Conductive PVD stack design for improved reliability of deposited electrodes

Abstract

The present disclosure relates to a conductive PVD stack design for improving the reliability of deposited electrodes. An electronic device may include: a housing component that defines an inner surface and an outer surface of the device; a first film deposited on the inner surface and extending at least partially around an edge of the housing component to the outer surface; and a second film deposited on the outer surface and at least partially deposited on a portion of the first film on the outer surface, the second film being in electrical communication with the portion of the first film deposited on the inner surface.

Description

[0001] Division Statement

[0002] This application is a divisional application of the Chinese invention patent application with the application date of February 28, 2020, the invention name of which is “Conductive PVD stack design for improving the reliability of deposited electrodes” and the application number: 202010126390.2. Technical Field

[0003] The embodiments generally relate to conductive coatings. More particularly, the embodiments relate to thin film conductive coatings for electronic devices. Background Art

[0004] When designing electronic devices, portability is increasingly a consideration, for example, to allow users to use the devices in a variety of situations and environments. In the context of wearable devices, these devices may be designed to operate in many different locations and environments and may be exposed to a wide range of environmental conditions, some of which may be particularly harsh for traditional or conventional electronic device designs.

[0005] At the same time, electronic devices continue to include more and more features, some of which may require the device to interact with or obtain information from the surrounding environment. Conventional techniques for allowing devices to communicate with the environment (such as providing openings or holes in the device housing to allow sensors to communicate with the environment) can become entry points for environmental contaminants and can cause unwanted liquids or abrasive particles to be trapped in the interior of the device. Such retention or exposure to environmental materials or conditions can result in undesirable degradation of the performance or operation of one or more features of the device. In addition, such openings or ports can affect the physical appearance of the device in a way that is unpleasant to the user.

[0006] Therefore, it may be desirable to provide alternative components and methods for allowing communication between the ambient environment and components (such as sensors housed in the internal volume of the device) that do not include holes or expose portions of the internal volume of the device to environmental conditions. Summary of the Invention

[0007] According to some aspects of the present disclosure, an electronic device may include a housing component defining an inner surface and an outer surface of the device. A metal film is deposited on the inner surface and extends at least partially onto the outer surface, and a ceramic film is deposited on the outer surface and at least partially deposited on a portion of the metal film on the outer surface. The ceramic film is in electrical communication with the portion of the metal film deposited on the inner surface.

[0008] In some examples, the electronic device may further include a seal that isolates an interior volume of the electronic device, at least partially defined by the interior surface, from the surrounding environment. The electronic device may further include an electronic component deposited in the interior volume and electrically coupled to the ceramic membrane, wherein the exterior surface is exposed to the surrounding environment, and the metal membrane and the ceramic membrane are electrically coupled to the electronic component via a conductive ink. The metal membrane may include at least one of chromium or titanium. The ceramic membrane may include carbonitride. The interior surface may include a concave geometry, and the exterior surface may include a convex geometry. The housing component may be transparent.

[0009] According to some aspects, a housing for an electronic device may include: a conductive film deposited on a first surface of the housing and extending at least partially to a second surface of the housing opposite the first surface; and a ceramic film deposited on the second surface and at least partially deposited on a portion of the conductive film deposited on the second surface. The conductive film and the ceramic film may form a conductive path extending across the first surface and the second surface.

[0010] In some examples, the housing may further include a conductive ink deposited on a portion of the conductive film deposited on the first surface. At least one of the ceramic film or the conductive film may be deposited by a physical vapor deposition process. The conductive film may include a first conductive layer in electrical contact with the first surface, and a second conductive layer deposited on the second surface and at least partially deposited on the first conductive layer. The first conductive layer may be formed before the second conductive layer, and the ceramic film may be formed after the first conductive layer and the second conductive layer.

[0011] The first conductive layer may have a thickness of 100 nanometers, and the second conductive film may have a thickness of 50 nanometers. The ceramic film may have a thickness of 1 micron. The conductive material may include at least one of chromium or titanium. The ceramic material may include a nitride that forms the conductive material. The first surface may include a non-planar surface. The ceramic film may have an L* value of 55 to 65 in the CIELAB color space.

[0012] According to some aspects, a method of forming a conductive housing component may include depositing a first conductive layer on a first surface of the housing component, depositing a second conductive layer on a second surface of the housing component opposite the first surface, the second conductive layer at least partially overlapping the first conductive layer, and depositing a ceramic layer on the second metal film.

[0013] In some examples, the conductive layer may include at least one of chromium or titanium, and the ceramic layer may include a nitride material containing at least one of chromium or titanium. The housing component may be a first housing component, and the method may further include sealing an interface between the first housing component and the second housing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present disclosure will be readily understood through the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and wherein:

[0015] Figure 1 A perspective view of an electronic device is shown.

[0016] Figure 2 Shown Figure 1 An exploded perspective view of an electronic device.

[0017] Figure 3 Shown Figure 1 A cross-sectional side view of a portion of an electronic device.

[0018] Figure 4 A top view of a portion of an electronic device including components is shown.

[0019] Figure 5A Shown Figure 4 Bottom view of the component.

[0020] Figure 5B Shown Figure 4 Top view of the components.

[0021] Figure 6 A cross-sectional view of a portion of a component of an electronic device is shown.

[0022] Figure 7 A cross-sectional view of a portion of a component of an electronic device is shown.

[0023] Figure 8 A cross-sectional view of a portion of an electronic device including components is shown.

[0024] Figure 9 A process flow diagram for forming components of an electronic device is shown. DETAILED DESCRIPTION

[0025] Reference will now be made in detail to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. On the contrary, the following description is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the embodiments defined by the appended claims.

[0026] The electronic device may include a housing component that at least partially defines an inner surface and an outer surface of the device. The inner surface may at least partially define an internal volume of the device. A metal film may be deposited on the inner surface of the component and may extend at least partially onto the outer surface. A ceramic film may be deposited on the outer surface of the component and at least partially deposited on a portion of the metal film on the outer surface. The ceramic film may be electrically connected to a portion of the metal film deposited on the inner surface to provide an electrical path from the outer surface to the inner surface through both the ceramic film and the metal film. The electronic device may also include a seal that can isolate the internal volume of the device from the surrounding environment, and the electrical path defined by the ceramic film and the metal film can provide a signal along the electrical path and across the seal to the internal volume of the device, where the signal can be transmitted to one or more components, such as sensors contained in the internal volume of the device.

[0027] Portable electronic devices can be made more robust by reducing and / or eliminating the number of openings from the internal volume defined by the device housing to the outer surface of the device housing. However, at the same time, it may be desirable to incorporate one or more sensors into a device that needs to communicate with the external environment. For example, a conventional input / output port of a device may typically include a cavity for receiving an electrical connector. This cavity may allow liquid to undesirably enter at least a portion of the device housing. Although such a cavity may be sealed from the rest of the internal volume of the device, the presence of corrosive liquids or debris may damage or degrade the operating performance of the device over time.

[0028] It may also be desirable to provide sensors in the device that allow the device to monitor biometric parameters of the user. For example, due to the substantially continuous contact of the wearable device with the user's skin while being worn, the wearable device may include sensors that monitor one or more conditions of the user's skin, such as the skin's electrical properties. These electrical properties may be tracked by the device over time to enable a variety of functions and features that the user may desire. However, in order to achieve this functionality, a path must exist between the sensors, which are typically housed in the internal volume of the device, and the user's skin, which is positioned external to the device. Consequently, conventional device configurations may experience similar issues with unwanted ingress of liquids or abrasive particles.

[0029] As described herein, it may be desirable to provide a conductive pathway extending from an exterior surface of a device, across a seal or sealant material, and into an interior volume of the device, where the pathway may be electrically coupled to one or more components, such as a sensor. In some examples, this electrical pathway may be achieved by including a housing component that includes a layer of conductive material extending from an exterior surface of the component, through a seal or waterproof element of the device housing, to an interior surface.

[0030] For example, one or more layers of material that can provide a desired level of electrical contact with the user's skin can be deposited on and extend between peripheral areas of opposing surfaces of the first housing component. In some examples, these layers can be considered contact electrodes. When the interface between the first and second housing components is sealed, the deposited one or more layers can provide a robust conductive path into and out of the housing without compromising the water resistance of the device housing and without undesirably exposing a portion of the device's interior volume to environmental conditions. In some examples, this conductive path can relay electrical signals, thereby providing sensor readings and / or power between the interior and exterior of the device housing.

[0031] In some examples, it may be beneficial to deposit one or more layers that form an electrical pathway on a housing component in a location that is not noticeable to a user. Furthermore, it may be desirable to form an electrical pathway on a component that is substantially electrically insulating to prevent crosstalk or noise in the signals provided along the pathway. Thus, one or more material layers may form contact electrodes that define the electrical pathway on the housing component. The material layers may include polymeric or ceramic materials, such as polycarbonate, glass, or sapphire.

[0032] However, when the layers of the contact electrode are exposed to the ambient environment, it may be desirable to deposit layers that can withstand environmental exposure and typical use while still providing a reliable electrical path to the interior of the device. In some examples, the contact electrode can be exposed to the ambient environment and daily use without wearing, scratching, delaminating, corroding, or otherwise degrading. Thus, in some examples, the outer surface of the contact electrode can be formed from a material having a desired level of hardness and corrosion resistance, while other layers of the contact electrode that are not exposed to the environment can have a relatively high level of conductivity and can be relatively ductile or deformable, for example to prevent or reduce brittle failure and to prevent, reduce, or withstand delamination of one or more layers of the contact electrode from the material of the component on which the contact electrode is formed.

[0033] The following references Figures 1-9 These and other embodiments are discussed. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for illustrative purposes only and should not be construed as limiting.

[0034] Figure 1 An embodiment of an electronic device 100 is shown. Figure 1 The electronic device shown in FIG is a wearable device, such as a smart watch. Figure 1The smartwatch 100 is only one representative example of a device that may be used with the components and methods disclosed herein. The electronic device 100 may correspond to any form of electronic device, medical device, health sensing device, wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, and other devices. The electronic device 100 may be referred to as an electronic device or a consumer device. Figure 2 More details of the electronic device 100 are provided.

[0035] Now refer to Figure 2 , electronic device 100 may include a housing 101 and a cover 103 attached to housing 101. Housing 101 may substantially define at least a portion of an exterior surface of device 100 and may include a base and sidewalls 120. Cover 103 may be transparent and may include glass, ceramic, plastic, or any other substantially transparent material, component, or assembly. Cover 103 may cover or otherwise cover a display, camera, touch-sensitive surface, and / or other components of device 100. Cover 103 may define a front exterior surface of device 100.

[0036] Rear cover 110 may also be attached to housing 101, for example opposite cover 103. Rear cover 110 may comprise ceramic, plastic, metal, or a combination thereof. In some examples, rear cover 110 may include component 130. Component 130 may be a component 130 that is at least partially electromagnetically transparent. Component 130 may comprise a transparent material and may include one or more portions that are transparent to electromagnetic radiation of any desired wavelength, such as visible light, infrared light, radio waves, or a combination thereof. In some examples, component 130 may be disposed above one or more sensors, such as electromagnetic radiation emitters and / or detectors, housed in the interior volume of device 100. Housing 101, cover 103, and rear cover 110 together may substantially define the interior volume and exterior surface of device 100.

[0037] In some examples, component 130 may include one or more contact electrodes disposed on an outer surface of the component. For example, component 130 may include a first contact electrode 132 and a second contact electrode 133. In some examples, first contact electrode 132 and second contact electrode 133 may be designed to provide electrical contact with a user's skin, for example, when smartwatch 100 is attached to the user using strap 102 coupled to housing 101. In some examples, contact electrodes 132, 133 may provide an electrical path for relaying or transmitting signals from the outer surface of electronic device 100 to the interior volume of device 100. In some examples, the electrical path provided by contact electrodes 132, 133 may communicate with one or more components (e.g., one or more sensors contained within the interior volume of device 100). One or both of first contact electrode 132 and second contact electrode 133 may include a conductive film and a ceramic film.

[0038] The device 100 may also include internal components, such as a haptic engine, a battery, and a system-in-package (SiP), including one or more integrated circuits, such as a processor, a sensor, and a memory. The SiP may also include packaging. The device 100 may also include one or more electromagnetic radiation emitters and detectors, such as light-emitting diodes, cameras, optical detectors, infrared detectors, and other detectors and / or emitters. These emitters and detectors may be associated with one or more systems of the device (such as a camera system, a vision system, and / or a biometric system). Internal components (such as one or more emitters and detectors) may be disposed within an internal volume at least partially defined by the housing 101 and may be attached to the housing 101 via the following features: an internal surface, an attachment feature, a threaded connector, a stud, a column, or other features formed into, defined by, or otherwise part of the housing 101 and / or the cover 103 or the back cover 110. In some examples, the attachment feature may be formed on the inner surface of the housing 101, for example, by machining.

[0039] Housing 101 can be a substantially continuous or unitary component and can include one or more openings 112 for receiving input components of electronic device 100, such as buttons 114, and / or providing access to internal portions of electronic device 100. In some examples, device 100 can include input components, such as one or more buttons 114 and / or a crown 115. In some examples, device 100 can also include a seal or sealant material that can provide an airtight and / or watertight seal at the location of opening 112. Electronic device 100 can also include a strap 102 or other component designed to attach device 100 to a user or otherwise provide wearable functionality. In some examples, strap 102 can be a flexible material that comfortably allows device 100 to be retained at a desired location on the user's body. Additionally, housing 101 can include one or more features 113 therein that can provide attachment locations for strap 102. In some examples, strap 102 can be retained on housing 101 using any desired technique. For example, the strap 102 may include magnets that are attracted to magnets disposed within the housing 101, may include retaining features that mechanically retain the strap 102 to the housing 101, or a combination thereof.

[0040] Figure 3 Shown Figure 1 and Figure 2 A cross-sectional view of a portion of the smartwatch 100 is shown. Figure 2As described, the smartwatch 100 may include a back cover 110 and a component 130 coupled to the back cover 110, for example, at a hole defined by the back cover 110. The component 130 may be sealed to the back cover 110, for example, using an adhesive, a sealant material, a gasket, or any other desired method or material. That is, in some examples, the interface between the component 130 and the back cover 110 may be sealed using an adhesive, a sealant material, a gasket, or any other desired method or material. In some examples, the component 130 may include a transparent portion or material 131 that may define an outer surface and an inner surface of the component 130. The first contact electrode 132 and the second contact electrode 133 may be formed or deposited on the outer surface of the transparent portion 131 and may extend from the outer surface to the inner surface. In some examples, one or both of the first contact electrode 132 and the second contact electrode 133 may be electrically coupled to one or more components in the interior volume of the device 100, as described herein. For example, because first contact electrode 132 and / or second contact electrode 133 can extend from the outer surface of transparent portion 131 to the inner surface of the interior volume of device 100, electrical signals can be transmitted from the outer surface of device 100 to the interior volume, such as to sensor 126. However, the interior volume can be sealed and can remain sealed from the surrounding environment, while electrical signals can be transmitted through the electrical path defined by first contact electrode 132 and second contact electrode 133. In some examples, the outer surface and / or the inner surface defined by component 130 can be non-planar. For example, the outer surface of component 130 can be a convex surface, while the inner surface of component 130 can be a concave surface.

[0041] The electronic device 100 may also include a plurality of components disposed in an internal volume at least partially defined by the rear cover 110 and the component 130. For example, the electronic device 100 may include a frame 122 that may support one or more internal components, such as a battery 124. The electronic device 100 may also include a support structure 129 that may be coupled to or otherwise support the sensor 126. In some examples, the sensor 126 may be a biometric sensor and may be electrically connected to one or both of the first contact electrode 132 and the second contact electrode 133. In some examples, the sensor 126 may include an electrocardiogram (EKG or ECG) sensor, an electroencephalogram (EEG) sensor, an electromyogram (EMG) sensor, a skin electrode activity (EDA) sensor, a bioelectrical impedance sensor, other biometric sensors, or a combination thereof.

[0042] The electronic device 100 may also include one or more additional components or sensors, such as a light emitting component 128 and an optical sensor 127. The optical sensor 127 may be designed to receive light that has been transmitted back through the transparent portion 131 after interacting with the surrounding environment, such as a portion of a user adjacent to the component 130. In some examples, the light may be emitted by the light emitting component 128 before interacting with the surrounding environment.

[0043] In some examples, device 100 may include sensors such as an audio sensor (e.g., a microphone), an optical or visual sensor (e.g., a camera, a visible light sensor, an infrared sensor, or an ultraviolet light sensor), a proximity sensor, a touch sensor, a force sensor, a mechanical device (e.g., a crown, switch, button, or key), a vibration sensor, an orientation sensor, a motion sensor (e.g., an accelerometer or velocity sensor), a position sensor (e.g., a global positioning system (GPS) device), a thermal sensor, a communication device (e.g., a wired or wireless communication device), a resistive sensor, a magnetic sensor, an electroactive polymer (EAP), a strain gauge, an electrode, or some combination of these sensors.

[0044] In some examples, sensor 126 may be electrically coupled to both first contact electrode 132 and second contact electrode 133, as described herein. In this configuration, the voltage drop generated by the user's skin contacting first contact electrode 132 and second contact electrode 133 may be monitored by sensor 126 and, for example, relayed to a processor of device 100 to measure one or more biometric parameters of a user of electronic device 100. In some examples, the electrical signal provided to sensor 126 in the internal volume of device 100 via first contact electrode 132 and second contact electrode 133 may be combined with signals from one or more other sensors of the device, such as optical sensor 127, to provide an accurate biometric measurement of the user's physical state. Figure 4-5B Various examples of components, such as housing components (including films or layers that can provide electrical pathways between surfaces of the components) and processes for forming the same are described.

[0045] Figure 4 A top view of a portion of an electronic device is shown, which may be similar to and include the electronic device described herein with respect to Figure 1-Figure 3 Some or all of the characteristic features of the electronic device 100 described above. Figure 4The inner surface of a rear cover 210 that can be substantially similar to the rear cover 110 described herein is shown, and a component 230 that can be sealed to the rear cover 210 is also shown. In some examples, the component 230 may include a transparent portion and may be sealed to the rear cover 210 along the perimeter of the component 230. Although the component 230 is shown as being substantially circular, in some examples, the component 230 may include any desired shape. For example, the component 230 may be substantially rectangular, triangular, or any desired polygonal or polyhedral shape. The component 230 may be disposed in an aperture 211 that is at least partially defined by the rear cover 210. In some examples, the component 230 may have a perimeter shape that corresponds to or is substantially similar to the shape of the aperture 211 defined by the rear cover 210. In some examples, the component 230 may be sealed or coupled to the rear cover 210 by a sealant material or gasket 270 that may be disposed around the aperture 211 and / or the perimeter of the component 230. In some examples, sealant material 270 can be an adhesive, glue, gasket, or any other material capable of providing an airtight and / or watertight seal between component 230 and rear cover 210. Figure 5A and Figure 5B Component 230 is described in further detail.

[0046] Figure 5A A bottom view of component 230 is shown, for example, a portion of component 230 that may at least partially define an outer surface of an electronic device that includes component 230. As with component 130, component 230 may include a transparent portion or material 231 that may define an outer surface or back surface 234 of component 230. In some examples, first contact electrode 232 and second contact electrode 233 may be formed or deposited on outer surface 234 of transparent portion 231. In some examples, first contact electrode 232 and second contact electrode 233 may have substantially similar sizes and / or shapes. For example, first contact electrode 232 and second contact electrode 233 may have a substantially semicircular shape and may be formed or deposited on a peripheral portion of surface 234. However, in some examples, first contact electrode 232 and second contact electrode 233 may be any desired size or shape. Additionally, in some examples, first contact electrode 232 and second contact electrode 233 may cover or be deposited on only a portion of outer surface 234 of component 230. Thus, one or more sensors of an electronic device (such as a sensor with respect to a sensor) may be formed or deposited on a portion of outer surface 234 of component 230. Figure 2-Figure 3 The optical sensor may communicate with the surrounding environment and receive light from the surrounding environment through the portion of the transparent material 231 that is not covered by the first contact electrode 232 and the second contact electrode 233 .

[0047] In some examples, transparent portion 231 can be transparent to electromagnetic radiation within one or more wavelength ranges. In some examples, transparent portion 231 can comprise a transparent ceramic or polymer material, such as a polycarbonate material, an acrylic material, a glass material, a sapphire material, or a combination thereof. In some examples, transparent portion 231 can be a substantially integral or continuous portion of material, while in some other examples, transparent portion 231 can be formed from multiple portions or components that can be fused or bonded together. As described herein, transparent portion 231 can be of any shape or size.

[0048] In some examples, one or both of the first contact electrode 232 and the second contact electrode 233 may include one or more thin films. These thin films may be deposited by one or more deposition processes, such as the physical vapor deposition (PVD) processes described herein. The materials of the first contact electrode 232 and the second contact electrode 233 may be selected to provide a desired level of electrical contact when in physical contact with a desired surface, such as the user's skin. The materials of the first contact electrode 232 and the second contact electrode 233 may also be selected to provide a desired level of hardness, durability, or any other material properties. The materials of the first contact electrode 232 and the second contact electrode 233 may include a metallic material, a ceramic material, or a combination thereof. For example, the first contact electrode 232 may include a metal film including chromium or titanium and a ceramic film including a ceramic material that includes chromium or titanium.

[0049] Figure 5B 2 shows a top view of a component 230 that includes an inner surface 235 that may at least partially define an interior volume of an electronic device. As shown, a first contact electrode 232 may extend from an edge or perimeter of the component 230. Figure 5A The transparent portion 231 may extend from the outer surface 234 shown and extend to the inner surface 235. Similarly, the second contact electrode 233 may extend from the outer surface 234 to the inner surface 235. In some examples, a conductive material or portion of a conductive material may be formed, deposited, or otherwise placed on the inner surface 235 of the transparent portion 231. In some examples, the conductive material may be a metallic material such as copper, aluminum, any other conductive material, or a combination thereof. In some examples, the portion of the conductive material may form one or more electrical contacts that may provide electrical connections to one or more components of the electronic device, such as the sensors described herein. For example, the portion of the conductive material disposed on the inner surface 235 may form or define a first component contact 251, a second component contact 252, and a third component contact 253. These component contacts 251, 252, 253 may be electrically coupled or connected to any desired component in the electronic device, for example, via solder, conductive ink, or any other method or component.

[0050] In some examples, first contact electrode 232 can be electrically coupled to one or more component contacts 251, 252, 253. For example, a portion of first conductive electrode 232 deposited or formed on inner surface 235 of component 230 can be electrically coupled to component contacts 251, 252, 253 via conductive ink 242 or other conductive material. In some examples, conductive ink 242 can include conductive particles suspended in a binder material, such as silver particles suspended in a polymer binder. In some examples, this portion of conductive ink 242 can be applied to first contact electrode 232 and also to one or more component contacts 251, 252, 253 to form an electrical connection therebetween. Thus, first contact electrode 232 can be electrically connected to one or more components of an electronic device via first conductive ink portion 242 and one or more component contacts 251, 252, 253. Similarly, second contact electrode 233 can be electrically coupled to one or more component contacts 251, 252, 253 via second conductive ink portion 243. Thus, an electrical path can be formed from the outer surface 234 of the component 230 to the interior volume at least partially defined by the component 230 (including one or more sensors or other electronic components as described herein) through the first contact electrode 232 and / or the second contact electrode 233. In some examples, the first contact electrode 232 and the second contact electrode 233 can be in electrical communication with each other through a shared component contact. However, in other examples, the first contact electrode 232 and the second contact electrode 233 are not in electrical communication with each other.

[0051] Although described herein as conductive ink portions 242, 243, in some examples, these portions may include any desired conductive material. For example, portions 242, 243 may include solder, adhesive contact material, electrical connectors, or any other conductive material. In some examples, a mask layer 260 may be formed over the conductive material including component contacts 251, 252, 253. In some examples, the mask layer 260 may be an insulating material and may be used to electrically insulate one or more portions of the component contacts 251, 252, 253 or any other component of the electronic device. Additionally, the mask layer 260 may be used as an optical mask layer and may optically isolate one or more portions of the component 230 and / or sensor in the device. Detailed description of the embodiments of the present invention is provided below with reference to the accompanying drawings. Figure 6-Figure 8 Various examples of components, such as housing components (including films or layers that can provide electrical pathways between surfaces of the components) and processes for forming the same are described.

[0052] Figure 6A portion of component 330 is shown, comprising a transparent portion or body 331 and a contact electrode 332 comprising a conductive film 321 and a ceramic film 323 at least partially overlapping conductive film 321. As shown, transparent portion 331 may define a first surface 334 and a second surface 335, which may be disposed opposite first surface 335. In some examples, second surface 335 of transparent portion 330 may at least partially define the interior volume of an electronic device including component 330 and may be considered an interior surface of component 330. Similarly, surface 334 may at least partially define the exterior surface of the electronic device including component 330 and may thus be in communication with the surrounding environment. In some examples, surface 334 may be considered an exterior surface. Either or both surfaces 334, 335 may include any combination of planar and non-planar portions. In some examples, either or both surfaces 334, 335 may have a non-planar geometry, such as a concave or convex geometry. In some examples, either or both surfaces 334, 335 may include one or more non-planar features or structures, such as protrusions, indentations, corners, curves, lips, edges, bevels, other features or structures, or combinations thereof. In some examples, either or both surfaces 334, 335 may include any non-planar geometric structure that does not include undercut features or structures. However, in some other examples, either or both surfaces 334, 335 may include one or more undercuts.

[0053] The material forming transparent portion 331 can be any material that is substantially transparent to light of a desired wavelength range. For example, transparent portion 331 may include a material that is transparent to visible light, infrared light, ultraviolet light, or a combination thereof. In some examples, transparent portion 331 may include a transparent plastic material (such as polycarbonate and / or acrylic), a ceramic material (such as glass, sapphire, and / or any other desired ceramic material), or a combination thereof. In some examples, transparent portion 331 may have any desired thickness and may be approximately several millimeters to tens of millimeters thick. In some examples, one or more portions of transparent portion 331 may be as thin as several hundred microns. In addition, in some examples, transparent portion 331 may have a thickness that varies at the position of transparent portion 331.

[0054] In some examples, the conductive film 321 may be deposited or formed on the inner surface 335 and at least partially deposited or formed on the outer surface 334, as shown. In some examples, the conductive film 321 may be formed by any desired deposition process or combination of processes, such as a physical vapor deposition process, a chemical vapor deposition process, an epitaxial growth process, an electrochemical formation process, a printing process, an inkjet process, a spraying process, an electroplating process, any other known deposition process or process discovered in the future, or a combination thereof. In some examples, the conductive film 321 may have a uniform thickness across the entire area on which it is deposited. However, in some examples, the thickness of the conductive film 321 may vary depending on the deposition location on the transparent portion 331. Furthermore, in some examples and as described herein, the conductive film 321 may include multiple layers or films of conductive material.

[0055] In some examples, the conductive film 321 may include any conductive material or combination of materials. For example, the conductive film 321 may include one or more metals such as chromium, titanium, copper, aluminum, silver, or a combination thereof. In some examples, the conductive film 321 may be a ductile material. That is, in some examples, the conductive film 321 may be more ductile than the ceramic film 323. The conductive film 321 may have a thickness from about 10 nanometers (nm) to about 300 nm. In some examples, the conductive film 321 may be from about 25 nm thick to about 200 nm thick, or from about 50 nm thick to about 100 nm thick. For example, the conductive film 321 may be about 50 nm thick or about 100 nm thick. In some examples, the conductive film 321 may be about 100 nm thick on the inner surface 335 and about 50 nm thick on the outer surface 334.

[0056] In some examples, component 330 may also include a ceramic membrane 323, which may be formed or deposited on outer surface 334 such that ceramic membrane 323 at least partially overlaps a portion of conductive membrane 321 deposited on outer surface 334. In this manner, ceramic membrane 323 may be in electrical communication with conductive membrane 321, for example, at locations where membranes 321, 323 overlap. Ceramic membrane 323 may include any desired ceramic material, and in some examples, may include a ceramic material that provides a desired level of electrical communication between ceramic membrane 323 and the user's skin when in contact with the skin. In some examples, the electrical contact between ceramic membrane 323 and the user's skin may be or may include ionic contact. That is, in some examples, electrical signals may be transmitted or communicated from the user's skin to ceramic membrane 323 at least in part via ionic conduction. In some examples, the ceramic film 323 can be formed by any desired deposition process or combination of processes, such as a physical vapor deposition process, a chemical vapor deposition process, an epitaxial growth process, an electrochemical formation process, a printing process, an inkjet process, a spraying process, an electroplating process, any other known deposition process or process discovered in the future, or a combination thereof.

[0057] In some examples, the ceramic film 323 may include a carbide material, a nitride material, or a carbonitride material. In some examples, the ceramic film 323 may include additional component elements, such as silicon and / or metal elements. Therefore, in some examples, the ceramic film 323 may include a carbonitride material, such as a silicon carbonitride material. In some examples, the ceramic film 323 may include chromium silicon carbonitride (CrSiCN) or aluminum titanium nitride (AlTiN). In some examples, the ceramic film 323 may include one or more materials of the conductive film 321. For example, in the case where the conductive film 321 includes chromium, the ceramic film 323 may include a chromium-containing ceramic material, such as CrSiCN. Similarly, in the case where the conductive film 321 includes titanium, the ceramic film 323 may include a titanium-containing ceramic, such as AlTiN. The ceramic film 323 may have any desired thickness, for example, from about 10 nm thick to about 5000 nm (5 microns) thick. In some examples, ceramic film 323 can be from about 100 nm to about 2500 nm (2.5 microns) thick, or from about 500 nm to about 1000 nm (1 micron) thick. For example, ceramic film 323 can be about 1000 nm thick. In some examples, the thickness of ceramic film 323 can vary at various locations on component 330. In some examples, ceramic film 323 can have a hardness, as represented by a Vickers pyramid hardness value (HV), of greater than about 1000, greater than about 1500 HV, greater than about 2000 HV, greater than about 2500 HV, greater than about 3000 HV, or even greater.

[0058] As described herein, conductive film 321 may comprise a metallic material that is more ductile than ceramic film 323. Thus, conductive film 321 can be used to provide a high level of adhesion between contact electrode 332 and transparent portion 331, as the ductile conductive film 321 can conform to the surface of transparent portion 331 and can also absorb and distribute any stress applied to contact electrode 332. Ceramic film 323 may comprise a ceramic material that, in addition to providing a desired level of electrical connectivity with the surrounding environment, can also provide desirable levels of other material properties, such as hardness, durability, and / or corrosion resistance. Because ceramic film 323 can be deposited on outer surface 334 of transparent portion 331, it can at least partially define the exterior surface of an electronic device including component 330. Therefore, the material of ceramic film 323 can have a level of hardness that can withstand everyday use of electronic devices in the surrounding environment. Similarly, the ceramic material of ceramic film 323 can have a certain level of corrosion resistance, which can prevent degradation or undesirable corrosion of ceramic film 323, enabling continued use in a wide range of environments. Through the combination of the relatively stiff outer ceramic film 323 and the relatively ductile conductive film 321 at least partially underlying the ceramic film 323, the contact electrode 332 can achieve a desired level of adhesion to the transparent portion 331 while still maintaining a desired level of hardness and corrosion resistance to withstand exposure to the surrounding environment and maintain a desired level of electrical connectivity with the user's skin. Figure 7 Component 430 is described in further detail.

[0059] Figure 7 A cross-sectional view of a portion of a component 430 is shown, which may be substantially similar to and include the components described herein with respect to FIG. Figures 1-6 Some or all of the features of components 130, 230, and 330 described above may be present. Component 430 may include a transparent portion 431 comprising a transparent material, such as a transparent plastic or ceramic material, as described herein. In some examples, transparent portion 431 may have a non-planar shape or contour. Transparent portion 431 may define a first outer surface 434, which may at least partially define the exterior surface of an electronic device including component 430. In some examples, the outer surface may be convex. Transparent portion 431 may also define an inner surface 435, which may at least partially define the interior volume of the electronic device including component 430. In some examples, inner surface 435 may be disposed opposite outer surface 434. Inner surface 435 may have a non-planar shape or contour, and may be, for example, a concave surface. In some examples, the contours of outer surface 434 and inner surface 435 may correspond to each other. However, in some other examples, one or more portions of either surface 434 or 435 may have a shape that does not correspond to the shape of the opposing surface 434 or 435.

[0060] In some examples, component 430 may include a first contact electrode 432 that may include some or all of the features of contact electrodes 132, 133, 232, 233, 322 described herein. First contact electrode 432 may include a first conductive film or layer 421 that may be deposited on a portion or region of inner surface 435 (e.g., a portion of the perimeter adjacent to transparent portion 431). In some examples, first conductive film 421 may extend at least partially onto outer surface 434 of transparent portion 431. First conductive film 421 may include some or all of the features of any conductive film or layer described herein. In some examples, first conductive film 421 may include a metallic material, such as chromium, and may have a thickness of approximately 100 nm.

[0061] The first contact electrode 432 may also include a second conductive film or conductive layer 422. The second conductive film 422 may be at least partially deposited on the outer surface 434 of the transparent portion 431 and may at least partially overlap the first conductive film 421. For example, the second conductive film 422 may at least partially overlap the portion of the first conductive film 421 formed or deposited on the outer surface 434. In some examples, the second conductive film 422 may include the same material as the first conductive film 421. For example, if the first conductive film 421 includes chromium, the second conductive film 422 may also include chromium. However, in some other examples, the second conductive film 422 may include any desired material, such as any conductive material described herein. The second conductive film 422 may be electrically connected to the first conductive film 421. In some examples, the second conductive film 422 may have a thickness of approximately 50 nm.

[0062] In some examples, a metallurgical bond can be formed at the portion of film overlap between second conductive film 422 and first conductive film 421. In some examples, due to the nature of the deposition process for films 421, 422, second conductive film 422 and first conductive film 421 can be considered to be a substantially continuous or unitary film. In some examples, first conductive film 421 can be formed before second conductive film 422. In some examples, one or more other processes can be performed on component 430 during, before, or after the deposition of first conductive film 421 and second conductive film 422. Together, first conductive film 421 and second conductive film 422 can be considered to be a single, aggregated conductive film or layer extending from outer surface 434 to inner surface 435 of transparent portion 431.

[0063] In some examples, the thickness of the aggregated conductive film, including the first conductive film 421 and the second conductive film 422, can vary at various locations along the transparent portion 431. For example, the aggregated conductive film can have a thickness of approximately 100 nm at locations on the inner surface 435 where the conductive film includes only the first conductive film 421, and a thickness of approximately 50 nm at locations on the outer surface 434 where the aggregated conductive film includes only the second conductive film 422. In some examples, the thickness of the aggregated conductive film at locations on the transparent portion 431 where the second conductive film 422 overlaps the first conductive film 421 can be approximately the thickness of the first conductive film 421 plus the thickness of the second conductive film 422. In some examples, due to the directional nature of the deposition process involved and / or the geometry of the transparent portion 431, the first conductive film 421 and / or the second conductive film 422 can have a reduced thickness at locations where the films 421, 422 overlap. Thus, in some examples, the aggregated conductive film may have a thickness at the overlapping position of the first conductive film 421 and the second conductive film 422 that is smaller than the total thickness of other portions of the first conductive film 421 and the second conductive film 422 .

[0064] The first contact electrode 432 of the component 430 may also include a ceramic film 423 deposited on the outer surface 434 and at least partially overlapping the conductive film (e.g., the second conductive film 422). The ceramic film 423 may include some or all of the features of any other ceramic film described herein and may have a thickness between about 10 nm and about 5000 nm, for example, about 1000 nm. As described herein, the ceramic film 423 may include any carbide, nitride, or carbonitride material, including the materials of the first conductive film 421 and / or the second conductive film 422. For example, if the first conductive film 421 and the second conductive film 422 include chromium, the ceramic film 423 may include a chromium-containing carbonitride material, such as CrSiCN. The ceramic film 423 may be in electrical communication with the second conductive film 422. Therefore, due to the overlapping position of the second conductive film 422 and the first conductive film 421, the ceramic film 423 may be in electrical communication with the first conductive film 421 on the inner surface 435. Thus, the first contact electrode 432 can define an electrical path from the outer surface 434 to the inner surface 435 through the ceramic film 423, the second conductive film 422, and the first conductive film 421, wherein the first conductive film 421 can be electrically coupled to one or more components of the electronic device, for example, via conductive ink or other conductive materials, as described herein.

[0065] The portion of first contact electrode 432 that at least partially defines the outer surface of component 430 (e.g., the portion that includes ceramic film 423) can have a desired level of one or more material properties, such as hardness, corrosion resistance, and / or durability. Furthermore, because ceramic film 423 can at least partially define the outer surface of a device that includes component 430 and is optimally visible to a user, ceramic film 423 can also have a desired appearance or aesthetic. In some examples, the material of the ceramic film, such as the elements comprising the ceramic film and their respective ratios in the material of ceramic film 423, can be selected to provide a desired color and / or brightness to ceramic film 423.

[0066] In some examples, ceramic film 423 may comprise CrSiCN having a composition comprising approximately 50 weight percent (wt%) chromium, approximately 30 wt% silicon, and approximately 10 wt% carbon and nitrogen, with the remainder comprising any number of additional constituent elements, such as oxygen. In some examples, the weight percentage of chromium in the ceramic film may be increased to provide a lighter-colored ceramic film 423, or decreased to provide a darker-colored ceramic film 423, while maintaining other desired material properties. In some examples where ceramic film 423 comprises titanium, such as in an AlTiN ceramic film 423, the weight percentage of titanium may be increased to provide a lighter color, or decreased to provide a darker color, while maintaining other desired material properties. In some examples, ceramic film 423 may comprise AlTiN where a darker appearance than a pure CrSiCN film is desired, while ceramic film 423 may comprise a TiCN-containing material or a CrTiCN-containing material where a lighter appearance than a pure CrSiCN film is desired. In some examples, the ceramic film 423 may have an L* value in the CIELAB color space of from about 40 to about 90, from about 50 to about 80, from about 60 to about 70, or from about 55 to about 65 (e.g., about 60). Figure 8 Further details of electronic device 500 including component 530 are described.

[0067] Additionally, while the configuration of contact electrode 432, including first conductive layer 421, second conductive layer 422, and ceramic film 423 deposited on at least second conductive layer 423, can prevent or reduce delamination of one or more layers of contact electrode 432, in some examples, this configuration can maintain a desired level of functionality even if some delamination does occur. For example, high stress events and / or extremely high levels of wear can cause some catalytic cracking of ceramic film 423 and / or delamination from the underlying second conductive film 422. In these situations, an electrical path can still be maintained from outer surface 434 to inner surface 435 because, even though ceramic film 423 may have partially delaminated, other portions of ceramic film 423 can remain in electrical contact or communication with second conductive layer 422, providing an alternative electrical path from ceramic film 423 to first conductive film 421 through second conductive film 422.

[0068] Figure 8 A cross-sectional view of a portion of an electronic device 500 including a rear cover 510 and a component 530 as described herein is shown. The rear cover 510 and the component 530 may include the components described herein with respect to Figure 1-Figure 3 and Figure 1-Figure 7 Some or all of the features of the rear cover 110, 210 and components 130, 230, 330, 430 described above. As shown, component 530 may be substantially similar to that of Figure 7 The component 430 is described. For example, the component 530 may include a transparent portion 531, which may include a transparent polymer or ceramic material (such as sapphire).

[0069] Component 530 may also include a first contact electrode 532, which may include some or all of the features of contact electrodes 132, 133, 232, 233, 332, and 432 described herein. For example, contact electrode 532 may include a conductive layer comprising a first conductive film 521 deposited on an inner surface 535 of transparent portion 531 and a second conductive film 522 deposited on an outer surface 534 of transparent portion 531. Second conductive film 522 may at least partially overlap first conductive film 521 to form a concentrated conductive layer. First and second conductive films 521, 522 may include some or all of the features of any other conductive film described herein. Contact electrode 532 may also include a ceramic film 523 deposited on outer surface 534 of transparent portion 531 and at least partially deposited on the conductive layer, such as second conductive film 522. In some examples, first and second conductive films 521, 522 may include chromium, and ceramic film 523 may include CrSiCN. In some examples, the first conductive film 521 and the second conductive film 522 may include titanium, and the ceramic film 523 may include AlTiN. As described herein, the first contact electrode 532 may provide or define an electrical path from the outer surface 534 of the component 530, and thus from the outer surface of the electronic device 500, to the inner surface of the component 530.

[0070] In some examples, component 530 can be joined to rear cover 510 to form at least a portion of the housing of electronic device 500. In some examples, component 530 can be joined, bonded, or adhered to one or more surfaces of rear cover 510, for example, via an adhesive or sealant material 570. As shown, sealant material 570 can occupy the space between inner surface 535 of component 530 and one or more surfaces of rear cover 510 to provide a substantially watertight and / or airtight seal between component 530 and rear cover 510. Thus, the interior volume of electronic device 500, at least partially defined by component 530 and rear cover 510, can be sealed and isolated from the surrounding environment. Thus, a portion or all of outer surface 534 of component 530 can be exposed to the surrounding environment outside electronic device 500, while a portion or all of the inner surface of component 530 can at least partially define the interior volume of device 500. Thus, in some examples, the location of sealant or sealant material 570 can serve to separate, isolate, or isolate the inner surface 535 and outer surface 534 of component 530.

[0071] In some examples, sealant material 570 may be any material that can provide or act as an airtight and / or watertight seal between component 530 and rear cover 510. In some examples, sealant material 570 may include a material comprising one or more polymers. In some examples, sealant material 570 may include an adhesive, such as a pressure-sensitive adhesive and / or glue. In some examples, sealant material 570 may be disposed at or adjacent to the periphery of component 530. In some examples, the periphery of component 530 may correspond to the periphery of the aperture defined by rear cover 510 in which component 530 is disposed. In these examples, sealant material 570 may be disposed around a portion or all of the periphery of component 530 and / or a portion of rear cover 510 defining the aperture in which component 530 is disposed. In some examples, sealant material 570 may be used to bond component 530 to rear cover 510 such that component 530 is held entirely or substantially entirely against rear cover 510 by sealant material 570. However, in some examples, one or more additional retaining features or materials can be used to retain component 530 against rear cover 510, and sealant material 570 can act as a seal between rear cover 510 and component 530. In some examples, component 530 can be retained in a desired position relative to rear cover 510 by some combination of retaining features or components and sealant material 570.

[0072] As shown, the first contact electrode 532 can extend from the outer surface 534 to the inner surface 535 through the sealant material 570. Thus, in some examples, the sealant material 570 can directly contact the first contact electrode 532 to form a seal between the component 530 and the rear cover 510. Thus, a high level of adhesion between the layers of the first contact electrode 532, such as the first conductive film 521 and the transparent portion 531, can prevent undesirable delamination or separation between the rear cover 510 and the component 530. In addition, the materials of the first contact electrode 532 can be selected so that they can withstand exposure and bonding with the sealant material 570. Thus, in some examples, the electrical path defined by the first contact electrode 532 can extend from the outer surface 534 of the device 500 through or across the seal formed between the component 530 and the rear cover 510 to the interior volume of the device 500. However, in some other examples, the component 530 can additionally or alternatively be bonded or sealed to one or more other housing components of the device 500.

[0073] In this way, as described herein, electrical signals transmitted or relayed by the first contact electrode 532 can travel from the outer surface 534 of the device 500 to the interior volume along the electrical path defined by the first contact electrode 532, without requiring any openings or holes in the device 500 and without exposing one or more sensors disposed in the interior volume to the surrounding environment. The portion of the first contact electrode 532 disposed on the surface 535 that can at least partially define the interior volume of the device 500 can then be electrically coupled to one or more other components of the device 500, such as one or more sensors described herein.

[0074] Any number or types of electronic device components may include a layer or film of material that can provide an electrical path between surfaces of the components as described herein. The process of forming the conductive path may include any combination of film or layer formations, or any combination of deposition processes, as described herein. The component may include: a conductive film or conductive layer that can extend from one surface of the component to another surface; and a ceramic film formed on at least a portion of the conductive film and electrically connected to the at least a portion to provide the electrical path. Reference is made below to Figure 9 Various examples of components, such as housing components (including films or layers that can provide electrical pathways between surfaces of the components) and processes for forming the same are described.

[0075] Figure 9 A process flow diagram illustrating a process for forming a conductive housing component is shown. Figure 9 , a process 600 for forming a conductive housing component may include: at block 610, depositing a first conductive layer on a first surface of the component; at block 620, depositing a second conductive layer on a second surface of the component and at least partially on the first conductive layer; and at block 630, depositing a ceramic film on at least the second conductive layer.

[0076] At block 610, a first conductive layer or film is deposited on a first surface of a component. In some examples, a component may include a Figures 1-8 Some or all of the features of components 130, 230, 330, 430, and 530 described above. In some examples, the component can be a housing component of an electronic device. In some examples, the component can be substantially any component of an electronic device. In some examples, the first surface can have a planar surface or a non-planar surface, such as a surface having a concave or convex geometry. The first surface can include substantially any desired material that can withstand the deposition process and can be, for example, a polymer or ceramic surface, such as a transparent polymer or a transparent ceramic surface.

[0077] The first conductive layer can be deposited by any desired one or more deposition processes, such as a physical vapor deposition process, a chemical vapor deposition process, an epitaxial growth process, an electrochemical formation process, a printing process, an inkjet process, a spray coating process, an electroplating process, any other known deposition process or a process discovered in the future, or a combination thereof. In some examples, the deposition process can be a physical vapor deposition process, a chemical vapor deposition process, an atomic layer deposition process, or any other desired deposition process capable of depositing a film having the properties described herein. In some examples, the first conductive layer can include any conductive material, such as the metallic materials described herein. For example, the first conductive layer can include chromium, titanium, or any other conductive metal or a combination thereof.

[0078] In some examples, the conductive film may have a uniform thickness over the entire area in which it is deposited. However, in some examples, the thickness of the conductive film may vary depending on the geometry and location in which it is deposited. Additionally, in some examples and as described herein, the conductive film may include multiple layers or films of conductive material. The conductive film may have a thickness from about 10 nm to about 300 nm. In some examples, the conductive film may be from about 25 nm thick to about 200 nm thick, or from about 50 nm thick to about 100 nm thick. For example, the conductive film may be about 50 nm thick or about 100 nm thick. In some examples, the conductive film may be about 100 nm thick in some portions and about 50 nm thick in some other portions.

[0079] In some examples, the component can be subjected to one or more processing steps before the first conductive layer is deposited on the component. In some examples, one or more areas of the first surface of the component and / or any other surface of the component can be subjected to a cleaning process, an activation process, a passivation process, a masking process, or a combination thereof, for example.

[0080] At block 620, a second conductive layer may be deposited on the second surface of the component and at least partially over the first conductive layer. In some examples, the first conductive layer deposited at block 610 may extend at least partially over the second surface, such that the second conductive layer is deposited over a portion of the first conductive layer on the second surface of the component. However, in some examples, in addition to being deposited on the second surface of the component, a portion of the second conductive layer may be deposited on the first surface of the component at the location of the first conductive layer. In some examples, the second surface of the component may be disposed opposite the first surface of the component. In some examples, the second surface of the component may have any desired shape or geometry and may be a planar surface or a non-planar surface, such as a surface having a convex or concave geometry.

[0081] As with the deposition of the first conductive layer at block 610, the second conductive layer can be deposited by any desired deposition process or processes. For example, the second conductive layer can be deposited by one or more physical vapor deposition processes, chemical vapor deposition processes, epitaxial growth processes, electrochemical formation processes, printing processes, inkjet processes, spray coating processes, electroplating processes, any other known deposition processes or processes discovered in the future, or any combination thereof. The second conductive layer can have some or all of the properties of the first conductive layer as described with respect to block 610. In some examples, the second conductive layer can include the same or similar material as the first conductive layer. For example, if the first conductive layer includes a chromium layer, the second conductive layer can also include a chromium layer. Thus, in some examples, deposition of the second conductive layer on the first conductive layer can produce a single layer or film that can be considered a continuous or unitary layer or film. However, in some examples, the second conductive layer can include a different material than the first conductive layer. In some examples, the second conductive layer can have any desired thickness and can have the same or different thickness as the first conductive layer. In some examples, the second conductive layer can be in electrical communication with the first conductive layer, such that an electrical signal provided through the second conductive layer is also provided through the first conductive layer.

[0082] In some examples, the first surface of the component described with respect to block 610 can be an inner or interior surface of the component, while the second surface of the component can be an outer or exterior surface. In some examples, the outer surface can at least partially define an exterior surface of an electronic device including the component, while the inner surface can at least partially define an interior volume of the electronic device, as described herein.

[0083] At block 630, a ceramic film may be deposited on at least a portion of the second conductive layer deposited at block 620. In some examples, the ceramic film may also be deposited on a portion of the first conductive layer described with respect to block 610. The ceramic film may include any of the ceramic films described herein (such as those described with respect to Figures 5A-8 Some or all of the characteristic parts and characteristics of the ceramic membrane 323, 423, 523).

[0084] In some examples, the ceramic film may include a carbide material, a nitride material, or a carbonitride material. In some examples, the ceramic film may include additional component elements, such as silicon and / or metallic elements. Thus, in some examples, the ceramic film may include a carbonitride material, such as a silicon carbonitride material. In some examples, the ceramic film may include chromium silicon carbonitride (CrSiCN) or aluminum titanium nitride (AlTiN). In some examples, the ceramic film may include one or more materials of the conductive layer deposited at blocks 610 and 620. For example, if the conductive film includes chromium, the ceramic film may include a chromium-containing ceramic material, such as CrSiCN. Similarly, if the conductive film includes titanium, the ceramic film may include a titanium-containing ceramic, such as AlTiN. The ceramic film may have any desired thickness, for example, from approximately 10 nm to approximately 5000 nm. In some examples, the ceramic film may be from approximately 100 nm to approximately 2500 nm thick, or from approximately 500 nm to approximately 1000 nm thick. For example, the ceramic film may be approximately 1000 nm thick. In some examples, the thickness of the ceramic membrane can vary at different locations on the component. In some examples, the ceramic membrane can have a hardness greater than about 1000 HV, greater than about 1500 HV, greater than about 2000 HV, greater than about 2500 HV, greater than about 3000 HV, or even greater.

[0085] In some examples, the ceramic film can be in electrical contact or communication with the first and second conductive layers deposited at blocks 610 and 620. In some examples, while the ceramic film is not considered a conductive material in the conventional or traditional sense, the nature of the contact between the ceramic film and the desired surface (such as the user's skin) and the sheet resistance and thickness of the ceramic film can be used to provide an electrical signal from the user's skin to the first and second conductive layers, whereby the electrical signal can be transmitted to one or more components of the electronic device. Thus, even though ceramic materials are not generally considered highly conductive materials, the ceramic material can have sufficient conductivity to provide an electrical signal from the exterior of a component to an interior surface, such as the first surface of the component, whereby the electrical signal can be transmitted or received by one or more components of the electronic device, as described herein.

[0086] In some examples, one or more processing steps may be performed at any time after the ceramic film is deposited at block 630 and / or before or after the process steps described with respect to blocks 610 and 620. For example, a masking process or a cleaning process may be performed on the component after each of blocks 610, 620, and 630. Additional process steps, such as applying a conductive ink to the exposed areas of the first conductive layer, may also be performed at any desired time. Furthermore, in some examples, the steps of blocks 610, 620, and 630 may be performed in any desired order. However, in some examples, the first conductive layer may be deposited before the second conductive layer and the ceramic film, while the second conductive layer may be deposited after the first conductive layer and before the ceramic film, and the ceramic film may be deposited after the first and second conductive layers. In some examples, block 610 may be performed before performing or carrying out substantially any other process on the component, other than the forming and cleaning processes used in some examples. Thus, block 610 may be performed before other processes that could introduce contamination to the component or deposition equipment, thereby ensuring a desired level of adhesion between the first conductive film and the surface of the component.

[0087] In some examples, the deposition steps described at blocks 610, 620, and 630 may be performed in a single deposition chamber or apparatus, or may be performed in one or more different deposition chambers or apparatuses. For example, a single deposition chamber or apparatus may contain targets or components for deposition of the first conductive layer, the second conductive layer, and the ceramic film, and these components may be activated or used at desired times and for desired durations to perform method 600 as described herein.

[0088] Any of the features or aspects of the components discussed herein may be combined or included in any combination of variations. For example, the design and shape of the component comprising the electrical pathway is not subject to any limitation and may be formed by any number of processes, including those discussed herein. A component comprising one or more contact electrodes, as discussed herein, may be or may form all or part of a component of an electronic device, such as a housing or casing. A component may also be or form any number of additional components of an electronic device, including internal components, external components, casings, surfaces, or partial surfaces.

[0089] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0090] This disclosure recognizes that the use of such personal information data within the present technology can be used to benefit users. For example, this personal information data can be used to deliver targeted content of particular interest to the user. Thus, the use of such personal information data enables users to exercise planned control over the content delivered. Furthermore, this disclosure contemplates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into a user's overall health or serve as positive feedback for individuals using technology to pursue health goals.

[0091] This disclosure contemplates that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information will adhere to established privacy policies and / or practices. Specifically, such entities should implement and adhere to privacy policies and practices that are generally recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information. Such policies should be readily accessible to users and updated as the collection and / or use of data changes. Personal information collected from users should be used for the entity's legitimate and reasonable purposes and not shared or sold beyond those legitimate uses. Furthermore, such collection / sharing should be conducted with the user's informed consent. Furthermore, such entities should consider taking any necessary steps to safeguard and secure access to such personal information and ensure that others with access to the personal information adhere to their privacy policies and procedures. Furthermore, such entities may subject themselves to third-party assessments to demonstrate compliance with widely accepted privacy policies and practices. Furthermore, policies and practices should be tailored to the specific type of personal information collected and / or accessed and to applicable laws and standards, including jurisdictional considerations. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); whereas health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained for different types of personal data in each country.

[0092] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates providing hardware elements and / or software elements to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" to participate in the collection of personal information data at any time during or after registration for the service. In another example, a user may choose not to provide emotion-related data to a targeted content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or to completely prohibit the development of underlying emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then reminded again just before the personal information data is accessed by the application.

[0093] Furthermore, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risk can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than the address level), controlling how data is stored (e.g., aggregating data across users), and / or other methods, where appropriate.

[0094] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may be implemented without access to such personal information data. That is, various embodiments of the present technology will not be unable to function properly due to the absence of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0095] As used herein, the terms exterior, outside, interior, inside, top, and bottom are used for reference purposes only. An exterior portion or exterior portion of a component may form a portion of an exterior surface of the component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior portion or interior portion of a component may form or define an interior portion or inside portion of the component, but may also form or define a portion of an exterior surface or exterior surface of the component. In some orientations of the component, the top portion of the component may be located above the bottom portion, but may also be aligned with, below, or in some other spatial relationship to the bottom portion, depending on the orientation of the component.

[0096] Various inventions have been described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that numerous modifications may be made without departing from the scope and spirit of the invention disclosed herein, as those set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "including" and "having" as used in the specification and claims shall have the same meaning as the term "comprising."

[0097] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the embodiments. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. These descriptions are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that, in view of the above teachings, many modifications and variations are possible.

Claims

1. An electronic device comprising: a housing component defining an interior surface and an exterior surface of the electronic device; a first film deposited on the inner surface and extending at least partially around an edge of the housing member onto the outer surface; and A second film is deposited on the outer surface and at least partially on a portion of the first film on the outer surface, the second film being in electrical communication with a portion of the first film deposited on the inner surface.

2. The electronic device according to claim 1, further comprising: a seal that isolates an interior volume of the electronic device from a surrounding environment, the interior volume being defined at least in part by the interior surface; and An electronic component is disposed in the interior volume and electrically coupled to the second membrane, wherein the exterior surface is exposed to the surrounding environment. 3 . The electronic device of claim 1 , wherein the first film comprises at least one of chromium or titanium. The electronic device according to claim 1 , wherein the first film comprises a metal material. The electronic device of claim 1 , wherein the second film comprises a nitride material. The electronic device of claim 1 , wherein the second film comprises a ceramic material.

7. A housing for an electronic device, comprising: a conductive film deposited on a first surface of the housing and extending at least partially around a peripheral edge of the housing to a second surface of the housing opposite the first surface; a non-metallic film layer, the film layer being deposited on the second surface and at least partially deposited on a portion of the conductive film deposited on the second surface; and The conductive film and the film layer form a conductive path extending from the first surface to the second surface.

8. The housing of claim 7, further comprising a conductive ink in electrical contact with a portion of the conductive film on the first surface.

9. The housing of claim 7, wherein at least one of the film layer or the conductive film is deposited by a physical vapor deposition process.

10. The housing according to claim 7, wherein the conductive film comprises: a first conductive layer deposited on the first surface; and A second conductive layer is deposited on the second surface and at least partially on the first conductive layer.

11. The housing according to claim 10, wherein: The first conductive layer is formed before the second conductive layer; and The membrane layer is formed after the first conductive layer and the second conductive layer.

12. The housing of claim 10, wherein: The first conductive layer has a thickness of about 100 nanometers; and The second conductive layer has a thickness of about 50 nanometers.

13. The housing of claim 7, wherein the conductive film comprises at least one of chromium or titanium.

14. The housing of claim 7, wherein the membrane layer comprises a conductive ceramic material.

15. The housing of claim 14, wherein the film comprises a nitride containing at least one of chromium or titanium.

16. The housing of claim 7, wherein the first surface comprises a non-planar surface.

17. The housing of claim 7, wherein the film has an L* value of 55 to 65 in the CIELAB color space.

18. A method of forming a housing component, comprising: depositing a first conductive layer on the first surface of the housing component; depositing a second conductive layer on a second surface of the housing component opposite the first surface, the second conductive layer at least partially overlapping the first conductive layer; as well as A third layer is deposited on the second conductive layer.

19. The method of claim 18, wherein the second conductive layer comprises at least one of chromium or titanium, and the third layer comprises a nitride material including at least one of chromium or titanium.

20. The method of claim 18, wherein the housing component is a first housing component, the method further comprising sealing an interface between the first housing component and a second housing component.

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