Foldable electronic devices

Abstract

The foldable electronic device provided by the present application has a foldable screen including a screen body and a support sheet connected to the side of the screen body facing the rotating shaft, and the support sheet corresponds to the rotating shaft. The support sheet is used as a grounding circuit to connect the first device in the first shell to the support sheet through a conductive structure, and the second device in the second shell is also connected to the support sheet through a conductive structure, so that the first device and the second device are commonly grounded through the support sheet. Since the support sheet is fixedly connected to the part of the folding screen corresponding to the rotating shaft, a stable connection with the first device and the second device can be achieved through the conductive structure, and the low impedance characteristics of the support sheet itself can be used to achieve a good common grounding between the first device and the second device, thereby ensuring the stable and reliable operation of the devices in the first shell and the devices in the second shell.

Description

Technical Field

[0001] The present application relates to the field of electronic devices, and in particular to a foldable electronic device. Background Art

[0002] With the advent of the 5G era, the operating frequency bands of electronic devices (such as mobile phones) are increasing, the radio frequency requirements for screen grounding protection are getting higher and higher, and the required grounding impedance is getting smaller and smaller.

[0003] Among electronic devices, foldable electronic devices (such as foldable phones), i.e., electronic devices equipped with foldable screens, are increasingly popular among consumers due to their ability to switch between unfolded and folded states, enabling larger display areas and ease of portability. Taking a foldable phone as an example, the first and second shells of the phone are connected by a hinge mechanism. The components within the first and second shells are electrically connected using a flexible printed circuit (FPC) that passes through the hinge mechanism. Currently, this FPC also serves as a ground line, achieving a common ground for the components within the first and second shells.

[0004] However, in order to achieve a smaller ground impedance, the flexible circuit board is required to occupy a larger space, which will compress the structural space of the hinge and affect the reliability of the hinge mechanism. Summary of the Invention

[0005] The present application provides a foldable electronic device, wherein the grounding structure of the foldable electronic device can ensure the reliability of the hinge mechanism while ensuring a small grounding impedance and a small space occupied by the grounding structure.

[0006] The present application provides a foldable electronic device, comprising: a first housing, a second housing, a rotating shaft, and a foldable screen, wherein the rotating shaft is connected between the first housing and the second housing, and the foldable screen is supported and connected to one side surface of the first housing and the second housing; wherein the foldable screen comprises a screen body and a conductive support sheet, wherein the support sheet is attached to a side of the screen body facing the rotating shaft and is arranged corresponding to the rotating shaft, and the support sheet bends or unfolds with the screen body;

[0007] The foldable electronic device also includes: devices and conductive structures, the devices include a first device arranged in a first shell and a second device arranged in a second shell, and conductive structures are connected between the grounding part and the support sheet of the first device and between the grounding part and the support sheet of the second device.

[0008] The foldable electronic device provided by the present application has a foldable screen including a screen body and a support sheet connected to the side of the screen body facing the rotating shaft, and the support sheet corresponds to the rotating shaft. The support sheet is used as a grounding circuit to connect the first device in the first shell to the support sheet through a conductive structure, and the second device in the second shell is also connected to the support sheet through a conductive structure, so that the first device and the second device are commonly grounded through the support sheet. Since the support sheet is fixedly connected to the part of the folding screen corresponding to the rotating shaft, a stable connection with the first device and the second device can be achieved through the conductive structure, and the low impedance characteristics of the support sheet itself can be used to achieve a good common grounding between the first device and the second device, thereby ensuring the stable and reliable operation of the devices in the first shell and the devices in the second shell.

[0009] In a possible embodiment, both sides of the support sheet in the width direction extend beyond both sides of the rotating shaft;

[0010] The orthographic projection of the support sheet on the first shell has an overlapping area with the grounding part of the first device, and the orthographic projection of the support sheet on the second shell also has an overlapping area with the grounding part of the second device. The conductive structure is located in the overlapping area between the support sheet and the grounding part of the corresponding device.

[0011] By extending both sides of the support sheet in the width direction beyond both sides of the rotating shaft, the two sides of the support sheet in the width direction can be supported on the middle frame of the first shell and the middle frame of the second shell, respectively. In addition, one side of the support sheet overlaps with the ground portion of the first component in the first shell, facilitating the placement of a conductive structure between the ground portion of the first component and the support sheet within this overlapping region. Similarly, the other side of the support sheet overlaps with the ground portion of the second component in the second shell, facilitating the placement of a conductive structure between the ground portion of the second component and the support sheet within this overlapping region.

[0012] In a possible implementation manner, the conductive structure is a conductive layer attached between the support sheet and the ground portion of the corresponding device.

[0013] By setting a conductive layer between the grounding part of the corresponding device and the support sheet, the two side surfaces of the conductive layer are respectively bonded and connected to the support sheet and the grounding part of the corresponding device, and electrical conduction between the grounding part of the corresponding device and the support sheet is achieved through the conductive layer.

[0014] In a possible implementation, the conductive layer is a long strip structure.

[0015] In a possible implementation manner, the conductive layer extends along the length direction of the support sheet.

[0016] By laying out the conductive layer along the length of the support sheet, the entire conductive layer area can be located within the support sheet's unbent region, ensuring the reliability of the conductive layer. Furthermore, the length of the conductive layer is perpendicular (or nearly perpendicular) to the current flow direction, resulting in a large flow area for the conductive layer. This can reduce the contact impedance of the conductive layer and improve the grounding effect of the common ground structure.

[0017] In a possible implementation manner, the conductive layer corresponding to the first component and the conductive layer corresponding to the second component are arranged opposite to each other on two sides of the rotating shaft.

[0018] By arranging the conductive layers connected to both sides of the support sheet relatively on both sides of the rotating shaft, a shorter current path is maintained between the conductive layers on both sides, thereby reducing the impedance of the common grounding structure and improving the grounding effect of the common grounding structure.

[0019] In a possible implementation manner, the conductive layer extends from the edge of the support sheet toward the center of the support sheet.

[0020] By attaching the conductive layer along the edge of the support sheet, the connection of the conductive layer is facilitated, ensuring that the conductive layer extends along the length of the support sheet. Furthermore, the conductive layer extends from the edge of the support sheet toward the center of the support sheet, which increases the width of the conductive layer, reduces the contact resistance of the conductive layer, and improves the grounding effect of the common ground structure.

[0021] In a possible implementation, the conductive layer includes conductive foam.

[0022] By using conductive foam as the base material for the conductive layer, the conductive layer can have excellent electrical conductivity. Furthermore, the conductive foam has good elasticity and fast rebound. When squeezed between the support sheet and the corresponding device, it maintains close contact with both, ensuring stable conduction between the support sheet and the corresponding device.

[0023] In a possible embodiment, the conductive layer further includes a conductive medium layer;

[0024] The conductive medium layer at least covers a side surface of the conductive foam facing the support sheet and a side surface of the conductive foam facing the grounding portion of the corresponding device.

[0025] By attaching a conductive dielectric layer on at least the surface of the conductive foam corresponding to the support sheet and the device, the surface conductivity of the conductive foam can be enhanced, ensuring good electrical conduction between the support sheet and the corresponding device.

[0026] In one possible implementation, the conductive medium layer includes a gold layer or a copper layer.

[0027] In a possible implementation, the conductive layer is a conductive adhesive layer.

[0028] In a possible embodiment, the support sheet includes a flat plate portion and a raised portion, wherein a first end of the raised portion is integrally connected to the flat plate portion, and a second end of the raised portion is raised toward a ground portion of a corresponding component;

[0029] The raised portion constitutes at least a partially conductive structure, and the raised portion is electrically connected to a ground portion of a corresponding device.

[0030] The raised portions are formed by notching the flat plate portions on either side of the hollowed-out portion of the support sheet. The first end of the raised portion is integrally connected to the flat plate portion, and the second end of the raised portion is bent so as to tilt toward the grounding portion of the corresponding device. The raised portion provides electrical connection to the grounding portion of the corresponding device, and its inherent elasticity ensures a stable electrical connection between the support sheet and the grounding portion of the corresponding device.

[0031] In a possible implementation manner, a plurality of openings are distributed on the raised portion.

[0032] By setting multiple openings on the warping part, the bending of the warping part is facilitated, and the heat conduction effect of the warping part can be effectively weakened through the multiple openings. In the case where the warping part is connected to the conductive gasket or the grounding part of the device by welding, the welding process can be prevented from causing damage to the screen body.

[0033] In one possible embodiment, the bending arc of the raised portion is less than 90°, and the conductive structure also includes a conductive gasket, which is connected to the second end of the raised portion and extends toward the side where the raised portion is located, and the conductive gasket is attached to and connected to the grounding portion of the corresponding device.

[0034] When a smaller raised portion is provided on the support sheet to ensure the use effect of the folding screen, the curvature of the raised portion can be controlled to be less than 90 degrees, and the end surface of the second end of the raised portion faces the ground portion of the corresponding device. By connecting a conductive gasket to the second end of the raised portion and extending the conductive gasket toward the side where the raised portion is located, sufficient contact area between the conductive gasket and the ground portion of the device can be ensured, thereby ensuring a stable connection with the device. In addition, the pressure exerted by the device on the conductive gasket is transmitted to the raised portion, causing the raised portion to undergo elastic deformation tending to return to its original shape. This can improve the strength and flatness of the folding screen at the raised portion. The elastic force generated by the raised portion acts on the conductive gasket, ensuring a stable connection between the conductive gasket and the device.

[0035] In a possible embodiment, the conductive gasket includes a fixed section, a bent section and a connecting section connected in sequence, the fixed section is adhered to the surface of the tilted portion and extends toward the grounding portion, the bent section is bent toward the side where the first end of the tilted portion is located, and the connecting section is adhered to the grounding portion.

[0036] The conductive gasket is formed into a fixed section, a bending section and a connecting section in sequence. The fixed section is attached to the second end of the tilted portion and extends toward the grounding portion of the device. The bending section is bent from the second end of the tilted portion to the first end so that the connecting section is located on the side where the tilted portion is located. The connecting section can be attached and connected to the grounding portion of the device.

[0037] In a possible implementation, the connecting section has a mounting hole, a locking piece is passed through the mounting hole, and the conductive gasket is connected to the grounding portion through the locking piece.

[0038] In one possible embodiment, the curvature of the raised portion is greater than 90° and less than 180°, and the raised portion has a fitting section, which covers from the second end of the raised portion to the curved top near the raised portion, and the fitting section fits with the grounding portion of the corresponding device.

[0039] By making the bending arc of the raised portion greater than 90° and less than 180°, the raised portion forms a "U"-shaped structure, the second end and the first end of the raised portion are both located on the same side of the top of the curve, and the raised portion forms a fitting section from the second end to the portion close to the top of the curve. The raised portion relies on its own elastic force to tightly fit with the grounding portion of the corresponding device through the fitting section.

[0040] In a possible implementation, the conductive structure is a conductive spring, which is connected between the support sheet and the ground portion of the corresponding device, and is in a compressed state.

[0041] In a possible implementation, the middle area of ​​the support sheet in the width direction is a hollow portion, and the conductive structure corresponding to the ground portion of the first device and the conductive structure corresponding to the ground portion of the second device are respectively located on both sides of the hollow portion.

[0042] By providing a hollowed-out portion in the middle of the width of the support sheet, the sheet's elastic deformation capacity is enhanced, preventing the sheet from obstructing the folding of the foldable screen. Furthermore, by providing the conductive structures corresponding to the grounding portions of the first and second components in the solid areas of the support sheet on either side of the hollowed-out portion, the connection between the conductive structures and the support sheet is facilitated, ensuring stable electrical conduction between the grounding portions of the first and second components and the support sheet.

[0043] In a possible implementation, in the area enclosed between the conductive structures on both sides, the area inside the hollow portion is the first area, and the area outside the first area in the hollow portion is the second area;

[0044] The hollow area of ​​the first region is smaller than the hollow area of ​​the second region.

[0045] By dividing the hollowed-out portion of the support sheet into a first region and a second region, with the first region corresponding to the area enclosed by the conductive structures on both sides, and reducing the hollowed-out area of ​​the first region to be smaller than that of the second region, the flow area within the first region is increased, reducing the impedance of the support sheet and improving the grounding effect of the common ground structure. At the same time, the second region maintains a larger hollowed-out area to ensure the support sheet's bendability. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A structural diagram of a foldable electronic device provided in an embodiment of the present application in an unfolded state;

[0047] Figure 2 for Figure 1 A structural diagram of the foldable electronic device shown in FIG. 1 in a folded state;

[0048] Figure 3 for Figure 1 A schematic structural diagram of a housing assembly of a foldable electronic device is shown;

[0049] Figure 4 for Figure 3 An exploded view of a portion of the housing assembly is shown;

[0050] Figure 5 A structural diagram of the common ground structure of a foldable electronic device provided in an embodiment of the present application;

[0051] Figure 6 for Figure 5 A schematic diagram of a conductive structure used in the common ground structure shown;

[0052] Figure 7 The common ground structure with the conductive layer as the conductive structure corresponds to Figure 5 Cross-section at AA;

[0053] Figure 8a for Figure 5 A schematic diagram of another conductive structure used in the common ground structure shown;

[0054] Figure 8b for Figure 8a Another layout structure diagram of the conductive structure on the support sheet is shown;

[0055] Figure 9 The common ground structure corresponding to the conductive structure in FIG8 is applied Figure 5 Cross-section at AA;

[0056] Figure 10 for Figure 5 A schematic diagram of a third conductive structure used in the common ground structure shown;

[0057] Figure 11 A schematic structural diagram of a common grounding structure using another supporting plate provided in an embodiment of the present application.

[0058] Description of reference numerals:

[0059] 1- Foldable electronic devices;

[0060] 100-folding screen; 101-first part; 102-second part; 103-foldable part;

[0061] 110-screen body; 120-support sheet;

[0062] 121-hollow portion; 122-flat plate portion;

[0063] 1211 - first area; 1212 - second area; 1221 - raised portion; 1221a - laminating section;

[0064] 200-housing assembly;

[0065] 200a - first housing; 200b - second housing; 200c - rotating shaft; 201 - receiving slot;

[0066] 210-middle frame; 220-back cover;

[0067] 300-device; 301-motherboard; 302-battery; 303-speaker; 304-bracket;

[0068] 310-first device; 320-second device;

[0069] 400-conductive structure;

[0070] 410-conductive layer; 420-conductive gasket;

[0071] 411 - conductive foam; 412 - conductive dielectric layer; 421 - fixed section; 422 - bending section; 423 - connecting section;

[0072] 4231-Mounting hole;

[0073] a-opening; b-locking piece. DETAILED DESCRIPTION

[0074] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0075] The present application provides a foldable electronic device, including but not limited to a mobile phone, tablet personal computer, laptop computer, notebook computer, personal digital assistant (PDA), personal computer, multimedia player, e-book reader, vehicle-mounted device, or wearable device. Wearable devices include but are not limited to smart bracelets, smart watches, smart head-mounted displays, smart glasses, and the like.

[0076] Figure 1 A structural diagram of a foldable electronic device provided in an embodiment of the present application in an unfolded state; Figure 2 for Figure 1 The structure diagram of the foldable electronic device shown is in a folded state. Figure 1 and Figure 2 As shown, this embodiment takes the foldable electronic device 1 as a foldable mobile phone as an example for explanation. For the foldable electronic device 1, in different usage scenarios, the foldable electronic device 1 can be unfolded to an unfolded state (such as Figure 1 As shown), the unfolding angle of the foldable electronic device 1 is, for example, 180°. At this time, the foldable electronic device 1 can realize a large-screen display; the foldable electronic device 1 can also be folded to a folded state (as shown Figure 2 As shown, the foldable electronic device 1 is small in size and easy to carry. Moreover, according to actual needs, the foldable electronic device 1 can also stay in a semi-expanded state (hovering state). For example, the hovering angle of the foldable electronic device 1 can be 120°.

[0077] It should be noted that the angles described in this embodiment are all allowed to have slight deviations. For example, Figure 1 The unfolding angle of the foldable electronic device 1 shown is 180°, which means that the unfolding angle can be 180°, or approximately 180°, such as 170°, 175°, 185°, or 190°. The angles described below as examples can be understood in the same way.

[0078] Reference Figure 1 and Figure 2As shown, the foldable electronic device 1 includes a foldable screen 100 and a shell assembly 200, and the foldable screen 100 is supported and connected to one side surface of the shell assembly 200. In this embodiment, the side of the foldable screen 100 used for displaying information is defined as its front side, and the other side surface of the foldable screen 100 opposite to the front side is defined as its back side. Correspondingly, the side surface of the shell assembly 200 supporting the foldable screen 100 is defined as its front side, and the other side surface of the shell assembly 200 opposite to its front side is defined as its back side. In other words, the front side of the foldable screen 100 is exposed outside the shell assembly 200 and is used to display information and provide an interactive interface for the user. The back side of the foldable screen 100 faces the shell assembly 200 and is connected to the front side of the shell assembly 200. The appearance effect of the foldable electronic device 1 is mainly reflected through the side and back sides of the shell.

[0079] In this embodiment, the folding screen 100 can be, but is not limited to, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MLED) display, or a quantum dot light-emitting diode (QLED) display, etc.

[0080] Reference Figure 1 As shown, the foldable screen 100 may include a first portion 101, a second portion 102, and a foldable portion 103, wherein the foldable portion 103 is located between the first portion 101 and the second portion 102. During use of the foldable electronic device 1, the first portion 101 and the second portion 102 always remain planar, while the foldable portion 103 may be bent to change the angle between the first portion 101 and the second portion 102. For example, in the foldable screen 100, at least the foldable portion 103 is made of a flexible material, and the first portion 101 and the second portion 102 may be made of a flexible material, a rigid material, or partially of a rigid material and partially of a flexible material, which is not limited in this embodiment.

[0081] Driven by the housing assembly 200, the folding screen 100 can switch between the unfolded state and the folded state. Figure 1As shown, when the foldable screen 100 is in the unfolded state, the first portion 101 and the second portion 102 are in a relatively distant unfolded state, the foldable portion 103 is in a flat, unbent state, and the first portion 101, the second portion 102, and the third portion are oriented in the same direction and are coplanar. At this point, the angle between the first portion 101 and the second portion 102 is 180°, allowing the foldable screen 100 to achieve a large-screen display, providing users with richer information and a better user experience.

[0082] Reference Figure 2 As shown, when the foldable screen 100 is in the folded state, the first portion (not shown) and the second portion (not shown) are stacked relative to each other, and the foldable portion 103 is in a bent state. The foldable portion 103 can be, for example, in a teardrop shape. At this time, the foldable screen 100 is invisible to the user, and the housing assembly 200 protects the foldable screen 100 from being scratched by hard objects. This foldable electronic device 1 is an inward-folding electronic device.

[0083] Of course, in other examples, the foldable electronic device 1 can also be an outward-folding electronic device. When in the folded state, the first portion 101 and the second portion 102 of the foldable screen 100 face each other, and the housing assembly 200 is located between the first portion 101 and the second portion 102. It will be understood that whether it is an inward-folding electronic device or an outward-folding electronic device, the foldable electronic device 1 is compact in size when in the folded state, making it easy to carry and store.

[0084] In addition to being able to be in the unfolded state and the folded state, the foldable screen 100 can also remain in between the unfolded state and the folded state. For example, the foldable screen 100 can remain in a semi-expanded state (hovering state). In this case, the foldable portion 103 of the foldable screen 100 is also in a bent state, and the degree of bending is less than that in the folded state. The angle between the first portion 101 and the second portion 102 of the foldable screen 100 is, for example, 120°.

[0085] The housing assembly 200 is used to support and fix the folding screen 100 and drive the folding screen 100 to switch between the unfolded state and the folded state. Figure 3 for Figure 1 The schematic diagram of the structure of the housing assembly of the foldable electronic device is shown. Figure 3 As shown, the housing assembly 200 includes a first housing 200a, a second housing 200b and a shaft 200c. The shaft 200c is connected between the first housing 200a and the second housing 200b. The first housing 200a and the second housing 200b are rotatably connected via the shaft 200c, thereby realizing relative rotation between the first housing 200a and the second housing 200b. Figure 1 and Figure 2 As shown, the first shell 200a supports the first part 101 of the folding screen 100, and the second shell 200b supports the second part 102 of the folding screen 100. In other words, the first part 101 of the folding screen 100 is connected to the first shell 200a, and the second part 102 of the folding screen 100 is connected to the second shell 200b. The foldable part 103 of the folding screen 100 is set corresponding to the rotating shaft 200c, and the foldable part 103 can be fixedly connected to the rotating shaft 200c, for example.

[0086] The first shell 200a and the second shell 200b are driven by the rotating shaft 200c to rotate relative to each other, so that the foldable electronic device 1 switches between the unfolded state and the folded state. The first shell 200a and the second shell 200b can rotate in a direction away from each other and unfold until they are coplanar. At this time, the shell assembly 200 is in the unfolded state, and the foldable screen 100 is in the unfolded state as the shell assembly 200 unfolds. Figure 1 As shown; the first shell 200a and the second shell 200b can also be rotated in the direction of approaching each other and folded until the two are relatively stacked. At this time, the shell assembly 200 is in a folded state, and the folding screen 100 is in a folded state as the shell assembly 200 is folded; or, the first shell 200a and the second shell 200b can also be rotated relative to each other until the two remain in a semi-expanded state (hovering state) between the expanded state and the folded state. At this time, the angle between the first shell 200a and the second shell 200b is, for example, 120°, the folding screen 100 is in a hovering state with the shell assembly 200, and the angle between the first part 101 and the second part 102 of the folding screen 100 is, for example, 120°.

[0087] Among them, reference Figure 3 As shown, the first housing 200a is used to support and fix Figure 1 The first part 101 of the folding screen 100 is exemplarily provided with a first shell 200a having a support surface M1. The first part 101 of the folding screen 100 is mounted on the support surface M1 of the first shell 200a. The first shell 200a supports and fixes the first part 101 of the folding screen 100 through the support surface M1. The connection between the support surface M1 and the first part 101 includes but is not limited to gluing. Similarly, the second shell 200b is used to support and fix Figure 1 The second part 102 of the folding screen 100, for example, the second shell 200b has a support surface M2, the second part 102 of the folding screen 100 is mounted on the support surface M2 of the second shell 200b, and the second shell 200b supports and fixes the second part 102 of the folding screen 100 through the support surface M2, and the connection relationship between the support surface M2 and the second part 102 includes but is not limited to gluing.

[0088] For example, the structures of the first shell 200a and the second shell 200b can be the same, and the first shell 200a and the second shell 200b are mirror-symmetrical with the center line of the rotating shaft 200c as the axis of symmetry. In addition, the first shell 200a and the second shell 200b can be provided with a receiving groove 201 on the side facing each other. The opening a of the receiving groove 201 is, for example, located on the side surface of the first shell 200a (second shell 200b) facing the folding screen 100. The receiving groove 201 is recessed from the side surface toward the back cover 220. The two sides of the rotating shaft 200c extend into the receiving groove 201 of the first shell 200a and the receiving groove 201 of the second shell 200b respectively, and the two sides of the rotating shaft 200c can be fixedly connected to the first shell 200a and the second shell 200b respectively, so as to drive the first shell 200a and the second shell 200b to rotate relative to each other through the rotating shaft 200c.

[0089] Figure 4 for Figure 3 An exploded view of a portion of the housing assembly is shown. Figure 4 As shown in the figure, the exploded structure of the first shell 200a or the second shell 200b of the shell assembly 200 is shown. The first shell 200a and the second shell 200b can both include a middle frame 210 and a back cover 220. The middle frame 210 is connected between the folding screen 100 and the back cover 220. The side surface of the middle frame 210 facing the folding screen 100 forms the above-mentioned support surface M1 (support surface M2), which is used to support and fix the folding screen 100. The back cover 220 is connected to the side surface of the middle frame 210 facing away from the folding screen 100. The middle frame 210 and the back cover 220 enclose an installation space, which is used to accommodate some components 300 of the foldable electronic device 1. For example, the figure shows that the installation space is provided with a mainboard 301, a battery 302, and a speaker 303 module. Of course, the components 300 provided in the installation space are not limited to the components 300 shown in the figure, and may also include other components 300 not shown in the figure, such as a camera module and a microphone.

[0090] In actual applications, the types, quantities and layout structures of the devices 300 provided in the first shell 200a and the second shell 200b are usually different. For example, a circuit board can be provided in both the first shell 200a and the second shell 200b. The number of circuit boards in the first shell 200a (second shell 200b) can be one or more than two, wherein the circuit board provided in the first shell 200a (second shell 200b) includes a mainboard 301 that plays a core control role. The base material of the mainboard 301 is, for example, a printed circuit board (PCB). One of the mainboards 301 in the first shell 200a and the mainboard 301 in the second shell 200b is the core circuit board for controlling the entire machine, and the core circuit board usually integrates a central processing unit (CPU). A battery 302 can also be provided in the first shell 200a and the second shell 200b. The battery 302 is electrically connected to the circuit board, and the battery 302 provides power to the folding screen 100 and the speaker 303 through the circuit board. As for other components 300 such as the speaker 303 module, camera module and microphone, they can be concentrated in the first shell 200a, or concentrated in the second shell 200b, or some components 300 can be set in the first shell 200a and some components 300 can be set in the second shell 200b.

[0091] In addition, the devices 300 in the first shell 200a and the second shell 200b are usually electrically connected together. For example, a flexible circuit board can be set up to pass through the rotating shaft 200c, one end of the flexible circuit board is connected to the main board 301 in the first shell 200a, and the other end of the flexible circuit board is connected to the main board 301 in the second shell 200b. By electrically connecting the main board 301 in the first shell 200a and the main board 301 in the second shell 200b, the devices 300 in the first shell 200a and the devices 300 in the second shell 200b are electrically connected together.

[0092] In addition, the device 300 in the first shell 200a and the device 300 in the second shell 200b usually need to be designed with a common ground. As the name suggests, common grounding means that the device 300 in the first shell 200a and the device 300 in the second shell 200b have a common ground terminal (referred to as the common terminal). The common terminal is, for example, the negative pole of the battery 302. In this way, all devices 300 (the voltage) in the first shell 200a and the second shell 200b use the common terminal (zero potential) as a reference to ensure the normal operation of each device 300 and prevent the device 300 from being interfered with.

[0093] In related art, the flexible circuit board passing through the hinge 200c is used to connect the mainboard 301 in the first housing 200a and the mainboard 301 in the second housing 200b. In addition, the flexible circuit board can also be used to achieve common grounding for the components 300 in the first housing 200a and the components 300 in the second housing 200b. For example, a portion of the flexible circuit board can be used as a grounding line, with the grounding impedance of the grounding line being very low, to connect the mainboard 301 in the first housing 200a and the mainboard 301 in the second housing 200b, thereby maintaining a low resistance in the common ground portion between the two. Alternatively, the flexible circuit board can be used as a whole for grounding. In this case, a low-impedance grounding layer (e.g., a metal layer) can be provided on both surfaces of the flexible circuit board. The grounding layer can then connect the mainboard 301 in the first housing 200a and the mainboard 301 in the second housing 200b, thereby reducing the resistance of the common ground portion between the two.

[0094] It should be noted that if the portion of the flexible printed circuit board used as a grounding line has high impedance, this effectively means there's no common ground between the motherboard 301 in the first housing 200a and the motherboard 301 in the second housing 200b. Because the grounding line has high impedance, a voltage drop occurs when current is transmitted between the motherboard 301 in the first housing 200a and the motherboard 301 in the second housing 200b. For example, when the motherboard 301 in the first housing 200a transmits voltage V to the motherboard 301 in the second housing 200b via the flexible printed circuit board, the voltage drop occurs in the grounding line. This causes the voltage received by the motherboard 301 in the second housing 200b to be less than V. For example, the voltage received by the motherboard 301 in the second housing 200b may be V-δV. This can affect the stability of the foldable electronic device 1 and may result in the inability to transmit or receive high-level signals.

[0095] To reduce the impedance of the grounding portion of the flexible circuit board, given a constant distance between the mainboard 301 within the first housing 200a and the mainboard 301 within the second housing 200b, the length of the flexible circuit board is fixed. In related art, this is typically achieved by increasing the width of the flexible circuit board. However, for the flexible circuit board passing through the hinge 200c, the space reserved for the flexible circuit board on the hinge 200c is limited. In order to increase the width of the flexible circuit board, the space at the connection between the hinge 200c and the first housing 200a (second housing 200b) must be compressed. This compromises the reliability of the hinge 200c, making it difficult for the hinge 200c to stably rotate the first housing 200a (second housing 200b) and to stably support the housing assembly 200 in a suspended state.

[0096] In addition, the rotating shaft 200c connected between the first shell 200a and the second shell 200b is a movable structure. The rotating shaft 200c generally includes a base support portion and a transition portion movably connected to the base support portion on both sides. The transition portions on both sides are respectively connected to the first shell 200a and the second shell 200b. As the first shell 200a and the second shell 200b rotate relative to each other, the rotation angle and distance between the transition portions on both sides and the base support will change. Therefore, due to factors such as the rotation state of the foldable electronic device 1, the ambient temperature, and the accumulation of external forces, the contact impedance of the rotating shaft 200c itself is in an unstable state, and it cannot serve as a common grounding structure to stably achieve common grounding for the components in the first shell 200a and the components in the second shell 200b.

[0097] In view of this, the embodiment of the present application improves the common grounding structure between the device 300 in the first shell 200a and the device 300 in the second shell 200b, and uses the conductive support sheet 120 of the folding screen 100 itself as the grounding line, and connects the first device 310 in the first shell 200a to the support sheet 120 through the conductive structure 400, and also connects the second device 320 in the second shell 200b to the support sheet 120 through the conductive structure 400. Since the support sheet 120 is fixedly connected to the part of the folding screen 100 corresponding to the rotating shaft 200c, a stable connection with the first device 310 and the second device 320 can be achieved through the conductive structure 400. In addition, by utilizing the low impedance characteristics of the support sheet 120 itself, a good common grounding between the first device 310 and the second device 320 can be achieved, thereby ensuring stable and reliable operation of the device 300 in the first shell 200a and the device 300 in the second shell 200b.

[0098] The following describes in detail the common grounding structure between the device 300 in the first housing 200a and the device 300 in the second housing 200b in the foldable electronic device 1 of this embodiment.

[0099] Figure 5 This is a structural diagram of the common ground structure of the foldable electronic device provided in the embodiment of the present application. Figure 5 As shown, in order to facilitate the illustration of the common grounding structure of the device 300 in the first shell 200a and the device 300 in the second shell 200b, only the first shell 200a and the first device 310 located in the first shell 200a, the second shell 200b and the second device 320 located in the second shell 200b are illustrated. In addition, the entire folding screen 100 is not shown in the figure, but only the supporting sheet 120 in the folding screen 100 is shown.

[0100] Reference Figure 5As shown, a conductive structure 400 is connected between the grounding portion of the first device 310 and the support sheet 120, and a conductive structure 400 is connected between the grounding portion of the second device 320 and the support sheet 120. The support sheet 120 is used as a common grounding terminal for the first device 310 and the second device 320 to achieve common grounding of the first device 310 and the second device 320, and further, achieve common grounding between the device 300 in the first shell 200a and the device 300 in the second shell 200b.

[0101] It should be noted that the components 300 disposed within the first housing 200a include not only the first component 310 but also other components 300, with the first component 310 and other components 300 within the first housing 200a being electrically connected to each other. Similarly, the components 300 disposed within the second housing 200b include not only the second component 320 but also other components 300, with the second component 320 and other components 300 within the second housing 200b being electrically connected to each other. For example, the first housing 200a may include components 300 such as a mainboard 301, other circuit boards, and a battery 302, while the second housing 200b may include components 300 such as a mainboard 301, other circuit boards, and a battery 302. Regarding the aforementioned other components 300, such as the speaker 303 module, camera module, and microphone, these components 300 may all be located within the first housing 200a, all within the second housing 200b, or partially within the first housing 200a and partially within the second housing 200b.

[0102] As an example, the first component 310 can be the mainboard 301 in the first housing 200a, and the second component 320 can be the mainboard 301 in the second housing 200b. Both the mainboard 301 in the first housing 200a and the mainboard 301 in the second housing 200b are connected to the support sheet 120 via the conductive structure 400, thereby achieving a common ground between the components 300 in the first housing 200a and the components 300 in the second housing 200b. As another example, the battery 302 in the first housing 200a can serve as the first component 310, and the battery 302 in the second housing 200b can serve as the second component 320. Both the battery 302 in the first housing 200a and the battery 302 in the second housing 200b are connected to the support sheet 120 via the conductive structure 400, thereby achieving a common ground between the components 300 in the first housing 200a and the components 300 in the second housing 200b.

[0103] Of course, in other examples, the first component 310 may also be another component 300 disposed within the first housing 200a, and the second component 320 may also be another component 300 disposed within the second housing 200b. This embodiment is not limited thereto. For example, when only the motherboard 301 is disposed within the first housing 200a, the first component 310 may be the motherboard 301, and the second component 320 may be the battery 302 disposed within the second housing 200b.

[0104] When the motherboard 301 serves as the grounding structure connected to the support sheet 120, the grounding portion of the motherboard 301 can be a grounding layer (e.g., a metal layer) provided on the motherboard 301. When the battery 302 serves as the grounding structure connected to the support sheet 120, the grounding portion of the battery 302 can be the negative electrode of the battery 302. The following description uses the example of the first component 310 being the motherboard 301 within the first housing 200a and the second component 320 being the motherboard 301 within the second housing 200b.

[0105] In addition, combined Figure 1 As shown, it should be noted that the folding screen 100 of this embodiment can be composed of a screen body 110 ( Figure 1 Not shown) and the support sheet 120 ( Figure 1 The foldable screen 100 is composed of a housing assembly 200 and a support sheet 120. The screen body 110 is the main structure of the foldable screen 100. The support sheet 120 is usually fixedly connected to the surface of the screen body 110 on the side facing the housing assembly 200. The support sheet 120 is located at the position corresponding to the rotating shaft 200c of the screen body 110. The support sheet 120 is an elastic sheet structure. For example, the support sheet 120 can be a metal sheet. When the housing assembly 200 drives the screen body 110 to fold and unfold, the support sheet 120 bends and flattens synchronously with the foldable portion 103 of the screen body 110. The support sheet 120 can enhance the strength and stability of the foldable portion 103 of the screen body 110. For example, when the folding screen 100 is in the unfolded state, the flatness of the folding screen 100 can be improved through the support of the support sheet 120; when the folding screen 100 is in the folded state, the support of the support sheet 120 can also ensure that the foldable part 103 of the folding screen 100 is stably in a teardrop shape, avoiding creases on the foldable part 103.

[0106] For example, a mounting groove can be opened in the foldable part 103 of the screen body 110, with the groove opening facing the shell assembly 200, and the support sheet 120 is connected to the mounting groove by bonding or other means, and the surface of the support sheet 120 can be flush with the surface of the screen body 110.

[0107] Because the support sheet 120 is fixedly connected to the screen body 110 and is an integral structure, even when the foldable electronic device 1 switches between the unfolded state and the folded state, and the support sheet 120 switches between the bent and flattened states along with the screen body 110, the area of ​​the support sheet 120 does not change, and the support sheet 120 can maintain a fixed impedance. In addition, the support sheet 120 is usually made of a material with good electrical conductivity. For example, the support sheet 120 is made of a titanium alloy or a copper alloy, and the impedance of the support sheet 120 is very small. In this way, the first device 310 in the first shell 200a and the second device 320 in the second shell 200b are commonly grounded through the support sheet 120. The support sheet 120 provides a fixed and small impedance, which can ensure the grounding effect of the device 300 in the first shell 200a and the device 300 in the second shell 200b.

[0108] Continue to refer to Figure 5 As shown, the support piece 120 extends along the length direction of the rotating shaft 200c, and in order to facilitate the connection with the first device 310 in the first shell 200a and the second device 320 in the second shell 200b, the two sides of the support piece 120 in the width direction can extend beyond the two sides of the rotating shaft 200c. In other words, the width of the support piece 120 can be greater than the width of the rotating shaft 200c, and the support piece 120 extends to both sides of the rotating shaft 200c in the width direction. The two sides of the support piece 120 in the width direction can be supported on the first shell 200a and the second shell 200b respectively. Among them, there is an overlapping area between one side of the support sheet 120 and the grounding part of the first device 310 in the plane direction of the first shell 200a, that is, the orthographic projection of the support sheet 120 on the first shell 200a and the grounding part of the first device 310 have an overlapping area, and the conductive structure 400 connected between the grounding part of the first device 310 and the support sheet 120 is located in the overlapping area of ​​the two; similarly, there is also an overlapping area between the other side of the support sheet 120 and the grounding part of the second device 320 in the plane direction of the second shell 200b, that is, the orthographic projection of the support sheet 120 on the second shell 200b and the grounding part of the second device 320 have an overlapping area, and the conductive structure 400 connected between the grounding part of the second device 320 and the support sheet 120 is located in the overlapping area of ​​the two.

[0109] That is to say, there is an overlapping area between the grounding part of the first device 310 located in the first shell 200a and the support sheet 120, and there is a gap between the grounding part of the first device 310 and the support sheet 120, and the corresponding conductive structure 400 is located in the gap and connects the grounding part of the first device 310 and the support sheet 120; there is an overlapping area between the grounding part of the second device 320 located in the second shell 200b and the support sheet 120, and there is a gap between the grounding part of the second device 320 and the support sheet 120, and the corresponding conductive structure 400 is located in the gap and connects the grounding part of the second device 320 and the support sheet 120. Taking the first component 310 as the main board 301 in the first shell 200a as an example, the grounding portion of the main board 301 in the first shell 200a can be a grounding layer set on the side of the main board 301 facing the support piece 120; similarly, taking the second component 320 as the main board 301 in the second shell 200b as an example, the grounding portion of the main board 301 in the second shell 200b can also be a grounding layer set on the side of the main board 301 facing the support piece 120.

[0110] In addition, refer to Figure 5 As shown, the middle area of ​​the width direction of the support sheet 120 is generally a hollow portion 121, and the hollow portion 121 corresponds to the rotating shaft 200c. In other words, the hollow portion 121 corresponds to the foldable portion 103 of the folding screen 100. There are multiple openings a distributed in the hollow portion 121. In the figure, the opening a is a strip-shaped opening extending along the length direction of the support sheet 120 as an example. The strip openings are staggered front and back in the width direction of the support sheet 120. The strip openings can include closed strip holes completely located in the support sheet 120 and strip recesses connected to the side of the support sheet 120.

[0111] By forming a hollow portion 121 in the middle area of ​​the support sheet 120 in the width direction, it helps to weaken the rigidity of the support sheet 120 and enhance the elastic deformation ability of the support sheet 120, so as to prevent the support sheet 120 from hindering the folding of the folding screen 100. Among them, by providing a strip-shaped opening extending along the length direction of the support sheet 120, the extension direction of the strip-shaped opening is perpendicular to the bending direction (width direction) of the support sheet 120, which is more conducive to the bending of the support sheet 120. Of course, in other examples, the strip-shaped opening provided in the hollow portion 121 of the support sheet 120 can also be extended in other directions, or the opening a in the hollow portion 121 can also be other shapes besides the strip-shaped opening, and the hollow portion 121 can have an opening a of a single shape and size, or can have openings a of different shapes and sizes. This embodiment does not impose specific restrictions on this.

[0112] The areas on both sides of the support sheet 120 that overlap with the grounding portion of the first device 310 and the grounding portion of the second device 320 can be solid flat plate areas without an opening a. In this embodiment, the portions of the support sheet 120 located on both sides of the hollow portion 121 are defined as flat plate portions 122. During the process of bending and flattening the support sheet 120 along with the screen body 110, the flat plate portions 122 only rotate in angle, and their flat plate shape does not change. In other words, the grounding portion of the first device 310 and the grounding portion of the second device 320 correspond to the flat plate portions 122 on both sides of the hollow portion 121 of the support sheet 120, respectively. In this way, it is convenient to connect the conductive structure 400 to the flat plate portions 122 on both sides of the support sheet 120, which helps to achieve stable electrical connections between the grounding portion of the first device 310 and the support sheet 120, and between the grounding portion of the second device 320 and the support sheet 120.

[0113] Figure 6 for Figure 5 Schematic diagram of a conductive structure used in the common ground structure shown in FIG. Figure 6 As shown, as an embodiment, the conductive structure 400 connected between the support sheet 120 and the ground portion of the corresponding device 300 can be a conductive layer 410. That is, the conductive structure 400 connected between the ground portion of the first device 310 and the corresponding side of the support sheet 120 is the conductive layer 410, and the conductive structure 400 connected between the ground portion of the second device 320 and the corresponding side of the support sheet 120 is also the conductive layer 410. The two side surfaces of the conductive layer 410 are respectively in contact with the ground portion of the corresponding device 300 and the support sheet 120. For example, the two side surfaces of the conductive layer 410 can be bonded to the support sheet 120 and the ground portion of the corresponding device 300, respectively, and electrical conduction between the support sheet 120 and the ground portion of the corresponding device 300 is achieved through the conductive layer 410.

[0114] The conductive layer 410 can be designed as an elongated strip-shaped structure. The elongated strip-shaped conductive layer 410 has sufficient length to ensure sufficient contact area between the conductive layer 410 and the support sheet 120 (and the ground portion of the corresponding device 300), thereby ensuring a stable and secure connection between the conductive layer 410 and the ground portion of the corresponding device 300. Furthermore, the elongated strip-shaped conductive layer 410 has a very small width. By designing the placement of the conductive layer 410, the reliability of the connection of the conductive layer 410 can be prevented from being affected by repeated bending and flattening of the support sheet 120 over a long period of time.

[0115] Exemplarily, the length direction of the long strip of conductive layer 410 can correspond to the length direction of the support sheet 120. In other words, the long strip of conductive layer 410 can be extended along the length direction of the support sheet 120. The hollow portion 121 of the support sheet 120 corresponding to the foldable portion 103 of the folding screen 100 is located in the middle area of ​​the width direction of the support sheet 120, and the conductive layer 410 is connected to the area close to the edge in the width direction of the support sheet 120. By extending the conductive layer 410 along the length direction of the support sheet 120, the entire area where the conductive layer 410 is located is located on the flat plate portion 122 of the support sheet 120 that will not bend, thereby ensuring the reliability of the connection between the conductive layer 410 and the support sheet 120 (corresponding to the device 300), and ensuring the reliability of the connection of the conductive layer 410.

[0116] Furthermore, the current flowing in the common ground structure either flows from the first component 310 in the first housing 200a through the conductive layer 410 on that side to the support sheet 120, and then flows from the support sheet 120 through the conductive layer 410 on the side of the second housing 200b to the second component 320; or the current flows from the second component 320 in the second housing 200b through the conductive layer 410 on that side to the support sheet 120, and then flows from the support sheet 120 through the conductive layer 410 on the side of the first housing 200a to the first component 310. In other words, the current flows between the first component 310 and the second component 320 through the support sheet 120, and the current generally flows along the width of the support sheet 120.

[0117] On the basis of the low impedance performance of the support sheet 120 itself, the conductive layer 410 is arranged along the length direction of the support sheet 120. The length direction of the conductive layer 410 is perpendicular to the direction of current flow. The flow area of ​​the conductive layer 410 (the area where current flows) is large, which can reduce the contact impedance between the conductive layer 410 and the grounding part (support sheet 120) of the corresponding device 300, thereby improving the grounding effect of the common grounding structure.

[0118] In other examples, while ensuring that the conductive layer 410 is entirely connected to the area of ​​the flat plate portion 122 of the support sheet 120 where no bending occurs, thereby ensuring the reliability of the conductive layer 410, the conductive layer 410 may also extend in a direction inclined to the length direction of the support sheet 120. In other words, there is an angle between the length direction of the conductive layer 410 and the length direction of the support sheet 120, and the angle is, for example, in the range of 0° to 40°. This embodiment does not impose any restrictions on this.

[0119] In the case where the conductive layer 410 extends along the length of the support sheet 120, to facilitate connection with the conductive layer 410, the conductive layer 410 can be disposed corresponding to the edge of the support sheet 120. Thus, by disposing the conductive layer 410 along the edge of the support sheet 120, the length of the conductive layer 410 can be aligned with the length of the support sheet 120, thereby improving the connection efficiency of the conductive layer 410. Furthermore, for a support sheet 120 having a limited width and a flat portion 122 that does not deform (bend), by disposing the conductive layer 410 along the edge of the support sheet 120, the width of the conductive layer 410 extends from the edge of the support sheet 120 toward the center of the support sheet 120. This can increase the width of the conductive layer 410, thereby reducing the contact resistance between the conductive layer 410 and the support sheet 120 (corresponding to the device 300), thereby improving the grounding effect of the common ground structure.

[0120] In addition, on the basis of the conductive layer 410 being extended along the length direction of the support sheet 120 (or approaching the length direction of the support sheet 120), the conductive layer 410 can extend from one end to the other end of the grounding portion of the corresponding device 300, that is, the conductive layer 410 covers all areas of the corresponding device 300 in the length direction of the support sheet 120. At this time, corresponding to the grounding portion of the corresponding device 300, on the basis of the width of the conductive layer 410 remaining unchanged, the flow area of ​​the conductive layer 410 is maximized, and the contact impedance between the conductive layer 410 and the grounding portion (support sheet 120) of the corresponding device 300 is minimized.

[0121] For example, in the length direction of the support sheet 120, for the case where the overlapping length between the grounding portion of the first device 310 and the support sheet 120 is the same as the overlapping length between the grounding portion of the second device 320 and the support sheet 120, the conductive layer 410 corresponding to the first device 310 and the conductive layer 410 corresponding to the second device 320 can both be extended to the two ends of the corresponding device 300; for the case where the overlapping length between the grounding portion of the first device 310 and the support sheet 120 is different from the overlapping length between the grounding portion of the second device 320 and the support sheet 120, the conductive layer 410 connected to the one with the shorter overlapping length with the support sheet 120, can be extended to its two ends, and the length of the conductive layer 410 connected to the other can be reasonably designed accordingly.

[0122] In practical applications, the components 300 in the first shell 200a and the components 300 in the second shell 200b can be rationally laid out and designed so that the first component 310 and the second component 320 are arranged as relatively as possible on both sides of the rotating shaft 200c. In this way, on the basis of arranging the conductive layer 410 along the length direction of the support sheet 120 (or close to the length direction of the support sheet 120), the conductive layer 410 connected to the first component 310 and the conductive layer 410 connected to the second component 320 can also be arranged relatively on both sides of the rotating shaft 200c. The conductive layer 410 not only has a larger flow area, but also the current path between the conductive layers 410 on both sides is shorter, which can effectively reduce the impedance of the common grounding structure.

[0123] Even if the layout structure of the first device 310 and the second device 320 is limited so that the conductive layers 410 on both sides cannot be arranged completely opposite to each other, the staggered distance between the conductive layers 410 on both sides can be minimized, the overlapping length of the conductive layers 410 on both sides in the length direction of the support sheet 120 can be increased, and the current path between the conductive layers 410 on both sides can be shortened to reduce the impedance of the common grounding structure.

[0124] Figure 7 The common ground structure with the conductive layer as the conductive structure corresponds to Figure 5 Cross-section view at AA in the middle. Figure 7 As shown, regarding the specific structural form of the conductive layer 410, in some embodiments, the main structure of the conductive layer 410 can be a conductive foam 411. The base material of the conductive foam 411 is mainly polyethylene or modified polyethylene. The base material is also mixed with conductive fillers and antistatic agents, which makes the conductive foam 411 have good conductive properties. In addition, the conductive foam 411 is filled with fillers in a loose and porous matrix, which has good elasticity and fast rebound. After the conductive layer 410 is set, the conductive foam 411 is squeezed between the support sheet 120 and the corresponding device 300. The conductive foam 411 is in close contact with the support sheet 120 and the corresponding device 300, which can ensure stable conduction between the support sheet 120 and the corresponding device 300.

[0125] Furthermore, to enhance the conductivity of the conductive foam 411, a conductive dielectric layer 412 is provided on the outer surface of the conductive foam 411. The conductive foam 411 and the conductive dielectric layer 412 together constitute the conductive layer 410. The conductive dielectric layer 412 is, for example, a gold layer or a copper layer. The conductive dielectric layer 412 enhances the surface conductivity of the conductive foam 411. The conductive dielectric layer 412 covers at least the surface of the conductive foam 411 facing the support sheet 120 and the surface of the conductive foam 411 facing the ground portion of the corresponding device 300. That is, the conductive foam 411 contacts the support sheet 120 and the ground portion of the corresponding device 300 through the outer conductive dielectric layer 412. Thus, the conductive layer 410 provides good electrical connectivity between the support sheet 120 and the corresponding device 300.

[0126] For example, the conductive medium layer 412 is usually a conductive cloth arranged outside the conductive foam 411. The conductive cloth can be bonded to the surface of the conductive foam 411 by conductive glue, and the surface of the conductive cloth is plated with conductive materials such as gold or copper. The conductive cloth can be only attached to the two sides of the conductive foam 411 corresponding to the support sheet 120 and the device 300, or, as shown in FIG. Figure 7 As shown in , the outer surface of the conductive foam 411 can be fully wrapped with conductive cloth.

[0127] In other embodiments, the conductive layer 410 disposed between the support sheet 120 and the ground portion of the corresponding device 300 may also be a conductive adhesive layer. The conductive adhesive layer, relying on its own adhesive properties, can directly bond the support sheet 120 and the corresponding device 300 together without the need for other adhesive materials. Furthermore, the conductive adhesive layer contains a plurality of conductive particles distributed within the adhesive. After the conductive adhesive cures or dries, the conductive particles contact each other, forming a bonded connection. This provides the conductive adhesive with excellent electrical conductivity, enabling stable electrical conduction between the support sheet 120 and the corresponding device 300.

[0128] in addition, Figure 7 The figure shows that the main board 301 in the first shell 200a and the main board 301 in the second shell 200b are both installed on the back cover 220 on the corresponding sides through the bracket 304. It should be understood that in addition to relying on the bracket 304 for fixation, the main board 301 can also be locked to the middle frame 210 or the back cover 220 by screws, bolts and other locking parts, or the main board 301 can also be connected to the middle frame 210 or the back cover 220 by gluing, welding, etc.

[0129] Figure 8a for Figure 5 Schematic diagram of another conductive structure applied in the common ground structure shown. Figure 8b for Figure 8a Another layout structure diagram of the conductive structure on the support sheet is shown. Figure 8a and Figure 8b As shown, in addition to providing a conductive layer 410 between the support sheet 120 and the ground portion of the corresponding device 300 , as another embodiment, the support sheet 120 itself can also be used to form the conductive structure 400 .

[0130] Among them, a raised portion 1221 that is raised toward the grounding portion of the corresponding device 300 can be formed on the flat plate portion 122 located on both sides of the hollow portion 121 on the support sheet 120 and in the area overlapping with the grounding portion of the corresponding device 300, and an electrical connection with the grounding portion of the corresponding device 300 is achieved through the raised portion 1221.

[0131] Specifically, the raised portion 1221 can be formed by cutting a groove in the flat portion 122. The grooved area is located within the area corresponding to the ground portion of the device 300, and the groove extends less than one circumference. This allows the material in the grooved area to form a structure in which one end remains connected to the flat portion 122, while the rest of the material is separated from the flat portion 122. Furthermore, the structure in the grooved area is bent toward the device 300 using the end that is completely separated from the flat portion 122. This forms the raised portion 1221, with a first end integrally connected to the flat portion 122 and a second end, opposite the first end, raised toward the ground portion of the device 300.

[0132] The supporting piece 120 itself forms a raised portion 1221 that is raised toward the grounding portion of the corresponding device 300. The raised portion 1221 is electrically connected to the grounding portion of the corresponding device 300. The raised portion 1221 is bent toward the corresponding device 300 and presents a raised state. This also makes the raised portion 1221 have good elasticity. Relying on the elasticity of the raised portion 1221, it can be ensured that the supporting piece 120 and the grounding portion of the corresponding device 300 are well and stably electrically connected.

[0133] Among them, reference Figure 8a As shown, in some examples, the raised portion 1221 can be arranged in the middle area of ​​the flat portion 122 of the support sheet 120. In other words, the raised portion 1221 can be formed by cutting a groove in the middle area of ​​the flat portion 122. In this way, the distance between the raised portions 1221 of the flat portion 122 on both sides is shorter, and the current path between the grounding portion of the first device 310 and the grounding portion of the second device 320 connected by the raised portions 1221 on both sides is shorter, which can reduce the common grounding impedance of the first device 310 and the second device 320.

[0134] Reference Figure 8bAs shown, in other examples, the raised portion 1221 can also be disposed at the edge of the flat portion 122 of the support sheet 120. In this case, the raised portion 1221 can be formed by cutting a groove inward from the edge of the flat portion 122. The formed raised portion 122 extends from a portion of the flat portion 122 near the edge toward the ground portion of the corresponding device 300. In this case, the raised portion 1221 can be disposed at the upper or lower edge of the flat portion 122 in the longitudinal direction of the corresponding rotating axis. The raised portion 1221 can be located in the middle of the upper or lower edge of the flat portion 122. This shortens the distance between the raised portions 1221 on both sides, thereby reducing the common ground impedance of the first device 310 and the second device 320. Of course, on the basis of meeting the common ground impedance requirement, at least one of the raised portions 1221 on either side of the flat portion 122 can be disposed on one long side of the support sheet 120.

[0135] Reference Figure 8a or Figure 8b As shown, as an embodiment, the size of the warped portion 1221 can be controlled to be maintained relatively small. In other words, the groove cut on the flat portion 122 only occupies a small area, so as not to affect the strength and flatness of the folding screen 100 in the grooved area, thereby ensuring the performance of the folding screen 100. In this case, for the warped portion 1221 with a small size, the curvature of the warped portion 1221 can be less than 90°. The warped portion 1221 mainly relies on the end face of its second end to face the grounding portion of the corresponding device 300. There is not enough contact area between the warped portion 1221 and the grounding portion of the corresponding device 300 to ensure a stable connection with the device 300. At this time, a conductive gasket 420 can be connected to the second end of the warped portion 1221, and the conductive gasket 420 is connected to the grounding portion of the device 300 to achieve an electrical connection between the warped portion 1221 and the grounding portion of the device 300. Figure 9 The common ground structure corresponding to the conductive structure in FIG8 is applied Figure 5 Cross-sectional view at AA in FIG8 and FIG8 Figure 9As shown, the conductive gasket 420 can extend to the side where the warped portion 1221 is located. On the one hand, there is a large contact area between the conductive gasket 420 and the grounding portion of the corresponding device 300, which can ensure that the conductive gasket 420 and the corresponding device 300 are stably connected. On the other hand, the pressure of the grounding portion of the device 300 on the conductive gasket 420 acts on the warping portion 1221, which can cause the second end of the warping portion 1221 to move toward the flat portion 122 of the support sheet 120, and the warping portion 1221 produces an elastic deformation from the original warped state to a flattened state, so that the warping portion 1221 tends to return to its original shape, and the contact area between the warping portion 1221 and the screen body 110 is increased, which can improve the strength and flatness of the folding screen 100 in this area. Moreover, the elastic force generated by the elastic deformation acts on the conductive gasket 420, which can make the conductive gasket 420 in close contact with the grounding portion of the corresponding device 300.

[0136] Illustratively, the conductive gasket 420 may include a fixed segment 421, a bent segment 422, and a connecting segment 423 connected in sequence. The conductive gasket 420 may be an integrally formed part, with the fixed segment 421, the bent segment 422, and the connecting segment 423 corresponding to the sequentially formed portions of the conductive gasket 420. The fixed segment 421 is connected to the second end of the raised portion 1221. The fixed segment 421 may be attached to the surface of the raised portion 1221, for example, by welding or bonding with a conductive adhesive. The fixed segment 421 extends toward the ground portion. The bent segment 422 bends from the second end of the raised portion 1221 toward the first end of the raised portion 1221, such that the connecting segment 423 is located on the side of the raised portion 1221. The connecting segment 423 may be attached to the surface of the ground portion of the corresponding device 300, thereby achieving connection between the conductive gasket 420 and the ground portion of the corresponding device 300.

[0137] As for the connection between the conductive gasket 420 and the ground portion of the device 300, as shown in FIG8 , the connecting section 423 of the conductive gasket 420 that is in contact with the ground portion of the device 300 can be set to a ring structure, and the ring-shaped connecting section 423 is equivalent to forming a mounting hole 4231 in the central area of ​​the connecting section 423. Figure 9 As shown, a locking member b is inserted into the mounting hole 4231. The locking member b is, for example, a screw, bolt, or rivet. The locking member b passes through at least a portion of the thickness of the device 300 (e.g., the mainboard 301), so that the conductive gasket 420 is locked to the device 300 through the locking member b. Alternatively, in other examples, the conductive gasket 420 can be welded or bonded to the surface of the device 300 with a conductive adhesive on one side of the connecting section 423 facing the ground portion of the device 300.

[0138] Figure 10 for Figure 5 Schematic diagram of the third conductive structure used in the common ground structure shown in FIG. Figure 10As shown, under the premise that the strength and flatness of the folding screen 100 in the slotted area are guaranteed, the area enclosed by the slot cut on the flat portion 122 of the support sheet 120 can be slightly increased to slightly increase the size of the formed warped portion 1221. For the slightly increased size of the warped portion 1221, the degree of bending of the warped portion 1221 can be increased accordingly. In this case, the curvature of the warped portion 1221 can be greater than 90° and less than 180°. For example, the curvature of the warped portion 1221 can be 120°, 130°, 140°, 150°, etc.

[0139] By making the curvature of the raised portion 1221 greater than 90° and less than 180°, the raised portion 1221 forms a "U"-shaped structure, with a curved top. The second end and first end of the raised portion 1221 are both located on the same side of the curved top. The portion of the raised portion 1221 from its second end to the portion near the curved top forms a bonding section 1221a. The raised portion 1221 can mate with the ground portion of the corresponding device 300 by virtue of the bonding section 1221a formed by itself, without the need for additional conductive components (such as conductive gaskets 420) to connect to the device 300. The portions of the raised portion 1221 located on both sides of the curved top form opposing elastic arms, and the elastic force of the elastic arms ensures that the raised portion 1221 and the ground portion of the device 300 are tightly bonded.

[0140] Among them, the bonding section 1221a can be connected to the grounding part of the device 300 by welding or conductive adhesive bonding, or, similar to the connection method of the aforementioned conductive gasket 420, the bonding section 1221a can be locked on the device 300 by connecting parts such as screws, bolts or rivets, which will not be repeated here.

[0141] and Figure 8a and Figure 8b The position setting method of the raised portion 1221 shown in the figure is similar. For the raised portion 1221 with a bending arc greater than 90° and less than 180°, the raised portion 1221 can be set in the middle area of ​​the flat plate portion 122, or the raised portion 1221 can also be set in the edge area of ​​the flat plate portion 122, which will not be repeated here.

[0142] In other examples, the lifting portion 1221 and the grounding portion of the corresponding device 300 can also be connected through other connecting structures. For example, the lifting portion 1221 and the grounding portion of the corresponding device 300 can be snapped together, a snap portion can be integrally formed on the lifting portion 1221 or a separate snap portion can be connected, and a slot can be opened on the grounding portion of the corresponding device 300, and the snap portion is snapped into the slot to achieve electrical connection between the lifting portion 1221 and the grounding portion of the corresponding device 300.

[0143] Please refer to Figure 8 and Figure 10Regardless of whether the curvature of the raised portion 1221 is less than 90° or greater than 90° but less than 180°, the raised portion 1221 may be provided with a plurality of openings a, similar to the hollow portion 121 of the support sheet 120. This facilitates the bending of the raised portion 1221 and facilitates the formation of the raised portion 1221 that is tilted toward the ground portion of the device 300. Furthermore, the plurality of openings a are equivalent to forming a plurality of air dielectric layers in the raised portion 1221, which can effectively reduce the heat conduction effect of the raised portion 1221. This prevents damage to the screen body 110 during the welding process when the raised portion 1221 is connected to the conductive gasket 420 or the ground portion of the device 300. Among them, for the raised portion 1221 with a bending arc greater than 90° and less than 180°, the bonding section 1221a of the raised portion 1221 may not be provided with an opening a to ensure the contact area between the bonding section 1221a and the grounding portion of the corresponding device 300, and to ensure that the connection between the bonding section 1221a and the grounding portion of the device 300 is stable.

[0144] In other embodiments, the conductive structure 400 may be, for example, a conductive spring disposed between the support sheet 120 and the ground portion of the corresponding device 300, with one side of the conductive spring in contact with the support sheet 120 and the other side of the conductive spring in contact with the ground portion of the corresponding device 300, thereby achieving electrical connection between the support sheet 120 and the ground portion of the corresponding device 300 through the conductive spring. The conductive spring located between the support sheet 120 and the ground portion of the device 300 is in a compressed state, and the elastic force generated by the conductive spring causes its two sides to cling to the support sheet 120 and the ground portion of the corresponding device 300, respectively, ensuring stable electrical conduction between the support sheet 120 and the ground portion of the corresponding device 300.

[0145] For example, the conductive spring can be configured to Figure 10 Alternatively, the conductive spring may be configured as a "U"-shaped structure similar to the raised portion 1221, or a different form such as an "S"-shaped structure or a frame-shaped structure, which is not limited in this embodiment.

[0146] In addition, the support sheet 120 itself may be improved to reduce its impedance. Figure 11 This is a schematic diagram of a common ground structure using another supporting plate provided in an embodiment of the present application. Figure 11As shown, in this embodiment, the area enclosed between the conductive structures 400 on both sides of the hollow portion 121 of the support sheet 120 is defined as a first area 1211, and the area of ​​the hollow portion 121 outside the first area 1211 is defined as a second area 1212. The area enclosed between the conductive structures 400 on both sides is the area enclosed by the line connecting the edges of the opposite sides of the conductive structures 400 on both sides. Taking the conductive structures 400 on both sides as an example, the area enclosed by the conductive structures 400 on both sides is the rectangular area enclosed by the line connecting the opposite ends of the conductive structures 400 on both sides and the side edges of each conductive structure 400.

[0147] The size of the opening a (e.g., a strip-shaped hole) within the first region 1211 of the hollow portion 121 can be designed to reduce the size of the opening a and thereby reduce the coverage area of ​​the opening a within the first region 1211. In other words, the hollow area of ​​the first region 1211 can be reduced so that the hollow area of ​​the first region 1211 is smaller than the hollow area of ​​the second region 1212. Since current primarily flows within the region enclosed by the conductive structures 400 on corresponding sides of the support sheet 120, reducing the hollow area within the first region 1211 increases the flow area within the first region 1211, thereby increasing the density of current flowing through the first region 1211 and reducing the impedance of the support sheet 120, thereby facilitating improved grounding effectiveness of the common ground structure.

[0148] At the same time, the opening a in the second area 1212 still maintains a large size, so that the second area 1212 maintains a large hollow area to ensure the bendability of the support sheet 120, and ensure that the support sheet 120, while enhancing the strength of the foldable part 103 of the folding screen 100, will not affect the bending and flattening of the foldable part 103.

[0149] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0150] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A foldable electronic device, characterized in that: include: A first housing, a second housing, a rotating shaft, and a folding screen, wherein the rotating shaft is connected between the first housing and the second housing, and the folding screen is supported and connected to a side surface of the first housing and the second housing; wherein the folding screen includes a screen body and a conductive support sheet, the support sheet is attached to a side of the screen body facing the rotating shaft and is arranged corresponding to the rotating shaft, and the support sheet bends or unfolds with the screen body; The foldable electronic device further includes: components and a conductive structure, the components including a first component disposed in the first housing and a second component disposed in the second housing, the conductive structure being connected between a ground portion of the first component and the support sheet, and between a ground portion of the second component and the support sheet; The orthographic projection of the support sheet on the first shell has an overlapping area with the grounding part of the first component, and the orthographic projection of the support sheet on the second shell also has an overlapping area with the grounding part of the second component. The conductive structure is located in the overlapping area between the support sheet and the grounding part of the corresponding component.

2. The foldable electronic device according to claim 1, wherein: Both sides of the support piece in the width direction extend beyond both sides of the rotating shaft.

3. The foldable electronic device according to claim 2, wherein: The conductive structure is a conductive layer attached between the support sheet and the ground portion corresponding to the device.

4. The foldable electronic device according to claim 3, wherein: The conductive layer is a long strip structure.

5. The foldable electronic device according to claim 4, wherein: The conductive layer extends along the length direction of the supporting sheet.

6. The foldable electronic device according to claim 5, characterized in that: The conductive layer corresponding to the first component and the conductive layer corresponding to the second component are arranged opposite to each other on both sides of the rotating shaft.

7. The foldable electronic device according to claim 5, wherein: The conductive layer extends from the edge of the support sheet toward the center of the support sheet.

8. The foldable electronic device according to any one of claims 3 to 7, wherein: The conductive layer includes conductive foam.

9. The foldable electronic device according to claim 8, wherein: The conductive layer also includes a conductive medium layer; The conductive medium layer at least covers a surface of the conductive foam facing the support sheet and a surface of the conductive foam facing a ground portion corresponding to the device.

10. The foldable electronic device according to claim 9, wherein: The conductive medium layer includes a gold layer or a copper layer.

11. The foldable electronic device according to any one of claims 3 to 7, characterized in that: The conductive layer is a conductive adhesive layer.

12. The foldable electronic device according to claim 2, wherein: The supporting piece includes a flat plate portion and a tilted portion, wherein a first end of the tilted portion is integrally connected to the flat plate portion, and a second end of the tilted portion tilts toward a ground portion corresponding to the device; The raised portion constitutes at least a portion of the conductive structure, and the raised portion is electrically connected to a ground portion corresponding to the device.

13. The foldable electronic device according to claim 12, wherein: The raised portion is distributed with a plurality of openings.

14. The foldable electronic device according to claim 13, wherein: The bending arc of the raised portion is less than 90°, and the conductive structure also includes a conductive gasket, which is connected to the second end of the raised portion and extends to the side where the raised portion is located. The conductive gasket is attached to and connected to the grounding portion of the corresponding device.

15. The foldable electronic device according to claim 14, wherein: The conductive gasket includes a fixed section, a bent section and a connecting section connected in sequence, the fixed section is attached to the surface of the tilted portion and extends toward the grounding portion, the bent section is bent toward the side where the first end of the tilted portion is located, and the connecting section is attached to the grounding portion.

16. The foldable electronic device according to claim 15, wherein: The connecting section has a mounting hole, a locking piece is passed through the mounting hole, and the conductive gasket is connected to the grounding portion through the locking piece.

17. The foldable electronic device according to claim 13, wherein: The curvature of the raised portion is greater than 90° and less than 180°, and the raised portion has a fitting section, which covers from the second end of the raised portion to the curved top near the raised portion, and the fitting section is fitted with the grounding portion of the corresponding device.

18. The foldable electronic device according to claim 2, wherein: The conductive structure is a conductive spring, which is connected between the support sheet and the ground portion corresponding to the device, and is in a compressed state.

19. The foldable electronic device according to any one of claims 2-7, 9-10, and 12-18, characterized in that: The middle area of ​​the support sheet in the width direction is a hollow portion, and the conductive structure corresponding to the ground portion of the first device and the conductive structure corresponding to the ground portion of the second device are respectively located on both sides of the hollow portion.

20. The foldable electronic device according to claim 19, wherein: In the area enclosed between the conductive structures on both sides, the area inside the hollow portion is a first area, and the area outside the first area in the hollow portion is a second area; The hollow area of ​​the first region is smaller than the hollow area of ​​the second region.

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