least first and second carrier tapes 324, 326 at opposite outer portions of the lead frame 322. The carrier tapes 324, 326 can have a series of holes 328 for alignment with associated manufacturing equipment. Thus, the carrier tapes 324, 326 can be considered optional.

[0082] It should be noted that the conductive element 150, the pins 140a, 140b, and the carrier tapes 324, 326 (if present) are all formed from the same piece of conductive material that has been pre - formed so that the conductive element 150 has an increased thickness compared to the thickness of the pins 140a, 140b. The conductive element 150 is formed in a pre - selected shape without winding or turning a metal strip or wire. No part of the conductive element 150 crosses above or below another part of the conductive element 150. The inductance of the electromagnetic device taught herein can be adjusted in the following ways, for example: changing the thickness, width, shape, or other dimensions of the conductive element; changing the core material; increasing or decreasing the thickness of the core material; changing the density of the core material, e.g., by hot - pressing or cold - pressing; and / or positioning the conductive element within the core body.

[0083] It should be further noted that Figure 15 can also be considered as showing a template of an electromagnetic device that can be further formed, for example, by trimming or bending the pins 140a’, 140b’. In this case, the template can be formed by stamping a multi - thickness conductive material into Figure 15 the shape shown.

[0084] In step 1018, when the device has a core, one or more core materials (preferably, core materials composed of powders of iron and / or ferrite) are pressed around the conductive element 150 and the partial leads 140a, 140b (including the first inner lead portion 156 and the second inner lead portion 157) to form the body 133. To form the body 133, the electroplated template 322 can be inserted into a press, in which one or more core materials will be pressed into a desired shape around the coil portion of the lead frame, for example, generally rectangular, but as shown, the shape can include rounded corners or rounded edges. Figure 7 The template 322 is shown, and the body formed around the conductive element 150 and the partial leads 140a, 140b is shown, where the body 133 is shown in a partially transparent manner. It should be noted that if an electromagnetic device without a core is to be formed, step 1018 can be optional.

[0085] In step 1020, the portion of the template adjacent to the leads is trimmed to a selected size and positioned around the body 133 to form surface mount leads, which is ideal for modern circuit board assembly processes. At least a portion of each of the leads 140a, 140b is positioned along the side surface of the body 133, and at least the ends 130 of the leads 140a, 140b are bent under and along a portion of the bottom surface 135 of the body 133. As previously mentioned, an example of the finished electromagnetic device 100 is shown in Figure 1A as follows.

[0086] Figure 8 The template 330 is shown, and the template 330 can be formed according to the Figure 3 steps shown and is associated with an electromagnetic device having a conductive element 250 as shown in Figure 2A - 2C as follows. As shown in Figure 8 the template 330 includes the conductive element 250, and the conductive element 250 includes a straight conductive element, which is arranged as an "I" or "H" shaped conductive element or a conductive element having a "barbell" shape when viewed from the top. The template can be formed according to the steps outlined and described previously in Figure 3 as follows. In step 1016, the selected shape of the conductive element 250 is shown in Figure 2A - 2C as follows.

[0087] As shown in Figure 8As shown, the template 330 includes a conductive element 250 and pins 240a, 240b. For example, if the template 330 is formed as a lead frame, a carrier tape 332, 334 may be provided. The conductive element 250 and the pins 240a, 240b are formed from the same single piece of conductive material. The carrier tapes 332, 334 may have a series of holes 336 for alignment with related manufacturing equipment. The conductive element 250 can be formed to have an increased thickness area 280, which has a thickness TH1a. The first pin 240a has a thickness TH2a, and the second pin 240b has a third thickness TH3a. Therefore, the thickness of the pins 240a, 240b is less than the increased thickness TH1a of the conductive element 150. The thickness of the first inner pin portion 255 and the second inner pin portion 257 adjacent to the conductive element 150 is reduced to facilitate (e.g., by bending) forming the pin. Due to the reduced thickness of the pin, these areas are easier to bend and form surface mount pins without cracking or breaking. For example, Figure 2B and Figure 8 As shown, the width of the first inner pin portion 255 and the second inner pin portion 257 (along the Y1-Y2 axis or direction) can be narrower or smaller than the width of other portions of the pins 240a, 240b (e.g., the first surface mount contact portion 230a or the second surface mount contact portion 230b).

[0088] According to various aspects of the present invention, the electromagnetic device can also be made using a thinning or cutting process. The thinning process uses a cutting blade to remove material.

[0089] In one aspect of the present invention, by Figure 9 A flowchart is provided to illustrate a method for making an electromagnetic device. In step 2010, a sheet of conductive material is provided as a starting material. The conductive material sheet can be formed from a conductive material (eg, by a rolling or pressing process). Figure 4 An example sheet 300 of conductive material is shown. The term "sheet" is also used to understand the concept of using a sheet or plate or strip of conductive material as a starting material for forming the template of the present invention. Preferably, the sheet 300 of conductive material is composed of a metal such as copper. Examples of conductive materials that can be used to form the sheet 300 include, but are not limited to, copper, steel, aluminum, zinc, bronze, or a combination or alloy of these materials. The thickness of the metal sheet can be selected to be the thickness of the area where the thickness of the conductive element formed by the sheet is increased. It is further contemplated that the conductive material can be formed or provided as or can start with a rod, wire, or other arrangements or shapes that can be processed or formed according to the teachings of this article without departing from the various aspects of the present invention. Therefore, although a sheet is used as an example, other conductive materials with other shapes can also be used to form the electromagnetic device shown and described.

[0090] In step 2012, a thinning process is performed, wherein a sheet is cut using a blade to form a multi-thickness sheet 410.

[0091] Figure 10 Shown is a cutting blade 437 having a raised central cutting portion 439 as shown in the process of cutting a sheet of conductive material to form a multi-thickness sheet 410. The resulting multi-thickness sheet 410 has: a central region 412 provided as a thickness-increasing region, the central region 412 having an increased thickness; a first outer portion 416 adjacent to a first side 418 of the thickness-increasing region 414, the first outer portion 416 having a second thickness less than the thickness of the central region 412; a second outer portion 420 adjacent to a second side 422 of the thickness-increasing region 414, the second outer portion 420 having a third thickness less than the thickness of the central region but which may be equal to the thickness of the first outer portion 416. As shown, the first outer portion 416 and the second outer portion 420 may be located on opposite sides of the thickness-increasing region 414. As further described, the multi-thickness sheet 410 is used to form a template.

[0092] In step 2014, the multi-thickness sheet may be electroplated using electroplating or a similar process, nickel being plated as a first layer and then tin being plated on top of the nickel as a second layer.

[0093] In step 2016, the multi-thickness sheet 410 is stamped or otherwise processed to form a multi-thickness template for use in an Figure 1A - 1C electromagnetic device as shown. At this stage, the process may provide a multi-thickness template as Figure 6 shown.

[0094] In step 2018, one or more core materials (preferably a core material composed of a powder of iron and / or ferrite) are pressed around the conductive element and the partial leads (including the first inner lead portion and the second inner lead portion) to form a body. At this stage, the Figure 7 shown shows a body 133 formed around a partial template. If no core is required, step 2018 may be optional.

[0095] In step 2020, the portion of the template adjacent to the leads is trimmed to a selected size and positioned around the body to form surface mount leads, which is ideal for modern circuit board assembly processes. At least a portion of each lead is positioned along the side surface of the body, and at least the ends of the leads are bent under and along a portion of the bottom surface of the body. As previously mentioned, an exemplary final electromagnetic device 100 is shown in Figure 1A the figure.

[0096] The thinning process may also be used to form a structure having Figure 2A - 2CThe electromagnetic design of the shown arrangement. The thinning process can also be used to form conductive elements having various shapes, sizes, orientations, and / or arrangements.

[0097] Forging and / or pressing and / or flattening (coining) processes can also be used to form electromagnetic devices according to various aspects of the present invention.

[0098] In one aspect of the present invention, the Figure 11 flowchart provided in shows a method for fabricating an electromagnetic device. At step 3010, a sheet of conductive material is provided as the starting material. Figure 4 Sheet 300 shown in shows such an exemplary sheet of conductive material.

[0099] At step 3012, the sheet can be electroplated using electroplating or a similar process, nickel being plated as the first layer and then tin being plated on top of the nickel as the second layer. In this regard, the thickness of the sheet is uniform at this stage of the process. As further discussed, this thickness represents the increased thickness of the conductive element.

[0100] At step 3014, stamping or other machining processes are performed to form a template of uniform thickness.

[0101] Figure 12 Shows a template 500 in the process of being formed, the template 500 including a formed conductive element 520, a first lead 530a, and a second lead 530b, the formed conductive element 520, the first lead 530a, and the second lead 530b all being formed from the same single piece of conductive material that forms the sheet. If the template 500 is formed as a lead frame, carrier tapes 540, 542 may be provided. The carrier tapes 540, 542 may have a series of holes 544 for alignment with associated manufacturing equipment.

[0102] To obtain a multi-thickness template, at step 3016, the first lead 530a and the second lead 530b or portions of each lead are flattened, for example, by forging or pressing.

[0103] Figure 13 Shows a detailed view of a portion of the template 500, where the first lead 530a and the second lead 530b are flattened or compressed such that the thickness of the leads is reduced compared to the thickness of the conductive element 520. Different processes (e.g., stamping, rolling, roll forming, or milling) can be used to produce the thickness-reduced portions.

[0104] After flattening the first pin 530a and the second pin 530b, the central region 512 of the conductive element 520 of the template 500 is formed into a thickness-increased region 514 having the thickness of the original sheet, the thickness of the first pin 530a is reduced and less than the thickness of the central region 512, the thickness of the second pin 530b is reduced and less than the thickness of the central region 512, but may be the same as the thickness of the first pin 530a. The thicknesses of the carrier tapes 540, 542 may be the same as the thickness of the conductive element 520 if these regions are not flattened.

[0105] In step 3018, one or more core materials (preferably core materials composed of powders of iron and / or ferrite) are pressed around the conductive element 520 and the partial pins 530a, 530b to form the body 546. To form the body 546, the electroplated template 500 may be inserted into a press, in which one or more core materials will be pressed into a desired shape around the coil portion of the lead frame, for example, generally rectangular, but as shown in the figure, the shape may include rounded corners or rounded edges. At this stage, the arrangement of the pin body and the frame is similar to that described previously. Figure 7 If no core is required, step 3018 may be optional.

[0106] In step 3020, the portion of the template adjacent to the pins is trimmed to a selected size and positioned around the body 546 to form surface-mount pins, which are ideal for modern circuit board assembly processes. At least a portion of each of the pins 530a, 530b is positioned along the side surface of the body 133, and at least the ends of the pins 530a, 530b are bent below and positioned along a portion of the bottom surface of the body 546.

[0107] It can be envisioned that the steps used in Figure 11 can be employed to form a template including a conductive element provided by a straight conductive element (e.g., Figure 2A - 2C the conductive element in

[0108] in the form of an "I" or "H" shaped conductive element or a "barbell" shaped conductive element when viewed from the top). In addition, it is also possible to start from a template with a substantially uniform thickness (as shown in Figure 12 ) and form a conductive element having a thickness-increased region by electroplating to thicken the conductive element 520. For example, copper can be electroplated above or on top of the conductive element 520 until a certain thickness is reached. This "thickening" process can be accomplished, for example, by 3D printing the electroplating material or by depositing a metal onto the conductive element 520 using methods known in the metalworking industry (such as sputtering, etc.).

[0109] The method described herein can also be used to form an electromagnetic device having a shaped conductive element that has a reduced thickness compared to the thickness of one or more pins. For example, referring to Figure 3 , as step 1012, an extrusion process can form a multi-thickness sheet where the central portion of the sheet has a reduced thickness and the outer sides of the sheet have a greater thickness than the central portion. Further by way of example, referring to Figure 9 , in step 2012, a thinning process can form a multi-thickness sheet where the central portion of the sheet has a reduced thickness and the outer sides of the sheet have a greater thickness than the central portion. Further by way of example, referring to Figure 11 , in step 3016, a flattening process can flatten the conductive element rather than the pins, thereby forming a conductive element having a reduced thickness compared to the pins.

[0110] Thus, as shown in the example of Figure 16 , the template 700 is stamped from a single piece of conductive material having a uniform thickness, such as the sheet shown in Figure 4 . A stamping or other forming process forms a conductive element 750 (which can be a serpentine conductive element), a first pin 740a, and a second pin 740a, all of which are formed from the same single piece of conductive material. In this regard, the conductive element 750 is stamped, pressed, forged, or thinned to produce an electromagnetic device where the thickness of the conductive element is less than that of the pins 740a, 740b. The conductive element 750 can be serpentine, barbell-shaped, or other selected shapes, or can be generally flat with one or more surfaces along or in a plane. The pins 740a, 740b can be bent or trimmed by methods known in the art or as described herein. A core can be molded around the conductive element 750 and portions of the pins.

[0111] The conductive material or sheet of conductive material can be formed such that the region for forming the conductive element has a different hardness than the region for forming the first pin portion or the second pin portion. For example, a first portion of the conductive material can have a first hardness (e.g., medium hard), and a second portion of the conductive material can have a second hardness (e.g., annealed soft). Alternatively, a first portion of the conductive material can have a first hardness (e.g., Vickers hardness 100HV10), and a second portion of the conductive material can have a second hardness (e.g., Vickers hardness 30HV10).

[0112] It is understood that, depending on the process used to form the conductive element, the surface of the conductive element and / or the pin described herein may be slightly or somewhat round, arched, or curved, and the side edges may be rounded, curved, or arched. Acceptable metals for forming the conductive element and the pin may be copper, aluminum, platinum, or other metals known in the art as electromagnetic conductive elements. As used herein, "flat" means "substantially flat", i.e., substantially flat within normal manufacturing tolerances. It is understood that the flat surface of the conductive element and / or the pin may be slightly or somewhat round, arched, curved, or wavy depending on the process used to form the conductive element, and the side edges may be slightly or somewhat rounded, arched, curved, or wavy, but are still considered "flat".

[0113] The increased thickness portion or region of the conductive element described herein can reduce the direct current resistance (DCR) of an electromagnetic device (such as an inductor) including such a conductive element.

[0114] The templates described herein can provide multiple thicknesses in a single integral piece. The templates described herein can also be formed by 3D printing technology.

[0115] The reduced thickness region of the pin or pin portion of the template facilitates the formation of the pin (e.g., by shaping and / or bending). In addition, the thinner but wider pin portion can improve heat conduction when mounted on a circuit board, and due to the width of the surface mount pin or terminal, the mounting strength can be further improved to resist shock and vibration.

[0116] It is understood that the above is for illustration only and not any limitation. Various alternatives and modifications to the described embodiments can be envisioned without departing from the spirit and scope of the present invention. After the present invention has been described in detail, those skilled in the art should understand that many physical changes can be made without changing the creative concepts and principles embodied in the present invention, and only some of these changes are exemplified in the specific embodiments of the present invention. In addition, it is also understood that many embodiments only include a part of the preferred embodiments, and these embodiments do not change the concepts and principles embodied therein. Therefore, the embodiments and alternative configurations of the present invention should be considered exemplary and / or illustrative in all respects and not restrictive, and the scope of the present invention is indicated by the appended claims rather than the above description. Therefore, all alternative embodiments and changes to the embodiments of the present invention within the meaning and equivalent scope of the said claims should be included therein.

Claims

1. A method for fabricating an electromagnetic device with multiple thicknesses, the method comprising the steps of: providing a conductive material; forming the conductive material into a multi-thickness sheet by performing an extrusion process, a thinning process, or a flattening process, the multi-thickness sheet including a first portion having a first thickness, a second portion having a second thickness, and a third portion having a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness; and forming a multi-thickness template by: forming the first portion of the multi-thickness sheet into a conductive element that constitutes a coil of an inductor, forming the second portion of the multi-thickness sheet into a first lead portion, and forming the third portion of the multi-thickness sheet into a second lead portion, wherein the conductive element, the first lead portion, and the second lead portion are formed from a continuous, non-wound piece of conductive material; wherein the first lead portion extends from an inner lead portion adjacent to the conductive element to a first surface-mount contact portion, wherein the thickness of the first lead portion is uniform from the inner lead portion to the first surface-mount contact portion; and wherein the second lead portion extends from an inner lead portion adjacent to the conductive element to a second surface-mount contact portion, wherein the thickness of the second lead portion is uniform from the inner lead portion to the second surface-mount contact portion.

2. The method according to claim 1, wherein at least a portion of the multi-thickness template is formed by stamping the multi-thickness sheet.

3. The method according to claim 1, wherein the conductive element has a serpentine shape, a rectangular shape, an I-shape, an H-shape, or a barbell shape.

4. The method according to claim 1, wherein the surface of the conductive element, the surface of the first lead portion, and the surface of the second lead portion are along or lie in a plane.

5. The method according to claim 1, wherein no portion of the conductive element crosses above or below another portion of the conductive element.

6. The method according to claim 1, wherein the thickness of the first lead portion is substantially uniform along the entire length of the first lead portion, and the thickness of the second lead portion is substantially uniform along the entire length of the second lead portion.

7. The method according to claim 1, wherein the first lead portion has a first width adjacent to the conductive element and a second width at the end of the first lead portion, and wherein the second width is different from the first width.

8. The method according to claim 1, wherein the second lead portion has a first width adjacent to the conductive element and a second width at the end of the second lead portion, and wherein the second width is greater than the first width.

9. A method for fabricating an electromagnetic device, the method comprising the steps of: providing a conductive material; Form the conductive material into a multi-thickness sheet, the multi-thickness sheet including a first portion for forming a conductive element having a first thickness, a second portion for forming a first pin portion having a second thickness, and a third portion for forming a second pin portion having a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness; Form a multi-thickness template by: Form the first portion of the multi-thickness sheet into the conductive element, Form the second portion of the multi-thickness sheet into the first pin portion, and Form the third portion of the multi-thickness sheet into the second pin portion, the conductive element, the first pin portion, and the second pin portion being formed from a continuous, non-wound piece of conductive material; Press a core material around at least a portion of the conductive element, at least a portion of the first pin portion, and at least a portion of the second pin portion to form a body; and Position at least a portion of the first pin portion along an outer surface of the body to form a first surface mount pin, and the method further includes the step of: positioning at least a portion of the second pin portion along the outer surface of the body to form a second surface mount pin.

10. The method according to claim 9, the method further including the steps of trimming the first pin portion and trimming the second pin portion.

11. The method according to claim 10, the method further including: Extend at least a portion of the first pin portion along a bottom surface of the body, and The method further includes the steps of: Position at least a portion of the second pin portion along the bottom surface of the body.

12. The method according to claim 9, wherein, The step of forming the conductive material into a multi-thickness sheet includes performing an extrusion process.

13. The method according to claim 9, wherein, The step of forming the conductive material into a multi-thickness sheet includes performing a thinning process.

14. The method according to claim 9, wherein, The step of forming the conductive material into a multi-thickness sheet includes performing a flattening process.

15. The method according to claim 9, wherein, The step of forming the multi-thickness template includes stamping the multi-thickness sheet to form the conductive element, the first pin portion, and the second pin portion.

16. The method according to claim 9, wherein, The conductive element has a serpentine shape, a rectangular shape, an I shape, an H shape, or a barbell shape.

17. The method according to claim 9, wherein, The surface of the conductive element, the surface of the first pin portion, and the surface of the second pin portion are along or lie in a plane.

18. The method according to claim 9, wherein, No portion of the conductive element crosses above or below another portion of the conductive element.

19. The method according to claim 9, the method further includes the step of electroplating a nickel layer or a tin layer on the multi-thickness sheet or the multi-thickness template.

Images