Electronic component film dispensing sealing method

Abstract

The application discloses a kind of electronic component film dispensing sealing methods, belong to the field of semiconductor packaging, first obtain the film parameter of electronic component film in this dispensing sealing method, then according to film parameter, in combination with continuous helical line mode, dispensing running path is set and output, and finally, film dispensing sealing process is completed by dispensing equipment according to dispensing running path;Dispensing running path adopts at least two circular tracks to form a continuous helical line, and the diameter of circular track gradually decreases from the outer ring to the inner ring of film edge, and multiple circular tracks form a thin and wide glue sealing ring;This method can ensure that the glue covers the film edge stably and comprehensively, improve the sealing performance, prevent the product from leaking, ensure the product efficacy, so as to ensure subsequent stable sample and mass production;The principle of this method is simple, easy to implement, and has good popularization and application value.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of semiconductor packaging, and particularly relates to the field of waterproof and breathable film sealing and dispensing, and especially relates to an electronic component film dispensing and sealing method. BACKGROUND

[0002] The encapsulation film technology is a new type of encapsulation technology, which can encapsulate electronic components in a film, thereby improving the reliability and stability of the components. The application range of the encapsulation film technology is very wide, including the fields of electronics, optoelectronics, medical treatment, aerospace, etc.

[0003] For some electronic component products, such as MEMS pressure sensor products, it is required that the outside air can directly contact the chip through the vent film on the MEMS product shell, and liquid cannot enter to contact the chip. Therefore, in view of the above requirements, it is necessary to use glue to seal the periphery of the film to prevent liquid from seeping from the joint between the film and the MEMS product shell.

[0004] The conventional dispensing and sealing method is to use a dispensing device to dispense a circle of glue around the film to seal the edge of the joint between the film and the product shell. However, due to the limited width of the glue, the glue often cannot cover the edge of the film, causing the product to seep, resulting in product failure and inability to continue sample preparation and mass production. In order to solve this problem, two methods are usually used: the first is to replace the dispensing needle to increase the width of the glue and increase the contact area of the glue with the product film. However, due to the limited space of the working environment, it is difficult to replace the dispensing needle; the second is to increase the glue output of the dispensing device. This method increases the thickness of the glue, resulting in a large amount of glue being absorbed by the film, affecting the air permeability of the film and thus affecting the product performance. SUMMARY

[0005] In order to overcome the shortcomings of the above-mentioned technology, the electronic component film dispensing and sealing method provided by the application can solve the technical problem that the existing dispensing and sealing process cannot cover the edge of the film with glue, causing the product to seep and resulting in product failure.

[0006] In order to achieve the above-mentioned purpose, the technical scheme of the application is as follows:

[0007] An electronic component film dispensing and sealing method, comprising:

[0008] obtaining film parameters of an electronic component film;

[0009] generating and outputting a dispensing running path based on the film parameters and in combination with a continuous spiral line mode; wherein the dispensing running path adopts a continuous spiral line to form at least two circular tracks, and the diameter of the circular tracks gradually decreases from the outer circle to the inner circle of the film edge.

[0010] The dispensing equipment performs the film dispensing sealing process according to a dispensing operation path.

[0011] Further, the film parameters include a film model, a film size and a film material.

[0012] Further, the dispensing operation path is composed of two circular tracks formed by a continuous spiral line, the starting point of the spiral line is located on the circular track of the outer edge of the film, the ending point is located on the circular track of the inner edge of the film, and the starting point to the ending point of the spiral line is transitioned in a circular arc manner.

[0013] Further, the film dispensing sealing process includes:

[0014] The dispensing equipment forms the outer edge circular track by dispensing on the outer edge of the film, after completing one circle, continues dispensing while starting to change the track to reduce the diameter of the dispensing path, continues to form the inner edge circular track by dispensing on the inner edge of the film, until the dispensing is completed.

[0015] Further, the electronic component and the film are cleaned before the dispensing starts.

[0016] Further, the glue and the dispensing needle are selected according to the film parameters, and the dispensing equipment parameters are set; the dispensing equipment parameters include a dispensing speed, an air pressure of the dispensing equipment and a moving speed of the dispensing equipment.

[0017] Further, the moving speed of the dispensing equipment is as follows: the outer edge moving speed is 20-30 mm / s; and the inner edge moving speed is 30-40 mm / s.

[0018] Further, the air pressure of the dispensing equipment is 260-460 kpa.

[0019] Further, the viscosity of the glue used by the dispensing equipment is ≤360 pa.s.

[0020] Further, the dispensing equipment uses a coating dispenser and a dispensing needle with a caliber of 0.075 mm.

[0021] Compared with the prior art, the present application has the following beneficial effects:

[0022] The application further provides a point sealing method for an electronic component film, which comprises the following steps: obtaining film parameters of the electronic component film; setting a point sealing path according to the film parameters and a continuous spiral line mode, and outputting the point sealing path; and finally completing the film point sealing process by a point sealing device according to the point sealing path. The point sealing path adopts a continuous spiral line formed by at least two circular tracks, and the diameter of the circular track gradually decreases from the outer ring to the inner ring of the film edge, and the multiple circular tracks form a thin and wide glue sealing ring. The method can ensure that the glue stably and comprehensively covers the film edge, improves the sealing performance, prevents liquid seepage of the product, ensures the product efficacy, and thus ensures subsequent stable sample making and mass production. The method has simple principle and is easy to implement, and has good popularization and application value.

[0023] Preferably, in the application, the point sealing path is composed of two circular tracks formed by a continuous spiral line. The point sealing device forms an outer ring circular track by point sealing at the outer ring of the film edge. After completing one circle, the point sealing device continues to glue while starting to change the track to reduce the diameter of the point sealing path, continues to glue at the inner ring of the film edge to form an inner ring circular track, and stops until the glue is discharged. The purpose of point sealing a circle of glue at the outer ring of the film is to lay a foundation for the glue, thereby providing stability for point sealing of the film edge. The glue of the second circle of point sealing actually completes the film sealing. The two circles of glue form a sealing glue ring, which ensures the sealing performance. In addition, the spiral line point sealing mode also saves the amount of glue and reduces the cost of consumables.

[0024] Preferably, in the application, the electronic component and the film are cleaned before point sealing to avoid interference of dust or other impurities on the point sealing process.

[0025] Preferably, in the application, the moving speed of the point sealing device adopts an outer ring moving speed of 20-30 mm / s, an inner ring moving speed of 30-40 mm / s, and an air pressure of 260-460 kpa. In this way, the point sealing effect can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A principle diagram of the point sealing path setting provided by the embodiment of the application;

[0027] Figure 2 A flowchart of the point sealing method for the electronic component film provided by the application. DETAILED DESCRIPTION

[0028] The application provides a point sealing method for an electronic component film, as shown in Figure 2 The application provides a point sealing method for an electronic component film, as shown in

[0029] S1: Obtain film parameters of the electronic component film.

[0030] S2: generating and outputting a dispensing running path based on the film parameters and in combination with the continuous spiral line mode; wherein the dispensing running path adopts a continuous spiral line to form at least two circular tracks, and the diameter of the circular tracks gradually decreases from the outer circle of the film edge to the inner circle.

[0031] S3: the dispensing equipment performs the film dispensing sealing process according to the dispensing running path.

[0032] Specifically, the film parameters in S1 include the film model, the film size and the film material.

[0033] In S2, the dispensing running path is composed of two circular tracks formed by a continuous spiral line, the starting point of the spiral line is located on the circular track of the outer circle of the film edge, the ending point is located on the circular track of the inner circle of the film edge, and the starting point to the ending point of the spiral line adopts a circular arc transition.

[0034] Before dispensing starts, the electronic components and the film are cleaned; the glue and the dispensing needle are selected according to the film parameters, and the dispensing equipment parameters are set; wherein the dispensing equipment parameters include the glue output speed, the air pressure of the dispensing equipment and the moving speed of the dispensing equipment.

[0035] The specific steps are as follows: the dispensing equipment dispenses at the outer circle of the film edge to form an outer circle circular track, after completing one circle, it continues to dispense while starting to change the track to reduce the diameter of the dispensing path, and continues to dispense at the inner circle of the film edge to form an inner circle circular track, until the dispensing ends.

[0036] The moving speed of the dispensing equipment is as follows: the outer circle moving speed is 20-30 mm / s; the inner circle moving speed is 30-40 mm / s; the air pressure of the dispensing equipment is 260-460 kpa, and the viscosity of the glue used by the dispensing equipment is ≤360 pa.s. Here, the dispensing equipment adopts a coating dispensing machine and a dispensing needle with a caliber of 0.075 mm.

[0037] The application will be further described in combination with the embodiments and the accompanying drawings:

[0038] Embodiment

[0039] To solve the background art mentioned: MEMS pressure sensor class products, require that the outside air can pass through the vent film on the MEMS product shell and directly contact the chip, and cannot cause liquid to enter into contact with the chip. Therefore, in view of the above requirements, it is necessary to use glue to seal the periphery of the film to prevent liquid from seeping from the joint between the film and the MEMS product shell. In order to solve such problems, two methods are usually used: the first is to replace the dispensing needle so that the width of the glue increases, increasing the contact area of the glue with the product film. However, due to the limited space of the working environment, it is difficult to replace the dispensing needle; the second is to increase the dispensing amount of the dispensing equipment; using this method, the thickness of the glue increases, causing a large amount of glue to be absorbed by the film, affecting the air permeability of the film and thus affecting the product performance, making it impossible to continue subsequent sample preparation and mass production.

[0040] To solve the above problems, the present embodiment provides an electronic element film dispensing sealing method. In this embodiment, the electronic element product is a MEMS sensor product, which uses a vent film on the MEMS product shell to isolate the chip from the outside air. In order to prevent liquid seepage, an electronic element film dispensing sealing method is proposed. The specific steps of this method are as follows:

[0041] Step one: First, identify the MEMS sensor product to be processed, obtain the name, model, processing requirements, etc. of the MEMS sensor product through historical data records or electronic element database, and obtain the corresponding film parameters according to the above information, including film model, film size and film material, etc. The reason for obtaining the film parameters is that the size of the product film can be adjusted to completely seal and cover the edges of the film with glue, which can meet the product's demand for sealing and waterproofing.

[0042] Step two: According to the film model, film size and film material parameter information obtained in step one, set the dispensing running path of the dispensing equipment in combination with the continuous spiral line method (dispensing method). This step mainly determines the dispensing circle number, radius of each circle and preset trajectory of the dispensing running path according to the film parameter information.

[0043] Here, the dispensing running path is a continuous spiral line that can enclose two circular trajectories, and the diameter of the circular trajectory gradually decreases from the outer circle to the inner circle of the film edge.

[0044] Step three: output the dispensing running path set in step two to the dispensing equipment, and the dispensing equipment adopts a coating dispensing machine. Before dispensing begins, clean the electronic components and the film to avoid dust or other impurities interfering with the dispensing process. Select glue and dispensing needles according to the film parameters, and set the dispensing equipment parameters; the dispensing equipment parameters include glue output speed, dispensing equipment air pressure, and dispensing equipment movement speed.

[0045] As shown in Figure 1 , the dispensing machine implements the film dispensing sealing process according to the dispensing running path. It should be noted that different caliber needles can be selected according to the product dispensing conditions, and appropriate glue is selected under the condition that the needle is determined. The viscosity of the glue determines the rate of glue flow; the needle speed determines the glue amount and stability; and the dispensing air pressure determines the glue output. In order to ensure better dispensing sealing effect, in this embodiment, the dispensing needle caliber selected by the dispensing machine is 0.075 mm; the corresponding glue viscosity is 360 pa.s; the air pressure is 360 kpa; the movement speed of the outer circle of the dispensing is 25 mm / s; and the movement speed of the inner circle is 35 mm / s.

[0046] The specific steps of the dispensing sealing process are as follows:

[0047] Figure 1 The dispensing running path is designed in the form of a continuous spiral line, that is, the running path of the dispensing needle. As can be seen from the figure, the middle is the film of the product, and this dispensing running path adopts a continuous spiral line, forming two circular tracks. From the dispensing starting point (the solid black point of the outer circle) to the dispensing ending point (the solid black point of the inner circle), counterclockwise running is adopted (the track is shown as Figure 1 the middle white line); wherein the dispensing starting point is located on the outer circle of the film edge, and the dispensing ending point is located on the inner circle of the film edge.

[0048] The dispensing machine stably dispenses a circle of glue on the outer circle of the film in the first circle, thereby preparing the foundation for the glue, and providing stability for covering the film edge. The second circle of glue actually completes the film sealing. After completing one circle, continue to dispense glue while starting to change the track to reduce the diameter of the dispensing path, so that part of the second circle of glue is on the film edge and part of it is left on the first circle of glue, until the dispensing ends. As shown in Figure 1 , the two circles of glue form an annular sealing structure, which can prevent the occurrence of liquid leakage at the joint. This method realizes that the annular glue of the dispensing is thin and wide, and can stably cover the step surface. This method can be applied to various sealed film products, especially MEMS pressure sensor products, so that the glue can stably and reliably dispense and seal the waterproof and breathable film of the MEMS pressure sensor product. The use of this method can ensure stable mass production of such products.

[0049] After dispensing is completed, the following steps need to be completed:

[0050] Inspection and testing: After dispensing is completed, the electronic components are inspected and tested to ensure that the glue has been accurately applied and the desired sealing effect has been achieved.

[0051] Cleaning and maintenance: After dispensing is completed, clean the dispensing machine and work area in a timely manner to maintain the cleanliness and good condition of the equipment. At the same time, regularly maintain and maintain the dispensing machine to ensure its normal operation and prolong its service life.

[0052] In summary, the present application provides a method for dispensing and sealing electronic component films, which has the following advantages compared to existing dispensing and sealing processes:

[0053] The dispensing and sealing method first obtains the film parameters of the electronic component film, and then sets the dispensing running path according to the film parameters and the continuous spiral line method, and outputs the dispensing running path. Finally, the dispensing equipment completes the film dispensing and sealing process according to the dispensing running path; the dispensing running path adopts a continuous spiral line formed by at least two circular tracks, and the diameter of the circular track gradually decreases from the outer circle to the inner circle of the film edge, and multiple circular tracks form a thin and wide glue sealing ring. This method can ensure that the glue covers the film edge stably and comprehensively, improve the sealing performance, prevent the product from leaking, ensure the product efficacy, and thus ensure stable sample and mass production; the principle of the method is simple and easy to implement, and has good popularization and application value.

[0054] The above embodiments are only one of the implementation manners of the technical solutions of the present application, and the scope of protection claimed by the present application is not limited to the above embodiments. Any changes, substitutions and other implementation manners easily thought of by those skilled in the art within the technical scope disclosed by the present application are also included.

Claims

1. An electronic component film dispensing sealing method, characterized by, The application relates to a method for sealing an electronic component film by dispensing. The method comprises the following steps: acquiring film parameters of the electronic component film; generating and outputting a dispensing operation path based on the film parameters and in combination with a continuous spiral line mode, wherein the dispensing operation path adopts a continuous spiral line to form at least two circular tracks, and the diameter of the circular tracks gradually decreases from the outer circle to the inner circle of the film edge; the dispensing equipment executes a film dispensing sealing process according to the dispensing operation path; wherein the film parameters include the film model, the film size and the film material; the moving speed of the dispensing equipment is as follows: the outer circle moving speed is 20-30 mm / s; and the inner circle moving speed is 30-40 mm / s; wherein the air pressure of the dispensing equipment is 260-460 kPa; 2. The method of claim 1, wherein the electronic component film is sealed by dispensing. the viscosity of the glue adopted by the dispensing equipment is less than or equal to 360 Pa.s.

3. The method of claim 1, wherein the electronic component film is sealed by dispensing. The dispensing operation path is formed by two circular tracks of a continuous spiral line, the starting point of the spiral line is located on the circular track of the outer circle of the film edge, the ending point is located on the circular track of the inner circle of the film edge, and the starting point to the ending point of the spiral line adopts a circular arc mode transition. The film dispensing sealing process comprises the following steps:

4. The method of claim 3, wherein the electronic component film dispensing sealing method is characterized by, the dispensing equipment dispenses to form an outer circle circular track at the outer circle of the film edge, after completing one circle, the dispensing equipment continues to dispense while starting to change the track to reduce the diameter of the dispensing path, and continues to dispense to form an inner circle circular track at the inner circle of the film edge until the dispensing is completed. wherein, 5. The method of claim 1, wherein the electronic component film dispensing and sealing method is characterized by, before the dispensing starts, the electronic component and the film are cleaned. wherein, 6. The method of claim 1, wherein the method further comprises: the glue and the dispensing needle are selected according to the film parameters, and the dispensing equipment parameters are set; the dispensing equipment parameters include the dispensing speed, the air pressure of the dispensing equipment and the moving speed of the dispensing equipment. The dispensing equipment adopts a coating dispenser and adopts a dispensing needle with a caliber of 0.075 mm.

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